TWI263293B - Probe card for integrated circuits - Google Patents

Probe card for integrated circuits

Info

Publication number
TWI263293B
TWI263293B TW094133675A TW94133675A TWI263293B TW I263293 B TWI263293 B TW I263293B TW 094133675 A TW094133675 A TW 094133675A TW 94133675 A TW94133675 A TW 94133675A TW I263293 B TWI263293 B TW I263293B
Authority
TW
Taiwan
Prior art keywords
probe pin
probe
pad
insulating film
probe card
Prior art date
Application number
TW094133675A
Other languages
English (en)
Other versions
TW200713480A (en
Inventor
Choon-Leong Lou
Mei-Shu Hsu
Original Assignee
Star Techn Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Star Techn Inc filed Critical Star Techn Inc
Priority to TW094133675A priority Critical patent/TWI263293B/zh
Priority to US11/164,908 priority patent/US20070069745A1/en
Priority to JP2006040662A priority patent/JP2007093574A/ja
Application granted granted Critical
Publication of TWI263293B publication Critical patent/TWI263293B/zh
Publication of TW200713480A publication Critical patent/TW200713480A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
TW094133675A 2005-09-28 2005-09-28 Probe card for integrated circuits TWI263293B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094133675A TWI263293B (en) 2005-09-28 2005-09-28 Probe card for integrated circuits
US11/164,908 US20070069745A1 (en) 2005-09-28 2005-12-09 Probe card for integrated circuits
JP2006040662A JP2007093574A (ja) 2005-09-28 2006-02-17 集積回路用プローブカード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094133675A TWI263293B (en) 2005-09-28 2005-09-28 Probe card for integrated circuits

Publications (2)

Publication Number Publication Date
TWI263293B true TWI263293B (en) 2006-10-01
TW200713480A TW200713480A (en) 2007-04-01

Family

ID=37893064

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133675A TWI263293B (en) 2005-09-28 2005-09-28 Probe card for integrated circuits

Country Status (3)

Country Link
US (1) US20070069745A1 (zh)
JP (1) JP2007093574A (zh)
TW (1) TWI263293B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5095253B2 (ja) 2007-03-30 2012-12-12 富士通株式会社 半導体エピタキシャル基板、化合物半導体装置、およびそれらの製造方法
MY144280A (en) * 2007-11-20 2011-08-29 Mimos Berhad Mems based probe card and a method of testing semiconductor ion sensor using the same
JP2010217085A (ja) * 2009-03-18 2010-09-30 Toppan Printing Co Ltd 検査装置
JP5452088B2 (ja) * 2009-06-15 2014-03-26 株式会社日立ハイテクノロジーズ 微小接触式プローバ
US9316685B2 (en) * 2012-11-12 2016-04-19 Mpi Corporation Probe card of low power loss
TWI484200B (zh) * 2013-05-28 2015-05-11 Richtek Technology Corp 測試操作機與測試載具以及相關測試方法
DE102016114145A1 (de) 2016-08-01 2018-02-01 Endress+Hauser Flowtec Ag Testsystem zur Überprüfung von elektrischen Verbindungen von elektronischen Bauteilen mit einer Leiterplatte
IT201800001170A1 (it) * 2018-01-17 2019-07-17 Technoprobe Spa Testa di misura di tipo cantilever e relativa sonda di contatto

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344239B2 (de) * 1973-09-01 1977-11-03 Luther, Erich, 3050 Wunstorf; Maelzer, Fritz; Maelzer, Martin; 7910 Reutti Post Neu-Ulm; Türkkan, Tamer, 3011 Laatzen Kontaktvorrichtung zum anschliessen einer gedruckten schaltung an ein pruefgeraet
US4820976A (en) * 1987-11-24 1989-04-11 Advanced Micro Devices, Inc. Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts
US5103557A (en) * 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
US5225037A (en) * 1991-06-04 1993-07-06 Texas Instruments Incorporated Method for fabrication of probe card for testing of semiconductor devices
US5598096A (en) * 1994-12-02 1997-01-28 Ford Motor Company Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal
JP2001153886A (ja) * 1999-11-26 2001-06-08 Mitsubishi Electric Corp プローブカード、及びこれを備えたテスト装置

Also Published As

Publication number Publication date
TW200713480A (en) 2007-04-01
JP2007093574A (ja) 2007-04-12
US20070069745A1 (en) 2007-03-29

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees