I2r 5 3 6 ^S^twf.doc/c 九、發明說明： 【發明所屬之技術領域】 本發明7C有關於一種圖案化製辛呈，且特別是有關於〆 種電漿顯不|§之定址電極以及導電結構的形成方法。 【先前技術】 近年來’由於微電子技術的進步促使資訊、通訊和網 路技術及其相錢勃發展下，驗呈現各種文字、數 據圖案和動悲景> 像的顯示器成為不可或缺的必要零件。 ^中’電漿顯示器以其大尺寸、自發光、無視角依存、輕 /以及王衫化等優點而具有極大的應用潛力，可望成為下 一代的平面顯示器之主流。 圖1綠示為習知—種電漿顯示器的立體分解示意圖。 靖/照圖1，電漿顯示器100主要是由前基板（front SU Strate)U〇、放電氣體（未繪示）以及後基板（rear su ,strate)12〇所構成。其中，前基板11〇主要是由基板ι〇、 =電極以及γ電極所構成，且χ電極與γ電極係配置於 土反/1〇上’並覆蓋有介電層11與保護層12 〇 ^基板120係由基板20、定址電極（address mi、15、介電層17、阻隔壁(rib)30以及螢光材料層 成。其中，定址電極15係配置於基板20上，介 私曰^則係配置於基板20上，並覆蓋住定址電極15。 rtf 30係配置於介電層17上，並將基板20刻分為多 個放電腔體-彳刀句夕 f 13，螢光材料層21則係配置於放電腔體13 的側壁及底部。此外，電聚顯示器刚中的放電氣體亦是 1253 673s4twf.d〇c/c 配置在這些放電腔體13中。 、一承上所述，習知定址電極15的形成方法係先將含有 感光材料的銀漿料全面性地塗佈在基板20上，之後再對 此銀漿t進行曝光及顯影製程，以在基板20上形成條狀 圖案的，址電S 15。纽可知，在此圖案化製程中必須 移除大量價格昂貴的練料，以形成條狀的定址電極15。、 然而在此製程中被移除的銀漿料並無法再回收使用， 而造成製程成本上的浪費。 u 為了解決上述之問題，習知還提出另一種形成定址電 極15—的方法，其係利用網板印刷製程而直接在基板20上 形成定址電極15。然而，由於網板印刷製程無法形成較 精細的圖案，因此並不適用於高解析度之顯示器的 【發明内容】 有鑑於此，本發明的目的就是在提供一種電漿顯示哭 之定址電極與導電結構的形成方法，以減少製程中所耗二 的材料量，進而節省製程成本。 貝 /發明提出-種電槳顯示H之定址電極的形成方法， 其係先長:供一感光導電材料，接著進行網版印刷製程，γ 將此感光導電材料配置在基板上，因而形成 =沾= 條導電圖案。紐，提供-鮮，此光罩具有相互^= 多條透光_。讀將此鮮配置在基板上方，以使 之每一透光圖案均位於這些導電圖案其中之一的上方 中，每-透光圖案的線寬係小於其所軸之導電 ^ 寬。接著，以此光罩絲幕對這些導輯行微影製=綠 12536^Z^64twf.doc/« 以於基板上形成多條定址電極。 依照本發明之較佳實施例所述，此感光導電材料例如 是金屬與感光材料的混合物，且其較佳的是銅、始或銀與 感光材料的混合物。 依照本發明之較佳實施例所述，在形成這些定址電極 之後更包括對這些疋址電極進行一燒結(sintering)製程， 以去除這些定址電極中的非金屬材料。 ―依照本發明之較佳實施例所述，上述之網板印刷製程 係將具有多_口_㈣置於基板上，然後將感光導電 材料塗佈於網板上，以使感光導電材料經由這些開口流至 基板上，以形成上述之導電圖案，之後再將網板由基板上 移除。其中，這些導電圖案之線寬例如是介於100微米至 120微米之間。而且，在—實施财，這些導電圖案的間 距例如是100微米。 依照本發明之較佳實施例所述，在圖案化導電圖案以 形成這些定址電極的步驟巾，包括令這些定址電極的間距 為微米’且在—實施例中，更包括令這些定址電 線寬為70微米。 ^本發明提供一種導電結構的形成方法，適於在基板上 心成夕個導電結構。此方法係先提供一感光導電材料，秋 後進行網板印刷製程，以將感光導電材料配置於基板上”，、、 因而在基板上形成多個導電圖案。接著進行微影製程，以 圖案化這些導電圖案而形成多個導電結構。 依照本發明之較佳實施例所述，上述之微影製程的步 >4twf.doc/c 驟包括先提供具有多個透光圖案的光罩，然後將此光罩配 置在基板上方，以使光罩之每一透光圖案均位於這些第一 感光圖案其中之一的上方。而且，每一透光圖案係小於其 所對應之第一感光圖案。之後，以此光罩為罩幕對這些第 一感光圖案進行微影製程，以在基板上形成多個導電結 構0 依照本發明之較佳實施例所述，此感光導電材料例如 疋金屬與感光材料的混合物，且其較佳的是銅、鉑或銀與 感光材料的混合物。 ^ 依照本發明之較佳實施例所述，在形成這些導電結構 之後，更包括對這些導電結構進行一燒結製程，以去除這 些導電結構中的非金屬材料。 依照本發明之較佳實施例所述，形成這些第一感光圖 案的步驟包括令光罩上之透光圖案的間距為2〇〇微米，且 在一實施例中’更包括令透光圖案之線寬例如是7〇微米。 此外，這些第一感光圖案之線寬例如是介於1〇〇微米至12〇 ^依照本發明之較佳實施例所述，上述之網板印刷製程 係先將具衫個開^_板配置於基板JL，賊將感^導 電材料塗佈於網板上，以使感光導電材料經由這些開口流 基板上，以形成上述之第—感光圖案，之後再將網板 基板上移除。其中’這些第一感光圖案之線寬例如是介於 1〇〇微米至12G微米之間。而且，在—實施例中，這些第 一感光圖案的間距例如是丨00微米。 —I2r 5 3 6 ^S^twf.doc/c IX. Description of the invention: [Technical field to which the invention pertains] The present invention 7C relates to a patterning process, and in particular to the invention of a plasma. Addressing electrodes and methods of forming conductive structures. [Prior technology] In recent years, due to advances in microelectronics technology, information, communication and network technologies and their development have been developed, and displays of various texts, data patterns, and tragic scenes have become indispensable. Necessary parts. ^中's plasma display has great application potential due to its large size, self-illumination, no viewing angle dependence, lightness, and king size. It is expected to become the mainstream of the next generation of flat panel displays. Figure 1 is a schematic exploded perspective view of a conventional plasma display. According to Fig. 1, the plasma display device 100 is mainly composed of a front substrate (U), a discharge gas (not shown), and a rear substrate (rear su, strate). The front substrate 11A is mainly composed of a substrate ι, a = electrode and a γ electrode, and the χ electrode and the γ electrode are disposed on the soil reverse/1〇 and covered with the dielectric layer 11 and the protective layer 12 〇 ^ The substrate 120 is formed by a substrate 20, address electrodes (address mi, 15, dielectric layer 17, barrier rib 30, and a layer of phosphor material. The address electrodes 15 are disposed on the substrate 20, and the interface is It is disposed on the substrate 20 and covers the address electrode 15. The rtf 30 is disposed on the dielectric layer 17, and the substrate 20 is divided into a plurality of discharge cavities - a sickle f 13 , a phosphor layer 21 The arrangement is disposed on the side wall and the bottom of the discharge chamber 13. In addition, the discharge gas in the electropolymer display is also 1253 673s4twf.d〇c/c disposed in the discharge chambers 13. The method for forming the address electrode 15 is to firstly apply a silver paste containing a photosensitive material to the substrate 20, and then expose and develop the silver paste t to form a strip pattern on the substrate 20. , address S 15 . New Zealand knows that a large number of expensive products must be removed in this patterning process The material is formed to form the strip-shaped address electrode 15. However, the silver paste removed in this process cannot be recycled, which causes waste of process cost. u In order to solve the above problems, the conventional method also proposes another A method of forming an address electrode 15 - directly forming an address electrode 15 on a substrate 20 by a screen printing process. However, since the screen printing process cannot form a finer pattern, it is not suitable for high resolution. SUMMARY OF THE INVENTION In view of the above, an object of the present invention is to provide a method for forming a plasma-discharged address electrode and a conductive structure to reduce the amount of material consumed in the process, thereby saving process cost. The invention proposes a method for forming an address electrode of an electric paddle, which is firstly long: for a photosensitive conductive material, followed by a screen printing process, and γ is disposed on the substrate, thereby forming a smear=strip Conductive pattern. New, provide - fresh, the reticle has mutual light = _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the upper of one of the conductive patterns, the line width of each of the light-transmitting patterns is smaller than the conductive width of the axis. Then, the photomask screen is used to lithography the green lines = green 12536^Z ^64twf.doc/« to form a plurality of addressed electrodes on the substrate. According to a preferred embodiment of the invention, the photosensitive conductive material is, for example, a mixture of a metal and a photosensitive material, and preferably copper, or A mixture of silver and a photosensitive material. Further, in accordance with a preferred embodiment of the present invention, after forming the addressed electrodes, a sintering process is performed on the address electrodes to remove non-metallic materials from the addressed electrodes. According to a preferred embodiment of the present invention, the screen printing process described above has a plurality of ports (four) placed on a substrate, and then a photosensitive conductive material is coated on the screen to allow the photosensitive conductive material to pass through the layers. The opening flows onto the substrate to form the conductive pattern described above, and then the stencil is removed from the substrate. Wherein, the line width of these conductive patterns is, for example, between 100 micrometers and 120 micrometers. Moreover, in the implementation, the spacing of these conductive patterns is, for example, 100 μm. In accordance with a preferred embodiment of the present invention, the step of patterning the conductive patterns to form the addressed electrodes includes spacing the addressed electrodes to a micron' and, in an embodiment, including making the addressed wires wide 70 microns. The present invention provides a method of forming a conductive structure suitable for forming a conductive structure on a substrate. The method first provides a photosensitive conductive material, and after the autumn, performs a screen printing process to dispose the photosensitive conductive material on the substrate, thereby forming a plurality of conductive patterns on the substrate. Then performing a lithography process to pattern The conductive patterns form a plurality of conductive structures. According to a preferred embodiment of the present invention, the step of the lithography process described above includes first providing a mask having a plurality of light transmissive patterns, and then The reticle is disposed above the substrate such that each of the light transmissive patterns of the reticle is located above one of the first sensitized patterns. Moreover, each of the light transmissive patterns is smaller than the corresponding first sensible pattern. Thereafter, the first photosensitive pattern is lithographically processed by the mask as a mask to form a plurality of conductive structures on the substrate. According to a preferred embodiment of the present invention, the photosensitive conductive material such as base metal and photosensitive a mixture of materials, and preferably a mixture of copper, platinum or silver and a photosensitive material. ^ In accordance with a preferred embodiment of the present invention, after forming the conductive structures, The conductive structures are subjected to a sintering process to remove non-metallic materials from the conductive structures. According to a preferred embodiment of the present invention, the steps of forming the first photosensitive patterns include spacing the light-transmitting patterns on the mask to 2 〇〇 micron, and in one embodiment 'more includes the line width of the light-transmitting pattern is, for example, 7 μm. Further, the line width of these first photosensitive patterns is, for example, between 1 μm and 12 μm. According to a preferred embodiment of the present invention, the screen printing process described above firstly disposes a shirt on the substrate JL, and the thief applies a conductive material on the screen to make the photosensitive conductive material pass through the screen. The openings are formed on the substrate to form the first photosensitive pattern, and then the screen substrate is removed. The line width of the first photosensitive patterns is, for example, between 1 μm and 12 μm. In the embodiment, the pitch of the first photosensitive patterns is, for example, 丨00 μm. —
Ltwf.doc/c 依照本發明之較佳實施例所述，在圖案化這些導電圖 案以形成導電結構的步财，包括令這㈣電結&的間距 為200微米，且在一實施例中，更包括令這些導電結構之 線寬為70微米。 一 本發明係先利用網板印刷製程在基板上形成多個尺寸 較大的導電圖案，之後再進行微影製程，以圖案化這些導 電圖案’進而在基板上形成具有符合需求之尺寸的多^導 電結構。與習知僅以微影製程進行圖案化的製程相較之 下’本發明可減少圖案化製程中所移除的材料量，進而節 省製程成本。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作 明如下。 、" 【實施方式】 本發明係利用網板印刷的方式在基板上形成多個導電 圖=後，再利用微影製程圖案化這些導電圖案，以獲得具 有貝際所舄之尺寸的導電結構。與習知相較之下，本發明 不仁可節省製程成本，也能夠形成圖案較為精細的膜層， =更於應用在高解析度之顯示H的製程巾。以下將舉實施 、月本^明，但其並非用以限定本發明。熟習此技藝者 可依照本發明之精神對下述之實施例稍做變化，惟其仍屬 於本發明之範圍内。 圖2A至圖2C 結構之形成流程剖面 繪示為本發明之一較佳實施例的導電 圖。在此將以圖1所繪示之定址電極 ^twf.doc/c 15的製作過程來說明本發明之導電結構的形成方法。 請參照圖2A，首先利用感光導電材料2〇2以及網板 204進行網板印刷製程，以於基板20上形成多個導電圖 案206。此網板印刷製程係先將網板2〇4配置於基板2〇 上’接著將感光導電材料202塗佈於網板204上，以使感 光導電材料202可經由網板204之開口 210流至基板20 上，因而形成導電圖案206。在此，通常可以藉由刮刀216 來元成上述將感光導電材料202塗佈在印刷網板204上的 v驟。此外，感光導電材料202例如是由感光材料與導電 性較佳之金屬混合而成。舉例來說，感光導電材料2〇2例 如是由一般常見之感光材料與銀、銅或是鉑混合而成。 承上所述，網板204例如是具有多個長條形的開口 210，如圖3所示。因此，藉由網板2〇4所形成的導電圖 案206亦為長條形之圖案，且在本發明之一實例中，這些 ¥電圖案206的線寬a例如是介於1〇〇微米至丨2()微米之 間而這些導電圖案206之間的間距(Space)b例如是1〇〇 微米。值得注意的是，本發明並未限定網板2〇4之開口 21〇 的形狀與排列方式為圖3所示，熟習此技藝者可依照實際 製程所欲形成之圖案來選擇網板2〇4之開口 21〇的形狀盥 排列方式。 〃 一請參照圖2B，在基板20上形成導電圖案2〇6之後， 接著將網板204由基板20上移除。然後，以光罩212對 導電圖案206進行微影製程。其中，光罩212上係呈有多 個透光圖案214(如圖4所示），而這些透光圖案；、14可 1253 67i264twf.d〇c/c 以疋，欲形成或是欲移除之圖案相同，端視進行微影製程 之感光材料的特性而定，熟習此技藝者應該瞭解其細節， 此處將=贅述。在本實施例中，透光圖案214例如是與欲 形成之定址電極15 (見圖1)關餘同。換言之，透光 圖案214例如是長條狀且相互平行的透光圖案。 、，繼續參照圖2B，將光罩212配置於基板2〇上方， 以使每一透光圖案214均位於一導電圖案206上方。接著 =光罩212為罩幕，藉由光源240對這些導電圖案2〇6進 仃曝光製程。之後，請參照圖2C，將光罩212從基板如 ^方移除，紐對這些曝光後的導電圖案施進行顯影製 ^ j於基板2G上形成多個導電結構23()。在本實施例 中’這些導電結構230即是圖丨之電漿顯示器廟中的定Ltwf.doc/c In accordance with a preferred embodiment of the present invention, the steps of patterning the conductive patterns to form a conductive structure include making the (4) electrical junction & spacing of 200 microns, and in one embodiment It also includes making these conductive structures have a line width of 70 microns. In the invention, a plurality of large-sized conductive patterns are formed on a substrate by using a screen printing process, and then a lithography process is performed to pattern the conductive patterns ′ to form a size on the substrate having a desired size. Conductive structure. Compared with the conventional process of patterning only by the lithography process, the present invention can reduce the amount of material removed in the patterning process, thereby saving the process cost. The above and other objects, features, and advantages of the present invention will become more apparent from the understanding of the appended claims. [Embodiment] In the present invention, a plurality of conductive patterns are formed on a substrate by screen printing, and then the conductive patterns are patterned by a lithography process to obtain a conductive structure having a size of a beak. . Compared with the prior art, the invention can save the process cost, and can also form a film with a fine pattern, and is more suitable for the process towel of the high-resolution display H. The following is a description of the implementation, but it is not intended to limit the invention. It will be apparent to those skilled in the art that the following examples may be modified in accordance with the spirit of the invention, which is still within the scope of the invention. 2A to 2C are schematic cross-sectional views showing a conductive pattern of a preferred embodiment of the present invention. Here, a method of forming the conductive structure of the present invention will be described with reference to the fabrication process of the address electrode ^twf.doc/c 15 illustrated in FIG. Referring to FIG. 2A, a screen printing process is first performed using the photosensitive conductive material 2〇2 and the screen 204 to form a plurality of conductive patterns 206 on the substrate 20. The screen printing process firstly disposes the stencil 2 〇 4 on the substrate 2 ' and then applies the photosensitive conductive material 202 to the stencil 204 so that the photosensitive conductive material 202 can flow through the opening 210 of the stencil 204 . On the substrate 20, a conductive pattern 206 is thus formed. Here, the above-described