TWI266067B - Module for testing integrated circuit - Google Patents

Module for testing integrated circuit

Info

Publication number
TWI266067B
TWI266067B TW94122663A TW94122663A TWI266067B TW I266067 B TWI266067 B TW I266067B TW 94122663 A TW94122663 A TW 94122663A TW 94122663 A TW94122663 A TW 94122663A TW I266067 B TWI266067 B TW I266067B
Authority
TW
Taiwan
Prior art keywords
coupling interface
integrated circuit
interface
module
probe
Prior art date
Application number
TW94122663A
Other languages
Chinese (zh)
Other versions
TW200702689A (en
Inventor
Shelton Lu
Jason Chen
Chi-Hsing Hsu
Hsing-Chou Hsu
Original Assignee
Via Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Via Tech Inc filed Critical Via Tech Inc
Priority to TW94122663A priority Critical patent/TWI266067B/en
Application granted granted Critical
Publication of TWI266067B publication Critical patent/TWI266067B/en
Publication of TW200702689A publication Critical patent/TW200702689A/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A module for testing integrated circuit suitable for being connected to a tester head is used to contact electrically a tested surface of an integrated circuit wafer. The module includes a probe interface board, a probe card, and a tester socket. The probe interface board has a first coupling interface and an opposite second coupling interface. The first coupling interface is connected to the tester head. The probe card is assembled into the probe interface board and has a third coupling interface and an opposite fourth coupling interface. The third coupling interface is connected electrically to the second coupling interface. The tester socket is assembled into the probe card and has a fifth coupling interface and an opposite sixth coupling interface. The fifth coupling interface is connected electrically to the fourth coupling interface. The sixth coupling interface contacts electrically the tested surface of the integrated circuit wafer.
TW94122663A 2005-07-05 2005-07-05 Module for testing integrated circuit TWI266067B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94122663A TWI266067B (en) 2005-07-05 2005-07-05 Module for testing integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94122663A TWI266067B (en) 2005-07-05 2005-07-05 Module for testing integrated circuit

Publications (2)

Publication Number Publication Date
TWI266067B true TWI266067B (en) 2006-11-11
TW200702689A TW200702689A (en) 2007-01-16

Family

ID=38191492

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94122663A TWI266067B (en) 2005-07-05 2005-07-05 Module for testing integrated circuit

Country Status (1)

Country Link
TW (1) TWI266067B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114200179A (en) * 2020-09-18 2022-03-18 利亘通国际有限公司 Open type test head of wafer automatic test system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114200179A (en) * 2020-09-18 2022-03-18 利亘通国际有限公司 Open type test head of wafer automatic test system

Also Published As

Publication number Publication date
TW200702689A (en) 2007-01-16

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