1250937 (1) 玖、發明說明 【發明所屬之技術領域】 本發明是關於一種將黏接性薄膜與玻璃等基材一起通 過互相反方向地旋轉的一對壓接輥間而在基材上黏貼薄膜 的薄膜黏貼裝置；特別是關於一種將分離的兩枚薄膜黏貼 於基材使得在正交於壓接輥間的通過方向的方向成爲並排 的薄膜黏貼裝置者。 【先前技術】 在製作液晶顯示面板或電漿顯示面板等中，有將具黏 接性的抗蝕薄膜黏貼於基材的玻璃基板的工程，而在該工 程中使用著將抗蝕薄膜與玻璃基板一起通過互相反方向地 旋轉的一對壓接輥間而將抗蝕薄膜黏貼於基板上的薄膜黏 貼裝置。 薄膜黏貼裝置是設於玻璃基板的搬運路途中，複數玻 璃基板是隔著一定間隔搬運在搬運路上，而抗蝕薄膜是成 爲從薄膜輥被送出而與各玻璃基板一起通過壓接輥間。 抗鈾薄膜是具黏接性，須作成在使用前等光阻薄膜不 會附著灰塵，或是容易從薄膜輥送出等理由，而在抗蝕薄 膜的表背面覆蓋底層薄膜與蓋層薄膜作成三層構成，而捲 繞作成三層構成的薄膜俾作成薄膜輥。 此種薄膜輥是被裝設在薄膜黏貼裝置，在使用時由薄 膜輥送出後，剝掉蓋層薄膜而作成抗蝕薄膜與底層薄膜的 兩層構成，兩層構成的薄膜是供給於壓接輥間使得抗蝕薄 -5- (2) 1250937 膜成爲玻璃基板側。 藉由壓接輥欲將抗蝕薄膜黏貼於玻璃基板之際，爲了 防止壓接輥在基板間的抗蝕薄膜受污染，而轉印至後續的 玻璃基板，在相當於基板間的抗鈾薄膜設置暫時性的盍J曾 薄膜，或是相反地除去相當於基板間的抗鈾薄膜而施以露 出底層薄膜等的基板間處理。 通過壓接輥間的各玻璃基板是成爲以底層薄膜連繫的 形式之故，因而切斷玻璃基板間的底層薄膜而得到互相地 分離的玻璃基板，成爲運送至下一工程。 近年來，若在下游工程個別地處理所分離的玻璃基板 使得生產性會降低之故，因而在未分離之狀態下進行線括 處理。 這時候，作爲顯示面板並不是使用所需大小的玻璃基 板，而是作爲顯示面板使用所需大小的兩倍或三倍的大型 玻璃基板、黏貼薄膜，儘量進行所期望的處理之後切斷玻 璃基板，而作爲顯示面板作成所需大小。 作爲表示此種技術者，有日本特開2 002-3 43 7 1 3號公 報。 在上述習知技術中，通過壓接輥間之際，抗蝕薄膜與 玻璃基板均爲各一枚，而玻璃基板的切斷方向是壓接輥間 通過方向，亦即，正交於搬運路的玻璃基板的搬運方向的 方向，而成爲被限定於抗鈾薄膜的寬度方向的搬運方向採 取多數個（搬運方向採取多面）。 顯示面板是逐漸成爲大型化方向，惟在上述習知技術 -6- 1250937 (3) 上，爲了防止容易破裂的玻璃基板的長大化的方便，薄膜 寬度是須配合顯示面板的長度方向長度。 配合顯不面板的大型化而須增加薄膜寬度，並不是順 著資材共用化的流程，而導致增加生產成本。 【發明內容】 爲了此，本發明的目的，是在於提供一種基材的切斷 方向成爲壓接輥間通過方向，亦即成爲搬運路的基材搬運 方向的寬度方向可採取多數個的薄膜黏貼裝置。 又，本發明的目的，是在於提供一種即使未使用按照 顯示面板的大型化的寬度大的薄膜也可採取多數個的薄膜 黏貼裝置。 爲了達成上述目的的本發明的薄膜黏貼裝置，是屬於 將黏接性薄膜與基材一起通過互相反方向地旋轉的一對壓 接輥間而在該基材上黏貼該薄膜的薄膜黏貼裝置，其特徵 爲：設置對於基材的搬運方向正交的方向成爲並排的至少 兩支薄膜捲出軸，從裝設於各薄膜捲出軸的薄膜輥所送出 的各薄膜是與該基材一起通過該一對壓接輥間，各薄膜是 同時地黏貼於該基材。 又，作爲達成上述目的的本發明薄膜黏貼裝置的特徵 爲：在各薄膜捲出軸的軸支位置從偏離基材搬運方向的 各薄膜輥一直到一對壓接輥之間的各薄膜的路徑途中個別 設置張力控制機構，俾調整各薄膜路徑長不相同的各薄膜 的張力，將對於基材的黏合狀態成爲一致。 -7- 1250937 (4) 又，作爲達成上述目的的本發明薄膜黏貼裝置的特徵 :一對壓接輥是作成平輥’作爲背輥使用冠狀輥，以一對 平輥來防止各薄膜的蛇行，同時可得到因背輥而長大化的 平輥的壓接力的均勻化。 【實施方式】 以下，參照圖式詳述本發明的一實施形態。 第1圖是表示成爲本發明的薄膜黏貼裝置的槪略圖。 la、lb是分別裝設薄膜輥2a、2b的薄膜捲出軸；藉由 伺服馬達3a、3b個別地獨立而被驅動控制。各薄膜輥2a、 2b是將以蓋層薄膜與底層薄膜覆蓋抗蝕薄膜的表背而作成 三層構成者，經捲繞使得底層薄膜成爲外側者。 在剛從各薄膜輥2a、2b送出後，剝離蓋層薄膜4a、4b 而作成抗蝕薄膜5a、5b及底層薄膜6a、6b的兩層構成。 兩層構成的抗蝕薄膜5a、5b與底層薄膜6a、6b是總稱 爲薄膜7a、7b。經剝離的蓋層薄膜4a、4b是分別被回收到 捲取輥8a、8b。9a、9b是以非接觸計測各薄膜輥2a、2b的 薄膜徑的感測器。 10是將作爲黏貼抗蝕薄膜5a、5b的基材的玻璃基板1 1 在圖中由左邊朝右邊搬運的複數搬運輥。在各搬運輥1 0中 ，以適當間隔上下地設置壓輥1 2，而能夾住玻璃基板11。 搬運輥1 〇與壓輥1 2是構成玻璃基板1 1的搬運路，而在第1 圖中以虛線表示該路面位置。 1 5 A、1 5 B是設於玻璃基板1 1的搬運路中的一對壓接 -8- (5) 1250937 車昆，在表面有樹脂塗層，而在內部設置電熱器。雖未圖不 ，惟內設溫度感測器’成爲使樹脂塗層表面濕度變成所需 溫度而可控制供給於電熱器的電力。 1 6 A、1 6 B是各壓接輥1 5 A、1 5 B的背輥。作爲各壓接 輥15A、15B，外形使用圓筒的平輥，作爲背輥16A、16B 使用外形具有朝軸長的中央側稍鼓起的冠狀輥。利用該二 段構成，各壓接輥1 5 A、1 5 B是正交於各壓接輥1 5 A、1 5 B 的軸向或玻璃基板1 2的搬運方向的寬度方向中以均勻線壓 加壓玻璃基板1 1的上下表面。 複數玻璃基板1 2是以適當間隔由圖左邊的未圖示的上 游側機器搬運以搬運輥1 0與壓輥1 2所構成的搬運路上之故 ，因而感測器1 7成爲檢測各該玻璃基板1 2的搬入。 依照該感應器1 7檢測玻璃基板，逐步實行薄膜黏貼於 下述的玻璃基板。 從薄膜輥2a、2b所送出而被剝離蓋層薄膜4a、4b的薄 膜7a、7b是經方向轉換輥20a、20b，而到達基板處理單元 21a、 21b ° 基板間處理單元2 1 a、2 1 b是分別具有一對圓盤刀具 22a、22b與黏接手段23a、23b及支撑台24a、24b。一對圓 盤刀具22a、22b與黏接手段23a、23b是位於抗飩薄膜5a、 5b這側，而支撑台24a、2413是位於底層薄膜6a、6b這側。 一對圓盤刀具22a、22b與黏接手段23a、23b是一面將 薄膜7a、7b推向支撑台24a、24b一面朝垂直於圖的方向移 動，亦即朝各薄膜7a、7b的寬度方向移動，而在各薄膜7a 1250937 (6) 、7b的厚度方向，底層薄膜6a、6b是不會被切斷地而切斷 抗蝕薄膜5 a、5 b。配合該切斷，以黏接手段2 3 a、2 3 b從底 層薄膜6a、6b剝離各一對圓盤刀具22a、22b間的抗蝕薄膜 5 a、5 b，而露出被剝離部位的底層薄膜6 a、6 b (又，作爲 表示該基板間處理單元2 1 a、2 1 b的一例者有表示於日本特 開2002-104719號公報者）。 通過各基板間處理單元21a、21b的薄膜7a、7b是依次 經吸附輥25，薄膜張力檢測單元26、薄膜張力調整輥27、 薄膜過熱防止輥2 8，而到達一對壓接輥1 5 A、1 5 B。 吸附輥25、薄膜張力檢測單元26、及薄膜張力調整輥 27是設在各薄膜7a、7b，惟紙面上方便而僅表示薄膜7b這 側的一方。在薄膜過熱防止輥28、捲繞著兩薄膜7a、7b。 吸附輥25是經由離合器29a以伺服馬達30被驅動控制 〇 又，吸附輥25是呈圓筒狀，雖未圖示惟多數開孔設於 表面所有全周，而內部空間是經由電磁閥連通於真空源。 薄膜張力檢測單元6是成爲經由壓力感測器支持接觸 於底層薄膜6a、6b的輥的構成，從壓力感測器所檢測的薄 膜推壓力如圖示地朝圖式的左右方向移動薄膜張力調整輥 2 7，使得薄膜張力保持所需要値。 薄膜過熱防止輥2 8是薄膜7 a、7 b不會過度接觸於內設 電熱器的壓接輥1 5 A使得抗融薄膜5 a、5 b不變質者，如下 述地配合玻璃基板1 1的搬運而上下移動，而從壓接輥1 5 A 適當地拉開薄膜7a、7b。 *10- (7) 1250937 上述薄膜捲出軸1 a、1 b是在正交於以搬運輥1 〇與壓輥 1 2構成的搬運路的玻璃基板（基材1 1 )的搬運方向的方向 形成並排。 第2 ( a )圖是表示從上方鳥瞰各玻璃基板Π由圖式左 邊朝右邊通過壓接輥1 5 A、1 5 B間，而在黏貼抗蝕薄膜5 a 、5b狀態下搬運的狀況者。 壓接輥1 5 A、1 5 B是與薄膜過熱防止輥2 8同樣地並不 個別地設置薄膜7a、7b而成爲共用，與玻璃基板1 1一起地 通過壓接輥1 5 A、1 5 B間的抗蝕薄膜5 a、5 b是以加熱加壓 同時地黏貼在玻璃基板1 1。 如沿著第2 ( a )圖的1 一 1切剖線的縱斷面圖的第2 ( b )圖所示地，將在各玻璃基板1 1的前部與後部未黏貼有抗 蝕薄膜5 a、5 b的長度L 1、L2與前後兩玻璃基板1 1的間隔 L3的合計長度L4 ( = L1+L2+L3)作爲各基板間處理單 元21a、21b的一對圓盤刀具22a、22b的設定間隔。 在第2 ( a )圖施以剖面線的領域是抗蝕薄膜5a、5b黏 貼於各玻璃基板1 1的領域，惟成爲其搬運方向每一長度L5 地以各基板間處理單元2 1 a、2 1 b可剝取抗鈾薄膜5 a、5 b。 回到第1圖、3 1是分離單元，該單元是對於黏貼抗蝕 薄膜5 a、5 b而以底層薄膜6 a、6 b連接的各玻璃基板1 1切斷 底層薄膜6a、6b加以分離者，具有朝底層薄膜6a、6b的寬 度方向移動的圓盤刀具與支撑台33。在第2 (a)圖以一點 鏈線表示依圓盤刀具3 2的底層薄膜6 a ' 6 b的切斷位置。 第3圖是表示在玻璃基板丨丨黏貼抗蝕薄膜5 a、5 b之後 -11 - 1250937 (8) ，藉由圓盤刀具32來切斷底層薄膜6a、6b，作成分離且獨 立的玻璃基板1 1的狀態。又第3 ( b )圖是沿者第3 ( a )圖 的II 一 II切斷線的橫斷面圖。 又，第3圖的兩點鏈線是表示利用以後未圖示的切斷 手段來切斷玻璃基板1 1的位置，在切斷後成爲兩枚顯示面 板者，表示著基材（玻璃基板1 1 )的切斷方向成爲壓接輥 15A、15B間通過方向，亦即，成爲搬運路的基材（玻璃 基板1 1 )的搬運方向的寬度方向採取兩枚的情形。 如第2 ( a )圖所示地，將對於依圓盤刀具3 2的底層薄 膜6a、6b的前後切斷位置的間隔作爲L6，將設置有圓盤刀 具32且切斷底層薄膜6a、6b的位置作爲基準，並將從該基 準位置在第1圖中一直到各基板間處理單元21a、21b的各 該中心位置（各一對圓盤刀具22a、22b的各該中心位置） 爲止的薄膜7a、7b的搬運路徑上的長度成爲上述的前後的 切斷位置間隔L6的N (=任意整數）倍。 該N倍的整數値是在薄膜7a與薄膜7b作成不相同者。 因此，因此，各基板間處理單元2 1 a、2 1 b的各該中心位置 (各一對圓盤刀具22a、22b的各該中心位置）是最低也成 爲僅偏離上述的前後切斷位置間隔L6分量。 藉由該偏離，各基板間處理單元2 1 a、2 1 b是在玻璃基 板11的搬運方向或薄膜7a、7b的搬運方向的第1圖的左右 方向並排，爲了在薄膜7a、7b的寬度方向各基板間處理單 元2 1 a、2 ] b彼此間不會干涉，不但能容易地進行各基板間 處理單元2 1 a、2 ] b的保養檢修，而薄膜輥2 a、2 b也如圖示 (9) 1250937 地可偏離地軸支，又也容易地進行薄膜輥2a、2b的更換。 這時候，偏離地軸支的薄膜輥2 a、2 b的間隔，是與各基板 間處理單元2 1 a、2 1 b同樣地作成上述的前後的切斷位置間 隔L 6分量較理想。由此，處理於薄膜7 a及薄膜7 b的基板間 處理部（抗蝕除去部）的位置在薄膜的寬度方向一致，而 成爲可同時地進行對於薄膜7a及薄膜7b的各種操作或處理 ，具有可提高處理速度的優點。 以下，說明薄膜7a、7b黏貼至玻璃基板1 1的情形。 首先準備，成爲第4圖的狀態地，從薄膜輥2a、2b送 出三層薄膜，剝離蓋層薄膜4a、4b並以捲取輥8a、8b回收 〇 剝離蓋層薄膜4a、4b而成爲兩層的薄膜7a、7b，是經 過各基板間處理單元2 1 a、2 1 b或吸附輥25、薄膜張力檢測 單元26、薄膜張力調整輥27及薄膜過熱防止輥28而通過壓 接輥15A、15B間，以未圖示的薄膜握持手段朝第4圖的右 邊引拉成爲與搬運路平行的狀態，而形成薄膜路徑。 在薄膜7a、7b通過各基板間處理單元21a、21b的期間 ，配合上述前後切斷位置間隔L6而以各基板間處理單元 2 1 a、2 1 b進彳了除去抗飽薄膜5 a、5 b。 兩基板間處理單元2 1 a、2 1 b的間隔是至少作成前後切 斷位置間隔L6，因此在基板間處理單元2 1 a被除去的抗蝕 薄膜5 a僅移動前後切斷位置間隔L6分量，則成爲以基板間 處理單元21 a被除去的抗蝕薄膜5b並排的狀態。以薄膜張 力調整輥27調整薄膜7a、7b的張力成爲該並排位置不會偏 (10) 1250937 離。又，在兩基板間處理單元21a、21b的蓋層薄膜5a、5b 的除去處理中，從圓盤刀具22a、22b或黏接手段23a、23b 施加力量不會使薄膜7a、7b鬆弛地，以吸附輥25個別地吸 附保持各薄膜7a、7b，同時以伺服馬達3a、3b或伺服馬達 3 〇將張力賦於各薄膜7 a、7 b。 在抗蝕薄膜5a、5b的除去處理後，解除對於吸附輥25 的各薄膜7a、7b的個別吸附保持並打開離合器29，使得伺 服馬達30的驅動力不會施加於薄膜7a、7b，而不會妨礙薄 膜7a、7b的通過。又，薄膜過熱防止輥28是移動至搬運路 這側，使得薄膜7a、7b藉由壓接輥15A、15B不會加熱成 所需以上。 當以感測器1 7檢測到第一枚玻璃基板1 1被搬入時，如 第5圖所示地使得抗蝕薄膜5a、5b的黏貼前端與玻璃基板 1 1的薄膜黏領域前端能一致於壓接輥1 5 A、1 5 B的加壓位 置地分別移動抗蝕薄膜5a、5b與玻璃基板1 1之後，經由背 輥16A、16B而朝搬運路的方向移動壓接輥15A、15B。 薄膜過熱防止輥28是從搬運路避至上方，增加對於壓 接輥1 5 A、1 5 B的抗蝕薄膜5 a、5 b的接觸面積，以壓接輥 15A、15B預熱使得抗蝕薄膜5a、5b成爲適用於黏貼的溫 度。 以壓接輥15A、15B的互相反方向旋轉，薄膜7a、7b 是通過與玻璃基板1 1 一起通過壓接輥1 5 A、1 5 B間，抗蝕 薄膜5 a、5 b是藉由壓接輥1 5 A、1 5 B以加熱加壓黏貼於玻 璃基板1 1。 -14- 1250937 (11) 在該黏貼中，也以薄膜張力檢測單元26檢測各薄膜7a 、7b的張力，進行各伺服馬達3a、3b的驅動力控制或是薄 膜張力調整輥27的位置調整，使得各薄膜7a、7b的張力相 等。 當它成對於第一枚的玻璃基板1 1的黏貼，則如第6圖 所示，與背輥1 6 A、1 6 B —起打開壓接輥5 A、5 B，而薄膜 過熱防止輥2 8是移向搬運路這側。 又，將玻璃基板1 1與薄膜7a、7b移動基板間處理長度 L 4的長度分量而朝下游（第6圖的右邊）這側移動搬運路 上，並等待第二枚的玻璃基板11的搬入。 當第二枚的玻璃基板1 1被搬入，則重複以上所說明的 動作，如第6圖所示地等待搬入第三枚玻璃基板丨丨，作成 第三枚玻璃基板1 1與壓接輥1 5 A、1 5 B開始黏貼的第1圖狀 態。 在此，將分離單元3 1的支撑台3 3朝搬運路這側移動一 直到接觸於底層薄膜6a、6b。圓盤刀具32也朝搬運路這側 移動，而位於薄膜7a、7b的寬度方向端部，朝寬度方向旋 轉移動，而朝寬度方向切斷薄膜7a、7b。以薄膜7a、7b的 寬度方向切斷，利用底層薄膜6 a、6 b所連繫的各玻璃基板 1 1是在搬運路中最下游者成爲分離狀態，而形成表示於第 3圖者。 然後，從搬運路拉開分離單元3丨的圓盤刀具3 2與支撑 台3 3，而在第三枚玻璃基板丨丨黏貼抗飩薄膜5 a、5 b，以下 ’重複以上所說明的動作一直到不需要搬入所需枚數的玻 -15- 1250937 (12) 璃基板11，則可得到黏貼抗蝕薄膜5a、5b的多數被分離的 玻璃基板11 ° 被分離的各玻璃基板Π是在第3 ( b)圖的兩點鏈線位 置進行切斷，則玻璃基板11 (基材）的切斷方向成爲壓接 輥間通過方向’亦即，搬運路的玻璃基板（基材）11的搬 運方向的寬度方向採取兩個（寬度方向採取兩面）° 若增加薄膜輥的並排設置支數’則增加該多出分量採 取多數個的數量。 各薄膜輥的寬度是對應於最終的顯示面板寬度之故， 因而雖未準備最大寬度的薄膜輥’也可從一枚玻璃基板採 取多數個。 又，兩感測器9 a、9 b的任一方檢測出薄膜輥2 a、2 b的 殘留量事先設定較少’而發出薄膜更換的警報’則在黏貼 薄膜中對於玻璃基板1 1的黏貼終了後’兩薄膜輥2 a、2 b是 更換爲新者，而從第4圖的狀態再始動。 各壓接輥15A、15B是平輥，與背輥16A、16B的組合 ，在兩薄膜7 a、7 b作用均勻的加壓力，也可阻止各壓接輥 15A、15B的兩薄膜7a' 7b的蛇行。 從薄膜輥2a、2b在各壓接輥15A、15B能產生的兩薄 膜7a、7b的蛇行，是藉由設置朝薄膜7a、7b的寬度方向可 微調薄膜捲出軸la、lb或方向轉換輥20a、20b或吸附輥25 或薄膜張力調整輥2 7的位置的調整位置單元，可將對於玻 璃基板1〗的寬度方向的位置一致於所期望位置。 在第1圖的實施例中，兩基板間處理單元2 1 a、2 1 b的 •16- 1250937 (13) 設置間隔是作爲前後的切斷位置間隔L6，惟將與基板間處 理單元2 1 a、2 1 b同樣的單元設置於兩基板間處理單元2 1 a 、2 1 b的中間位置，而在兩基板間處理單元2 1 a、2 1 b的中 間位置剝取抗餓薄膜5 a、5 b。 又，在該中間位置將剝取抗蝕薄膜5 a、5 b的單元，稱 爲抗蝕薄膜中間剝離單元，而與在第1圖所示者同一物， 相當物賦於與第1圖同一記號。 又，每一枚的玻璃基板1 1地以壓接輥1 5 A、1 5 B黏貼 抗蝕薄膜5 a、5 b並加以分離時，則可得到表示於第7圖的 玻璃基板。 沿著表示於第7 (a)圖的III 一 III切斷線的橫斷面圖 是與第3 ( b )圖同樣者，惟沿著表示於第7 ( a )圖的IV — IV切斷線的縱斷面圖是成爲表示於第7 ( b )圖者。 表示於第7 ( a )圖的尺寸L7是藉由抗鈾薄膜中間剝離 單元在兩基板間處理單元2 1 a、2 1 b的中間位置剝取抗蝕薄 膜5a、5b的長度，將該中間剝離長度L7作成在第3 ( b)圖 所說明的各基板間處理單元2 1 a、2 1 b的一對圓盤刀具2 2 a 、22b的設定間隔 L4 ( = LI + L2 + L3 )。 又，如在第7 ( b )圖以兩點鏈線所示地與薄膜7a、7b 一起切斷玻璃基板1 1，則可得到表示於第3圖的玻璃基板 1 1 〇 該第7圖的實施例是除了對應於抗鈾薄膜5a、5b的寬 度方向採取多數個之外，也進行分別朝搬運方向分離（在 第7圖表示將抗蝕薄膜5b分離成5bR、5 bF的狀態）抗蝕薄 -17- (14) 1250937 膜5 a、5 b的搬運方向採取多數個，可田狀地分離玻璃基板 1 1者，成爲縱橫採取多數個（採取縱橫多面）。 表示於第8圖者，是未具有表示於第1圖的薄膜黏貼裝 置各基板間處理單元21a、21b，而將兩支薄膜捲出軸2a、 2 b設在比連結方向轉換輥1 9與方向轉變輥2 0 a、2 0 b的薄膜 7a、7b的搬運位置還上方。 又，在該實施例作爲方向轉換輥20a、20b，對於抗鈾 薄膜5 a、5 b使用具有非黏接性者。又，在第8圖中，也在 第1圖所示者同一物，相當於賦於與第1圖同一記號。 可將設置各壓接輥1 5 A、1 5 B的背輥1 6 A、1 6 B的空間 作成較寬層，作業人員是容易地進行保養檢修。 在分離單元31切斷薄膜7a、7b之後，可得到表示於第 9圖的玻璃基板1 1。未施以基板間處理之故，因而抗蝕薄 膜5a、5b是黏貼一直到玻璃基板1 1的寬度方向（玻璃基板 1 1的搬運方向）的端部，而在玻璃基板1 1並排地黏貼兩條 抗飩薄膜5 a、5 b，得到與第1圖的實施例同樣的效果。 在上述實施例1至3中，在玻璃基板1 1上面黏貼抗蝕薄 膜，惟成爲黏貼於下面也可以，或是成爲黏貼於上下兩面 也可以。 黏貼薄膜的基板是並不被限定於玻璃基板者’而是印 刷基板用的樹脂基板也可以’或是富於可撓性的較厚的片 也可以。 如上所述地，依照本發明，基材的切斷方向成爲壓接 輥間通過方向，亦即成爲搬運路的基材的搬運方向可採取 -18- (15) 1250937 多數個，而分割後的相鄰基材是利用一對壓接輥同時地實 施薄膜黏貼之故，因而可得到黏貼性能一致者。 又依照本發明’即使基材作成大型化也可使用配合於 分割後的基材寬度方向長度的薄膜之故，因而不必使用高 成本的薄膜，不會導致生產的高成本。 【圖式簡單說明】 第1圖是表示本發明的一實施例的薄膜黏貼裝置的槪 略圖。 第2(a)圖及第2(b)圖是表示用以說明以圖示於第 1圖的薄膜黏貼裝置將薄膜黏貼於玻璃基板的狀況的圖式 〇 第3 (a)圖及第3(b)圖是表示用以說明以圖示於第 1圖的薄膜黏貼裝置將薄膜黏貼於玻璃基板並予以分離的 狀況的圖式。 第4圖是表示用以說明以圖示於第1圖的薄膜黏貼裝置 將薄膜黏貼於玻璃基板的準備狀況的圖式。 第5圖是表示用以說明以圖示於第1圖的薄膜黏貼裝置 將薄膜黏貼於第一枚的玻璃基板的狀況的圖式。 第6圖是表示用以說明以圖示於第1圖的薄膜黏貼裝置 完成薄膜黏接於第二枚的玻璃基板的狀況的圖式。 第7 ( a )圖及第7 ( b )圖是表示用以說明利用成爲本 發明的其他實施例的薄膜黏貼裝置將薄膜黏貼於玻璃基板 的狀況的圖式。 -19- 1250937 (16) 第8圖是表示成爲本發明的另一實施例的薄膜黏貼裝 置的槪略圖。 第9 ( a )圖及第9 ( b )圖是用以表示利用圖示於第8 圖的薄膜黏貼裝置將薄膜黏貼於玻璃基板的狀況的圖式。 〔主要元件對照表〕 la、 lb 薄 膜 捲 出 軸 2a、 2b 薄 膜 早比 4a、 4b 芸 J3XL 層 薄 膜 5a > 5b 玻 璃 基 板 6a、 6b 底 層 薄 膜 7a、 7b 薄 膜 10 搬 運 輥 11 玻 璃 基 板 ( 基 材） 12 壓 輥 1 5 A 、15B 壓 接 击曰 早比 1 6 A 、16B 背 輥 2 1a 、21b 基 板 間 處 理 口口 早 元 22a 、 22b 圓盤刀具1250937 (1) Technical Field of the Invention The present invention relates to a method in which an adhesive film is adhered to a substrate by a pair of pressure-bonding rolls which are rotated in opposite directions to each other by a substrate such as glass. A film adhesive device for a film; in particular, a film adhesive device in which two separated films are adhered to a substrate so as to be side by side in a direction orthogonal to the direction of passage between the pressure rollers. [Prior Art] In the production of a liquid crystal display panel, a plasma display panel, or the like, there is a process of adhering a tacky resist film to a glass substrate of a substrate, and in the process, a resist film and a glass are used. The substrate is adhered to the film bonding apparatus on the substrate by a pair of pressure rollers that rotate in opposite directions to each other. The film sticking device is disposed in the conveyance path of the glass substrate, and the plurality of glass substrates are conveyed on the conveyance path at regular intervals, and the resist film is sent out from the film roll and passed through the pressure roller together with each of the glass substrates. The anti-uranium film is adhesive, and must be formed such that the photoresist film does not adhere to dust before use, or is easily sent out from the film roll, and the underlying film and the cover film are formed on the front and back surfaces of the resist film. In the layer configuration, a film formed by winding three layers is formed into a film roll. The film roll is installed in the film sticking device, and is sent out by the film roll in use, and then the cover film is peeled off to form a two-layer structure of the resist film and the base film. The film composed of the two layers is supplied for crimping. The thin film of the resist--5-(2) 1250937 was made between the rolls as the glass substrate side. When the pressure-sensitive adhesive film is to be adhered to the glass substrate by the pressure roller, in order to prevent the pressure-sensitive adhesive film from being contaminated by the resist film between the substrates, the film is transferred to the subsequent glass substrate, and the uranium-resistant film is equivalent to the substrate. A temporary film is formed, or the inter-substrate treatment for exposing the underlying film or the like is performed by removing the anti-uranium film corresponding to the substrate. Since each of the glass substrates between the pressure-bonding rolls is connected to the underlying film, the underlying film between the glass substrates is cut to obtain mutually separated glass substrates, and the glass substrates are transported to the next stage. In recent years, if the separated glass substrate is treated individually in a downstream process, the productivity is lowered, and the wire-cutting process is performed in a state where it is not separated. At this time, as a display panel, a glass substrate of a desired size is not used, but a large-sized glass substrate or an adhesive film which is twice or three times the size required for the display panel is used, and the glass substrate is cut after performing the desired treatment as much as possible. And as the display panel to make the required size. As a person who expresses such a technique, there is a Japanese Patent Publication No. 2 002-3 43 7 1 3 . In the above-mentioned prior art, when the pressure roller is pressed between the rolls, the resist film and the glass substrate are each one, and the cutting direction of the glass substrate is the direction of passage between the pressure rollers, that is, orthogonal to the conveyance path. In the direction of the conveyance direction of the glass substrate, a plurality of conveyance directions are limited to the width direction of the uranium-impermeable film (multiple faces are taken in the conveyance direction). The display panel is gradually becoming a large-sized direction. However, in the above-mentioned conventional technique -6-1250937 (3), in order to prevent the growth of the glass substrate which is easily broken, the film width is required to match the length of the display panel in the longitudinal direction. In order to increase the width of the film in conjunction with the enlargement of the panel, it is not a process of sharing materials, which leads to an increase in production costs. In view of the above, an object of the present invention is to provide a film in which the cutting direction of the substrate becomes a direction in which the pressure rollers pass, that is, a plurality of film stickers can be taken in the width direction of the substrate conveyance direction of the conveyance path. Device. Further, an object of the present invention is to provide a film sticking device which can take a large number of films even if a film having a large width in accordance with the enlargement of the display panel is not used. The film sticking device of the present invention for achieving the above object is a film sticking device which adheres a film between a pair of pressure rollers which are rotated in opposite directions by a bonding film and a substrate, and adheres the film to the substrate. It is characterized in that at least two film winding-out shafts are arranged side by side in a direction orthogonal to the conveying direction of the base material, and each film fed from the film roll mounted on each film winding-out axis passes through the substrate. Between the pair of pressure rollers, each film is simultaneously adhered to the substrate. Moreover, the film sticking apparatus of the present invention which achieves the above object is characterized in that the path of each film of the film winding-out shaft is from the film roll which is offset from the substrate conveyance direction to the path of each film between the pair of pressure-bonding rolls. The tension control mechanism is separately provided in the middle, and the tension of each film having a different film path length is adjusted to match the adhesion state to the substrate. -7- 1250937 (4) Further, as a feature of the film sticking device of the present invention which achieves the above object, a pair of crimping rolls are formed as flat rolls. As a back roll, a crown roll is used, and a pair of flat rolls are used to prevent the film from being snaked. At the same time, the uniformity of the pressure contact force of the flat rolls which are grown by the back rolls can be obtained. [Embodiment] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a schematic view showing a film sticking device of the present invention. La and lb are film take-up shafts on which the film rolls 2a and 2b are respectively mounted; and the servo motors 3a and 3b are individually driven and controlled independently. Each of the film rolls 2a and 2b is formed by laminating the front and back of the resist film with the cover film and the underlayer film, and the underlayer film is wound to the outside. Immediately after being sent out from the film rolls 2a and 2b, the cover film films 4a and 4b are peeled off to form a two-layer structure of the resist films 5a and 5b and the underlayer films 6a and 6b. The two-layered resist films 5a and 5b and the underlying films 6a and 6b are collectively referred to as films 7a and 7b. The peeled cover film films 4a, 4b are respectively recovered to the take-up rolls 8a, 8b. 9a and 9b are sensors for measuring the film diameter of each of the film rolls 2a and 2b in a non-contact manner. 10 is a plurality of conveyance rollers that convey the glass substrate 1 1 as a base material of the adhesive resist films 5a and 5b from the left side to the right side in the drawing. In each of the transport rollers 10, the press roller 12 is placed up and down at an appropriate interval, and the glass substrate 11 can be sandwiched. The conveyance roller 1 〇 and the pressure roller 1 2 are conveyance paths constituting the glass substrate 1 1 , and the road surface position is indicated by a broken line in Fig. 1 . 1 5 A, 1 5 B is a pair of crimping -8-(5) 1250937 car provided in the conveyance path of the glass substrate 1, and has a resin coating on the surface, and an electric heater is provided inside. Although not shown, the built-in temperature sensor ’ is such that the surface temperature of the resin coating becomes a desired temperature to control the electric power supplied to the electric heater. 1 6 A, 1 6 B are the back rolls of the respective crimping rolls 1 5 A, 1 5 B. As each of the pressure-bonding rolls 15A and 15B, a cylindrical flat roll is used as the outer shape, and the back rolls 16A and 16B are used as crown rolls which have an outer shape slightly bulging toward the center side of the axial length. With the two-stage configuration, each of the pressure-bonding rollers 15 5 A and 1 5 B is orthogonal to the axial direction of each of the pressure-bonding rollers 15 A and 15 B or the width direction of the conveyance direction of the glass substrate 12 The upper and lower surfaces of the glass substrate 11 are pressed. The plurality of glass substrates 12 are conveyed at an appropriate interval by an upstream device (not shown) on the left side of the drawing, and the conveyance path formed by the conveyance roller 10 and the pressure roller 12 is used. Therefore, the sensor 17 detects each of the glass. The substrate 12 is carried in. The glass substrate was inspected in accordance with the sensor 17, and the film was gradually adhered to the glass substrate described below. The films 7a, 7b which are fed out from the film rolls 2a, 2b and are peeled off the cover film films 4a, 4b are passed through the direction changing rolls 20a, 20b, and reach the substrate processing units 21a, 21b. The inter-substrate processing units 2 1 a, 2 1 b is a pair of disc cutters 22a, 22b and bonding means 23a, 23b and support tables 24a, 24b, respectively. The pair of disk cutters 22a, 22b and the bonding means 23a, 23b are located on the side of the tamper-evident films 5a, 5b, and the support tables 24a, 2413 are located on the side of the underlying films 6a, 6b. The pair of disc cutters 22a, 22b and the bonding means 23a, 23b move the film 7a, 7b toward the support tables 24a, 24b in a direction perpendicular to the drawing, that is, toward the width direction of each of the films 7a, 7b. Moving, in the thickness direction of each of the films 7a 1250937 (6) and 7b, the underlying films 6a and 6b are cut without being cut, and the resist films 5a and 5b are cut. With this cutting, the resist films 5a and 5b between the pair of disk cutters 22a and 22b are peeled off from the underlying films 6a and 6b by the bonding means 2 3 a and 2 3 b to expose the underlayer of the peeled portion. The film 6 a, 6 b (also shown as an example of the inter-substrate processing unit 2 1 a, 2 1 b is shown in Japanese Laid-Open Patent Publication No. 2002-104719). The film 7a, 7b passing through the inter-substrate processing units 21a, 21b is sequentially passed through the adsorption roller 25, the film tension detecting unit 26, the film tension adjusting roller 27, and the film overheat preventing roller 2, to reach a pair of crimping rollers 15 A. , 1 5 B. The adsorption roller 25, the film tension detecting unit 26, and the film tension adjusting roller 27 are provided on the respective films 7a and 7b, and the paper surface is convenient, and only one side of the film 7b is shown. The film overheat preventing roller 28 is wound around the two films 7a and 7b. The suction roller 25 is driven and controlled by the servo motor 30 via the clutch 29a. The suction roller 25 has a cylindrical shape. Although not shown, most of the openings are provided on all surfaces of the surface, and the internal space is connected via a solenoid valve. Vacuum source. The film tension detecting unit 6 is configured to support a roller that is in contact with the underlying film 6a, 6b via a pressure sensor, and the film pressing force detected from the pressure sensor is moved as shown in the drawing to the left and right direction of the