1273255 九、發明說明： 【發明所屬之技術領域】 本毛明仏有關於一種表面黏著元件與電路板之電性 ^接品質檢測方法，更詳而言之，係關於—種檢測表面黏 者兀件與電路板之電性連接品質的方法。 【先前技術】 近年來隨著電子產品的輕薄短小化趨勢，促使各種元 •牛的體積與重量愈來愈小。表面黏著元件（㈣似 :㈣心似，_)由於其節省空間、可靠性高以及有 牙=量生產、自動化及低生産成本之特性，業已成爲印 路板（printed circuit b〇ard，pcB)上之主要元件。 二二f著元件例如電容、電阻、電感、電晶體、二 。脰寺已被廣泛應用於各式主機板的製造上。 將表面黏著元件接置於電路板上，主要#蔣雜# f βί 在電路板之焊墊表面上；夢由將錫賞印刷 .表面黏著元件放置於已形自動化置放設備將 成有錫I之電路板的焊墊上；之 ^由^(reil〇W)技術使表面黏著元件之接點焊接電性 路板之接合。 凡成表面黏著元件與印刷電 該印刷電路板電性連接各表面黏 ^ 系列電性測試，如電氣測試 $進行一 最基本測試為線上測試(ln_cir二广^ 測試係使用專門的、1Λ eSt ，傳統的線上 夂元#、^ 料關該電料上的元件，以對 判4，而可季確地測出元件漏裝、錯 5 19095 !273255 4、電路板開短路箄姑立 測試係藉由測試表面“元：：線上：試中所包含的阻抗 阻抗大小，而判而70與印刷電路板之接點之間的 是否電性連接。铁而 ' =耆元件與印刷電路板之接點之間 誤以及技丄等V:因由：定位不準確或焊接過 間極易發生錯位、虛焊等現，黏:J兀❹電路板之接點之 電路板電性連接、本進而發生表面黏著元件與 电I生連接不充分導致接觸不、 抗測试可檢測表面黏 豕雖白知之阻 題，但若僅使用 I电路板是否電性連接的問 黏者兀件與電路板是入帝 、…、法侍知表面 進行功能職時，由^^ %'、接，對於後續該電路板 接不足導致接觸不著元件與電路板之間電性連 至整個主機板報廢：情況 率、且增力，費用及維修= 因此，如何提供— 〜低產叩的良率。 1應接點之_連接問題:二面板之對 題。 匕成局亟待解決之難 【發明内容】 鑒於上述習知技術之缺點，本發明之 供-種表面黏著元件與電路板：要目的在於提 藉以檢測表面料元件接°口質檢測方法， 本發明之再1的㈣問題。 路板之電性連接品質 A I面#者兀件與電 為達上述目的得:;升產品良率。 月美供一種表面黏著元件與電路 1 9095 6 '1273255 板之電性連接品質檢測方法 與電路板，且該表面黏著元件盘電= 泰表面黏著元件 之接點；提供一電容測試工呈：二別具有相互對應 與該電路板相互對應之接點之間白^ =成該表面黏著元件 電容值判別哼I面+ 、电谷值；依據所測得的 質。 面劫元件與該電路板之間的電性連接^ 電 其中’該表面黏著元件可為 極體等主被動元件或半導體封裝件。合 該表面黏著元件盥 復包括依據哼f φ „ 弘，連接品質檢測方法 並將所測得的實際電容值“：：传到-理想電容值， .判別該表面黏著元二容值進行比較，據以 ι表面黏者兀件盘命々 質檢測方法係藉由測試表面黏著 鲁接點之間的實陪命六枯* /、包路板相互對應之 板之間的電性;二，：以判別該表面黏著元件與電路 黏著元件-電俾以避免習知技術無法檢测表面 作簡單易二=性連接的缺失。同時，本發明操 【實施方:】…且有利於提升產品良率。 ::係藉由特定的具體實例說明本發 二:=之人士可由本說明書所揭示之内容輕易地 的呈雕、/'μ點與功效。本發明亦可藉由其他不同 員例加以施行或應用，本說明書中的各項細節亦可 19095 7 1273255 基於不同觀點與應用，在不悖離本 修飾與變更。 s力之知神下進打各種 之第1A圖與第㈣，係分別為-係如電晶體丨 表面‘者兀件的底視圖及侧視圖。 " 1係包括-間… 間如圖所不，該電晶體 包極接”，、占G、兩個源極接點S1、 >及極接點Dl、D2。 ^及兩個 弟2A圖與第2B圖係分別為—電路板 I置该係電晶體1之後的示意圖。如第1A圖所_圖及接 板2之表面係設置接點G,、S1,、％圖所-，於該電路 接點分別對應電晶體1之接點G、s卜S2 :及D2，該些 配合參閲第“圖及第⑼圖，該電晶體；請 技術（SMT)接置於該電路板2後，該電日^ 著 路板2相對應之接點G，、S1，、S2=性連接該電 細介紹本發明之表面 及D2,。以下詳 1測方法之流程步驟。' 〃包路板之電性連接品質檢 如弟3圖所示，係為本發明之表 板2之電性連接品質檢測方法的步驟與電路 之檢測方法係藉由電容測試工具而例圖。本發明 電路板2之相互對應之接點之間的電容值，^著元件1與 能夠依據電容值判別表㈣著元件俾供檢測人員 性連接品質；其中，該 /、书路板2之間的電 電晶體、二極體等兀1可為電阻、電容、 首先執行件或是半導體封裝件。 幻，係先計算該電晶體1與電路板2之 19095 8 1273255 間相互對應之間φ 客伯免★接點於理想電性連接狀態時的理想電 苴中，ν达 篆毛合计异公式C=K*A/d計算而得， 之距離太;1/吊數，A為兩接點之相對面積’ d為兩接點 之貫施例係以電晶體1與電路板2之間相互對應 閣甩極接點G與G，兔办丨丨w1273255 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a method for detecting the electrical quality of a surface-adhesive component and a circuit board, and more specifically, a method for detecting surface stickiness A method of electrically connecting a piece to a circuit board. [Prior Art] In recent years, with the trend of thinness and lightness of electronic products, the volume and weight of various types of cattle have been reduced. Surface-adhesive components ((4) like: (4) heart-like, _) have become printed circuit boards (pcB) due to their space-saving, high reliability and the characteristics of tooth production, automation and low production cost. The main components on it. Two elements are components such as capacitors, resistors, inductors, transistors, and diodes. The temple has been widely used in the manufacture of various types of motherboards. The surface adhesive component is placed on the circuit board, mainly #蒋杂# f βί on the surface of the soldering pad of the circuit board; the dream is printed by the tin. The surface adhesive component is placed on the shaped automatic placement device and will be tinned. On the solder pad of the circuit board; the ^ (reil〇W) technology is used to make the joint of the surface adhesive component solder the electrical circuit board. The surface-adhesive component and the printed circuit board are electrically connected to each surface of the adhesive series electrical test, such as electrical test $ to conduct a basic test for online testing (ln_cir 二广^ test system uses a special, 1Λ eSt, The traditional online 夂元#, ^ material off the components on the electric material, to judge 4, but can accurately measure the missing components, wrong 5 19095 ! 273255 4, the circuit board open short circuit 箄 立 test From the test surface "yuan::line: the impedance impedance included in the test, and judge whether the electrical connection between the junction with the printed circuit board 70. Iron and then = contact between the component and the printed circuit board Mistakes and technical errors, etc. V: Causes: Inaccurate positioning or misalignment, soldering, etc. during soldering. Sticky: Electrical connection of the board of the J兀❹ circuit board, and surface adhesion Insufficient connection between components and electric I leads to contact failure, and the test surface adhesion is not affected. However, if only the I circuit board is electrically connected, the adhesive element and the circuit board are in the emperor. ..., the law knows the surface to perform functional duties, ^^ %', connected, for the subsequent lack of connection of the board, resulting in no contact between the component and the circuit board electrically connected to the entire motherboard scrap: situation rate, and increase, cost and maintenance = Therefore, how to provide - ~ The yield of low yielding. 1 The connection problem of the joints: the problem of the second panel. The difficulty of solving the problem of the second panel [invention] In view of the above disadvantages of the prior art, the surface adhesive element of the present invention Circuit board: The purpose is to lend to detect the surface material component interface quality detection method, the fourth problem of the invention (four). The electrical connection quality of the road board AI surface and the electricity for the above purpose: The product yield rate is improved. Month America provides a surface adhesion component and circuit 1 9095 6 '1273255 board electrical connection quality detection method and circuit board, and the surface adhesion component disk = Thai surface adhesion component contact; provide a capacitor The tester presents: the two have mutually corresponded to each other and the corresponding points of the circuit board between the white ^ = the surface of the adhesive component capacitance value 哼I surface +, electric valley value; according to the measured quality. With the circuit Electrical connection between the boards ^Electricity, wherein the surface adhesive component can be a passive component such as a pole body or a semiconductor package. The surface adhesive component can be combined according to 哼f φ „ 弘, connection quality detection method and The measured actual capacitance value ":: is passed to the - ideal capacitance value. The surface adhesion element is judged to be compared. According to the ι surface adhesion method, the enamel detection method is based on the test surface adhesion. Between the points, the actual life of the six dead * /, the board between the boards corresponding to the electrical; second, to distinguish the surface of the adhesive components and circuit adhesive components - electricity to avoid the conventional technology can not detect the surface It is simple and easy to use = the lack of sexual connection. At the same time, the present invention [implementer:] ... and is conducive to improving product yield. :: The description of the present invention by a specific specific example: = = can be easily carved, / 'μ points and efficacy can be revealed by the content disclosed in this specification. The present invention can also be implemented or applied by other different examples, and the details in the present specification can also be based on different opinions and applications, without departing from the modifications and changes. The first and fourth (4) of the singularity of the gods are the bottom view and the side view of the surface of the transistor. " 1 series includes - between... The transistor is connected to the pole," G, two source contacts S1, > and pole contacts Dl, D2. ^ and two brothers 2A Figure 2 and Figure 2B are respectively a schematic diagram of the circuit board I after the system of the transistor 1. As shown in Figure 1A, the surface of the board 2 is provided with contacts G, S1, and %. The contacts of the circuit correspond to the contacts G, S2, and D2 of the transistor 1, respectively. For the cooperation, refer to the figure "Fig. and (9), the transistor; the technology (SMT) is placed on the circuit board. After the second day, the contact points G, S1, and S2 of the circuit board 2 correspond to the electric connection to introduce the surface of the present invention and D2. The following is a detailed description of the process steps of the test method. 'Electrical connection quality inspection of the package road board As shown in Figure 3, the method of detecting the electrical connection quality of the board 2 of the present invention and the detection method of the circuit are illustrated by a capacitance test tool. The capacitance value between the mutually corresponding contacts of the circuit board 2 of the present invention, the component 1 can be connected to the component according to the capacitance value discriminating table (4), and the quality of the connection is detected; wherein, between the / board board 2 The 电1 of the transistor, diode, etc. can be a resistor, a capacitor, a first actuator or a semiconductor package. Magic, first calculate the correspondence between the transistor 1 and the circuit board 2 19095 8 1273255 φ 客伯免 ★ contact in the ideal electrical connection state of the ideal power ν, 篆 篆 合 合 合 公式 公式=K*A/d is calculated, the distance is too; 1/number of cranes, A is the relative area of the two contacts' d is the embodiment of the two contacts, the correspondence between the transistor 1 and the circuit board 2 Gently contact G and G, rabbits do 丨丨w
係為電晶體1之門恭 ，11此，於本實施例中，A 間的彳目#f 2 ?毛極接點0與電路板2之對應接點G，之 丨曰J的相對面積。出 〜 計瞀；^ & 、 ； 、d、Α均為已知，依據上述公式可 =了想電容值C1。接著進至步驟. 晶體/1=2板中2，係提供—電容測試工具，用以測試電 值。本實施 式中未表_、士 甲电極接點G與G’上設置測試點（圖 電容測試，以測係藉由探針接觸該測試點作 之對應接點G，之間的二電極接，點G與電編 具復可包括-顯示器（圖式中未^_2)。此外，該電容測試工 .及測試結果。接著進至步‘㈣表不）’用以顯示測試狀態 於步驟S 3中，比較實j!疚带六 以供判別嗲+日^ 戶' 除屯今值與理想電容值之差別， 質。本與電路板2之接點之間的電性連接品 栌、、例 較實際電容值C2與理相電容 據以供判斷該電晶體！之間電:':谷值C1之產， 接點G，之Η 66 + k 接-占6與電路板2之對應 c姻/d i 連接品質。根據電容計算公式 ，由於介電常數K、距離 C2與理想電容值基本不Μ，實際電容值 的實際電m 電晶⑸與電路板2之間 ^生連接面積與理想電性連接面積之比值。當該電 19095 9 1273255 ==路板2之間的實際電性連接面積最大時，即實 二里；於理想電性連接面積，該實際電容值C2 /、王心毛办值C1之比，即Γ9/Γ 石έ 6问帝a 2/Cl之比值寻於1，此時，可 霍疋閘％極接點G與G，之電 層面的限制，該電晶體i盘電路因為技術 之間很難實現準確對位，實際電:=電極接點G與G’ 想狀態電性連接面戶t戸… 接的面積往往小於理 當C2/C1 ^ 即C2/C1之比值小於1。因此， ί ^予4小於1但大於—定預設之臨界值時，声示今 貫際電性連接面積雖小於理相 U、以 範圍内，此時，可確定閘電 良好。當C2/C1之比值小於_ 二:1·生連接口”' 閘電極接點（^G，之間電性二之臣品界值時，可確定 路板2必須進行修復動作。 貝不足不’即表示該電 ::复步驟SUS3,即可完成電晶 路板 間其他相互對應之接點的電性連接 ％路板2之 .電晶體1與電路板2之間的電性連接品7 ’俾以提供該 另，本發明之電容測試可結合 人員係先判斷表面黏著元件與 /収，亦即，檢測 再利用本發明之檢測方法判 間的阻抗測試後， 電性連接是否充分，以便提早 對其進行修理。 運接不足之產品並 綜上所述，本發明之表面黏 接品質檢測方法係藉由測試表面—二％路板之電性連 應之接點之間的電容值，而供^ =件與電路板相互對 “測人員判斷表面黏著元件 19095 10 '1273255 與電路板之間的電性連接品質 一 測表面黏著元件與電路板之 二於無法檢 造成元件或電路板損壞之指失 ^連接¥致功能測試中 :，而得降低維修成本及減少維修時前=出問 ^著元件與電路板之間的電性連接品質而可:二：測 =產…並及時進行修復等動作，以利於提升產/二現 外，本發明之檢測方法尚具有操作簡單、易於二 點，而可整合習知之在線測 、貝轭寺優 發現故障。 在相4，^及時、準確、快速地 =述實施例僅例示性說明本發明之原理及其 =於限制本發明。任何熟習此項技藝之人士均= 月本發明之精神及範疇下，對 延 變。因此，本發明之權利㈣：”：行修飾與改 範圍所列。 ㈣保叹乾圍，應如後述之申請專利 【圖式簡單說明】 弟1A圖及第1B圖分別為表面黏住元件之底視圖及側 視圖； 第2 A圖為電路板之局部立體圖； 第2B圖為兒路板接置表面黏住元件之後之側視圖； 以及 第3圖係為本發明之表面黏著元件與電路板之電性連 接品質檢測方法之運作流程示意圖。 【主要元件符號說明】 1 電晶體 11 19095 1273255 2 電路板 D1、D2 電晶體之汲極接點 G 電晶體之閘電極接點、 G， 、 SI， 、S2’、Dl’、D25 電路板之接點 SI、S2 電晶體之源極接點 S卜S3 流程步驟 12 19095It is the door of the transistor 1. In this embodiment, the relative area between the # # 间 f f f f f f f f f f f f f f f f f f f f f f f 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Out ~ 瞀; ^ &,; , d, Α are known, according to the above formula = can think of the capacitance value C1. Then proceed to the step. Crystal / 1 = 2 board 2, provides a capacitance test tool to test the voltage. In this embodiment, the test points are not set on the _, 士甲 electrode contacts G and G' (the capacitance test is performed to measure the two electrodes between the corresponding contacts G by the probes contacting the test points). Connect, point G and electric splicing can include - display (not ^ 2 in the figure). In addition, the capacitor tester and test results. Then go to step '(4) table) 'to display the test status in the step In S 3, compare the real j! 疚 with six for the difference between the value of the current value and the ideal capacitance value. The electrical connection between the junction with the circuit board 2, and the actual capacitance value C2 and the phase capacitance are used to judge the transistor! Between: ': The production of the valley value C1, the contact G, then the 66 + k connection - the corresponding 6 and the circuit board 2 c marriage / d i connection quality. According to the capacitance calculation formula, since the dielectric constant K, the distance C2 and the ideal capacitance value are substantially the same, the actual capacitance value of the actual electric m crystal (5) and the circuit board 2 between the raw connection area and the ideal electrical connection area ratio. When the electric 19095 9 1273255 == the actual electrical connection area between the road plates 2 is the largest, that is, the real two-way; in the ideal electrical connection area, the actual capacitance value C2 /, the ratio of the core value of the C1, that is, Γ9 /Γ石έ 6Q The ratio of a 2/Cl is found to be 1. At this time, the voltage of the poles of the gates G and G can be limited. The transistor i disk circuit is difficult because of the technology. To achieve accurate alignment, the actual electricity: = electrode contact G and G' want to state the electrical connection face t戸... The area of the connection is often less than the reasonable C2 / C1 ^ that is, the ratio of C2 / C1 is less than 1. Therefore, when ί ^4 is less than 1 but greater than the predetermined threshold value, the acoustic connection area is smaller than the phase U and the range, and the gate can be determined to be good. When the ratio of C2/C1 is less than _ 2:1 · raw connection port "' gate electrode contact (^G, between the two values of electrical property, it can be determined that the road plate 2 must be repaired. 'That means that the electricity:: Repeat step SUS3, can complete the electrical connection of the other corresponding contacts between the crystal plate, the % circuit board 2. The electrical connection between the transistor 1 and the circuit board 2 In order to provide the other, the capacitance test of the present invention can be combined with the person to first judge the surface adhesive component and/or receive, that is, after detecting the impedance test using the detection method of the present invention, whether the electrical connection is sufficient, so that Repairing the cable early. In addition, the surface bonding quality inspection method of the present invention is based on the capacitance between the contacts of the electrical surface of the test surface-two-way plate. And the ^=piece and the circuit board are opposite each other. "The tester judges the surface adhesion component 19095 10 '1273255 and the electrical connection quality between the circuit board. The surface adhesion component and the circuit board are undetectable, and the component or the circuit board is damaged. The loss of the ^ connection ¥ to the functional test :, but to reduce the maintenance cost and reduce the maintenance before the = = ask ^ the electrical connection quality between the component and the circuit board can be: two: test = production ... and timely repair and other actions, in order to improve production / two Nowadays, the detection method of the invention has the advantages of simple operation and easy two points, and can integrate the conventional online measurement, and the yoke temple excellent fault is found. In the phase 4, ^ timely, accurate and fast = the embodiment is only exemplary The principles of the present invention and its limitations are intended to limit the invention. Any person skilled in the art will be able to change the invention within the spirit and scope of the present invention. Therefore, the right (4) of the present invention: ": modification and modification of the scope (4) The sigh of sighing should be applied for patents as described later [Simple description of the drawings] The 1A and 1B drawings are the bottom view and the side view of the surface-adhering components respectively; Figure 2A is the part of the circuit board. Fig. 2B is a side view of the surface of the board after the attachment surface is adhered to the component; and Fig. 3 is a schematic diagram of the operation of the method for detecting the quality of the electrical connection between the surface mount component and the circuit board of the present invention. symbol Ming] 1 transistor 11 19095 1273255 2 circuit board D1, D2 transistor's drain contact G transistor gate electrode contact, G, SI, S2', Dl', D25 board contact SI, S2 transistor source contact S Bu S3 process step 12 19095