1278985 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種靜電放電保護元件，更明確地說，係 有關一種具低觸發電壓及簡易製程之靜電放電保護裝置。 【先前技術】 '1278985 IX. Description of the Invention: [Technical Field] The present invention relates to an electrostatic discharge protection element, and more particularly to an electrostatic discharge protection device having a low trigger voltage and a simple process. [Prior Art] '
對於過電壓之保護係持續地為電路設計上的重點之_。 傳統上，過電壓保護係使用二極體為之，但使用二極體之 過電壓保護裝置之觸發電壓（trigger vohage)一般超出某些 積體電路所能承受之極限，而使得其用途受到限制。 在相關領域中，已有少數試圖改進靜電放電保護元件之 發明，如Motorola公司之專利號US 6,493，198所示。該習知 70件係在印刷電路板中，將電路層以蝕刻等方式刻出一懸 空突出之結構’以和下方之接地層使用空氣為介質進行靜 電放電。虽隹然該習知技藝將過電壓#護裝置併A電路板之 中’可簡化製作之程序，但其仍具有以下之缺點： 1 ·使用空氣為介質’觸發電壓仍高，而其說明書及申 請專利範圍巾並未提議或以可使用其他材料作為^質； 2·其為開放式結構，容易受到製造過程中其他覆蓋芦 誤覆蓋於上，或使料程巾外界污染而降低效能，而^ 明書及申請專利範圍中並未提議或暗示可將該發明之：椹 以何種方式㈣護或封閉，相反地，其說明t中還教 要確定留下開口； τ 3. 路板的 於該習知技藝中，谁弁越+ a 以印刷電 質層之厚 進仃靜電放電的兩端係The protection of overvoltage is continually the focus of circuit design. Traditionally, the overvoltage protection system uses a diode, but the trigger voltage of the overvoltage protection device using the diode generally exceeds the limit that some integrated circuits can withstand, and its use is limited. . In the related art, there have been a few inventions that attempt to improve the electrostatic discharge protection component, as shown in the patent number US 6,493,198 to Motorola. The conventional 70-piece is in a printed circuit board, and the circuit layer is etched or the like to etch a suspended structure erected to electrostatically discharge with the underlying ground layer using air as a medium. Although the conventional technique will over-voltage the protection device and the 'A circuit board' can simplify the production process, it still has the following disadvantages: 1 · Using air as the medium' trigger voltage is still high, and its specification and The scope of the patent application does not propose or use other materials as the quality; 2. It is an open structure, which is easily covered by other coverings in the manufacturing process, or the external pollution of the material towel is reduced, and the efficiency is lowered. ^ The invention and the scope of the patent application do not suggest or imply that the invention may be: in what way (4) is protected or closed, and conversely, the description t also teaches to determine the remaining opening; τ 3. In this conventional technique, whoever + y is printed on the two ends of the electrostatic discharge by the thickness of the printed dielectric layer
一介電質層加以分陪M 刀知開一段距離，該介電 102713.doc 1278985 2叙為數nnl (mil為千分之一英对），此厚度對於靜電放 1言仍顯稍大，但其說明書及申請專利 或暗示如何將該距_小。 【發明内容】 严改進上述之缺點’本發明提出-新穎結構之過電壓靜 =電保護裝置，其具有低觸發電壓及製程簡易之優點。A dielectric layer is added to the M-knife to open a distance. The dielectric 102713.doc 1278985 2 is counted as nnn (mil is one thousandth of a mile), and this thickness is still slightly larger for electrostatic discharge, but Its specifications and patent applications or hints how to make the distance _ small. SUMMARY OF THE INVENTION The above disadvantages are severely improved. The present invention proposes a novel structure of an overvoltage static electric protection device which has the advantages of low trigger voltage and simple process.
=所有猙電放電裝置’本發明之靜電放電保護裝置亦 具有貫質上電性分離之兩個電極區，但本發明之特點在 ^該等兩個電極㈣各為—㈣板之-部分，且該等兩 塊導電板以壓合方式或黏合方式而成為該裝置之至少一部 分’使該等兩個電極區之間留有一間隙作為電性分離之 用°因此’本發明極適於使用印刷電路板之製冑，而大 且"ί貝廉地製造。 吞亥等導電板並不需穿+垃 王接&在一起，僅需其該等電極區 之間留有所述之間隙之距離即可。 再者’本發明之靜電放電保護裝置中還另外提供了一放 電區’其可充滿具需要之崩潰電壓之物質。該等兩個電極 區同時緊鄰於該放電區，啖在兮妙 ^在5亥放電區包括在内。於該等 電極區之間的電位差大於一 ^ 預疋值時，该等電極區之間會 經由該放電區放電並導通。該物皙 邊物貝可為虱氣或低溫燒結型 介電材料之類低崩潰電壓之物質。 由於本發明之裝置以該等導雷妨厭人斗、*人 只号等罨扳壓合或黏合而成，故導 電板之間的距離（也就是該箄雷^ 、 疋唸寻^極區之間可能的最小距離） 僅為10〜20 μπι (μιη為百萬分之_ΑΡ、工 禺刀之公尺）。再加上本發明之放 I02713.doc .1278985 電區中使用低崩潰電壓之物質充填，以氦氣為例，氦氣之 崩潰電壓僅為空氣的1/9,故本發明之該裝置之觸發電壓理 論上可低至20伏特左右。 配合上述之裝置，本發明還提供了一組裝該裝置的方 • 法，包含下列步驟： 提供兩塊導電板，其中該每一導電板含有至少—電極區； 將該兩塊導電板以壓合方式或黏合方式加以接合而成°為 • 肖裝置之至少一部分’並且該等電極區間留有-間隙以供 靜電放電之用；以及 製作一放電區，以被具需要之崩潰電壓之物質所充滿， 使該等電極區同時緊鄰於該放電區或在該放電區内。 於上述之裝置及方法中，該間隙距離實質上大於i〇 pm， 過小會有短路的顧慮。 如採用印刷電路板之製程，則該等導電板可各附著於一 基板作為其外層之至少-部份’該等基板可為印刷電路板 • 技術中使用之硬板或軟板，其中該硬版可為類似FR_4之含 裱氧樹脂之玻璃纖維板，而該軟板可由聚亞醯胺構成。且 該等兩塊導電板之壓合方式可使用熱壓合製程，該間隙由 黏著膠體層所構成。 【實施方式】 為了便於瞭解本發明起見，以下將以一具體實施例解說 之，其中相同的元件符號表示相同或相似的元件，且該實 施例僅為本發明之一可能貫施方式，所有不脫離本發明範 疇之可能的變化都屬於本發明所申請之範圍。 102713.doc 1278985 清見圖la、圖113及圖lc。圖la為本發明之一實施例之裝 置之上視圖，圖lb為該裝置沿圖la+A_A,線之剖面圖，圖 為該裝置之下視圖。 該實施例之裝置具有至少兩個外接端101及102。該襄置 由兩基㈣3及104構成。每一該等外接端皆被該等基板所 共有。每一該等基板連接該等外接端的至少一個面上鋪設 有導電板105。該兩基板之該等導電板相接，但是於其接： 面上留有-間隙剛而不使該兩基板直接電性接觸。該等導 電板1〇5不完全覆蓋連接該等外接^的該接觸面，以使得同 一基板之該等外接端之間，實質上無法經由該導電板105 而導通。該裝置尚包含有-空腔形式之—放電區⑽。該放 電區同時接觸或包含在該接觸面上每一該等基板之導電板 1 05之至>、刀’且充滿著所需要之崩潰電壓的物質。 鑑於本實施例之該裝置之結構細密，故由該裝置之製造 方法開始介紹，俾能易於對本實施例之該裝置之結構有= 冰' 層的認識。 首先，先提供兩基板。圖2a、圖2b及圖2c中所顯示者， 分別為圖lb中上方之該基板1G3未處理前之上視圖了下視 圖，及沿圖2a中B-B，線之剖面圖。另—基板1〇4具有相同之 構造。吾人已知’每-該等基板皆擁有先前所述之兩個外 接端之-部分。若以圖2b為例’其右側末端於該裝置中為 外接端！02之一部分，而左側末端於該裝置中為外接端 之一部分。每一該等基板連接該等外接端的至少一個面上 鋪設有導電板105。 102713.doc 10- Ϊ278985 接著，對每—基板而言，選定該等導電板之—做為接合 面。於本貫施例之該裝置中，該接合面即為導電板1〇5。該 . 冑電板不完全覆蓋連接該輪入端及該輸出端的表面，使得 ： @ —基板之該輸人端與該輪出端之間，實質上無法經由該 f電板而導通。於圖2b及圖2。中，可看到該導電板之不連 、·賣處201使知在導電板1〇5上左側末端與右側末端之間實質 為電HlWj離。在该導電板黏貼或錢上該基板之前，先在 鲁 肖基板103上施加-罩幕，於該導電板黏貼或鍍上該基板 103之後，再剝離該罩幕，或於全面性黏貼或鍍上該導電板 後’再將不需要之部分剝離或除去。 接著，以前述之接合面將兩基板相互貼近，並留有一間 隙106而不使該兩基板直接電性接觸。如圖“、圖讣及圖仏 中所顯示者，分別為接合後之該裝置之上視圖，圖3 &中沿 著線C-C’之剖面圖，及該裝置之下視圖。隨後，於該等兩 基板之接合面製作一空腔形式之放電區，如圖1]3中之放電 ® 區107。該放電區107同時接觸或包含每一該等基板之導電 板105之至少部分，且充滿具需要之崩潰電壓之物質。可相 當簡易的以鑽孔方式製作該空腔形式之放電區，並於充入 遠具需要之崩潰電壓之物質後，將該放電區以玻璃膠等物 質封閉，如圖1 b中之封閉區域1 〇8。 於完成上述本實施例之該裝置之基本結構後，另可於兩 端完成通孔109,並於圖3b中之外表面301及3 02上施以需要 之餘刻或圖案化步驟’以及端電極製作，即可成為一鹿用 於電路板上之標準元件，如圖la、圖lb及圖lc所示。 102713.doc 1278985 ^習本技藝者應能瞭解，本發明之裝置由於能夠運用印 /路板之製程，故製作時可先大量製作在同一基板上， ==開以得到具有靜電放電保護功能的個別表面黏 Γ過電㈣護元件，達到批次化量產之目的。該等過電 ^保遵70件也可以多晶片並聯方式成為陣列形式之元件。 或者，在-印刷電路板上某部位（或全面）製作本發明之裝 置，該印刷電路板即成為一塊具有靜電放電保護功能之電 路板。 2此之後之可能應用極多，但皆屬本發明之基本應用， 茲舉下列數例·· ^可於8亥裝置外表面上，利用表面黏著技術附加上且 =㈣訊消除功能，且同時具備有電感加電容功能的κ =益元件’形成同時具有靜電放電保護和高頻雜訊消除 功月b之過―電㈣護元件或陣列元件（將複數個該元件並聯）。 2·於丽述具靜電放電保護功能之電路板上，附加上且 =頻雜訊消除功能’且同時具備有電感加電容功能的π 2元件’形成同時具有靜電放電保護和高頻雜訊消除 功能之電路板。 3·將該前述具有靜電放電保護功能之電路板 人 PPTC過電隸護元件，即成為—同時具有過電壓= 保護功能之電路板’若加以切割，則形成個別 過電壓及過電流保護功能之單晶片元件或陣列元件。 4.前述同時具有過電壓及過電流保護功能之電路板上 可再加入具有高頻雜訊消除功能，且同時具備有電感加電 102713.doc • 1278985 :此的LC濾波器元件，即成為同時具有過電壓及過電流 二功能與高頻雜訊消除功能之印刷電路板。若加以切 . 成個別之同時具有過電壓及過電流保護功能與高 • 頻雜訊消除功能之單晶片元件或陣列元件。 於上述之裝置及方法中，該間隙距離實質上大於10 μιη， • 過小會有短路的顧慮。 如採用印刷電路板之製程，則該等導電板可各附著於一 • *板作為其外層之至少一部份，該等基板可為印刷電路板 技術中使用之硬板或軟板，其中該硬板可為類似FR-4之含 裒氧树月曰之玻璃纖維板，而該軟板可由聚亞醯胺構成。該 等兩塊導電板之壓合方式可使用熱壓合製程，該間隙由黏 著膠體層所構成。 【圖式簡單說明】 以下各圖之比例為清楚起見，皆未依正確比例繪製，故 圖中之比例僅為示意圖，而非為實施時之實際尺寸。 鲁 圖1a、圖lb及圖lc為本裝置之一具體實施例之上視圖， 沿線A-A’分割之剖面圖，與下視圖。 圖2a、圖2b及圖2c為本裝置之一具體實施例之製作過程 中，一基板之上視圖，沿線B-B’分割之剖面圖，與下視圖。 圖3a、圖3b及圖3c為本裝置之一具體實施例之製作過程 中，兩基板接合後之示意圖。 【主要元件符號說明】 101 外接端 102 外接端 102713.doc 13 1278985 103 基板 104 基板 105 導電板 106 間隙 107 放電區 108 封閉區域 109 通孔 201 不連纟買處 301 外表面 302 外表面 102713.doc -14= all electric discharge devices of the present invention. The electrostatic discharge protection device of the present invention also has two electrode regions that are electrically separated electrically, but the present invention is characterized in that the two electrodes (four) are each - (four) plate-parts, And the two conductive plates are at least part of the device by pressing or bonding, so that a gap is left between the two electrode regions for electrical separation. Therefore, the present invention is extremely suitable for printing. The circuit board is made up of large and " Conductive plates such as Tenghai do not need to be worn together. It is only necessary to leave the gap between the electrode areas. Further, the electrostatic discharge protection device of the present invention additionally provides a discharge region which can be filled with a substance having a required breakdown voltage. The two electrode regions are simultaneously adjacent to the discharge region, and are included in the 5 hai discharge region. When the potential difference between the electrode regions is greater than a predetermined value, the electrode regions are discharged and turned on via the discharge region. The material may be a low breakdown voltage substance such as a helium gas or a low-temperature sintered dielectric material. Since the device of the present invention is formed by pressing or bonding the cockroaches, the horns, etc., the distance between the conductive plates (that is, the 箄雷^, 疋念寻极区The minimum possible distance between them is only 10~20 μπι (μιη is _ 百万 ΑΡ, 公 之 metric metric). In addition, the I02713.doc.1278985 electric zone of the present invention is filled with a material with a low breakdown voltage. In the case of helium gas, the collapse voltage of helium is only 1/9 of that of air, so the trigger of the device of the present invention The voltage can theoretically be as low as about 20 volts. In conjunction with the above apparatus, the present invention also provides a method of assembling the apparatus, comprising the steps of: providing two conductive plates, wherein each conductive plate contains at least an electrode region; and pressing the two conductive plates together Formed or bonded to form at least a portion of the ? device and the electrodes are provided with a gap for electrostatic discharge; and a discharge region is formed to be filled with a substance having a required breakdown voltage The electrode regions are simultaneously adjacent to or within the discharge region. In the above apparatus and method, the gap distance is substantially larger than i pm, and if it is too small, there is a concern of short circuit. If a printed circuit board process is employed, the conductive plates may each be attached to a substrate as at least a portion of the outer layer. The substrates may be printed circuit boards or hard or soft boards used in the technology, wherein the hard The plate may be a glass fiber board containing a oxy-resin similar to FR_4, and the soft board may be composed of polymethyleneamine. And the pressing manner of the two conductive plates can be performed by a thermal compression bonding process, and the gap is composed of an adhesive layer. [Embodiment] In order to facilitate the understanding of the present invention, the following is a detailed description of the embodiments, wherein the same reference numerals are used for the same or similar elements, and the embodiment is only one possible mode of the present invention, all Possible variations without departing from the scope of the invention are within the scope of the invention. 102713.doc 1278985 See Figure la, Figure 113 and Figure lc. Figure la is a top view of an apparatus according to an embodiment of the present invention, and Figure 1b is a cross-sectional view of the apparatus taken along line la+A-A, and the figure is a lower view of the apparatus. The device of this embodiment has at least two external ends 101 and 102. The device consists of two bases (four) 3 and 104. Each of the external terminals is shared by the substrates. A conductive plate 105 is disposed on at least one surface of each of the substrates connected to the external terminals. The conductive plates of the two substrates are in contact with each other, but a gap is left on the surface of the substrate without directly contacting the two substrates. The conductive plates 1〇5 do not completely cover the contact faces connecting the external contacts such that substantially no connection between the external terminals of the same substrate via the conductive plates 105 is possible. The device also includes a discharge zone (10) in the form of a cavity. The discharge region simultaneously contacts or contains the conductive plates of each of the substrates on the contact surface, the knives and is filled with the required breakdown voltage. In view of the fact that the apparatus of the present embodiment is fine in structure, it has been described by the manufacturing method of the apparatus that the structure of the apparatus of the present embodiment can be easily recognized by the structure of the ice layer. First, two substrates are provided first. 2a, 2b, and 2c, respectively, the upper view of the upper substrate 1G3 in Fig. 1b is untreated, and the cross-sectional view taken along line B-B in Fig. 2a. In addition, the substrate 1〇4 has the same configuration. It is known that each of the substrates has a portion of the two external ends previously described. Take Figure 2b as an example. The right end of the device is an external terminal in the device! One part of 02, and the left end is part of the external end in the device. A conductive plate 105 is disposed on at least one surface of each of the external terminals connected to the substrates. 102713.doc 10- Ϊ 278985 Next, for each substrate, the conductive plates are selected as the joint faces. In the device of the present embodiment, the joint surface is the conductive plate 1〇5. The 胄 electric plate does not completely cover the surface connecting the wheel end and the output end, such that: @—the input end of the substrate and the wheel end are substantially incapable of conducting through the f-electrode. Figure 2b and Figure 2. In the middle, it can be seen that the conductive plate is not connected, and the selling place 201 makes it known that the left end and the right end of the conductive plate 1〇5 are substantially electrically separated. Before the conductive plate is pasted or used on the substrate, a mask is applied on the Lushaw substrate 103. After the conductive plate is pasted or plated, the mask is peeled off, or the adhesive is fully adhered or plated. After the conductive plate is placed, the unnecessary portion is peeled off or removed. Then, the two substrates are brought close to each other by the aforementioned bonding faces, and a gap 106 is left without directly contacting the two substrates. As shown in the figure ", Figure 讣 and Figure ,, respectively, the top view of the device after the joint, the cross-sectional view along line C-C' in Figure 3 & and the lower view of the device. Subsequently, Forming a discharge region in the form of a cavity on the bonding surface of the two substrates, such as the discharge® region 107 in FIG. 1 and 3. The discharge region 107 simultaneously contacts or includes at least a portion of the conductive plate 105 of each of the substrates, and It is filled with the material with the required breakdown voltage. The discharge area in the form of a cavity can be made by drilling in a relatively simple manner, and after filling the material with the required breakdown voltage, the discharge area is sealed with a glass glue or the like. , as shown in FIG. 1 b, after the basic structure of the device of the present embodiment is completed, the through holes 109 can be completed at both ends, and on the outer surfaces 301 and 302 of FIG. 3b. Applying the necessary engraving or patterning step 'and the end electrode fabrication, it can be used as a standard component on a circuit board, as shown in Figure la, Figure lb and Figure lc. 102713.doc 1278985 ^Appreciation Skills It should be understood that the device of the present invention can utilize the printing/road board Process, so the production can be made in large quantities on the same substrate, == open to obtain individual surface adhesive over-current (four) protection components with electrostatic discharge protection function, to achieve the purpose of mass production. The 70-piece can also be used as an element in the form of an array in a multi-wafer parallel manner. Alternatively, the device of the present invention can be fabricated at a certain portion (or comprehensively) on a printed circuit board, and the printed circuit board becomes a circuit board having an electrostatic discharge protection function. 2 After this, there may be many applications, but they are all the basic applications of the present invention. The following examples can be added to the outer surface of the device, and the surface adhesion technology is used to add and eliminate the (four) signal cancellation function. At the same time, the κ=Yi component with the function of inductance and capacitance is formed with both electrostatic discharge protection and high-frequency noise elimination. The electric (four) protection component or array component (the plurality of components are connected in parallel). Lixu has an electrostatic discharge protection function on the circuit board, with the addition of = frequency noise cancellation function 'and π 2 components with inductance and capacitance function formed simultaneously with electrostatic discharge protection Circuit board for high-frequency noise cancellation function. 3. The circuit board PPTC over-current protection component with the above-mentioned electrostatic discharge protection function becomes a circuit board with overvoltage = protection function. Single-wafer component or array component forming individual over-voltage and over-current protection functions. 4. The above-mentioned circuit board with overvoltage and overcurrent protection functions can be added with high-frequency noise cancellation function, and at the same time, it has inductance plus Electric 102713.doc • 1278985: This LC filter component is a printed circuit board that has both overvoltage and overcurrent functions and high frequency noise cancellation. If it is cut, it has an overvoltage and over Single-chip or array components with current protection and high-frequency noise cancellation. In the above apparatus and method, the gap distance is substantially greater than 10 μm, and • too small a short circuit may be a concern. If a printed circuit board process is used, the conductive plates may each be attached to a * board as at least a portion of an outer layer thereof, and the substrates may be hard or soft boards used in printed circuit board technology, wherein The hard board may be a fiberglass board containing 裒-4 containing a cerium tree, and the soft board may be composed of polyamidamine. The two conductive plates may be pressed together by a thermal compression process consisting of an adhesive layer. [Simplified description of the drawings] The proportions of the following figures are not drawn to the correct scale for the sake of clarity. Therefore, the ratios in the figures are only schematic views, not the actual dimensions at the time of implementation. Lutu 1a, lb, and lc are top views of a specific embodiment of the apparatus, a cross-sectional view taken along line A-A', and a lower view. 2a, 2b, and 2c are a top view of a substrate, a cross-sectional view taken along line B-B', and a bottom view, during fabrication of one embodiment of the apparatus. 3a, 3b and 3c are schematic views of the bonding of the two substrates in the manufacturing process of one embodiment of the device. [Main component symbol description] 101 External terminal 102 External terminal 102713.doc 13 1278985 103 Substrate 104 Substrate 105 Conductive plate 106 Clearance 107 Discharge area 108 Closed area 109 Through hole 201 Not in place 301 Outer surface 302 Outer surface 102713.doc -14