TWI256968B - Novel adhesives comprising diacetals - Google Patents
Novel adhesives comprising diacetalsInfo
- Publication number
- TWI256968B TWI256968B TW092126338A TW92126338A TWI256968B TW I256968 B TWI256968 B TW I256968B TW 092126338 A TW092126338 A TW 092126338A TW 92126338 A TW92126338 A TW 92126338A TW I256968 B TWI256968 B TW I256968B
- Authority
- TW
- Taiwan
- Prior art keywords
- glue
- prepared
- diacetals
- stratified
- aid
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/04—Condensation polymers of aldehydes or ketones with phenols only
- C09J161/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
- C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
- C09J161/30—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic and acyclic or carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/30—Presence of wood
- C09J2400/303—Presence of wood in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2461/00—Presence of condensation polymers of aldehydes or ketones
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Paper (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0211845A FR2844803B1 (fr) | 2002-09-25 | 2002-09-25 | Nouveaux adhesifs renfermant du 1,1,2,2-tetramethoxyethane |
FR0308393A FR2844802B1 (fr) | 2002-09-25 | 2003-07-09 | Nouveaux adhesifs renfermant des diacetals |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200417590A TW200417590A (en) | 2004-09-16 |
TWI256968B true TWI256968B (en) | 2006-06-21 |
Family
ID=31979942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092126338A TWI256968B (en) | 2002-09-25 | 2003-09-24 | Novel adhesives comprising diacetals |
Country Status (15)
Country | Link |
---|---|
US (1) | US20060194918A1 (zh) |
EP (1) | EP1543088B1 (zh) |
JP (1) | JP2006500471A (zh) |
CN (1) | CN1685026A (zh) |
AR (1) | AR041371A1 (zh) |
AT (1) | ATE377639T1 (zh) |
AU (1) | AU2003282162A1 (zh) |
BR (1) | BR0314636A (zh) |
CA (1) | CA2499619A1 (zh) |
DE (1) | DE60317354D1 (zh) |
FR (1) | FR2844802B1 (zh) |
NO (1) | NO20051012L (zh) |
PL (1) | PL376046A1 (zh) |
TW (1) | TWI256968B (zh) |
WO (1) | WO2004029170A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2866893B1 (fr) * | 2004-03-01 | 2007-10-19 | Clariant France Sa | Utilisation du 1,1,2,2-tetramethoxyethane a titre d'agent de coalescence |
BRPI0706521A2 (pt) | 2006-01-12 | 2011-03-29 | Dynea Oy | sistema de ligação de polìmero-aldeìdo para produção de produtos de madeira |
US8389613B2 (en) * | 2006-03-29 | 2013-03-05 | Vencorex France | Aqueous emulsions comprising polyisocyanate/acetal solvent compositions and coatings/adhesives produced therefrom |
FR2910784B1 (fr) | 2006-12-27 | 2009-02-20 | Arkema France | Utilisation de composes pour la conservation du corps humain ou animal et compositions les comprenant |
JP4859749B2 (ja) * | 2007-05-11 | 2012-01-25 | 日本合成化学工業株式会社 | 偏光板および偏光板用接着剤 |
FR2933271B1 (fr) * | 2008-07-01 | 2010-07-30 | Arkema France | Compositions topiques pour la conservation du corps humain ou animal |
US10155069B2 (en) | 2016-09-09 | 2018-12-18 | King Abdulaziz University | Bone graft with a tannin-hydroxyapatite scaffold and stem cells for bone engineering |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2360959A (en) * | 1944-10-24 | Process of making tetra-acetals | ||
NL128127C (zh) * | 1962-10-08 | |||
US4039496A (en) * | 1974-09-09 | 1977-08-02 | American Cyanamid Company | Low formaldehyde fully etherified methylolated melamine with urea-formaldehyde-glyoxal as textile resin |
SE455790B (sv) * | 1982-08-06 | 1988-08-08 | Perstorp Ab | Modifieringsmedel som tillsats i bindemedel av kondensationsprodukter av formaldehyd och urea, melamin eller fenol eller blandningar av dessa |
DE3339424A1 (de) * | 1983-10-29 | 1985-05-09 | Herberts Gmbh, 5600 Wuppertal | Waermehaertbare beschichtungsmasse, darin enthaltene prekondensate und deren verwendung |
FR2566771B1 (fr) * | 1984-06-29 | 1986-12-26 | Hoechst France | Derives du glyoxal et procede pour leur preparation |
US5219616A (en) * | 1989-05-13 | 1993-06-15 | Herberts Gesellschaft Mit Beschranker Haftung | Heat curable coating compositions and their use for coating finish films and endless edges |
US5155170A (en) * | 1990-11-09 | 1992-10-13 | Akzo Coatings, Inc. | Process for preparing low formaldehyde polyacetal containing coating |
EP1174480A1 (fr) * | 2000-07-17 | 2002-01-23 | LAMBIOTTE & CIE S.A. | Colle aminoplaste ou phénoplaste à résistance mécanique améliorée |
-
2003
- 2003-07-09 FR FR0308393A patent/FR2844802B1/fr not_active Expired - Fee Related
- 2003-09-15 EP EP03773781A patent/EP1543088B1/fr not_active Expired - Lifetime
- 2003-09-15 DE DE60317354T patent/DE60317354D1/de not_active Expired - Lifetime
- 2003-09-15 CN CN03822959.5A patent/CN1685026A/zh active Pending
- 2003-09-15 AT AT03773781T patent/ATE377639T1/de not_active IP Right Cessation
- 2003-09-15 JP JP2005501923A patent/JP2006500471A/ja not_active Abandoned
- 2003-09-15 WO PCT/FR2003/002716 patent/WO2004029170A1/fr active IP Right Grant
- 2003-09-15 US US10/529,253 patent/US20060194918A1/en not_active Abandoned
- 2003-09-15 PL PL03376046A patent/PL376046A1/xx not_active Application Discontinuation
- 2003-09-15 CA CA002499619A patent/CA2499619A1/fr not_active Abandoned
- 2003-09-15 AU AU2003282162A patent/AU2003282162A1/en not_active Abandoned
- 2003-09-15 BR BR0314636-7A patent/BR0314636A/pt not_active Application Discontinuation
- 2003-09-24 AR ARP030103470A patent/AR041371A1/es unknown
- 2003-09-24 TW TW092126338A patent/TWI256968B/zh not_active IP Right Cessation
-
2005
- 2005-02-24 NO NO20051012A patent/NO20051012L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
CN1685026A (zh) | 2005-10-19 |
WO2004029170A1 (fr) | 2004-04-08 |
PL376046A1 (en) | 2005-12-12 |
ATE377639T1 (de) | 2007-11-15 |
NO20051012L (no) | 2005-04-13 |
US20060194918A1 (en) | 2006-08-31 |
TW200417590A (en) | 2004-09-16 |
AR041371A1 (es) | 2005-05-11 |
DE60317354D1 (de) | 2007-12-20 |
EP1543088A1 (fr) | 2005-06-22 |
FR2844802B1 (fr) | 2007-03-23 |
EP1543088B1 (fr) | 2007-11-07 |
CA2499619A1 (fr) | 2004-04-08 |
FR2844802A1 (fr) | 2004-03-26 |
JP2006500471A (ja) | 2006-01-05 |
BR0314636A (pt) | 2005-08-02 |
AU2003282162A1 (en) | 2004-04-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |