八、 本案若有彳匕學式時，請揭示最能顯示發明特徵的化學式： 九、 發明說明： 【發明所屬之技術領域】 本發明係有關於晶粒與膠膜之分離，特別是關於晶粒頂出機構之頂 針模組。 【先前技術】 晶圓經過切割後，即進行黏晶Attach)的程序。此時每個晶粒 (Die ’或稱晶片）相互之間為完全分離，且分別獨立黏著於具有黏性的膠 膜(UV Tape或Blue Tape)上。晶粒取放機台(Die Sort)在吸取晶粒時，其 係於晶粒上方以一真空吸嘴吸取晶粒，同時膠膜下方將受到一頂針之推 頂作用’而將晶粒頂出膠膜，以利真空吸嘴吸取晶粒，再經由機械動作， 將晶粒置放於晶粒座(Die pa(j)上。 關於晶粒頂出機構的習知技術其特徵皆著重於晶粒被頂出時易破 裂之改善，以及晶粒與膠膜間更有效的分離。多頂針的頂出機構改善草 一頂針易造成晶粒破碎之缺點，以周圍頂針作第一階段的預頂，中心頊 針作第二階段的頂出；兩階段的頂出機構以一動力源使頂出座作第〆階 段頂出，頂針作第二階段頂出；利用真空做第一階段的分離以設置〆面 積小於晶粒面積之突起平台於膠膜下方，當平台抽真空時，位於肀台外 緣的膠膜即可脫離膠膜，有利於頂針做第二階段的分離。 第一圖為一習知的晶粒頂出機構之側視剖面圖；如圖所示，〆真突 1295825 室22設有複數個真空孔道24，晶粒10係黏著於一膠膜12之上，而該 膠膜12係置放於該真空室22上，使得該真空室22可透過該真空孔道 24而對該膠臈12產生真空吸力，進而將晶粒1〇定位於適當位置。 接續’再透過一頂針座18帶動其上多個頂針20上升，並分別通過 其所對應之真空孔道24，並推頂該膠膜12至某固定高度，使膠膜12 與晶粒10大致分離。此時，一位於晶粒10上方之真空吸盤14，便透 過一设於其上之真空吸嘴16而將晶粒1〇取起，進而令晶粒10與膠膜 12分離。 上述晶粒10、頂針20與頂針座18之排列如第二圖所示，一晶粒 10被四個頂針20頂起，相較於單一頂針與膠膜12的單點接觸，其係 增加為四點_，*使得其翻之應力更為平均施加於職12/晶粒1〇 上。然而’此頂針形狀與排列不適用於更小尺寸之晶粒，特別是長寬比 較大的晶粒。 如第二A圖與第三b圖所示，其中第三a圖為俯視圖，第三B圖 為側視圖’當晶粒1Q之長寬比較大時，例如液晶訴器所使用的驅動 晶片1〇 ’其長度常見有8/10/12公厘；其寬度常見有1/0·8/0 5公厘。由 於晶粒10寬度很小且逼近頂針2〇之直徑，因此頂針20無法並排兩列， 而只能以單列排列。 又’如第二c圖所不’此頂針2。的形狀將造成晶粒1〇被頂針2〇 頂出膠膜12 Β守’產生傾斜而無法貼合於真空吸盤14，進而導致真空吸 1295825 嘴16無法確實吸取晶粒10。 再者，先前技術係將頂針座(18)與頂針(2〇)分開製造，再將兩者組立 成一頂針模組。_各構件分別的製造公差與組立誤差，使得組立後每 支頂針20之高度有不同之誤差值，同樣也是造成被頂出之晶粒10產生 偏斜，致使真空吸盤14無法確實吸取之原因。 因此，虽需提出一種改良頂針模組，確保每支頂針之高度在同一平面， 以平順推頂晶粒，並適度增加麟推頂晶歡觀面積，以確保 破頂出時稀魅偏斜，進而有效提升真纽取之 产’ 使得其在維猶紅更加制。 度’更 【發明内容】 本發明之主要目的在於拇供一種晶粒取放機之頂針模組，藉由適度 增加各支頂針與膠麟晶粒之細賴，而絲頂過程中得㈣接觸之 方式推’以有效確保被頂出之晶粒不致產生偏斜，進而有效提升真空吸 取之效果與穩定度。 本發明之次要目的在於提供一種晶粒取放機之頂針模組，將連 接座與頂針以—體成型之方式加工，以雜每支頂針之高度在同一平面 上，而可同時接觸膠膜或晶粒，進而將晶片平整頂起。 本發明之又-目的在於提供—種晶粒取放機之贿模組，將頂針、 連接座或斯座以-體成型之方式加卫觀，心增加轉之方便性。 根據上述目的，本發明提供一種晶粒取放機之頂針模組，其包人一 頂針座、-連接座與數個頂^連接座形成於頂針座上方，數個頂針形 1295825 成於連接座_L^ ’ τ騎獅財__頂部絲，且每侧針的卿邊緣位 於同樣同度。藉此’在推頂触巾每侧顺轉賴線魏，複數個 線接觸構成-面接觸而將晶粒平整地頂起。同時，—體成型之頂針模，組 在使用與維護上較為方便有效率。 【實施方式】 本卷月的些貫施例會詳細描述如下。其中，各元件之不 同部分並沒有依照尺寸緣圖。某些尺度與其他相關尺度相比已 經被誇大或是縮小，以提供更清楚的描述和理解。 第四圖顯不本發明晶粒頂出模組之實施例，頂出模組5分為三部 刀刀別疋頂針座51、複數個頂針52、與連接座53。此頂針模組$是 以體成型的方式製作，例如線切割，或者模具成型的方式製成。特別 疋抓用線;Μ方式4，由於麟52與連接座53是由同—塊材料以相同 參數切割輕的，耻辭不會錄作上的公差。所使_材質可以為 不鏽鋼SUS440、中碳鋼_、白鐵等，在其他實施例中，亦可用其他 適田硬度的金>1鱗金屬㈣。頂針座51的形狀沒有歸，在本實施 例中’其為一圓柱狀，其直徑約略等於晶粒的長度，且背向頂針52的 面具有銜接觸(未祕圖)秋賴㈣定。連麵Μ職於頂針座 51之上與複數_針52之下，形狀可妓長條、平板、梯柱或其他變 化舰，例如在連接座53之側面與頂針座51可形成導角測。連接座 53的高度H2可以調整，以加強頂針52的機械強度。在連接座犯的上 方’形成複數個頂針52 ’每個頂針52可以分成頂針根部521與頂針頂 1295825 部522兩部分，衛糊騎Μ W1、厚狀細；頂針頂 部522為底_丨、厚T2之顧。在本實謝T2等於T1，在其 實_中T2不-疋等於Ή。頂針根部奶可與連接座犯形成導角 加強機械喊。另外’本發明之連難Μ其功缺加強頂針 52之強度，嚴格來說可以視為非必要元件。因此，在其他實施例中， 頂針52亦可直接形成於頂針座以上。 當頂針模組5帶動頂針52頂出膠臈(未示細時，頂針頂部522 P邊緣5221 ’與晶粒1Q之細面積縣線翻，且其接觸長度為 T2而曰曰粒1〇與頂針52的接觸面積，是重要的考量。單一頂針於的 頂出應力過於集中，晶粒1G料破碎，複數個頂針Μ可使應力分散， 但如果接__大，則晶·㈣與麵不易分離。，在此必須說 月々本發月之頂針根部521與頂針頂部522並無雜限制，但是重要的 、疋員針頂522具有一頂部邊緣5221與晶粒1〇形成線接觸，复接 觸長度Τ2約略等於晶㈣之寬度W2。在-實施例中，晶粒1G的寬度 W2為0· 7公厘，而頂針厚度T2為〇· 5公厘。另外，頂針頂部如的 頁邛邊緣5221之形狀不限制為一直線，亦可以為一曲線。甚 至，複數個頂針52中，有部分為直線，有部分為曲線。 同時’由於頂針座5；1、連接座53、與頂針52係以一體成型方式加 工’而省去各構件相互組配之公差，亦gp，藉由一體成型之加工方式而 縮減成單—頂針麵5之加卫公差，郷合加工精度的提高，致使所有 頂針52之頂部邊緣5221得以位在同一個高度平面上，並且，所有頂針 1295825 52之頂部邊緣5221，將構成—平整的面接觸，則當頂針52將晶粒ι〇 頂出膠膜時，晶粒U)將保持平整，而不會發生偏斜的情況^上述之頂 針座5卜連接座53、與頂針52係—體成型的，飾，亦可以是連接座 53與頂針52為一體成型’再與頂針座η組合。 第五圖顯示本發明頂針模組之另一實施例，頂針座51與連接座別 =成與前實施例相同，不予贅述，僅描述不同處，且相同树以相同的 ) 符號表示。與第四圖實施例不同的是，在第四圖中頂針52的頂部邊緣 卿與晶粒10的寬賴為平行，但第五圖之實施例中，頂針52的頂 部邊緣5221與晶粒10的寬度W2呈現某個角度0，而並非平行。 以上所述僅為本創作之較佳實施例而已，並非用以限定本 創作之申請專利範圍；凡其他未脫離創作所揭示之精神下所完 成之等效改變或修飾，均應包含在下述之申請專利範圍内。 【圖式簡單說明】 第一圖顯示一習知的晶粒頂出機構之側視剖面圖^ 第一自顯示第一圖之晶粒、頂釺座與頂針之相對位置排列俯視 圖。 第三A圖至第三C圖顯示一具有大長寬比之晶粒使用一習知頂 針之示意圖，其中第三A圖為俯視圖，第三b圖為侧視圖，第 二C為晶粒被頂針了員出時發生傾斜情況之示意圖。 第四圖顯示本發明頂針模組之一實施例。 第五圖顯示本發明了貝針模組之另一實施例。 1295825 【主要元件符號說明】 10 晶粒 12 膠膜 14 真空吸盤 16 真空吸嘴 18 頂針座 20 頂針 22 真空室 24 真空孔道 5 頂針模組 51 頂針座 52 頂針 53 連接座 521 頂針根部 522 頂針頂部 531 導角 5211 導角 5221 頂部邊緣8. If there is a dropout in this case, please disclose the chemical formula that best shows the characteristics of the invention: IX. Description of the invention: [Technical field of the invention] The present invention relates to the separation of crystal grains and film, especially regarding crystal The ejector module of the particle ejection mechanism. [Prior Art] After the wafer is diced, the program of the die attach is performed. At this time, each of the dies (Die's or wafers) is completely separated from each other and adhered to the viscous film (UV Tape or Blue Tape), respectively. When the die pick-up machine (Die Sort) sucks the die, it is attached to the die above the die to suck the die with a vacuum nozzle, and the underside of the film will be pushed by a pin. The film is used to absorb the crystal grains by the vacuum nozzle, and then the crystal grains are placed on the die pad (Die pa(j) by mechanical action. The conventional technique for the die-ejection mechanism focuses on the crystal. The granules are easily broken when they are ejected, and the granules are more effectively separated from the film. The ejector mechanism of the thimbles improves the shortcomings of the thimbles and the thimbles, and the thimbles are used as the first stage of the pre-topping. The center needle is used for the second stage of the ejector; the two-stage ejector mechanism uses a power source to make the ejector seat to be ejected in the second stage, and the thimble is to be ejected in the second stage; The protrusion platform with the area smaller than the area of the crystal grain is disposed below the film. When the platform is evacuated, the film located on the outer edge of the platform can be separated from the film, which is beneficial to the separation of the thimble in the second stage. A side cross-sectional view of a conventional die ejector mechanism; as shown, The chamber 22 is provided with a plurality of vacuum holes 24, and the die 10 is adhered to a film 12, and the film 12 is placed on the vacuum chamber 22 so that the vacuum chamber 22 can pass through the vacuum. The channel 24 creates a vacuum suction force on the capsule 12, thereby positioning the die 1〇 in position. The continuation of the ejector pin 18 causes the plurality of ejector pins 20 to rise and pass through the corresponding vacuum holes 24 respectively. And pushing the film 12 to a fixed height to substantially separate the film 12 from the die 10. At this time, a vacuum chuck 14 above the die 10 passes through a vacuum nozzle 16 disposed thereon. The die 1 is removed, and the die 10 is separated from the film 12. The arrangement of the die 10, the ejector pin 20 and the ejector pin 18 is as shown in the second figure, and a die 10 is topped by four ejector pins 20. As a result, compared with the single point contact of the single thimble with the film 12, the system is increased to four points _, * so that the stress of the thimble is applied evenly on the job 12/die 1 。. However, the shape of the thimble is The arrangement is not suitable for smaller size crystals, especially for larger length and width. For example, the second A and the third b As shown in the figure, the third a is a top view, and the third B is a side view. 'When the length and width of the die 1Q are relatively large, for example, the driving chip used in the liquid crystal device 1' has a length of 8/10/. 12 mm; its width is usually 1/0·8/0 5 mm. Since the width of the die 10 is small and approaches the diameter of the thimble 2 ,, the thimble 20 cannot be arranged in two rows side by side, but only in a single column. 'The shape of the ejector pin 2 as shown in the second c-figure will cause the die 1 〇 to be ejector pin 2 ejector of the film 12 Β ' 产生 产生 产生 产生 而 而 而 而 而 而 而 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 产生 12 12 12 12 12 12 12 12 12 12 16 The die 10 can not be sucked. Further, the prior art system separates the ejector pin (18) from the thimble (2 〇), and then groups the two into a ejector module. The manufacturing tolerances and assembly errors of the respective components are such that the height of each of the ejector pins 20 after assembly is different, which also causes the deflection of the die 10 which is ejected, so that the vacuum chuck 14 cannot be reliably sucked. Therefore, it is necessary to propose an improved thimble module, to ensure that the height of each thimble is on the same plane, to smoothly push the top grain, and moderately increase the area of the lining of the lining, to ensure that the fascination is deviated when the ejector is broken. In order to effectively improve the production of the real new one, it makes it more stable. Degrees [More] The main purpose of the present invention is to provide a thimble module for a crystal pick-and-place machine, by appropriately increasing the fineness of each thimble and the rubber lining, and (4) contacting the wire top process. The method of pushing is to effectively ensure that the crystals that are ejected are not deflected, thereby effectively improving the effect and stability of the vacuum suction. A secondary object of the present invention is to provide a ejector module for a die pick-and-place machine, which processes the connecting seat and the thimble in a body-forming manner, and the height of each thimble is on the same plane, and can simultaneously contact the film. Or a grain, which in turn lifts the wafer flat. Another object of the present invention is to provide a bribe module for a grain pick-and-place machine, which enhances the convenience of turning the thimble, the connecting seat or the seat by means of body shaping. According to the above object, the present invention provides a ejector module for a die pick-and-place machine, which has a thimble seat, a connecting base and a plurality of top connecting blocks formed above the thimble seat, and a plurality of thimbles 1295825 formed in the connecting seat. _L^ ' τ riding lions __ top silk, and the edge of each side of the needle is at the same degree. Thereby, the yarn is swayed on each side of the ejector top, and a plurality of line contacts constitute a surface contact to lift the crystal grains flat. At the same time, the ejector die, which is formed by body, is more convenient and efficient in use and maintenance. [Embodiment] Some examples of this month will be described in detail below. Among them, different parts of each component are not in accordance with the size map. Certain scales have been exaggerated or reduced compared to other relevant scales to provide a clearer description and understanding. The fourth embodiment shows an embodiment of the die ejector module of the present invention. The ejector module 5 is divided into three knives, a thimble pin 51, a plurality of thimbles 52, and a connector 53. The thimble module $ is made in a body-formed manner, such as wire cutting or mold forming. In particular, the thread is used. Because the lining 52 and the connecting seat 53 are cut by the same material with the same parameters, the shame will not be recorded as the upper tolerance. The material may be made of stainless steel SUS440, medium carbon steel, white iron or the like. In other embodiments, other gold alloys of >1 scale metal (4) may also be used. The shape of the ejector pin 51 is not returned. In the present embodiment, it is a cylindrical shape having a diameter which is approximately equal to the length of the crystal grain, and the face facing away from the ejector pin 52 has a contact contact (not secret). The facets are placed above the ejector pin 51 and under the _ pin 52, and can be shaped like a strip, a flat plate, a ladder column or other variable ship, for example, a side angle can be formed on the side of the connecting seat 53 and the thimble base 51. The height H2 of the connector 53 can be adjusted to enhance the mechanical strength of the thimble 52. A plurality of thimbles 52 are formed on the upper side of the connection seat. Each ejector pin 52 can be divided into a thimble root portion 521 and a thimble top portion 1295825 portion 522. The thimble rider W1 is thick and thin; the thimble top portion 522 is bottom _ 丨, thick T2's care. In this case, T2 is equal to T1, and in its real _ T2 is not - 疋 is equal to Ή. The thimble root milk can form a guide angle with the connection seat to strengthen the mechanical shout. Further, the strength of the thimble 52, which is difficult to enhance the strength of the present invention, can be regarded as a non-essential element strictly. Therefore, in other embodiments, the thimble 52 can also be formed directly above the thimble seat. When the thimble module 5 drives the thimble 52 to eject the plastic raft (when not shown, the apex top 522 P edge 5221' and the fine area of the die 1Q are turned over, and the contact length is T2 and the 〇 〇 1 〇 and the thimble The contact area of 52 is an important consideration. The ejector stress of a single thimble is too concentrated, the grain 1G material is broken, and the multiple thimbles can disperse the stress, but if the __ is large, the crystal (4) is not easily separated from the surface. Here, it must be said that there is no impurity limitation between the ejector root 521 and the thimble top 522 of the month, but the important needle top 522 has a top edge 5221 which is in line contact with the grain 1〇, and the complex contact length Τ2 is approximately It is equal to the width W2 of the crystal (four). In the embodiment, the width W2 of the crystal grain 1G is 0.7 mm, and the thickness T2 of the thimble is 〇·5 mm. In addition, the shape of the top edge of the thimble such as the edge 5221 is not The limit is a straight line, and may also be a curve. Even, among the plurality of thimbles 52, some are straight lines and some are curved. At the same time, 'the thimble base 5; 1, the connecting seat 53 and the thimble 52 are integrally formed. 'And save the tolerances of the components to each other Also, the gp is reduced to a single-to-needle face 5 by the integral molding process, and the machining precision is improved, so that the top edges 5221 of all the thimbles 52 are positioned on the same height plane, and all The top edge 5221 of the thimble 1295825 52 will form a flat surface contact, and when the thimble 52 pushes the grain 〇 out of the film, the grain U) will remain flat without deflection. The thimble base 5 and the connecting base 53 are integrally formed with the thimble 52, and the connecting seat 53 and the thimble 52 may be integrally formed and then combined with the thimble base n. The fifth figure shows another embodiment of the ejector module of the present invention. The thimble holder 51 and the connection pedestal are the same as the previous embodiment, and are not described again, only the differences are described, and the same tree is denoted by the same symbol. Different from the fourth embodiment, in the fourth figure, the top edge of the thimble 52 is parallel to the width of the die 10, but in the embodiment of the fifth figure, the top edge 5221 of the thimble 52 and the die 10 are The width W2 presents an angle of 0, not parallel. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention; any equivalent changes or modifications made without departing from the spirit of the invention should be included in the following Within the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The first figure shows a side cross-sectional view of a conventional die ejector mechanism. ^ First, a top view of the relative position of the die, top pedestal and thimble of the first figure is shown. 3A to 3C are schematic views showing the use of a conventional ejector pin for a die having a large aspect ratio, wherein the third A is a top view, the third b is a side view, and the second C is a die. The thimble is a schematic diagram of the tilting situation when the member is out. The fourth figure shows an embodiment of the thimble module of the present invention. The fifth figure shows another embodiment of the beard module of the present invention. 1295825 [Main component symbol description] 10 die 12 film 14 vacuum suction cup 16 vacuum nozzle 18 thimble seat 20 thimble 22 vacuum chamber 24 vacuum hole 5 thimble module 51 thimble seat 52 thimble 53 connection seat 521 thimble root 522 thimble top 531 Leading angle 5211 lead angle 5221 top edge