TWI256083B - Seasoning method for etch chamber - Google Patents
Seasoning method for etch chamberInfo
- Publication number
- TWI256083B TWI256083B TW093115794A TW93115794A TWI256083B TW I256083 B TWI256083 B TW I256083B TW 093115794 A TW093115794 A TW 093115794A TW 93115794 A TW93115794 A TW 93115794A TW I256083 B TWI256083 B TW I256083B
- Authority
- TW
- Taiwan
- Prior art keywords
- etching chamber
- yield
- flow rate
- reacting gas
- seasoning
- Prior art date
Links
- 235000011194 food seasoning agent Nutrition 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 6
- 239000006227 byproduct Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093115794A TWI256083B (en) | 2004-06-02 | 2004-06-02 | Seasoning method for etch chamber |
US11/141,978 US20050269293A1 (en) | 2004-06-02 | 2005-05-31 | Seasoning method for etch chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093115794A TWI256083B (en) | 2004-06-02 | 2004-06-02 | Seasoning method for etch chamber |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200540981A TW200540981A (en) | 2005-12-16 |
TWI256083B true TWI256083B (en) | 2006-06-01 |
Family
ID=35446553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093115794A TWI256083B (en) | 2004-06-02 | 2004-06-02 | Seasoning method for etch chamber |
Country Status (2)
Country | Link |
---|---|
US (1) | US20050269293A1 (zh) |
TW (1) | TWI256083B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7662723B2 (en) * | 2005-12-13 | 2010-02-16 | Lam Research Corporation | Methods and apparatus for in-situ substrate processing |
CN111211065A (zh) * | 2018-11-22 | 2020-05-29 | 长鑫存储技术有限公司 | 半导体生产设备的清洗方法及半导体工艺方法 |
CN111725044B (zh) * | 2019-03-21 | 2023-08-18 | 北京北方华创微电子装备有限公司 | 暖机方法和基片的刻蚀方法 |
CN111370283B (zh) * | 2020-03-05 | 2023-01-17 | 北京北方华创微电子装备有限公司 | 一种暖机方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4739787A (en) * | 1986-11-10 | 1988-04-26 | Stoltenberg Kevin J | Method and apparatus for improving the yield of integrated circuit devices |
JPH0982495A (ja) * | 1995-09-18 | 1997-03-28 | Toshiba Corp | プラズマ生成装置およびプラズマ生成方法 |
US5756400A (en) * | 1995-12-08 | 1998-05-26 | Applied Materials, Inc. | Method and apparatus for cleaning by-products from plasma chamber surfaces |
US5803107A (en) * | 1996-03-29 | 1998-09-08 | Lam Research Corporation | Method and apparatus for pressure control in vacuum processors |
US5827437A (en) * | 1996-05-17 | 1998-10-27 | Lam Research Corporation | Multi-step metallization etch |
US6670265B2 (en) * | 1997-05-12 | 2003-12-30 | Advanced Micro Devices, Inc. | Low K dielectic etch in high density plasma etcher |
US6165272A (en) * | 1998-09-18 | 2000-12-26 | Taiwan Semiconductor Manufacturing Company, Ltd | Closed-loop controlled apparatus for preventing chamber contamination |
US6153849A (en) * | 1999-01-29 | 2000-11-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for preventing etch rate drop after machine idle in plasma etch chamber |
US6949203B2 (en) * | 1999-12-28 | 2005-09-27 | Applied Materials, Inc. | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene |
KR100476931B1 (ko) * | 2002-09-19 | 2005-03-16 | 삼성전자주식회사 | 시즈닝 레서피의 최적화 방법 |
US20040211519A1 (en) * | 2003-04-25 | 2004-10-28 | Tokyo Electron Limited | Plasma reactor |
-
2004
- 2004-06-02 TW TW093115794A patent/TWI256083B/zh not_active IP Right Cessation
-
2005
- 2005-05-31 US US11/141,978 patent/US20050269293A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TW200540981A (en) | 2005-12-16 |
US20050269293A1 (en) | 2005-12-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |