TWI271246B

TWI271246B - Electrolytic processing apparatus and method

Info

Publication number: TWI271246B
Application number: TW092100219A
Authority: TW
Inventors: Yuzo Mori; Mitsuhiko Shirakashi; Masayuki Kumekawa; Hozumi Yasuda; Itsuki Kobata
Original assignee: Yuzo Mori; Ebara Corp
Priority date: 2002-01-08
Filing date: 2003-01-07
Publication date: 2007-01-21
Also published as: US20050115838A1; TW200301717A; WO2003057948A1; JP2003205428A

Abstract

There is provided an electrolytic processing apparatus and method that can effect processing of a substrate with high processing precision and can produce an intended form of processed substrate with high accuracy of form. The electrolytic processing apparatus includes: a holder for holding a substrate; a processing electrode that can come close to the substrate; a feeding electrode for feeding electricity to the substrate; an ion exchanger disposed in the space between the substrate and the processing electrode, or the substrate and the feeding electrode; a fluid supply section for supplying a fluid into the space; a power source for applying a voltage between the processing electrode and the feeding electrode; a drive sections for allowing the substrate and the processing electrode, facing each other, to make a relative movement; and a numerical controller for effecting a numerical control of the drive sections.

Description

1271246 五、發明說明（1) --- [發明所屬之技術領域] 本發明係關於電解加工裝置及方法，尤户一德田、音 4曰種用於加工基板（諸如半導體晶圓）表面之¥電材料或用於移除黏著在基板表面之雜質的電解加工裝置及方法。 ,、 [先前技術] 近年來，明顯傾向使用具有低電卩且率與電子遷移卩且4二 (electromigration resistance)的鋼（cu)取代 |呂 < 姜呂1271246 V. INSTRUCTION DESCRIPTION (1) --- [Technical Field to Be Invented by the Invention] The present invention relates to an electrolytic processing apparatus and method, and is used for processing a surface of a substrate (such as a semiconductor wafer). An electrical material or an electrolytic processing apparatus and method for removing impurities adhering to a surface of a substrate. , [Prior Art] In recent years, there has been a clear tendency to use steel (cu) with low electric enthalpy and rate and electron migration resistance to replace | 吕 < Jiang Lu

合金，以作為用於形成基板（諸如半導體晶圓）上之互1 電路（interconnetion circuit)的材料。銅互連線 (interconnect)通常藉由將銅填充於形成在基板表面中的微細凹槽而形成，有多種習知之用於形成該銅互連線的技術，包含化學氣相沈積（CVD)、濺鍍及電鍍，根據任一種這樣的技術’銅膜係形成於基板之實質地整個表面中，接著以化學機械研磨（chemical mechanical polishing’ CMP)移除多餘的銅。弟8A圖至第8C圖係以製程步驟的順序說明形成具有銅互f線之該基板W的實例。如f 8A圖所示，諸如二氧化矽 2 2 ί 5 :Ϊ電常數材料膜之絕緣膜2係沈積於導電層An alloy as a material for forming an interconnetion circuit on a substrate such as a semiconductor wafer. Copper interconnects are typically formed by filling copper into fine recesses formed in the surface of the substrate, and a variety of conventional techniques for forming the copper interconnects, including chemical vapor deposition (CVD), Sputtering and electroplating, according to any of the techniques 'a copper film is formed on substantially the entire surface of the substrate, followed by chemical mechanical polishing 'CMP' to remove excess copper. 8A to 8C illustrate an example of forming the substrate W having copper f-lines in the order of the process steps. As shown in FIG. 8A, an insulating film 2 such as a ruthenium dioxide 2 2 ί 5 : germanium constant material film is deposited on the conductive layer.

於半導體基材！上互上’其中該導U 13係形成影/姓刻技術而形成於^用的接觸孔3與溝渠4係藉由微 .^ ^ ^ ^ ^成於、、、巴緣膜2中。之後，氮化钽阻障層5 或類似物係形成於整個本 ^ a ^ 口表面上，且作為電鍍用之電供應層的種子層7係形成於阻障層5上。然後，如第8B圖所；丄^ 口所不’在基板W表面上進行銅電鍍，On semiconductor substrates! In the upper side, the contact hole 3 and the trench 4 formed by the U 13 system are formed by the micro-^^^^^, and are formed in the film 2 of the film. Thereafter, a tantalum nitride barrier layer 5 or the like is formed on the entire surface of the surface, and a seed layer 7 as an electric supply layer for electroplating is formed on the barrier layer 5. Then, as shown in Fig. 8B, the copper plating is performed on the surface of the substrate W.

314314.ptd314314.ptd

第10頁 1271246 五、發明說明（2) 而將接觸孔3與溝渠4填充以銅，並同時沈積銅膜6於絕緣膜2上。其次，藉由化學機械研磨移除絕緣膜2上的銅膜6 與阻障層5，以使填充於接觸孔3與溝渠4中之互連線用銅膜的表面與絕緣膜2表面實質上位於相同的平面上，因而形成如第8C圖所示之由銅膜6組成的互連結構 (interconnection)。不同類型裝置中的元件近來已變得更微細且要求更高的精度，由於次微米製造技術已廣泛地使用，所以材料性質主要為加工方法所影響。在使用此種習知機械加工方法的狀況下，在工件的所欲部位係以物理方式破壞，並藉由工具而由工件表面移除，所以可能產生諸多缺陷而劣化工件性質。因此，在未劣化材料性質的情況下進行加工變得重要。諸如化學研磨、電解加工及電解研磨等若干加工方法一直在進行開發，以解決此問題。相對於習知的物理加工，這些方法係藉由化學分解反應進行移除加工或類似加工。因此，這些方法並不受塑性變形所造成之缺陷（諸如變樣層（altered layer)與差排（dislocation))的影響，以使得在未劣化材料性質的情況下可進行加工。利用離子交換器之催化反應並於超純水中進行加工的加工方法已開發成為電解加工方法，第9圖說明此電解加工方法的原理。第9圖係表示當安裝於加工電極1 4上的離子交換器1 2a及安裝於饋電電極1 6上的離子交換器1 2b與工件1 0表面接觸或靠近時之離子狀態，其中電壓係由電源1 7Page 10 1271246 V. Description of Invention (2) The contact hole 3 and the trench 4 are filled with copper, and a copper film 6 is simultaneously deposited on the insulating film 2. Next, the copper film 6 on the insulating film 2 and the barrier layer 5 are removed by chemical mechanical polishing so that the surface of the copper film for the interconnect line filled in the contact hole 3 and the trench 4 and the surface of the insulating film 2 are substantially They are located on the same plane, thus forming an interconnection composed of the copper film 6 as shown in Fig. 8C. Components in different types of devices have recently become finer and require higher precision, and because sub-micron fabrication techniques have been widely used, material properties are primarily affected by processing methods. In the case of using such a conventional machining method, the desired portion of the workpiece is physically destroyed and removed by the surface of the workpiece by the tool, so that many defects may be generated to deteriorate the properties of the workpiece. Therefore, it becomes important to carry out processing without deteriorating the properties of the material. Several processing methods such as chemical grinding, electrolytic machining and electrolytic grinding have been developed to solve this problem. These methods are subjected to removal processing or the like by chemical decomposition reaction as compared to conventional physical processing. Therefore, these methods are not affected by defects caused by plastic deformation, such as altered layers and dislocations, so that processing can be performed without deteriorating the properties of the material. A processing method using a catalytic reaction of an ion exchanger and processing in ultrapure water has been developed as an electrolytic processing method, and Fig. 9 illustrates the principle of this electrolytic processing method. Figure 9 is a diagram showing the ion state when the ion exchanger 12a mounted on the processing electrode 14 and the ion exchanger 12b mounted on the feeding electrode 16 are in contact with or close to the surface of the workpiece 10, wherein the voltage system Power supply 1 7

314314.ptd 第11頁 1271246 五、發明說明（3) 施加於加工電極1 4與饋電電極1 6之間，且液體1 8 (諸如超純水）係由液體供應部1 9供應至加工電極1 4、饋電電極1 6 與工件1 0之間。在本電解加工的狀況中，諸如超純水之液體18中的水分子20係使用離子交換器12a， 12b而有效率地解離成氫氧離子2 2與氫離子2 4。所產生的氫氧離子2 2係藉由工件1 0與加工電極1 4間的電場並藉由液體1 8的流動，而傳送至正對於加工電極1 4的工件1 0表面，藉此提高工件10 周圍的氫氧離子2 2密度，且氫氧離子2 2係與工件1 0的原子 1 0 a發生反應，藉由此反應所產生的反應產物2 6係於液體 18中分解，並藉由液體1 8的流動而沿著工件1 0表面由工件 1 0移除，因而完成工件1 0表面的移除加工。在使用前揭方法藉由離子交換器進行導電材料之電解加工的過程中，無法將習知機械加工所普遍使用的數值控制機構直接應用於此電解加工中。在這方面，電解加工方法係利用氫氧離子與工件原子間的化學交互作用。於是，即使當工件與工具（電極）彼此並未接觸，加工現象仍發生。因此，電解加工不同於藉由物理破壞工件而完成加工之機械加工的加工原理。更具體地說，在一般的機械加工中，係使彼此接觸的工件與工具得以進行相對運動，以便對工件進行物理破壞而完成加工。當諸如加工量到達希冀的加工量時，使工件與工具分開不接觸便可終止加工的進行，即使當工具越過工件表面時，也不會進行加工。另一方面，根據利用反應物質與工件間之化學交互作用的電解加工法，如前所述，即使當工具（電極）未與工件接觸，314314.ptd Page 11 1271246 V. Description of the Invention (3) Applied between the processing electrode 14 and the feeding electrode 16 and the liquid 18 (such as ultrapure water) is supplied from the liquid supply portion 19 to the processing electrode 1 4, between the feeding electrode 1 6 and the workpiece 10 . In the case of the present electrolytic processing, the water molecules 20 in the liquid 18 such as ultrapure water are efficiently dissociated into the hydroxide ions 2 2 and the hydrogen ions 24 using the ion exchangers 12a, 12b. The generated hydroxide ions 2 2 are transferred to the surface of the workpiece 10 facing the processing electrode 14 by the electric field between the workpiece 10 and the processing electrode 14 and by the flow of the liquid 18, thereby improving the workpiece. 10 the surrounding hydroxide ion 2 2 density, and the hydroxide ion 2 2 system reacts with the atom 10 a of the workpiece 10 , and the reaction product 26 generated by the reaction is decomposed in the liquid 18 by The flow of the liquid 18 is removed from the workpiece 10 along the surface of the workpiece 10, thereby completing the removal process of the surface of the workpiece 10. In the process of electrolytic processing of a conductive material by an ion exchanger, the numerical control mechanism commonly used in conventional machining cannot be directly applied to this electrolytic processing. In this regard, electrolytic processing methods utilize chemical interactions between hydroxide ions and workpiece atoms. Thus, even when the workpiece and the tool (electrode) are not in contact with each other, a processing phenomenon occurs. Therefore, electrolytic machining is different from the machining principle of machining that completes machining by physically damaging the workpiece. More specifically, in general machining, the workpieces in contact with each other are moved relative to each other to physically destroy the workpiece to complete the machining. When the machining amount reaches the desired machining amount, the machining can be terminated without the workpiece being separated from the tool, and the machining is not performed even when the tool passes over the surface of the workpiece. On the other hand, according to the electrolytic processing method using chemical interaction between the reaction material and the workpiece, as described above, even when the tool (electrode) is not in contact with the workpiece,

314314.ptd 第12頁 1271246 五、發明說明（4) 在反應物質數量達特定水平時，仍會發生加工現象。因此，當工具（電極）越過已完成預定數量加工之工件部分的表面時，仍無可避免地會發生加工現象。因此，為了藉由利用反應物質與工件間之化學交互作用的電解加工法’以將導電材料以南加工精度進行加工而形成希冀的加工工件外形，需要一種控制系統，此種控制系統不僅在機械加工的狀況中控制工件與工具間的接觸狀態（工具的位置），且亦控制諸如氫氧離子之反應物質與工件原子間的化學交互作用。 [發明内容] 本發明已鑑於前揭背景技藝的情形而完成。因此，本發明之目的在於提供一種電解加工裝置與方法，可以高加工精度完成表面具有導電材料（作為待加工的材料）之工件的加工，並可形成具有高精度外形之希冀的加工工件外形。為達成前揭目的，本發明提供一種電解加工裝置，該裝置包括：固定座，用於可拆卸自如地固持工件；加工電極，可靠近或接觸為固定座所固持的工件；饋電電極，用於將電力供應至為固定座所固持的工件；離子交換器，配置於工件與加工電極間之空間以及工件與饋電電極間之空間中的至少一個空間中；流體供應部，用於將流體供應至其中存在有離子交換器之工件與加工電極及饋電電極中之至少其中一個電極之間；電源，用於施加電壓於加工電極與饋電電極之間；驅動部，用於使彼此面對且為固持座所314314.ptd Page 12 1271246 V. INSTRUCTIONS (4) When the amount of reactive substances reaches a certain level, processing still occurs. Therefore, when the tool (electrode) passes over the surface of the workpiece portion where the predetermined number of machining has been completed, the machining phenomenon inevitably occurs. Therefore, in order to form a processed workpiece shape by electrolytic processing using a chemical interaction between a reactive substance and a workpiece to process the conductive material to a south processing precision, a control system is required, which is not only in the machine The state of contact between the workpiece and the tool (the position of the tool) is controlled in the processing state, and the chemical interaction between the reactant such as hydroxide ions and the workpiece atom is also controlled. SUMMARY OF THE INVENTION The present invention has been made in view of the circumstances of the prior art. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an electrolytic processing apparatus and method which can perform processing of a workpiece having a conductive material (as a material to be processed) on a surface with high processing precision, and can form a workpiece shape having a high-precision shape. In order to achieve the foregoing object, the present invention provides an electrolytic processing apparatus comprising: a fixing seat for detachably holding a workpiece; a machining electrode which can be brought close to or in contact with a workpiece held by the fixing seat; and a feeding electrode Supplying electric power to a workpiece held for the fixed seat; an ion exchanger disposed in at least one of a space between the workpiece and the processing electrode and a space between the workpiece and the feeding electrode; and a fluid supply portion for discharging the fluid Supplying between the workpiece in which the ion exchanger is present and at least one of the processing electrode and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a driving portion for making each other face For the holding seat

314314.ptd 第13頁 1271246 五、發明說明（5) 固持的工件與加工電極得以進行相對運動；以及數值控制器，用於完成驅動部的數值控制。本電解加工裝置得以將加工前或加工期間的工件外形與希冀的加工後工件外形做比較，而決定加工量（相當於二種外形之間的座標差），將參數資料（相當於加工量）輸入數值控制器並且根據所輸入的資料而完成驅動部的數值控制，其中該驅動部用於使彼此面對之為固定座所固持的工件與加工電極得以進行相對運動。在該數值控制下進行作業的電解加工裝置可製造成具有高精度外形之希冀的加工工件外形。該電源可將控制在定值的電流或電壓供應至加工電極與饋電電極之間。在電解加工期間，當加工電極與饋電電極之間流動的電流控制在定值時，加工速率便為固定。在該狀況中，加工量係取決於電流值與加工時間的乘積。因此，在加工電極與饋電電極之間流動的電流控制在定值的狀況下，僅藉由數值控制加工時間（亦即工件與加工電極彼此面對的期間），使得電解加工現象發生（停留時間），便可獲得具有高精度外形之希冀的加工工件外形。數值控制器可藉由驅動部而對諸如為固持座所固持之工件與加工電極間的相對運動速度進行數值控制。當在彼此面對且為固定座所固持之工件與加工電極間的相對運動得以改變相對速度而進行電解加工時，可對可變的相對運動速度進行數值控制，此舉使電解加工得以在314314.ptd Page 13 1271246 V. INSTRUCTIONS (5) The relative movement of the held workpiece and the machining electrode; and the numerical controller for numerical control of the drive unit. The electrolytic processing device can compare the shape of the workpiece before or during processing with the shape of the workpiece after processing, and determine the processing amount (corresponding to the coordinate difference between the two shapes), and the parameter data (equivalent to the processing amount) The numerical controller is input and the numerical control of the driving portion is performed according to the input data, wherein the driving portion is used for relative movement of the workpiece and the machining electrode which are held by the fixing base facing each other. The electrolytic machining apparatus that operates under this numerical control can be manufactured into a workpiece shape with a high-precision shape. The power supply supplies a current or voltage controlled at a constant value between the processing electrode and the feed electrode. During the electrolytic processing, when the current flowing between the processing electrode and the feeding electrode is controlled to a constant value, the processing rate is fixed. In this case, the amount of processing depends on the product of the current value and the processing time. Therefore, when the current flowing between the processing electrode and the feeding electrode is controlled to a constant value, the processing time is only controlled by the numerical value (that is, the period during which the workpiece and the processing electrode face each other), so that the electrolytic machining phenomenon occurs (stays Time), you can get the shape of the processed workpiece with the high-precision shape. The numerical controller can numerically control the relative movement speed between the workpiece held by the holder and the machining electrode by the driving portion. When the relative motion between the workpiece and the machining electrode which are faced to each other and held by the fixing seat is changed by the relative speed for electrolytic processing, the variable relative movement speed can be numerically controlled, so that the electrolytic machining can be performed.

314314.ptd 第14頁 1271246 五、發明說明（6) 工件之加工表面的特定點上加工一段最佳化的加工時間 (停留時間）。或者，數值控制器可藉由驅動部而對為固定座所固持之工件與加工電極間的相對步進運動的止動時間進行數值控制。當在彼此面對且申固定座所固持之工件與加工電極間得以做相對步進運動而進行電解加工時，該運動中的止動時間係經數值控制，此舉使電解加工得以在工件之加工表面的特定點上加工一段最佳化的加工時間（停留時間）。在此所稱之a相對步進運動〃意指工件與加工電極之其中任一者或二者進行運動，以使加工電極在工件上反覆進行特定距離之運動與停止的相對運動。本發明提供一種電解加工方法，該方法包括：提供加工電極、饋電電極與離子交換器，該離子交換器配置於為固定座所固持之工件與加工電極間之空間及工件與饋電電極間之空間中的至少一個空間中；當電力由饋電電極供應至工件時，加工電極得以靠近或接觸為固定座所固持之工件；將流體供應至其中存在有離子交換器之工件與加工電極及饋電電極中之至少其中一個電極之間的空間；施加電壓於加工電極與饋電電極之間；以及在以數值控制器數值控制運動的情況下，使彼此面對且為固定座所固持的工件與加工電極得以進行相對運動。本電解加工方法可包括：量測加工前和/或加工期間的工件外形；將所量測之外形與工件加工後之希冀外形的314314.ptd Page 14 1271246 V. INSTRUCTIONS (6) An optimized processing time (residence time) is processed at a specific point on the machined surface. Alternatively, the numerical controller may numerically control the stopping time of the relative stepping motion between the workpiece held by the fixed seat and the machining electrode by the driving portion. When the workpieces facing each other and the holder held by the holder are subjected to the relative stepping motion for electrolytic machining, the stopping time in the movement is numerically controlled, so that the electrolytic machining can be performed on the workpiece. An optimized processing time (residence time) is processed at a specific point on the machined surface. As used herein, a relative step motion means that either or both of the workpiece and the machining electrode are moved to cause the machining electrode to repeatedly move relative to the workpiece at a particular distance. The invention provides an electrolytic processing method, which comprises: providing a processing electrode, a feeding electrode and an ion exchanger, wherein the ion exchanger is disposed between a space between the workpiece and the processing electrode held by the fixing seat and between the workpiece and the feeding electrode In at least one of the spaces; when power is supplied from the feed electrode to the workpiece, the machining electrode is brought close to or in contact with the workpiece held by the fixed seat; the fluid is supplied to the workpiece and the processing electrode in which the ion exchanger is present and a space between at least one of the feeding electrodes; applying a voltage between the processing electrode and the feeding electrode; and, in the case of controlling movement by a numerical controller value, facing each other and being held by the fixing seat The workpiece and the machining electrode are allowed to move relative to each other. The electrolytic machining method may include: measuring the shape of the workpiece before and/or during the processing; and measuring the shape and the shape of the workpiece after processing

314314.ptd 第15頁 1271246 五、發明說明（7) 座標資料輸入數值控制器中；以及根據量測外形與希冀外形之間的座標差，而對為固定座所固持之工件與加工電極間的相對運動速度進行數值控制。本電解加工方法可包括：量測加工前和/或加工期間的工件外形；將所量測之外形與工件加工後之希冀外形的座標資料輸入數值控制器中；以及根據量測外形與希冀外形之間的座標差，而對為固定座所固持之工件與加工電極間之相對步進運動中的止動時間進行數值控制。本發明之前揭及其他目的、特徵與優點將以實例配合附圖而由下列說明變得清楚，其中該附圖說明本發明的較佳實施例。 [實施方式] 現將參考圖式說明本發明的較佳實施例。雖然以下說明的實施例係應用於使用基板作為待加工工件並移除（研磨）形成於基板表面上之銅的電解加工裝置（電解研磨裝置），但是本發明無疑可應用於其他工件及其他電解加工〇第1圖表示根據本發明第一個實施例之電解加工裝置。本電解加工裝置包括用於吸引並固持基板W正面朝上 (所謂的 ''面朝上〃方式）之基板固定座3 0以及具有碟狀電極部3 6 (由絕緣材料製成）的電極頭3 8。電極部3 6中嵌有交錯配置且表面（下表面）暴露的扇形加工電極3 2與饋電電極3 4，電極頭3 8則定位於基板固定座3 0上方。由層疊層（疊片）所組成的離子交換器4 0係安裝於電極部3 6的下314314.ptd Page 15 1271246 V. INSTRUCTIONS (7) Coordinate data is input into the numerical controller; and based on the coordinate difference between the measured shape and the desired shape, and between the workpiece held by the fixed seat and the machining electrode The relative motion speed is numerically controlled. The electrolytic machining method may include: measuring a shape of the workpiece before and/or during the processing; inputting the coordinate data of the measured shape and the desired shape of the workpiece into the numerical controller; and measuring the shape and the shape according to the shape The coordinate difference between the two is numerically controlled for the stop time in the relative stepping motion between the workpiece held by the fixed seat and the machining electrode. Other objects, features, and advantages of the invention will be apparent from [Embodiment] A preferred embodiment of the present invention will now be described with reference to the drawings. Although the embodiments described below are applied to an electrolytic processing apparatus (electrolytic polishing apparatus) using a substrate as a workpiece to be processed and removing (grinding) copper formed on the surface of the substrate, the present invention is undoubtedly applicable to other workpieces and other electrolysis. Processing Fig. 1 shows an electrolytic processing apparatus according to a first embodiment of the present invention. The electrolytic processing apparatus includes a substrate holder 30 for attracting and holding the substrate W face up (so-called 'face-up manner) and an electrode tip having a dish electrode portion 36 (made of an insulating material) 3 8. A fan-shaped processing electrode 32 and a feeding electrode 34 which are staggered and have a surface (lower surface) exposed are embedded in the electrode portion 36, and the electrode tip 38 is positioned above the substrate holder 30. An ion exchanger 40 composed of a laminate (laminated) is mounted under the electrode portion 36

314314.ptd 第16頁 1271246 五、發明說明（8) 表面美=蓋加工電㈣與鎮電電極“的表面。支J 疋座3〇係直接連接至可旋轉自如地進行支撑之支撐軸42的上端部。馬達44作為使叉牙之之基板W與加工電極32之間發生相土板固疋座30所固持並配置於支撐軸42旁邊。同步皮帶^動的第―驅動部，達（第一驅動部）44之間，以藉由^ f ^撐H馬的致動而使基板固定座3 〇與為基固a 驅部）4 4 W一同轉動。口疋座3 0所固持之基板電極頭3 8係向上連接至可太伞^ 端，該旋轉臂48的基部係連接至*轉動之旋轉臂48的自由空心旋轉軸54係藉由垂直運動之二=車:上4的上端，該珠螺桿52進行垂直運動。馬彡K 5°的致動，而經由滾所固持之基板W與加工電極32之=由二於使由基板固座3〇 ^ # „ t, "η 垂直地運動。同牛*册u止人並付以與紋轉軸54—同動部）5 fi夕^ ^3於旋轉軸5 4與馬達（第二驅旋轉軸二以藉由馬達（第二驅動部）56的致動而使疋轉軸54與旋轉臂48一同旋轉（轉動）。之達6〇2 Ϊ ’電極頭38係直接連接至空心馬彡6°，該空心馬極3 2之η :於使由基板固定座3 〇所固持之基板界與加工電 (^ ^ Β生相對運動的第三驅動部，以便藉由空心馬達弟二驅動部）60的致動而進行旋轉。交換:ί 例中，離子交換器40為由一對強酸性陽離子子二二& 62b及插置於纖維62a， 621}間的強酸性陽離又、溥膜62c所組成之三層結構（疊片）。離子交換器314314.ptd Page 16 1271246 V. INSTRUCTIONS (8) Surface beauty = cover processing electricity (4) and the surface of the electrification electrode ". J 疋 3 〇 is directly connected to the support shaft 42 which is rotatably supported The upper end portion of the motor 44 is held by the soil plate fixing seat 30 between the substrate W and the machining electrode 32 of the fork, and is disposed beside the support shaft 42. The first drive portion of the synchronous belt is driven. Between the driving portions 44, the substrate holder 3 is rotated together with the substrate 4 by the actuation of the H. The substrate held by the port 30 is held. The electrode tip 38 is connected upwardly to the end of the umbrella, and the base of the rotating arm 48 is connected to the free hollow rotating shaft 54 of the rotating arm 48. The vertical movement of the second = the upper end of the upper 4, The bead screw 52 performs vertical movement. The action of the stirrup K 5°, and the substrate W and the processing electrode 32 held by the roll are made of the substrate fixed by 3 〇 ^, "η vertical Ground movement. With the ox* booklet u and the person with the slanting shaft 54-synchronous part) 5 fi ^ ^ ^ 3 on the rotating shaft 5 4 and the motor (the second drive rotating shaft two by the motor (second driving part) 56 Actuation causes the boring shaft 54 to rotate (rotate) together with the rotating arm 48. Up to 6 〇 2 Ϊ 'The electrode head 38 is directly connected to the hollow stirrup 6°, the hollow horse pole 3 2 η: The substrate boundary held by the substrate holder 3 is rotated by the actuation of the machining unit (the third driving portion that moves relative to the movement to drive the hollow motor shaft) 60. In the example, The ion exchanger 40 is a three-layer structure (laminated) composed of a pair of strongly acidic cationic cations & 62b and a strong acid cation and a ruthenium film 62c interposed between the fibers 62a, 621}. Device

1271246 五、發明說明（9)^ ' --—..., ($片）4 0具有良好的透水性及換器40f對於基板W的暴露表面（下更表度面此且外’該離子交坦性。離子交換器40的結構可經配\ 又好的平膜用於該暴露表 .^ V _ 乂使付離子交換器薄昊露之離子六ί 換器纖維的疊片則配置於！恭路之雕于人換器薄膜的上方。直於该較佳方式係離子交換器40的各該有強酸性陽離子交換基（續酸基二^ 62^，62(：帶弱酸性陽離子交換臬（羧美）沾缺’、而，亦可使用帶有陰離子交換基（季銨基）的籬；一 " 有強鹼性 Μ工一祕I ,李子父換器、或帶有弱鹼性^ 級或更低等級之胺基）的離子交換器丨土 u離丁又佚卷的不織布可以諸如下製備：將纖維直徑20至50微米且孔隙率約9〇%的聚烯法織布進打所謂的射線嫁接聚合化處理（radiati〇n polymerization)’該射線嫁接聚合化處理包含將照射於不織布上及後續的嫁接聚合化處理上，藉此導入\ 接鏈；以及接著將所導入的嫁接鏈進行胺化，而導入= 基於其中。所導入之離子交換基的容量可由所導入之= 鏈的數量所決定。可使用諸如丙烯酸、苯乙稀、曱基丙酸酯、對苯乙烯磺酸鈉或氯曱基苯乙稀土 ^ (chloromethylstyrene)之單體進行嫁接聚合化處理，可藉由調整單體濃度、反應溫度及反應時間而進行嫁接量的控制。因此，嫁接度（亦即嫁接聚合化處理後之布重量對嫁接聚合化處理前之不織布重量的比例）最多、^ 為5 0 0%。總之，接枝聚合作用後所導入之離子交換基的1271246 V. INSTRUCTIONS (9)^ ' ---..., ($piece) 4 0 has good water permeability and the exposed surface of the converter 40f for the substrate W (the lower surface is this and the outside 'the ion The structure of the ion exchanger 40 can be used for the exposure table with a good flat membrane. ^ V _ 乂付付付付付付付付付付付付恭恭恭恭恭恭恭恭恭恭恭恭恭恭恭The road is engraved above the human converter film. Straight to the preferred mode is the strong acid cation exchange group of the ion exchanger 40 (continued acid group 2 62 ^, 62 (: with weakly acidic cation exchange enthalpy ( Carboxyl) can be used as a trap, but a hedge with an anion exchange group (quaternary ammonium group) can also be used; a " has a strong alkaline workmanship I, a plum master changer, or a weakly alkaline grade or A lower-grade amine-based ion exchanger, an alumina, and a non-woven fabric, can be prepared, for example, by forming a polyolefin woven fabric having a fiber diameter of 20 to 50 μm and a porosity of about 9 〇%. Radiation polymerization (radiati〇n polymerization) 'The radiation graft polymerization process includes irradiating the non-woven fabric And the subsequent graft polymerization treatment, thereby introducing the chain; and then ammating the introduced graft chain, and introducing = based thereon. The capacity of the introduced ion exchange group can be imported by the chain Depending on the amount, grafting polymerization can be carried out using monomers such as acrylic acid, styrene, mercaptopropionate, sodium p-styrenesulfonate or chloromethylstyrene, which can be adjusted by adjustment. The grafting amount is controlled by the body concentration, the reaction temperature and the reaction time. Therefore, the degree of grafting (that is, the ratio of the weight of the cloth after the graft polymerization treatment to the weight of the non-woven fabric before the graft polymerization treatment) is the highest, and is 0.5%. In summary, the ion exchange group introduced after graft polymerization

314314.ptd 第18頁 1271246 五、發明說明（ίο) ' -- 容量最大可為5 meq/g。帶有強酸性陽離子交換基的不織布可以下列方法製備：如同帶有強鹼性陰離子交換基之不織布的狀況，將維直徑20至50微米且孔隙率約90%的聚烯烴不織布進行所謂的射線嫁接聚合化處理，該射線嫁接聚合化處理包含將 r射線照射於不織布上及後續的嫁接聚合化處理，因而產生嫁接鏈；以及接著以熱硫酸將所導入的嫁接鏈進行處理，以將磺酸基導入於其中。倘若嫁接鏈係以熱磷酸進行處理，則可導入磷酸鹽基。嫁接度最多可達5〇〇%，且嫁接聚合化處理後所導入之離子交換基的容量最大可達5 meq/g ° 離子交換器40之各該疊層62a，62b，62c的基材可為諸如聚乙稀或聚丙稀之？K烯fe或任何其他有機聚合物。此外，除了不織布的形式之外，離子交換器可為編織品、帶材、多孔性材料、網材或短纖維等形式。當使用聚乙豨或t丙烯作為基材時，嫁接聚合化處理可藉由下列方式完成：首先將放射線（7射線或電子束）照射於基材上（預照射）而產生基，並接荖補芙盘輩辦获生反應，…獲得具有些許雜質之均；鏈早方面，當使用聚烯烴以外的有機聚合物作為基材時，可藉由將基材浸滲以單體並將放射線（7射線、電子束或紫外光射線）照射於基材上（同時照射），而完成基的聚合化處理。雖然本方法未能提供均勻的嫁接鏈，但其可應用於諸多種基材。314314.ptd Page 18 1271246 V. Description of the invention (ίο) ' -- The maximum capacity is 5 meq/g. A non-woven fabric having a strongly acidic cation exchange group can be produced by a method of so-called ray grafting of a polyolefin nonwoven fabric having a diameter of 20 to 50 μm and a porosity of about 90%, as in the case of a nonwoven fabric having a strongly basic anion exchange group. a polymerization treatment comprising irradiating r-rays onto a nonwoven fabric and subsequent graft polymerization, thereby producing a graft chain; and subsequently treating the introduced graft chains with hot sulfuric acid to treat the sulfonic acid groups Imported into it. If the graft chain is treated with hot phosphoric acid, a phosphate group can be introduced. The grafting degree can be up to 5% by weight, and the capacity of the ion exchange group introduced after the graft polymerization treatment can be up to 5 meq/g °. The substrate of each of the stacks 62a, 62b, 62c of the ion exchanger 40 can be For example, polyethylene or polypropylene? K-ene or any other organic polymer. Further, the ion exchanger may be in the form of a woven fabric, a tape, a porous material, a mesh material or a short fiber, in addition to the form of non-woven fabric. When polyethyl hydrazine or t propylene is used as the substrate, the graft polymerization treatment can be carried out by first irradiating radiation (7-ray or electron beam) onto the substrate (pre-irradiation) to generate a base, and then picking up In the early stage, when an organic polymer other than polyolefin is used as the substrate, the substrate can be impregnated with monomer and radiation ( The 7-ray, electron beam or ultraviolet ray is irradiated onto the substrate (simultaneous irradiation), and the polymerization treatment of the base is completed. Although the method fails to provide a uniform graft chain, it can be applied to a variety of substrates.

314314.ptd 第19頁 1271246 五、發明說明（π) 藉由使用由不織布（液體可由此流過，並具有陰離子交換基或陽離子交換基）製做之離子交換器4 0的各該疊層 6 2a，6 2b，6 2c，便得以在液體的離子與離子交換器的離子交換基之間進行離子交換反應。當離子交換器40的各該疊層62a，62b，62c僅具有陰離子交換基及陽離子交換基的其中一者時，可進行電解的材料會受限，此外可能因極性而形成雜質。為解決該問題，可將陰離子交換器及陽離子交換器重疊，或可使離子交換器4 0的各該疊層62a，62b，6 2c本身帶有陰離子交換器及陽離子交換器二者，藉此可擴大待加工材料的範圍，並可抑制雜質的形成。再者，以離子交換材料之疊層所組成的多層結構（諸如不織布、編織品及多孔性薄膜）製做離子交換器4 0，便得以增加離子交換器4 0的總離子交換容量，藉此便可在諸如銅的移除（研磨）加工中抑制氧化物的形成，以避免對於加工速率產生負面影響。在這方面，在移除加工期間，當離子交換器4 0的總離子交換容量小於離子交換器4 0所接納的銅離子數量時，氧化物便無可避免地形成於離子交換器4 0的表面上或内部中，此將對於加工速率產生負面影響。因此，氧化物的形成係受離子交換器的離子交換容量所影響，而超過容量的銅離子便會形成氧化物。因此，可使用離子交換材料（具有增加總離子交換容量之離子交換材料）之疊層所組成的多層離子交換器作為離子交換器，便可有效抑制氧化物的形成。314314.ptd Page 19 1271246 V. Description of the Invention (π) Each of the laminates 6 of the ion exchanger 40 made of a non-woven fabric (the liquid can flow therethrough and having an anion exchange group or a cation exchange group) is used. 2a, 6 2b, 6 2c, an ion exchange reaction between the ions of the liquid and the ion exchange groups of the ion exchanger. When each of the laminates 62a, 62b, 62c of the ion exchanger 40 has only one of an anion exchange group and a cation exchange group, the material which can be electrolyzed is limited, and in addition, impurities may be formed due to polarity. In order to solve this problem, the anion exchanger and the cation exchanger may be overlapped, or each of the stacks 62a, 62b, 6 2c of the ion exchanger 40 may be provided with both an anion exchanger and a cation exchanger. It can expand the range of materials to be processed and suppress the formation of impurities. Further, by forming a multi-layer structure (such as a nonwoven fabric, a woven fabric, and a porous film) composed of a laminate of ion exchange materials, the ion exchanger 40 can be used to increase the total ion exchange capacity of the ion exchanger 40. The formation of oxides can be suppressed in a removal (grinding) process such as copper to avoid a negative impact on the processing rate. In this regard, during the removal process, when the total ion exchange capacity of the ion exchanger 40 is less than the amount of copper ions received by the ion exchanger 40, the oxide is inevitably formed in the ion exchanger 40. On the surface or inside, this will have a negative impact on the processing rate. Therefore, the formation of oxides is affected by the ion exchange capacity of the ion exchanger, and the copper ions exceeding the capacity form oxides. Therefore, a multilayer ion exchanger composed of a laminate of an ion exchange material (an ion exchange material having an increased total ion exchange capacity) can be used as an ion exchanger, and the formation of an oxide can be effectively suppressed.

314314.ptd 第20頁 1271246 五、發明說明（12) 較佳方式係離子交換器4 0具希冀至少正對於工件的材料具有性。例如’通常使用市售發泡聚 Rode 1公司所製造）作為CMp研磨有極佳的耐磨性。藉由提供多數作為離子交換器40之各該疊層的脂平板中，因而使平板具有離子而希冀材料性質具有、、吸水性" 根據本貫施例，複數個扇形配置於電極部36中，而電源68的 =6而父錯連接至電極板6 4。連接 ’交為加工電極3 2，而連接至電源饋電電極3 4。此施加於諸如銅的 ^陰極側進行。依據待加工的材、电極’而陽極側可為加工電極。料為銅、銦、鐵或類似材料時，因此’連接至電源6 8陰極的電極連接至陽極的電極板6 4則應為饋 S石夕或類似材料的狀況中，電此’連接至電源陽極的電極板應極的電極板則應為饋電電極。因此，藉由將加工電極3 2與 $置於電極部3 6的周緣方向上，電力供應至基板導電膜（待加工有透水性及吸水性，再者高硬度與良好的表面平坦氨酯 '、1C 100(Γ (由墊，I C 1 0 0 0相當硬並具個通孔，便可使用該製品材料，得以提供孔洞於樹父換器4 0所需的透水性，乃理所當然者。電極板6 4係於周緣方向上陰極與陽極則經由集電環至電源6 8陰極的電極板6 4 68陽極的電極板64則變為加工’因為銅的電解加工料而定，陰極側可為饋電更具體地說，當待加工材電解加工在陰極側進行，板6 4應為加工電極3 2，而電電極34。另一方面，在解加工在陽極側進行。因為加工電極，而連接至陰饋電電極34分開且交錯地 i更無須固定饋電部份以將部位）’而可在基板的整314314.ptd Page 20 1271246 V. INSTRUCTIONS (12) The preferred mode is that the ion exchanger 40 has at least the material properties of the workpiece. For example, 'usually produced by a commercially available foamed poly Rode 1 company') has excellent wear resistance as a CMp. By providing a plurality of the fat plates as the laminates of the ion exchangers 40, the plates are made to have ions, and the material properties are desirable, and the water absorption property is according to the present embodiment, and a plurality of sectors are disposed in the electrode portion 36. And the power source 68 = 6 and the parent is wrongly connected to the electrode plate 64. The connection 'turns to the processing electrode 3 2 and is connected to the power feeding electrode 34. This is applied to the cathode side such as copper. The anode side may be a processing electrode depending on the material to be processed, the electrode '. When it is made of copper, indium, iron or the like, therefore, the electrode plate connected to the anode of the power source 6.8 is connected to the anode. The electrode plate 64 should be in the condition of feeding or the like, and it is connected to the power source. The electrode plate of the anode electrode plate should be the feed electrode. Therefore, by placing the processing electrodes 3 2 and $ in the peripheral direction of the electrode portion 36, power is supplied to the substrate conductive film (water permeability and water absorption to be processed, and high hardness and good surface flat urethane) , 1C 100 (Γ (from the pad, IC 1 0 0 0 is quite hard and has a through hole, you can use the material of the product, to provide the water permeability required for the hole in the tree replacement device 40, which is taken for granted. The plate 6 4 is in the circumferential direction, the cathode and the anode are passed through the collector ring to the electrode plate of the cathode of the power source 6 8 , and the electrode plate 64 of the anode is processed. Because of the electrolytic material of copper, the cathode side can be More specifically, when the electrolytic processing of the material to be processed is performed on the cathode side, the plate 64 should be the processing electrode 32 and the electric electrode 34. On the other hand, the processing is performed on the anode side. Connected to the female feed electrode 34 separately and staggered i need not be fixed to the feed portion to place the part)

第21頁 1271246 五、發明說明（13) 個表面上完成加工。此外，與負極，便可分解電解產物南力t7 «I»表^面的平》土曰彳生。關於加工電極3 2與饋電生的加工電極3 2與饋電電極在，有鑑於此，較佳方式係屬、導電氧化物或導電陶瓷使用廣泛使用為電極的金屬可為諸如以下列方式獲得者電極上，並接著將經塗佈的化並強化電極。陶瓷製品通而獲得，且具有各種性質的物、碳化物及氮化物與非金原料中包含具有導電性的陶數值通常會增加，而造成所諸如翻之非氧化性材料或以電極表面，便可避免因電極降。以脈衝方式或交錯地改變正極 ’並可藉由多次重複加工而提電極3 4部分，因電解反應所發之氧化或分解通常為問題所使用碳、相當不活性的貴金作為饋電電極3 4的基材，而非或金屬化合物。貴金屬基電極 :將翻或銥電鍍於或塗佈於鈦電極在高溫下進行燒結以穩定常藉由將無機原料進行熱處理陶兗製品係由包括金屬氧化屬之各種原料所製做，而這些竟。當電極氧化時，電阻率的施加之電壓的增加。然而，以諸如氧化銀之導電氧化物保護基材氧化所造成的導電率下定座嘴7(3作為用於將純水或超純水供應至為基板固供應部，該純水喷嘴7〇配置於基板固定方間的純水θ ΐ = ί ί超純水供應至離子交換器4〇。在此的純水意： 0 LTs/ : 1〇\SiCm的水，而超純水意指導電率不i過 ./cm的水。本电9月的導電率在此意指25t、i大氣壓Page 21 1271246 V. INSTRUCTIONS (13) Finishing processing on the surface. In addition, with the negative electrode, the electrolytic product can be decomposed. Nanli t7 «I» table ^ surface of the flat" soil students. Regarding the processing electrode 32 and the feed electrode 32 and the feed electrode, in view of this, a preferred embodiment of the metal, a conductive oxide or a conductive ceramic using a metal widely used as an electrode can be obtained, for example, in the following manner. On the electrode, and then coated and strengthened the electrode. Ceramic products are obtained by all means, and the values of ceramics containing various properties, carbides and nitrides and non-goldic materials containing conductive materials are usually increased, resulting in non-oxidizing materials such as turning or electrode surfaces. It can be avoided due to electrode drop. Changing the positive electrode in a pulsed or staggered manner and extracting the electrode portion 34 by repeated processing, the oxidation or decomposition due to the electrolytic reaction is usually a problem with the use of carbon, a relatively inactive noble gold as a feed electrode. 3 4 substrates, not metal compounds. Precious metal base electrode: electroplating or coating on a titanium electrode to perform sintering at a high temperature to stabilize the heat treatment of the inorganic raw material. The ceramic pottery product is made of various materials including metal oxide, and these are actually made. . When the electrode is oxidized, the applied voltage of the resistivity increases. However, the fixed nozzle 7 (3 is used for supplying pure water or ultrapure water to the substrate solid supply portion) by the conductivity of the conductive oxide such as silver oxide to protect the substrate, the pure water nozzle 7〇 configuration The pure water θ ΐ = ί ί ultra pure water is supplied to the ion exchanger 4〇. The pure water here means: 0 LTs / : 1〇\SiCm water, and ultrapure water is intended to guide the electric rate. Not i./cm of water. The conductivity of this electricity in September means 25t, i atmospheric pressure

314314.ptd 第22頁 1271246 五、發明說明（14) (a t m )下的導電率。除了純水或超純水以外，亦可使用導電率不超過5 0 0 // S / c m的液體或任何電解溶液。藉由在加工期間供應該液體，便可移除諸如加工產物及溶解氣體等加工的不穩定因子，並可以良好的再生性 (reproducibility)均勻地完成加工。本電解加工裝置設有用於完成驅動部之數值控制的數值控制器7 2，亦即馬達（第一驅動部）4 4、馬達（第二驅動部）5 6及馬達（第三驅動部）6 0，以使彼此面對且為基板固定座3 0所固持的基板W與加工電極3 2得以進行相對運動。馬達（驅動部）4 4， 5 6， 6 0因而為可進行數值控制的伺服馬達，且該等馬達（驅動部）4 4，5 6，6 0之旋轉角與轉速係由來自數值控制器7 2的輸出訊號而進行數值控制。根據本實施例，當加工電極3 2與饋電電極3 4之間的電流流動為定值而進行電解加工時，數值控制器7 2進行數值控制：藉由馬達（第一驅動部）4 4而控制之為基板固持座 3 0所固持之基板W的轉速；藉由馬達（第二驅動部）5 6將旋轉臂4 8進行旋轉而控制之電極頭3 8的水平運動速度；以及藉由馬達（第三驅動部）6 0而控制之電極頭3 8的轉速。現將參考第2及第3圖而說明數值控制的實例。首先，如第2圖所示，量測加工前的基板（工件）外形。具體地說，加工前之外形的各座標點係於XY Z座標系統（其中Z軸係與作為基準面的XY平面正交）中進行量測，將所量測之加工前的外形資料輸入數值控制器7 2中。此外，關於加工前之外形的座標點（X，y，z 〇部分，希冀之加工後外形的314314.ptd Page 22 1271246 V. Description of invention (14) Conductivity at (a t m ). In addition to pure water or ultrapure water, liquids or any electrolytic solution with a conductivity of not more than 500 // S / c m can be used. By supplying the liquid during processing, unstable factors such as processed products and dissolved gases can be removed, and processing can be performed uniformly with good reproducibility. The electrolytic processing apparatus is provided with a numerical controller 7 2 for performing numerical control of the driving unit, that is, a motor (first driving unit) 44, a motor (second driving unit) 56, and a motor (third driving unit) 6 0, so that the substrate W and the processing electrode 32 which are faced to each other and held by the substrate holder 30 are relatively moved. The motor (drive unit) 4 4, 5 6, 6 0 is thus a servo motor that can be numerically controlled, and the rotation angle and rotational speed of the motors (drive parts) 4 4, 5 6, 60 are from the numerical controller. The output signal of 7 2 is numerically controlled. According to the present embodiment, when the current flow between the processing electrode 32 and the feeding electrode 34 is constant and electrolytic processing is performed, the numerical controller 7 performs numerical control: by the motor (first driving portion) 4 4 Controlled by the rotational speed of the substrate W held by the substrate holder 30; the horizontal movement speed of the electrode tip 38 controlled by the rotation of the rotating arm 48 by the motor (second driving portion); The number of revolutions of the electrode tip 38 controlled by the motor (third drive unit) 60. An example of numerical control will now be described with reference to Figures 2 and 3. First, as shown in Fig. 2, the shape of the substrate (workpiece) before processing is measured. Specifically, the coordinate points of the external shape before processing are measured in the XY Z coordinate system (where the Z-axis system is orthogonal to the XY plane as the reference plane), and the measured shape data before processing is input into the numerical value. Controller 7 2 . In addition, regarding the coordinate points of the outer shape before processing (X, y, z 〇 part, the desired shape of the processed

314314.ptd 第23頁 1271246 五、發明說明（15) 相應座標點（X，y，z 0亦輪的外形資料。此外，諸如有外形資料（每個馬達控制訊於任意時間輸入至數值控制當加工電極3 2與饋電電值而進行電解加工時，加工與加工時間的乘積決定加工電電極3 4之間流動的電流控值控制加工時間（亦即基板間），以使電解加工現象發有高精度外形之希冀的加工因此，根據本實施例， 1〜蘇取決於輸入於數值控制而決定各座標點上之：控制之為基板固定座3 〇所固 (苐一驅動部）5 6將旋轉臂的水平運動速度；以及藉由之電極頭3 8的轉速，而且將 5 6, 6 0中，以便對馬達（制0 入數值控制器7 2，以作為希冀關外形與加工速率的單元加工號脈衝的傳送速度）係預先或器72。極3 4之間的電流流動控制為定速率為固定，以藉此由電流值 ®。因此，在加工電極3 2與饋制在定值的狀況下，僅藉由數 W與加工電極3 2彼此面對的期生（停留時間），便可獲得具基板外形。各座標點在Z方向上的加工量z 器7 2中的資料。根據加工量z 藉由馬達（第一驅動部）44而持之基板W的轉速；藉由馬達 4 8進行旋轉而控制之電極頭μ 馬達（第三驅動部）60而控制矾號輸入馬達（驅動部）驅動部）4 4，5 6，6 0進行數值控臂接下來將說明藉由本電解加工裝置所進行的電解加首先’以基板固定座3〇吸引並 48將電極頭38移至為基板固定座固持基板W，並以旋轉 3 0所固持之基板w正上314314.ptd Page 23 1271246 V. Description of invention (15) The corresponding coordinate point (X, y, z 0 also has the shape information of the wheel. In addition, such as the shape data (each motor control message is input to the numerical control at any time) When the electrode 3 2 and the feed electric value are subjected to electrolytic processing, the product of the processing and the processing time determines the current control value processing time (ie, between the substrates) flowing between the processed electric electrodes 34 to cause the electrolytic processing phenomenon to occur. Therefore, according to the present embodiment, the 1~su is determined by the input value control to determine the coordinate points: the control is the substrate holder 3, and the solid drive (the drive unit) 5 6 The horizontal movement speed of the rotating arm; and the speed of the electrode head 38, and will be 5, 60, in order to the motor (to enter the numerical controller 7 2, as a unit for the shape and processing rate) The transfer speed of the machining number pulse is either pre- or 72. The current flow between the poles 3 is controlled to a fixed rate, whereby the current value is used. Therefore, the machining electrode 3 2 is fed at a fixed value. In the case, the shape of the substrate can be obtained only by the period (stay time) in which the number W and the processing electrode 32 face each other. The processing amount of each coordinate point in the Z direction is the data in the device 7 2 . The amount z is the number of revolutions of the substrate W held by the motor (first driving unit) 44, and the electrode head μ motor (third driving unit) 60 controlled by the rotation of the motor 48 controls the nickname input motor (drive unit) ) The drive unit) 4 4, 5 6, 6 0 performs the numerical control arm. Next, the electrolysis by the electrolysis apparatus will be described. First, the substrate holder 3 is attracted and 48 is moved to the substrate. The holder holds the substrate W and is held on the substrate w held by the rotation 30

弟24頁 314314.ptdBrother 24 pages 314314.ptd

1271246 五、發明說明（16) =的加工位置’其中該基板w為諸如帛議所示之表 f作為導體膜（待加工部位）之銅膜6的基板W。1次，馬達50的致動而將電極頭38下降以作垂直‘ j於電極頭38之電極部36下表 = 固定座_固持之基板㈣上表面接觸或接近其/、為基板接著’由電源6 8施加電力於力 + q 9 s 之間，同時m極32时1%極與饋電電極34 制在定值，世且蔣其电電極34之間的電流流動控者，合旋轉臂48谁二Ϊ固定座30與電極頭38進行旋轉。再時，：工，而將電極頭38水平地移動。同 H . m ; 土板口疋座3 0上方的純水喷嘴7 0將純水或超、、、屯水供應至基板W盘雷托Q Χ ^ 填充於加工電極32 /千頭=之間’藉此將純水或超純水此，形成於=之饋導電體電膜極(3:與基板w之間的子六施·™ j η丄,^ &體膜（銅膜6)的電解加工係由離子又換益40中的氫離子或氫氧離子所完成。離助，：；3=藉由離子交換器40中之催化反應的輔子& 7 5 。純水解離成氫氧離子與氫離子。氫氧離 :;二電Λ32附近傳遞電荷，而變成氮氧基，氣氧Κ 興暴扳W的銅膜以座 # , 土曰加工。為將在铲+ 以猎完成銅膜6的移除（研磨）透氣的離子薄產生之氫氧隔阻在外，可使用不氫氣隔阻在外酸性陽離子交換薄膜62,因而可將的旋轉所產生）而超純水的流動（由電極部36 更具體地說，士土器40中，便可將足ΐ使純水或超純水得以流入離子交換、里的水供應至官能基（在帶有強酸性陽1271246 V. Description of the Invention (16) = Processing Position ' wherein the substrate w is the substrate W of the copper film 6 as the conductor film (the portion to be processed) such as the table f shown in the table. Once, the motor 50 is actuated to lower the electrode tip 38 to be perpendicular 'j to the electrode portion 36 of the electrode tip 38. The lower surface = the fixed seat _ the holding substrate (four) the upper surface contacts or is close to it / is the substrate then 'by The power supply 6 8 applies electric power between the forces + q 9 s, while the m pole 32 is 1% pole and the feed electrode 34 is set at a constant value, and the current flow controller between the electric electrodes 34 and the rotating arm 48 Who is the holder 30 and the electrode head 38 rotates. At the same time, the work is performed while the electrode tip 38 is moved horizontally. Same as H.m; pure water nozzle 70 above the earth plate sill seat 30, pure water or super, water, water supply to the substrate W disk Reto Q Χ ^ filled between the processing electrode 32 / thousand = 'There is a pure water or ultrapure water, which is formed on the electric conductor electrode of the feed conductor (3: between the substrate and the substrate w), ^ & body film (copper film 6) The electrolysis process is carried out by ion or hydrogen ion in the exchange of 40. Deprotection,:; 3 = a helper by the catalytic reaction in the ion exchanger 40 & 7 5 . Hydrogen and oxygen ions and hydrogen ions. Hydrogen and oxygen separation:; Two electric enthalpy 32 transfer charge, and become nitroxyl, gas oxime 兴扳 W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W W Complete removal of the copper film 6 (grinding) The hydrogen-oxygen barrier generated by the gas-permeable ion thinning can be used, and the flow of ultrapure water can be generated by using the non-hydrogen barrier in the outer acid cation exchange film 62, and thus the rotation can be performed ( More specifically, in the electrode portion 36, in the stalker 40, the water can be supplied to the functional group by allowing the pure water or the ultrapure water to flow into the ion exchange. Acid cation

314314.ptd 第25頁 1271246 五、發明說明離子交換經解離之離子（或可藉由超純水的流的穩定定性與均藉由可增加離可避免電器4 0中累積於疊片產物可能及其分佈表面平坦的平坦性將預料預先輸制：藉由固持之基臂4 8進行馬達（第在電之相對運 (17) 基之水分氫氧水流流動性與勻性製做子交解反積超中的會改造成性或離子子的基）移除為必均勻，並由多換器應的過疊反應變其負面二者交換數量間的，因要的性將且接層結 (疊反應片累產物形式影響皆具器的狀況中 ’而且由導反應所形成而可提高加 ’且希冀水導致離子供著將導致加構之疊片所片）4 0的總產物（氧化積容量的數超過累積容，且該經轉。再者，可的離子交換為磺酸基體膜（銅的加工產工效率。流為穩定應與加工工的穩定組成的離離子交換物與離子量。在這量的數量化的產物使用具有器4 0提南 )’藉此增加膜6)與氫氧物（包含氣體因此，純水或且均勻的。水產物移除的穩性與均勻性。子交換器4 0，容量，藉此便 )在離子交換方面，倘若累 ’則所累積的可對加工速率高硬度或良好基板加工表面加工外形貧料、希冀外形資料及單元加工外形資入數值控制器7 2，進行電解加工，並同時數值控馬達（第一驅動部）4 4而控制之基板固定座3 0所板W的轉速’藉由馬達（第二驅動部）5 6將旋轉旋轉控制之電極頭3 8的水平運動速度；以及藉由二驅動=60而控制之電極頭38的轉速。解力主/月’於數值控制基板W與加工電極3 2間動的^況下’將在加工電極3 2與饋電電極3 4之間314314.ptd Page 25 1271246 V. Description of the invention The ion exchange of dissociated ions (or the stability of the flow by ultrapure water can be increased by the possibility of accumulating in the avoidable electrical appliance 40 accumulated in the laminated product The flatness of the flat surface of the distribution surface is expected to be pre-transferred: the motor is held by the holding base arm 48 (the relative flow of the water in the opposite phase (17), the flow of water, hydrogen and water, and the homogenization In the super-expansion, the base of the ionic or ionic sub-transformation must be uniform, and the over-stacking reaction of the multi-replacer should change the negative between the two, and the nature of the exchange will be The cumulative product form of the stacked reaction sheet affects the condition of the device and is formed by the conduction reaction to increase the total product (oxidation product formed by the ion supply and the ion supply will cause the laminated sheet). The number of capacities exceeds the cumulative capacity, and the transfer is continued. Further, the ion exchange is a sulfonic acid base film (the processing efficiency of copper. The flow is stable and should be separated from the stable composition of the processing worker). The amount of ion exchange with the amount of ions. In this amount of quantified product is used to have a device 40] to increase the membrane 6) with hydroxide (including gas, therefore pure water or uniform. Water product removal Stability and uniformity. Sub-exchanger 40, capacity, by which, in terms of ion exchange, if it is tired, it can accumulate high processing rate for processing rate or good surface processing of substrate processing. And the unit processing shape is input into the numerical controller 7 2, and the electrolytic processing is performed, and at the same time, the motor (the first driving part) 4 is controlled by the motor (the first driving part) 4 and the substrate fixing seat 30 is controlled by the motor. The horizontal movement speed of the electrode holder 38 of the rotary rotation control; and the rotation speed of the electrode head 38 controlled by the second drive = 60. The force main/month 'between the numerical control substrate W and the processing electrode 3 2 Under the condition 'will be between the processing electrode 3 2 and the feeding electrode 3 4

314314.ptd 第26頁 1271246 五、發明說明（18) 流動的電流控制在定值，藉此固定加工速率，該電解加工可形成具有高精度外形之希冀的加工基板W (工件）外形。在完成電解加工後，切斷電源6 8，停止基板固定座3 0 與電極頭3 8的旋轉，以及終止旋轉臂4 8的旋轉。然後，升高電極頭3 8，並將為基板固定座3 0所固持的加工基板W輸送至下個製程。本實施例揭示供應純水（最好為超純水）至電極部3 6 與基板W間之空間的狀況。在電解加工時，使用不含電解質的純水或超純水可避免諸如電解質之額外的雜質黏著於並留置於基板W的表面上。再者，在電解加工期間所溶解的銅離子或類似物係藉由離子交換反應而立刻為離子交換器4 0所捕捉，此舉可避免所溶解的銅離子或類似物再次析出於基板W的其他部位上，或者避免所溶解的銅離子或類似物氧化而變成污染基板W表面的微粒。超純水具有高電阻率，因此電流難以流經超純水。藉由縮短電極與工件間的距離，或將離子交換器置於電極與工件之間，便使電阻率降低。再者，當一種電解溶液與多種電解溶液一同使用時，便可進一步降低電阻率並降低電源消耗。當使用電解溶液進行電解加工時，進行加工的工件部位面積較加工電極面積稍微寬些。另一方面，在結合使用超純水與離子交換器的狀況中，因為幾乎無電流流經超純水，所以電加工僅於等於加工電極與離子交換器之面積的工件面積中完成。314314.ptd Page 26 1271246 V. INSTRUCTIONS (18) The flow current is controlled at a constant value to fix the machining rate, and the electrolytic machining can form a workpiece W (workpiece) profile with a high-precision shape. After the electrolytic machining is completed, the power supply 6 is turned off, the rotation of the substrate holder 30 and the electrode tip 38 is stopped, and the rotation of the rotating arm 48 is terminated. Then, the electrode tip 3 8 is raised, and the processed substrate W held by the substrate holder 30 is transported to the next process. This embodiment discloses a situation in which pure water (preferably ultrapure water) is supplied to the space between the electrode portion 36 and the substrate W. In the electrolytic processing, the use of pure water or ultrapure water containing no electrolyte can prevent additional impurities such as electrolyte from adhering to and remaining on the surface of the substrate W. Furthermore, the copper ions or the like dissolved during the electrolytic processing are immediately captured by the ion exchanger 40 by the ion exchange reaction, thereby preventing the dissolved copper ions or the like from being precipitated again on the substrate W. At other sites, or by the dissolution of dissolved copper ions or the like, the particles which contaminate the surface of the substrate W become particles. Ultrapure water has a high electrical resistivity, so it is difficult for current to flow through ultrapure water. The resistivity is reduced by shortening the distance between the electrode and the workpiece, or by placing the ion exchanger between the electrode and the workpiece. Furthermore, when an electrolytic solution is used together with a plurality of electrolytic solutions, the electrical resistivity can be further reduced and power consumption can be reduced. When the electrolytic solution is used for electrolytic processing, the area of the workpiece to be processed is slightly wider than the area of the processed electrode. On the other hand, in the case where ultrapure water and an ion exchanger are used in combination, since almost no current flows through the ultrapure water, the electromachining is performed only in the area of the workpiece equal to the area of the processing electrode and the ion exchanger.

314314.ptd 第27頁 1271246 五、發明說明（19) 可彳吏用夢由、Ά 溶液以取代純水：f電解質至純水或超純水所獲得的電解低電阻率並降低純水，*用此種電解溶液可進-步降 & _ ^ ^ 电，原消耗。諸如氯化鈉或硫酸鈉等中性鴎 =為氣或硫酸等酸溶液，•諸如氨之驗溶液；冷、‘、二ϊ r並可根據工件性質而選擇性地使用這些 =戌。。。*使用该電解溶液時，較佳方式係於基板w與離子 =換為4 0之間提供些微的間距，以使該基板输離子交換斋4 0不會彼此接觸。、再者亦得使用藉由添加界面活性劑或類似物至純水或超純水所獲得的液體，以取代純水或超純水，其中該液，具有不超5 0 0// s/cm的導電率，以不超過50// s/cm為較佳’而不超過於G·1# S/cm (不低於1〇 ΜΩ · cm的電阻率）為更佳。因為界面活性劑存在於純水或超純水中，所以該液體可在基板W與離子交換器4 〇之間的界面上形成一薄層’该薄層用於均勻地抑制離子遷移，藉此調節離子交換 (金屬溶解）的濃度，以提高加工表面的平坦性。界面活性劑的濃度希冀不超過1 〇〇 p p m。當導電率的數值太高時，電流效率會下降，且加工速率會降低。使用導電率不超過 5 0 0 /Z S / c m的液體可獲得希冀的加工速率，該液體之導電率以不超過50// S/cm為較佳，而不超過〇· 1/z s/cm為更佳。根據本實施例，藉由將離子交換器4 0置於基板W、加工電極32與饋電電極34之間，便可提高相當多的加工速率。在這方面’使用超純水的電化學加工係藉由超純水中314314.ptd Page 27 1271246 V. INSTRUCTIONS (19) It is possible to replace the pure water with a solution of dreams and hydrazine: the electrolysis low resistivity obtained by the electrolyte to pure water or ultrapure water and reduce the pure water, * With this kind of electrolytic solution, it can be stepped down & _ ^ ^ electricity, the original consumption. Neutral hydrazine such as sodium chloride or sodium sulphate = acid solution such as gas or sulfuric acid, • test solution such as ammonia; cold, ‘, ϊ ϊ r and can be selectively used depending on the nature of the workpiece. . . * When using the electrolytic solution, the preferred method is to provide a slight spacing between the substrate w and the ion = 4 0 so that the substrate ion exchange is not in contact with each other. In addition, a liquid obtained by adding a surfactant or the like to pure water or ultrapure water may be used instead of pure water or ultrapure water, wherein the liquid has a temperature of not more than 500%/s/ The conductivity of cm is preferably not more than 50 / / s / cm 'not more than G · 1 # S / cm (not less than 1 〇Μ Ω · cm resistivity) is more preferable. Since the surfactant is present in pure water or ultrapure water, the liquid can form a thin layer at the interface between the substrate W and the ion exchanger 4 ' 'the thin layer for uniformly suppressing ion migration, whereby The concentration of ion exchange (metal dissolution) is adjusted to improve the flatness of the machined surface. The concentration of the surfactant is not more than 1 〇〇 p p m. When the value of the conductivity is too high, the current efficiency is lowered and the processing rate is lowered. The processing rate of the liquid can be obtained by using a liquid having a conductivity of not more than 50,000 / ZS / cm, and the conductivity of the liquid is preferably not more than 50 / / S / cm, and not more than 〇 · 1 / zs / cm Better. According to this embodiment, by placing the ion exchanger 40 between the substrate W, the processing electrode 32 and the feed electrode 34, a considerable processing rate can be increased. In this respect, the electrochemical processing using ultrapure water is in ultrapure water.

314314.ptd 第28頁 1271246314314.ptd Page 28 1271246

五、發明說明（20) 作用而完成。然而，為反應物之氫氧離子敦率可因除了移除加反應）而降低。因進行移除加工。增加增加超純水的解離反催化材料。更具體地的氫氧離子與加工材料間的化學交互在常溫與常壓的條件下，超純水中作的數量小至1 0 _7mo 1 /L，以使移除加I 工反應以外的反應（諸如氧化膜形成此，必須增加氫氧離子，以有效率地氫氧離子的方法係藉由使用催化材料應，而離子交換器可有效地作用為該說’水分子解離反應所需的活化能係藉子交換器中官能機基與水分子間的交互作用而降低，因而促使水解離發生以猎此提南加工速率。再者’根據本貫施例’在電解加工時，離子交換器4 〇會與基板W接觸或靠近。當離子交換器4 〇定位靠近基板w 時’電阻率會大到某個程度（依據其間的距離而定），因此需要稍大的電壓以提供必要的電流密度。然而，另一方面’因為非接觸性的關係，易於沿著基板w表面形成純水流或超純水流，因而可有效率地移除形成於基板表面上的反應產物。在離子交換器4 0與基板W接觸的狀死中\電阻率變得非常小，因而僅需施加微小的電壓，而+ % 電源消I毛。 ^错此減少電流密度，時，可能會故(etch 相反地，因、，所以可倘若為了提高加工速率而提高電壓以增力。則當電極與基板（加工工件）間的電阻率很大發生放電。放電的發生會在工件表面上造成麵 p i t)’因而無法形成均勻且平坦的加工表面。為當離子交換器4 0與基板W接觸時，電阻率復，5. The invention (20) is completed by function. However, the oxyhydrogen ion rate for the reactants may be lowered by the addition of the addition reaction. Due to removal processing. Increase the dissociation anti-catalytic material that increases ultrapure water. More specifically, the chemical interaction between the hydroxide ion and the processed material is as small as 10 _7 mol 1 /L in the ultra-pure water under normal temperature and normal pressure conditions, so that the reaction other than the addition reaction is removed. (such as oxide film formation, it is necessary to increase hydroxide ions, the method of efficiently hydroxide ions is by using a catalytic material, and the ion exchanger can effectively act as the activation required for the water molecule dissociation reaction. It can be reduced by the interaction between the functional group and the water molecule in the borrower exchanger, thus promoting the hydrolysis to occur to capture the processing rate of the southing. Further, in the electrolytic processing according to the present embodiment, the ion exchanger 4 〇 will be in contact with or close to the substrate W. When the ion exchanger 4 〇 is positioned close to the substrate w, the resistivity will be large to some extent (depending on the distance between them), so a slightly larger voltage is needed to provide the necessary current. Density. However, on the other hand, because of the non-contact relationship, it is easy to form a pure water flow or an ultrapure water flow along the surface of the substrate w, so that the reaction product formed on the surface of the substrate can be efficiently removed. The shape of the ion exchanger 40 in contact with the substrate W is very small, so that only a small voltage needs to be applied, and the +% power source is eliminated. ^When this current density is reduced, it may be delayed ( Conversely, because of the increase, the voltage is increased to increase the processing rate. When the resistance between the electrode and the substrate (machined workpiece) is large, the discharge occurs. The occurrence of the discharge causes a surface pit on the surface of the workpiece. 'Therefore, it is impossible to form a uniform and flat processing surface. When the ion exchanger 40 is in contact with the substrate W, the resistivity is complex,

314314.ptd 第29頁314314.ptd Page 29

!271246 五、發明說明（21) 避免發生放電v 置，^ ^圖表不根據本發明第二個實施例的+醢4 直该電解加工梦罢从*此㈤—产〇 W的包解加工裝接點固定板8〇 ^ #二命=f 0上表面周緣具有環狀 Ο Ο ^ 炸為饋笔電極之複多書i：伽^ > ι_ 8 2係以特定間拓6 # 向内伸出的接點有加工電極84, 接點固尸8〇。再者，電極頭38設 36,該加工電栋L帛1圖之，例中所使用的電極部而接點（饋電經由集、電86而連接至電源68的陰極，係與第1圖所矛^。壯82則連接至電源68的陽極。其他結點（Πίΐ施例，當基板W以基板固定座3_持時，接上的鋼膜^於82係與如第8β圖所示之沈積在基板W表面揭實施例的相π為待加工材料）接觸，電解加工可以如前定值的電产ά ^方式進行。因此，將電極頭38下降，並將 )8 2之門”L、包源6 8施加至加工電極8 4與接點（饋電電極轉，並以及同時將基板固定座30與電極頭38進行旋 u± 二字旋轉臂4 8進行旋轉而水平地移動電極頭3 8。同極8 4之、餐7 〇將純水或超純水供應至基板W與加工電工。間’因此完成基板W之導電膜（銅膜6)的電解加如同可揭的加工實施一般，在電解加工之前，工珂外形杳 ^刀口值抑，:貝枓、希冀外形資料及單元加工外形資料輸入數二制器72，以便數值控制：藉由馬達（第一驅動部）而控制少边 y ^ ^ 達f <為基板固定座3 〇所固持之基板W的轉速；藉由馬第二驅動部）56將旋轉臂48進行旋轉而控制之電極頭!271246 V. Invention Description (21) Avoid the occurrence of discharge v, ^ ^ chart is not according to the second embodiment of the present invention + 醢 4 straight to the electrolytic processing dreams from * this (five) - 〇 W Wrap processing Contact fixing plate 8〇^#二命=f 0The upper surface has a ring shape on the periphery Ο ^ The multi-book that is fried as a pen electrode i: gamma ^ > ι_ 8 2 is a specific extension 6 #Inward extension The contact point is a machining electrode 84, and the joint is 8 corp. Further, the electrode tip 38 is provided with 36, and the electrode portion of the electrode holder 38 is connected to the electrode portion used in the example (the feed is connected to the cathode of the power source 68 via the current collector 86). The spears are connected to the anode of the power source 68. The other nodes (when the substrate W is held by the substrate holder 3_, the steel film is attached to the 82 series and as shown in the eighth figure The deposition on the surface of the substrate W exposes the phase π of the embodiment to be the material to be processed), and the electrolytic processing can be performed as in the previously determined electric production method. Therefore, the electrode tip 38 is lowered, and the gate of the gate 8) L, the package source 6 8 is applied to the processing electrode 8 4 and the contact point (the feed electrode is rotated, and at the same time, the substrate holder 30 and the electrode tip 38 are rotated to rotate the U 2 character rotating arm 4 8 to horizontally move the electrode Head 38. Same as 8 4, meal 7 〇 Supply pure water or ultrapure water to the substrate W and the processing electrician. Therefore, the electrolysis of the conductive film (copper film 6) of the substrate W is completed as a removable process. In general, before the electrolysis process, the shape of the work 杳 ^ knife edge value,: Beckham, Greek shape data and unit processing shape The number two controller 72 is input for numerical control: the small side y ^ ^ reaches f < the rotation speed of the substrate W held by the substrate holder 3 藉 by the motor (first driving portion); Drive unit) 56 for controlling the electrode tip by rotating the rotating arm 48

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1271246 五、發明說明（22) 3 8的水平運動速度；以及藉由馬達（第三驅動部）6 〇而控制之電極頭3 8的轉速。在該控制下所進行的電解加工可形成具有高精度外形之希冀的加工基板W外形。第5圖表示根據本發明第三個實施例之電解加工裝置。本電解加工裝置包括用於吸引並固持基板⑺正面朝上之基板固定座100，以及配置於基板固定座1〇〇上方之桶狀或柱狀的加工電極1 〇 2。加工電極1 〇 2搞合於可旋轉且可垂直運動之水平延伸旋轉軸1 0 4的自由端，離子交換器i 〇 6緊密安裝於加工電極1 0 2的外周面上，基板固定座1 〇〇與加^ 電極1 0 2配置於填充有諸如超純水或純水之流體的力u工才接 (未圖示）中，亦即將該基板固定座1 〇〇及加工電極1 〇 =潛基板固定座1 0 0耦合於對著Z軸而在0方向上旋 ^ 轉本體1 0 8的上表面，該旋轉本體1 0 8安裝於χγ平f H 上表面，該XY平台1 1 8包含有：X基座！丨2，藉由馬〇 1 1 8的 (作為第一驅動部）的致動而在X方向上逸并梦二達110 為基板固定座10 0所固持的基板W與加工電極1 q 2〜向上進行相對運動；以及Y基座1 1 6，藉由馬達丨件以在X方固定座1 0 0所固持的基板W與加工電極i 〇 2得以 & / 行相對運動。 γ方第二驅動部）的致動而在Y方向上進行移動， 1 4 (作為 ]掊的篡柘WJ& 工Φ k η ______ 使^為基板向上進由電源1 2 0之陰極延伸出的 1 0 2，而由陽極延伸出的線路則該饋電電極1 2 2係連接至電導體線路連接 (亦係連接至加至饋電電極即如第8B圖工電極 1 2 2，其中所示之形1271246 V. DESCRIPTION OF THE INVENTION (22) The horizontal moving speed of 3 8; and the rotational speed of the electrode tip 38 controlled by the motor (third driving portion) 6 〇. The electrolytic processing performed under this control can form the shape of the processed substrate W with a high-precision shape. Fig. 5 shows an electrolytic processing apparatus according to a third embodiment of the present invention. The electrolytic processing apparatus includes a substrate holder 100 for attracting and holding the substrate (7) facing upward, and a barrel-shaped or columnar processing electrode 1 〇 2 disposed above the substrate holder 1A. The processing electrode 1 〇2 is engaged with the free end of the horizontally extending rotating shaft 104 which is rotatable and vertically movable, and the ion exchanger i 〇6 is closely mounted on the outer peripheral surface of the processing electrode 102, and the substrate holder 1 〇 The electrode and the electrode 1 0 2 are disposed in a force (not shown) filled with a fluid such as ultrapure water or pure water, that is, the substrate holder 1 and the processing electrode 1 潜 = latent The substrate holder 1000 is coupled to the upper surface of the body 810 in the 0 direction opposite to the Z axis, and the rotating body 108 is mounted on the upper surface of the χγ flat f H , the XY stage 1 18 includes There are: X base!丨2, in the X direction by the actuation of the stirrup 1 1 8 (as the first driving portion), and the dream two reaches 110 for the substrate W and the processing electrode 1 q 2 held by the substrate holder 10 The relative movement is performed upward; and the Y base 1 1 6 is moved relative to the processing electrode i 〇 2 by the motor element with the substrate W held by the X-side holder 1.0. The γ-square second driving unit is moved in the Y direction, and 1 4 (as 掊WJ& Φ k η ______ causes the substrate to extend upward from the cathode of the power source 1 2 0 1 0 2, and the line extending from the anode is connected to the electrical conductor line connection (also connected to the feeding electrode, ie, the 8B drawing electrode 1 2 2, wherein Shape

1271246 五、發明說明（23) 成於基板W中的銅膜6)並供應電力至該電導體。加工槽設有流體喷嘴，該流體喷嘴作為用於將諸如純水或超純水之流體供應至加工槽中的流體供應部。本電解加工裝置設有用於完成驅動部之數值控制的數值控制器1 2 4，亦即馬達1 1 0 (第一驅動部）與馬達1 1 4 (第二驅動部），該等馬達1 1 0、1 1 4使彼此面對之為基板固定座1 0 0所固持的基板W與加工電極1 0 2得以進行相對運動。馬達（驅動部）1 1 0，1 1 4因而為可進行數值控制的伺服馬達，且該等馬達1 1 0，1 1 4之旋轉角與轉速係由來自數值控制器1 2 4的輸出訊號而進行數值控制。現將參考第6圖而說明數值控制的實例。首先，如第2 圖所示，藉由在XY Z座標系統（其中Z軸係與作為基準面的 XY平面正交）中量測加工前之外形的各座標點，而量測加工前的基板（工件）外形。將所量測之加工前的外形資料輸入數值控制器1 2 4中。此外，關於加工前之外形的座標點（X，y，z 〇部分，希冀之加工後外形的相應座標點 (X，y，z 0亦輸入至該數值控制器1 2 4中。此外，諸如有關外形與加工速率的單元加工外形資料（每個馬達控制訊號脈衝的傳送速度）係預先或於任意時間輸入至數值控制器 124° 根據本實施例，各座標點在Z方向上的加工量Z卜#取決於輸入數值控制器1 24中的資料。根據加工量Z i_2，決定藉由馬達（第一驅動部）1 1 0與馬達（第二驅動部）1 1 4將為基板固定座1 0 0所固持之基板W止動的期間，並且將訊號1271246 V. Description of Invention (23) A copper film 6) formed in a substrate W and supplied with electric power to the electric conductor. The processing tank is provided with a fluid nozzle as a fluid supply portion for supplying a fluid such as pure water or ultrapure water into the processing tank. The electrolytic processing apparatus is provided with a numerical controller 1 2 4 for performing numerical control of the driving unit, that is, a motor 1 1 0 (first driving unit) and a motor 1 1 4 (second driving unit), and the motors 1 1 0, 1 1 4 The substrate W and the processing electrode 1 0 2 held by the substrate holder 100 are moved relative to each other. The motor (drive unit) 1 1 0, 1 1 4 is thus a servo motor that can be numerically controlled, and the rotation angle and the rotational speed of the motors 1 1 0, 1 1 4 are output signals from the numerical controller 1 2 4 And numerical control is performed. An example of numerical control will now be described with reference to Fig. 6. First, as shown in Fig. 2, the substrate before processing is measured by measuring the respective coordinate points of the pre-process outer shape in the XY Z coordinate system (where the Z-axis system is orthogonal to the XY plane as the reference plane) (workpiece) shape. Enter the measured shape data before machining into the numerical controller 1 2 4 . In addition, regarding the coordinate points (X, y, z 〇 part of the shape before processing, the corresponding coordinate points of the processed shape (X, y, z 0 are also input to the numerical controller 1 2 4. In addition, such as The unit processing profile data (the transmission speed of each motor control signal pulse) regarding the shape and the processing rate is input to the numerical controller 124 in advance or at any time. According to the present embodiment, the machining amount Z of each coordinate point in the Z direction is卜# depends on the data input to the numerical controller 1 24. According to the machining amount Z i_2 , it is determined that the motor (first driving portion) 1 10 and the motor (second driving portion) 1 1 4 will be the substrate holder 1 0 0 holds the substrate W during the stop period and signals

314314.ptd 第32頁 1271246 五、發明說明（24) · 輸入馬達（驅動部）110, 114中，以便對馬達n〇 n4進行數值控制。 ’ 根據本實施例’諸如第8B圖所示之表面具有銅膜6 (作為導電膜（待加工的部位））的基板w係為基板固定座1〇〇所吸引並固持，而安裝於加工電極1〇2表面上的離子交換器106係靠近基板W表面（上表面）或與該基板w表面 (上表面）接觸。然後，將定值的電流由電源丨2〇供應至加工電極102與饋電電極122之間，並同時將加工電極1〇2旋轉’而進行電解加工。在電解加工期間’藉由XY平台118進行步進運動，亦即基板W在X或Y方向上反覆地運動與停止。就本操作而言’如前所述’加工前外形資料、希冀外形資料及單元加工外形資料係預先輸入數值控制器1 2 4，藉由馬達（第一驅動部）11 〇與馬達（第二驅動部）1 1 4而對為基板固定座 1 〇〇所固持之基板W的止動時間進行數值控制，以該經控制之相對步進運動所進行的電解加工可形成具有高精^形之希冀的加工基板外形。在此所稱之、'相對步進運動〃意指基板w與加工電極 1 0 2之任一者或二者進行運動，以使力σ工電極1 〇 2在基板界上反覆進行特定距離之運動與停止的相對運動。第7圖表示根據本發明第四個實施例之電解加工裝置。本貫施例與第5圖所示之第三個實施例的差別在於使用球形或橢圓形的加工電極1 0 2 a。當加工電極1 〇 2 a下降時’安裝於加工電極1 0 2 a表面的離子交換器1 〇 6 3會與基板314314.ptd Page 32 1271246 V. INSTRUCTIONS (24) • Input motors (drivers) 110, 114 for numerical control of motor n〇 n4. According to the present embodiment, the substrate w having the surface of the copper film 6 (as a conductive film (the portion to be processed)) as shown in FIG. 8B is attracted and held by the substrate holder 1 , and is mounted on the processing electrode. The ion exchanger 106 on the surface of the substrate 2 is in contact with or in contact with the surface (upper surface) of the substrate W. Then, a constant current is supplied from the power source 〇2〇 to between the processing electrode 102 and the power feeding electrode 122, and at the same time, the processing electrode 1〇2 is rotated, and electrolytic processing is performed. The stepping motion is performed by the XY stage 118 during the electrolytic processing, that is, the substrate W is repeatedly moved and stopped in the X or Y direction. For the purpose of this operation, the pre-processing profile data, the shape data and the unit processing profile data are pre-inputted into the numerical controller 1 2 4 by means of the motor (first drive unit) 11 马达 and the motor (second The driving portion) 1 1 4 numerically controls the stopping time of the substrate W held by the substrate fixing base 1 , and the electrolytic processing by the controlled relative stepping motion can be formed into a high precision shape. Hope to process the shape of the substrate. As used herein, 'relative step motion 〃 means that either or both of the substrate w and the processing electrode 1 2 are moved such that the force σ electrode 1 〇 2 repeats a certain distance over the substrate boundary. The relative movement of movement and stopping. Fig. 7 shows an electrolytic processing apparatus according to a fourth embodiment of the present invention. The difference between the present embodiment and the third embodiment shown in Fig. 5 is that a spherical or elliptical processing electrode 10 2 a is used. When the processing electrode 1 〇 2 a falls, the ion exchanger 1 〇 6 3 mounted on the surface of the processing electrode 1 0 2 a will be bonded to the substrate

314314.ptd 第33頁 1271246 五、發明說明（25) W接觸。當離子交換器如此接觸基板W時，加工電極1 0 2 a得以進行旋轉。其他結構係與第三個實施例相同。根據本實施例，加工部位（點）的面積很小，因此可輕易地將超純水或純水供應至加工部位周圍，而得以進行穩定的加工。根據前揭實施例，驅動部可使為基板固定座所固持的基板與加工電極得以進行相對運動，並在加工電極與饋電電極之間流動的電流控制在定值的情況下進行數值控制。然而，亦得以將施加於加工電極與饋電電極之間的電壓控制在定值，由電壓與電流之間的關係決定在加工電極與鎖電電極之間流動的電流，以及根據由此所決定的電流而對驅動部進行數位控制。基板（工件）外形的量測不僅可在加工前進行，亦可在加工期間的任何時間進行任何次數。在此部分，會有實際加工時間異於預定加工時間的狀況，該差異可使所完成之加工基板的外形精確度降低。藉由在加工期間盡可能完成多次的基板量測，便可消除或減少精確度的降低。因此，增加加工期間的量測次數通常可提高加工精確度。如前所述，本發明得以將加工前或加工期間的工件外形與希冀的加工後工件外形做比較並決定加工量（相當於二種外形之間的座標差）；將參數資料（相當於加工量）輸入數值控制器；以及根據所輸入的資料而完成驅動部的數值控制，其中該驅動部用於使彼此面對且為固定座所固持的工件與加工電極得以進行相對運動，在該數值控制下314314.ptd Page 33 1271246 V. Description of invention (25) W contact. When the ion exchanger contacts the substrate W in this manner, the processing electrode 1 0 2 a is rotated. The other structure is the same as that of the third embodiment. According to this embodiment, the area of the processing portion (dot) is small, so that ultrapure water or pure water can be easily supplied to the periphery of the processing portion for stable processing. According to the foregoing embodiment, the driving portion can relatively move the substrate held by the substrate holder and the processing electrode, and numerically control the current flowing between the processing electrode and the feeding electrode to a constant value. However, it is also possible to control the voltage applied between the processing electrode and the feeding electrode to a constant value, and the relationship between the voltage and the current determines the current flowing between the processing electrode and the locking electrode, and is determined according to the determination The current is digitally controlled by the drive unit. The measurement of the shape of the substrate (workpiece) can be performed not only before processing, but also at any time during processing. In this section, there is a case where the actual processing time is different from the predetermined processing time, and the difference can lower the shape accuracy of the completed processed substrate. The accuracy reduction can be eliminated or reduced by performing as many substrate measurements as possible during processing. Therefore, increasing the number of measurements during processing generally improves processing accuracy. As described above, the present invention compares the shape of the workpiece before or during processing with the shape of the workpiece after processing and determines the amount of processing (corresponding to the coordinate difference between the two shapes); And inputting a numerical controller; and performing numerical control of the driving portion according to the input data, wherein the driving portion is configured to cause relative movement of the workpiece and the processing electrode facing each other and held by the fixing seat, at the value Under control

314314.ptd 第34頁 1271246 五、發明說明（26) 進行作業的電解加工可形成具有高精度外形之希冀的加工工件外形。雖然已揭示並詳細說明本發明的特定較佳實施例，但是應暸解地是可在不離開隨附申請專利範圍的範疇下對本發明進行各種改變與修改。產業利用性本發明係關於電解加工裝置及方法，用於加工基板 (諸如半導體晶圓）表面之導電材料或用於移除黏著在基板表面之雜質。314314.ptd Page 34 1271246 V. INSTRUCTIONS (26) The electrolytic machining of the work can form a workpiece with a high-precision shape. While the invention has been shown and described with reference to the preferred embodiments of the present invention, it is understood that various changes and modifications may be made in the invention without departing from the scope of the appended claims. Industrial Applicability The present invention relates to an electrolytic processing apparatus and method for processing a conductive material on a surface of a substrate (such as a semiconductor wafer) or for removing impurities adhered to a surface of a substrate.

314314.ptd 第35頁 1271246 圖式簡單說明 [圖式簡單說明] 第 1圖係根據本發明第一個實施例之電解加工裝置的縱剖面前視圖；第 2圖係說明工件之加工前外形與希冀加工後外形間之關係的示意圖；第 3圖係說明以第 1圖之電解加工裝置進行數值控制的實例的方塊圖，第 4圖係根據本發明第二個實施例之電解加工裝置的縱剖面前視圖；第 5圖係根據本發明第三個實施例之電解加工裝置的概略透視圖，第 6圖係說明以第 5圖之電解加工裝置進行數值控制的實例的方塊圖，第 7圖係根據本發明第四個實施例之電解加工裝置的概略透視圖，第 8 A至第8 C圖係以製程步驟順序說明形成銅互連線之實例的示意圖；以及第 9圖係說明使用離子交換器進行電解加工之原理的示意圖〇 1 a 導電層 1 半導體基材 2 絕緣膜 3 接觸孔 4 溝渠 5 阻障層 6 銅膜 7 種子層314314.ptd Page 35 1271246 Brief Description of Drawings [Simplified Description of Drawings] Fig. 1 is a longitudinal sectional front view of an electrolytic processing apparatus according to a first embodiment of the present invention; Fig. 2 is a view showing a pre-processing shape of a workpiece and A schematic diagram of the relationship between the shapes after processing; FIG. 3 is a block diagram showing an example of numerical control by the electrolytic processing apparatus of FIG. 1, and FIG. 4 is a longitudinal view of the electrolytic processing apparatus according to the second embodiment of the present invention. Fig. 5 is a schematic perspective view of an electrolytic processing apparatus according to a third embodiment of the present invention, and Fig. 6 is a block diagram showing an example of numerical control by the electrolytic processing apparatus of Fig. 5, Fig. 7 According to a schematic perspective view of an electrolytic processing apparatus according to a fourth embodiment of the present invention, FIGS. 8A to 8C are diagrams illustrating an example of forming a copper interconnection line in the order of process steps; and FIG. 9 illustrates the use of ions. Exchanger FIG intended line shows the principle of electrochemical machining of the conductive layer 2 1 a square insulating film of a semiconductor substrate trench 3 4 5 contact hole barrier layer 7 seed copper film 6

314314.ptd 第36頁 1271246314314.ptd Page 36 1271246

圖式簡單說明 10 工件 10a 原子 12a、 1 2t )"4 0、 1 06 106a 離子交換器 14 加工電極 16^ 34、 122 饋電電極 17、 68^ 120 電源 18 液體 19 液體供應部位 20 水分子 2 2 氫氧離子 24 氫離子 26 反應產物 30 基板固定座 32 加工電極 36 電極部 38 電極頭 42 支撐軸 4[ 50 > 56、 .1 Π )、 114 馬達 46〜 58 同步皮帶 48 旋轉臂 52 滾珠螺桿 54 空心旋轉轴 60 空心馬達 6 2a， 62b 強酸性陽離子: 交換纖維 62c 強酸性陽離子: 交換薄 L膜 64 扇形電極板 66^ 86 集電環 70 純水喷嘴 72 數值控制器 80 接點固定板 82 接點 84 加工電極 100 基板固定座 314314.ptd 第37頁 1271246Schematic description 10 workpiece 10a atom 12a, 1 2t ) " 4 0, 1 06 106a ion exchanger 14 processing electrode 16 ^ 34, 122 feed electrode 17, 68 ^ 120 power supply 18 liquid 19 liquid supply site 20 water molecules 2 2 hydroxide ion 24 hydrogen ion 26 reaction product 30 substrate holder 32 processing electrode 36 electrode portion 38 electrode head 42 support shaft 4 [50 > 56, .1 Π ), 114 motor 46 to 58 timing belt 48 rotating arm 52 Ball screw 54 Hollow rotating shaft 60 Hollow motor 6 2a, 62b Strong acid cation: Exchange fiber 62c Strong acid cation: Exchange thin L film 64 Sector electrode 66^ 86 Collector ring 70 Pure water nozzle 72 Numerical controller 80 Contact fixing Plate 82 Contact 84 Machining electrode 100 Substrate holder 314314.ptd Page 37 1271246

314314.ptd 第38頁314314.ptd Page 38

Claims

1271246 案號 92100219 六、申請專利範圍 1 . 一種電解加工裝置固定座，用於加工電極，可工件；饋電電的該工件，離子交換器，間及該工件與該饋中；流體供子交換器之極，用於將電力供應至為該固定座所固持應部，該工件少其中一個電極之電源，用於施之間；驅動部，用於該工件與該加工電數值控制器， 2. 如申請專利範圍第控制在定值的電流電極之間。 3. 如申請專利範圍第制器係藉由該驅動與該加工電極間的 4. 如申請專利範圍第，包括：可拆卸自如地固持工件；靠近或接觸為該固定座所固持的該配置於該工件與該加工電極間之空電電極間之空間的至少一個空間用於將流體供應至其中存在有該離與該加工電極及該饋電電極中之至間；加電壓於該加工電極與該饋電電極使彼此面對且為該固定座所固持的極得以進行相對運動；以及用於完成該驅動部的數值控制。 1項之電解加工裝置，其中該電源將或電壓供應至該加工電極與該饋電 2項之電解加工裝置，其中該數值控部而對為該固定座所固持之該工件相對運動速度進行數值控制。 2項之電解加工裝置，其中該數值控1271246 Case No. 92100219 VI. Patent Application No. 1. An electrolytic processing device holder for processing an electrode, a workpiece; a workpiece for feeding electricity, an ion exchanger, and the workpiece and the feed; a fluid donor exchanger The pole is used for supplying electric power to the holding portion for the fixing seat, the workpiece is less than one of the electrodes, and is used for the application; the driving portion is used for the workpiece and the processing electric quantity controller, 2. For example, the scope of the patent application is controlled between constant current electrodes. 3. If the scope of the patent application is between the drive and the processing electrode, as in the scope of the patent application, including: detachably holding the workpiece; the configuration of the holder being held close to or in contact with the holder At least one space of a space between the workpiece and the air electrode between the processing electrodes is used to supply a fluid to a space between the processing electrode and the feeding electrode; applying a voltage to the processing electrode The feed electrode allows relative movement of the poles facing each other and held by the mount; and numerical control for completing the drive section. An electrolytic processing apparatus of the first aspect, wherein the power source supplies a voltage or a voltage to the processing electrode and the electrolysis processing device of the feeding item 2, wherein the numerical control unit performs a numerical value on the relative movement speed of the workpiece held by the fixing seat control. 2 items of electrolytic processing equipment, wherein the numerical control

3]43]4(修正版）.ptc 第39頁 1271246 _案號92100219 年#月今曰修正_ 六、申請專利範圍制器係藉由該驅動部而對為該固定座所固持之該工件與該加工電極間的相對步進運動的止動時間進行數值控制。 5. —種電解加工方法，包括：提供加工電極、饋電電極與離子交換器，該離子交換器配置於為固定座所固持之工件與該加工電極間之空間及該工件與該饋電電極間之空間的至少其中一個空間中；當電力由該饋電電極供應至該工件時，該加工電極得以靠近或接觸為該固定座所固持之該工件；將流體供應至其中存在有該離子交換器之該工件與該加工電極及該饋電電極中之至少其中一個電極之間的空間；施加電壓於該加工電極與該饋電電極之間；以及在以數值控制器數值控制運動的情況下，使彼此面對且為該固定座所固持的該工件與該加工電極得以進行相對運動。 6. 如申請專利範圍第5項之電解加工方法，其中將控制在定值的電流或電壓供應至該加工電極與該饋電電極之 7. 如申請專利範圍第6項之電解加工方法，包括：量測加工前和/或加工期間的該工件之外形；將所量測之外形與該工件加工後之希冀外形的座標資料輸入該數值控制器中；以及3] 43] 4 (Revised Edition). ptc Page 39 1271246 _ Case No. 92100219 Year #月今曰修正_ Sixth, the patent scope controller is the workpiece held by the driver by the driver The stop time of the relative stepping motion between the machining electrodes is numerically controlled. 5. An electrolytic processing method comprising: providing a processing electrode, a feeding electrode, and an ion exchanger, the ion exchanger being disposed in a space between a workpiece held by the fixing seat and the processing electrode, and the workpiece and the feeding electrode At least one of the spaces between the spaces; when power is supplied from the feed electrode to the workpiece, the process electrode is brought close to or in contact with the workpiece held by the mount; supplying the fluid to the ion exchange therein a space between the workpiece and at least one of the processing electrode and the feed electrode; applying a voltage between the processing electrode and the feed electrode; and in the case of controlling movement with numerical controller values The workpieces facing each other and held by the holder are moved relative to the machining electrode. 6. The electrolytic processing method according to claim 5, wherein a current or voltage controlled at a constant value is supplied to the processing electrode and the feeding electrode. 7. The electrolytic processing method according to claim 6 of the patent scope includes : measuring the shape of the workpiece before and/or during processing; inputting the measured external shape and coordinate data of the desired shape after processing the workpiece into the numerical controller;

3]43]4(修正版）.ptc 第40頁 1271246 _案號92100219 分f年f月孑曰修正_ 六、申請專利範圍根據該量測外形與該希冀外形之間的座標差，而對為該固定座所固持之該工件與該加工電極間的相對運動速度進行數值控制。 8.如申請專利範圍第6項之電解加工方法，包括：量測加工前和/或加工期間的該工件之外形；將所量測之外形與該工件加工後之希冀外形的座標資料輸入該數值控制器中；以及根據該量測外形與該希冀外形之間的座標差，而對為該固定座所固持之該工件與該加工電極間之相對步進運動中的止動時間進行數值控制。3] 43] 4 (revision). ptc page 40 1271246 _ case number 92100219 points f year f month 孑曰 correction _ six, the scope of the patent application according to the coordinate difference between the shape and the shape of the hope, and The relative movement speed between the workpiece and the processing electrode held by the fixing seat is numerically controlled. 8. The electrolytic machining method according to claim 6 of the patent application, comprising: measuring the shape of the workpiece before and/or during the processing; inputting the coordinate data of the measured shape and the desired shape of the workpiece after processing Numerical control in the numerical controller; and based on the coordinate difference between the measured shape and the shape of the hope, and the stopping time in the relative stepping motion between the workpiece and the machining electrode held by the fixing seat .

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