1294074 -ϋ 、九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置及應用該散熱裝置之電子裝 置。 ’ 【先前技術】 隨著電子資訊業不斷發展，電子元件（特別是中央處 理器）運行頻率和速度在不斷提升。惟，高頻高速將棱電 >子疋件產生之熱量隨之增多，使得其溫度不斷升高，影響 電子件運行時之性能，為確保電子元件能正常運作，必 須及時排出電子元件所產生之大量熱量。 ^為此，業界通常使用一種散熱裝置進行散熱，該習知 散熱裝置-般包括安裝於電子元件上面之一底座和設在底 a上之複數政熱片，隨著電子產品不斷朝高密度封裝和多 月b方向發展，系統空間也隨之減少，從而極大限制了散 .裝置之尺寸，使得散熱問題越來越嚴峻。 【發明内容】 有鑒於此，有必要提供一種具有較高散熱效率之散熱 褒置及應用該散熱裝置之電子裝置。 ^ 種散熱裝置，包括散熱器、背板以及連接所述背板 彳政熱器之固定件，該背板包括一本體以及一結合於該本 體上之散熱體。 種電子裝置，包括一主機板、一中央處理器、一散 執、 北》 …、σ —者板以及一固定件；該主機板具有一第一側面和 6 1294074 …亥第々側面相對之第二側面，該中央處理器安裝在該 主機板之第一側面，該散熱器貼合於該中央處理器上；該 :板設置在該主機板之第二側面，該固定件與該背板： '，將該散熱器固持在該主機板上，該背板包括一本體和 一導熱地連接於該本體上之散熱體。 本發明與習知技術相比至少具有如下優點··在背板主 體上形成散熱結構，一方面與固定件配合來實現散熱器之 固定，另-方面利用主體上之散熱結構對熱源進行輔^散 熱’充分利用主機板背面空間，提高散熱效率。 【實施方式】 圖1至圖3示出了本發明一個較佳實施例中之散埶裝 置’該散熱裝置用於散發安裝在主機板3〇上之中央處理器 34產生之熱置’肖散熱裝置主要包括-散熱器10、一背板 2〇及複數固定件40,該固定件4〇末端形成有與背板心士 合之螺紋。 ^ 中央處理器34安裝在主機板30之正面，其周圍之四 角落處形成有供固定件4〇穿過之穿孔32。散熱器1〇貼合 於中央處理器34 i，背板置在主機板30之背面，並 與固定件40配合，將散熱器1〇固定於主機板30上。 —如圖1及圖2所示，散熱器1〇包括一基座u、複數平 行排列於基座11上之散熱片12及二熱管14。該基板Μ :般採用銅、铭等導熱性能良好之材料製成，其大致呈矩 形’其底面與中央處理3 34頂面接觸以吸收其產生之熱 1294074 量。基座π四角落分別向外凸伸出一凸耳ll〇，每一凸耳 110上開設與主機板30之穿孔32對應之透孔112。基座U 上表面近中間位置並排設有二半圓形凹槽13,這些凹槽Η 與基座η之凸耳11G所在側緣垂直。這些散熱片^間 距平行排列於基座11JL，其上下兩邊緣垂直彎折延伸有折 邊，所有這些折邊連續形成與基座u上表面貼合之平面， 該平面上在垂直散熱片12之延伸方向形成有與基座^上 凹槽13對應之半圓形凹槽123。每—散熱片12在遠離下側 邊緣處均設有二圓1(未標號），該圓孔周緣橫向延伸形 成有折邊。所有這些圓孔同軸排列’形成一 14之圓形通孔16。 熱管14大體呈U形，其包括 弟 水平段144、 ， ， |八^ Λ. , __ 二水平段146以及-將[水平段144與第二水平段146 連接之傳熱段142’第一水平段144容置於凹槽。和123 配合而成之容置槽内，第二水平段146容置於通孔Μ内， =從基座η吸收來自中央處理器34產生之熱量，通過傳 ，段142傳遞到第二水平段146，再通過第二水平段⑽ 到散熱片12上部’以使熱量在散熱片12上分佈更加 句勻，從而提高散熱效率。 之材:Ζ參照圖^背板2G也由銅、料導熱性能良好 =製成，其緊貼在主機板3〇之背面，一方面可以與固 配合將散熱器10固定於主機板30上，另一方面可 =助散發中央處理器34傳遞至主機板30上之敎量，從 “系統之散熱效率，並有效地利用了系統空間。背板 8 1294074 :2〇包括-本冑21以及設置在該本體2i上之散熱體，該散 實施例中為與本體21 —體成型之複數散熱韓片 該本體21四角落上分卿鱗—錢定件4q對應之 ”孔212。可以理解之是，散熱體並不局限於 其形狀和結構可以根據系統空間和散熱需求：不二 變’例如，它並不局限於與本體21 —體成型，其也可以通 過焊接等其他方式來實現。 本實施例中之散熱裝置在組裝過程中，可以首先將背 板20定位於主機板30之背面，並使背板2〇四角落之螺孔 212對準主機板30上之穿孔32。然後，將散熱If U)放置 在中央處理器34頂部，並使散熱器1〇上之通過透孔ιΐ2 對準穿孔32 ’散熱器1G之底面與中央處理器％之頂面貼 合，兩者之間可以添加導熱介質來提高傳熱效率。最後， 將固定件40依次傳過透孔112和穿孔％，並螺接於背板 20之螺孔212中’從而將散熱器1〇固定在主機板3〇上。 可$理解，該背板20之本體21與散熱體也可以分開 設置，並通過熱管相連。較佳地，該散熱體可以是電子裝 置之金屬機殼。 ^ 综上所述，本發明符合發明專利要件，爰依法提出專 利申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟‘本案技藝之人士，在爰依本發明精神所作之等效修飾 或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 1294074 圖1係本發明一較佳實施例中之散熱裝置之立體分解 圖0 圖2係圖1所示之散熱裝置之立體組合圖。 圖3係圖1所示之背板之立體圖。 【主要元件符號說明】1294074 - ϋ, 九, invention: [Technical Field] The present invention relates to a heat sink and an electronic device using the same. [Prior Art] As the electronic information industry continues to evolve, the frequency and speed of electronic components (especially central processors) continue to increase. However, the high-frequency and high-speed high-speed will increase the heat generated by the prismatic components, which will increase the temperature and affect the performance of the electronic components. To ensure the normal operation of the electronic components, the electronic components must be discharged in time. A lot of heat. ^ For this reason, the industry usually uses a heat sink for heat dissipation. The conventional heat sink generally includes a base mounted on the electronic component and a plurality of hot films disposed on the bottom a, as the electronic product continues to be packaged in high density. With the development of multi-month b direction, the system space is also reduced, which greatly limits the size of the device, making the heat dissipation problem more and more severe. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a heat dissipating device having a high heat dissipation efficiency and an electronic device using the heat dissipating device. The heat dissipating device comprises a heat sink, a back plate and a fixing member connected to the back plate heat exchanger, the back plate comprises a body and a heat sink coupled to the body. The electronic device includes a motherboard, a central processing unit, a scatter, a north, a σ-board, and a fixing member; the motherboard has a first side and a 6 1294074 ... On the second side, the central processor is mounted on the first side of the motherboard, the heat sink is attached to the central processor; the board is disposed on the second side of the motherboard, the fixing component and the backboard: Holding the heat sink on the motherboard, the backboard includes a body and a heat sink thermally coupled to the body. Compared with the prior art, the present invention has at least the following advantages: · forming a heat dissipating structure on the main body of the back plate, and cooperating with the fixing member to realize the fixing of the heat sink, and further utilizing the heat dissipating structure on the main body to supplement the heat source. Cooling 'utilizes the back space of the motherboard to improve heat dissipation efficiency. [Embodiment] FIG. 1 to FIG. 3 show a heat sink device for dissipating a heat dissipation device generated by a central processing unit 34 mounted on a motherboard 3 in a preferred embodiment of the present invention. The device mainly comprises a heat sink 10, a back plate 2〇 and a plurality of fixing members 40, and the end of the fixing member 4 is formed with a thread which is matched with the back plate. The central processing unit 34 is mounted on the front surface of the main board 30, and the four corners around it are formed with perforations 32 through which the fixing members 4 are passed. The heat sink 1 is attached to the central processing unit 34 i , and the back plate is placed on the back surface of the main board 30 and mated with the fixing member 40 to fix the heat sink 1 to the main board 30 . As shown in Figs. 1 and 2, the heat sink 1A includes a base u, a plurality of fins 12 arranged in parallel on the base 11, and two heat pipes 14. The substrate Μ is generally made of a material having good thermal conductivity such as copper or ingot, and has a substantially rectangular shape, and its bottom surface is in contact with the top surface of the central processing 3 34 to absorb the amount of heat generated by it 1294074. Each of the four corners of the base π protrudes outwardly from a lug 〇, and each of the lugs 110 defines a through hole 112 corresponding to the through hole 32 of the motherboard 30. The upper surface of the upper surface of the base U is arranged side by side with two semicircular grooves 13 which are perpendicular to the side edges of the lugs 11G of the base n. The fins are arranged in parallel on the pedestal 11JL, and the upper and lower edges are vertically bent and extended with a hem, and all of the hem are continuously formed into a plane conforming to the upper surface of the susceptor u, and the plane is on the vertical fin 12 The extending direction is formed with a semicircular groove 123 corresponding to the groove 13 on the base. Each of the fins 12 is provided with a double circle 1 (not numbered) at a distance from the lower side edge, and the periphery of the circular hole is formed to have a folded edge laterally. All of these circular holes are coaxially arranged to form a circular through hole 16 of 14. The heat pipe 14 is generally U-shaped and includes a horizontal section 144, , , | eight Λ., __ two horizontal sections 146 and - a first level of the heat transfer section 142' connecting the horizontal section 144 and the second horizontal section 146 Segment 144 is received in the recess. The second horizontal section 146 is accommodated in the through hole, and the heat generated from the central processing unit 34 is absorbed from the base η, and is transmitted to the second horizontal section through the transmission 142. 146, and then through the second horizontal section (10) to the upper portion of the heat sink 12 to distribute heat evenly on the heat sink 12, thereby improving heat dissipation efficiency. The material: Ζ reference picture ^ back plate 2G is also made of copper, material thermal conductivity = good, it is closely attached to the back of the motherboard 3, on the one hand can be fixed with the fixed heat sink 10 on the motherboard 30, On the other hand, it can be used to assist the emission of the central processor 34 to the amount of power on the motherboard 30, from the "system cooling efficiency, and effectively utilize the system space. Backplane 8 1294074: 2 〇 include - this 胄 21 and settings The heat dissipating body on the body 2i, in the embodiment, is a plurality of heat-dissipating Korean films integrally formed with the body 21, and the holes 212 corresponding to the four-corner body of the main body 21 are divided into two sides. It can be understood that the heat sink is not limited to its shape and structure, and can be changed according to system space and heat dissipation. For example, it is not limited to being formed integrally with the body 21, and it can also be welded or the like by other means. achieve. In the assembly process, the heat dissipation device of the embodiment may firstly position the back plate 20 on the back surface of the motherboard 30, and align the screw holes 212 of the back plate 2 with the four corners with the through holes 32 of the motherboard 30. Then, the heat sink If U) is placed on the top of the central processing unit 34, and the heat sink 1 is aligned with the through hole ι 2 to align the perforation 32 'the bottom surface of the heat sink 1G and the top surface of the central processor %, both A heat transfer medium can be added to improve heat transfer efficiency. Finally, the fixing member 40 is sequentially passed through the through hole 112 and the perforation %, and screwed into the screw hole 212 of the back plate 20 to fix the heat sink 1〇 on the main board 3〇. It can be understood that the body 21 of the backboard 20 and the heat sink can also be disposed separately and connected by a heat pipe. Preferably, the heat sink may be a metal case of an electronic device. ^ In summary, the present invention complies with the patent requirements of the invention and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective exploded view of a heat sink according to a preferred embodiment of the present invention. FIG. Figure 3 is a perspective view of the backing plate shown in Figure 1. [Main component symbol description]
散熱器 10 基座 11 凸耳 110 透孔 112 散熱片 12 凹槽 123 、 13 孰管 i、、％ 14 傳熱段 142 第一水平段 144 第二水平段 146 通孔 16 背板 20 本體 21 螺孔 212 散熱鰭片 22 主機板 30 穿孔 32 中央處理器 34 固定件 40Radiator 10 base 11 lug 110 through hole 112 fin 12 recess 123, 13 manifold i,, % 14 heat transfer section 142 first horizontal section 144 second horizontal section 146 through hole 16 back plate 20 body 21 screw Hole 212 Heat sink fin 22 Mother board 30 Perforation 32 Central processor 34 Fixing member 40