TWI275535B - Container paper board for containing electronic chips - Google Patents

Abstract

A container paper board for containing electronic chips in which generation of fluff on inside face of concavities in which the electronic chips are contained or when a top cover tape is peeled off from the base paper board is zero or very little, comprises a base paper board, having a multi-layered paper board structure, wherein a pulp prepared by disintegrating the base paper board has a pulp fiber length distribution coefficient of 1.20 to 3.20, determined by the pulp fiber length-determination method including an automated optical method, in accordance with JAPAN TAPPI No. 52.

Description

1275535 九、發明說明： ί：發明戶斤屬之技術領域】 發明領域 本發明係有關-種用來容納呈晶片狀之電子零件的容 5器紙板。更具言之，本發明係有關—種用來容裝電子晶片 的容器紙板，其巾在該㈣紙板上_成的凹㈣會產生 的毛屑很少，並具有優異的易裂性，本發明之可容裝電子 晶片的容紙板在黏接覆帶時會展現絕佳的穩定性，而可 避免產生毛屑’該等毛屑是在當覆帶被由該溶液紙板剝除 10 時會由該紙板釋離者。 發明背景 該用來容裝呈晶片狀之電子零件的容器紙板通常會被 轉變成一用來帶送該等晶片狀電子零件的載具，其係將作 15 為該容器紙板的紙板片進行如下的處理： (1) 一紙板會被切割成一條帶的形狀而具有一所需寬 度。 (2) 在所造成之該基礎紙板上，將會被製設許多可容納 電子曰曰片的矩形孔（凹穴或貫孔），及諸多可在一晶片容裝或 20晶片取出機中用來移動該容器紙板的圓孔（凹穴或貫孔）。 (3) 當要製成違專貫孔時，該基礎紙板的背面會被覆設 一底覆帶，其係在加熱及壓力下來將該底覆帶熱黏於基礎 紙板的背面上，並封閉該等矩形貫孔的底部開口而形成矩 形凹穴。當有多數凹穴被以一軋紋處理取代該等矩形貫孔 5 1275535 來被製設在該基礎紙板上時’則該覆底程序將可省略。該 覆帶與該載體紙板的接合係藉一種習稱為熱封的方法來完 成，其包含將該覆帶疊合於該容器紙板上，並藉對該覆帶 的頂面加熱及加壓，而使該覆帶黏接於容器紙板上。 5 (4)多數的電子晶片會由未密封的頂部開口來置入該等 矩形凹六内。 (5) —頂覆帶會被黏接於5亥基礎紙板的正面上，並以熱 封法來密封該矩形凹穴的頂部開口。 (6) 如此造成之裝有該等電子晶片的容器紙板會被繞一 1〇 卡匣捲軸來捲繞。 繞該卡匣捲軸來捲繞的容器紙板會被傳送至一使用 者。 (7) 在該等電子晶片被實際使用之前，該頂覆帶會被由 該容器紙板的正面剝除’而該等電子晶片會被由該等矩形 15凹穴取出。 回應上述用途，該容器紙板的品質必須滿足以下要求： (1) 所容裝的電子晶片不會被該容器紙板所影響。 (2) 該容器紙板的表面須具有高光滑度可使覆帶牢貼於 該表面上。 2〇 (3) 該容器紙板的機械強度要高得足以承受各種處理。 尚有一問題必須被解決，即該容器紙板的品質缺陷係 會在紙層上產生毛屑。該毛屑是由毛狀紙漿纖維所構成， 而在當晶片的使用者從紙板表面剝除覆帶時，會由該容器 紙板的表面釋出者。該覆帶被剝除之後，而有毛屑產生於 6 1275535 該等用來容裝電子晶片 之矩形孔的内面，及該容哭 表面上時，將會造成各w紙板的 ，例如，欲由該等矩形孔取 ^子片妨礙，或該等晶片易受毛屬污染等等。 本未Λ審的專利巾請案n。in 及No. 10-218281(專利文件2@^ (寻歡件1) 寺冒揭露用來防止在該等矩 形孔内產生毛屑的裝置。右 祐决 Μ衣置中，有一樹脂會被塗覆 寺矩形孔的内面。又，日本未實審的專利申請宰1275535 IX. INSTRUCTIONS: ί: TECHNICAL FIELD OF THE INVENTION FIELD OF THE INVENTION The present invention relates to a paperboard for containing electronic components in the form of wafers. More specifically, the present invention relates to a container paperboard for accommodating an electronic wafer, and the concave (four) of the towel on the (four) paperboard generates little swarf and has excellent cracking property. The invention can accommodate an electronic wafer containing paper sheet which exhibits excellent stability when the cover tape is adhered, and can avoid the generation of dander which is caused when the cover tape is peeled off from the solution paperboard 10 Discharged by the cardboard. BACKGROUND OF THE INVENTION The container paperboard for containing electronic components in the form of wafers is typically converted into a carrier for carrying the wafer-like electronic components, which is to be used as a cardboard sheet for the container paperboard as follows. Handling: (1) A cardboard will be cut into a strip shape with a desired width. (2) On the basis of the base paperboard, a number of rectangular holes (recesses or through holes) for accommodating the electronic cymbals will be formed, and many can be used in a wafer or 20 wafer unloader. To move the circular hole (concave or through hole) of the container cardboard. (3) When the special hole is to be made, the back surface of the base paperboard is covered with a bottom cover tape which is heated and pressed to heat the bottom cover tape to the back side of the base paperboard, and closes the The bottom of the rectangular through hole is opened to form a rectangular recess. The overlying procedure can be omitted when a plurality of pockets are replaced by the embossing process to replace the rectangular through holes 5 1275535 on the base paperboard. The bonding of the cover tape to the carrier paperboard is accomplished by a method known as heat sealing, which comprises laminating the cover tape on the container paperboard and heating and pressurizing the top surface of the cover tape. The cover tape is adhered to the container board. 5 (4) Most of the electronic wafers are placed in the rectangular recesses 6 by unsealed top openings. (5) The top cover tape is adhered to the front side of the 5 hp base paperboard, and the top opening of the rectangular recess is sealed by heat sealing. (6) The container paperboard thus loaded with the electronic wafers is wound around a 1〇 cassette winding. The container cardboard wound around the cassette reel is conveyed to a user. (7) Before the electronic wafers are actually used, the top cover tape is stripped from the front side of the container paperboard and the electronic wafers are taken out by the rectangular 15 recesses. In response to the above purposes, the quality of the container board must meet the following requirements: (1) The electronic wafers contained are not affected by the container board. (2) The surface of the container board shall have a high degree of smoothness to allow the cover to adhere to the surface. 2〇 (3) The mechanical strength of the container board is high enough to withstand various treatments. There is still a problem that must be solved, that is, the quality defect of the container board will produce chips on the paper layer. The dandruff is composed of bristles of pulp fibers which are released from the surface of the cardboard when the user of the wafer strips the cover from the surface of the paperboard. After the strip is stripped, and the dander is generated on the inner surface of the rectangular hole for accommodating the electronic chip, and the surface of the crying surface, the w-board will be caused, for example, by The rectangular holes are obstructed by the sub-pieces, or the wafers are susceptible to contamination by the hairs and the like. This unclaimed patent towel is requested. In and No. 10-218281 (Patent Document 2@^(寻欢件1) The temple exposes a device for preventing the generation of dander in the rectangular holes. In the right coat, a resin will be coated. The inner surface of the rectangular hole of the temple. In addition, the Japanese patent application for untested

10 15 ΤΓ·53195(專利文件3)亦揭露—種防止產生毛屑的i =/、铺控躲木對硬柄私㈣以縣礎紙板的 :::來防止。但是，沒有任何—種上述的習知技術具有 此充分阻止毛職生的效果，而可完全解決因·產生於 邊等矩形孔内所衍生的問題。10 15 ΤΓ·53195 (Patent Document 3) also discloses that i =/, which prevents the generation of dander, is prevented by the use of :::. However, none of the above-mentioned conventional techniques have the effect of sufficiently preventing the hair occupation, and the problems derived from the rectangular holes such as the edges can be completely solved.

專利文件 1 : JP-1M65786-A 專利文件2 : JP-10-218281-A 專利文件3 : JP-2002-53195-APatent Document 1: JP-1M65786-A Patent Document 2: JP-10-218281-A Patent Document 3: JP-2002-53195-A

I：發明内容3 發明概要 本發明之-目的係為提供一種用來容裝晶片狀之電子 20零件的容器紙板，其能高度抑Α在供容裝電子晶片的凹穴 内產生毛屬，且當-覆帶被由該容器紙板的表面剝除時， 於4、我板表面上所產生及釋出的毛屑量係為零或很少。 本發明的發明人已發現，在習知的容裝電子晶片之容 器紙板中包含一基礎紙板，其係由多層紙板製造方法所製 7 1275535 成，在容裝電子晶片的凹穴内面及該紙板表面上，當一覆 f被由該表面剝除之後，毛屑將會由於構成該各紙層之紙 |纖維長度的不當分佈而來產生，又已發現當該等紙漿纖 維的分佈係數在某一特定範圍内時，則毛屑的產生量將會 ， 5非常低。本發明即根據上述發現而來完成者。 ^ 本發明之用來容裝電子晶片的容器紙板乃包含一基礎I. SUMMARY OF THE INVENTION The present invention is directed to providing a container paperboard for containing wafer-like electronic components, which is highly resistant to the generation of genus in the pockets for housing electronic wafers, and - When the cover tape is peeled off from the surface of the container board, the amount of dander generated and released on the surface of the board is zero or little. The inventors of the present invention have found that a conventional paperboard for containing electronic wafers includes a base paperboard made of 7 1275535 made of a multi-layer paperboard manufacturing method, and the inner surface of the pocket for accommodating the electronic wafer and the paperboard. On the surface, when a coating f is peeled off from the surface, the dander will be produced due to the improper distribution of the paper length of the paper layers, and it has been found that when the distribution coefficients of the pulp fibers are at a certain When it is within a certain range, the amount of shavings produced will be very low. The present invention has been completed based on the above findings. ^ The container paperboard for accommodating an electronic wafer of the present invention comprises a foundation

、、、氏板具有多層紙板結構，其中，當該基礎紙板被偶JIS _ P822G ’紙装實驗室濕粉碎法來粉碎，而所造成的粉碎聚料 使用一自動光學法依日本ΤΑρρι Ν〇·52的規定來進行紙漿 、戴、、隹長度測s時’該等粉碎的紙漿會具有由12至32〇的纖 維長度分佈係數。 在本發明之用來容裝電子晶片的容器紙板中，該等粉 碎紙漿的纖維長度分佈係數最好是在1.2至270的範圍内。 在本發明之用來容裝電子晶片的容器紙板中當一基 15礎紙板的正表面層部份由該紙板正面沿其厚度方向算起具 • 有ΙΟΟμιη的厚度，而被以紙漿粉碎法來粉碎時所造成的 粉碎紙聚較好具有L2至謂的纖維長度分佈係數。 • 纟本發明之絲容裝電子W的容⑽板+，該基礎 ~ 紙板正面部份所形成之粉碎紙聚的纖維長度分佈係數更好 20 是在1.2至2·50的範圍内。 在本發明之用來容裝電子晶片的容器紙板中，該基礎 紙板較好是由-種造紙漿料所製成，其包含一分級紙衆其 中不3有可邊存在一24網目之網幕上的粗紙浆纖維，及可 穿過一 150網目之篩網的細紙漿纖維。 8 1275535 在本毛明之用來容裝電子晶片的容器紙板中，較好 是，該基礎紙板的正面部份由該紙板的正面算起係有 ΙΟΟμιη的厚度’且由該分級紙漿所製成，#内不含有會留 存在24、、罔目之網幕上的粗紙漿纖維，及會穿過一 15〇網目 5 之師網的細紙漿纖維。 本=月之用來容裝電子晶片的容器紙板會具有一功, , and the board has a multi-layer cardboard structure, wherein, when the base paperboard is pulverized by the even JIS _ P822G 'paper-packed laboratory wet pulverization method, the resulting pulverized aggregate is subjected to an automatic optical method according to Japanese ΤΑρρι Ν〇· The provisions of 52 for the pulp, wear, and crepe length measurements s 'the pulverized pulp will have a fiber length distribution coefficient from 12 to 32 。. In the container paperboard for containing an electronic wafer of the present invention, the fiber length distribution coefficient of the pulverized pulp is preferably in the range of 1.2 to 270. In the container paperboard for accommodating an electronic wafer of the present invention, when the front surface layer portion of a base paper is counted from the front surface of the paperboard in the thickness direction thereof, the thickness of the paper is pulverized by the pulp pulverization method. The pulverized paper produced by pulverization preferably has a fiber length distribution coefficient of L2 to ya. • The volume (10) plate + of the wire-loading electron W of the present invention is more than 20 in the range of 1.2 to 2.50. In the container paperboard for accommodating an electronic wafer of the present invention, the base paperboard is preferably made of a papermaking pulp, which comprises a grading paper, wherein there is no net screen of 24 mesh. The coarse pulp fibers on the top, and the fine pulp fibers that can pass through a 150 mesh screen. 8 1275535 In the container paperboard of the present invention for accommodating an electronic wafer, preferably, the front portion of the base paperboard is 厚度μιη thickness from the front side of the paperboard and is made of the graded pulp. #There is no coarse pulp fiber that will remain on the screen of the 24th, and the mesh, and the fine pulp fiber that will pass through the net of a 15 mesh. This month's container cardboard used to hold electronic wafers will have a merit

、士即田有，婁文日穴被製設在該紙板中來容納該等晶片 才。，毛屑並不會或只會很少量地產生在該等 凹穴内面中， 復$由。亥紙板正面被剝除時，在該紙板的正面上即 〇該等凹穴開口處，毛屑亦不會或只會很少量地產生在該紙 2表面上’因此被容納於該等凹穴内的電子晶片將比較不 4被毛屑所污染。 【實施冷式】 較佳實施例之詳細說明 15 20 本毛明之用來容裝電子晶片的容器紙板乃包含-基礎 =具有Η的紙板結構，其中，當該基礎紙板依據瓜 氏水Λ私至溼粉碎法來粉碎，且所造成的粉碎紙漿 ^用-自動林法，依據日本TAm Ν。Μ的規定來進行 的:戴准長度H該粉碎的紙裝會具有由丨.20至3.2〇 你^^長度h佈係數。較好是，該粉碎紙漿的纖維長度分 糸數係在1.2〇至⑽的範圍内。包含該基礎紙板，即可形 板纖維長度分佈係數由㈣至心的粉碎紙漿之容器紙 被制!會具有—優點：#有多數用來容裝電子晶片的凹穴 衣攻在該紙板中時，料會有錢乎沒有任何晶片會被 9 1275535 斤亏木°亥等毛屑係產生於該等凹穴内面，及當由該 、氏板上剝除4封容裝該等晶>!之凹六開口的覆帶時所產生 者且不曰有或幾乎沒有任何電子晶片會被該紙板所產生 勺毛屑污木麵優點的原因係，當該容器紙板的基礎紙 有上述之纟㈣纖維長度分佈係數時，在該基礎紙板内 厚度方向的紙漿纖維分佈結構，即該基礎紙板内沿厚度 =向:紙漿纖維之間的_分佈結構，將會均勻—致，故 @有夕數用來&納電子晶片的凹穴或貫孔被製設在該基礎 Μ反上$貝J用來製成貫孔之冲料刃的冲料速度，或用 =成凹a的壓紋速度將能保持較。因此，在該等貫孔 或凹八内"卩’由於冲料速度或壓紋速度的局部減降而導致 毛屑的產生將會被抑止。且，因在該基礎紙板正面即該等 凹穴開口處之紙漿纖維的分佈結構會均勻-致，爰當覆蓋 1基礎紙板正面即該等凹穴開π處的覆帶被由該紙板剝除 日守其剝除私序將能以一固定速度來進行，故由於剝除速 =的局部變化而導致毛屑的產生將完全或 幾乎不會發生。 畜上述粉碎的紙漿之纖維長度分佈係數大於3.20B寺 ，則所 j成的紙板會對毛屑的產生呈現不充分的抑制作用。又， 右違係數小於1.2，則該紙板之料漿的產能將會減低，因此 20在貝務上將會令紙板的生產造成一經濟上的弱點。 在本舍明的谷為紙板中，當該基礎紙板被粉碎且所造 成之粉碎紙漿被用來測定其纖維長度分佈係數時，該係數 必須在1.20至2.90的範圍内。該基礎紙板的粉碎係依據JISP 822(M998，紙漿實驗室濕粉碎法來進行。於此粉碎過稃 1275535 中’該基礎紙板的樣品會被以30g的乾量來取樣，並會在 20士5 C的溫度以蒸餾水或離子交換水來浸潰3〇〇分鐘。如此 幵>成之w合物的總體積會被調整至2〇〇〇ml，嗣該混合物會 被饋入一標準的粉碎機内，且該漿液中的紙板樣品會被以 5 30_q>m的攪拌轉速來粉碎，而職粉碎的漿料渣液。 该粉碎紙裝的纖維長度分佈係數之測定係依據曰本 TAPPI紙漿測試法Ν(χ 52·2_，漿料及紙—纖維長度之測 疋-自動光學法來進行。即，該粉碎紙漿之渣液樣本會被 以/月淨的水來稀釋至〇 〇〇1%的濃度。該自動光學測試機之 1〇測量系統的壓力會被輕為篇pa;淨水會被注人一測量槽 内至違槽之《的高度；且上述之稀釋的紙漿渣液會被充入 補内至填滿該槽，然後來測量該漿液的纖維長度。 該樣本的平均纖維長度係依下列公式來計算·· Σ】 a)計數的平均纖維長度LN=iShishi is in the field, and the 娄文日穴 is made in the cardboard to accommodate the wafers. The shavings are not or will only be produced in a small amount in the inner faces of the pockets. When the front side of the cardboard is peeled off, on the front side of the cardboard, that is, at the opening of the recess, the shavings are not generated or only slightly generated on the surface of the paper 2, and thus are accommodated in the concave The electronic wafer in the hole will be less contaminated by the dander. [Implementation of the cold type] Detailed description of the preferred embodiment 15 20 The container paperboard used for accommodating the electronic wafer includes - the base = a cardboard structure having a crepe, wherein the base paperboard is privately based on the guillotine Wet pulverization method to pulverize, and the resulting pulverized pulp is used - automatic forest method, according to Japanese TAm Ν. Μ 规定 规定 : : : : : : 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴 戴Preferably, the pulverized pulp has a fiber length fraction in the range of 1.2 Å to (10). Including the base paperboard, the shape fiber length distribution coefficient is made of (4) to the heart of the pulverized pulp container paper! There will be - advantages: # There are a large number of pockets for accommodating electronic wafers in the cardboard It is expected that there will be no money, no chips will be produced in the inner surface of the pockets by 9 1275535 jin, loss of wood, etc., and when the four pieces are removed from the plate, the crystals are included! The reason why the recessed six-opening cover is produced without any or almost no electronic wafers will be affected by the paperboard's spoiled wood surface, when the base paper of the container board has the above-mentioned flaws (4) When the fiber length distribution coefficient is used, the distribution structure of the pulp fibers in the thickness direction of the base paperboard, that is, the thickness of the base paperboard = the distribution structure of the pulp fibers, will be uniform, so @夕夕The recesses or through holes of the incoming & nanoelectronic wafer are formed on the basis of the basis of the punching speed of the punching edge of the through hole, or by the embossing speed of the concave a Can keep it better. Therefore, the generation of swarf due to the local decrease in the pulverizing speed or the embossing speed in the through holes or the concave ridges will be suppressed. Moreover, since the distribution structure of the pulp fibers at the front surface of the base paperboard, that is, the opening of the pockets, is uniform, the cover tape covering the front side of the base paperboard, that is, the π opening of the pockets is stripped by the paperboard. It is possible to carry out the stripping of the private sequence at a fixed speed, so that the generation of shavings due to the local change of the stripping speed = will occur completely or almost never. If the fiber length distribution coefficient of the above-mentioned pulverized pulp is greater than 3.20B, the paperboard formed by the animal will have an insufficient inhibitory effect on the generation of dander. Moreover, if the right violation coefficient is less than 1.2, the production capacity of the paperboard slurry will be reduced, so 20 will cause an economic weakness in the production of cardboard. In the paper of the present invention, in the paperboard, when the base paperboard is pulverized and the pulverized pulp is used to determine the fiber length distribution coefficient, the coefficient must be in the range of 1.20 to 2.90. The pulverization of the base paperboard is carried out in accordance with JISP 822 (M998, pulp laboratory wet pulverization method. In this smashed 755 1275535, the sample of the base paperboard will be sampled at a dry volume of 30 g and will be at 20 士5 The temperature of C is immersed in distilled water or ion-exchanged water for 3 minutes. Thus, the total volume of the compound is adjusted to 2 〇〇〇ml, and the mixture is fed into a standard pulverization. Inside the machine, and the paperboard sample in the slurry is pulverized by the stirring speed of 5 30_q>m, and the slurry slag liquid is crushed. The fiber length distribution coefficient of the pulverized paper is determined according to the TAPPI pulp test method. Ν (χ 52·2_, slurry and paper - fiber length measurement - automatic optical method. That is, the slag liquid sample of the pulverized pulp will be diluted to 〇〇〇 1% with / month net water Concentration. The pressure of the measuring system of the automatic optical testing machine will be lightly pa; the purified water will be injected into the height of the measuring tank to the violation of the tank; and the diluted pulp slag will be charged. Fill the tank to fill the tank and measure the fiber length of the slurry. The average fiber length of the sample is calculated according to the following formula: Σ a) The average fiber length counted is LN=i

Σμ2 Σ^*1!Σμ2 Σ^*1!

b)長度加權的平均纖維長度k = c)重量加權的平均纖維長度Lw = 其中： ln代表計數的平均纖維長度，b) length-weighted average fiber length k = c) weight-weighted average fiber length Lw = where: ln represents the average fiber length of the count,

Ll代表長度加權的平均纖維長度， Lw代表重量加權的平均纖維長度， 仏代表在一分量丨中的纖維數目， 11 1275535 h代表在一分量i中的平均纖維長度。 。亥重ϊ加權的平均纖維長度會被測定，而顯示出每單 位長度的纖維重量係正比於該纖維的長度。 5 、在則里中，一纖維長度分佈曲線及該粉碎紙漿樣品 、月开V曲線(Qg1Ve)會被該自動光學測試機所計算並示出。 、X粕砰紙漿的纖維長度分佈係數即為該重量加權的平 句、戴、、隹長度(w赚以計數的平均纖維長度⑽之商數，而得 以下列公式來表示： 10 15 20 戴、准長度分佈係數=〔重量加權的平均纖維長度(W)〕 /〔计數的平均纖維長度(M)〕 ♦ 纖、准長度分佈係數愈大，則該纖維長度分佈的範圍 忍大’而若該係數愈小’則其纖維長度分佈的範圍愈小。 、在本發明的容器紙板中，當該基礎紙板的正表面層部 ^被貼設頂覆帶來封閉供容納電子晶片之凹穴開口的 面异起，沿該紙板的厚度方向具有ΙΟΟμιη的厚度，且其 =維長度分佈紐被㈣扯犯⑽的範圍_，則不僅 ^亥頂覆帶被由該基礎紙板的正面來舰時可以減少毛屑 2生’且亦能抑止在該等凹穴的内側面中產生毛肩。藉 ^该基礎紙板之正表面層部份的纖維長度分佈範圍減至 =更小’則該紙板正表面層部份的紙漿纖維 會形成-致，而得減少一用來抑止產峰车眉μ南卞 , 產生毛屑之表面處理劑 合:分佈，該等表面處理劑係被塗覆在該正表面上並 :;二該基礎紙板的正表面層部份内，故該表面處理劑將 此-勾—致地塗覆並滲人該紙板内，而可阻止—用來將該 12 1275535 頂覆層黏接於基礎紙板上的黏劑滲入該紙板内，並可抑止 毛屑的產生。該基礎紙板之正表面層部份的纖維長度分佈 係數更好是在1·2〇至2.5的範圍内。 於本發明的密器紙板中，為將上述的纖維長度分佈係 ， 5數控制在1·20至3.20的範圍内，該紙漿的纖維長度及用於該 ^ 夕層紙板乂程中之漿料内的細纖維含量％將會被妥當地控 制，而該等漿料會被包含於所製成之多層紙板的眾多紙層 • 内。針對某些種類的紙漿，例如回收的紙漿和由多種不同 樹木製成之混合紙漿等，其本就會具有較高的纖維長度分 10佈係數，故會保留在一24網目之網幕上的粗紙漿纖維，及 會通過一 150網目之篩網的細紙漿纖維最好能由上述種類 的紙漿中被剔除。較好是，在該多層紙板中的每一紙層皆 能具有相同一致的紙漿纖維間隙結構。尤其是，該基礎紙 板由其正面沿厚度方向算起有10叫111厚度的頂面層部份， 15較好是包含具有較低纖維長度分佈係數的紙漿。即使該紙 • 漿具有低纖維長度分佈係數，但若該紙聚是僅由具有大纖 維長度的紙漿纖維所構成，或只由具有極短纖維長度的紙 • 漿纖維所構成，則在所造成的基礎紙板中亦極可能容易產 生毛屑。 20 具言之，該基礎紙板的正面層部份（沿厚度方向由正面 算起具有ΙΟΟμπι的厚度)較好是由重量加權平均纖維長度為 〇·60至1.70mm，更好是〇·60至1.50mm的紙漿所製成。 最好用來製造該多層式紙板之各紙層的紙漿全部皆由 具有相同纖維長度的紙漿纖維所構成。但是，可使用於本 13 1275535 發明之供容納電子晶片 & 7尽八紙板，當該多 層紙板A程係使用單-種類的紙滎來進行時，該製程的操 作效率會較低。當該紙板的正表層部份〉、儿 衣王木 » /〇予度方向由正面 算起具有ΙΟΟμπι的厚度，且包含一具有 數的紙漿，而該紙板的中間層部份係包人—、又^佈係 s 具有比該正表 二：更高纖維長度分佈係數的紙襞時’則藉控制所製成 的紙板之平均纖維長度分佈係數，將能製成—可供容納電 子晶片之容器紙板的基礎紙板，其能減少毛屬的產生 含減少操作效率。 10 15 20 ，可使用於本發明之料漿的種類並沒有限制。例如，化 學料聚、機械料漿、回收紙漿、非木質纖維料裝皆可單獨 =:或Γ種或更多種的混合物來使用。藉著使用該 亚文虽地配合各種類型的打黎機器，將可製成且有 所需纖維長度分佈係數及重量加權平均纖維長度的料衆。. 2的=有所需纖維長度分佈係數及重量加權平均纖維長 又、'斗水將可在打漿處理之後，使用、γ ^ ^ 絪心土 h «旻使用濾☆、網幕、或篩 田、：_和較細的紙漿纖維而來形成。在本發明中， 2肖24網目之網幕及-15G網目之篩網剔除該等 ㈣及較7纖維’而來形成-分級的紙漿。 “衣成本么明的多層式基礎紙板之各 維長度分佈係數、重旦“” 曰I氏水緘 重里加核平均纖維長度、及計數平均纖 L 一、又寺’係被以下來測定··將該多層式紙板分成多數的 單元紙層，粉砗号Γ夂一 MD早凡紙層，將所粉碎的紙漿纖維分散 在水中，再對該含水料漿進行上述各項係數的測量；但並 14 1275535 非在該等料漿中之每一種紙漿皆會被用來製成該多層式紙 板，因為在該多層式紙板的生產中，有一部份包含在該料 $内的細纖維將會被造紙線網所除去；因此，用來製造該 钱層的料漿巾之各種紙漿的纖維長度分佈係數、重量加 權^均、截維長度、及計數平均纖維長度等，並不一定相同 ^ 於最後構成該等紙層之各紙漿者。 #在本發明巾，該粉碎紙漿之纖維長度分佈係數、重量 ❿ 力°#平均纖維長度、及計數平均纖維長度等，係依據曰本 ΤΑΡΡ Νο· 52中所規定的自動光學法，使用一纖維長度分佈 忉測減機(商標.FiberLab，由KAJAANIK.K·所製造)來測定。 可用來製成本發明之容器紙板的基礎紙板之料漿的打 ' I機類型並沒有特別的限制，只要所製成的紙漿具有所需 • _維長度分佈餘和重量加權平均纖維長度即可。可使 用於本發明的打漿機包括各種不同類型的機器，例如打聚 15栈’ J〇rdan，Delux精製機(DF)，雙盤精製機(DDR)等。又， _ 騎漿_度亦沒有限制，只要能夠製成具有所需纖維長 度分佈係數及重量加權平均纖維長度的紙漿即可。為增加 ，形成紙板的特性，該紙漿最好具有大約25〇至55〇ml的加拿 大標準打漿度(Canadian Standard Freeness)。 20 本發明之容裔紙板的基礎紙板可擇地含有各種内部添 加劑。該等内部添加劑乃包括例如天然及人造的造紙用内 部上漿劑，如松脂上漿劑、苯乙烯順丁烯二酸、烷基乙烯 酮二聚物及稀烴丁二酸酐；各種紙張強化添加劑、滯留酸、 防水合劑例如聚酿胺多胺環氧氯丙烧，防起泡劑，填料例 15 1275535 如滑石和色料等。 在本發明的容紙板之基礎紙板中，為能加強該基礎 紙板對頂、底覆帶的黏合性質，及該基礎紙板的抑止產生 毛屑特性，在該基礎紙板的正面和背面會被選擇地塗層至 _ 5少一適當的化學物，其係例如選自：聚乙烯醇、澱粉、聚 丙烯酷胺、丙稀酸树月曰、本乙烯丁二烯樹脂、苯乙稀異戊 間二烯樹脂、聚酯樹脂、乙烯醋酸乙烯樹脂、及胺基甲酸 ^ 乙酯樹脂等。該化學物的塗覆係可使用例如條塗覆機、片 塗覆機、空氣刀塗覆機、桿塗覆機、閘輥塗覆機 、滾輪塗 10覆機例如上漿壓機或軋光塗覆機、尖刃塗覆機或Bel-Bapa 塗覆機等來完成。 用於本發明之容器紙板的基礎紙板的基本質量和厚度 會對應於被容納在該容器紙板中之電子晶片的尺寸來妥當 地構建。通常，該基礎紙板較好具有2〇〇至1〇〇〇g/m2的基本 15夤里及220至的厚度。因該基礎紙板較好具有上述 ❿ ㈤質量和厚度，㈣基礎紙板最好;彡層紙形成法來 製造，利用該方法將可輕易地使該基礎紙板獲得所需的外 . 觀和手感。 <範例> 2〇 本發明將藉以下各範例來進一步說明，它們並非用來 艮制本發明的範圍。在該等範例和比較例中，各物質的含 ^和〉辰度係根據固體或有效物質的質量來計算。又，以該 紙形成法所造成的紙板會先依1131>8111來預先處理，然後 再加以冽量和試驗。該重量加權平均纖維長度和纖維長度 16 1275535 分佈係數的測定方法，及該紙板對設於其中之凹穴内面所 產生的毛屑，或當一覆帶由該紙板剝除時所產生的毛屑等 之抑制性質的評估係如下所示·· (1) 重量加權平均纖維長度及纖維長度分佈特性的測定 5 方法： 一粉碎的紙漿之重量加權平均纖維長度(W)和計數+ 均纖維長度(M)係依據日本TAPPI No· 52之規定，將該粉碎 紙漿的含水漿液用一自動光學測試機（商標：Fiber Lab係由 KAJAANI Κ·Κ·所製）來測定。嗣，該粉碎紙漿的纖維長度 1〇分佈係數可由上述測出的重量加權平均纖維長度(W)和計 數平均纖維長度(M)來算出。 (2) 藉粉碎一容器紙板之基礎紙板的正表面層部份，其 冶忒板的厚度方向，由該基礎紙板的正面即可供黏接一覆 帶並具有凹穴開口以供容納及取出電子晶片的表面算起具 15有100μπι的厚度，來製成一紙漿並測定其纖維長度分佈係 數的方法： 一基礎紙板的樣品會被測量厚度Α(μηι)和基本質量 B(g/m2)，而該樣品的密度化化“)可由所測出的厚度和基本 質量值來算出。嗣，有兩片電絕緣帶（由3M公司所製，商標·· 2〇 Sc〇tCh電黏帶#5)會被黏附於該樣品的正面和背面，且該貼 有覆帶的樣品會被分成兩片，來形成該樣品之一正表層部 伤，其沿该樣品厚度方向由該樣品的表面算起會有1〇叫m 的厚度，令一紙張基本質量D = c(g/cm3)x〇〇lcm(=1〇〇^m) 而排除該黏帶質量。該樣品的正表層部份會依據JISP 8220 17 1275535 來在水中完全粉碎。所形成的粉碎紙漿之含水裝、、夜 一 被使用一自動光學測试機（商標·· Fiber Lah，± γ · ' 所製）來測定重量加權平均纖維長度(W)和計數平约纖、会 度(Μ)。由該重量加權平均纖維長度(W)和計數平均纖 度(M)的數據，將可算出該粉碎紙漿的纖維長度分佈係數" (3)在範例1至8及比較例1和2的紙板中形成凹穴，並评 估設在紙板中之凹穴内面的抑制產生毛屑特性·Ll represents the length-weighted average fiber length, Lw represents the weight-weighted average fiber length, 仏 represents the number of fibers in a component enthalpy, and 11 1275535 h represents the average fiber length in a component i. . The weight average fiber length will be determined, and the fiber weight per unit length is shown to be proportional to the length of the fiber. 5. In the middle, a fiber length distribution curve and the pulverized pulp sample and the monthly opening V curve (Qg1Ve) are calculated and shown by the automatic optical testing machine. The fiber length distribution coefficient of the X粕砰 pulp is the quotient of the weight-weighted flat sentence, wearing, and 隹 length (w earned by counting the average fiber length (10), and is expressed by the following formula: 10 15 20 wearing, Quasi-length distribution coefficient = [weight-weighted average fiber length (W)] / [counted average fiber length (M)] ♦ The larger the fiber and quasi-length distribution coefficient, the longer the fiber length distribution is. The smaller the coefficient, the smaller the range of fiber length distribution. In the container paperboard of the present invention, when the front surface layer of the base paper board is attached with a top cover, the cavity opening for accommodating the electronic chip is closed. The surface of the paper has a thickness of ΙΟΟμιη along the thickness direction of the paperboard, and its = dimension length distribution is (4) the range of (10) _, which is not only when the top cover is used by the front of the baseboard. Reducing the shavings 2 and also suppressing the generation of the bristle in the inner side of the pockets. By the fact that the fiber length distribution of the front surface layer portion of the base paperboard is reduced to = smaller, the cardboard front surface Part of the pulp fiber will form - a reduction in the surface treatment agent used to suppress the peaking of the eyebrows, the surface treatment agent is distributed, the surface treatment agent is coated on the front surface and: In the positive surface layer portion, the surface treatment agent coats and infiltrates the paperboard, and blocks the adhesion of the 12 1275535 top cladding layer to the base paperboard. The agent penetrates into the paperboard and suppresses the generation of the dander. The fiber length distribution coefficient of the front surface layer portion of the base paperboard is preferably in the range of 1.2 to 2.5. In the secret cardboard of the present invention In order to control the above fiber length distribution system, the number of 5 is controlled in the range of 1.20 to 3.20, and the fiber length of the pulp and the fine fiber content % in the slurry used in the process of the paperboard will be properly Ground control, and the slurry will be included in the numerous paper layers of the multi-layer paperboard produced. For certain types of pulp, such as recycled pulp and mixed pulp made from many different trees, etc. Will have a higher fiber length divided into 10 cloth coefficients, so it will remain The coarse pulp fibers on the screen of a 24 mesh, and the fine pulp fibers which pass through a 150 mesh screen are preferably removed from the pulp of the above type. Preferably, each paper in the multilayer cardboard The layers can all have the same uniform pulp fiber gap structure. In particular, the base paperboard has a top layer portion of 10 thickness 111 from the front side in the thickness direction, and 15 preferably contains a lower fiber length distribution coefficient. Pulp. Even if the paper pulp has a low fiber length distribution coefficient, if the paper is composed only of pulp fibers having a large fiber length, or only composed of paper pulp fibers having a very short fiber length, It is also very likely that brittle chips are easily generated in the resulting base paper. 20 In other words, the front layer portion of the base paper sheet (having a thickness of ΙΟΟμπι from the front in the thickness direction) is preferably a weight-weighted average fiber length. It is made of pulp of 60 to 1.70 mm, more preferably 60 to 1.50 mm. Preferably, the pulp used to make the paper layers of the multi-layer paperboard is all composed of pulp fibers having the same fiber length. However, it can be used for the electronic wafer & 7 paperboard of the invention of 13 1375535. When the multi-layer cardboard A process is carried out using a single-type paper cassette, the efficiency of the process is low. When the positive surface portion of the paperboard, the erection of the erection, the thickness of the »μπι from the front has a thickness of ΙΟΟμπι, and contains a pulp with a number, and the middle layer of the cardboard is tied to the person - And the fabric s has a higher fiber length distribution coefficient than the positive two: the average fiber length distribution coefficient of the paperboard produced by the control, which can be made into a container for accommodating the electronic wafer Cardboard baseboard, which reduces the production of hairs and reduces operational efficiency. 10 15 20 , the kind of slurry which can be used in the present invention is not limited. For example, chemical, mechanical, recycled, and non-wood fiber materials can be used alone or in combination of two or more. By using this Asian language to match various types of machines, it is possible to produce and have a desired fiber length distribution coefficient and a weight-weighted average fiber length. 2 = have the required fiber length distribution coefficient and weight-weighted average fiber length, 'Double water will be used after beating treatment, γ ^ ^ 絪心土 h «旻 use filter ☆, screen, or sieve field , : _ and finer pulp fibers are formed. In the present invention, the screen of the 2 Shaw 24 mesh and the screen of the -15G mesh reject the (4) and 7 fibers to form a graded pulp. "The distribution coefficient of each dimension of the multi-layer base paperboard with the cost of clothing is heavy," "I" is the average fiber length of the 里I's leeches, and the average fiber length is counted, and the temple is determined by the following. The multi-layer paperboard is divided into a plurality of unit paper layers, and the powdered pulp fibers are dispersed in water, and the above-mentioned various coefficients are measured; 14 1275535 Each of the pulps that are not in the slurry will be used to make the multi-layer paperboard, because in the production of the multi-layer paperboard, a portion of the fine fibers contained in the material will be The papermaking wire mesh is removed; therefore, the fiber length distribution coefficient, the weight weighting average, the cut length, and the average fiber length of the various pulps used to make the pulp layer of the money layer are not necessarily the same. Each of the pulps constituting the paper layers. In the present invention, the fiber length distribution coefficient, the weight ° force °#the average fiber length, and the count average fiber length of the pulverized pulp are based on 曰本ΤΑΡΡ ·ο· 52 The prescribed automatic optical method is determined by using a fiber length distribution measuring machine (trademark. FiberLab, manufactured by KAJAANIK.K.). It can be used to make the slurry of the base paperboard of the container paper of the present invention. The type is not particularly limited as long as the pulp produced has the required length and weight-weighted average fiber length. The beater used in the present invention can include various types of machines, such as poly 15 Stack 'J〇rdan, Delux refining machine (DF), double disc refiner (DDR), etc. Also, _ riding _ degree is not limited, as long as it can be made with the required fiber length distribution coefficient and weight-weighted average fiber length The pulp may be added. To increase the characteristics of the paperboard, the pulp preferably has a Canadian Standard Freeness of about 25 〇 to 55 〇 ml. 20 The base paperboard of the original cardboard of the present invention may optionally contain Various internal additives. These internal additives include, for example, natural and artificial internal sizing agents for papermaking, such as rosin sizing agents, styrene maleic acid, alkyl ketene II. And dilute hydrocarbon succinic anhydride; various paper strengthening additives, retention acid, waterproofing agent such as polyamine polyamine epoxidation, antifoaming agent, filler example 15 1275535 such as talc and colorant, etc. In the base paperboard of the paperboard, in order to strengthen the bonding property of the base paperboard to the top and bottom covering tapes, and the basic paperboard to suppress the generation of dander characteristics, the front and back sides of the base paperboard are selectively coated to _ 5 less suitable chemical, for example selected from the group consisting of: polyvinyl alcohol, starch, polypropylene amine, acrylic acid eucalyptus, the present ethylene butadiene resin, styrene isoprene resin, poly Ester resin, ethylene vinyl acetate resin, and urethane resin. The coating of the chemical may be, for example, a strip coater, a sheet coater, an air knife coater, a rod coater, a gate roll coater, a roller coater such as a sizing press or calendering. This is done by a coater, a sharp edge coater or a Bel-Bapa coater. The basic quality and thickness of the base paperboard used in the container paperboard of the present invention will be properly constructed corresponding to the size of the electronic wafer housed in the paperboard of the container. Usually, the base paperboard preferably has a thickness of from about 2 inches to about 1 inch g/m2 and a thickness of from about 20 inches to about 220 inches. Since the base paperboard preferably has the above-mentioned 五 (5) quality and thickness, (4) the base paperboard is preferably produced; the crepe paper forming method is used, and the method can easily obtain the desired outer appearance and feel of the base paperboard. <Examples> 2 The present invention will be further illustrated by the following examples, which are not intended to limit the scope of the invention. In these examples and comparative examples, the content of each substance and the degree of □ are calculated based on the mass of the solid or active substance. Further, the paperboard caused by the paper forming method is pretreated in advance according to 1131 > 8111, and then subjected to measurement and testing. The method for determining the weight-weighted average fiber length and the fiber length 16 1275535 distribution coefficient, and the chip generated by the paperboard on the inner surface of the pocket provided therein, or the chip generated when a cover tape is peeled off from the paperboard The evaluation of the inhibitory properties is as follows: (1) Determination of weight-weighted average fiber length and fiber length distribution characteristics 5 Method: Weight-weighted average fiber length (W) and count + average fiber length of a pulverized pulp ( M) The aqueous slurry of the pulverized pulp was measured by an automatic optical tester (trademark: Fiber Lab series manufactured by KAJAANI Co., Ltd.) in accordance with the Japanese TAPPI No. 52. That is, the fiber length 1 〇 distribution coefficient of the pulverized pulp can be calculated from the above-described weight-weighted average fiber length (W) and the average fiber length (M). (2) by smashing the front surface layer portion of the base paperboard of a container paperboard, the thickness direction of the metallurgical board is provided by the front side of the base paper board to be adhered and has a recess opening for receiving and taking out The surface of the electronic wafer is calculated to have a thickness of 100 μm to prepare a pulp and measure the fiber length distribution coefficient: a sample of the base paperboard is measured for thickness μ (μηι) and basic mass B (g/m 2 ) And the density of the sample "" can be calculated from the measured thickness and the basic mass value. 嗣, there are two pieces of electrical insulation tape (made by 3M company, trademark · · 2〇Sc〇tCh electric tape # 5) will be adhered to the front and back of the sample, and the coated sample will be divided into two pieces to form a positive surface flaw of the sample, which is calculated from the surface of the sample along the thickness of the sample. There will be a thickness of 1 m, so that the basic mass of a paper D = c (g / cm3) x 〇〇 lcm (=1 〇〇 ^ m) and the quality of the tape is excluded. Completely crushed in water according to JISP 8220 17 1275535. The hydrated pulp formed by the water, night The weight-weighted average fiber length (W) and the count-flat fiber, the degree of convergence (Μ) were measured using an automatic optical tester (trademark··················· The fiber length (W) and the count average fineness (M) data, the fiber length distribution coefficient of the pulverized pulp can be calculated " (3) the pockets are formed in the cardboards of Examples 1 to 8 and Comparative Examples 1 and 2, and Evaluation of the suppression of the inner surface of the pockets in the cardboard to produce dander characteristics

在各範例1至8及比較例1和2中，會由所造成的容器紙 板取出一樣品，並切成8mm寬的條帶。在所切成的條帶中， ίο有眾多矩形的貫孔會被使用一打孔機（商標：twa_65〇()， 由TOKYO WELLS Κ·Κ·所製）依據JIS c D8〇6_3的規定沿 該條帶的縱向以2mm的間隔來製成，該各貫孔在該條帶的 橫向會有1.12mm的長度，而在該條帶的縱向會有〇 62mm的 見度。在該等貫孔的内面可使用放大鏡來觀察，而以肉眼 15來評估該紙板的抑制產生毛屑特性。其評估結果會被分成 下列五個等級： —_U產生肤況_____ 未發現有毛屑 每1.12mm寬會發現1至3片毛屑 每1.12mm寬會發現3至1〇片毛屑 每1.12mm寬會發現11至20片毛屑 每1.12mm寬會發現21片或更多的毛屑 ()在範例9製成的紙板中形成凹穴，並評估該纸板凹穴 18 1275535 内面的抑止產生毛屑特性： 由範例9製成之紙板取出的樣品會被士刀成8顏寬的 條帶。依據JIS C D8〇6_3的規定，有許多直徑^ 54_而 間隔4咖的_凹穴，及許多沿該帶橫向有G.66mm長度， 而沿該帶縱向有〇.36mm寬度，且沿該帶深度方向有⑴”以瓜 深度的矩形凹穴（壓槽）會以2疆的_來製設在該紙板帶 中。該等凹穴的内面會被使用放大鏡來觀察，而以肉眼來In each of Examples 1 to 8 and Comparative Examples 1 and 2, a sample was taken out from the resulting container paper and cut into strips of 8 mm width. Among the cut strips, ίο has a large number of rectangular through holes that will be used with a punch (trademark: twa_65〇(), manufactured by TOKYO WELLS Κ·Κ·) according to JIS c D8〇6_3 The longitudinal direction of the strip is made at a spacing of 2 mm, which has a length of 1.12 mm in the transverse direction of the strip and a 〇62 mm visibility in the longitudinal direction of the strip. The inner surface of the through holes can be observed using a magnifying glass, and the inhibition of the paperboard by the naked eye 15 is used to evaluate the shaving characteristics. The results of the evaluation will be divided into the following five grades: - _U produces skin condition _____ No hair debris found. Every 1.12 mm wide will find 1 to 3 pieces of dander. Each 1.12 mm wide will find 3 to 1 piece of dandruff per 1.12 A width of mm will find that 11 to 20 pieces of dander will find 21 or more pieces of dross per 1.12 mm wide () forming a pocket in the paperboard made of Example 9, and evaluating the suppression of the inner surface of the cardboard pocket 18 1275535 Debris Characteristics: Samples taken from the cardboard made in Example 9 will be cut into 8 strips by a knife. According to the provisions of JIS C D8〇6_3, there are a plurality of _ pockets having a diameter of 54 Å, and a plurality of yags having a length of G.66 mm along the lateral direction of the belt, and a width of 〇36 mm along the longitudinal direction of the belt, and along the Rectangular pockets (pressure grooves) with a depth of (1)" in the depth direction will be made in the cardboard belt in the form of a ridge. The inner faces of the pockets will be observed with a magnifying glass, but with the naked eye.

°平估其抑制產生毛料性。餅估結果會被錢下列玉個 等級： __毛屑產生狀況___ 1 未發現有毛屑 2 每〇.66mm寬會發現1至3片毛屑 3 每〇.66mm寬會發現3至10片毛屑 4 每〇.66mm寬會發現11至20片毛屑 5 每〇.66mm寬會發現21片或更多的毛屑 (5)當一頂覆帶被由紙板剝除時，該紙板之抑制產生毛 屑特性的評估計： 範例9之紙板的樣品會被切割成8mm寬的條帶。一頂覆 2〇 T(商標：Cover tape No· 318H-14A，由 NITTO DENKO Κ·Κ· 所製）會被以19CTC的熱封溫度，在0.49MPa的熱封壓力下， 使用一熱封機（商標：TW A 6600，由 TOKYO WELLS K.K. 所製），以3m/min的熱封速度來熱黏合於該紙板帶的正面。 該貼有覆帶的紙板帶會被保留在大氣中1個小時。嗣該頂覆 19 1275535 帶會被以180。的剝離角度和300mm/min的剝離速度來由該 紙板帶的正面剝除。 如此與該頂覆帶分開的紙板頂面會被使用放大鏡來觀 祭，而以肉眼評估該紙板正面的抑制產生毛屑特性。其評 5 估結果會被分成下列五個等級： 等級 --毛-屑產主散況 1 未發現有毛屑 2 每10mm的剝除距離會發現1至3片毛屑 3 每10mm的剝除距離會發現4至1〇片毛屑 4 每10mm的剝除距離會發現ns2〇片毛屑 5 (範例1) 每10mm的剥除距離會發現21片或更多的毛屑 一具有三層結構的紙板會被製成，該各層的紙漿成分 15互不相同。該紙板之正面、中間及背面各層的紙漿分別如 下來備製。 針對该正面層，30%質量的軟樹牛皮紙漿A(含有一部 份細紙漿纖維具有〇.2mm或更小的纖維長度而占未打漿之 纸聚質量的3.2%，25μηι的纖維寬度，及3 1〇mm的平均纖維 20長度）及7〇%質量之由橡膠樹製成的破碎硬樹牛皮紙漿B， 其含有一部份細紙漿纖維具有〇2mm或更小的纖維長度而 占未打漿之紙漿貝畺的2.5%，i3pm的纖維寬度，及〇 85mm 的平均纖維長度，4兩者A與B會互相混合，並在雙盤精製 機内被打漿來形成-具有加拿大標準打漿度(CSF)48〇]_ 20 1275535 紙漿。針對該中間層，則10%質量的軟樹牛皮紙漿A和90% 裊量的漂白硬樹牛皮紙漿B會被混合並在雙盤精製機中打 漿，而來形成一 CSF為410ml的紙漿。針對該背面層，則一 漂白的硬樹破碎牛皮紙漿B將會單獨在一雙盤精製機内打 5漿，而來形成一CSF為480ml的紙漿。該各紙漿之含水漿液 將會混合0.94%質量的硫酸鋁，0.45%質量的松脂乳膠上漿 劑（商標：SIZEPAIN N-771 ，由 ARAKAWA φ KAGAKUKOGYO Κ_Κ·所製），及0.60%質量的聚丙烯醯胺 紙張強化劑（商標：POLYSTRON 117，由ARAKAWA 10 KAGAUKOGYO Κ.Κ·所製），上述各質量％皆為與該紙漿的 乾質量之對比量。 該二種漿料會被送至一製造三層複合紙板的Yankee造 紙機，而來製成一三層紙板，包含一正面層具有l〇〇g/m2的 基本質量，一中間層具有200g/m2的基本質量，及一背面層 15具有5〇Wm2的基本質量，它們會互相疊合。如此造成的紙 # 板會被使用一上漿壓機來覆以一聚乙烯醇，其在L0g/m2的 乾塗層量中會有98莫耳％的皂化度及1〇00的聚合度，然後 • 會被以一連接於該造紙機的光滑機（軋光機）來平滑化。如此 製成之可谷納電子晶片之容器紙板的基礎紙板會具有 20 35〇g/m2的基本質量及0.42mm的厚度。在該基礎紙板中，有 許多供容裝電子晶片的凹穴會被以前述方法來製成。 由該容器紙板之基礎紙板製成的粉碎紙漿之重量加權 平均纖維長度、計數平均纖維長度、及纖維長度分佈係數 等皆會由前述的測量方法來測定；而設在該紙板中之凹穴 21 1275535 内面，及當頂覆帶由該紙板正面剝除時該正面的抑制產生 毛屑特性，則會被以前述的評估方法來評估。該等紙漿成 分係被示於表1。其測量及評估結果係示於表2。 (範例2) - 5 一具有三層結構的紙板會被製成，其各層的紙漿成分 - 係互不相同。該紙板之正面、中間及背面層的紙漿係如下 來製備。 # 針對該正面層，30%質量之軟樹牛皮紙漿c(含有一部 份纖維長度為〇.2mm或更小的細紙漿纖維占未打漿之紙漿 10纖維質量的25%，纖維寬度為23μιη，而平均纖維長度為 2.83mm)，及70%質量之漂白的硬樹牛皮紙漿Β會被互相混 合’並在一雙盤精製機中打漿來形成具有48〇m^CSF的紙 漿。針對該中間層，10%質量之軟樹牛皮紙漿C和9〇%質量 的漂白硬樹牛皮紙漿B會被互相混合，並在一雙盤精製機中 15打漿來形成一具有410ml之CSF的紙漿。針對該背面層，一 Φ 單獨的漂白硬樹破碎牛皮紙漿B會在一雙盤精製機中被打 漿來形成一具有480ml之CSF的紙漿。該等紙漿會被饋入如 _ 同範例1的多層紙板製程中，而來製成一可供容裝電子晶片 之谷裔紙板的基礎紙板。由該基礎紙板，一容器紙板將會 20以如同範例1的方式來被製成。該等紙漿成分係示於表1 中。而其測量和評估結果係示於表2中。 (範例3) 一具有三層結構而各層之紙漿成分互不相同的紙板會 被製成。該紙板之正面、中間及背面層的紙漿係如下來備 22 1275535° It is estimated that its inhibition produces wooliness. The cake evaluation result will be the following jade grades: __Dust production status ___ 1 No debris found 2 Every 〇.66mm wide will find 1 to 3 pieces of shavings 3 Each 〇.66mm wide will find 3 to 10 Piece of shavings 4 will find 11 to 20 pieces of shavings per 〇.66mm wide. Each piece of 〇.66mm will find 21 or more pieces of shavings. (5) When a top covering is peeled off by cardboard, the board An evaluation meter that suppresses the generation of shaving characteristics: The sample of the cardboard of Example 9 is cut into strips of 8 mm width. A top cover 2〇T (trademark: Cover tape No. 318H-14A, manufactured by NITTO DENKO Κ·Κ·) will be sealed at a heat seal temperature of 19 CTC at a heat seal pressure of 0.49 MPa. (Trademark: TW A 6600, manufactured by TOKYO WELLS KK), heat-bonded to the front side of the paperboard tape at a heat sealing speed of 3 m/min. The taped cardboard tape will be kept in the atmosphere for 1 hour.顶The top cover 19 1275535 band will be 180. The peel angle and the peel speed of 300 mm/min were stripped from the front side of the cardboard strip. The top surface of the cardboard thus separated from the top cover tape is observed by a magnifying glass, and the suppression of the front side of the cardboard is visually evaluated to produce dander characteristics. The results of the evaluation 5 will be divided into the following five grades: Grade--Mao-chips Dispensing condition 1 No shavings found 2 Every 10 mm stripping distance will find 1 to 3 pieces of shavings 3 Every 10 mm stripping The distance will be 4 to 1 毛 毛 毛 每 每 每 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns The paperboard will be made and the pulp components 15 of the layers will be different from each other. The pulp of each of the front, middle and back layers of the paperboard is prepared separately. For the front layer, 30% by mass of soft kraft pulp A (containing a portion of fine pulp fibers having a fiber length of 2 mm or less and accounting for 3.2% of the mass of the unbeaten paper, a fiber width of 25 μm, and 3 1〇mm average fiber length 20) and 7〇% by mass of broken hardwood kraft pulp B made of rubber tree, which contains a part of fine pulp fibers having a fiber length of 〇2 mm or less and accounting for unbeaten 2.5% of pulp shellfish, fiber width of i3pm, and average fiber length of 〇85mm, 4 A and B will mix with each other and be beaten in a double-disc refiner to form - with Canadian Standard Freeness (CSF) 48 〇]_ 20 1275535 pulp. For the intermediate layer, 10% by mass of soft kraft pulp A and 90% by weight of bleached hard kraft pulp B were mixed and slurried in a double-disc refiner to form a CSF of 410 ml of pulp. For this back layer, a bleached hard-tree-breaking kraft pulp B will be separately pumped in a double-dish refiner to form a pulp having a CSF of 480 ml. The aqueous slurry of each pulp will be mixed with 0.94% by mass of aluminum sulfate, 0.45% by mass of rosin latex sizing agent (trademark: SIZEPAIN N-771, manufactured by ARAKAWA φ KAGAKUKOGYO Κ_Κ·), and 0.60% by mass of polypropylene. A guanamine paper strengthener (trademark: POLYSTRON 117, manufactured by ARAKAWA 10 KAGAUKOGYO Κ.Κ), each of the above-mentioned mass% is a comparative amount with the dry mass of the pulp. The two slurries are sent to a Yankee paper machine for the manufacture of three-layer composite paperboard to form a three-layer paperboard comprising a front layer having a basic mass of l〇〇g/m2 and an intermediate layer having a thickness of 200 g/ The basic mass of m2, and a back layer 15 having a basic quality of 5 〇 Wm2, will overlap each other. The paper # board thus produced is coated with a polyvinyl alcohol using a sizing press, which has a saponification degree of 98 mol% and a polymerization degree of 1 00 in a dry coating amount of L0g/m2. Then • will be smoothed with a smoothing machine (calender) attached to the paper machine. The base paperboard of the container paper of the thus made Konova electronic wafer has a basic mass of 20 35 〇g/m 2 and a thickness of 0.42 mm. In the base paperboard, a plurality of pockets for housing the electronic wafer are produced in the aforementioned manner. The weight-weighted average fiber length, the count average fiber length, and the fiber length distribution coefficient of the pulverized pulp made of the base paperboard of the container paperboard are all determined by the aforementioned measuring method; and the pocket 21 provided in the paperboard The inner surface of 1275535 and the shading characteristics of the front side when the top cover tape is peeled off from the front side of the paperboard are evaluated by the aforementioned evaluation method. These pulp components are shown in Table 1. The measurement and evaluation results are shown in Table 2. (Example 2) - 5 A cardboard having a three-layer structure is produced, and the pulp components of the respective layers are different from each other. The pulp of the front, middle and back layers of the paperboard was prepared as follows. # For this front layer, 30% quality soft kraft pulp c (containing a part of the fiber length of 〇.2mm or less fine pulp fibers accounted for 25% of the unbleached pulp 10 fiber mass, fiber width 23μιη, The average fiber length was 2.83 mm), and 70% by mass of the bleached hard kraft pulp was mixed with each other' and beaten in a double-dish refiner to form a pulp having 48 〇m ^ CSF. For the intermediate layer, 10% by mass of soft kraft pulp C and 9% by mass of bleached hardwood kraft pulp B were mixed with each other and 15 beaten in a double disc refiner to form a pulp having 410 ml of CSF. . For the backside layer, a Φ individual bleached hardwood crushed kraft pulp B is slurried in a double disc refiner to form a pulp having 480 ml of CSF. The pulp is fed into a multi-layer paperboard process as in Example 1 to form a base paperboard for the packaging of the electronic chip. From the base paperboard, a container of cardboard 20 would be made in the same manner as in Example 1. The pulp components are shown in Table 1. The measurement and evaluation results are shown in Table 2. (Example 3) A paperboard having a three-layer structure in which the pulp compositions of the respective layers are different from each other is produced. The pulp on the front, middle and back layers of the board is prepared as follows 22 1275535

ο 針對该正面層，該漂白的硬樹牛皮紙漿Β會單獨在一雙 盤精衣機中被打漿來形成一450ml CSF的紙漿。針對該中間 層，該漂白的硬樹牛皮、紙漿B亦會單獨在-雙盤精製機中來 ，5打漿形成一410mlCSF的紙漿。針對該背面層，則一漂白的 - 划树碎牛皮紙漿1^單獨在-雙盤精製機中打漿來形成 一460ml CSF的紙漿。該等紙漿會被饋入如同範例1的多層 • 紙板製程中’而來製成一可供容裝電子晶片之容器紙板的 基礎紙板。由該基礎紙板，一容器紙板會被以如同範例1的 10方式來製成。該等紙漿的成分係被示於表丨。而其測量和評 估的結果係被示於表2中。 (範例4) 一具有二層結構而各層之紙漿成分互不相同的紙板會 被製成。該紙板之正面、中間及背面層的紙漿係如下來備 15 製。 _ 針對該正面層’ 40%質量的軟樹牛皮紙漿A和60%質量 之由橡膠樹製成的破碎硬樹牛皮紙漿B會被互相混合，並在 一雙盤精製機中打漿來形成一480ml CSF的紙漿。針對該中 間層，10%質量的軟樹牛皮紙漿A和90%質量之漂白的硬樹 " 20牛皮紙漿^(含有一部份纖維長度為0.2mm或更小的細紙敷 纖維占未打漿之紙漿質量的6.8%，紙漿寬度為Ι6μιη，而平 均紙漿長度為會被互相混合，而在一雙盤精製機中 被打漿來形成一410mlCSF的紙漿。針對該背面層，則漂白 的硬樹牛皮紙漿B會單獨在一雙盤精製機中被打漿形成一 23 1275535 480ml的紙漿。該各紙漿的含水漿液會被混合〇 94%質量的 硫酸铭’一0.45%質量的松脂乳膠上漿劑（商標：siZEPAIN N-771，由 ARAKAWA KAGAKUKOGYO γ γ所製），及一 0.60%質5:的聚丙稀酿胺紙張強化劑（商標：pqlystroN 一 5 117，由 ARAKAWA KAGAUKOGYO K.K.所製），上述各質 ▲ 量％係依該紙漿的乾質量比率計量。 該三種漿液會被供入一三層複合紙板的Yankee造紙機 φ 中，而來製成一三層紙板，其包含一正面層具有100§/1112的 基本質量，一中間層具有200g/m2的基本質量，及一背面層 10具有5〇g/m2的基本質量，它們會互相疊合。所造成的紙板 會被使用一上漿壓機來覆以一聚乙烯醇，其在l 的乾 塗層ΐ會具有88莫耳％的皂化度及1700的聚合度，然後以 一連接該造紙機的光滑機（軋光機）來平滑化。如此製成之可 容裝電子晶片的容器紙機之基礎紙板會具有35〇g/m2的基 15本質置及0.42mm的厚度。由該基礎紙板，一可供容裝電子 • 晶片的容器紙板將能以如同範例1的方式來製成。 所製成的紙板會接受如同範例丨的測量和評估。該等紙 一 漿成分係不於表1。而測量和評估結果則示於表2。 (範例5) 20 -具有三層結構其各層紙漿成分互不相同的紙板會被 衣成I、氏板之正面、中間、及背面層的紙漿係如下來備 製。 針對該正面$，3〇%質量之軟樹牛皮紙裝A和观質量 之由橡膠樹製成的破碎硬樹牛皮紙㈣其含有-部份纖維 24 1275535 長度為〇.2mm或更小的細紙漿纖維占未打漿之紙漿質量的 3.7%，纖維寬度為19μηι，及平均纖維長度為〇 86mm)會被 互相混合並在一雙盤精製機中來打漿而形成一48〇ml CSF 的紙漿。針對該中間層，1〇%質量的軟樹牛皮紙漿八和9〇% 5貝里之漂白的硬樹牛皮紙漿E會被互相混合，並在一雙盤精 製機中打漿來形成一4i〇micSF的紙漿。針對該背面層，則 僅有該漂白的硬樹破碎牛皮紙漿£會在一雙盤精製機中被 打漿來形成一 4 8 〇 m丨c s F的紙漿。該等紙漿會被饋入如同範 例1的夕層紙板製程中，而來製成一可容納電子晶片之容器 10紙板的基礎紙板。由該基礎紙板，一容器紙板將會以如同 範例1的方式來被製成。該等紙漿成分係示於表i。而其測 里和n平估結果係不於表2中。 (範例6) 一具有三層結構而各層之紙漿成分互不相同的紙板會 15被製成。該紙板之正面、中間、及背面層的紙漿係如下來 備製。 針對該正面層，30%質量的軟樹牛皮紙漿F(含有一部份 纖維長度為0.2mm或更小之細紙漿纖維占未打漿之紙漿質 量的4.5%，纖維寬度為24μιη，平均纖維長度為2 67mm)及 20 70%質量之漂白硬樹牛皮紙漿D會被互相混合，並在一雙盤 精裝技:内打漿來形成一 470ml CSF的紙聚。針對該中間層， 10%質量之軟樹牛皮紙漿F及90%質量的漂白硬樹牛皮紙漿 D會被互相混合，並在一雙盤精製機中打漿來形成一 的紙漿。針對該背面層，則漂白的硬樹破碎牛皮紙漿〇會單 25 1275535 獨在一雙盤精製機中被打漿來形成一48〇mi CSF的紙漿。該 等紙漿會被饋入如同範例1的多層紙板製程中，而製成一可 容納電子晶片之容器紙板的基礎紙板。由該基礎紙板，一 容器紙板會如同範例1的方式來被製成。該等紙漿成分係被 _ 5示於表1。其測量及評估結果則被示於表2中。 _ (範例7) 一具有二層結構而各層之紙漿成分互不相同的紙板會 φ 被製成。該紙板的正面、中間及背面層之紙漿係如下來備 製。 10 針對該正面層，30%質量之軟樹牛皮紙漿A和70%質量 之由橡膠樹製成的破碎硬樹牛皮紙漿E會被互相混合，並在 一雙盤精製機中打漿來形成一48〇ml CSF的紙漿。針對該中 間層，10%質量之軟樹牛皮紙聚A和9〇%質量的漂白硬樹牛 皮紙漿E會被互相混合，並在—雙盤精製機中打漿來形成一 15 41_CSF的紙漿。針對該背面層，則—漂白的硬樹破碎牛 # 纟紙漿时在一雙盤精製機中被打浆來形成-480ml CSF的 紙水°亥正面、中間及背面層的紙漿會被使用一Baua磁體 . 測試機來除去存留在—24網目網幕上的粗纖維及穿過一 150網目篩網的細纖維，而依據丁八1^1丁233 hm_82來分級。 20 該等紙漿會被饋入如同範例16勺多層紙板製程中，來製 成可谷、、、内私子日日片之各器紙板的基礎紙板。由該基礎紙 板’ H紙板會被以如同範例㈤方式來製成。該等紙聚 成分係被不於表1。其測量和評估結果則被示於表2。 (範例8) 26 1275535 一具有三層結構而各層之紙漿成分互不相同的紙板會 被製成。該紙板之正面、中間及背面層的紙漿係如下來備 製。ο For this front layer, the bleached hard-tree kraft pulp is separately beaten in a double-disher to form a 450 ml CSF pulp. For the intermediate layer, the bleached hard bark and pulp B were also separately used in a double-dish refiner, and 5 beats to form a 410 ml of CSF pulp. For this backing layer, a bleached-tree shredded kraft pulp was separately beaten in a double-dish refiner to form a 460 ml of CSF pulp. The pulp is fed into a multi-layer cardboard process as in Example 1 to form a baseboard for the container of the electronic wafer. From the base paperboard, a container of cardboard can be made in a manner similar to that of the example 1. The composition of these pulps is shown in the table. The results of their measurements and evaluations are shown in Table 2. (Example 4) A paperboard having a two-layer structure in which the pulp compositions of the respective layers are different from each other is produced. The pulp of the front, middle and back layers of the paperboard is prepared as follows. _ For the front layer '40% of soft kraft pulp A and 60% by mass of broken hard kraft pulp B made of rubber tree will be mixed with each other and beaten in a double-dish refiner to form a 480ml CSF Pulp. For the intermediate layer, 10% by mass of soft-tree kraft pulp A and 90% by mass of bleached hardwood " 20 kraft pulp^ (containing a portion of fine paper fibers having a fiber length of 0.2 mm or less as unslurry The pulp quality is 6.8%, the pulp width is Ι6 μιη, and the average pulp length is mixed with each other, and is beaten in a double-dish refiner to form a 410 ml CSF pulp. For the back layer, the bleached hard-tree kraft pulp B will be separately beaten in a double-disc refiner to form a 23 1275535 480 ml pulp. The aqueous slurry of each pulp will be mixed with 94% by mass of sulfuric acid Ming 'a 0.45% by mass rosin latex sizing agent (trademark: siZEPAIN N-771, manufactured by ARAKAWA KAGAKUKOGYO γ γ), and a 0.60% quality 5: polyacrylamide paper fortifier (trademark: pqlystroN-5 117, manufactured by ARAKAWA KAGAUKOGYO KK), the above ▲ % is measured according to the dry mass ratio of the pulp. The three slurries are fed into a Yankee paper machine φ of a three-layer composite paperboard to form a three-layer paperboard comprising a front layer having 100 §/1112 Basic Quality, an intermediate layer having a basic mass of 200 g/m2, and a backing layer 10 having a basic mass of 5 〇g/m2, which are superposed on each other. The resulting cardboard is covered with a sizing press. Polyvinyl alcohol, which has a saponification degree of 88 mol% and a degree of polymerization of 1700 in a dry coating of 1, and is then smoothed by a smoothing machine (calender) connected to the paper machine. The base paperboard of a container paper machine that can accommodate electronic wafers will have a base of 35 〇g/m2 and a thickness of 0.42 mm. From the base paperboard, a container paperboard for accommodating electronic wafers can be The paperboard was prepared in the same manner as in Example 1. The paperboard produced was subjected to measurement and evaluation as in the example. The paper pulp composition was not shown in Table 1. The measurement and evaluation results are shown in Table 2. (Example 5) 20 - A paperboard having a three-layer structure in which the pulp compositions of the respective layers are different from each other will be prepared as follows: the front, middle, and back layers of the pulp are prepared as follows. For the front $, 3〇% of the quality of the soft Tree kraft paper A and view quality of broken hardwood kraft paper made of rubber tree (4) It contains - part of fiber 24 1275535 Length of pulp paper of length 〇.2mm or less, 3.7% of the mass of unbeaten pulp, fiber width of 19μηι, and average fiber length of 〇86mm) will be mixed with each other A pair of disc refiners were used to beat to form a 48 〇ml CSF pulp. For the intermediate layer, 1% by mass of soft-tree kraft pulp 8 and 9〇% 5 berries of bleached hard-tree kraft pulp E are mixed with each other and beaten in a double-dish refiner to form a 4i〇micSF Pulp. For this backing layer, only the bleached hard-tree broken kraft pulp will be beaten in a double-plate refiner to form a pulp of 4 8 〇 m丨c s F. The pulp is fed into a blanket process as in Example 1 to form a baseboard for holding the electronic wafer container 10 cardboard. From the base paperboard, a container paperboard will be made in the same manner as in Example 1. These pulp components are shown in Table i. The results of the measurement and n-level estimation are not in Table 2. (Example 6) A paperboard having a three-layer structure in which the pulp compositions of the respective layers are different from each other was produced. The pulp of the front, middle, and back layers of the paperboard is prepared as follows. For the front layer, 30% by mass of soft kraft pulp F (containing a portion of fine pulp fibers having a fiber length of 0.2 mm or less, accounting for 4.5% of the mass of the unbeaten pulp, a fiber width of 24 μm, and an average fiber length of 2 67mm) and 20 70% by mass of bleached hardwood kraft pulp D will be mixed with each other and beaten in a double-disc fit: to form a 470ml CSF paper. For the intermediate layer, 10% by mass of softwood kraft pulp F and 90% by mass of bleached hardwood kraft pulp D were mixed with each other and beaten in a double-dish refiner to form a pulp. For this back layer, the bleached hard-tree broken kraft pulp will be 25 2575535 and beaten in a double-dish refiner to form a 48 〇mi CSF pulp. The pulp is fed into a multi-layer paperboard process as in Example 1 to form a base paperboard that holds the cardboard of the electronic wafer. From the base paperboard, a container board would be made in the same manner as in Example 1. These pulp components are shown in Table 1. The measurement and evaluation results are shown in Table 2. _ (Example 7) A paperboard having a two-layer structure in which the pulp compositions of the respective layers are different from each other is produced. The pulp of the front, middle and back layers of the paperboard is prepared as follows. 10 For the front layer, 30% by mass of softwood kraft pulp A and 70% by mass of broken hardwood kraft pulp E made of rubber trees are mixed with each other and beaten in a double-dish refiner to form a 48〇 Ml CSF pulp. For the intermediate layer, 10% by mass of soft-tree kraft paper A and 9% by mass of bleached hard-tree kraft pulp E were mixed with each other and beaten in a double-dish refiner to form a 15 41_CSF pulp. For the back layer, the bleached hard-tree broken cattle #纟 pulp is beaten in a double-plate refiner to form -480ml CSF paper water. The front, middle and back layers of pulp are used with a Baua magnet. The test machine was used to remove the coarse fibers remaining on the -24 mesh screen and the fine fibers passing through a 150 mesh screen, and classified according to Ding 8 1 1 233 hm _ 82. 20 The pulp will be fed into a multi-ply paperboard process such as the 16-pile multi-layer paperboard process to make the base paperboard for each of the paperboards of the Valley, and Inner Private Days. From the base paperboard 'H-board, it will be made in the same manner as in the example (5). These paper polymerization components are not shown in Table 1. The measurement and evaluation results are shown in Table 2. (Example 8) 26 1275535 A paperboard having a three-layer structure in which the pulp compositions of the respective layers are different from each other is produced. The pulp of the front, middle and back layers of the paperboard is prepared as follows.

針對該正面層，30%質量的軟樹牛皮紙漿A，及70%質 ^ 5里之由橡膠树製成的破碎硬樹牛皮紙漿E，會被依TAPPI • T233 hm__82來分級，而使用一Baua磁體測試機來除去留存 在一 24網目網幕上的粗纖維，及會穿過一 15〇網目篩網的細 φ 纖維；然後互相混合並在一雙盤精製機中打漿來形成一 480ml CSF的紙漿。針對該中間層，1〇%質量的軟樹牛皮紙 10漿A和90%貝i之漂白的硬樹牛皮紙漿e會被依TAPPI T233 hm-82來分級’而使用一Baua磁體測試機除去會留存在一 ％ 網目網幕上的粗纖維，及會穿過一 15〇網目篩網的細纖維， 然後互相混合並在一雙盤精製機中打漿來形成一 41〇如 CSF的紙漿。針對該背面層，該漂白的硬樹牛皮紙漿e會依 15 TAPPI T233 hm_82來分級。而使用_Baua磁體測試機除去 Φ 會留存在一24網目網幕上的粗纖維，及會穿過一 150網目篩 網的細纖維，然後在一雙盤精製機中打漿來形成一具有 # 480ml CSF的紙漿。該等紙漿會被饋入如同範例丨的多層紙 板製程中，來製成一可供容納電子晶片的容器紙板之基礎 20紙板。由該基礎紙板，一容器紙板將會以如同範例1的方式 末被‘成。该寻紙漿的成分係被示於表1。其測量及評估結 果則被不於表2中。 (範例9) 一具有三層結構而各層的紙漿成分互不相同的紙板會 27 1275535 被製成。該紙板之正面、中間及背面層的紙漿係如下來備 製。 針對該正面層，僅有漂白的硬樹牛皮紙漿B會在一雙盤 精製機中被打漿來形成一具有4 5 0m 1 C S F的紙漿。針對該中 5 間層，只有該漂白的硬樹牛皮紙漿B會在一雙盤精製機中被 打漿來形成一具有410ml CSF的紙漿。針對該背面層，亦只 有該紙漿B會在一雙盤精製機中被打漿來形成一具有460ml CSF的紙漿。該等紙漿會被饋入如同範例1之多層紙板製程 中，而來製成一可容納電子晶片之容器紙板的基礎紙板。 10 由該基礎紙板，一容器紙板會以如同範例1的方式來被製 成。 其測量及評估結果係被示於表2中。 (比較例1) 一具有三層結構且各層之紙漿成分互不相同的紙板會 15 被製成。該紙板之正面、中間、及背面層的紙漿係如下來 備製。 針對該正面層，50%質量之軟樹牛皮紙漿F及50%質量 之漂白的硬樹牛皮紙漿D會被互相混合，並在一雙盤精製機 中打漿來形成一480ml CSF的紙漿。針對該中間層，10%質 20 量的軟樹牛皮紙漿F和90%質量的漂白硬樹牛皮紙漿D會被 互相混合，並在一雙盤精製機中打漿而來形成一410ml CSF 的紙漿。針對該背面層，該漂白的硬樹牛皮紙漿D會在一雙 盤精製機中打漿來形成一480ml CSF的紙漿。該等紙漿會被 饋入如同範例1的多層紙板製程中，而來製成一可供容納電 28 1275535 子晶片之容器紙板的基礎紙板。由該基礎紙板、/容器紙 板會以如同範例1的方式來製成。該等紙漿成分係示於表 1。其測ϊ及评估結果係示於表2中。 (比較例2) ^ 5 一具有二層結構而各層之紙漿成分不同的紙板會被製 • 成。該紙板之正面、中間及背面層的紙漿係如下來備製。 針對該正面層，30%質量之軟樹牛皮紙漿G(包含一部 φ 份纖維長度為〇.2inm或更小的細紙漿纖維占該未打漿紙漿 夤里的7.2% ’纖維見度為21 μπι，平均纖維長度為3.25mm)， 10及70%質量之由橡膠樹製成的漂白硬樹牛皮紙漿h(包含一 部份纖維長度為0.2mm或更小的細紙漿纖維占該未打漿紙 漿質量的7%，纖維寬度為i7pm，平均纖維長度為1〇5111111)， 會被互相混合而在一雙盤精製機中打漿來形成一具有 480ml CSF的紙漿。針對該中間層，1〇%質量的軟樹牛皮紙 15漿E和90%質量之漂白的硬樹牛皮紙漿H會被互相混合，而 φ 在一雙盤精製機中打漿來形成一410ml CSF的紙漿。針對該 背面層，則只有該紙漿Η會在一雙盤精製機中被打漿來形成 • 一480ml CSF的紙漿。該等紙漿會被饋入如同範例丨的多層 紙板製程中，而來製成可容納電子晶片之容器紙板的基礎 20 紙板。由該基礎紙板，一容器紙板會以如同範例1的方式來 被製成。該等紙板成分係被示於表1。而其測量及評估結果 係被示於表2中。 由該各範例及比較例所製成之容器紙板的基礎紙板來 備I的粉碎紙漿之纖維長度分佈係數，重量加權的平均纖 29 1275535 維長度(W)及計數平均纖維長度(Μ)等之測量結果，及設於 該紙板中之凹穴内面和該紙板的正面在該頂覆帶被剝除之 後對抑制產生毛屑特性的評估結果，係被示於表2中。For the front layer, 30% of the soft kraft pulp A, and 70% of the broken hardwood kraft pulp E made of rubber trees will be classified according to TAPPI • T233 hm__82, using a Baua A magnet tester removes the coarse fibers remaining on a 24 mesh screen and the fine φ fibers that pass through a 15 inch mesh screen; then mixes with each other and beats in a double disc refiner to form a 480 ml CSF. pulp. For the intermediate layer, 1% by mass of soft kraft paper 10 pulp A and 90% shelled bleached hardwood kraft pulp e will be classified according to TAPPI T233 hm-82' and will be retained using a Baua magnet tester. The coarse fibers on the one percent mesh screen and the fine fibers that would pass through a 15 inch mesh screen were then mixed with each other and beaten in a double disc refiner to form a 41 Å pulp such as CSF. For this backing layer, the bleached hardwood kraft pulp e will be classified according to 15 TAPPI T233 hm_82. Using _Baua magnet tester to remove Φ will leave the crude fiber on a 24 mesh screen, and will pass through the fine fiber of a 150 mesh screen, and then beaten in a double disc refiner to form a #480ml CSF pulp. The pulp is fed into a multi-layer paperboard process as an example, to form a baseboard for the container of electronic wafers. From the base paperboard, a container paperboard will be finished as in the case of Example 1. The composition of the retort is shown in Table 1. The measurement and evaluation results are not shown in Table 2. (Example 9) A paperboard having a three-layer structure in which the pulp compositions of the respective layers are different from each other is manufactured as 27 1275535. The pulp of the front, middle and back layers of the paperboard is prepared as follows. For this front layer, only the bleached hard kraft pulp B is beaten in a double disc refiner to form a pulp having 450 s 1 C S F. For the middle 5 layers, only the bleached hard kraft pulp B was beaten in a double disc refiner to form a pulp having 410 ml of CSF. For this backing layer, only the pulp B was beaten in a double disc refiner to form a pulp having 460 ml of CSF. The pulp is fed into a multi-ply paperboard process as in Example 1 to form a base paperboard for the container of the electronic wafer. 10 From the base paperboard, a container of cardboard will be made in the same manner as in Example 1. The measurement and evaluation results are shown in Table 2. (Comparative Example 1) A paperboard having a three-layer structure in which the pulp compositions of the respective layers were different from each other was produced. The pulp of the front, middle, and back layers of the paperboard is prepared as follows. For the front layer, 50% by mass of soft kraft pulp F and 50% by mass of bleached hard kraft pulp D were mixed with each other and beaten in a double-dish refiner to form a 480 ml of CSF pulp. For the intermediate layer, 10% by mass of soft kraft pulp F and 90% by mass of bleached hard kraft pulp D were mixed with each other and beaten in a double-dish refiner to form a 410 ml CSF pulp. For this backing layer, the bleached hard kraft pulp D is beaten in a double disc refiner to form a 480 ml CSF pulp. The pulp is fed into a multi-layer paperboard process as in Example 1 to form a base paperboard for holding the container paper of the 28 1275535 sub-wafer. The base paperboard, /container paperboard will be made in the same manner as in Example 1. The pulp components are shown in Table 1. The results of the measurements and evaluation are shown in Table 2. (Comparative Example 2) ^ 5 A paperboard having a two-layer structure in which the pulp compositions of the respective layers were different was produced. The pulp of the front, middle and back layers of the paperboard is prepared as follows. For this front layer, 30% by mass of soft kraft pulp G (containing a φ part of fiber with a length of 〇.2inm or less, the fine pulp fiber accounts for 7.2% of the unpulped pulp '' fiber visibility is 21 μπι , an average fiber length of 3.25 mm), 10 and 70% by mass of bleached hardwood kraft pulp made of rubber tree h (containing a part of fine pulp fibers having a fiber length of 0.2 mm or less, which accounts for the quality of the unpulped pulp) 7%, with a fiber width of i7 pm and an average fiber length of 1〇5111111), were mixed with each other and beaten in a double-dish refiner to form a pulp having 480 ml of CSF. For the intermediate layer, 1% by mass of soft kraft paper 15 pulp E and 90% by mass of bleached hardwood kraft pulp H are mixed with each other, and φ is beaten in a double-plate refiner to form a 410 ml CSF pulp. . For the back layer, only the pulp pulp is beaten in a double disc refiner to form a 480 ml CSF pulp. The pulp is fed into a multi-layer paperboard process like the sample crucible to form the base 20 cardboard for the container of the electronic wafer. From the base paperboard, a container of cardboard would be made in the same manner as in Example 1. These paperboard components are shown in Table 1. The measurement and evaluation results are shown in Table 2. The base paperboard of the container paperboard prepared by the respective examples and comparative examples was prepared for the fiber length distribution coefficient of the pulverized pulp of I, the weight-weighted average fiber 29 1275535 dimension length (W), and the count average fiber length (Μ). The results of the measurement, and the evaluation results of the inner surface of the pocket provided in the paperboard and the front surface of the paperboard to suppress the generation of the shaving property after the top cover tape was peeled off are shown in Table 2.

30 1275535 表130 1275535 Table 1

含量 (%) 具有0.2mm或更小 厚度之細纖維含量 纖維 寬度 (μηι) 纖維 長度 (μπι) CSF (ml) 範例1 正面層 NBKP A 30 3.2 25 3.1 480 LBKP B 70 2.5 13 0.85 中間層 NBKP A 10 3.2 25 3.1 410 LBKP B 90 2.5 13 0.85 背面層 LBKP B 100 2.5 13 0.85 範例2 正面層 NBKP C 30 2.5 23 2.83 480 LBKP B 70 2.5 13 0.85 中間層 NBKP C 10 2.5 23 2.83 410 LBKP B 90 2.5 13 0.85 背面層 LBKP B 100 2.5 13 0.85 480 範例3 正面層 LBKP B 100 2.5 13 0.85 450 中間層 LBKP B 100 2.5 13 0.85 410 背面層 LBKP B 100 2.5 13 0.85 460 範例4 正面層 NBKP A 40 3.2 25 3.1 480 LBKP B 60 2.5 13 0.85 中間層 NBKP A 10 3.2 25 3.1 410 LBKP D 90 6.8 16 1.03 背面層 LBKP B 100 2.5 13 0.85 480 範例5 正面層 NBKP A 30 3.2 25 3.1 480 LBKP E 70 3.7 19 0.86 中間層 NBKP A 10 3.2 25 3.1 410 LBKP E 90 3.7 19 0.86 背面層 LBKP E 100 3.7 19 0.86 480 範例6 正面層 NBKP F 30 4.5 24 2.67 470 LBKP D 70 6.8 16 1.03 中間層 NBKP F 10 4.5 24 2.67 410 LBKP D 90 6.8 16 1.03 背面層 LBKP D 100 6.8 16 1.03 480 範例7 (打漿之 後分級） 正面層 NBKP A 30 3.2 25 3.1 480 LBKP E 70 3.7 19 0.86 中間層 NBKP A 10 3.2 25 3.1 410 LBKP E 90 3.7 19 0.86 背面層 LBKP E 100 3.7 19 0.86 480 範例8 (打漿之 後分級） 正面層 NBKP A 30 3.2 25 3.1 480 LBKP E 70 3.7 19 0.86 中間層 NBKP A 10 3.2 25 3.1 410 LBKP E 90 3.7 19 0.86 背面層 LBKP E 100 3.7 19 0.86 480 比較例1 正面層 NBKP F 50 4.5 24 2.67 480 LBKP D 50 6.8 16 1.03 中間層 NBKP F 10 4.5 24 2.67 410 LBKP D 90 6.8 16 1.03 背面層 LBKP D 100 6.8 16 1.03 480 比較例2 正面層 NBKP G 30 7.2 21 3.25 480 LBKP H 70 7 17 1.05 中間層 NBKP E 10 3.7 19 0.86 410 LBKP H 90 7 17 1.05 背面層 LBKP H 100 7 17 1.05 480 31 1275535 表2 \整個 \氏板 重量加權的平 均纖維長度(W) (mm) 1十數平均 纖維長度(Μ) (mm) 纖維長度 抑制產生^® 分佈係數 當頂覆層被剝 離後的正面 100μπι>| 整個 紙板 正表面層 ΙΟΟμηι厚 整個 紙板 正表面層 ΙΟΟμηι 厚 整個 紙板 正表面層 ΙΟΟμηι 厚 凹穴内面 1 1.35 1.46 0.57 0.60 2.37 2.43 2 2 2 1.10 1.29 0.59 0.60 1.86 2.15 1 2 3 0.92 0.92 0.64 0.64 1.44 1.44 1 1 4 1.39 1.88 0.53 0.60 2.62 3.13 2 4 範例 5 1.60 1.41 0.56 0.58 2.86 2.43 3 2 6 1.23 1.25 0.43 0.44 2.84 3 4 7 0.86 0.86 0.62 0.62 1.39 1.39 1 1 8 0.86 0.86 0.61 0.61 1.41 1.41 1 1 9 0.92 1.82 0.92 0.64 0.64 1.44 1.44 J_ | 1 比 άΛ 7t:.! T 1.98 0.46 0.45 4.40 Γ" .1— 5 孕父例 2 1.84 1.82 0.50 0.50 3.68 3.64 4 5 由表2中，乃可驗證在第1至9範例依本發明來製成之容 器紙板的基礎紙板形成的粉碎紙漿會具有在12〇至3 2〇範 圍内的紙聚纖維長度分佈係數’且範例丨至9的容器紙板在 形成於紙板中的凹穴内面，及該紙板的正表面當剝除頂覆 帶之後會沒有或極少產生毛屑。 (產業上可利用性） 本發明之可容裝電子晶片的容器紙板在該紙板的凹穴 内面，及該紙板的正面在被剝除頂覆帶之後，將不會或甚 少產生毛肩’因此將不會有或幾乎沒有電子晶片會被產生 於本發明之容器紙板内的毛屑所污染。故，本發明之用於 容裝電子晶片的容器紙板會非常實用。 I：圖式簡單説明】 (無） 【主要元件符號説明】 (無） 32Content (%) Fine fiber content with a thickness of 0.2 mm or less Fiber width (μηι) Fiber length (μπι) CSF (ml) Example 1 Front layer NBKP A 30 3.2 25 3.1 480 LBKP B 70 2.5 13 0.85 Intermediate layer NBKP A 10 3.2 25 3.1 410 LBKP B 90 2.5 13 0.85 Back layer LBKP B 100 2.5 13 0.85 Example 2 Front layer NBKP C 30 2.5 23 2.83 480 LBKP B 70 2.5 13 0.85 Intermediate layer NBKP C 10 2.5 23 2.83 410 LBKP B 90 2.5 13 0.85 Back layer LBKP B 100 2.5 13 0.85 480 Example 3 Front layer LBKP B 100 2.5 13 0.85 450 Intermediate layer LBKP B 100 2.5 13 0.85 410 Back layer LBKP B 100 2.5 13 0.85 460 Example 4 Front layer NBKP A 40 3.2 25 3.1 480 LBKP B 60 2.5 13 0.85 Intermediate layer NBKP A 10 3.2 25 3.1 410 LBKP D 90 6.8 16 1.03 Back layer LBKP B 100 2.5 13 0.85 480 Example 5 Front layer NBKP A 30 3.2 25 3.1 480 LBKP E 70 3.7 19 0.86 Intermediate layer NBKP A 10 3.2 25 3.1 410 LBKP E 90 3.7 19 0.86 Back layer LBKP E 100 3.7 19 0.86 480 Example 6 Front layer NBKP F 30 4.5 24 2.67 470 LBKP D 70 6.8 16 1.03 Intermediate layer NBKP F 10 4.5 24 2.67 410 LBKP D 90 6.8 16 1.03 Back layer LBKP D 100 6.8 16 1.03 480 Example 7 (Classification after beating) Front layer NBKP A 30 3.2 25 3.1 480 LBKP E 70 3.7 19 0.86 Intermediate layer NBKP A 10 3.2 25 3.1 410 LBKP E 90 3.7 19 0.86 Back layer LBKP E 100 3.7 19 0.86 480 Example 8 (Classification after beating) Front layer NBKP A 30 3.2 25 3.1 480 LBKP E 70 3.7 19 0.86 Intermediate layer NBKP A 10 3.2 25 3.1 410 LBKP E 90 3.7 19 0.86 Back layer LBKP E 100 3.7 19 0.86 480 Comparative Example 1 Front layer NBKP F 50 4.5 24 2.67 480 LBKP D 50 6.8 16 1.03 Intermediate layer NBKP F 10 4.5 24 2.67 410 LBKP D 90 6.8 16 1.03 Back layer LBKP D 100 6.8 16 1.03 480 Comparative example 2 Front layer NBKP G 30 7.2 21 3.25 480 LBKP H 70 7 17 1.05 Intermediate layer NBKP E 10 3.7 19 0.86 410 LBKP H 90 7 17 1.05 Back layer LBKP H 100 7 17 1.05 480 31 1275535 Table 2 \The whole \ board weight Weighted average fiber length (W) (mm) 1 tens of average fiber length (Μ) (mm) Fiber length suppression produces ^® Distribution coefficient when the top coating is peeled off the front side 100μπι>| The entire cardboard front surface layerΙ Ομηι Thick whole cardboard positive surface layer ΙΟΟμηι Thick whole cardboard positive surface layer ΙΟΟμηι Thick recessed inner surface 1 1.35 1.46 0.57 0.60 2.37 2.43 2 2 2 1.10 1.29 0.59 0.60 1.86 2.15 1 2 3 0.92 0.92 0.64 0.64 1.44 1.44 1 1 4 1.39 1.88 0.53 0.60 2.62 3.13 2 4 Example 5 1.60 1.41 0.56 0.58 2.86 2.43 3 2 6 1.23 1.25 0.43 0.44 2.84 3 4 7 0.86 0.86 0.62 0.62 1.39 1.39 1 1 8 0.86 0.86 0.61 0.61 1.41 1.41 1 1 9 0.92 1.82 0.92 0.64 0.64 1.44 1.44 J_ 1 άΛ 7t:.! T 1.98 0.46 0.45 4.40 Γ" .1 - 5 Pregnancy 2 2.84 1.82 0.50 0.50 3.68 3.64 4 5 From Table 2, it can be verified that the first to the nine examples are based on the invention. The pulverized pulp formed by the base paperboard of the container paperboard will have a paper polyfiber length distribution coefficient in the range of 12 〇 to 32 〇 and the container paperboard of the example 丨 9 is in the inner surface of the pocket formed in the paperboard, and The front surface of the board will have little or no shavings after stripping the top cover. (Industrial Applicability) The container paper of the present invention which can accommodate an electronic wafer is on the inner surface of the pocket of the paperboard, and the front side of the paperboard will not produce or produce a rough shoulder after being peeled off the top cover tape. Therefore, no or almost no electronic wafer will be contaminated by the dander generated in the container of the present invention. Therefore, the container paperboard of the present invention for accommodating an electronic wafer can be very practical. I: Simple description of the schema] (None) [Explanation of main component symbols] (None) 32

Claims (1)

1275535 十、申請專利範圍： 51275535 X. Patent application scope: 5 10 1510 15 1· -種用以容納電子W的容践板，包含—基礎紙板具 有多層的紙板結構，其中#該基礎紙板依據nsp8220， 紙漿實驗室濕粉碎法來粉碎，且卿成的粉碎紙聚依日 本ΤΑΡΡΙ Νο·52的規定使用一自動光學法來測量紙聚纖 維長度時，該粉碎的紙漿係具有1.2至3.20的紙漿纖維長 度分佈係數。 2·如申晴專利圍第1項之容器紙板，其中該粉碎紙漿的 纖維長度分佈係數係由丨2至2.7〇。 3·如申請專利範圍第㈣之容器紙板，其中該基礎紙板之 :正面層部份沿該紙板厚度方向由該基礎紙板的正面 异起具有ΙΟΟμηι的厚度將會被依該紙漿粉碎法來粉 砰’而所形成的粉碎紙漿會具有12至2 8〇的紙漿纖維長 度分佈係數。 4·如申請專利範圍第3項之容器紙板，其巾由該基礎紙板 之正面層部份形成的粉碎紙漿之纖維長度分佈係數係 由 1.2至2.50。 5·如申凊專利範圍第1至4項任一項之容器紙板，其中該基 礎紙板是由一種造紙漿料所製成，該漿料係為一分級紙 漿其不含有會留存在一24網目網幕上的粗紙漿纖維，及 會穿過一 150網目篩網上的細紙漿纖維。 6·如申請專利範圍第5項之容器紙板，其中該基礎紙板的 正面部份具有1〇〇μηι的厚度是由該分級紙漿所製成，其 不含有會留存在一24網目網幕上的粗紙漿纖維，及會穿 過一 150網目篩網的細紙漿纖維。 33 251· - a plastic plate for accommodating the electronic W, comprising - the base paperboard has a multi-layer cardboard structure, wherein # the base paperboard is pulverized according to the nsp8220, pulp laboratory wet pulverization method, and the smashed paper of the smashed pile is gathered in Japan ΤΑΡΡΙ Νο. 52 The pulverized pulp has a pulp fiber length distribution coefficient of 1.2 to 3.20 when an automatic optical method is used to measure the length of the paper polyfiber. 2. The container paperboard of the first paragraph of Shenqing Patent, wherein the fiber length distribution coefficient of the pulverized pulp is from 丨2 to 2.7〇. 3. The container paperboard of claim 4, wherein the base paper layer has a thickness of 正面μηι from the front surface of the base paperboard along the thickness direction of the paperboard, and is pulverized according to the pulp pulverization method. 'The resulting comminuted pulp will have a pulp fiber length distribution coefficient of 12 to 28 。. 4. The container paperboard of claim 3, wherein the woven paper formed from the front layer portion of the base paper has a fiber length distribution coefficient of from 1.2 to 2.50. The container paperboard according to any one of claims 1 to 4, wherein the base paperboard is made of a papermaking pulp which is a graded pulp which does not contain a 24 mesh. The coarse pulp fibers on the screen and the fine pulp fibers that pass through a 150 mesh screen. 6. The container paperboard of claim 5, wherein the front portion of the base paperboard has a thickness of 1 〇〇μηι which is made of the graded pulp, which does not contain a 24 mesh screen. Coarse pulp fibers, and fine pulp fibers that pass through a 150 mesh screen. 33 25