1258227 九、發明說明： 【發明所屬之技術領域】 本發明係有關維持功率電子領域或於led領域所使用之 功率晶片或LED等之電子零件，為了將此以高精密度安裝於電 路基板，以所使用之高熱傳導性電路組件之製造方法及以此方 法所得之南溫傳導性電路組件。 【先前技術】 “近年來，隨著電子機器之高功能化，輕小薄型化，要求於 電路基板上，高精密度安裝電子零件。尤其係於功率電子之領 域中，由於以高精密度安裝易於發熱之電子零件（譬如，led) 來作為電子零件:對電路基板而言，除了藉由細微-案（精密 圖案）所形成之兩精密度配線之設計外，亦要求著於電子零件 =熱之散熱性較高。但是，對電路基板本身由於關著期待 乂间之政熱性，故於散熱性較高之封裝，乃期望著且 子零件之電路組件，喊裝於此電路組件基板 女衣電 干專裝，眾所皆知乃以特開2003—163378號所揭 =專利。此封裝係於以射出成形所形成之金屬體之—部分 屬ΐί'緣邑緣間隔物，相互形成電氣隔離之2個金 萄土層於各金屬基層連接電子零件之 铁而fr零件槪出之熱亦透過金屬基層而釋放出。 故具有製造電路藉由—刪_成形而形成， 再者，度且安之問題。 性隔離金屬基層間zitmv；間距離，即使關於電氣 合於端子間距離而^緣距離），亦要求配 之極薄尺寸，均勻完成絕』門言如，於20〜500#m程度 前技術上具有不易實現之問題^現之厚度（絕緣距離），於先 5 1258227 形成之封裝，和安裝於上述封裝 積層體所 :安裝面，係以削薄上述積層體之剖面而力 =成丄= 述、t ===4；_ 麵= ，氣性連接於以上述絕緣間隔物 二 ，，故巧面為平滑且電子零件之絲難財為上^衣 壬現於安裝面之絕賴隔物之厚度， / 域使·積顧之輯性難層厚 (絕緣距離)’涵蓋於封裝整體既二 成5之^度，可正確進行與電子零件之電氣性連接。 _ 來作為電子零件時，複數之led為相互並％ =源述封裝，咖將可實現作為並列為—列線條 【實施方式】 ❸f 一f〜第四圖為表示本發明之實施型態之高教傳導性雷 '、夺產生功率電晶體或如LED之較多熱之雷早愛杜 T示’乃使用為高精密度於電路基^p上安i電 古封褒30大多係由金屬所形成，藉由具有金屬較 :’使得具有散熱於電子零件4〇所產生熱之功 月二:ί封衣3對形成於電路基板P之電路圖案60，係且有 2Ϊ接電子零件40 5子之電極作用。亦即，如第二ίϊί 3G為藉由絕緣間隔物22使得電氣性隔離之2 個金屬基層11，12整體化於絕緣間隔物22之構造。 40係以跨越絕緣間隔物22形狀配置於封裝30，形成於電^零 1258227 °可5易=封裝3°係從積層體L以削薄而完成，故其厚度(t) 30二Ϊ圖叙上:然為表示細分化從積層體L切割出封裝 此二之電路組件Μ之例子’但是本發明並非僅限於 將此以削溥之封裝30，完成單-之電路組件M。 τ么另^具備2個金屬層10和一個絕緣樹脂層20之積層體 早Δ，將此複數個重疊’將單元間以適當方法，形成 =持之構4體之後’進行削薄而亦可同時製作出複數之封袭 由於為獲得金屬層10和樹脂絕緣 ί ϋ s 最好事先粗面化處理金屬靠之表面。譬 理蕻二0丨f面’形成氧化覆蓋臈而進行化學性粗面處 ΐίΐΐ行物理性粗面化處理金屬層ig之表面。 用成金屬層10者雖然並非特定限制，但是最好係使 用徒銅，銘，錄，鐵，及包含至少此 和 複層材料（依序重翻ί各iid金ΐ 展。銅所j于之金屬包層材料）選擇出。另外，亦可將不同金屬 層20之兩側。金屬層1G之厚度雖然並 非#寸別限疋，但是譬如最好為5〜2〇醜之範圍。 、1 作為形成絕緣樹脂層2〇之絕緣性 塑f成物。作為此等之組合物= 物係知於熱硬化性樹腊或塑二： ϋ最ϊ緣脂f之形態軸無特別限制 燥於PET薄膜等而獲得^狀^將絕緣性樹脂塗佈乾 入乾燥於玻璃布; 1258227 如職細（p—g) 另成薄且均句之厚度之絕緣樹脂20。 =。此齡係藉由添加習知於熱硬化性 ί月曰）之無機填充物，硬化劑，硬化催化劑，溶劑^ ，顏料等’而利用黏稠（sl )化 物（或者可熱塑性樹脂組成物）而取得。 咖曰組成 P絕緣樹脂層20，亦即，絕緣間隔物22之厚度，且士 。若絕緣樹脂層20之厚*低於‘m時: ===脂層20之氣泡或，提高藉由金屬層ι〇表面之細 微犬起所產生之絕緣不良之可能性，可能無法充 若絕緣樹脂層20之厚度超過於5〇〇_時，將ΐ過 =為對象之電子零件4G之端子間距離，有時將“ 連接。樹脂絕緣層2G之厚度，可因應於使用之ΐ ^5\η 士而力Γ以變更，譬如，端子間距離於較長者上 上設定為子間距離較為短且藉由突塊電極電氣連接 作為絕，性樹脂’係以於使用熱硬錄樹脂組合物中，嬖 舻J.T使用環氧樹脂’苯酚樹脂，聚醯亞安樹脂，矽樹脂，i 或磷變性樹脂，來作為主要成份之熱概月曰 播* 熱硬化⑽驗合物’最好伟高 =填充物。如此一來，藉由高度填充無機填充:好以 22之熱傳導性，且較有效釋放從電 其ί Λ同時，絕緣間隔物22之熱膨脹係數為接近於金屬 y a ’ 22之熱膨祕數，可改善高鱗導性1：路組件之熱 ='。因應於需要而藉由調整無機填充物之填充量，亦可調 i於積層體L完成時之熱硬化性樹脂組合物之流動性。θ 作為上述之無機填充物，雖然無特別加以限定，但是可使 11 1258227 用由 A1203，％〇，BN，A1N，Si〇2，CaC〇3 等選擇出，獅3， _ ’ Μ ’ A11V ’ 6於係比其絲機填充物優 好係並用偶合劑或分散劑等。 之iii卜中作it零件4G ’以譬如於使用發出uv (紫外線） 之寻r要求充分於絕緣間隔物22之耐UV性能。於如此 緣树月曰層20 ’進而可防止絕緣間隔物22之絕緣列化。作為舍 料之絕緣性樹脂，最好係使用以氟元素 (以鐵浮龍（註冊商標）為主要成份），和 素树月曰、、且a物（譬如，以石夕樹脂為主要成份）之任一者或 以下，將說明本實施型態之實施例子。 (實施例子1) 將形成絕緣樹脂層2〇之黏著薄片完成如下。 ㈣if ίί混合環氧樹月旨100之重量部，二氰二胺基（硬 fiii!部’2—乙醇+甲基（替）味唾（硬化催化劑） =篁環氧魏偶合劑10重量部，由乙基甲基酮及二 :基甲胺所形成之溶劑（MEK: DMF=1:2 (重量比））7 里部而溶解之溶液。 嫌枯ϊά欠、，於此溶液再混合平均顆粒直徑5 _之氧化銘（無 體700重量部，以授摔機（dispar)授拌此，作成固 Γ% ’黏度3000cps之黏祠狀。且，將此黏稠狀塗 ίΓϋ缚膜上，以15(rcl0分鐘乾燥此，完成具有厚度5〇 "峰者性之B狀態之黏著料（含有無機填充物85wt% )。 ，次’使用5imn厚之純來作為金屬層1()，積層為上面 ^ =寻片’以6.67hPa (5tor)以下之降壓條件，加熱、 理貫際壓力G. 29_ (3kgf/em2)，13(rCx 10分而完成 不貝層體L。 12 1258227 之後，削薄積層體L而取得厚度（t=5mm)之 ， 於金屬層ίο絲進行鑛金，將複數個封裝 & =電子料，再藉__4將_==^ 電路ίϊ Μ細緻化封裝30而取得搭配複數電子零件40之個別[Technical Field] The present invention relates to an electronic component such as a power chip or an LED used in the field of power electronics or in the field of LEDs, in order to mount this on a circuit board with high precision. A method of manufacturing a high thermal conductivity circuit assembly used and a south temperature conductive circuit assembly obtained by the method. [Prior Art] "In recent years, with the high functionality of electronic devices, light and thin, it is required to mount electronic components on circuit boards with high precision. Especially in the field of power electronics, due to high precision installation. Electronic parts that are prone to heat (for example, led) are used as electronic parts: in addition to the design of two precision wirings formed by fine-cases (precision patterns), electronic parts = heat are required for the circuit board. The heat dissipation is high. However, since the circuit board itself is concerned with the heat of the future, the package with high heat dissipation is expected, and the circuit components of the sub-parts are expected to be mounted on the circuit component substrate. The electric dry special assembly is well known as the patent disclosed in Japanese Patent Laid-Open No. 2003-163378. The package is formed by electrical separation of the metal body formed by injection molding, which is part of the ΐί' edge. The two gold soil layers are connected to the iron of the electronic component at each metal base layer, and the heat extracted by the fr part is also released through the metal base layer. Therefore, the manufacturing circuit is formed by deleting-forming, and further The problem of degree and safety. Zitmv; the distance between the metal barriers, even if it is about the distance between the terminals and the distance between the terminals, it is required to be equipped with a very thin size, evenly complete the door, for example, at 20~500 There is a technically difficult problem to achieve before the #m degree. The current thickness (insulation distance) is formed by the package formed in the first 5 1258227, and is mounted on the above-mentioned package laminate: the mounting surface is formed by thinning the profile of the laminate. Force = 丄 = 述, t ===4; _ face =, gas is connected to the above insulation spacers two, so the smart surface is smooth and the electronic parts of the wire is difficult to make the top The thickness of the partition depends on the thickness of the partition, and the thickness of the layer (insulation distance) is included in the package as a whole. It can be electrically connected to the electronic parts correctly. In the case of an electronic component, the plurality of LEDs are mutually mutually and %=sourced, and the coffee can be implemented as a side-by-column line. [Embodiment] ❸f-f~4 is a high-information conductivity indicating an embodiment of the present invention. Thunder', capture power transistors or more LEDs The hot thunder has long loved the Du T show 'is used for high precision on the circuit base ^p on the i-electric seal 褒 30 mostly formed of metal, with a metal: 'has heat dissipation in electronic parts 4〇 The heat generated by the moon 2: ί seal 3 pairs of circuit patterns 60 formed on the circuit board P, and has two electrodes connected to the electronic components 40 5 . That is, as the second ίϊί 3G is insulated by insulation The material 22 causes the two metal base layers 11, 12 electrically isolated to be integrated into the structure of the insulating spacer 22. The 40 series is disposed in the package 30 in a shape spanning the insulating spacer 22, and is formed on the electric zero 1258227 °. The 3° is completed by thinning the laminated body L, so the thickness (t) is shown in the following figure: it is an example in which the subdividing cuts out the circuit component encapsulating the two from the laminated body L. It is not limited to the package 30 that is to be cut, and the circuit component M is completed. τ 另 ^ 具备 具备 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备 具备At the same time, a plurality of seals are produced. It is preferable to roughen the surface of the metal in advance in order to obtain the metal layer 10 and the resin insulation ί s s. The surface of the metal layer ig is treated by a physical roughening treatment. Although it is not a specific limitation to use the metal layer 10, it is preferable to use the copper, the inscription, the record, the iron, and the at least one and the multi-layer material (in order to re-read the iid gold 展 exhibition. Metal cladding material) is selected. Alternatively, the sides of the different metal layers 20 may be placed. Although the thickness of the metal layer 1G is not limited to 寸, it is preferably a range of 5 to 2 〇 ugly. 1 is an insulating plastic material forming the insulating resin layer 2〇. As such a composition = the system is known as a thermosetting wax or a plastic two: The shape axis of the most rim fat f is not particularly limited to dryness in a PET film or the like, and is obtained by applying an insulating resin to the insulating resin. Drying on glass cloth; 1258227 As fine (p-g) is another thin and uniform thickness of insulating resin 20. =. This age is obtained by adding a squeezing compound (or a thermoplastic resin composition) by adding an inorganic filler, a hardener, a hardening catalyst, a solvent, a pigment, etc., which are conventionally known to be thermosetting. . The curry layer constitutes the P insulating resin layer 20, that is, the thickness of the insulating spacer 22, and is a gentleman. If the thickness * of the insulating resin layer 20 is lower than 'm: === the bubble of the fat layer 20 or the possibility of poor insulation caused by the fine dog on the surface of the metal layer may not be insulated. When the thickness of the resin layer 20 exceeds 5 〇〇, the distance between the terminals of the electronic component 4G that is the target is sometimes "connected. The thickness of the resin insulating layer 2G can be used in accordance with ΐ ^5\ η 士 士 Γ Γ 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬 譬 η 譬 譬 譬 譬 η 譬 譬 η 譬 η η η η η η η η η η η η η η η η η η η η η η η , 嬖舻JT uses epoxy resin 'phenol resin, poly phthalocyanine resin, enamel resin, i or phosphorus denatured resin, as the main component of the hot month 曰 broadcast * heat hardening (10) test 'best Wei Gao = The filler is thus filled with a high degree of inorganic filling: preferably with a thermal conductivity of 22, and a more effective release from the electricity, while the thermal expansion coefficient of the insulating spacer 22 is close to that of the metal ya '22. The number can improve the high scale conductivity 1: the heat of the road component = '. The fluidity of the thermosetting resin composition at the time of completion of the laminated body L can be adjusted by adjusting the amount of the inorganic filler to be filled as needed. θ The inorganic filler described above is not particularly limited, but is not particularly limited. 11 1258227 can be selected by A1203, %〇, BN, A1N, Si〇2, CaC〇3, etc., lion 3, _ ' Μ ' A11V ' 6 is better than its silk machine filling and coupling agent Or a dispersant, etc. The iii is used as the part 4G', for example, the use of uv (ultraviolet) is required to be sufficient for the UV resistance of the insulating spacer 22. Thus, the edge of the tree layer 20' can be prevented. Insulation of the insulating spacers 22. As the insulating resin for the material, it is preferable to use a fluorine element (with iron flotation (registered trademark) as a main component), and a sapphire, and a substance (such as An embodiment of the present embodiment will be described with respect to any one or less of the following elements: (Example 1) The adhesive sheet forming the insulating resin layer 2 is completed as follows. (iv) If ίί mixed epoxy tree The weight of the month 100, dicyandiamine Fiii! Department '2 - Ethanol + Methyl (alternative) flavor saliva (hardening catalyst) = 10 parts by weight of oxime oxime coupling agent, solvent formed by ethyl methyl ketone and dimethyl ketone (MEK: DMF =1:2 (weight ratio)) 7 The solution dissolved in the inner part. It is too dry, and the solution is mixed with the average particle diameter of 5 _ Oxidation (No body weight of 700 parts, to dispare the machine (dispar) This is mixed with a viscosity of 3000 cps, and the viscous shape is applied to the film. The viscous coating is applied to the film at 15 (rcl dried for 0 minutes, and the B state with a thickness of 5 〇" Adhesive (containing 85 wt% of inorganic filler). , 'Use 5imn thick pure as the metal layer 1 (), the layer is the above ^ = finder 'with a pressure reduction condition of 6.67hPa (5tor) or less, heating, and the internal pressure G. 29_ (3kgf / em2) , 13 (rCx 10 points and complete the shell layer L. 12 1258227, after thinning the layer L to obtain the thickness (t = 5mm), in the metal layer ίο silk for gold, multiple packages & Material, and then __4 will _==^ circuit ϊ Μ fine-grained package 30 to obtain a combination of multiple electronic components 40
〜ίί三圖所示之實施型態中，雖然為表示藉由形成於下面 犬兔，極44而將電子零件4〇連接齡屬基層U :各袭訂b〇Ming)，錫爐等，配^ 子轉之下*和金_ u， 另外，於上述之實施之型態上，雖妙 子零件4〇時’二 工時，將涵ΐ於封^f^3G表面’要求電鍍處理或鏡面加 而可於1、〇 ϋ ΐ ’ #由光罩雜絕緣樹脂層2〇， 第五圖“七圖為表:：月錄之層二層施= ”交互積層為複數片之絕緣樹脂Λ/2〇Γ第五 面之剖斷面’沿著積層方向相互取得呈令 40下面之端子連接㈣;届'J配置’再藉由鮮錫將各電子零件 13 1258227 ίί之複數電路組件M (第五圖⑽。如此-來，從 心匕，於，同時亦取出複數之電敝件M。 之金屬芙以不同之金屬層10 一部分所形成 所形成ii緣間隔ί20 一部分 電子示製作縱幽㈣複數之 件之電路細杜M之各封聚單片32，為搭載一個電子零 數之久牛之例子，但是本發明未必限定於此型態，且複 處答載複數之電子零件’亦可作成於任意 二’，足積層體L切割出-片封裝3。， 間㈣99 t f 1之’從積層體L切割封裝30，將絕緣 藉赃馳顿，同時， 研^7所十坦化之封裝之其中一面，作成雷早愛杜夕6 ίΪϋΪ密ίΐ進行f子零件之絲。此极善細^電子Ϊ i子零件於_嫩之後，亦可絲於_化之單片封 另^ ’當以使用LED來作為電子零件時 ===如由於為縱橫配列電子零= 顯示用電路i且件。/點 ^ f j：r"""? 此 f度备光。因此，將縱列配置LE1) 件了^之L£= 第而將可細示糊畫像 弟八圖為本貫施型態之變形例子，表示細緻化封裝3〇所 14 1258227In the embodiment shown in Fig. 3, although the electronic component 4 is connected to the base layer U by the formation of the lower dog, the pole 44, each of the b〇Ming), the tin furnace, etc. ^ Sub-transfer * and gold _ u, In addition, in the above-mentioned implementation type, although the sub-parts 4 〇 when the 'two working hours, will cover the surface of the ^ ^ ^ 3G ' require plating or mirror plus However, it can be used in the 〇ϋ ΐ # # 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由剖The cross section of the fifth side's are connected to each other along the direction of the stacking direction (4); the 'J configuration' and the electronic circuit components of the electronic components 13 1258227 ίί Figure (10). So, from the heart, at the same time, also take out a plurality of electric components M. The metal buds are formed by a part of different metal layers 10 to form a ii edge interval ί20 part of the electronic display to create a vertical (four) plural The circuit of the circuit is a single piece of 32, which is an example of a long-term cow with an electronic zero, but the present invention may not necessarily The electronic component that is limited to this type and is duplicated and loaded with a plurality of 'can also be made into any two', the foot laminate L cuts out - the package 3, and the (four) 99 tf 1 'cuts the package 30 from the laminated body L, I borrowed the insulation from the insulation, and at the same time, I studied the side of the package of the ten-tend, and made it into the wire of the f-parts. This is a very good fine ^ electronic Ϊ i sub-parts _ After the tender, you can also sing the singular single-chip seal ^ 'When using the LED as the electronic component === If the electronic zero is arranged for the vertical and horizontal = display circuit i and the piece. / point ^ fj: r" ;""? This f-level is ready for light. Therefore, the column is configured with LE1). The L?= will be able to show the example of the deformation of the eight-figure mode. Packaging, 3, office 14 1258227
Idi32為湘正方體形狀，於相鄰之2個面可安裝 氣。此種情況，各電子零件4〇係以適當方式電 氣性ίίϊϊ關隔物22所隔離之金屬基層1卜12，電 件尺和可任意封裝30之厚度係配合於使用之電子零 如第笛十一圖為表示本發明之其他實施型態，其中， ίίί ίΐί=金Λ基層11，12，13之封裝單片32，製造 目々件40之電路組件Μ。此封裝單片30禆科钟忐腚 ί η 晶體作為電子零件來安裝，^金屬基 而加以使用。於此圖；ifn τ，_之電極 電子零相連_，使 層連接電子零件。〜備犬塊電極’而藉由突塊電極往金屬基 30^ 如第五圖所示，於從積型態之積層體L。亦即， 零件4〇為了跨越於之封裝^上’各電子 電子零件40之後，將延著圖中曰^於縱檢並列安裝複數 分斷32封裝 本發明並非限定於包含 数^電„ Μ。 所隔離之金屬基賴目 人^早片32之相互電氣性 亦即’可作成電路組件二二目之金屬基層之封裝， 目’選擇於積之金取出之電路組件數 者積層體L之寬度，進而&各種脂層20之數目，或 可製造-次多數個具備因屬:層 15 1258227 之封裝3〇，電路組件M。 再者，搭載於-個電路組 非限定於-個。如第十二圖^零件40數目，亦並 碰，備安裝於—個個別封I十二，所了’將2個電子零件 單片32係具備3個金屬/層'，體3°，。„，個別封裝 係使用為共同電極，各電子变 ，中央金屬基層12 物22形狀而配置於金屬基；，以跨越絕緣間隔 (w^ebond,,) 情況下，如第十二圖所示，格载複數之電子零件之 自由選擇金屬層數目，於從層數’亦即’ 子零件之後，切割封裝ί積^上安裝複數電 圖所示之複數電子零件之電路組ϋ =夕文具備第十三 告传用不闾带、"牛Μ。另外，如圖所示，即使 田使用不Π域之电子冬件40Α，備時 Π己列於封裝上，故可有效製造多數i路易Ϊ此ί 列2個以上之電子零件而 = 氣性並列連接。 了衣早U2上，亦可相互電 【圖式簡單說明】 第一圖於本發明之實施型態之高熱傳導性電路組件之 衣造方法之各過程（A)〜（E)說明圖。 示以上述相同製造方法所得之電路組件斜視圖。 弟二圖為表不同上之電路組件之侧面圖。 ^四圖為表示安制上電路組件之電路基板之剖面圖。 第五圖，表示於本發明之其他實施型態之高熱傳導性電路組 十 件之製造方法之各過程（Α)〜（F)說明圖。 ^六圖為表示以上述相同製造方法所得之電路組件斜視圖。 第七圖為表示同上之電路組件之側面圖。 第八圖為表示以上述相同製造方法所得之其他電路組件斜視 圖。 16Idi32 is in the shape of a square cube, and gas can be installed on two adjacent sides. In this case, each electronic component 4 is electrically connected to the metal base layer 1 12 separated by the spacer 22 in an appropriate manner, and the thickness of the electrical component tape and the optional package 30 is matched with the electronic zero used as the first tenth. One figure shows another embodiment of the present invention in which the package piece 32 of the base layer 11, 12, 13 of the base layer is manufactured, and the circuit components of the object 40 are manufactured. This package is a monolithic 30 禆 忐腚 ί ί crystal that is mounted as an electronic component and used as a metal base. In this figure; ifn τ, _ electrode electronic zero connected _, the layer is connected to the electronic parts. ~ Prepare the dog block electrode' and use the bump electrode to the metal base 30^ as shown in the fifth figure, in the buildup layer L. That is, after the components 4 are packaged over the 'electronic electronic components 40', the plurality of segments 32 are packaged in parallel with the vertical inspection. The present invention is not limited to the inclusion of a plurality of wires. The mutual electrical properties of the isolated metal-based Laiman's early film 32 are also the package of the metal base layer which can be used as the circuit component of the second component of the circuit, and the width of the laminated body L of the circuit component selected by the product. And the number of the various fat layers 20, or the number of the plurality of the fat layers 20, may be manufactured in a plurality of layers: the package of the layer 15 1258227, the circuit component M. Further, the circuit group is not limited to one. Twelfth figure ^ The number of parts 40, also touched, is installed in an individual seal I twelve, the 'two electronic parts single 32 series with three metal / layer', body 3 °, „ The individual package is used as a common electrode, and each electron is changed, and the central metal base layer 12 is shaped like a metal substrate; in the case of crossing the insulation interval (w^ebond,), as shown in FIG. The number of freely selected metal layers of the electronic components carrying the complex number 'After the sub-components, product ^ ί cut package mounted on a plurality of electrical shown in FIG plurality of electronic part circuit group ϋ = Xi Advertisement message includes a thirteenth pass with without with Lu, " [mu] cattle. In addition, as shown in the figure, even if the field uses 40 pieces of electronic winter parts that are not in the field, the time is listed on the package, so it is possible to effectively manufacture more than two electronic parts of the i. connection. In the case of the clothes U2, it is also possible to electrically exchange each other. [Schematic description of the drawings] The first figure shows the processes (A) to (E) of the method for fabricating the high thermal conductivity circuit assembly of the embodiment of the present invention. An oblique view of the circuit component obtained by the same manufacturing method as described above is shown. The second picture shows the side view of the different circuit components. The four figures are sectional views showing the circuit substrate on which the circuit components are mounted. Fig. 5 is a view showing the processes (Α) to (F) of the manufacturing method of the high thermal conductivity circuit group of the other embodiment of the present invention. ^6 is a perspective view showing a circuit component obtained by the same manufacturing method as described above. Figure 7 is a side view showing the same circuit component. Figure 8 is a perspective view showing another circuit component obtained by the same manufacturing method as described above. 16