TWI266067B - Module for testing integrated circuit - Google Patents
Module for testing integrated circuitInfo
- Publication number
- TWI266067B TWI266067B TW94122663A TW94122663A TWI266067B TW I266067 B TWI266067 B TW I266067B TW 94122663 A TW94122663 A TW 94122663A TW 94122663 A TW94122663 A TW 94122663A TW I266067 B TWI266067 B TW I266067B
- Authority
- TW
- Taiwan
- Prior art keywords
- coupling interface
- integrated circuit
- interface
- module
- probe
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A module for testing integrated circuit suitable for being connected to a tester head is used to contact electrically a tested surface of an integrated circuit wafer. The module includes a probe interface board, a probe card, and a tester socket. The probe interface board has a first coupling interface and an opposite second coupling interface. The first coupling interface is connected to the tester head. The probe card is assembled into the probe interface board and has a third coupling interface and an opposite fourth coupling interface. The third coupling interface is connected electrically to the second coupling interface. The tester socket is assembled into the probe card and has a fifth coupling interface and an opposite sixth coupling interface. The fifth coupling interface is connected electrically to the fourth coupling interface. The sixth coupling interface contacts electrically the tested surface of the integrated circuit wafer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94122663A TWI266067B (en) | 2005-07-05 | 2005-07-05 | Module for testing integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94122663A TWI266067B (en) | 2005-07-05 | 2005-07-05 | Module for testing integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI266067B true TWI266067B (en) | 2006-11-11 |
TW200702689A TW200702689A (en) | 2007-01-16 |
Family
ID=38191492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94122663A TWI266067B (en) | 2005-07-05 | 2005-07-05 | Module for testing integrated circuit |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI266067B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114200179A (en) * | 2020-09-18 | 2022-03-18 | 利亘通国际有限公司 | Open type test head of wafer automatic test system |
-
2005
- 2005-07-05 TW TW94122663A patent/TWI266067B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114200179A (en) * | 2020-09-18 | 2022-03-18 | 利亘通国际有限公司 | Open type test head of wafer automatic test system |
Also Published As
Publication number | Publication date |
---|---|
TW200702689A (en) | 2007-01-16 |
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