TWI297766B - Flat plate-type heat pipe - Google Patents

Flat plate-type heat pipe Download PDF

Info

Publication number
TWI297766B
TWI297766B TW094145188A TW94145188A TWI297766B TW I297766 B TWI297766 B TW I297766B TW 094145188 A TW094145188 A TW 094145188A TW 94145188 A TW94145188 A TW 94145188A TW I297766 B TWI297766 B TW I297766B
Authority
TW
Taiwan
Prior art keywords
heat pipe
flat
hole
present
working fluid
Prior art date
Application number
TW094145188A
Other languages
English (en)
Chinese (zh)
Other versions
TW200638016A (en
Inventor
Seok Hwan Moon
Gunn Hwang
Sang Choon Ko
Sung Weon Kang
Chang Auck Choi
Original Assignee
Korea Electronics Telecomm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Electronics Telecomm filed Critical Korea Electronics Telecomm
Publication of TW200638016A publication Critical patent/TW200638016A/zh
Application granted granted Critical
Publication of TWI297766B publication Critical patent/TWI297766B/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/02—Tubular elements of cross-section which is non-circular
    • F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094145188A 2005-04-19 2005-12-20 Flat plate-type heat pipe TWI297766B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050032212A KR100631050B1 (ko) 2005-04-19 2005-04-19 평판형 히트 파이프

Publications (2)

Publication Number Publication Date
TW200638016A TW200638016A (en) 2006-11-01
TWI297766B true TWI297766B (en) 2008-06-11

Family

ID=37115274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145188A TWI297766B (en) 2005-04-19 2005-12-20 Flat plate-type heat pipe

Country Status (5)

Country Link
US (1) US20080185128A1 (ko)
JP (1) JP2008531966A (ko)
KR (1) KR100631050B1 (ko)
TW (1) TWI297766B (ko)
WO (1) WO2006112586A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185283A (ja) * 2007-01-31 2008-08-14 Toshiba Home Technology Corp ヒートパイプ
KR20080076423A (ko) * 2007-02-16 2008-08-20 엘에스엠트론 주식회사 판형 히트 파이프 및 그 제조방법
DE602008002507D1 (de) * 2007-08-27 2010-10-28 Abb Research Ltd Wärmetauscher für Komponenten der Leistungselektronik
TWI413887B (zh) * 2008-01-07 2013-11-01 Compal Electronics Inc 熱管結構
KR100942063B1 (ko) 2008-03-03 2010-02-11 한국생산기술연구원 사각 채널형 히트 파이프
TW201100736A (en) * 2009-06-17 2011-01-01 Yeh Chiang Technology Corp Superthin heat pipe
JP5455503B2 (ja) * 2009-08-11 2014-03-26 モレックス インコーポレイテド 熱輸送ユニット、電子機器
WO2011142841A2 (en) 2010-01-14 2011-11-17 University Of Virginia Patent Foundation Multifunctional thermal management system and related method
US8311708B2 (en) * 2010-02-16 2012-11-13 Ford Global Technologies, Llc Adjustable grill shutter system
US20110214841A1 (en) * 2010-03-04 2011-09-08 Kunshan Jue-Chung Electronics Co. Flat heat pipe structure
CN102012181A (zh) * 2010-06-21 2011-04-13 邹飞龙 板式多通道异形腔热超导管
US20120080170A1 (en) * 2010-10-04 2012-04-05 Hsiu-Wei Yang Plate-type heat pipe sealing structure and manufacturing method thereof
KR20120065575A (ko) * 2010-12-13 2012-06-21 한국전자통신연구원 압출로 제작되는 박막형 히트파이프
KR20120065569A (ko) * 2010-12-13 2012-06-21 한국전자통신연구원 박막형 히트 파이프
KR101158682B1 (ko) 2010-12-30 2012-06-25 주식회사 케이에스비 다채널 평판형 히트파이프를 이용한 진공관형 태양열 집열기
FR2976739A3 (fr) * 2011-06-16 2012-12-21 Renault Sa Dispositif de regulation thermique d’une batterie d’accumulateurs d’un vehicule a motorisation electrique
KR20130050790A (ko) 2011-11-08 2013-05-16 한국전자통신연구원 평판 히트 파이프 및 그 제조 방법
CN102661670B (zh) * 2012-05-17 2014-09-03 程宝华 一种超导纳米传热板式换热器及其制造方法
KR20140029633A (ko) * 2012-08-29 2014-03-11 한국전자통신연구원 모세관력이 향상된 방열소자 및 그 제조방법
KR101465628B1 (ko) * 2012-09-28 2014-11-28 전자부품연구원 집광형 태양전지 모듈
FR2998657B1 (fr) * 2012-11-28 2015-01-30 Renault Sa Caloduc reversible plat
TW201437591A (zh) * 2013-03-26 2014-10-01 Asustek Comp Inc 熱管結構
US20140352926A1 (en) * 2013-05-31 2014-12-04 Cooler Master Co., Ltd. Shell structure for handheld device
US9421648B2 (en) * 2013-10-31 2016-08-23 Asia Vital Components Co., Ltd. Manufacturing method of heat pipe structure
KR101600667B1 (ko) * 2013-12-05 2016-03-07 티티엠주식회사 엇댄 구조의 윅을 갖는 박형 히트파이프
US10698458B2 (en) * 2014-06-02 2020-06-30 Microsoft Technology Licensing, Llc Integrated vapor chamber for thermal management of computing devices
US10156400B2 (en) * 2015-01-30 2018-12-18 Mitsubishi Electric Corporation Heat exchanger and refrigeration cycle device
KR102219482B1 (ko) 2015-03-03 2021-02-25 한국전자통신연구원 반도체 소자
CN107835926A (zh) * 2015-06-19 2018-03-23 株式会社Innotm 薄型热管及其制造方法
CN105352351B (zh) * 2015-11-03 2018-07-06 刘树宇 一种均温板改进结构
US10694641B2 (en) 2016-04-29 2020-06-23 Intel Corporation Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms
CN108253827B (zh) * 2016-12-28 2020-06-23 神讯电脑(昆山)有限公司 铝挤型热板及其制造方法
WO2018198354A1 (ja) * 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5179043A (en) * 1989-07-14 1993-01-12 The Texas A&M University System Vapor deposited micro heat pipes
US5219021A (en) * 1991-10-17 1993-06-15 Grumman Aerospace Corporation Large capacity re-entrant groove heat pipe
US5309986A (en) * 1992-11-30 1994-05-10 Satomi Itoh Heat pipe
JPH11101585A (ja) * 1997-09-29 1999-04-13 Furukawa Electric Co Ltd:The 板型ヒートパイプとその実装構造
JP2000193385A (ja) * 1998-12-24 2000-07-14 Furukawa Electric Co Ltd:The 平面型ヒートパイプ
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
KR200259040Y1 (ko) * 2001-09-04 2001-12-31 주식회사 한국에치피티 평판형 히트파이프
KR200297491Y1 (ko) * 2002-08-26 2002-12-11 (주) 대홍기업 평판형 히트파이프와 히트싱크
US20040112572A1 (en) * 2002-12-17 2004-06-17 Moon Seok Hwan Micro heat pipe with poligonal cross-section manufactured via extrusion or drawing

Also Published As

Publication number Publication date
US20080185128A1 (en) 2008-08-07
KR100631050B1 (ko) 2006-10-04
WO2006112586A1 (en) 2006-10-26
TW200638016A (en) 2006-11-01
JP2008531966A (ja) 2008-08-14

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MC4A Revocation of granted patent