1271501 九、發明說明： 【發明所屬之技術領域】 本發明係關於-種熱管及其製造方法，特難關於—種具絲網型 毛細結構之熱管及其製造方法。 【先前技術】 近年來，P4著電子元件運算速度之快速提昇，其產生之熱量越來 越多，過多之熱量若無法及時排出，將嚴重影響中央處理器運行時之 穩定性，因此，發熱電子元件之散熱問題亟需解決。 、人們普遍_散熱ϋ對電子藉進行散熱。最初之散熱器爲—體 成型，包括-基板和由基板延伸出之若干相互平行之散熱讀片 時將运種散熱ϋ緊貼在發熱電子元件上，在散熱紅安裝—風扇輔助 散熱。這種散熱器在最初一段時間裏能夠滿足電子元件之散埶需求， 然而隨著轩元件發熱量之邱，此種散無_滿足散熱需求 此，有人通過增加散熱器之散熱面積來提昇其散熱能力。然而，通當 增加散熱面積就必須增加散熱器體積，使其所占之空間和本 =增加，與電子元件日益輕薄化之發展趨勢相違背，難合: 愈高之散熱需求。 仃口4求 界採用熱管辅助散熱，將熱管穿設於散熱鰭片中，_ Γ向散乍液體在發熱電子元件處（蒸發端）吸熱蒸 之熱量傳：散二在=2戶(冷凝端)將發熱電子_ 子元件之《。:彻餘風祕赴之熱量帶走，完成對電 壁部之上構，凝結成液體，該液體在熱管 ;有較高之傳熱效率和傳熱速度，在電子元件散熱領 其毛==::=管性能之主要參數，常見之熱管根據 了刀為溝槽型、燒結型、纖維型及絲網型，其中絲 1271501 網型熱管之應用較為瘩令，羽 絲網捲製成筒狀，使，網且二、〜網型熱管之製造方法’-般係將 此種方法製造之哉ΪΓ 然後將絲網***銅管内。利用 接觸，故，掌/、、、/〆於絲網具有向内性，管壁與絲網間不能良好 (-tecticb〇„ding) 合，易使絲網在炼接過程中造 ^惟贿接或共溶接 n 中化成才貝壞，利用彈簧支撐，易使加工形成之 力狗自。， 壞之提供—鮮級細部之毛細結構損 管體3====提熱管，包括-管體、設於 管體内以支撐絲網盥总驊二啟4工作；|貝，该熱官進一步包括設於 料製成。、〜”e體内壁接觸之支撐體，該支撐體係由多孔性材 撐體ί;;ϊΓ使:从撐體，將絲網及支 管體内，絲空及填^介====，然後將 ❿ 並利用支標體支擇絲網，使絲網與管壁間具良好接觸， ⑽m纟明沿圓财向受力均勻， 哥命。同時，支撐體罝古—土 α 1 〜瓦、、、& I便用 時不m 可使支撐體在熱管被彎曲或壓扁 守不易知壞，使該熱管具有更為廣泛之用途。 低加=W# ’ m有效減少製造工序及降 -口 本，並可防止燒結過程中對絲網之損宝。 【實施方式】 、° 下面參照_結合實關對本發明作進-步說明。 熱，月熱管，用於對發熱電子元件（圖未示）散 支撐體6及i充於管體觸之絲網4、穿設於絲網4内之 其中，管體2由導熱性良好之金屬製成，本實施例中，管體2材 1271501 料為鋼。 銅、設社量細小H形成毛細輯。、_ 4材料可為 ^末砥疋，使絲網4與工作介質間不發生化學反應。 、 料製i撑與:體以接觸’該支撐體6由多孔性材 材料製作支體金屬或聚乙稀等多孔高分子 該支受;=:支撐體6也可為空心結構’降低通過 本實液體’並可與支擇體6及絲網4共存， 如第二至第九圖所示’該熱管之製作過程如下·· ^供所需之絲網4、管體2及支擇體6 ; σ月參閱弟四至弟六圖’將絲網4剪邦诉摄制 之形狀置人管體2内； j 4减亚捲衣成適合於讀2内壁 請參閱第七圖，將支撐體6置入絲 與管體2内壁保持良好接觸； Η支象、糸網4,使絲網4 管之力將管體2内部抽成真空及填充工作介質，並封裝，完成熱 丨：：， =第人及第九圖所示，本發明中，也可將 體6上，將絲網4與支撐體6 一同置入管體2内，簡化於支按 盥支ΪΞΠ支ff 6可為整段式結構’使絲網4在整個長度上都 #' 具良好之支撐效果。該支撐體6也可為分段式 分式支^分ί支擇體6接觸，可達到相同之功效。同時，採用 更有熱；贬綱6狀部分進行彎折， 介質’細之工作 ^. 又^牙® &之孔隙向另一端運動，在另一㈣趨：#為 體工網4孔隙之毛細作用下迴流至熱管之吸熱、 進下工作趣，貫現對電子元件之散熱。為使工作介質汽化 1271501 形成之氣體在熱官内運行時受到較小之阻力，該支樓體6之開孔率以 大於50%為宜。 網4 棚^ ’包金屬或多孔高分子材料支撐體6支撐絲網4，使絲 ^ 壁具良好接觸，有利於發熱電子元件產生熱量之傳遞。 彎二戈ί扁:ΐίϊί撐Ϊ6具有一定韌性，可使支撐體6在熱_ 弓曲錢她，使該鮮具錢為敍之職。 之社ί熱::了 t ’不需經過哼結即可實現絲網4與管體1内壁 = f方法加工之熱管，管體1内壁與絲網4間 0周方向又力均勻，可有效延長熱管之使用壽命。 綜上所述，本發明符合發明專利要件，麦依 以上所述者僅為本發.難實補，舉凡_=出專辦…惟’ 滅本發鴨神所作之較修 ^技款人士，在 範圍内。 ⑽/兩盍於以下之申請專利 【圖式簡單說明】 第一圖為本發明熱管第一實施例之截面圖； 第二圖為本發明熱管另一實施例之截面圖； 第三圖為本發明熱管製造方法之工作流程圖； 第四至=圖為本發明鮮製造方法第_實施例之部分工作狀態 第八及^九圖為本發明熱管製造方法另一實施例之部分工作狀態 【主要元件符號說明】 管體 支撐體 1 絲網 61271501 IX. Description of the Invention: [Technical Field] The present invention relates to a heat pipe and a method of manufacturing the same, and it is particularly difficult to relate to a heat pipe having a wire mesh type capillary structure and a method of manufacturing the same. [Prior Art] In recent years, P4 has rapidly increased the computing speed of electronic components, and the heat generated by it is increasing. If too much heat is not discharged in time, it will seriously affect the stability of the CPU during operation. Therefore, the heating electrons The heat dissipation problem of the components needs to be solved. People are generally _ cooling ϋ to heat the electrons. The original heat sink is formed into a body, including a substrate and a plurality of mutually parallel heat-dissipating readings extending from the substrate. The heat-dissipating heat is applied to the heat-generating electronic components, and the heat-dissipating red-fan is used to assist heat dissipation. This type of heat sink can meet the divergence requirements of electronic components for the first time. However, with the heat generation of the Xuan components, this kind of dispersion does not meet the heat dissipation requirements. Some people increase the heat dissipation area of the heat sink to improve the heat dissipation. ability. However, to increase the heat dissipation area, it is necessary to increase the volume of the heat sink, so that the space occupied by it and the increase of this ratio are contrary to the trend of the increasingly thin and light electronic components. It is difficult to meet: the higher the heat dissipation requirement. The mouth of the mouth 4 uses the heat pipe to assist the heat dissipation, and the heat pipe is placed in the heat sink fin, _ Γ Γ 乍 乍 在 在 在 在 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 发热 = = = = = = = = ) will heat the electronic _ sub-components. : The heat of the secret wind goes away, completes the upper wall of the electric wall, condenses into a liquid, the liquid is in the heat pipe; has higher heat transfer efficiency and heat transfer speed, and heats the heat of the electronic components ==: :=The main parameters of tube performance, the common heat pipe is based on the groove type, sintered type, fiber type and wire mesh type. The application of wire 1271501 mesh type heat pipe is more sturdy, and the feather wire mesh is made into a cylindrical shape. The manufacturing method of the net and the second and the net type heat pipes is generally manufactured by this method, and then the wire mesh is inserted into the copper pipe. The contact is used, so the palm/,,,/〆 is inward-facing on the screen, and the wall between the tube and the screen is not good (-tecticb〇„ding), which makes it easy for the screen to make bribes during the refining process. Connected or co-dissolved n into a bad shell, using spring support, easy to make the formation of the force of the dog., the provision of bad - fresh details of the capillary structure damage tube 3 = = = = heat pipe, including - pipe body , disposed in the tube body to support the screen 盥 盥 骅 启 2 work; | shell, the heat officer further includes a support made of material, ~ "e body wall contact, the support system consists of porous material Supporting body;; ϊΓ :: From the struts, the wire mesh and the branch pipe body, the silk space and the filling medium ====, then the ❿ With good contact, (10) m Ming Ming along the round financial direction, even force, brother. At the same time, the support body 罝古-土 α 1 ～, 、, & I can not be used to make the support body bend or squash in the heat pipe, which makes the heat pipe have a wider range of uses. Low addition = W# 'm effectively reduces the manufacturing process and reduces the mouth-and-mouth, and prevents the damage to the screen during the sintering process. [Embodiment] The following is a description of the present invention with reference to the following. The heat pipe is used for heat-generating electronic components (not shown), and the loose support bodies 6 and i are filled in the wire mesh 4 of the pipe body, and are placed in the wire mesh 4. The pipe body 2 is made of good thermal conductivity. Made of metal, in this embodiment, the tube body 21271501 is made of steel. Copper, set a small amount of H to form a capillary series. The material of _ 4 can be ^ 砥疋, so that no chemical reaction occurs between the screen 4 and the working medium. , the material is supported by: the body is in contact with the support body 6 is made of a porous material such as a porous metal such as a bulk metal or a polyethylene; the support 6 can also be a hollow structure. The solid liquid 'can coexist with the supporting body 6 and the wire mesh 4, as shown in the second to ninth figures. 'The heat pipe is produced as follows. · · For the required wire mesh 4, the pipe body 2 and the supporting body 6; σ月看弟四至弟六图' The shape of the screen 4 is cut into the shape of the tube 2; j 4 minus the sub-roll is suitable for reading 2 inner wall, please refer to the seventh picture, the support body 6 The wire is placed in good contact with the inner wall of the pipe body 2; the weir image, the wire mesh 4, the force of the wire mesh tube 4 draws the inside of the pipe body 2 into a vacuum and fills the working medium, and is packaged to complete the heat 丨::, = As shown in the first person and the ninth figure, in the present invention, the wire mesh 4 and the support body 6 may be placed in the pipe body 2 together with the support body 6, and the simplification of the branch support ff 6 may be the entire length. The structure 'makes the screen 4 to have a good supporting effect over the entire length. The support body 6 can also be in the form of a segmented type of branching, which can achieve the same effect. At the same time, it is more hot; the 6-part part of the scorpion is bent, the medium 'fine work ^. The hole of the ^ tooth® & moves toward the other end, in another (four) trend: #为体网4孔之Under the action of capillary action, it returns to the heat absorption of the heat pipe, and enters the work, and the heat dissipation of the electronic components is realized. In order to vaporize the working medium, the gas formed by the 1271501 is subjected to less resistance when operating in the thermal officer, and the opening ratio of the branch body 6 is preferably greater than 50%. The net 4 shed ^ ‘ metal or porous polymer material support body 6 supports the wire mesh 4, so that the wire wall has good contact, which is favorable for the heat transfer of the heat-generating electronic components. Bend two Ge ah flat: ΐίϊ Ϊ Ϊ 6 has a certain degree of toughness, so that the support body 6 in the heat _ bow money her, so that the fresh money for the Syrian post. The company zh heat:: t 'can achieve the wire 4 and the inner wall of the pipe body 1 = f method of processing the heat pipe without the knot, the inner wall of the pipe body 1 and the wire mesh 4 between the 0-week direction and uniform force, can be effective Extend the service life of the heat pipe. In summary, the present invention is in accordance with the requirements of the invention patent, and the above mentioned is only the hair of the present. It is difficult to make up for it, and the _= out of the special...but the 'killer' who made the skill of the duck god Within the scope. (10) / 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The working flow chart of the method for manufacturing the heat pipe of the invention; the fourth to the figure is a part of the working state of the fresh manufacturing method of the present invention, and the eighth and the ninth drawings are part of the working state of another embodiment of the heat pipe manufacturing method of the present invention. Component Symbol Description Tube Support 1 Wire Mesh 6