TWI256673B - High voltage metal oxide semiconductor and fabricating method thereof - Google Patents

High voltage metal oxide semiconductor and fabricating method thereof

Info

Publication number
TWI256673B
TWI256673B TW94130276A TW94130276A TWI256673B TW I256673 B TWI256673 B TW I256673B TW 94130276 A TW94130276 A TW 94130276A TW 94130276 A TW94130276 A TW 94130276A TW I256673 B TWI256673 B TW I256673B
Authority
TW
Taiwan
Prior art keywords
drift regions
gate
regions
high voltage
source
Prior art date
Application number
TW94130276A
Other languages
Chinese (zh)
Other versions
TW200713578A (en
Inventor
Hwi-Huang Chen
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW94130276A priority Critical patent/TWI256673B/en
Application granted granted Critical
Publication of TWI256673B publication Critical patent/TWI256673B/en
Publication of TW200713578A publication Critical patent/TW200713578A/en

Links

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

A high voltage MOS transistor comprising a substrate, a well, a gate insulating layer, a gate, two drift regions, a channel region, a source/drain region and an insulator is provided. The well is disposed in the substrate. The gate insulating layer is formed over the substrate. The gate is disposed over the gate insulating layer. The drift regions are located in the well beside the gate, wherein the gate has a width not more than that of the drift regions. The channel region is located between the drift regions, wherein the channel region has a width larger that of the drift regions. The source/drain regions are formed in the two drift regions respectively. The insulator is formed in the two drift regions and between the channel region and the source/drain regions. The insulator and the source/drain regions are surrounded by the two drift regions.
TW94130276A 2005-09-05 2005-09-05 High voltage metal oxide semiconductor and fabricating method thereof TWI256673B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94130276A TWI256673B (en) 2005-09-05 2005-09-05 High voltage metal oxide semiconductor and fabricating method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94130276A TWI256673B (en) 2005-09-05 2005-09-05 High voltage metal oxide semiconductor and fabricating method thereof

Publications (2)

Publication Number Publication Date
TWI256673B true TWI256673B (en) 2006-06-11
TW200713578A TW200713578A (en) 2007-04-01

Family

ID=37614743

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94130276A TWI256673B (en) 2005-09-05 2005-09-05 High voltage metal oxide semiconductor and fabricating method thereof

Country Status (1)

Country Link
TW (1) TWI256673B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415262B (en) * 2008-02-27 2013-11-11 Advanced Analogic Tech Inc Isolated transistors and diodes and isolation and termination structures for semiconductor die
TWI584476B (en) * 2011-08-25 2017-05-21 聯華電子股份有限公司 High voltage metal-oxide-semiconductor transistor device and method of fabricating the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI415262B (en) * 2008-02-27 2013-11-11 Advanced Analogic Tech Inc Isolated transistors and diodes and isolation and termination structures for semiconductor die
TWI584476B (en) * 2011-08-25 2017-05-21 聯華電子股份有限公司 High voltage metal-oxide-semiconductor transistor device and method of fabricating the same

Also Published As

Publication number Publication date
TW200713578A (en) 2007-04-01

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