1275879 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種直下式背光模組之散熱結構，特 別疋一種有關於將直下式背光模組所產生之熱量輪出，使 直下式液晶面板能運作更穩定，效能發揮的更好之散熱择 構。 “、、、、、° 【先如技術】 4知一般直下式背光模組於使用時，會產生許多熱 1，而且其熱量之來源大多源自冷陰極燈管及轉換器 (INVERTER )，又由於冷陰極燈管係被包覆於直下式 光模組内部，故其燈管所產生之熱量，大都係藉由金屬背 板之表面與空氣接觸來導出熱量，主 式將冷陰極燈管所產生之熱量散出，但是，現今 下式背光模組，因為冷陰極燈管愈加愈多，使得該直 =面板之總消耗功率也愈來愈大，因此，熱量也增^ 後方第i圖所示’該習知直下式背光模組之背: 後方係排财複數排冷陰極燈管， 之結構，當產生之埶量兪來侖客L月弋表面係為千: 提供-個更高版末=量二;;，無; 導致直下式液晶面板溫度過高二 板作動不良及冷陰極燈管之輝于直下式液晶t 該直下式液晶面板之壽命降：度下降，長期使用更會使4 種能夠有效輸出該直下式液晶 ，以達到冷卻之散熱結構，實 因此，便有需要提供一 面板於作動時所產生之熱量 為虽待解決之一大難題。 【發明内容】 鑑於以上習知技術之問題 本發明之主要目的在於提 1275879 上；複數個冷陰極燈管14係設置於該一背板1〇之下表面12 之上，意即該複數個散熱柱2〇及複數個冷陰極燈管，係 分別設置於該一背板10之兩侧，再者，該背板1〇係大致呈 一〔形狀。 …請再見第4圖，有關本發明之背板1〇及其上表面^之 4c數個散熱柱20係分別以沖壓製程製作成形，係先提供至 板材，利用沖壓模具對該至少一板材進行沖壓並使其 =性、交形，將该至少一板材分別沖壓出複數個散熱柱及 背板10，當然該複數個散熱柱2〇在沖壓成形得過程中，係 不能將複數個散熱柱20之未與背板接觸之表面沖壓破裂， 即複數個散熱柱20與背板接觸之表面係為不透光，以避免 使付背光模組Γ漏光，再者，由於該背板1〇與複數個散埶 柱20係非為一體成形，主要係將該複數個散熱柱2〇以組 设於該背板1〇之上表面11，當複數個散熱柱20分別 I设完成於背板10，再將該複數個冷陰極燈管14裝入於背 板10之另二側表面12上，此時，便可透過該散熱背板1〇上 表面11之複數根散熱柱20，將冷陰極燈管14所產生之熱 量，更快速攜出以達到散熱的目的，也因為該背板1〇&置 有複J根散熱柱20增加了許多與空氣接觸之面積，對於直 下^^光模組1，如增加冷陰極燈管14數量時，此一發明更 月匕提阿α亥月板1〇之散熱能力，將增加之冷陰極燈管μ所產 生之更多熱量，更快速有效率的散熱冷卻。 再：’請再見第5Α、5Β、5C圖，係、為該背板之端面剖 視圖，當複數個散熱柱20與背板1〇組合固定時係可包含膠 黏、卡合或螺紋鎖緊等方式之至少一者。 ^ ^再參照第4及5A、5B、5C圖，該背板1()之上表_ 開”—穿孔15，該複數個散熱柱20沖壓成形時係包 含有一卡合部21，如第5A圖所示，可利用膠黏方式 1275879 數個散熱柱20之卡合部21固定至背板ι〇之穿孔15，或者， 如第5B所示，當該複數個散熱柱20設置於該背板ι〇表面“ 亡?二將複數個散熱柱20之卡合部21 ’卡勾至背板10之 =孔15中，又或者如第5C所示，可利用公母螺紋配合方- 式，將複數個散熱柱20卡合部21鎖緊並固定至背杯 · 孔15中。 β攸ιυ之牙 另外，為了更增加散熱面積及減輕重量，係 成t第6圖所示之中空結構形式，係為將； ^形式之放熱柱20'裝設至背板之上表面丨丨上，當鈇 =形式之散熱枝2G'之與背板接觸之表㈣為不透光封 匕背光模組不會有漏光，同理，當該複數個冷陰極 …、更〖夬速攜出以達到散熱的目的。 · 呈有月之組裝於背板上之複數個散熱柱2〇係可 Π 如第仏、78、7。、71)圖所示，係為包 :之中:為中空設計，係包含心 有關本發明之背板及散熱柱之材料 傳V係數之材料，因此，本發明之 回汔、 等材料，再者，右Μ 士政口 月板材枓可包含鋁或鋼 鋁心有關本 複數個散熱柱材料係可包含 鋁或銅專咼導熱係數材料。 j匕3 上述本發明之該背板上表面更進一步可 複數個散熱柱表面也可設計成黑色，i 柱表面也可設計成粗縫表 ，數们放熱 匕举0疋為使背板及複數個 1275879 散熱柱之放射率增加’提高輻射熱傳量，進而幫助散 ^發明綜合多年設計經驗，乃發明—種能夠將直^ 背光模組之熱量有效輸出之結構，能有效輸出，並提供二 :更高的散熱功能，克服直下式背光模組因散熱效果不、 仫’而導致液晶面板作動;^良及》陰極燈管之輝度下 進由此可知’本發明相較於習知做法，已具備顯著功 虽，本發明以較佳實施例揭露於上，然其並非用以限 明’任何熟習此項技藝者，在不脫離本發明之精神 =乾圍内’當可做些許之更動與潤飾，因此 範圍當視後附之申請範圍所界定者 月之保叹 【圖式簡單說明】 ，1圖係習知直下式背光模組之背板設計示意圖 f 2圖係本發明之一較佳實施例之示意圖 Ϊ ^圖係本發明之背板與散熱柱一體成形局部放大圖 ^圖係本發明之另一較佳實施例之示意圖 =合圖、第％圖係本發明之散熱柱與背板各種: ，6圖係本發明中空散熱柱裝設於背板上之局部放大圖 ^ π %、7D圖係本發明之散熱柱為圓形柱、多角^ 柱、方形柱、及矩形柱等形狀示意圖 ilAi8B^8D圖係本發明之散熱柱為中空設計示意丨 L主要70件符號說明】 ，直下式背光模組之散熱結構 [直下式背光模組之散熱結構 1G背板 11背板之上表面 12 背板之下表面 1275879 13散熱柱 14 冷陰極燈管 15背板之孔洞 20散熱柱 2(Γ中空形式之散熱柱 21散熱柱之卡合部1275879 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation structure of a direct type backlight module, and more particularly to a method for rotating a heat generated by a direct type backlight module to make a direct type liquid crystal The panel can operate more stably, and the performance is better. ",,,,, ° [Before technology] 4 know that the general direct-lit backlight module will generate a lot of heat 1 when it is used, and the source of its heat is mostly derived from the cold cathode lamp and converter (INVERTER), and Since the cold cathode lamp tube is coated inside the direct-type optical module, the heat generated by the lamp tube is mostly derived by contacting the surface of the metal back plate with air, and the main type is the cold cathode lamp tube. The generated heat is dissipated. However, today's lower-type backlight modules, because more and more cold-cathode lamps are used, the total power consumption of the straight-panel is also increasing. Therefore, the heat is also increased. Show the back of the conventional direct-lit backlight module: the rear is a series of cold cathode lamps, the structure of the cold cathode lamp, when the amount of 兪 兪 仑 L L L L L : : : : : : : : : : : : End = quantity two;;, no; causes the temperature of the direct type liquid crystal panel to be too high, the second board is not working properly, and the cold cathode lamp is brighter than the direct type liquid crystal. The life of the direct type liquid crystal panel is lowered: the degree is lowered, and the long-term use will make 4 Can effectively output the direct type liquid crystal to achieve cold However, there is a need to provide a heat generated by a panel during operation as one of the major problems to be solved. [Invention] In view of the above problems of the prior art, the main object of the present invention is to provide 1275879 A plurality of cold cathode lamps 14 are disposed on the lower surface 12 of the back plate 1 , that is, the plurality of heat dissipation columns 2 复 and the plurality of cold cathode lamps are respectively disposed on the back plate 10 . On both sides, in addition, the back plate 1 is substantially in the shape of a shape. [See also FIG. 4, the back plate 1 of the present invention and the upper surface thereof 4c of the heat dissipation columns 20 are respectively stamped The process is formed into a sheet, and the at least one sheet is stamped by a stamping die and made into a shape and a cross shape, and the at least one sheet is respectively punched out by a plurality of heat dissipating columns and the back sheet 10, of course, the plurality of sheets In the process of stamping and forming, the surface of the plurality of heat dissipating columns 20 that are not in contact with the backing plate cannot be punched and ruptured, that is, the surface of the plurality of heat dissipating columns 20 in contact with the backing plate is opaque to avoid Make the backlight module leak Light, in addition, since the back plate 1〇 is not integrally formed with a plurality of divergent columns 20, the plurality of heat dissipation columns 2 are mainly disposed on the upper surface 11 of the back plate 1,, when plural The heat dissipation columns 20 are respectively disposed on the back plate 10, and the plurality of cold cathode lamps 14 are mounted on the other two side surfaces 12 of the back plate 10. At this time, the heat dissipation back plate can be passed through the heat dissipation back plate. The plurality of heat dissipation columns 20 of the surface 11 absorb the heat generated by the cold cathode lamps 14 more quickly to achieve the purpose of heat dissipation, and also because the back plate 1〇& The area in contact with the air, for the direct light ^1 optical module 1, such as the increase in the number of cold cathode fluorescent tubes 14, this invention will increase the cooling capacity of the cold cathode lamps The more heat generated by μ, the faster and more efficient cooling and cooling. Again: 'Please see the fifth, fifth, and fifth 5C diagrams, which are the cross-sectional views of the backplane. When multiple heatsinks 20 and backplanes are combined and fixed, they may include adhesive, snap or thread lock. At least one of the ways. ^ ^ Referring again to Figures 4 and 5A, 5B, 5C, the back plate 1 () above the table - open" - the perforation 15, the plurality of heat-dissipating columns 20 are stamped and formed to include a snap portion 21, such as the 5A As shown in the figure, the engaging portion 21 of the heat dissipating post 20 of the adhesive method 1275879 can be fixed to the through hole 15 of the back plate ι, or, as shown in FIG. 5B, when the plurality of heat dissipating columns 20 are disposed on the back plate The surface of the 〇 “ 亡 亡 亡 亡 亡 亡 亡 亡 亡 亡 亡 亡 亡 亡 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 〇 A plurality of heat dissipating post 20 engaging portions 21 are locked and fixed to the back cup/hole 15. In addition, in order to increase the heat dissipation area and reduce the weight, the hollow structure shown in Fig. 6 is attached to the surface of the back plate. On the top, when the 散热= form of the heat-dissipating branch 2G' is in contact with the backing plate (4), there is no light leakage in the opaque sealed backlight module. Similarly, when the plurality of cold cathodes are... In order to achieve the purpose of heat dissipation. · A plurality of heatsinks 2 that are assembled on the backplane for a month, such as 仏, 78, 7. 71) is a package: in the hollow design, the material containing the V coefficient of the material of the back sheet and the heat dissipation column of the present invention, and therefore, the material of the present invention, and the like, The right-handed Shizhengkou moon plate can contain aluminum or steel aluminum. The various heat-radiating column materials can contain aluminum or copper-specific thermal conductivity materials. J匕3 The surface of the back plate of the present invention may further have a plurality of heat dissipating column surfaces which may also be designed as black, and the surface of the i-column may also be designed as a thick-seam table, and the number of exotherms is 0 疋 for the back plate and the plural The increase of the emissivity of the 1275879 heat-dissipating column 'improves the radiant heat transfer volume, and thus helps the invention of the multi-year design experience. It is the invention that can effectively output the heat of the backlight module, and can provide two outputs: The higher heat dissipation function overcomes the fact that the direct-lit backlight module does not cause the heat-dissipating effect to cause the liquid crystal panel to act; the brightness of the cathode lamp is improved, and thus the present invention has been compared with the conventional practice. The present invention has been disclosed in its preferred embodiments. However, it is not intended to limit the invention to those skilled in the art, and may do some modifications without departing from the spirit of the invention. Retouching, so the scope is defined as the sigh of the month defined by the application scope [simplified description of the drawing], 1 is a schematic diagram of the backplane design of the conventional direct-lit backlight module. Implementation 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Fig. 6 is a partial enlarged view of the hollow heat dissipating column of the present invention installed on the back plate. π %, 7D drawing The heat dissipating column of the present invention is a circular column, a multi-angle column, a square column, and a rectangular column. ilAi8B^8D diagram The heat dissipation column of the present invention is a hollow design representation 丨L main 70 symbol description], the heat dissipation structure of the direct type backlight module [the heat dissipation structure of the direct type backlight module 1G back plate 11 the upper surface of the back plate 12 Back surface of the back plate 1275879 13 Heat sink column 14 Cold cathode lamp tube 15 Back plate hole 20 Heat sink column 2 (Γ Hollow form of heat sink column 21 Heat sink column