TWI264541B - Resilient micro-probe structure - Google Patents

Resilient micro-probe structure

Info

Publication number
TWI264541B
TWI264541B TW94125221A TW94125221A TWI264541B TW I264541 B TWI264541 B TW I264541B TW 94125221 A TW94125221 A TW 94125221A TW 94125221 A TW94125221 A TW 94125221A TW I264541 B TWI264541 B TW I264541B
Authority
TW
Taiwan
Prior art keywords
probe
base
resilient
layer
probe base
Prior art date
Application number
TW94125221A
Other languages
Chinese (zh)
Other versions
TW200704936A (en
Inventor
Troy-Chi Chiu
Bor-Gaung Chang
Chien-Ping Chen
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW94125221A priority Critical patent/TWI264541B/en
Application granted granted Critical
Publication of TWI264541B publication Critical patent/TWI264541B/en
Publication of TW200704936A publication Critical patent/TW200704936A/en

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  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A resilient micro-probe structure comprises a probe base, a protection layer, and a grounding metal layer. The protection layer surrounds the probe base to enhance insulation and securing of the base. The grounding metal layer surrounds the protection layer to reduce electrical interference and to combine with the probe base to form a probe card. The probe base has a conductive via extending through a conductor layer and a resilient layer to shorten transmission route and to increase probe density. The probe base has a probe portion comprising a probe body and a tip whereby force applied in a test can be supported by the resilient layer. A solder pad of the probe base serves to connect with an external instrument. The resilient micro-probe of the present invention can meet the requirements of high precision and high reliability.
TW94125221A 2005-07-26 2005-07-26 Resilient micro-probe structure TWI264541B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94125221A TWI264541B (en) 2005-07-26 2005-07-26 Resilient micro-probe structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94125221A TWI264541B (en) 2005-07-26 2005-07-26 Resilient micro-probe structure

Publications (2)

Publication Number Publication Date
TWI264541B true TWI264541B (en) 2006-10-21
TW200704936A TW200704936A (en) 2007-02-01

Family

ID=37969392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94125221A TWI264541B (en) 2005-07-26 2005-07-26 Resilient micro-probe structure

Country Status (1)

Country Link
TW (1) TWI264541B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112326085A (en) * 2020-11-23 2021-02-05 西畔(北京)信息技术有限责任公司 Pressure sensor assembly and pressure distribution detection shoe

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI593970B (en) * 2016-07-25 2017-08-01 日月光半導體製造股份有限公司 Testing device
CN112327012A (en) * 2020-10-26 2021-02-05 安捷利（番禺）电子实业有限公司 Connector test fixture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112326085A (en) * 2020-11-23 2021-02-05 西畔(北京)信息技术有限责任公司 Pressure sensor assembly and pressure distribution detection shoe

Also Published As

Publication number Publication date
TW200704936A (en) 2007-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees