1281599 A7 ___B7 五、發明説明（1 ) 發明所屬之技術領域 本發明係關於對玻璃基板或半導體晶圓等基板施予顯 像等處理的系統。 先行技術 在玻璃基板等基板形成微細的配線圖案等是透過微細 圖案的遮罩來進行鈾刻或離子摻雜等各種處理。 於是，要形成上述微細圖案的遮罩就在基板表面形成 光阻劑膜，對該光阻劑膜進行選擇性曝光，供給顯像液至 曝光後的光阻劑膜，如果是負型光阻劑膜則溶出非曝光部 分，如果爲正型光阻劑膜則溶出曝光部分後形成微細圖案 〇 就LCD用的大型角基板的顯像而言，顯像方法大致分 爲2種，1種是旋轉顯像，另1種爲線內（in-line)式顯像系 統。 旋轉顯像系統是將曝光後的基板保持在旋轉杯內的夾 盤，在該靜止狀態的基板表面盛放顯像液，在進行指定時 間顯像後利用夾盤使基板旋轉利用離心力甩開顯像液的系 統，因爲是在靜止的狀態下進行顯像所以適於微細的圖案 形成。 此外，線內式顯像系統則是邊搬送基板，邊從配置在 搬送路上方的噴嘴將顯像液噴灑狀地供給至基板表面，再 邊搬送基板邊進行潤濕與乾燥的系統，因爲並未使基板旋 轉所以裝置構成簡單。 本纸張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） (請先閱讀背面之注意事寫本頁) •裝. 訂 經濟部智慧財產局員工消費合作社印製 -5- 1281599 A7 B7___ 五、發明説明（4 ) 另外，在傳送裝置2通過搬送滾筒1 1之間採用可以升降 的升降桿的情況下並無必要採用搬送帶12，可以是僅以搬 送滾筒11來構成基板搬送部1。 此外，基板處理系統具備基板處理部3。基板處理部3 是以前述傳送裝置2的位置做爲基準而在基板搬送部1的上 游側與下游側被配置成平面圖上爲重疊的型態。另外，圖 示例中是將基板處理部3配置在基板搬送部1的上方，但也 是可以配置在下方。 基板處理部3分別具備在與前述傳送裝置2之間進行基 板傳送的臂3 1，在被保持在臂3 1上的基板表面供給顯像液 等處理液的塗敷噴嘴32，吸引回收被供給到基板表面的顯 像液等處理液的回收噴嘴33。 前述塗敷噴嘴32以及回收噴嘴33被做成與基板表面保 持一定間隔並可以來回動作的型態，進而也可以採用切口 噴嘴作爲這些塗敷噴嘴3 2以及回收噴嘴3 3來進行有效率的 塗敷·回收。 以下就以上構成所形成的基板處理系統所做的顯像處 理加以說明。 首先，如第1圖所示光阻劑膜曝光處理終了的第1片基 板W1會經基板搬送部1的搬送滾筒11上被朝傳送裝置2搬送 過去。 接著，如第3圖所示，如果第1片基板1由搬送帶12搬送 直到傳送裝置2上，一旦停止下來就使傳送裝置2 (夾盤） 上昇從搬送帶12接收第1片基板W1 ° 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事填寫本頁) •裝· 經濟部智慧財產局員工消費合作社印製 -8- 1281599 A7 B7 五、發明説明（5 ) 如果從搬送帶12接收到第1片基板W1，則如第4圖所示 ，使傳送裝置2更上昇到極限，將第1片基板W1舉高至基板 處理部3的位置。這時，第2片基板W2會經基板搬送部1的 搬送滾11上被朝傳送裝置2搬送過去。 接著，如第5圖所示，上游側的基板處理部3的臂3 1會 從傳送裝置接收第1片基板W1，傳送裝置2則下降到原來的 位置，如第6圖所示，塗敷噴嘴32會下降到與第1片基板W1 的間隔成指定的間隔。此外，與此同時，第2片基板W2會 被搬送到傳送裝置2上。 之後，如第7圖所示，在臂3 1載置基板直接後退這段期 間會從塗敷噴嘴32供給顯像液。藉此對第1片基板W1 —定 量均等地供給顯像液。此外，在對第1片基板W 1供給顯像 液期間，傳送裝置2會將第2片基板W2舉高到基板處理部3 的位置。 接著，如第8圖所示，在上游側的基板處理部3回收噴 嘴33會下降到大約接觸到第1片基板W1表面的顯像液，而 在下游側的基板處理部3塗敷噴嘴32則下降到接近第2片基 板W2的表面。此外，與此同時，第3片基板W3會被搬送到 傳送裝置2上。 然後，如第9圖所示，在上游側的基板處理部3臂3 1會 前進並以回收噴嘴回收第1片基板w 1上的顯像液，而在下 游側的基板處理部3臂3 1會後退並供給顯像液至第2片基板 W2上。另外，已回收的顯像液透過循環流路邊被追加新液 ，邊被調整顯像液的濃度’被過濾之後’再從塗敷噴嘴3 2 本紙張尺度適用中國國家標準(。奶）八4規格（210><297公釐） (請先閱讀背面之注意事寫本頁) 裝 、1Τ 經濟部智慧財產局員工消費合作社印製 -9- 1281599 A7 B7 五、發明説明（6 ) 被供給出去。 接著’如第10圖所不’傳送裝置2上昇後接收第1片基 板W 1，進而如第1 1圖所示’傳送裝置下降後將第1片基板 W1傳送給基板搬送部1。該第1片基板W1被送到下游側後， 如第12圖所示，以傳送裝置2將第3片基板W3從基板搬送部 1舉起，如第13圖所示’將第3片基板W3送到上游側的基板 處理部3。這段期間，於下游側的基板處理部3對第2片基板 W2施予顯像處理。 然後如第14圖所示，於上游側的基板處理部3供給顯像 液給第3片基板W3，於下游側的基板處理部回收第2片基板 W2上的顯像液，將第4片基板W4送到搬送部1。之後，如第 15圖所示第2片基板W2會透過傳送裝置2被送回搬送部1， 第3片基板W3則在上游側的基板處理部3被施予顯像處理’ 進而如第16圖所示，第4片基板W4會被送到下游側的基板 處理部3。 以後，反覆上述的操作，對基板施予連續地顯像處理 〇 第17圖爲表示另一實施例並與第2圖同樣的平面圖’該 實施例中，是將基板處理部3以傳送裝置2爲中心配置成4個 。作成這種構造可以更加縮短處理的生產循環週期。 第1 8圖爲第1圖的另一實施例，在上游側或者下游側的 其中一方追加基板搬送部3，如第1 7圖所示即使不能朝橫方 向展開時，也能縮短處理的生產循環週期。 進而，如第1 9圖所示，在基板處理部3正下方設置供給 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） (請先閱讀背面之注意事填寫本頁) •裝 訂 經濟部智慧財產局員工消費合作社印製 -10- 1281599 經濟部智慧財產局員工消費合作社印製 A7 ___ B7____五、發明説明（7 ) 潤濕液的潤濕處理部，當然可以實現系統的小型化。 發明的效果 如以上說明，根據本發明因爲利用傳送裝置將搬送途 中的基板送到基板處理部進行顯像等處理，所以沒有必要 在處理中停止其他基板的搬送，又因爲是對靜止狀態的基 板施予處理，所以能提高處理的均一性，而且將基板搬送 部與基板處理部配置成平面圖上爲重疊的型態’可以達成 系統全體的小型化。 圖面之簡單說明 第1圖係關於本發明基板處理系統的縱剖面圖。 第2圖係同基板處理系統的平面圖。 第3圖係說明該基板處理系統的作業工程的縱剖面圖。 第4圖係說明該基板處理系統的作業工程的縱剖面匬1 ° 第5圖係說明該基板處理系統的作業工程的縱剖面圖1 ° 第6圖係說明該基板處理系統的作業工程的縱剖面圖。 第7圖係說明該基板處理系統的作業工程的縱剖面圖I ° 第8圖係說明該基板處理系統的作業工程的縱剖面圖。 第9圖係說明該基板處理系統的作業工程的縱剖面圖。 第10圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第11圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第1 2圖係說明該基板處理系統的作業工程的縱剖面圖 (請先閱讀背面之注意事填寫本頁} 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） -11 - 1281599 A7 B7 五、發明説明（8 第 圖 面 剖 縱 的 程Η 業 作 的 統 系 彐二 理 處 板 基 該 明 說 係 圖 第 圖 面 剖 縱 的 程Η 業 作 的 統 系 彐二 理 處 板 基 該 明 說 係 圖 第 圖 面 剖 縱 的 程Η 業 作 的 統 系 彐二 理 處 板 基 該 明 說 係 圖1281599 A7 ___B7 V. EMBODIMENT OF THE INVENTION (1) Field of the Invention The present invention relates to a system for performing processing such as imaging on a substrate such as a glass substrate or a semiconductor wafer. Prior art A fine wiring pattern or the like is formed on a substrate such as a glass substrate by performing a process such as uranium etching or ion doping through a mask of a fine pattern. Therefore, in order to form the mask of the fine pattern, a photoresist film is formed on the surface of the substrate, and the photoresist film is selectively exposed to supply a developing liquid to the exposed photoresist film, if it is a negative photoresist. The film is dissolved in the non-exposed portion, and if it is a positive photoresist film, the exposed portion is eluted to form a fine pattern. For the development of a large-angle substrate for LCD, the development method is roughly classified into two types, one is Rotating imaging, the other is an in-line imaging system. The rotary developing system is a chuck that holds the exposed substrate in the rotating cup, and holds the developing liquid on the surface of the stationary substrate, and uses the chuck to rotate the substrate by centrifugal force after performing the image development for a predetermined time. The liquid-like system is suitable for fine pattern formation because it is developed in a stationary state. In addition, the in-line type development system is a system in which the developer is sprayed onto the surface of the substrate by a nozzle disposed above the conveyance path while the substrate is conveyed, and the substrate is wetted and dried while being conveyed. The device is not rotated, so the device configuration is simple. This paper scale is applicable to China National Standard (CNS) Α4 specification (210Χ297 mm) (Please read the note on the back to write this page) • Installed. Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing-5-1281599 A7 B7___ 5. Description of the Invention (4) When the transfer device 2 uses a lifter that can be moved up and down between the transfer rollers 1 1 , it is not necessary to use the transfer belt 12 , and the substrate transfer unit 1 may be configured only by the transfer roller 11 . . Further, the substrate processing system includes a substrate processing unit 3. The substrate processing unit 3 is disposed in a plan view on the upstream side and the downstream side of the substrate transport unit 1 with reference to the position of the transport device 2 as a reference. Further, in the illustrated example, the substrate processing unit 3 is disposed above the substrate transport unit 1, but may be disposed below. Each of the substrate processing units 3 includes an application nozzle 32 that supplies a processing liquid such as a developing solution to the surface of the substrate held on the arm 31 by an arm 31 that performs substrate transfer between the transfer device 2, and suction supply is supplied. The recovery nozzle 33 of the treatment liquid such as a developing solution on the surface of the substrate. The coating nozzle 32 and the recovery nozzle 33 are formed to be spaced apart from the surface of the substrate and can be moved back and forth. Further, slit nozzles can be used as the coating nozzles 3 2 and the recovery nozzles 3 for efficient coating. Apply and recycle. The development processing performed by the substrate processing system formed as described above will be described below. First, the first substrate W1 which has been subjected to the exposure process of the photoresist film as shown in Fig. 1 is transported to the transfer device 2 via the transfer drum 11 of the substrate transfer unit 1. Next, as shown in FIG. 3, when the first substrate 1 is transported by the transport belt 12 up to the transport device 2, the transport device 2 (clip chuck) is raised and the first substrate W1 is received from the transport belt 12 when stopped. This paper scale applies to China National Standard (CNS) A4 specification (210X297 mm) (please read the note on the back to fill out this page) • Install · Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing-8-1281599 A7 B7 V. (5) When the first substrate W1 is received from the transport belt 12, as shown in Fig. 4, the transport device 2 is further raised to the limit, and the first substrate W1 is lifted up to the position of the substrate processing unit 3. . At this time, the second substrate W2 is transported toward the transport device 2 via the transport roller 11 of the substrate transport unit 1. Next, as shown in Fig. 5, the arm 31 of the upstream substrate processing unit 3 receives the first substrate W1 from the transport device, and the transport device 2 is lowered to the original position, as shown in Fig. 6, The nozzle 32 is lowered to a predetermined interval from the first substrate W1. At the same time, the second substrate W2 is transported to the transport device 2. Thereafter, as shown in Fig. 7, the developing liquid is supplied from the coating nozzle 32 while the arm 3 1 is placed on the substrate to be directly retracted. Thereby, the developing liquid is supplied to the first substrate W1 in a uniform manner. Further, while the developer liquid is supplied to the first substrate W1, the transfer device 2 lifts the second substrate W2 to the position of the substrate processing portion 3. Next, as shown in FIG. 8, the substrate processing unit 3 in the upstream side collects the nozzle 33 and descends to the developer liquid which is in contact with the surface of the first substrate W1, and the substrate processing unit 3 on the downstream side applies the nozzle 32. Then, it falls to the surface close to the second substrate W2. Further, at the same time, the third substrate W3 is transported to the transfer device 2. Then, as shown in Fig. 9, the arm 3 1 of the substrate processing unit 3 on the upstream side advances, and the developing liquid on the first substrate w 1 is recovered by the recovery nozzle, and the arm processing unit 3 on the downstream side is 3 1 will retreat and supply the developing liquid to the second substrate W2. In addition, the recovered developer liquid is added to the circulation flow path and a new liquid is added, and the concentration of the developer liquid is adjusted after being filtered. Then, from the application nozzle 3 2, the paper size is applied to the Chinese national standard (milk) eight. 4 specifications (210><297 mm) (Please read the note on the back to write this page) Pack, 1Τ Ministry of Economic Affairs Intellectual Property Bureau Staff Consumer Cooperative Printed -9- 1281599 A7 B7 V. Invention Description (6) Supply it out. Then, if the transfer device 2 is raised as shown in Fig. 10, the first substrate W1 is received, and as shown in Fig. 1, the transfer device is lowered, and the first substrate W1 is transferred to the substrate transfer unit 1. After the first substrate W1 is sent to the downstream side, as shown in FIG. 12, the third substrate W3 is lifted from the substrate transport unit 1 by the transport device 2, and the third substrate is shown as shown in FIG. W3 is sent to the substrate processing unit 3 on the upstream side. During this period, the substrate processing unit 3 on the downstream side applies a development process to the second substrate W2. Then, as shown in Fig. 14, the substrate processing unit 3 on the upstream side supplies the developing liquid to the third substrate W3, and the substrate processing unit on the downstream side collects the developing liquid on the second substrate W2, and the fourth sheet is collected. The substrate W4 is sent to the transport unit 1. After that, as shown in Fig. 15, the second substrate W2 is sent back to the transport unit 1 through the transport device 2, and the third substrate W3 is subjected to development processing in the upstream substrate processing unit 3, and as shown in Fig. 16. The fourth substrate W4 is sent to the substrate processing unit 3 on the downstream side. Thereafter, the above-described operation is repeated to apply a continuous development process to the substrate. Fig. 17 is a plan view showing another embodiment and being similar to Fig. 2. In this embodiment, the substrate processing unit 3 is a transfer device 2 Configured as four for the center. Making this configuration can further shorten the production cycle of the process. In the other embodiment of the first aspect, the substrate transfer unit 3 is added to one of the upstream side and the downstream side, and the production of the process can be shortened even if the horizontal direction cannot be expanded as shown in FIG. Cycle period. Further, as shown in Fig. 19, the Chinese National Standard (CNS) A4 specification (210X 297 mm) is applied directly below the substrate processing unit 3. (Please read the back of the page and fill out this page) • Binding Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing -10- 1281599 Ministry of Economic Affairs Intellectual Property Bureau employee consumption cooperative printing A7 ___ B7____ V. Invention description (7) Wetting treatment unit of dampening fluid, of course, can realize system miniaturization. Advantageous Effects of Invention As described above, according to the present invention, since the substrate in transit is sent to the substrate processing unit for processing such as development by the transfer device, it is not necessary to stop the transfer of the other substrate during the process, and the substrate is in a stationary state. Since the processing is performed, the uniformity of the processing can be improved, and the substrate transporting portion and the substrate processing portion can be arranged in a superimposed pattern on the plan view. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal sectional view showing a substrate processing system of the present invention. Figure 2 is a plan view of the same substrate processing system. Fig. 3 is a longitudinal sectional view showing the work of the substrate processing system. Fig. 4 is a longitudinal sectional view showing the working process of the substrate processing system. Fig. 5 is a longitudinal sectional view showing the operation of the substrate processing system. Fig. 1 is a view showing the operation of the substrate processing system. Sectional view. Fig. 7 is a longitudinal sectional view showing the operation of the substrate processing system. Fig. 8 is a longitudinal sectional view showing the operation of the substrate processing system. Fig. 9 is a longitudinal sectional view showing the work of the substrate processing system. Fig. 10 is a longitudinal sectional view showing the operation of the substrate processing system. Fig. 11 is a longitudinal sectional view showing the operation of the substrate processing system. Fig. 12 is a longitudinal sectional view showing the working process of the substrate processing system. Figure (Please read the note on the back of the page) This paper scale applies to the Chinese National Standard (CNS) A4 specification (210X 297 mm) -11 - 1281599 A7 B7 V. Description of the invention (8) Η Η Η 彐 彐 彐 板 板 该 该 该 该 该 该 该 该 该 该 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 系 第 第 第 第 第 第 第 第 第 第 第 第 第 第Department of the Department of Science and Technology
(請先閱讀背面之注意事V 第1 6圖係說明該基板處理系統的作業工程的縱剖面圖 〇 第17圖係表示另一實施例的平面圖。 第1 8圖係表示另一實施例的縱剖面圖。 第19圖係表示另一實施例的縱剖面圖。 圖號說明 1基板搬送部 2傳送裝置 3基板處理部 11搬送滾筒 12搬送帶 31臂 32塗敷噴嘴 33回收噴嘴 W1第1片基板 W2第2片基板 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） 裝-- 寫本頁)(Please read the note on the back first. Fig. 16 is a longitudinal sectional view showing the operation of the substrate processing system. Fig. 17 is a plan view showing another embodiment. Fig. 18 is a view showing another embodiment. Fig. 19 is a longitudinal cross-sectional view showing another embodiment. Fig. 1 shows a substrate transport unit 2 transport unit 3 substrate processing unit 11 transport roller 12 transport belt 31 arm 32 application nozzle 33 recovery nozzle W1 first The second substrate of the substrate W2 is applicable to the Chinese National Standard (CNS) Α4 specification (210X 297 mm) - write this page)
1T 經濟部智慧財產局S工消費合作社印製 -12- 1281599 A7 五、發明説明（9 ) W3第3片基板 W4第4片基板 •.....—! ·=-- II · ! J - - !^— --- - 士 (請先閱讀背面之注意事ιβ填寫本頁) 訂 線 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中.國國家標隼（CNS ) Α4規格（210Χ 297公釐） -13-1T Ministry of Economic Affairs Intellectual Property Bureau S-Working Consumer Cooperative Printed -12- 1281599 A7 V. Invention Description (9) W3 3rd Substrate W4 4th Substrate •.....——! ·=-- II · ! J - - !^— --- - 士 (Please read the note on the back first to fill out this page) Customize the Ministry of Economic Affairs Intellectual Property Bureau Employees Consumption Cooperatives Print this paper size applicable. National Standard (CNS) Α 4 Specifications (210Χ 297 mm) -13-