step of coating the photosensitive conductive material 202 on the printing screen 204 can be generally performed by the doctor blade 216. Further, the photosensitive conductive material 202 is made of, for example, a mixture of a photosensitive material and a metal having better conductivity. For example, the photosensitive conductive material 2〇2 is, for example, a mixture of commonly used photosensitive materials and silver, copper or platinum. As described above, the stencil 204 is, for example, an opening 210 having a plurality of elongated shapes as shown in FIG. Therefore, the conductive patterns 206 formed by the stencils 2 〇 4 are also elongated patterns, and in one example of the present invention, the line width a of the electric patterns 206 is, for example, between 1 〇〇 micron to Between 2 () micrometers and the spacing b between these conductive patterns 206 is, for example, 1 〇〇 micrometer. It should be noted that the shape and arrangement of the openings 21 of the stencil 2 〇 4 are not shown in FIG. 3 , and those skilled in the art can select the stencil 2 〇 4 according to the pattern to be formed by the actual process. The shape of the opening 21〇 is arranged. Referring to FIG. 2B, after the conductive pattern 2〇6 is formed on the substrate 20, the screen 204 is then removed from the substrate 20. Then, the conductive pattern 206 is subjected to a lithography process by the photomask 212. Wherein, the reticle 212 has a plurality of transparent patterns 214 (as shown in FIG. 4), and the transparent patterns; 14 can be 1253 67i264twf.d〇c/c, which are to be formed or to be removed. The pattern is the same, depending on the characteristics of the photographic material for the lithography process, those skilled in the art should understand the details, which will be described here. In the present embodiment, the light transmissive pattern 214 is, for example, the same as the address electrode 15 (see Fig. 1) to be formed. In other words, the light transmitting pattern 214 is, for example, a light-transmissive pattern that is elongated and parallel to each other. 2B, the photomask 212 is disposed above the substrate 2〇 such that each of the light transmissive patterns 214 is located above a conductive pattern 206. Then, the mask 212 is a mask, and the conductive pattern 2〇6 is exposed to the light source 240. Thereafter, referring to FIG. 2C, the photomask 212 is removed from the substrate, and the exposed conductive patterns are developed to form a plurality of conductive structures 23 on the substrate 2G. In the present embodiment, the conductive structures 230 are defined in the plasma display temple of the figure.
ϊ::!-15。此外’在本發明之一實例中，此處所形成之 ^電、、、。構230的線寬C例如是7〇微米。而且，由於圖2A =形，的導電圖案206之線寬a係介於ι〇〇微米至i2〇 礒未之間，且間距bg 1〇〇微米，因 =的叫㈣d則例如是介於觸微米— 至== 特別較’以電t顯示器觸的製程為例，通常在完 疋址電極15的目案化製程後，還 以移除定址電極15中的# Y烷、、，°裏私 等），進而提高其導電性非金屬材枓（例如是感光材料 值得注意的是，H述實補 _示器100的定址電極15為例做說明圖 11 twf.doc/c 發明限定為圖1之電漿顯示器100的製程。熟習此技藝者 應該知道，本發明亦可應用於其他型態的電漿顯示器中， 例如是具有格狀(waffle)阻隔壁或是蜂巢狀(h〇ney c〇mb)阻 隔壁的電漿顯示器中。除此之外，本發明也可以應用於其 他形成導電結構的製程中。換言之，上述實施例係用以說 明本發明，並非用以限定本發明之應用範圍。 、综上所述，本發明係先利用網板印刷製程在基板上形 成多個尺寸較大的導電圖案，之後再進行微影製程，以圖 案化這些導電圖案，進而在基板上形成多個尺寸較小的導 電結構。因此本發明可具有下列優點： 1·與習知僅以微影製程進行圖案化的製程相較之 I，本發明可減少圖案化製程中所移除的材料量，進而 省製程成本。 圖案化的製程相較 因此可應用於高解 2·與習知僅以網板印刷製程進行 之下，本發明可形成較為精細的圖案， 析度之電漿顯示器的製程中。 雖，、、、、本發明已贿佳實施觸露如上，然其並非用以 二本發明，，任何熟習此技藝者，在*雌本發明之精神 二較圍内’當可作些許之更動與潤飾，因此本發明之保 轨圍當視後社冑請專利範圍所界定者鱗。 【圖式簡單說明】 器的立體分解示意圖 之一較佳實施例的導ϊ::!-15. Further, in an example of the present invention, the electricity, , and . The line width C of the structure 230 is, for example, 7 〇 micrometers. Moreover, since the line width a of the conductive pattern 206 is between ι 〇〇 micron and i2 〇礒, and the pitch bg is 1 〇〇 micrometer, the (4) d of = is, for example, a touch Micron-to-= is particularly preferable to the process of taking an electric t-display, usually after the meshing process of the address electrode 15 is completed, to remove the #Y-alkane, Etc.), thereby improving the conductivity of the non-metallic material 枓 (for example, the photosensitive material is noteworthy, the description of the address electrode 15 of the sigma 100 is illustrated as an example. FIG. 11 twf.doc/c invention is limited to FIG. The process of the plasma display 100. It will be appreciated by those skilled in the art that the present invention can also be applied to other types of plasma displays, such as waffle barrier walls or honeycombs (h〇ney c〇). Mb) in the plasma display of the barrier wall. In addition, the present invention can also be applied to other processes for forming a conductive structure. In other words, the above embodiments are for explaining the present invention and are not intended to limit the scope of application of the present invention. In summary, the present invention first utilizes a screen printing process at the base. A plurality of large-sized conductive patterns are formed on the board, and then a lithography process is performed to pattern the conductive patterns to form a plurality of small-sized conductive structures on the substrate. Therefore, the present invention has the following advantages: Compared with the conventional process of patterning only by the lithography process, the invention can reduce the amount of material removed in the patterning process, thereby saving the process cost. The patterned process can be applied to the high solution. 2, and the conventional method is only carried out by the screen printing process, the invention can form a finer pattern and the process of the plasma display of the resolution. Although, the invention has been implemented in the above, However, it is not used in the present invention, and any person skilled in the art can make some changes and refinements in the spirit of the invention. Therefore, the orbit of the present invention is regarded as a post-hospital society. The scale defined by the scope of the patent. [Simplified illustration of the diagram] The schematic diagram of one of the preferred embodiments of the apparatus
圖1繪示為習知一種電漿顯示 圖2A至圖2C繪示為本發明 結構之形成流程剖面圖。 12 125367264 twf.doc/c 圖3繪示為圖2A之網板204的上視示意圖。 圖4繪示為圖2B之光罩212的上視示意圖。 【主要元件符號說明】 10、20 :基板 1卜17 :介電層 12 :保護層 13 :放電腔體 15 :定址電極 21 :螢光材料層 30 :阻隔壁 100 :電漿顯示器 110 :前基板 120 :後基板 202 :感光導電材料 204 :網板 206 :導電圖案 210 :網板之開口 212 :光罩 214 :光罩之透光圖案 216 :刮刀 230 ·•導電結構 240 :曝光光源 X : X電極 Y : Y電極 131 is a conventional plasma display. FIG. 2A to FIG. 2C are cross-sectional views showing the formation process of the structure of the present invention. 12 125367264 twf.doc/c FIG. 3 is a top plan view of the stencil 204 of FIG. 2A. 4 is a top plan view of the reticle 212 of FIG. 2B. [Description of main component symbols] 10, 20: substrate 1b 17: dielectric layer 12: protective layer 13: discharge cavity 15: address electrode 21: phosphor layer 30: barrier wall 100: plasma display 110: front substrate 120: rear substrate 202: photosensitive conductive material 204: stencil 206: conductive pattern 210: stencil opening 212: reticle 214: reticle transparent pattern 216: squeegee 230 • conductive structure 240: exposure light source X: X Electrode Y: Y electrode 13