TWI268183B - Capacitive ultrasonic transducer and method of fabricating the same - Google Patents
Capacitive ultrasonic transducer and method of fabricating the sameInfo
- Publication number
- TWI268183B TWI268183B TW094137938A TW94137938A TWI268183B TW I268183 B TWI268183 B TW I268183B TW 094137938 A TW094137938 A TW 094137938A TW 94137938 A TW94137938 A TW 94137938A TW I268183 B TWI268183 B TW I268183B
- Authority
- TW
- Taiwan
- Prior art keywords
- ultrasonic transducer
- capacitive ultrasonic
- same
- fabricating
- stacking
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094137938A TWI268183B (en) | 2005-10-28 | 2005-10-28 | Capacitive ultrasonic transducer and method of fabricating the same |
US11/324,408 US20070097791A1 (en) | 2005-10-28 | 2006-01-04 | Capacitive ultrasonic transducer and method of fabricating the same |
JP2006181649A JP4425245B2 (ja) | 2005-10-28 | 2006-06-30 | 容量性超音波振動子およびその製造方法 |
KR1020060060509A KR100791821B1 (ko) | 2005-10-28 | 2006-06-30 | 용량성 초음파 변환기 및 그것의 제조방법 |
US12/049,224 US7937834B2 (en) | 2005-10-28 | 2008-03-14 | Method of fabricating capacitive ultrasonic transducers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094137938A TWI268183B (en) | 2005-10-28 | 2005-10-28 | Capacitive ultrasonic transducer and method of fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI268183B true TWI268183B (en) | 2006-12-11 |
TW200716265A TW200716265A (en) | 2007-05-01 |
Family
ID=37996106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094137938A TWI268183B (en) | 2005-10-28 | 2005-10-28 | Capacitive ultrasonic transducer and method of fabricating the same |
Country Status (4)
Country | Link |
---|---|
US (2) | US20070097791A1 (zh) |
JP (1) | JP4425245B2 (zh) |
KR (1) | KR100791821B1 (zh) |
TW (1) | TWI268183B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112485775A (zh) * | 2020-04-10 | 2021-03-12 | 友达光电股份有限公司 | 换能装置、换能结构及其制造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITRM20060238A1 (it) * | 2006-05-03 | 2007-11-04 | Esaote Spa | Trasduttore ultracustico capacitivo multipiano |
US7721397B2 (en) * | 2007-02-07 | 2010-05-25 | Industrial Technology Research Institute | Method for fabricating capacitive ultrasonic transducers |
JP5269090B2 (ja) * | 2007-12-03 | 2013-08-21 | コロ テクノロジーズ インコーポレイテッド | 静電変換器およびアレイにおけるスルーウエハ相互接続部 |
EP2215710A1 (en) | 2007-12-03 | 2010-08-11 | Kolo Technologies, Inc. | Packaging and connecting electrostatic transducer arrays |
US9087677B2 (en) * | 2011-03-28 | 2015-07-21 | Tokyo Electron Limited | Methods of electrical signaling in an ion energy analyzer |
JP5896665B2 (ja) * | 2011-09-20 | 2016-03-30 | キヤノン株式会社 | 電気機械変換装置の製造方法 |
JP6297131B2 (ja) | 2013-03-14 | 2018-03-20 | ボルケーノ コーポレイション | ウェハスケールトランスデューサコーティング及び方法 |
US10315224B2 (en) | 2015-05-20 | 2019-06-11 | uBeam Inc. | Ultrasonic transducer |
US10058892B2 (en) | 2015-05-20 | 2018-08-28 | uBeam Inc. | Membrane bonding |
US10065854B2 (en) * | 2015-05-20 | 2018-09-04 | uBeam Inc. | Membrane bonding with photoresist |
KR102244601B1 (ko) * | 2019-05-29 | 2021-04-26 | 인하대학교 산학협력단 | 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법 |
CN110510573B (zh) * | 2019-08-30 | 2023-01-10 | 中国科学院深圳先进技术研究院 | 一种电容式微机械超声换能器及其制备方法和应用 |
TWI718073B (zh) * | 2020-06-19 | 2021-02-01 | 友達光電股份有限公司 | 電容式換能裝置及其製造方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1975801A (en) * | 1930-12-15 | 1934-10-09 | Sound Lab Corp Ltd | Microphone |
US4262399A (en) * | 1978-11-08 | 1981-04-21 | General Electric Co. | Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit |
US5619476A (en) * | 1994-10-21 | 1997-04-08 | The Board Of Trustees Of The Leland Stanford Jr. Univ. | Electrostatic ultrasonic transducer |
US5894452A (en) * | 1994-10-21 | 1999-04-13 | The Board Of Trustees Of The Leland Stanford Junior University | Microfabricated ultrasonic immersion transducer |
US6295247B1 (en) * | 1998-10-02 | 2001-09-25 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined rayleigh, lamb, and bulk wave capacitive ultrasonic transducers |
JP3440037B2 (ja) | 1999-09-16 | 2003-08-25 | 三洋電機株式会社 | 半導体装置、半導体エレクトレットコンデンサマイクロホンおよび半導体エレクトレットコンデンサマイクロホンの製造方法。 |
US6443901B1 (en) * | 2000-06-15 | 2002-09-03 | Koninklijke Philips Electronics N.V. | Capacitive micromachined ultrasonic transducers |
ITRM20030318A1 (it) | 2003-06-25 | 2004-12-26 | Esaote Spa | Trasduttore ultracustico capacitivo microlavorato e |
JP4193615B2 (ja) | 2003-07-04 | 2008-12-10 | セイコーエプソン株式会社 | 超音波変換装置 |
US20050177045A1 (en) | 2004-02-06 | 2005-08-11 | Georgia Tech Research Corporation | cMUT devices and fabrication methods |
US7646133B2 (en) * | 2004-02-27 | 2010-01-12 | Georgia Tech Research Corporation | Asymmetric membrane cMUT devices and fabrication methods |
JP2007527285A (ja) | 2004-02-27 | 2007-09-27 | ジョージア テック リサーチ コーポレイション | 多要素電極cmut素子及び製作方法 |
US7530952B2 (en) | 2004-04-01 | 2009-05-12 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive ultrasonic transducers with isolation posts |
US7251884B2 (en) * | 2004-04-26 | 2007-08-07 | Formfactor, Inc. | Method to build robust mechanical structures on substrate surfaces |
US7470232B2 (en) * | 2004-05-04 | 2008-12-30 | General Electric Company | Method and apparatus for non-invasive ultrasonic fetal heart rate monitoring |
TWI260940B (en) | 2005-06-17 | 2006-08-21 | Ind Tech Res Inst | Method for producing polymeric capacitive ultrasonic transducer |
-
2005
- 2005-10-28 TW TW094137938A patent/TWI268183B/zh not_active IP Right Cessation
-
2006
- 2006-01-04 US US11/324,408 patent/US20070097791A1/en not_active Abandoned
- 2006-06-30 JP JP2006181649A patent/JP4425245B2/ja not_active Expired - Fee Related
- 2006-06-30 KR KR1020060060509A patent/KR100791821B1/ko active IP Right Grant
-
2008
- 2008-03-14 US US12/049,224 patent/US7937834B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112485775A (zh) * | 2020-04-10 | 2021-03-12 | 友达光电股份有限公司 | 换能装置、换能结构及其制造方法 |
CN112485775B (zh) * | 2020-04-10 | 2023-06-23 | 友达光电股份有限公司 | 换能装置、换能结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4425245B2 (ja) | 2010-03-03 |
KR20070045898A (ko) | 2007-05-02 |
US7937834B2 (en) | 2011-05-10 |
US20070097791A1 (en) | 2007-05-03 |
US20080235936A1 (en) | 2008-10-02 |
TW200716265A (en) | 2007-05-01 |
JP2007124613A (ja) | 2007-05-17 |
KR100791821B1 (ko) | 2008-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI268183B (en) | Capacitive ultrasonic transducer and method of fabricating the same | |
WO2013154894A3 (en) | Strengthened glass articles having etched features and methods of forming the same | |
SE0402082D0 (sv) | Metal product, method of manufacturing a metal product and use thereof | |
WO2007017404A3 (de) | Anordnung zur hermetischen abdichtung von bauelementen und verfahren zu deren herstellung | |
TW201129497A (en) | silicon substrate having nanostructures and method for producing the same and application thereof | |
WO2012039932A3 (en) | Methods for forming layers on a substrate | |
WO2009105367A3 (en) | Integrated circuit package and method of manufacturing same | |
NZ592506A (en) | Coated glass surfaces and method for coating a glass substrate | |
TW200701817A (en) | Method for producing polymeric capacitive ultrasonic transducer | |
CN106024387A (zh) | 薄膜电容器 | |
TW200737244A (en) | Dielectric element and method for manufacturing the same | |
EP2248763A3 (en) | Capacitive electro-mechanical transducer and fabrication method of the same | |
FR2984599B1 (fr) | Procede de fabrication d'un micro- ou nano- fil semiconducteur, structure semiconductrice comportant un tel micro- ou nano- fil et procede de fabrication d'une structure semiconductrice | |
WO2010082733A3 (ko) | 열전 나노와이어 및 그의 제조방법 | |
WO2010011009A9 (ko) | 전자부품 모듈용 금속 기판과 이를 포함하는 전자부품 모듈 및 전자부품 모듈용 금속 기판 제조방법 | |
WO2012072070A3 (de) | Sensor mit einem vorzugsweise mehrschichtigen keramiksubstrat und verfahren zu dessen herstellung | |
WO2008099246A3 (en) | Multilayer structure and its fabrication process | |
WO2010143895A3 (en) | Semiconductor substrate, semiconductor device, and manufacturing methods thereof | |
TW200704582A (en) | Semiconductor composite device and method of manufacturing the same | |
MX2014004910A (es) | Celda transductora, micro-labrada, capacitiva, pre-colapsada con capa de tension. | |
CN110127592B (zh) | Mems感知器结构及其制造方法 | |
TW200709232A (en) | Dielectric film production process and capacitor | |
WO2006094280A3 (en) | Metal-insulator-metal capacitor manufactured using etchback | |
WO2011010872A3 (ko) | 금속 배선 형성을 위한 식각액 조성물 | |
WO2009083487A3 (fr) | Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |