TWI255902B - Heat pipe and method of manufacturing - Google Patents
Heat pipe and method of manufacturingInfo
- Publication number
- TWI255902B TWI255902B TW93117737A TW93117737A TWI255902B TW I255902 B TWI255902 B TW I255902B TW 93117737 A TW93117737 A TW 93117737A TW 93117737 A TW93117737 A TW 93117737A TW I255902 B TWI255902 B TW I255902B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat pipe
- tube
- casing
- metal plate
- vacuum
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rigid Pipes And Flexible Pipes (AREA)
- Thermal Insulation (AREA)
Abstract
A heat pipe includes a casing and a wicking layer covering the inner surface of the casing, and a protecting layer disposed on the outer surface of the casing keeping the heat pipe in vacuum. More particularly, the heat pipe includes a hydrophilic layer disposed on the wicking layer. The heat pipe contains some working fluid. A method of manufacturing the heat pipe includes following steps: (1) offering a metal plate; (2) treating surfaces of the plate by laser beam; (3) coating material on sides of the metal plate to form the wicking layer and the hydrophilic layer by turn, and the protecting layer under condition of a vacuum greater than 5x10<-6> pascal; (4) rolling the metal plate into a tube, sealing the seem and one end of the tube; (5) filling some working fluid into the tube, and pumping it vacuum; (6) sealing the tube.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93117737A TWI255902B (en) | 2004-06-18 | 2004-06-18 | Heat pipe and method of manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93117737A TWI255902B (en) | 2004-06-18 | 2004-06-18 | Heat pipe and method of manufacturing |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200600740A TW200600740A (en) | 2006-01-01 |
TWI255902B true TWI255902B (en) | 2006-06-01 |
Family
ID=37614012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93117737A TWI255902B (en) | 2004-06-18 | 2004-06-18 | Heat pipe and method of manufacturing |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI255902B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103185476A (en) * | 2011-12-30 | 2013-07-03 | 奇鋐科技股份有限公司 | Radiating structure of radiating unit |
TWI477729B (en) * | 2011-12-30 | 2015-03-21 | Asia Vital Components Co Ltd | Heat dissipation structure of heat dissipation unit |
TWI593930B (en) * | 2011-12-30 | 2017-08-01 | 奇鋐科技股份有限公司 | Heat dissipation structure for heat dissipation unit |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI692607B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692605B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
TWI692609B (en) * | 2019-06-28 | 2020-05-01 | 新加坡商 J&J 資本控股有限公司 | Heat conducting structure, manufacturing method thereof, and mobile device |
-
2004
- 2004-06-18 TW TW93117737A patent/TWI255902B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103185476A (en) * | 2011-12-30 | 2013-07-03 | 奇鋐科技股份有限公司 | Radiating structure of radiating unit |
TWI477729B (en) * | 2011-12-30 | 2015-03-21 | Asia Vital Components Co Ltd | Heat dissipation structure of heat dissipation unit |
CN103185476B (en) * | 2011-12-30 | 2016-05-11 | 奇鋐科技股份有限公司 | The radiator structure of heat-sink unit |
TWI593930B (en) * | 2011-12-30 | 2017-08-01 | 奇鋐科技股份有限公司 | Heat dissipation structure for heat dissipation unit |
Also Published As
Publication number | Publication date |
---|---|
TW200600740A (en) | 2006-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |