TWI262893B - Manufacturing method and product of micro-cones array - Google Patents

Abstract

This invention relates to the manufacturing method and product of micro-cones array. It mainly includes the steps of (1) preparing step, (2) micro-exposure step, (3) conductive layer forming step, (4) micro-mold fabricating step, and (5) product forming step. This invention utilizes the proximity printing technique. The light scattering effect can be controlled by the gap between photoresist and mask, and further controlled by the adjustment of exposure degree. So, it can automatically manufacture the micro-cones array. By adjusting the gap between the photoresist and the mask as well as the exposure degree, the tapered angle can be fabricated in the range of 30 to 85 degrees. Also, various mask dimension and photoresist thickness can determine the tapered angle and cone size. This invention can produce various micro-lens arrays. It has a stable manufacturing processing with low-cost equipment. It can produce a light-guide plate having excellent illumination characteristics. The product also can engage with other micro parts easily and firmly.

Description

1262893 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關一種圓錐柱微結構陣列之 成品,，特別是指一種應用近接式曝光製作微透二：2二 透鏡陣列、製程穩定、生產設備 容易之综合效益。 兀件之疋位卡合 【先前技術】 不雨是液晶顯示器（LCD)、行動電話的螢幕 位助理(PDA)，均需要更亮、更持久、更省J幕；= 的光源J強化顯示效果。而使用微透鏡陣列(Mi=s】 array)技術時，已有研究指出可提升託％之亮度。此外， 它也可應用於其他光學或軍事領域。 傳統微透鏡陣列之製造方法大致有以下幾種方式·· Μ 阻㈣法。將厚膜光阻經過曝光顯影後形成柱 狀的U、、、α構，再經過高溫整形，光阻柱狀微結構熔化，利 用内ΛΚ力與表面張力的作用，這些微凸圓柱即逐漸自動變 形成具有半球狀表面，達到具有微透鏡狀陣列之結構。 太“一、、熱壓成形法。此法是以熱壓機將χ光深刻精密電 吴造成形技術（包括了 χ光微影、微電鑄、微成形，亦即 ·/罙刻電禱模造’英文為Lithography electroforming = cHmolding ’簡稱LIGA)的模仁在聚合塑膠薄板上以高 ^同’非接觸壓模成形微透鏡陣列，透鏡曲率半徑可以 藉由熱壓溫度及壓力控制。 12628931262893 V. INSTRUCTION DESCRIPTION (1) Technical Field of the Invention The present invention relates to a finished product of a tapered column microstructure array, and more particularly to a method for fabricating a micro-transparent two-two lens array using a proximity exposure process, and having a stable process. The comprehensive benefits of easy production equipment.疋 疋 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 . When using the microlens array (Mi=s) array technology, it has been pointed out that the brightness of the support can be increased. In addition, it can be applied to other optical or military fields. The manufacturing method of the conventional microlens array generally has the following methods: · 阻 resistance (four) method. The thick film photoresist is exposed and developed to form a columnar U, , and α structure, and then subjected to high temperature shaping, and the photoresist columnar microstructure is melted. These micro convex cylinders are gradually automated by the action of internal force and surface tension. The structure is formed to have a hemispherical surface to a structure having a microlens array. Too "one, hot press forming method. This method is based on the hot press to transform the deep and precise electric Wu shape technology (including the lithography, micro-electroforming, micro-forming, that is, / / engraving) The mold core of Lithography electroforming = cHmolding 'LIGA' is molded on a polymer plastic sheet by a high-contact 'non-contact compression molding microlens array. The radius of curvature of the lens can be controlled by hot pressing temperature and pressure. 1262893

一 液滴喷出法。喷出微液滴方式。其利用類似噴w (ink-jet)印刷之技術，喷出複數個微液滴至該光阻層上£ ’進而形成反射式之微透鏡陣列。 曰 四、準分子雷射加工法。準分子雷射微細加工技術 作微小的3D微結構，在高分子材料基材（例如有機玻璃 PMMA))的X及γ軸上移動並利用一可程式控制雷射光強声 之裝置，在預定之位置發射出預定之強纟，“匕，即可： 工出一具有半圓球狀之外表面。 般的光罩最大不同處 同的餘刻深度。可應 元件與局填充率 ) 失： 。灰階光罩法雖可應 與高填充率之微透鏡 而吕’其半球狀表面 溫度過低，則塑膠薄 塑膠薄板將直接接觸 。液滴噴出法所製出 關，故難以控制微透 射加工法的微透鏡表 穩定。 射加工法與灰階光罩 五、灰階光罩法。灰階光罩與一 為灰階光罩曝光壹次即可產生多種不 用於連續曲面形狀的多階繞射微光學 (fill factor)之微透鏡陣列之製作£ 而上述各種方式分別具有下述缺 [1 ]微透鏡陣列的樣式無法突破 用於連續曲面的多階繞射微光學元件 陣列，但是，只能做一種形狀。 [2 ]製程不穩定。就光阻熱熔法 之精確度不易控制。而熱壓成形法若 板無法形成透鏡，且壓力過高時聚合 模仁頂部，半球狀表面不易精確控& 微透鏡的直徑與喷嘴喷口直徑大小相 鏡外表面之精確外形。至於準分子雷 面則粗糙度較差，整體而言，製程不 [3]生產設備成本高。準分子雷 1262893 五、發明説明（3) 法之成品雖然尺寸較準，變化較大，但是，設備複雜又昂 貴’不付產業成本。 因此’有必要研發出製程簡單穩定且生產設備成本低 的微透鏡陣列之製造方法。 【發明内容】 本發明之主要目的，在於提供一種圓錐柱微結構陣列 之製造方法及其成品’其可製造出不同樣式的微透鏡陣列 本發明之次要目的，在於提供一種圓錐柱微結構陣列 之製造方法及其成品，其具備微透鏡之製程穩定的優點。 本發明之又一目的，在於提供一種圓錐柱微結構陣列 之製造方法及其成品，其具備生產設備成本低之產業優勢 本發明之再一目的，在於提供一種圓錐柱微結構陣列 之製造方法及其成品，其生產之導光板特性佳。 本發明之另一目的， 之製造方法及其成品，其 合元件之定位卡合容易。 在於提供一種圓錐柱微結構陣列 中，圓錐柱微結構陣列與精密配 為達前述目的，本發明 之製造方法及其成品，在製 一、預備步驟：準備一 該基板上塗佈一預定厚度且 轉速度概略成反比，再烘烤 阻層上設一組墊片，該組墊 係提供一種圓錐柱微結構陣列 造方法方面係包括下列步驟： 基板’利用一旋轉塗佈方式在 可流動之光阻層，其厚度與旋 略為硬化該光阻層，然後於光 片係用以分隔該光罩與該光阻A droplet ejection method. Spray the microdroplet method. It utilizes a technique similar to ink-jet printing to eject a plurality of micro-droplets onto the photoresist layer to form a reflective microlens array.曰 Fourth, excimer laser processing. Excimer laser micromachining technology is used to make tiny 3D microstructures, move on the X and γ axes of polymer material substrates (such as plexiglass PMMA) and use a device that can control the sound of laser light. The position emits a predetermined strong force, "匕, you can: work out a surface with a semi-spherical shape. The same depth of the mask is the same as the maximum difference between the mask and the filling rate." Although the mask method can be applied to the microlens with high filling rate and the hemispherical surface temperature is too low, the plastic thin plastic sheet will be in direct contact. The droplet ejection method is used to make the micro-transmission processing method. The microlens table is stable. The shooting method and the gray-scale mask 5. The gray-scale reticle method. The gray-scale reticle and a gray-scale reticle can be used to produce a plurality of multi-order diffractions that are not used for the continuous curved surface shape. The fabrication of microlens arrays with micro-filling factors and the above-mentioned various methods have the following lack of [1] microlens array patterns cannot break through multi-order diffraction micro-optical element arrays for continuous curved surfaces, but only Make a shape [2] The process is unstable. The accuracy of the photoresist hot melt method is not easy to control. However, if the hot press forming method cannot form a lens, and the pressure is too high, the top of the polymer core is difficult to accurately control the hemispherical surface. The diameter of the lens and the diameter of the nozzle nozzle are the exact shape of the outer surface of the mirror. As for the excimer thunder surface, the roughness is poor. Overall, the process is not [3] the cost of the production equipment is high. Excimer Ray 1262893 V. Invention Description (3 Although the finished product of the method is relatively accurate and varies greatly, the equipment is complicated and expensive 'does not pay the industrial cost. Therefore, it is necessary to develop a manufacturing method of the microlens array which is simple and stable in process and low in production equipment cost. The main object of the present invention is to provide a method for manufacturing a conical column microstructure array and a finished product thereof, which can produce different patterns of microlens arrays. The second object of the present invention is to provide a method for manufacturing a conical column microstructure array. And its finished product, which has the advantage of stable process of microlens. Another object of the present invention is to provide a tapered column microstructure The manufacturing method of the column and the finished product thereof have the industrial advantage of low production equipment cost. Another object of the present invention is to provide a method for manufacturing a conical column microstructure array and a finished product thereof, which have good characteristics of the light guide plate produced. Another object, the manufacturing method and the finished product thereof, the positioning of the combined components is easy. The invention provides a prismatic microstructure array, a tapered column microstructure array and precision matching for the above purpose, the manufacturing method of the invention and The finished product is prepared in a preliminary step: preparing a substrate to be coated with a predetermined thickness and the rotation speed is roughly inversely proportional, and the baking resistance layer is provided with a set of spacers, and the set of pads provides a pyramidal microstructure array. The method aspect includes the following steps: the substrate 'using a spin coating method on the flowable photoresist layer, the thickness and the surface of the photoresist layer are hardened, and then the light sheet is used to separate the photomask and the photoresist

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層介於120至600微米之間隙，該光罩穿設複數的透光孔； 一、微影成型步驟：設一曝光源，該曝光源向該光罩 照射一紫外線光，該紫外線光透過光罩的透光孔而對該光 阻層照射，使該光阻層曝光；在該光阻層曝光後施予顯影 及供烤’微影成型微結構陣列； 一、V電層成型步驟：該光阻層之微結構陣列成形， 移除該曝光源、該光罩及該墊片，於光阻層上鍍一導電層 ’该導電層並充滿在微結構陣列之間； 四、 微模仁製作步驟：在導電層上電鑄一微模嗲 微模仁對應該微結構陣列形成微模穴陣列； 五、 翻製成品步驟：以微模仁射出成形複數微結構之 成，品。 本發明之上述目的與優點，不難從下述所選用實施例 之詳細說明與附圖中，獲得深入瞭解。 茲以下列實施例並配合圖式詳細說明本發明於後： 【實施方式】 ' ^ 請參閱第一、第二及第三圖，本發明係為一種圓錐柱 微結構陣列之製造方法及其成品，在實施上係應用一近接 式曝光法（Proximity printing)製作圓錐柱微結構陣列， 其包括下列步驟： 一、預備步驟11 :準備一個基板2 1，利用一旋轉塗佈 方式在該基板2 1上塗佈一預定厚度且可流動之光阻層2 2， $厚度與旋轉速度概略成反比，待光阻層2 2之黏稠表面烘 乾稍硬後，於光阻層22上設一組墊片23，並在墊片23上設The layer is between 120 and 600 micrometers, and the mask is provided with a plurality of transparent holes. 1. The lithography forming step: providing an exposure source, the exposure source is irradiated with ultraviolet light to the reticle, and the ultraviolet light transmits light. The light-transmissive layer of the cover is irradiated to the photoresist layer to expose the photoresist layer; after the photoresist layer is exposed, the developing and baking are performed; the micro-shadow forming microstructure array; and the V-electrode layer forming step: Forming a microstructure array of the photoresist layer, removing the exposure source, the photomask and the spacer, and plating a conductive layer on the photoresist layer, the conductive layer is filled between the microstructure arrays; The manufacturing step: electroforming a micro-mold micro-mold on the conductive layer to form a micro-cavity array corresponding to the microstructure array; 5. Turning the finished product step: forming a plurality of micro-structures by micro-molding. The above objects and advantages of the present invention will be readily understood from the following detailed description of the embodiments of the invention. The present invention will be described in detail below with reference to the following embodiments: [Embodiment] ' ^ Please refer to the first, second and third figures. The present invention is a manufacturing method of a tapered column microstructure array and a finished product thereof. In the implementation, a proximity pillar microstructure array is fabricated by using Proximity printing, which comprises the following steps: 1. Preparation step 11: preparing a substrate 2 1 by using a spin coating method on the substrate 2 1 Applying a predetermined thickness and the flowable photoresist layer 2 2, the thickness is inversely proportional to the rotational speed. After the viscous surface of the photoresist layer 22 is slightly hardened, a set of pads is disposed on the photoresist layer 22. Sheet 23, and is placed on the spacer 23

1262893 五、發明說明（5) 一光罩24 ’該組墊片23係用以分隔該光罩24與該光阻層22 介於1 2 0至6 0 〇微米之間隙，該光罩2 4穿設複數的透光孔 241 ； 二、 微影成型步驟1 2 :設一曝光源2 5 (例如設一紫外 線光源），該曝光源25向該光罩24的方向照射一紫外線光 251 ’该紫外線光251透過光罩24的透光孔241對光阻層22 照射’光阻層22曝光’·在光阻層22曝光後施予顯影及烘烤 ’微影成型微結構陣列2 2 1 (例如第六圖所示的圓柱狀微結 構陣列）。 ^ 三、 導電層成型步驟13 :該光阻層22之微結構陣列 221成形，移除該曝光源25、該光罩24及該墊片23，於光 阻層2 2上鍍一導電層2 6，該導電層2 6並充滿在微結構陣列 2 21 (如第七圖所示）之間。 四 '微模仁製作步驟14 :在導電層26上電鑄一微模仁 3 0，該微模仁3 0對應該微結構陣列2 2 1形成微模穴陣列3 1 (如第八及第九圖所示的倒錐狀微模穴陣列）。 五、翻製成品步驟1 5 :以微模仁3 0射出成形具有複數 微結構之成品4 0，如第十四圖所示（及如附件第g圖所示） 〇 如此為本發明圓錐柱微結構陣列之製造方法及其成品 請參閱第三圖，該光罩24在實施上最好選自一聚乙烯 對苯二甲酸鹽材質（Polyethylene terephthalate，簡稱 PET)，此為製造薄膜及纖維所需的聚酯樹脂，而該透光孔1262893 V. Description of the Invention (5) A mask 24' is used to separate the mask 24 from the photoresist layer 22 by a gap of 120 to 600 μm. The mask 2 4 a plurality of light-transmissive holes 241 are provided; 2. The lithography forming step 1 2: an exposure source 25 is provided (for example, an ultraviolet light source is provided), and the exposure source 25 is irradiated with an ultraviolet ray 251 in the direction of the reticle 24 The ultraviolet light 251 is irradiated to the photoresist layer 22 through the light-transmitting hole 241 of the photomask 24 to expose the photoresist layer 22 to be exposed. After the photoresist layer 22 is exposed, the image is developed and baked. The micro-image forming microstructure array 2 2 1 ( For example, the cylindrical microstructure array shown in the sixth figure). 3. The conductive layer forming step 13: the microstructure array 221 of the photoresist layer 22 is formed, the exposure source 25, the mask 24 and the spacer 23 are removed, and a conductive layer 2 is plated on the photoresist layer 22. 6. The conductive layer 26 is filled between the microstructure array 2 21 (as shown in the seventh figure). Four 'micro mold kernel fabrication step 14: electroforming a micro mold core 30 on the conductive layer 26, the micro mold core 30 corresponding to the microstructure array 2 2 1 forming a micro mold hole array 3 1 (such as the eighth and the The inverted cone-shaped microcavity array shown in Fig. 9). V. Turning the finished product Step 1 5: Forming the finished product 40 having a plurality of microstructures by micro-molding 30, as shown in Fig. 14 (and as shown in the attached figure g), thus the tapered column of the present invention The manufacturing method of the microstructure array and the finished product thereof are referred to the third figure. The photomask 24 is preferably selected from a polyethylene terephthalate (PET), which is a film and a fiber. Required polyester resin, and the light transmission hole

1262893 五、發明說明（6) — --- 241大體為圓形，另外，該墊片23之厚度大約為i2〇#計 600/zni為較佳，而基板21係選自晶圓（Wafer)、有機玻璃 (PMMA)、PC板、載玻片之其中一種。 再請參閱第四及第五圖，本發明在實施上，係設一厚 膜塗佈機50在基板21上塗佈光阻層22，並設一管柱6〇由基 板21下方抽真空吸附固定，以管柱60帶動基板21轉動，& 光阻層22均勻塗佈在基板21上，管柱6〇的轉速根據所需之 光阻層22厚度做調整，光阻層22愈厚轉速愈慢，反之則轉 速愈快（配合參閱第十圖）。 该光阻層2 2在實施上最好具有天然橡膠之物理性質， 例如選用聚異戊二烯（jSR(THB —12〇N))，利於透鏡成形， 透光性良好’且品質穩定。而光阻層2 2在旋塗完畢之後， I以烤箱設定9 5度烘烤（根據光阻層2 2厚度來估計所需之 時間’較理想時間為3〜8分鐘）。 待黏祠狀之光阻層22表面烘乾稍硬後，將基板21、光 阻層22、墊片23及光罩24置入一紫外線曝光機 (UV A1 igner)中曝光，曝光劑量依據所需之錐度大小，大 $在60 0mJ〜2400 mj之間作調整，則形成不同圓錐角度的 微結構陣列221 (例如附件第η、第I及第j圖所示，大約在 3=度〜85度間的不同圓錐角度皆可製作），假設使用直徑 =別為40 //m、50//m、1〇〇/ζιη圓形的光罩24，則分別配合 第十一圖、第十二圖、第十三圖所示的曝光量與半圓錐角 比例，可形成較佳的微結構陣列2 2 i。 曝光後置入一超音波震盪器中顯影，並依據光阻層2 21262893 V. INSTRUCTION DESCRIPTION (6) — The 241 is generally circular. In addition, the thickness of the spacer 23 is approximately i2〇# 600/zni is preferred, and the substrate 21 is selected from wafers (Wafer). One of plexiglass (PMMA), PC board, and glass slides. Referring to the fourth and fifth figures, the present invention is implemented by applying a thick film coater 50 to apply a photoresist layer 22 on the substrate 21, and a column 6 is vacuumed and adsorbed from under the substrate 21. Fixed, the substrate 60 rotates the substrate 21, and the photoresist layer 22 is evenly coated on the substrate 21. The rotation speed of the column 6〇 is adjusted according to the thickness of the photoresist layer 22 required, and the thickness of the photoresist layer 22 is thicker. The slower, on the other hand, the faster the speed (see the tenth figure). The photoresist layer 22 preferably has physical properties of natural rubber, for example, polyisoprene (jSR (THB - 12 〇N)), which is advantageous for lens formation, good light transmittance, and stable quality. After the photoresist layer 22 is spin-coated, I is baked at a temperature of 95 degrees by the oven (the estimated time required according to the thickness of the photoresist layer 22 is 3 to 8 minutes). After the surface of the photoresist layer 22 to be pasted is slightly hardened, the substrate 21, the photoresist layer 22, the spacer 23 and the photomask 24 are placed in an ultraviolet exposure machine (UV A1 igner) for exposure. The required taper size, the large $ is adjusted between 60 0mJ and 2400 mj, and the microstructure array 221 with different cone angles is formed (for example, as shown in the attached figure η, I and j, about 3=degrees to 85 Different cone angles can be made between the degrees), assuming that the masks with a diameter = 40 / m, 50 / / m, 1 / / ζ 圆形 round, respectively, with the eleventh, twelfth The ratio of exposure to semi-cone angle shown in Fig. 13 and Fig. 13 can form a preferred microstructure array 2 2 i. After exposure, it is placed in an ultrasonic oscillator for development, and according to the photoresist layer 2 2

1262893 五、發明說明（7) 之厚度來調整顯影時間（顯影時間以丨〜8分鐘 厚顯影時間越長，反之則顯影時 ^ ’越 箱設定12〇度烘烤5分鐘，完成微結構陣列後再以烤 亚利用一電子束蒸鍍機（Electron Gun Evaporation)，在微結構陣列221表面鍍上一声 為導電層。 曰金’以做 至於在微模仁3〇製作的部分，此微模仁3〇的 要採用金屬錄之電鑄技術，@且為 肢主 ^會加入其他合金元素以提高電碡微模仁膜门 此本：件之金屬的微模仁3〇便採用所謂之鎳鈷電“因 本發明之微結構陣列221也可利用光學模擬軟 。 (Tracepro)進行光線追跡，模擬出光照度圖與視 、， 與圓柱微結構陣列及微透鏡陣列做比較。 曰，亚 一如附件之第A、第B、第C、第D、第E及第F圖所示 =二顆LED作為導光板之光源，並以側光式導光板做模擬 的結果，顯不使用本發明之微結構陣列221作 、 在面板均句性、視角度、輝度與光使用二 於圓柱Μ結構陣列和微透鏡陣列。 此外，關於本發明之一種圓錐柱微結構陣列之製造方 法所生產之成σσ 40，如第十四圖所示，其包含： 一圓錐柱微結構陣列41，其上設有複數個圓錐柱微結 構411，其半錐角係介於3〇度至85度間。 當然，上述成品4 〇可再搭配·· 一精密配合元件42，其設有複數個相對應該複數個圓 1262893 五、發明說明（8) 錐柱微結構4 1 1且且右4日PI . 你盥γ η輪4 ，、有相冋+錐角之圓錐孔結構42 1，用以 ®錐柱微結構陣列41精準的滑卡配合。 本發明之優點及功效可歸納為： 藏央了 ΐ作不同樣式的微透鏡陣列。本發明之近接式 二）鱼/公、確的製作出不同錐度（半錐角約從30度至80 :凹圓錐二 圓^柱微結構陣列’例如微凸圓錐柱陣列或 破凹w錐柱陣列都可輕易成形。 可以[i]- f ί穩定。藉由本發明圓錐柱微結構陣列製程， 可以穩疋控制圓錐柱微結構之錐度與尺寸。 式二本低。本發明無需複雜又昂貴之可程 仁，更可大量生產，降低製造成本。 攻衩 產之[乂念f出之導光板特性佳。利用本發明之製法所生 ί之；：構陣列作為導光板網點時，纟面板均句性、視角 :类ί ί光使用效率皆優於傳統製法之圓柱微結構陣列 和微透鏡陣列。 卞 [5]圓錐柱微結構陣列與精密配合元件之定位卡人 U於本發明成品之圓錐柱微結構陣列具有複數個；錐 角^於3G度至85度之錐狀結構，當與另—精密配合元件 、、且δ或滑卡配合時，由於圓錐對錐孔之接觸時具有 ^ ，之=能，縱使在對正上略有誤差，也可滑移入而精確= ^位卡合，完全解決傳統圓柱對圓孔必須非常精準的 才能組合或卡合的問題。 7 以上僅是藉由較佳實施例詳細說明本發明，對於該實1262893 V. The thickness of the invention (7) adjusts the development time (development time is 丨~8 minutes thicker, the development time is longer, otherwise the development time is ^', the box is set to 12 degrees and baked for 5 minutes, after completing the microstructure array Then, using an electron beam evaporation machine (Electron Gun Evaporation), a surface of the microstructure array 221 is plated with a conductive layer. The sheet metal is used as a part of the micro mold core 3, which is made of micro mold. 3〇The metal casting electroforming technology should be used, and the other alloy elements should be added to the limbs to improve the electro-mechanical micro-mold door. This is the metal micro-module 3〇 using so-called nickel-cobalt Electrically, "the microstructure array 221 of the present invention can also utilize optical analog soft. (Tracepro) for ray tracing, simulating illuminance maps and viewing, and comparing with cylindrical microstructure arrays and microlens arrays. The first A, B, C, D, E, and F diagrams show that the two LEDs are used as the light source of the light guide plate, and the side light type light guide plate is used as a simulation result, and the microscopic invention is not used. The structure array 221 is made, the panel is uniform, The angle, the luminance, and the light are used in an array of cylindrical structures and a microlens array. Further, the method of manufacturing a tapered column microstructure array of the present invention produces σσ 40, as shown in Fig. 14, which includes: A conical column microstructure array 41 is provided with a plurality of conical column microstructures 411, and the semi-cone angle system is between 3 and 85 degrees. Of course, the above-mentioned finished product 4 can be further matched with a precision matching component. 42, it is provided with a plurality of corresponding multiple circles 1262893 V. Description of the invention (8) Cone-column microstructure 4 1 1 and right 4 days PI. You 盥 γ η wheel 4, with a cone of 冋 + cone angle The hole structure 42 1 is used for the precise sliding card fit of the cone-column microstructure array 41. The advantages and effects of the present invention can be summarized as follows: The microlens array of different styles is preserved. The proximity type 2) fish of the present invention / Male, and indeed produce different taper (half cone angle from about 30 degrees to 80: concave cone two round ^ column microstructure arrays such as micro convex tapered column array or broken concave w cone column array can be easily formed. i]- f ί stable. By the conical column microstructure array process of the present invention The taper and size of the tapered column microstructure can be controlled steadily. The second type is low. The invention does not require complicated and expensive process, and can be mass-produced and reduced in manufacturing cost. The characteristics of the light plate are good. The method of the invention is adopted; when the array is used as the light guide plate dot, the 纟 panel is uniform in terms of sentence and angle: the light use efficiency is superior to the conventional cylindrical microstructure array and microlens. Array. 卞 [5] Conical column microstructure array and precision matching component positioning card U has a plurality of tapered column microstructure arrays of the present invention; cone angle ^ 3 degrees to 85 degrees cone structure, when Another - precision matching components, and δ or sliding card fit, because the cone to the cone hole contact ^, = energy, even if there is a slight error in the alignment, can also slip into the accurate = ^ card In combination, it completely solves the problem that the traditional cylinder must be very precise in order to combine or fit. 7 The foregoing is only a detailed description of the present invention by way of a preferred embodiment,

第14頁 1262893 五、發明說明（9) 皆不脫離本發明之精神 施例所做的任何簡單修改與變化 與範圍。 由以士詳細說明，可使热知本項技藝者明瞭本發明的 雨述目的’實已符合專利法之規 提出發明 專利申請。 【附件】 圖係本發明之圓錐柱微結構陣列導光板光照度圖 ，圖係本發明之圓錐柱微結構陣列導光板視角圖 ，c圖係本發明之圓柱微結構陣列導光板光照度圖 ，D圖係本發明之圓柱微結構陣列導光板視角圖 第E圖係本發明之微透鏡陣列導光板光照度圖 f F圖係本發明之微透鏡陣列導光板視角圖 fG圖係本發明之圓錐柱微結構陣列放大示意圖一 f H圖係本發明之圓錐柱微結構陣列放大示意圖二 f 1圖係本發明之圓錐柱微結構陣列放大示意圖三 第J圖係本發明之圓錐柱微結構陣列放大示意圖四Page 14 1262893 V. INSTRUCTIONS (9) NO ADDITIONAL MODIFICATIONS AND ALTERNATIVES AND RANGES ARE EXCLUDED FROM THE EMBODIMENT OF THE INVENTION. The detailed description by the essay can make it possible for the skilled person to understand that the purpose of the invention is in accordance with the provisions of the patent law. [Attachment] Fig. is a illuminance diagram of a light guide plate of a conical column microstructure array of the present invention, and is a view of a light guide plate of a conical column microstructure array of the present invention, and c is a illuminance diagram of a light guide plate of a cylindrical microstructure array of the present invention, D diagram The present invention is a microlens array light guide plate illuminance diagram f F diagram of the present invention, the microlens array light guide plate angle view fG diagram is the conical column microstructure of the present invention Array magnification diagram - f H diagram of the conical column microstructure array of the present invention, a schematic diagram of the f 1 diagram of the conical column microstructure array of the present invention, a schematic diagram of the third embodiment of the conical column microstructure array of the present invention

12628931262893

【圖式簡單說明】 '圖係ί i : Ξ用近接式曝光法製作圓錐柱微結構陣列 ，二圖係本發明之主要裝置實施示意圖 =三圖係本發明之光罩平面示意圖 第四圖係本發明之光阻層塗佈前示意圖 f f圖係本發明之光阻層塗佈後示意圖 f六圖係本發明之圓錐柱微結構陣列示意圖 ^七圖係本發明之導電層暨圓錐柱微結^陣列示意圖 弟八圖係本發明之電鑄形成模仁示意圖 第九圖係本發明之圓錐柱微結構陣列模仁示意圖 第十圖係本發明之光阻層轉速與膜厚關係圖 第十一圖係本發明之曝光劑量與半圓錐角之關係圖（直徑 為40 //in之圓形光罩） 第十二圖係本發明之曝光劑量與半圓錐角之關係圖（直徑 為50 //m之圓形光罩） 第十三圖係本發明之曝光劑量與半圓錐角之關係圖（直徑 為100 /zm之圓形光罩） 第十四圖係本發明之成品與精密配合元件之示意圖 【圖式元件符號說明】 11預備步驟 13導電層成型步驟 1 5翻製成品步驟 2 2光阻層 1 2微影成型步驟 1 4微模仁製作步驟 21基板 2 2 1微結構陣列[Simple diagram of the diagram] 'Graphic ί i : 制作 圆锥 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近 近The schematic diagram of the photoresist layer of the present invention is shown in the figure after the coating of the photoresist layer of the present invention. The six-figure diagram of the conical column microstructure of the present invention is a schematic diagram of the conductive layer and the tapered column of the present invention. The schematic diagram of the array diagram of the electroformed mold of the present invention is the ninth diagram of the conical column microstructure array of the present invention. The tenth diagram is the relationship between the rotation speed and the film thickness of the photoresist layer of the present invention. Figure 1 is a diagram showing the relationship between the exposure dose and the half cone angle of the present invention (a circular mask having a diameter of 40 // in). The twelfth graph is a graph showing the relationship between the exposure dose and the half cone angle of the present invention (the diameter is 50 // The circular mask of m) The thirteenth diagram is the relationship between the exposure dose and the semi-cone angle of the present invention (a circular mask having a diameter of 100 /zm). The fourteenth figure is the finished product and the precision matching component of the present invention. Schematic diagram [graphic component symbol description] 11 Preliminary Step 13 Conductive Layer Forming Step 1 5 Reversal Step 2 2 Photoresist Layer 1 2 Photolithography Step 1 4 Micro Mold Making Step 21 Substrate 2 2 1 Microstructure Array

第16頁 1262893 圖式簡單說明 23墊片 2 4 1透光孔 2 5 1紫外線光 3 0微模仁 4 0成品 4 1 1圓錐柱微結構 4 2 1圓錐孔結構 60管柱 24光罩 25曝光源 26導電層 3 1微模穴陣列 4 1圓錐柱微結構陣列 4 2精密配合元件 5 0厚膜塗佈機 第17頁Page 16 1262893 Brief description of the diagram 23 gasket 2 4 1 light transmission hole 2 5 1 ultraviolet light 3 0 micro mold kernel 4 0 finished product 4 1 1 tapered column microstructure 4 2 1 tapered hole structure 60 column 24 mask 25 Exposure source 26 conductive layer 3 1 micro-cavity array 4 1 conical column microstructure array 4 2 precision matching component 50 thick film coater page 17

Claims (1)

1262893 修正 曰 _ 案號 93129155 【申請專利範圍 ^ +請專利範圍】 •了種圓錐柱微結構陣列之製造方法，其包括下列步驟 •預備步驟··準備一基板，利用一旋轉塗佈方式在 該基板上塗佈一預定厚度且可流動之光阻層，其 厚度與旋轉速度概略成反比，再烘烤略為硬化該 光阻層’然後於光阻層上設一組墊片，該組墊片 係用以分隔該光罩與該光阻層介於120至6〇〇微米 之間隙，該光罩穿設複數的透光孔； •微影成型步驟：設一曝光源，該曝光源向該光罩 照射一紫外線光，該紫外線光透過光罩的透光孔 而對該光阻層照射，使該光阻層曝光；在該光阻 層曝光後施予顯影及烘烤，微影成型微結構陣列 四 五 二·導電層成型步驟：該光阻層之微結構陣列成形， 移除該曝光源、該光罩及該墊片，於光阻層上鍍 一導電層，該導電層並充滿在微結構陣列之間； ，模仁製作步驟：在導電層上電鑄一微模仁Y該 微模仁對應該微結構陣列形成微模穴陣列； 乂 2 =製成品步驟：以微模仁射出成形具有複數微結 構之成品。1262893 曰 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Applying a predetermined thickness and flowable photoresist layer on the substrate, the thickness of which is inversely proportional to the rotation speed, and then baking the photoresist layer slightly, and then setting a set of spacers on the photoresist layer. Separating the reticle from the photoresist layer with a gap of 120 to 6 μm, the reticle is provided with a plurality of transparent holes; • lithography forming step: providing an exposure source, the exposure source is The mask is irradiated with ultraviolet light, and the ultraviolet light is transmitted through the light transmission hole of the mask to irradiate the photoresist layer to expose the photoresist layer; after the photoresist layer is exposed, the image is developed and baked, and the micro-shadow is formed. Structure array 452. Conductive layer forming step: forming a microstructure array of the photoresist layer, removing the exposure source, the mask and the spacer, and plating a conductive layer on the photoresist layer, the conductive layer is filled Between microstructure arrays The mold making step: electroforming a micro-mold on the conductive layer Y. The micro-mold corresponding to the microstructure array forms a micro-cavity array; 乂 2 = finished product step: micro-molding injection molding has a complex microstructure Finished product. 第18頁 ^ :請專利範圍第1項所述之圓錐柱微結構陣列之製 列，$，其中，該微結構陣列係為-«錐柱微結構陣 β亥微模穴對應圓錐柱微結構陣列則為一倒錐狀微 1262893 六、申請專利範圍模穴。 曰 修」 如申清專利範圍讓 造方法，其中弟1項所达之圓錐柱微結構陣列之製 ==料係為聚乙烯對笨二甲酸鹽； 中一種； 曰日圓、有機玻璃、PC板、載玻片之其 該光阻層之材料係為聚異戊二烯； =劑量係大約為600fflJ〜2400 mJ; 該導電層係為金； 該微模仁材質係選自金屬鎳、錄姑其中之一； 4 該曝光源係為一紫外線光源。 專=第1項所述之圓雖枉微結構陣列之製 -f膜塗佈機’係用來將光阻層塗佈在基板上； 板：：柱蚀ί由基板下方抽真空吸附固定，並帶動基 板轉動，使光阻層均勻塗佈在基板上； 一紫外線曝光機，係用來供光阻層曝光； 一超音波震盪器，係用來供光阻層顯影； 上：電子束蒸鍍機，係用來將導電層鍍在/微結構陣列 :=專=圍第1項所述之圓錐柱微結構陣列之製 以方法，其中，該微結構陣列係—近 作之圓錐柱微結構，其半錐角係介於3〇 ;至85度。衣Page 18^: Please select the column of the pyramidal microstructures described in item 1 of the patent scope, $, where the microstructure array is - «cone column microstructure array β Hai micro cavity corresponding conical column microstructure The array is an inverted cone-shaped micro 1262893.曰修" If Shen Qing's patent scope allows the method of making, the system of the tapered column microstructure of the younger brother is == the material is polyethylene to dimethate; one of them; 曰 yen, plexiglass, PC The material of the photoresist layer of the plate and the glass slide is polyisoprene; the dose system is about 600fflJ~2400 mJ; the conductive layer is gold; the micro mold kernel material is selected from the metal nickel, recorded One of them; 4 The exposure source is an ultraviolet light source. Specifically, the circle described in item 1 is a micro-structured array-f film coater for coating a photoresist layer on a substrate; a plate:: a column is etched and fixed by a vacuum under the substrate, And driving the substrate to rotate, so that the photoresist layer is uniformly coated on the substrate; an ultraviolet exposure machine is used for exposing the photoresist layer; an ultrasonic oscillator is used for developing the photoresist layer; A plating machine for plating a conductive layer on a microstructure array: a method for fabricating a tapered column microstructure array according to Item 1, wherein the microstructure array is a near-conical pyramid microstructure The half cone angle is between 3 〇; to 85 degrees. clothes