TWI255902B - Heat pipe and method of manufacturing - Google Patents

Heat pipe and method of manufacturing

Info

Publication number
TWI255902B
TWI255902B TW93117737A TW93117737A TWI255902B TW I255902 B TWI255902 B TW I255902B TW 93117737 A TW93117737 A TW 93117737A TW 93117737 A TW93117737 A TW 93117737A TW I255902 B TWI255902 B TW I255902B
Authority
TW
Taiwan
Prior art keywords
heat pipe
tube
casing
metal plate
vacuum
Prior art date
Application number
TW93117737A
Other languages
Chinese (zh)
Other versions
TW200600740A (en
Inventor
Ga-Lane Chen
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW93117737A priority Critical patent/TWI255902B/en
Publication of TW200600740A publication Critical patent/TW200600740A/en
Application granted granted Critical
Publication of TWI255902B publication Critical patent/TWI255902B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rigid Pipes And Flexible Pipes (AREA)
  • Thermal Insulation (AREA)

Abstract

A heat pipe includes a casing and a wicking layer covering the inner surface of the casing, and a protecting layer disposed on the outer surface of the casing keeping the heat pipe in vacuum. More particularly, the heat pipe includes a hydrophilic layer disposed on the wicking layer. The heat pipe contains some working fluid. A method of manufacturing the heat pipe includes following steps: (1) offering a metal plate; (2) treating surfaces of the plate by laser beam; (3) coating material on sides of the metal plate to form the wicking layer and the hydrophilic layer by turn, and the protecting layer under condition of a vacuum greater than 5x10<-6> pascal; (4) rolling the metal plate into a tube, sealing the seem and one end of the tube; (5) filling some working fluid into the tube, and pumping it vacuum; (6) sealing the tube.
TW93117737A 2004-06-18 2004-06-18 Heat pipe and method of manufacturing TWI255902B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93117737A TWI255902B (en) 2004-06-18 2004-06-18 Heat pipe and method of manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93117737A TWI255902B (en) 2004-06-18 2004-06-18 Heat pipe and method of manufacturing

Publications (2)

Publication Number Publication Date
TW200600740A TW200600740A (en) 2006-01-01
TWI255902B true TWI255902B (en) 2006-06-01

Family

ID=37614012

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93117737A TWI255902B (en) 2004-06-18 2004-06-18 Heat pipe and method of manufacturing

Country Status (1)

Country Link
TW (1) TWI255902B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103185476A (en) * 2011-12-30 2013-07-03 奇鋐科技股份有限公司 Radiating structure of radiating unit
TWI477729B (en) * 2011-12-30 2015-03-21 Asia Vital Components Co Ltd Heat dissipation structure of heat dissipation unit
TWI593930B (en) * 2011-12-30 2017-08-01 奇鋐科技股份有限公司 Heat dissipation structure for heat dissipation unit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI692607B (en) * 2019-06-28 2020-05-01 新加坡商 Ｊ＆Ｊ 資本控股有限公司 Heat conducting structure, manufacturing method thereof, and mobile device
TWI692605B (en) * 2019-06-28 2020-05-01 新加坡商 Ｊ＆Ｊ 資本控股有限公司 Heat conducting structure, manufacturing method thereof, and mobile device
TWI692609B (en) * 2019-06-28 2020-05-01 新加坡商 Ｊ＆Ｊ 資本控股有限公司 Heat conducting structure, manufacturing method thereof, and mobile device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103185476A (en) * 2011-12-30 2013-07-03 奇鋐科技股份有限公司 Radiating structure of radiating unit
TWI477729B (en) * 2011-12-30 2015-03-21 Asia Vital Components Co Ltd Heat dissipation structure of heat dissipation unit
CN103185476B (en) * 2011-12-30 2016-05-11 奇鋐科技股份有限公司 The radiator structure of heat-sink unit
TWI593930B (en) * 2011-12-30 2017-08-01 奇鋐科技股份有限公司 Heat dissipation structure for heat dissipation unit

Also Published As

Publication number Publication date
TW200600740A (en) 2006-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees