TWI268620B - Thin film transistor (TFT) and manufacturing method thereof - Google Patents

Thin film transistor (TFT) and manufacturing method thereof

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Publication number
TWI268620B
TWI268620B TW094142717A TW94142717A TWI268620B TW I268620 B TWI268620 B TW I268620B TW 094142717 A TW094142717 A TW 094142717A TW 94142717 A TW94142717 A TW 94142717A TW I268620 B TWI268620 B TW I268620B
Authority
TW
Taiwan
Prior art keywords
layer
gate
disposed
tft
thin film
Prior art date
Application number
TW094142717A
Other languages
Chinese (zh)
Other versions
TW200723534A (en
Inventor
Chung-Yu Liang
Ting-Chang Chang
Po-Tsun Liu
Min-Chaun Wang
Stephen Hsin-Li Chen
Feng Yuan Gan
Original Assignee
Au Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Au Optronics Corp filed Critical Au Optronics Corp
Priority to TW094142717A priority Critical patent/TWI268620B/en
Application granted granted Critical
Publication of TWI268620B publication Critical patent/TWI268620B/en
Publication of TW200723534A publication Critical patent/TW200723534A/en

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  • Thin Film Transistor (AREA)

Abstract

A thin film transistor (TFT) and a manufacturing method thereof are provided. The TFT includes a gate, an insulation layer, a channel layer, an etch stopper layer, an ohmic contact layer, a source and a drain. The gate is disposed on a substrate. The insulation layer is disposed above the substrate and covers the gate. The channel layer is disposed on partly of the insulation layer and correspondingly to the gate. The width of the channel layer is smaller than or equals to that of the gate. The etch stopper layer is disposed on partly of the channel layer and correspondingly to the gate. The width of the etch stopper layer is smaller than that of the channel layer. The ohmic contact layer is disposed on partly of the insulation layer, and covers two ends of the etch stopper layer and two ends of the channel layer. The source and the drain are disposed on the ohmic contact layer and correspondingly coupled to the two ends of the channel layer via the ohmic contact layer.
TW094142717A 2005-12-01 2005-12-01 Thin film transistor (TFT) and manufacturing method thereof TWI268620B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094142717A TWI268620B (en) 2005-12-01 2005-12-01 Thin film transistor (TFT) and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094142717A TWI268620B (en) 2005-12-01 2005-12-01 Thin film transistor (TFT) and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI268620B true TWI268620B (en) 2006-12-11
TW200723534A TW200723534A (en) 2007-06-16

Family

ID=57912270

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142717A TWI268620B (en) 2005-12-01 2005-12-01 Thin film transistor (TFT) and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI268620B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7981708B1 (en) 2010-07-16 2011-07-19 Au Optronics Corporation Method of fabricating pixel structure and method of fabricating organic light emitting device
US8501552B2 (en) 2011-11-16 2013-08-06 Chunghwa Picture Tubes, Ltd. Pixel structure and method of fabricating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7981708B1 (en) 2010-07-16 2011-07-19 Au Optronics Corporation Method of fabricating pixel structure and method of fabricating organic light emitting device
US8501552B2 (en) 2011-11-16 2013-08-06 Chunghwa Picture Tubes, Ltd. Pixel structure and method of fabricating the same

Also Published As

Publication number Publication date
TW200723534A (en) 2007-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees