TWI278978B - Flow-path constituting body - Google Patents

Flow-path constituting body Download PDF

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Publication number
TWI278978B
TWI278978B TW093133436A TW93133436A TWI278978B TW I278978 B TWI278978 B TW I278978B TW 093133436 A TW093133436 A TW 093133436A TW 93133436 A TW93133436 A TW 93133436A TW I278978 B TWI278978 B TW I278978B
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TW
Taiwan
Prior art keywords
flow path
path structure
flow
flexible film
fluid
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TW093133436A
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Chinese (zh)
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TW200524116A (en
Inventor
Mitsuo Yokozawa
Kiyotsugu Takasawa
Hiroshi Sugihara
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Nidec Sankyo Corp
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Publication of TW200524116A publication Critical patent/TW200524116A/en
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Publication of TWI278978B publication Critical patent/TWI278978B/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • F28F3/14Elements constructed in the shape of a hollow panel, e.g. with channels by separating portions of a pair of joined sheets to form channels, e.g. by inflation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/065Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material the heat-exchange apparatus employing plate-like or laminated conduits
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/26Safety or protection arrangements; Arrangements for preventing malfunction for allowing differential expansion between elements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)

Abstract

The present invention provides a passage constituting body in which arrangement or alignment can be easily carried out because of flexibility in the case of constituting a fluid passage route, passage constitution can be extremely easily performed at the time of manufacturing the passage constituting body, and the sealing of fluid can be secured in spite of sufficiently flexible constitution. The passage constituting body 150 is provided with at least two or more ports 151, 155, 156, 158 for allowing fluid to flow in or out and passages 152, 154, 157 for connecting respective ports. At least a part of the passages 152, 154, 157 is constituted of a non-adhesive area restricted by an adhesive area between flexible films or between a flexible film and another member.

Description

1278978 九、發明說明: 【發明所屬之技術領域】 本發明係關於流路結構體,特別係關於對個人電腦等電 子機器之發熱部,利用流體進行冷卻的情況時,所適用的 流路結構體之構造。 【先前技術】 近年,因為個人電腦的性能明顯的提昇,C P U ( C e n t r a 1 ProcessingUnit)處理速度亦正急遽的提昇,因而來自CPU 晶片等之發熱量亦將增加,其冷卻方法已構成問題。習知 的一般冷卻方法,係在具備風扇等散熱板上,固定著 CPU 晶片等發熱部,並藉由對此散熱板利用風扇等輸送氣流, 而強制性的施行空氣冷卻。可是,此種空氣冷卻方式,若 欲提高冷卻能力的話,便將出現空氣冷卻風扇噪音變大的 問題點,此外,因為在小型化的電腦框體内並無法充分確 保冷卻用通氣空間,因而將有無法獲得充分冷卻效率的問 題。 所以,便有探討著設置有:使 C P U晶片等發熱部接觸於 冷卻夾套,並對此冷卻夾套内供應液體且循環,並在液體 的循環路徑内推進液體的泵;以及具有散熱器構造的散熱 部之液冷方式(例如參照以下之專利文獻1 )。 (專利文獻1 )日本專利特開2 0 0 2 _ 9 9 3 5 6號公報 【發明内容】 (發明所欲解決之問題) 但是,在上述習知的液冷方式之冷卻系統中,因為將如 5 312XP/發明說明書(補件)/94-02/93133436 1278978 冷卻夾套、散熱部、泵、備用槽(reserve tank)等, 金屬或合成樹脂製管予以連接,因而便需要多數個管 其連接的接頭等,所以,將隨零件數量的增加,而出 裝時的連接作業繁雜,且製造上頗費工的問題。 再者,合成樹脂製具可撓性的管本身,因為一般均 有阻氣性,所以將無法完全防止管或其與各零件的連 份處有冷卻劑揮發於外面的情況,因而隨時間的經過 預測冷卻劑量將減少。所以,便勘查此種冷卻劑的揮 與冷卻劑的膨漲·收縮程度,而設置備用槽等副室, 須充分的確保其容量,因而亦有頗難將系統小型化 題。另外,為防止上述冷卻劑的揮發,亦有考慮採用 製管,但是,此情況下,因為頗難將管適當的彎曲, 便有配管的處理作業與對位作業較為困難的問題。 所以,本發明係解決上述問題者,其課題在於提供 在構成流體的流通路徑之際,藉由具有可撓性而使處 對位較容易,且可極簡單地執行製造時之流路構造作 流路結構體。此外,亦提供具有充分可撓性,可吸收 體(液體)溫度變化所產生的體積變動,確保流體密閉 流路結構體。 (解決問題之手段) 為解決上述問題點,本發明的特徵在於:至少具備 使流體流入或流出的接口部,並具有使該接口部間連 流路,該流路整體係利用由可撓性薄膜彼此間之黏著 所規範的非黏著區域,構成一體化。 312XP/發明說明書(補件)/94-02/93133436 利用 及將 現組 未具 接部 ,可 發量 且必 的問 金屬 因此 一種 理與 業的 因流 性的 2個 通的 區域 6 1278978 依照本發明的話,因為實質的僅由可撓性薄膜構成流 路,因而使製造變為容易,並可提高可撓性,且流路的密 閉性亦將提高。 再者,本發明的另一流路結構體,係將可撓性薄膜彼此 間或可撓性薄膜與其他構件其中一部份進行黏著而設置黏 著區域,並殘留著另外未黏著部份的非黏著區域,利用此 非黏著區域構成流路之至少其中一部份的流路結構體。 流路的至少其中一部份係由利用上述黏著區域所規範 的非黏著區域所構成。其中,流路結構體可將2片以上的 可撓性薄膜相互部份黏著而構成,亦可將1片可撓性薄膜 利用彎曲等而部份黏著,或者亦可將可撓性薄膜與其他構 件部份黏著而構成。 依照上述構造之本發明的話,藉由構成使接口間連通的 流路,且此流路之至少其中一部份係利用由可撓性逢膜彼 此間或可撓性薄膜與其他構件的黏著區域所規範的非黏著 區域所構成,便可極簡單的構成適當形狀與構造的流路。 特別係藉由利用可撓性薄膜彼此間之黏著區域所規範的非 黏著區域所構成,因為可確保充分的可撓性,因而可輕易 的執行處理與對位事宜。此外,藉由設置可撓性薄膜彼此 間的黏著區域,或設置可撓性薄膜與其他構件的黏著區 域,便可將該黏著區域的剛性提高某些程度,所以,藉由 預先構成適合系統的流路形狀,便可保持適當的流路形 狀,可容易的進行流路構成作業。另外,僅適當的設置可 撓性薄膜彼此間(或可撓性薄膜與其他構件間)的黏著區域 7 312XP/發明說明書(補件)/94-02/93133436 1278978 與非黏著區域,便可極容易且自由的形成流路形狀。 上述2個發明的更具體構造,可將2片可撓性薄膜部份 的相互黏著成一體化,並在一對黏著區域中利用包夾二側 所構成的非黏著區域而構成流路的構造,或者,亦可將 1 片可撓性薄膜彎曲之後,再施行部份黏著並保持摺疊狀 態,並利用一對黏著區域包夾二側而構成非黏著區域,或 者亦可將彎曲部份與黏著區域利用包夾二側構成的非黏著 區域而構成流路。此外,可撓性薄膜與部份黏著的其他構 件,可為合成樹脂或金屬等板材、塊狀材等任意構件,另 外,亦可為後述受熱部或散熱部等各結構部、框架、框體 等均無妨。 再者,上述發明中所謂「黏著」並不僅限於使用黏著劑 進行黏著的情況,係廣泛的涵蓋結果可使可撓性薄膜彼此 間呈密接固定的狀態。特別係最好將可撓性薄膜彼此間或 可撓性薄膜與其他構件進行直接黏附(熔接)。 本發明中,複數上述流路或具有分歧的上述流路,最好 利用上述可撓性薄膜構成一體化。藉由將複數流路利用可 撓性薄膜構成一體化,便可不需要將複數配管個別連接, 或將複數配管成束,不需要任何特別的作業,便可將複數 流路統籌一次配置。此外,藉由具分歧的流路利用可撓性 薄膜構成一體化,因為亦不需要複雜的配管連接作業或接 頭零件,因而可達降低製造成本與配管系統小巧化的效果。 本發明中,上述可撓性薄膜,最好為由金屬層與樹脂層 之積層體所構成的積層薄膜。藉由將上述可撓性薄膜,設 8 312XP/發明說明書(補件)/94-02/93133436 1278978 定為由金屬層與樹脂層之積層體所構成的積層薄膜,便可 提高流體密閉性與阻氣性(水蒸氣阻障性),且可確保充分 的可撓性。此積層薄膜的金屬層可舉例如由紹、祐合金、 銀、銀合金、銅、銅合金、金、金合金等所構成,此外, 亦可為箔,亦可為沈積層或塗佈層等被黏合層。藉由設置 此金屬層,便可輕易的確保阻氣性。另外,積層薄膜的樹 脂層有如聚烯烴系塑膠,例如由聚乙烯、聚丙烯等所構成 者。此種積層薄膜最好為將金屬層的表背雙面均利用雙層 樹脂層被覆的構造,而且,最好由可將樹脂層彼此間或樹 脂層與金屬層相互黏附(溶接)的材料所構成。此種具熱封 性樹脂可舉例如:上述聚烯烴系樹脂、部份的聚酯或尼龍 本發明中,最好具有連通於上述流路中途,並形成於其 旁邊之封閉的非黏著區域(退縮部)。依此的話,藉由設置 此經封閉的非黏著區域,因為可使部份流體退縮於此區域 中,因而便可吸收隨流體的膨漲或收縮而所產生的體積變 化,可防止流路結構體發生破裂或流體洩漏等情況。此外, 依照此經封閉的非黏著區域配置於流路上方的姿態,設置 流路結構體,因為當使液體流通於此流路内之時,便可將 液體中所含氣體或從液體中所釋放出的氣體,收容於此封 閉的非黏著區域内,並依從流路中的液體分離狀態留置, 因此,便可防止因此氣體而產生的不良情況(例如:降低熱 交換效率或氣體吸入於泵内導致無法噴出液體等)。 本發明中,最好在上述封閉的非黏著區域中,收容著利 9 312XP/發明說明書(補件)/94-02/93133436 1278978 用壓縮變形 的非黏著區 通的流體, 未滯留流體 被壓縮而減 入於此封閉 體外觀幾乎 本發明中 保持手段。 域所構成, 充分的確保 面的截面保 體的流路阻 的可撓性薄 構件。例如 膜與其他構 於非黏著區 於另一可撓 就可更確實 路内的内側 内,因而最 側支撐構件 好構成不致 具體而言, 而減少體積 域中收容著 幾乎不進入 的狀態,另 少體積,因 的非黏著區 無變化的情 ,最好設置 本發明的流 因而當流體 流路的流通 持手段,便 力。此截面 膜彼此間或 ’在流路内 件間r相互 域其中一可 性薄膜或構 的保持流路 支撐構件。 好構成不致 最好為中空 妨礙流路結 截面保持手 的變形材。 變形材,便 此封閉的非 外,當流體 而可構成僅 域内之構造 況下,吸收 保持著上述 路係因為由 壓力較小的 截面。因而 可充分的確 保持手段可 可撓性薄膜 依將可撓性 隔開作用的 撓性薄膜外 件作用的外 截面之觀點 此内側支撐 妨礙流體流 構件。此外 構體中的流 段若本身亦 依此的話, 可構成經常 黏者區域中 體積增大時 此體積減少 。所以,可 流體的體積 流路之流通 可撓性薄膜 情況時,可 ,藉由設置 保流通截面 使用確保非 與其他構件 薄膜彼此間 内側支撐構 面,並依將 側支撐構件 而言,最好 構件係因為 通的狀態。 ,此種截面 路方向可撓 在流通方向 藉由在封閉 使流路中流 ,且可構成 ,變形材便 份的流體進 在流路結構 變化。 截面的截面 的非黏著區 判斷將無法 保持流路截 ,而降低流 黏著區域中 間之間隔的 或可撓性薄 件,或固接 該外面隔開 等。特別係 為配置於流 配置於流路 例如,此内 保持手段最 性之狀態。 具有能彎曲 10 312XP/發明說明書(補件)/94-02/93133436 1278978 之可撓性的話便可。例如,若上述内側支撐構件若屬於中 空構件的話,便可由可撓性材料構成中空構件,亦可將中 空構件形成螺旋形狀構造。 利用上述流路結構體便可構成熱交換系統或溫度控制 系統。例如,熱交換(溫度控制)系統係具有:具吸熱機能的 受熱部、具散熱機能的散熱部、通過上述受熱部與上述散 熱部的循環路徑、以及至少使在該循環路徑中流通的流體 推進的流體推進手段,且上述循環路徑至少其中一部份係 由上述任一者所述流路結構體所構成。其中,上述流路結 構體係可依例如構成上述受熱部與散熱部間、散熱部與流 體推進手段間、受熱部與流體推進手段間之流路方式進行 連接。此情況下,在各結構部之間所設置的去路與返路等 2個流路,最好由一體化流路結構體所構成。此外,上述 系統内所設置各結構部間的連接流路部份,最好全部由一 體化流路結構體所構成。 【實施方式】 以下,針對本發明實施形態,利用圖示例一併進行説 明。另外,下述所説明的各實施形態雖針對含有受熱部、 散熱部及流體推進手段的熱交換系統中,所使用的流路結 構體進行説明,惟本發明的流路結構體並不僅限於此種用 途,亦可構成各種系統之其中一部份所設置的流路,可廣 泛的使用。 圖1所示係組裝本發明之流路結構體而構成的熱交換系 統1 0 0概要之概略構造斜視圖。此熱交換系統1 0 0係具備 11 312XP/發明說明書(補件)/94-02/93133436 1278978 有:受熱部(冷卻夾套)1 1 Ο、散熱部(散熱器)1 2 Ο、對散熱部 1 2 0吹送氣流並強制冷卻的冷卻風扇1 3 0、使流體(本實施 形態中係為液體)進行循環的流體推進手段(泵)1 4 0、以及 構成受熱部Π 0與散熱部1 2 0間之流路的流路結構體1 5 0。 受熱部1 1 0在内部構成未圖示的流路,係利用抵接於C P U 晶片等發熱部(未圖示),而構成從該發熱部奪取熱的構 造。在受熱部1 1 0中設置導入口與導出口,該等係連接於 上述流路結構體1 5 0的接口部1 5 5、1 5 6。 散熱部1 2 0係具有形成於内部且連繫於未圖示流路的導 入口與導出口 ,該等並連接於上述流路結構體1 5 0的接口 部1 5 1、1 5 8。此外,在其外面上設有多數個散熱風扇1 2 1, 構成透過該等散熱風扇1 2 1將熱散熱於外部的構造。此散 熱部1 2 0係構成接收利用具有週知構造之冷卻風扇1 3 0所 進行送風的構造。將經此冷卻風扇1 3 0所產生的氣流吹送 給散熱風扇1 2 1,俾強制性的將散熱部1 2 0冷卻。 流體推進手段1 4 0係利用電動馬達等驅動力來源而對流 體賦予推進力。圖示例係在散熱部1 2 0端部連接流體推進 手段1 4 0,並產生將從散熱部1 2 0導入口所導入的流體, 朝散熱部1 2 0導出口擠出的作用。當然,流體推進手段1 4 0 的位置僅要在後述的循環路徑内的話便可,可配置於任何 位置,並不僅限於圖示例。 本實施形態係構成在受熱部1 1 0與散熱部1 2 0間往返的 循環路徑。此循環路徑在圖示例中係利用一體的流路結構 體1 5 0所構成。換句話說,利用流路結構體1 5 0將受熱部 12 312ΧΡ/發明說明書(補件)/94-02/93133436 1278978 1 1 0與散熱部1 2 0之間的去路與返路構 體1 5 0係具有連接於受熱部1 1 0導入口與 1 5 5、1 5 6,以及連接於散熱部1 2 0導入口 部1 5 1、1 5 8。接口部1 5 1與1 5 5係利用流取 用槽)1 5 3及流路1 5 4而連通。此外,接口 利用流路1 5 7而連通。 藉由上述構造,熱交換系統1 0 0便藉由 内的流體,利用流體推進手段1 4 0賦予推 流體便從受熱部1 1 0導出口經由流路1 5 7 1 2 0導入口 ,再利用散熱部1 2 0進行散熱 1 2 0導出口經由流路1 5 2、滯留部1 5 3及:¾ 返受熱部1 1 0中,在此便形成從外部奪取 滯留部 1 5 3係具備有:提供吸收隨流體 產生流體體積變化的退縮空間之機能;當 流體時便供應流體的備用槽機能;以及 時,便收容液體中所含氣體或從液體所產 容機能等。 流路結構體1 5 0係圖2所示可撓性薄® 此間黏著,整體亦可構成具可撓性的片狀 膜1 5 Ο X、1 5 Ο Y係如圖2所示,屬於將樹脂 與金屬層150B積層的積層體,即為積層薄 保持可撓性,且可兼顧流路中的阻氣性(^ 與變形強度及耐蝕性。 樹脂層 1 5 0 A、1 5 0 C係由各種合成樹脂 312XP/發明說明書(補件)/94-02/93133436 ,一體。流路結構 導出口的接口部 與導出口的接口 & 1 5 2、滯留部(備 部1 5 6與1 5 8係 對上述循環路徑 進力,冷卻劑等 被導入於散熱部 ,然後從散熱部 it路1 5 4,再度重 熱量的狀態。 溫度上下變化所 因揮發等而減少 當流體採用液體 生氣體的氣體收 秦 1 5 Ο X、1 5 Ο Υ 彼 構件。可撓性薄 層 150 A、1 50C、 [膜。藉此,便可 K蒸氣阻障性)、 薄膜所構成。特 13 1278978 別以如聚烯烴系的聚乙烯、聚丙烯等具熱封性者為佳。此 外,亦可使用具熱封性的聚酯、尼龍等材料。其中,樹脂 層1 5 Ο A與1 5 0 C亦可由相同材料所構成,亦可由不同材料 所構成。 再者,金屬層150B最好為由銘、IS合金、銅、銅合金、 銀、銀合金、金、金合金等金屬所構成的箔或薄膜(沈積膜、 濺鍍膜、塗佈膜等)所構成。 本實施形態的可撓性薄膜1 5 Ο X、1 5 Ο Y係將金屬層1 5 Ο B 的表背雙面利用樹脂層1 5 Ο A與1 5 0 C施行被覆,藉此,便 頗適於彌補金屬層1 5 Ο B的變形強度與耐蝕性等。此外,若 依用途並無出現使用上問題的話,亦可僅由單層金屬層與 單層樹脂層所積層者。 本實施形態的流路結構體 1 5 0係設有:將可撓性薄膜 1 5 Ο X與1 5 Ο Y直接或利用黏著劑等而黏著的黏著區域;以 及相互未黏著的非黏著區域。特別以將可撓性薄膜 1 5 Ο X 與1 5 Ο Y構成能相互熱封,俾直接黏附(熔接)為佳。此情況 下,例如圖3所示,將可撓性薄膜1 5 Ο X與1 5 Ο Y,在模具A 與B之間施行熱封。此時,被模具A與B所夾壓與被加熱 的部份便形成黏著區域 1 5 Ο T,而藉由設置模具A的溝 A a 與模具B的溝B a,而未被夾壓或加熱的部份便將形成非黏 著區域 1 5 0 S。依此的話,便可在可撓性薄膜 1 5 Ο X、1 5 Ο Y 之間設置任意的流路構造1 5 Ο z。例如圖示例,可利用一體 的可撓性薄膜 1 5 Ο X、1 5 Ο Y,同時構成由非黏著區域 1 5 0 S 所構成複數個流路構造 1 5 Ο z,此外,亦可如圖中虛線所 14 312XP/發明說明書(補件)/94-02/9313343 6 1278978 示,構成從流路構造 1 5 Ο z 中途分歧的分歧流路構造 1 5 0 v (模具A的溝A b與模具B的溝B b所對應部份)。 圖示流路構造1 5 Ο z係由二側利用黏著區域1 5 Ο T所規範 的非黏著區域1 5 0 S所構成。但是,流路構造亦可將1片可 撓性薄膜彎曲,其中一邊由彎曲部份限制,另一邊則利用 與上述相同的黏著區域限制的非黏著區域所構成。 再者,藉由將上述可撓性薄膜與其他構件(例如,板狀 材或塊狀材)的其中一部份施行黏著而形成黏著區域,且未 對其他部份施行黏著而形成非黏著區域,藉此便可容易的 構成如同上述的流路。此情況下,亦是利用一體的可撓性 薄膜與其他構件,同時構成複數流路,或者亦可將具有分 歧等複雜流路構造形成一體。但是,此情況下,若其他構 件幾乎未具有可撓性的話,則流路結構體亦將形成幾乎未 具有可撓性狀態。 再度參照圖1進行説明。流路結構體1 5 0中所設置的接 口部 15 1、15 8、155、1 5 6 係構成流路 152、154、1 5 7 端部 的流入口或流出口 。圖示例中,各接口部係具有在上述可 撓性薄膜1 5 Ο X、1 5 Ο Y之間,挾持著由合成樹脂等所構成的 接口構件之構造。此接口構件係黏著固定(黏附固定)於可 撓性薄膜1 5 Ο X、1 5 Ο Y上。接口構件與可撓性薄膜1 5 Ο X、 1 5 Ο Y之間呈完全密封的狀態。在該等接口構件中設置連通 於上述流路的接口孔。所以,便藉由將此接口構件連接於 受熱部110、散熱部120的導入口或導出口 ,以構成上述 循環路徑。 15 312XP/發明說明書(補件)/94-02/93133436 1278978 另外,上述流路結構體1 5 0中所構成的流路1 5 2、1 5 4、 1 5 7,均構成朝其延長方向呈大致一定的流路截面狀態。藉 此,便可降低流體的滯留或亂流產生等情況。但是,流路 的構造並不僅限於此種可構成一定流路截面的構造,亦可 具有部份流路截面放大之構造等適當的流路構造。 上述流路結構體1 5 0係整體均形成具有可撓性,特別係 藉由可撓性薄膜彼此間黏著在一起的黏著區域1 5 Ο Τ,因為 可獲得某種程度的剛性,因而便呈現可自行保持著圖示形 狀的狀態。此情況下,若增加黏著區域1 5 Ο Τ面積的話,流 路結構體1 5 0的剛性將提高,反之,若黏著區域1 5 Ο Τ面積 減少的話,流路結構體1 5 0的剛性將降低。所以,便可利 用黏著區域1 5 Ο Τ面積,調整流路結構體1 5 0的剛性與可撓 性。具體而言,本實施形態係藉由適當的構成其外緣形狀, 或設置開口 1 5 9、缺口(狹縫)1 5 9 ’,而調整剛性與可撓性。 特別係配合需要,可提高流路結構體1 5 0特定部位的可撓 性。例如,圖示例係藉由在流路1 5 4與1 5 7之間設置開口 1 5 9或缺口部1 5 9 ’,便構成可提高二流路1 5 4、1 5 7間之區 域的可撓性,可輕易變更二流路相對位置關係的狀態。反 之,特定部位的剛性亦將提高。例如圖示例中,將滯留部 1 5 3構成U狀等,並在滯留部1 5 3内側形成黏著區域,藉 此便將提高滯留部1 5 3附近的剛性,而某程度的保持著其 形狀。 另外,在流路1 5 2附近角落所設置的開口 1 5 9,及在滯 留部1 5 3上方所設置的開口 1 5 9,係形成利用未圖示繫止 16 312ΧΡ/發明說明書(補件)/94·02/93133436 1278978 具等而支撐著流路結構體1 5 0的繫合孔構造。流路結構體 1 5 0亦可利用黏著、黏附、熔接等各種手段,而固定於框 架、支撐板、或上述受熱部 1 1 0、散熱部 1 2 0、冷卻風扇 1 3 0、流體推進手段1 4 0等其他構件上。此情況下,流路結 構體1 5 0的固定部位最好為上述黏著區域1 5 Ο Τ,俾可提高 支撐固定力。 上述流路結構體1 5 0係在如圖1所示系統内,對其他結 構部進行連接,然後,經從流體導入口 1 5 3 a導入既定量流 體,便完成熱交換系統1 0 0。此時,若流體屬於液體的話, 便從流體導入口 1 5 3 a流入於滯留部1 5 3中,然後再流入於 各流路1 5 2、1 5 4、1 5 7中,最後再填充於受熱部1 1 0、散 熱部1 2 0内部。流體導入口 1 5 3 a係因為構成於循環路徑的 最上游位置,因此藉由在適當位置設置空氣去除部,便可 將流體填充於整體循環路徑中。若液體完全填充於循環路 徑中的話,在將滯留部1 5 3内的空氣完全趕出之後,流體 導入口 1 5 3 a便利用黏著(黏附)等而封閉。 此情況下,流路結構體1 5 0中所填充的液體最好較流路 結構體1 5 0的最大容積少某程度量為佳。例如,最大容器 的9 0 %以下。藉此,即便因液體溫度上昇等而使液體膨漲, 仍可防止流路結構體發生破裂、液體洩漏等情況。特別係 上述滯留部1 5 3具備有當液體膨漲時,可使液體退縮俾防 止内壓上昇的機能。 再者,上述滯留部1 5 3亦具有當液體隨時間經過而減少 時,便將其液體補充給流路内的備用槽機能。液體的減少 17 312XP/發明說明書(補件)/94-02/93133436 1278978 係如本實施形態,藉由採用積層薄膜之具高密閉性與阻氣 性(水蒸氣阻障性)的可撓性薄膜1 5 Ο X、1 5 Ο Y,便可降低至 幾乎可忽視的程度,但是因為在流路結構體1 5 0與其他各 結構部的接頭部份、或在其他各結構部内部,亦無法避免 發生液體減少(例如僅為些許)現象,因而藉由設置滯留部 1 5 3便可延長製品壽命。 再者,上述滯留部1 5 3亦具有將混入液體中的空氣等氣 體、或從液體中所釋放出的各種氣體等氣體進行回收,並 留置的機能。此種機能在當流體使用液體的情況時便屬於 必要的。此種氣體回收機能並不僅將如上述的滯留部 153 設置於流路中途的方法,即便採取將如下述構成滯留部 1 5 3的退縮部,形成於流路旁邊的方法亦能達成。 圖 4與圖 5所示係可在上述流體結構體 1 5 0流路構造 1 5 Ο z其中一部份中,設置的滯留部1 5 3之具體例的退縮部 1 5 0 w構造例之放大概略斜視圖與放大剖面圖。此退縮部 1 5 0 w係設置於流路構造1 5 Ο z旁邊,並連通流路構造1 5 Ο z, 其他部份則由封閉的非黏著區域所構成。對此退縮部1 5 0 w 之流路構造1 5 Ο z的開口部1 5 0 u,最好開口截面較小於流 路的流通截面與退縮部1 5 0 w截面。此退縮部1 5 0 w係為若 因流體膨漲等而提高流路構造1 5 Ο z内之壓力的話,便透過 開口部1 5 0 u而流入部份流體,俾防止流路結構體1 5 0發生 破裂或流體洩漏情況而設置的。 再者,如圖5所示,當相對於流路構造1 5 Ο z,依將退縮 部1 5 0 w配置於上方的姿態設置著流路結構體1 5 0的情況 18 312XP/發明說明書(補件)/94-02/9313343 6 1278978 下,於流體使用液體時,便可構成將此液體中所含氣 從液體中所釋放出的氣體吸入於退縮部1 5 0 w中,使此 不再重返流路内的構造。藉此,便可防止因氣體進入 留於輸送液體的泵内,導致泵無法噴出液體的情況發 另外,此情況下,藉由縮小開口部1 5 0 u便將構成氣體 返回流路内的構造,但是為能更確實的防止氣體重返 内,因而亦可在上述滯留部1 5 0 w的開口部1 5 0 u中組 逆閥。 圖6與圖7所示係不同於上述滯留部1 5 3的具體例 備有退縮部 1 5 Ο p的流路構造之構造例之概略斜視圖 大剖面圖。此退縮部 1 5 Ο p係如同上述退縮部 1 5 0 w, 於流路構造1 5 Ο z旁邊,並對流路構造1 5 Ο z形成連通并 其他部份則利用封閉的非黏著區域所構成。但是,此 部1 5 Ο p對流路的開口部係構成較大。具體而言,當退 1 5 Ο p對流路構造1 5 Ο z投影時,其投影面整體大致形 口部的狀態。所以,在此退縮部1 5 Ο p内部,便收容著 壓縮變形而減小體積的變形材1 5 0 q。此變形材 1 5 0 Q 如封入氣體所構成的可撓性袋體、或如海綿般之可撓 孔質材等所構成。另外,上述變形材可由產生磁性的 構成,亦可構成吸熱體或散熱體,亦可合併具有不純 附體、脫臭材、著色材等的機能。 此構造係當流體體積或壓力尚未夠大之時,便如圖 實線所示,變形材1 5 0 q體積較大,因為利用此變形材 將退縮部1 5 Ο p大致塞滿,因而在流路構造1 5 Ο z中流 312XP/發明說明書(補件)/94-02/93133436 體或 氣體 並滯 生。 不易 流路 裝止 ,具 與放 設置 k態, 退縮 縮部 成開 利用 可由 性多 磁鐵 物吸 7中 1 50q 通的 19 1278978 流體便毫無滯留的在流路内進行流通。但是,當流體膨漲 或流體壓力提兩的情況時’隨流體的壓力’如圖不虛線所 示,變形材 1 5 0 q將被壓縮,藉此部份流體將滲入退縮部 1 5 Ο p内部。藉此,因為流體的壓力上昇將呈緩和,因而將 減少流路結構體發生破裂或流體洩漏等情況。 圖8所示係在流路結構體1 5 0中所構成的流路構造1 5 Ο z 内部,配置著截面保持手段的内側支撐構件1 5 0 i之構造例 之分解斜視圖。内側支撐構件1 5 0 i係由在流路構造1 5 Ο z 内部中,具有沿流路方向延伸之中空狀可撓性材料所構 成。圖示例中,内側支撐構件1 5 0 i係構成朝流路方向延伸 的螺旋狀,更具體而言,具備有將具有板面的帶狀材捲繞 成螺旋狀的構造,而該板面係在可撓性薄膜1 5 Ο X與1 5 Ο Y 的非黏著區域中支撐著某部份。 藉由將上述内側支撐構件1 5 0 i配置於流路構造1 5 Ο z内 部,便從内側保持著流路構造1 5 Ο z的流通截面。因為此内 側支撐構件1 5 0 i構成為中空狀(筒形狀),因此將不致妨礙 於流路内的流體流動,且因為内側支撐構件1 5 0 i具備可朝 流路方向彎曲的可撓性,因而亦不致損及流路結構體 1 5 0 的可撓性。 另外,内側支撐構件亦可為在流路構造 1 5 Ο z内立設的 柱狀物。此外,截面保持手段並不僅限於上述内側支撐構 件,亦可配置於流路構造1 5 Ο z外側,並依使非黏著區域中 的可撓性薄膜 1 5 Ο X、1 5 Ο Y之一邊離開另一邊的狀態保持 著,換句話說,亦可為外側支撐構件。此外側支撐構件係 20 312XP/發明說明書(補件)/94-02/93133436 1278978 例如固接於可撓性薄膜1 5 Ο X外面,將可撓性薄膜1 5 Ο X外 面,依離開其所相對向可撓性薄膜 1 5 Ο Υ部份的狀態保持 著,例如可利用圓弧狀支撐具構成。 圖9所示係可採用為上述流路結構體1 5 0構造之構造例 的概略斜視圖。圖1所示流路結構體1 5 0係構成將受熱部 1 1 〇與散熱部1 2 0連結的流路,但是,圖9所示構造則係 在流路構造1 5 Ο ζ内的既定區域1 5 Ο Ν外面上,直接配置著 溫度受控體Μ。此溫度受控體Μ係指如圖1所示呈熱接觸 著受熱部11 0狀態的CPU晶片等發熱部。此構造可利用流 路結構體達成如同圖1所示受熱部1 1 0相同的機能。特別 係因為呈在流路結構體的流路構造1 5 Ο z既定區域1 5 Ο N外 面,直接熱接觸著溫度受控體Μ的狀態,因而將可獲得更 良好的熱交換效率。 在此,圖示例的既定區域1 5 Ο Ν係配合溫度受控體Μ形 狀,依可對溫度受控體Μ進行更寬廣面積熱接觸狀態,形 成寬廣構造。藉此,便可更有效率的提高熱交換效率。此 外,既定區域1 5 Ο Ν與溫度受控體Μ係可利用適當的保持手 段保持著相互熱接觸狀態,亦可利用黏著材所施行的黏著 或黏附(熔接)等方式,進行相互固接。 圖1 0所示係可採用為上述流路結構體 1 5 0構造的另一 構造例之概略斜視圖。此構造例係具有在可撓性薄膜1 5 Ο X 與1 5 Ο Υ之間,配置著由磁鐵或磁性體所構成埋設體1 5 0 L, 並利用黏著區域將其包圍的構造。此埋設體1 5 0 L係配置於 流路構造1 5 Ο ζ旁邊。此例子係溫度受控體Κ至少部份係由 21 312ΧΡ/發明說明書(補件)/94-02/93133436 1278978 強磁性體或磁鐵所構造,藉此,溫度受控體κ便將呈吸附 保持於上述埋設體1 5 0 L的狀態。所以,藉由溫度受控體Κ 吸附保持於埋設體 1 5 0 L,即便未再設置其他任何保持手 段,仍可簡單的將溫度受控體Κ保持著熱接觸於流路構造 1 5 Ο ζ的狀態。此外,此構造亦可使溫度受控體Κ簡單的離 開流路結構體。 如上述各例所示,本發明的流路結構體係利用在可撓性 薄膜1 5 Ο X與1 5 Ο Υ之間挾持著其他構件,便可構成合併具 有各種機能的構造。例如,藉由在可撓性薄膜間包夾著補 強片,便可提高此夾入部份的剛性,藉由設定各種補強片 形狀,亦可規範流路結構體的形狀。另外,上述雖略有述 及,藉由與上述相反,在流路結構體其中一部份設置開口 或狹縫,而提高此部份的可撓性,藉此便可構成局部容易 彎曲或折疊的狀態。 圖1 1所示係流路結構體另一例的流路結構體2 5 0構造 之平面圖。在此流路結構體 2 5 0中,第1接口部 2 51 a、 251b、251c、第 2 接口部 252a、252b、252c 及第 3 接口部 2 5 3 a、2 5 3 b、2 5 3 c,係分別設置於不同的周緣處。在此例 中,分別設置複數個第1接口部、第2接口部及第3接口 部。然後,在各接口部間,設置流路2 5 4 a、2 5 4 b、2 5 4 c、 2 5 5 a、2 5 5 b、2 5 6 a、2 5 6 b,藉由該等流路便構成分別將複 數個接口部間連通的狀態。 在此流路結構體2 5 0中,上述流路係依上述複數接口部 中任一者均與其他所有接口部形成連通狀態,相互連黏 22 312XP/發明說明書(補件)/94-02/93133436 1278978 著。所以,藉由對上述流路之間,適當的按壓或黏著(黏附) 而封閉,便可簡單的達成配合所需的流路構造。例如,對 圖示一點虛線所包圍的區域G 1〜G 5,施行按壓或黏著(黏附) 的話,便可構成將第1接口部2 5 1 a與第3接口部2 5 3 a連 通,將第1接口部2 5 1 b與第2接口部2 5 2 a及第3接口部 2 5 3 b相連通(如具有分歧部)的構造。其中,上述區域G 1〜G 5 的按壓,可採用適當的夾壓具實施。此情況下,可使流路 結構體2 5 0回復於原本的狀態。此外,雖無法回復為原本 狀態,但是亦可對上述區域G 1〜G 5施行熱黏附。 再者,本發明的流路結構體並不僅限於上述圖示例,在 不脫逸本發明主旨的範疇内,當然可進行附加各種變更。 例如,上述實施形態的熱交換系統 1 0 0,雖構成利用受熱 部 1 1 0,將未圖示之溫度受控體進行冷卻的冷卻系統,但 是,亦可相反的,構成利用散熱部1 2 0對溫度受控體施行 加熱的加熱系統。 再者,在上述熱交換系統中,亦可設置複數個受熱部(吸 熱器),並將該等複數個受熱部利用上述流路結構體進行連 結,此時,亦可將複數個連結部份由一體的流路結構體構 成。此外,例如硬碟外裝部,冷卻對象並未具有局部的高 溫部,當廣範圍使用的情況時,亦可不是上述受熱部,而 是將圖9與圖1 0所示流路結構體本身構成受熱部。依此的 話,便不需要與受熱部間的連接部份之設計。此情況下, 構成可撓性薄膜其中一部份的金屬層,便具有導熱層的機 能0 23 312XP/發明說明書(補件)/94-02/93133436 1278978 本實施形態中,藉由將流路結構體形成如上述構造,在 製造步驟中,便可達削減零件數量、縮短步驟、縮短交貨 期等效果。此外,因為柔軟性·可撓性均優越,因此可輕 易的收容於各種空間中,特別係因為屬於薄型,因而即便 為扁平通路等亦可配置。所以,亦可通入於如筆記型電腦 等的樞軸部内。另外,例如將流路截面積朝流路方向適當 的改變,或將多數流路構成一體化,或將流路構成三叉路 或十字路狀等適當的分歧構造等,可自由的構成流路構 造,亦可貼附各種結構構件、或搭載各種結構零件、或沿 凹凸面設置等,達可配合各種狀況極柔和對應的明顯效果。 【圖式簡單說明】 圖1為實施形態的熱交換系統之概略斜視圖。 圖2為實施形態的可撓性薄膜積層構造之概略分解斜視 圖。 圖 3 為製造實施形態之流路結構體之方法的概略斜視 圖。 圖4為流路結構體其中一部份之構造例的概略斜視圖。 圖5為圖4所示構造例的放大部份剖面圖。 圖6為流路結構體其中一部份的另一構造例的概略斜視 圖。 圖7為圖6所示構造例的放大部份剖面圖。 圖8為流路結構體其中一部份的另一構造例之概略分解 斜視圖。 圖9為流路結構體其中一部份的再另一構造例之概略斜 24 312XP/發明說明書(補件)/94-02/93133436 1278978 視圖。 圖 1 〇為流路結構體其中一部份,再另外不同構造例的 概略斜視圖。 圖1 1為不同的流路結構體之實施形態之平面圖。 【主要元件符號說明】 1 00 熱交換系統 110 受熱部 120 散熱部 12 1 散熱風扇 13 0 冷卻風扇 140 流體推進手段 150' 2 5 0 流路結構體 1 5 0 A、1 5 0 C樹脂層 1 50B 金屬層 1 5 0 i 内側支撐構件(截面保持手段) 1 5 0 L 埋設體 1 5 0N 既定區域 1 5 0 p、1 5 0 w退縮部(封閉的非黏著區域) 1 50q 變形材 1 5 0 S 非黏著區域 1 5 0 T 黏著區域 1 5 0 u 開口部 1 5 0 v 分岐流路構造 1 5 0 X、1 5 0 Y可撓性薄膜 312XP/發明說明書(補件)/94-02/93133436 251278978 IX. Description of the invention:  TECHNICAL FIELD OF THE INVENTION The present invention relates to a flow path structure, Especially for the heat-generating part of an electronic device such as a personal computer, When using a fluid for cooling, The construction of the flow path structure to which it applies.  [Prior Art] In recent years, Because the performance of personal computers is significantly improved, C P U (C e n t r a 1 ProcessingUnit) processing speed is also rapidly improving, Therefore, the amount of heat generated from the CPU chip and the like will also increase. Its cooling method has constituted a problem. a conventional cooling method, It is equipped with a heat sink such as a fan. Fixing a heat generating part such as a CPU chip, And by using a fan or the like to convey airflow to the heat sink,  It is mandatory to perform air cooling. but, This air cooling method, If you want to improve your cooling capacity, There will be problems with the noise of the air cooling fan becoming larger. In addition, Because the cooling ventilation space cannot be sufficiently ensured in a compact computer case, Therefore, there will be problems in that sufficient cooling efficiency cannot be obtained.  and so, There are discussions about the settings: Contacting a heat generating portion such as a C P U wafer to the cooling jacket, And supplying liquid to the cooling jacket and circulating, And propelling the liquid pump in the circulation path of the liquid; Further, a liquid cooling method having a heat dissipating portion having a heat sink structure (see, for example, Patent Document 1 below).  (Patent Document 1) Japanese Patent Laid-Open Publication No. 2 0 0 2 _ 9 9 3 5 6 SUMMARY OF INVENTION [Problems to be Solved by the Invention] However, In the conventional liquid cooling method of the cooling system, Because it will be as cool as the 5 312XP / invention manual (supplement) /94-02/93133436 1278978 Heat sink, Pump, Reserve tank, etc.  Metal or synthetic resin pipes are connected, Therefore, it is necessary to have a plurality of joints connected thereto, and the like. and so, Will increase with the number of parts, The connection work at the time of loading is complicated. And the problem of manufacturing is quite laborious.  Furthermore, Synthetic resin made of flexible tube itself, Because they are generally gas barrier, Therefore, it will not be possible to completely prevent the tube or its joint with the parts from having a coolant volatilized outside. Thus the predicted cooling dose will decrease over time. and so, Exploring the swelling and shrinkage of the coolant and the coolant, And set up a sub-chamber such as a spare slot,  Must fully ensure its capacity, Therefore, it is quite difficult to miniaturize the system. In addition, In order to prevent the above-mentioned coolant from volatilizing, Also consider adopting piping, but, In this case, Because it is quite difficult to bend the tube properly,  There is a problem that the piping processing work and the alignment work are difficult.  and so, The present invention is to solve the above problems, The problem is to provide a flow path that constitutes a fluid, It is easier to position by virtue of flexibility. Further, the flow path structure at the time of manufacture can be extremely simply performed as the flow path structure. In addition, Also available with full flexibility, The volume change caused by the change in temperature of the absorbable body (liquid), Make sure the fluid is closed to the flow path structure.  (means to solve the problem) In order to solve the above problems, The invention is characterized by: At least an interface portion for allowing fluid to flow in or out, And having a flow path between the interface parts, The flow path as a whole utilizes a non-adhesive area defined by the adhesion of the flexible films to each other. Form an integration.  312XP/Invention Manual (supplement)/94-02/93133436 Utilization and current group not connected, The amount of metal that can be voluntarily and must be asked. Therefore, a two-pass area of the flow of industry and industry 6 1278978, according to the present invention, Because the material consists essentially of a flexible film, Thus making manufacturing easy, And can increase flexibility, And the tightness of the flow path will also increase.  Furthermore, Another flow path structure of the present invention, Adhesive areas are provided by adhering the flexible films to each other or to a portion of the other members. And there is a non-adhesive area with another unbonded part. The non-adhesive region is used to form at least a part of the flow path structure of the flow path.  At least a portion of the flow path is formed by a non-adhesive area as specified by the above-described adhesive region. among them, The flow path structure can be formed by adhering two or more flexible films to each other. One piece of the flexible film may be partially adhered by bending or the like. Alternatively, the flexible film may be adhered to other members.  According to the invention constructed as described above, By constructing a flow path that connects the interfaces, And at least a portion of the flow path is formed by a non-adhesive region defined by the flexible film or the adhesive region of the flexible film and other members. It is extremely simple to construct a flow path of appropriate shape and configuration.  In particular, it is constituted by a non-adhesive region which is defined by an adhesive region between the flexible films. Because it ensures sufficient flexibility, Therefore, processing and alignment can be easily performed. In addition, By providing an adhesive region between the flexible films, Or setting the adhesion area of the flexible film to other components, The rigidity of the adhesive area can be increased to some extent, and so, By pre-constituting the shape of the flow path suitable for the system, Keep the proper flow path shape, The flow path can be easily constructed. In addition, Only properly set the adhesion area of the flexible film to each other (or between the flexible film and other members) 7 312XP / invention manual (supplement) /94-02/93133436 1278978 and non-adhesive areas, The flow path shape can be formed extremely easily and freely.  More specific configurations of the above two inventions, The two flexible film portions can be bonded to each other to be integrated. And in a pair of adhesive regions, the non-adhesive region formed by the two sides of the sandwich is used to form a flow path structure. or, After bending a flexible film, Apply some adhesion and keep it folded. And using a pair of adhesive areas to sandwich the two sides to form a non-adhesive area, Alternatively, the curved portion and the adhesive region may be formed by a non-adhesive region composed of two sides of the sandwich. In addition, Flexible film and other components that are partially adhered, Can be made of synthetic resin or metal, Any member such as a block, In addition, It may be a structure such as a heat receiving portion or a heat radiating portion, which will be described later. frame, Frames, etc. are fine.  Furthermore, The term "adhesion" in the above invention is not limited to the case where the adhesive is adhered. A wide range of coverage results allow the flexible films to be in close contact with one another. In particular, it is preferable to directly adhere (fuse) the flexible films to each other or to the flexible film and other members.  In the present invention, a plurality of the above flow paths or the above-mentioned flow paths having divergence, It is preferable to form the integrated by the above flexible film. By integrating the plurality of flow paths with a flexible film, It is not necessary to connect the multiple pipes individually.  Or bundle the plural tubes, No special work is required, The complex flow paths can be coordinated once. In addition, Integrating with a flexible film by diverging flow paths, Because complex piping connections or joint parts are not required, Therefore, it is possible to reduce the manufacturing cost and the effect of miniaturization of the piping system.  In the present invention, The above flexible film, Preferably, it is a laminated film composed of a laminate of a metal layer and a resin layer. By using the above flexible film, Set 8 312XP / invention manual (supplement) /94-02/93133436 1278978 is a laminated film composed of a laminate of a metal layer and a resin layer, It can improve fluid tightness and gas barrier (water vapor barrier). It also ensures sufficient flexibility. The metal layer of the laminated film can be, for example, Alloy,  silver, Silver alloy, copper, Copper alloy, gold, Made of gold alloy, etc. In addition,  Can also be foil, It may also be an adhesive layer such as a deposited layer or a coated layer. By setting this metal layer, It is easy to ensure gas barrier properties. In addition, The resin layer of the laminated film is like a polyolefin plastic. For example, from polyethylene, It is composed of polypropylene and the like. Preferably, the laminated film is a structure in which both the front and back sides of the metal layer are covered with a double resin layer. and, It is preferable to be composed of a material which can adhere (solder) the resin layers to each other or the resin layer and the metal layer. Such a heat-sealable resin can be exemplified by, for example: The above polyolefin resin, Part of polyester or nylon. In the present invention, Preferably, it has a connection to the middle of the flow path, And formed in a closed non-adhesive area (retraction) next to it. In this case, By setting this closed non-adhesive area, Because some of the fluid can be retracted in this area, Thus, it is possible to absorb the volume change caused by the expansion or contraction of the fluid. It can prevent the flow path structure from cracking or fluid leakage. In addition,  According to the closed non-adhesive area, the posture is arranged above the flow path, Set the flow path structure, Because when the liquid is circulated in the flow path, The gas contained in the liquid or the gas released from the liquid can be Contained in this closed non-adhesive area, And depending on the liquid separation state in the flow path,  therefore, It can prevent the bad situation caused by the gas (for example: Reducing heat exchange efficiency or inhalation of gas into the pump results in failure to eject liquid, etc.).  In the present invention, Preferably in the closed non-adhesive area, Containing the benefits of the 9 312XP / invention manual (supplement) /94-02/93133436 1278978 using a non-adhesive zone of compression deformation,  The unretained fluid is compressed and reduced to the appearance of the enclosure.  Made up of domains,  A flexible thin member that adequately ensures the flow path resistance of the cross-section of the surface. For example, the membrane and other non-adhesive areas are in the inner side of the road that is more flexible. Therefore, the most side support members are not well formed, specifically  And the volume reduction domain contains a state of almost no entry, Another volume, Because of the non-adhesive zone, there is no change, It is preferable to set the flow of the present invention so that when the fluid flow path is held, It is easy. The cross-sectional membranes maintain a flow path support member with each other or between the flow path internals r.  The good composition does not mean that it is hollow. It hinders the flow path junction and maintains the deformed material of the hand.  Deformed material, This is closed, When the fluid can be constructed in only the domain, Absorption Maintains the above-mentioned path because of the smaller pressure section. Therefore, it is possible to sufficiently maintain the means of the flexible film in view of the outer cross section of the flexible film outer member which functions to separate the flexible film. This inner side supports the fluid flow member. In addition, if the flow segment in the structure itself is also dependent on this,  This volume can be reduced when the volume is increased in the area of the often sticky area. and so, Fluid volume flow path flexible film case, Yes, By providing a flow-retaining cross-section, use the inner support surface to ensure that the film is not bonded to the other members. And depending on the side support members, It is best to have a component because of the state of the pass.  , Such a cross-sectional direction of the road is flexible in the flow direction by flowing in the flow path, And can be composed, The fluid in the deformed material changes in the flow path structure.  The non-adhesive area of the section of the section will not be able to maintain the flow path cut. And to reduce the spacing or flexible thin parts in the middle of the flow adhesion area, Or fixed the outer partition and so on. Especially for configuring the flow in the flow path, for example, Here, the state of the means is the best.  It has the flexibility to bend 10 312XP / invention manual (supplement) /94-02/93133436 1278978. E.g, If the inner support member is a hollow member, The hollow member can be composed of a flexible material. The hollow member can also be formed into a spiral shape.  The heat exchange system or the temperature control system can be constructed by using the above-described flow path structure. E.g, The heat exchange (temperature control) system has: Heated part with heat absorption function, Heat dissipation unit with cooling function, a circulation path of the heat receiving portion and the heat radiating portion, And a fluid propulsion means for advancing at least the fluid circulating in the circulation path, And at least one of the above-mentioned circulation paths is constituted by the flow path structure of any of the above. among them, The above-described flow path structure system may constitute, for example, between the heat receiving portion and the heat radiating portion, Between the heat sink and the fluid propulsion means, The heat transfer unit is connected to the flow path between the fluid propulsion means. In this case, Two flow paths, such as an outward path and a return path, are provided between the respective structural portions, It is preferably composed of an integrated flow path structure. In addition, a portion of the connecting flow path between the respective structural portions provided in the above system, Preferably, all of them are composed of an integrated flow path structure.  [Embodiment] Hereinafter, For an embodiment of the present invention, Use the example of the figure to explain it together. In addition, Each of the embodiments described below is directed to a heat receiving unit,  In the heat exchange system of the heat radiating portion and the fluid propulsion means, The flow path structure used is explained. However, the flow path structure of the present invention is not limited to such use. It can also form a flow path set in one of various systems. Can be widely used.  Fig. 1 is a perspective view showing a schematic configuration of a heat exchange system 100 in which a flow path structure of the present invention is assembled. This heat exchange system 1 0 0 is equipped with 11 312XP / invention manual (supplement) /94-02/93133436 1278978 Heated part (cooling jacket) 1 1 Ο, Heat sink (heat sink) 1 2 Ο, a cooling fan that blows airflow to the heat dissipating portion 120 and forcibly cools it. a fluid propelling means (pump) for circulating a fluid (in the present embodiment, a liquid) 1 400 And a flow path structure 150 that constitutes a flow path between the heat receiving portion Π 0 and the heat radiating portion 120.  The heat receiving unit 1 10 0 internally forms a flow path (not shown). It is used to contact a heat generating unit (not shown) such as a C P U chip. Further, it constitutes a structure for taking heat from the heat generating portion. The inlet port and the outlet port are provided in the heat receiving portion 1 1 0, These are connected to the interface portion 155 of the flow path structure 150, 1 5 6.  The heat dissipating portion 120 has a lead-in port and a lead-out port which are formed inside and are connected to a flow path (not shown). The interfaces are connected to the interface unit 155 of the flow path structure 150, 1 5 8. In addition, There are many cooling fans on the outside of it 1 2 1,  A structure that dissipates heat to the outside through the heat dissipation fan 1 2 1 is formed. The heat radiating portion 120 constitutes a structure for receiving air blown by the cooling fan 130 having a well-known structure. The airflow generated by the cooling fan 130 is blown to the cooling fan 1 2 1, 俾 Mandatory cooling of the heat sink 1 120.  The fluid propelling means 140 uses a driving force source such as an electric motor to apply a propulsive force to the fluid. The example of the figure is connected to the fluid propulsion means 1 40 at the end of the heat dissipating portion 120. And generating a fluid introduced from the heat transfer portion 120 inlet port,  The action of extruding toward the heat outlet 1 120 outlet. of course, The position of the fluid propulsion means 1 40 is only required to be within the circulation path described later. Can be configured in any location, It is not limited to the example of the figure.  In the present embodiment, a circulation path is formed between the heat receiving portion 1 110 and the heat radiating portion 1 120. This circulation path is constituted by an integrated flow path structure 150 in the illustrated example. in other words, By using the flow path structure 150, the heat-receiving portion 12 312 ΧΡ / invention specification (supplement) / 94-02 / 93133436 1278978 1 1 0 and the heat-dissipating portion 1 2 0 between the outward path and the return path body 150 Connected to the heat receiving part 1 1 0 inlet and 1 5 5, 1 5 6, And connected to the heat sink 1 2 0 introduction port 1 5 1 , 1 5 8. The interface units 1 5 1 and 1 5 5 are connected by a flow taking groove 1 5 3 and a flow path 1 5 4 . In addition, The interface is connected by the flow path 157.  With the above construction, The heat exchange system 100 uses the fluid inside, The fluid is propelled by the fluid propelling means 140, and is introduced from the heat receiving portion 1 1 0 through the flow path 1 5 7 1 2 0 . Then, the heat dissipating portion 1 120 is used for heat dissipation. 1 2 0 the outlet is via the flow path 1 5 2. Retention Department 1 5 3 and: 3⁄4 back to the heat part 1 1 0, In this case, the trap is taken from the outside. The 1 5 3 system is equipped with: Providing a function of absorbing a receding space that varies with the volume of fluid produced by the fluid; a spare tank function that supplies fluid when it is fluid; In time, It accommodates the gas contained in the liquid or the function of the liquid.  The flow path structure 150 is the flexible thin® shown in Figure 2, The whole can also form a flexible sheet film 1 5 Ο X, 1 5 Ο Y series is shown in Figure 2. It belongs to a laminate in which a resin and a metal layer 150B are laminated. That is, the laminate is thin to maintain flexibility, It can also take into account the gas barrier properties (^ and deformation strength and corrosion resistance) in the flow path.  Resin layer 1 5 0 A, 1 5 0 C is made up of various synthetic resins 312XP / invention manual (supplement) /94-02/93133436 One. Flow path structure Interface between the interface of the outlet and the outlet  1 5 2 The retention section (the spare parts 1 5 6 and 1 5 8 are for the above-mentioned circulation path, Coolant or the like is introduced into the heat sink, Then from the heat sink it road 1 5 4, The state of heavy heat again.  The temperature changes up and down due to volatilization, etc. When the fluid uses liquid gas, the gas is collected. Qin 1 5 Ο X, 1 5 Ο 彼 Pieces. Flexible thin layer 150 A, 1 50C,  [membrane. With this, K vapor barrier)  The film is composed of. Special 13 1278978 It is preferred that the heat sealability such as polypropylene is preferred. In addition, It can also be used with heat-sealable polyester. Materials such as nylon. among them, The resin layer 1 5 Ο A and 1 50 C may also be composed of the same material. It can also be made of different materials.  Furthermore, The metal layer 150B is preferably made of IS alloy, copper, Copper alloy,  silver, Silver alloy, gold, a foil or film composed of a metal such as a gold alloy (deposited film,  Sputter film, It is composed of a coating film or the like.  The flexible film of the present embodiment is 1 Ο X, 1 5 Ο Y is the cover of the metal layer 1 5 Ο B on both sides of the front and back with resin layers 15 5 A and 1 50 C, With this, It is quite suitable for compensating for the deformation strength and corrosion resistance of the metal layer 15 Ο B. In addition, If there is no problem with the use according to the purpose, It is also possible to laminate only a single metal layer and a single resin layer.  The flow path structure of the present embodiment is provided with: An adhesive region in which the flexible film 15 5 Ο X and 15 Ο Y are adhered directly or by an adhesive or the like; And non-adhesive areas that are not bonded to each other. In particular, the flexible film 15 5 Ο X and 15 Ο Y can be heat sealed to each other. 俾 Direct adhesion (fusion) is preferred. In this case, For example, as shown in Figure 3, Flexible film 1 5 Ο X and 1 5 Ο Y, Heat sealing is applied between molds A and B. at this time, The portion that is pinched and heated by the molds A and B forms an adhesive area 1 5 Ο T, By setting the groove A a of the mold A and the groove B a of the mold B, The portion that is not pinched or heated will form a non-adhesive area of 150 S. In this case, Can be in the flexible film 1 5 Ο X, Set any flow path structure 1 5 Ο z between 1 5 Ο Y. For example, the figure example, An integrated flexible film is available. 1 5 Ο X, 1 5 Ο Y, At the same time, a plurality of flow path structures composed of non-adhesive regions 1 5 0 S are formed, 1 5 Ο z, In addition, It can also be shown in the dotted line in the figure 14 312XP / invention manual (supplement) /94-02/9313343 6 1278978, The divergent flow path structure 1 5 0 v (the portion corresponding to the groove B b of the mold B) of the mold A is formed from the flow path structure 1 5 Ο z.  The illustrated flow path structure 1 5 Ο z is composed of two non-adhesive areas 1 50 S defined by the adhesive area 15 Ο T on both sides. but, The flow path structure can also bend a flexible film. One side is limited by the curved part, The other side is constructed using a non-adhesive area that is the same as the adhesion area described above.  Furthermore, By using the above flexible film with other members (for example, One part of the plate or block material is adhered to form an adhesive area, And the other parts are not adhered to form a non-adhesive area. Thereby, the flow path as described above can be easily constructed. In this case, It also utilizes an integrated flexible film and other components. At the same time constitute a complex flow path, Alternatively, a complicated flow path structure such as a disparity may be integrated. but, In this case, If other components are almost not flexible, Then, the flow path structure will also form a state in which it has almost no flexibility.  This will be described with reference to Fig. 1 again. The interface portion 15 1 provided in the flow path structure 150 15 8. 155, 1 5 6 constitutes a flow path 152, 154. 1 5 7 Inflow or outflow at the end. In the example of the figure, Each of the interface portions has the above flexible film 15 Ο X, Between 1 5 Ο Y, The structure of the interface member composed of synthetic resin or the like is held. The interface member is adhesively fixed (adhered and fixed) to the flexible film 1 5 Ο X, 1 5 Ο Y. Interface member and flexible film 1 5 Ο X,  1 5 Ο Y is completely sealed. An interface hole that communicates with the flow path is provided in the interface members. and so, By connecting the interface member to the heat receiving portion 110, An introduction port or a discharge port of the heat dissipation portion 120, To form the above loop path.  15 312XP/Invention Manual (supplement)/94-02/93133436 1278978 In addition, The flow path 1 5 0 of the flow path structure 150 described above 1 5 4,  1 5 7, Each of them constitutes a substantially constant flow path cross-section in the direction in which it extends. By this, It can reduce the retention of fluid or turbulence. but, The structure of the flow path is not limited to such a structure that can constitute a certain flow path cross section. It is also possible to have an appropriate flow path structure such as a structure in which a part of the flow path is enlarged.  The flow path structure body 150 is integrally formed to have flexibility. In particular, the adhesive region 15 5 Ο 黏 is adhered to each other by the flexible film, Because a certain degree of rigidity is available, Therefore, it is in a state in which it can maintain its own shape as shown. In this case, If you increase the area of the adhesive area by 15 Ο ,, The rigidity of the flow path structure 150 will increase. on the contrary, If the area of the adhesive area is reduced by 1 5 Ο ,, The rigidity of the flow path structure 150 will be lowered. and so, It is possible to use the area of the adhesive area 1 5 Ο ,, The rigidity and flexibility of the flow path structure 150 are adjusted. in particular, This embodiment is configured by appropriately constituting its outer edge shape.  Or set the opening 1 5 9, Notch (slit) 1 5 9 ’, Adjust the rigidity and flexibility.  Special needs, The flexibility of the specific portion of the flow path structure 150 can be improved. E.g, The example of the figure is provided by providing an opening 1 5 9 or a notch portion 1 5 9 ' between the flow paths 1 5 4 and 1 5 7 , It constitutes a second flow path 1 5 4 Flexibility of the area of 1 5 7 The state of the relative positional relationship of the two-way path can be easily changed. on the contrary, The rigidity of a particular part will also increase. For example, in the example of the figure, The retention portion 1 5 3 is formed into a U shape or the like, And forming an adhesive area inside the retention portion 1 5 3 , Therefore, the rigidity in the vicinity of the retention portion 1 5 3 will be increased. And to some extent maintain its shape.  In addition, Opening 15 5 in the vicinity of the flow path 1 5 2 And an opening 1 5 3 disposed above the retention portion 1 5 3 A tying structure in which the flow path structure 150 is supported by a flow chart structure 150, which is not shown, is used to form a flow path structure 150 by means of a device (Supplementary)/94·02/93133436 1278978. The flow path structure 1 50 can also be adhered, Adhesion, Various means such as welding, Fixed to the frame, Support plate, Or the above-mentioned heat receiving unit 1 10 0, Heat dissipation unit 1 2 0, Cooling fan 1 3 0, The fluid propulsion means 1 4 0 and other components. In this case, Preferably, the fixed portion of the flow path structure 150 is the above-mentioned adhesive region 15 5 Ο , 俾 can increase the support fixing force.  The flow path structure 150 is in the system shown in FIG. Connect other structures, then, Introducing a predetermined amount of fluid from the fluid introduction port 1 5 3 a, The heat exchange system 100 is completed. at this time, If the fluid is a liquid,  From the fluid introduction port 1 5 3 a, it flows into the retention portion 1 5 3 , Then flow into each flow path 1 5 2 1 5 4, 1 5 7 , Finally, it is filled in the heat receiving unit 1 1 0, The heat radiating part is inside 1 2 0. The fluid introduction port 1 5 3 a is formed at the most upstream position of the circulation path. Therefore, by providing the air removal portion at an appropriate position, The fluid can be filled in the overall circulation path. If the liquid is completely filled in the circulation path, After the air in the detention unit 1 5 3 is completely ejected, The fluid inlet 1 5 3 a is conveniently closed by adhesion (adhesion) or the like.  In this case, Preferably, the liquid filled in the flow path structure 150 is less than the maximum volume of the flow path structure 150. E.g, Below 90% of the largest container. With this, Even if the liquid swells due to an increase in the temperature of the liquid or the like,  It can still prevent the flow path structure from rupturing, Liquid leakage, etc. In particular, the retention portion 1 5 3 is provided when the liquid is swollen, The function of retracting the liquid to prevent the internal pressure from rising.  Furthermore, The retention portion 1 5 3 also has a tendency to decrease as the liquid passes over time. The liquid is replenished to the alternate tank function in the flow path. Reduction of liquid 17 312XP / invention specification (supplement) /94-02/93133436 1278978 is as in this embodiment, A flexible film having high airtightness and gas barrier property (water vapor barrier property) by using a laminated film 1 5 Ο X, 1 5 Ο Y, Can be reduced to almost negligible levels, However, because of the joint portion of the flow path structure 150 and other structural parts, Or within other structural parts, It is also impossible to avoid the occurrence of liquid reduction (for example, only a few). Therefore, the life of the product can be extended by providing the retention portion 1 5 3 .  Furthermore, The retention portion 153 also has a gas such as air mixed in the liquid, Or recovering gases such as various gases released from the liquid, And the function of the indwelling. This function is necessary when the fluid is used with liquid. Such a gas recovery function can not only provide the retention portion 153 as described above in the middle of the flow path, but also Even if a retraction portion that constitutes the retention portion 1 5 3 as described below is taken, The method formed beside the flow path can also be achieved.  4 and 5 may be in a part of the fluid structure body 150 1 Ο z, The retracted portion of the specific portion of the stagnation portion 1 5 3 that is provided is an enlarged schematic perspective view and an enlarged cross-sectional view of the structure of the structure. The retracting portion 150 w is disposed beside the flow path structure 1 5 Ο z, And connect the flow path structure 1 5 Ο z,  The other part consists of a closed non-adhesive area. The opening portion 1 5 0 u of the flow path structure 1 5 Ο z of the retracting portion 1 500 w, Preferably, the opening cross section is smaller than the flow cross section of the flow path and the retraction portion 150 w cross section. When the retraction portion 150 w is to increase the pressure in the flow path structure 1 5 Ο z due to fluid expansion or the like, a portion of the fluid flows through the opening portion 150u. 设置 It is set to prevent the flow path structure 150 from rupturing or fluid leakage.  Furthermore, As shown in Figure 5, When constructing 1 5 Ο z with respect to the flow path, In the case where the flow path structure 1 50 is disposed in the posture in which the retracting portion 1 500 w is disposed in the upper direction, 18 312XP/invention specification (supplement)/94-02/9313343 6 1278978, When the fluid uses liquid, The gas released from the liquid in the liquid is sucked into the retraction portion 150 w, This eliminates the need to return to the structure within the flow path. With this, It prevents the gas from entering the pump that is left in the liquid to be transported. Causes the pump to be unable to eject liquid. In this case, By reducing the opening portion 1 5 0 u, the constituent gas is returned to the structure inside the flow path. But in order to be more sure of preventing gas from returning, Therefore, the valve can be reversed in the opening portion 1 5 0 u of the above-mentioned retention portion 1 500 w.  Fig. 6 and Fig. 7 show a schematic cross-sectional view of a configuration example of a flow path structure having a retraction portion 15 5 Ο p, which is different from the above-described retention portion 1 5 3 . The retraction part 1 5 Ο p is like the above-mentioned retraction part 1 5 0 w,  Beside the flow path structure 1 5 Ο z, The flow path structure is connected to the 1 5 Ο z and the other parts are formed by the closed non-adhesive area. but, This portion of the 15 Ο p convection passage has a large opening portion. in particular, When retreating 1 5 Ο p to the flow path structure 1 5 Ο z projection, The entire projection surface is substantially in the shape of a mouth portion. and so, Inside this retraction 1 5 Ο p, The deformed material 1 5 0 q which is compressed and deformed to reduce the volume is accommodated. The deformed material 1 5 0 Q is a flexible bag formed by enclosing a gas, Or a sponge-like flexible material such as a hole. In addition, The above deformed material may be made of magnetic material, It can also constitute a heat absorbing body or a heat sink. Can also be combined with impure possession, Deodorizing material, The function of coloring materials, etc.  This configuration is when the fluid volume or pressure is not yet large enough. As shown in the solid line, The deformed material 1 5 0 q is bulky, Because the deformed material is substantially filled with the retracted portion 1 5 Ο p, Thus, in the flow path configuration 1 5 Ο z, the body or gas is 312XP/inventive specification (supplement)/94-02/93133436 and is stagnant.  Not easy to stop the flow path, With and set the k state,  The retraction and contraction are opened. The 19 1278978 fluid can be circulated in the flow path without any retention. but, When the fluid is swollen or the fluid pressure is raised by two, the pressure with the fluid is as shown by the broken line. The deformed material 1 5 0 q will be compressed, This part of the fluid will penetrate into the interior of the retraction 1 5 Ο p. With this, Because the pressure rise of the fluid will be moderate, Therefore, it is possible to reduce the occurrence of cracks or fluid leakage of the flow path structure.  Figure 8 shows the inside of the flow path structure 1 5 Ο z formed in the flow path structure 150. An exploded perspective view showing a configuration example of the inner side support member 1 500i in which the section holding means is disposed. The inner support member 1 5 0 i is in the interior of the flow path structure 1 5 Ο z, It has a hollow flexible material extending in the direction of the flow path. In the example of the figure, The inner support member 1 500 is formed in a spiral shape extending in the direction of the flow path. More specifically, It has a structure in which a strip having a plate surface is wound into a spiral shape. The panel supports a portion of the flexible film in a non-adhesive region of 15 Ο X and 15 Ο Y.  By arranging the inner support member 1 500i inside the flow path structure 1 5 Ο z, The flow path of the flow path structure of 1 5 Ο z is maintained from the inside. Since the inner side support member 1 500 is formed in a hollow shape (cylinder shape), Therefore, it will not hinder the flow of fluid in the flow path. And because the inner support member 1 500 has a flexibility that can be bent in the direction of the flow path, Therefore, the flexibility of the flow path structure 150 is not impaired.  In addition, The inner support member may also be a column that is erected within the flow path structure 15 5 Ο z. In addition, The section retaining means is not limited to the above inner support members, It can also be arranged outside the flow path structure 1 5 Ο z. And according to the flexible film in the non-adhesive area 1 5 Ο X, 1 5 Ο Y leaves one side away from the other side, in other words, It can also be an outer support member. Further, the side support member 20 312XP/invention specification (supplement)/94-02/93133436 1278978 is for example fixed to the outside of the flexible film 1 5 Ο X, The flexible film is 15 Ο X outside, Maintained in a state of leaving the opposite side of the flexible film 1 5 Ο ,, For example, it can be configured by an arc-shaped support.  Fig. 9 is a schematic perspective view showing a configuration example of the above-described flow path structure 150. The flow path structure 150 shown in Fig. 1 constitutes a flow path connecting the heat receiving portion 1 1 〇 and the heat radiating portion 120. but, The structure shown in Fig. 9 is on the outside of a predetermined area 1 5 Ο in the flow path structure 1 5 Ο ,, The temperature controlled body is directly configured. The temperature-controlled body means a heat generating portion such as a CPU chip that is in thermal contact with the heat receiving portion 110 as shown in Fig. 1. This configuration can achieve the same function as the heat receiving portion 110 shown in Fig. 1 by using the flow path structure. In particular, because the flow path structure of the flow path structure is 1 5 Ο z the predetermined area 1 5 Ο N outer surface, Directly in contact with the state of the temperature controlled body, Thus, a better heat exchange efficiency will be obtained.  here, The established area of the illustrated example 1 5 Ο 配合 is fitted with a temperature-controlled body shape, Depending on the temperature of the controlled body, a wider area of thermal contact, Form a broad structure. With this, It can increase heat exchange efficiency more efficiently. In addition, The established area 1 5 Ο Ν and the temperature controlled body tether can maintain mutual thermal contact with appropriate holding means. It is also possible to use the adhesion or adhesion (fusion) of the adhesive material, Secure each other.  Fig. 10 is a schematic perspective view showing another configuration example of the above-described flow path structure 150. This configuration example is between the flexible film 1 5 Ο X and 1 5 Ο ,, The embedded body 1 5 0 L composed of a magnet or a magnetic body is disposed,  And use the adhesive area to surround it with the structure. This buried body 150L is disposed beside the flow path structure 1 5 Ο 。. This example is a temperature controlled body constructed at least in part by 21 312 ΧΡ / invention specification (supplement) /94-02/93133436 1278978 strong magnetic body or magnet, With this, The temperature-controlled body κ is adsorbed and held in the state of the above-mentioned buried body 1 500 L. and so, By the temperature controlled body 吸附 adsorption is maintained in the buried body 1 500 L, Even if you don’t have any other maintenance tools, It is still possible to simply keep the temperature controlled body 热 in contact with the flow path structure 1 5 Ο 。. In addition, This configuration also allows the temperature controlled body to simply exit the flow path structure.  As shown in the above examples, The flow path structure system of the present invention utilizes other members between the flexible film 15 Ο X and 1 5 Ο ,, It is possible to construct a structure with various functions. E.g, By sandwiching the reinforcing sheet between the flexible films, It can increase the rigidity of the sandwiched portion. By setting the shape of various reinforcing sheets, The shape of the flow path structure can also be specified. In addition, Although the above is mentioned a little, By contrast to the above, Providing an opening or a slit in one of the flow path structures, And improve the flexibility of this part, Thereby, a state in which the portion is easily bent or folded can be formed.  Fig. 11 is a plan view showing the structure of the flow path structure 250 of another example of the flow path structure. In this flow path structure 250, The first interface unit 2 51 a,  251b, 251c, The second interface unit 252a, 252b, 252c and 3rd interface part 2 5 3 a, 2 5 3 b, 2 5 3 c, They are set at different circumferences. In this case, Set a plurality of first interface parts, The second interface unit and the third interface unit. then, Between the interface parts, Set the flow path 2 5 4 a, 2 5 4 b, 2 5 4 c,  2 5 5 a, 2 5 5 b, 2 5 6 a, 2 5 6 b, Each of the flow paths constitutes a state in which a plurality of interface units are connected to each other.  In this flow path structure 250, The flow path is in a state of being in communication with all of the other interface portions according to any of the plurality of interface portions. Phase interconnection adhesive 22 312XP / invention manual (supplement) /94-02/93133436 1278978. and so, By the flow path between the above, Closed by proper compression or adhesion (adhesion), The flow path structure required for the fit can be easily achieved. E.g, For the areas G 1 to G 5 surrounded by a dotted line, To press or stick (stick), The first interface unit 2 5 1 a and the third interface unit 2 5 3 a can be connected to each other. The first interface unit 2 5 1 b is connected to the second interface unit 2 5 2 a and the third interface unit 2 5 3 b (for example, having a branching portion). among them, The pressing of the above regions G 1 to G 5 , It can be implemented with a suitable crimping tool. In this case, The flow path structure 250 can be returned to its original state. In addition, Although it is impossible to return to the original state, However, it is also possible to apply thermal adhesion to the above regions G 1 to G 5 .  Furthermore, The flow path structure of the present invention is not limited to the above-described example of the drawing. In the context of not departing from the gist of the present invention, Of course, various changes can be made.  E.g, The heat exchange system of the above embodiment is 100, Although it constitutes the heat receiving part 1 1 0, a cooling system that cools a temperature controlled body (not shown), But yes, Alternatively, A heating system that heats the temperature controlled body by the heat radiating portion 120 is constructed.  Furthermore, In the above heat exchange system, A plurality of heat receiving portions (heat absorbers) may also be provided. And connecting the plurality of heat receiving portions by the flow path structure, at this time, It is also possible to construct a plurality of connecting portions from an integral flow path structure. In addition, Such as the hard drive exterior, The cooling object does not have a local high temperature section. When used in a wide range of situations, It may not be the above heat receiving part, On the other hand, the flow path structure itself shown in Fig. 9 and Fig. 10 constitutes a heat receiving portion. In this case, There is no need to design the connection portion with the heat receiving portion. In this case,  a metal layer constituting a part of the flexible film, The function of having a heat conducting layer 0 23 312XP/Invention specification (supplement)/94-02/93133436 1278978 In this embodiment, By forming the flow path structure as described above, In the manufacturing step, Can reduce the number of parts, Shorten the steps, Shorten the effect of delivery time. In addition, Because of its superior flexibility and flexibility, Therefore, it can be easily accommodated in various spaces. Especially because it is thin, Therefore, it can be arranged even for a flat passage or the like. and so, It can also be used in a pivot part such as a notebook computer. In addition, For example, the flow path cross-sectional area is appropriately changed toward the flow path direction. Or integrate most of the flow paths, Or the flow path may constitute an appropriate divergent structure such as a trifurcation or a crossroad. Freely constructing the flow path structure, It can also be attached with various structural members, Or carrying various structural parts, Or set along the concave and convex surface, etc. Dako can match the obvious effects of extremely soft conditions.  BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view of a heat exchange system according to an embodiment.  Fig. 2 is a schematic exploded perspective view showing a structure of a flexible film laminate according to an embodiment;  Fig. 3 is a schematic perspective view showing a method of manufacturing a flow path structure of an embodiment.  Fig. 4 is a schematic perspective view showing a structural example of a part of the flow path structure.  Fig. 5 is an enlarged partial cross-sectional view showing the configuration example shown in Fig. 4.  Fig. 6 is a schematic perspective view showing another structural example of a part of the flow path structure.  Fig. 7 is an enlarged partial cross-sectional view showing the configuration example shown in Fig. 6.  Fig. 8 is a schematic exploded perspective view showing another structural example of a part of the flow path structure.  Fig. 9 is a schematic view of still another embodiment of a flow path structure, a schematic oblique 24 312XP/invention specification (supplement)/94-02/93133436 1278978 view.  Figure 1 shows a part of the flow path structure. A schematic oblique view of another different structural example.  Fig. 11 is a plan view showing an embodiment of a different flow path structure.  [Main component symbol description] 1 00 Heat exchange system 110 Heated part 120 Heat sink 12 1 Cooling fan 13 0 Cooling fan 140 Fluid propulsion means 150' 2 5 0 Flow path structure 1 5 0 A, 1 5 0 C resin layer 1 50B metal layer 1 5 0 i inner support member (section holding means) 1 5 0 L buried body 1 5 0N established area 1 5 0 p, 1 5 0 w retraction (closed non-adhesive area) 1 50q deformation material 1 5 0 S non-adhesive area 1 5 0 T adhesion area 1 5 0 u opening part 1 5 0 v bifurcation flow path structure 1 5 0 X, 1 5 0 Y flexible film 312XP / invention manual (supplement) /94-02/93133436 25

1278978 1 5 Ο z 流路構造 1 5 1、1 5 5、1 5 6、1 5 8 接口部 152、 154、 157、 254a 流路 、254b、 254c、 255a、 255b 、 256a 、 256b1278978 1 5 Ο z Flow path structure 1 5 1 , 1 5 5, 1 5 6 , 1 5 8 Interface parts 152, 154, 157, 254a Flow paths, 254b, 254c, 255a, 255b, 256a, 256b

1 53 滯 留 部 153 a 流 體 導入ϋ r 15 9 開 口 15 9 缺 π 25 1 a、 251b 、 25] C 第 1接 口 部 252 a、 2 5 2 b 2 5 2 c 第 2接 口 部 253 a、 2 5 3 b 2 5 3 c 第 3接 π 部 A、 B 模 具 G卜 G5 域 Aa ' Ba 、Ab Bb 溝 K、M 溫度受控體 312XP/發明說明書(補件)/94-02/93133436 261 53 Retention portion 153 a Fluid introduction ϋ r 15 9 Opening 15 9 Missing π 25 1 a, 251b, 25] C First interface portion 252 a, 2 5 2 b 2 5 2 c Second interface portion 253 a, 2 5 3 b 2 5 3 c 3rd connection π part A, B mold G Bu G5 domain Aa ' Ba , Ab Bb groove K, M temperature controlled body 312XP / invention manual (supplement) /94-02/93133436 26

Claims (1)

1278978 十、申請專利範圍: 1 . 一種流路結構體,其特徵為,至少具備2個使流體流 入或流出的接口部,並具有使該接口部間連通的流路,該 流路整體係利用由可撓性薄膜彼此間之黏著區域,所規範 的非黏著區域構成一體化。 2.如申請專利範圍第1項之流路結構體,其中,上述流 路係利用上述可撓性薄膜,一體化構成複數個上述流路或 具有分歧的狀態。 3 .如申請專利範圍第1項之流路結構體,其中,上述可 撓性薄膜係由金屬層與樹脂層之積層體所構成的積層薄 膜。 4 .如申請專利範圍第1項之流路結構體,其中,具有連 通於上述流路中途,且其旁邊由封閉的非黏著區域所構成 的滯留部。 5 .如申請專利範圍第4項之流路結構體,其中,在上述 滯留部中收容著利用壓縮變形而減少體積的變形材。 6 .如申請專利範圍第4項之流路結構體,其中,上述滯 留部係配置於上述流路的上方側。 7.如申請專利範圍第1項之流路結構體,其中,設有保 持著上述流路之流通截面的截面保持手段。 8 .如申請專利範圍第7項之流路結構體,其中,上述截 面保持手段係配置於上述可撓性薄膜之非黏著區域内的内 側支撐構件,或保持呈上述非黏著區域中的可撓性薄膜其 中一邊離開另一邊狀態的外側支撐構件。 27 312XP/發明說明書(補件)/94-02/93133436 1278978 9 . 一種流路結構體,其特徵為,至少具備2個使流體流 入或流出的接口部,並具有使該接口部間連通的流路,該 流路至少其中一部份,係由可撓性薄膜彼此間或可撓性薄 膜與其他構件的黏著區域所規範的非黏著區域所構成。 1 〇.如申請專利範圍第9項之流路結構體,其中,複數 個上述流路或具分歧的上述流路,係利用上述可撓性薄膜 而構成一體化。 1 1 .如申請專利範圍第9項之流路結構體,其中,上述 可撓性薄膜係由金屬層與樹脂層之積層體所構成的積層薄 膜。 1 2.如申請專利範圍第9項之流路結構體,其中,具有 連通於上述流路中途,且其旁邊由封閉的非黏著區域所構 成的滯留部。 1 3 .如申請專利範圍第1 2項之流路結構體,其中,在上 述滯留部中收容著利用壓縮變形而減少體積的變形材。 1 4 .如申請專利範圍第1 2項之流路結構體,其中,上述 滯留部係配置於上述流路的上方側。 1 5.如申請專利範圍第9項之流路結構體,其中,設有 保持著上述流路之流通截面的截面保持手段。 1 6.如申請專利範圍第 9項之流路結構體,其中,上述 其他構件係較上述可撓性薄膜,為更具有剛性的合成樹脂 或金屬等之板狀材或塊狀材。 28 312XP/發明說明書(補件)/94-02/93133436 1278978 七、指定代表圖: (一) 本案指定代表圖為:第(1 )圖。 (二) 本代表圖之元件符號簡單說明: 100 熱交換系統 110 受熱部 120 121 130 140 150 151 、 158 152 153 153a 154 155 、 156 157 159 159, 散熱部 散熱風扇 冷卻風扇 流體推進手段 流路結構體 接口部 流路 滯留部 流體導入口 流路 接口部 流路 開口 缺口 八、本案若有化學式時,請揭示最能顯示發明特徵的化學式: 無 4 312XP/發明說明書(補件)/94-02/931334361278978 X. Patent application scope: 1. A flow path structure characterized in that at least two interface portions for allowing a fluid to flow in or out are provided, and a flow path for connecting the interface portions is provided, and the flow path is utilized as a whole. The conformable non-adhesive areas are integrated by the adhesive regions of the flexible films. 2. The flow path structure according to claim 1, wherein the flow path is formed by integrating the plurality of flow paths or having a state of divergence by the flexible film. 3. The flow path structure according to the first aspect of the invention, wherein the flexible film is a laminated film composed of a laminate of a metal layer and a resin layer. 4. The flow path structure of claim 1, wherein the flow path structure is connected to the middle of the flow path and is surrounded by a closed non-adhesive area. 5. The flow path structure of claim 4, wherein the retaining portion houses a deformed material that is reduced in volume by compression deformation. 6. The flow path structure of claim 4, wherein the retention portion is disposed above the flow path. 7. The flow path structure according to claim 1, wherein a cross-section retaining means for maintaining a flow cross section of the flow path is provided. 8. The flow path structure according to claim 7, wherein the cross-section retaining means is disposed on the inner support member in the non-adhesive region of the flexible film or is held in the non-adhesive region The outer film of one side of the film is separated from the outer side of the other side. 27 312XP/Invention Manual (Supplement)/94-02/93133436 1278978 9. A flow path structure characterized by having at least two interface portions for allowing fluid to flow in or out, and having communication between the interface portions The flow path, at least one of which is formed by a non-adhesive area defined by the flexible film or the adhesive region of the flexible film and other members. The flow path structure according to claim 9, wherein the plurality of the flow paths or the different flow paths are integrated by the flexible film. The flow path structure according to claim 9, wherein the flexible film is a laminated film composed of a laminate of a metal layer and a resin layer. 1. The flow path structure according to claim 9, wherein the flow path structure is connected to the middle of the flow path and has a stagnation portion formed by a closed non-adhesive area. The flow path structure according to the first aspect of the invention, wherein the deformation portion in which the volume is reduced by compression deformation is accommodated in the accumulation portion. The flow path structure of claim 12, wherein the retention portion is disposed above the flow path. 1. The flow path structure according to claim 9, wherein a cross-section retaining means for maintaining a flow cross section of the flow path is provided. The flow path structure according to claim 9, wherein the other member is a plate material or a block material such as a synthetic resin or metal which is more rigid than the flexible film. 28 312XP/Inventive Manual (Repair)/94-02/93133436 1278978 VII. Designation of Representative Representatives: (1) The representative representative of the case is: (1). (2) A brief description of the components of the representative diagram: 100 heat exchange system 110 heat receiving unit 120 121 130 140 150 151 , 158 152 153 153a 154 155 , 156 157 159 159 , heat dissipation fan cooling fan fluid propulsion means flow path structure Body interface section Flow path retention section Fluid introduction port Flow path interface section Flow path opening notch 8. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: None 4 312XP/Invention Manual (Supplement)/94-02 /93133436
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JP4901283B2 (en) * 2006-04-21 2012-03-21 学校法人同志社 Stack and manufacturing method thereof
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