film. Roller 2 7, so that the film tension is maintained as needed. The film overheat preventing roller 28 is such that the film 7 a, 7 b does not excessively contact the crimping roller 15 A of the built-in electric heater so that the anti-melting film 5 a, 5 b does not deteriorate, and the glass substrate 1 is blended as follows. The handling is carried out up and down, and the films 7a, 7b are appropriately pulled apart from the pressure roller 15 5 A. *10- (7) 1250937 The film take-up reels 1 a and 1 b are directions orthogonal to the conveyance direction of the glass substrate (substrate 1 1 ) which is a conveyance path formed by the conveyance roller 1 〇 and the press roll 1 2 Formed side by side. 2( a ) is a view showing a state in which the glass substrates are viewed from above, and are conveyed between the left and right sides of the drawing through the pressure rollers 1 5 A and 1 5 B and are conveyed in the state of the adhesive resist films 5 a and 5 b. . In the same manner as the film overheat preventing roller 28, the pressure rollers 1 5 A and 1 5 B are not provided separately, and are shared, and pass through the pressure roller 15 5 A, 15 together with the glass substrate 1 1 . The resist films 5a and 5b between the B layers are adhered to the glass substrate 11 by heat and pressure. As shown in the second (b) of the longitudinal cross-sectional view taken along line 1 - 1 of the second (a) diagram, a resist film is not adhered to the front and rear portions of each of the glass substrates 1 1 The total length L4 (= L1 + L2 + L3) between the lengths L 1 and L2 of 5 a and 5 b and the interval L3 between the front and rear glass substrates 1 1 as a pair of disc cutters 22a of the inter-substrate processing units 21a and 21b, 22b setting interval. In the field in which the hatching is applied to the second (a) diagram, the resist films 5a and 5b are adhered to the respective glass substrates 1 1 , but the inter-substrate processing unit 2 1 a is formed in each of the transport directions L5. 2 1 b can be stripped of anti-uranium film 5 a, 5 b. Returning to Fig. 1, reference numeral 31 is a separation unit for separating the underlying films 6a, 6b by the respective glass substrates 1 1 joined by the underlying films 6a, 6b for the adhesive resist films 5a, 5b. The disc cutter and the support table 33 are moved toward the width direction of the underlayer films 6a and 6b. In Fig. 2(a), the cutting position of the underlying film 6 a ' 6 b of the disk cutter 3 2 is indicated by a dotted line. Fig. 3 is a view showing the separation of the underlying films 6a and 6b by the disk cutter 32 after the glass substrate 丨丨 is adhered to the resist films 5a and 5b, -11 - 1250937 (8), and a separate and independent glass substrate is formed. The state of 1 1. Further, the third (b) is a cross-sectional view of the II-II cut line along the third (a) diagram. In addition, the two-dot chain line of FIG. 3 shows the position where the glass substrate 1 1 is cut by the cutting means not shown later, and the two display panels are shown after the cutting, and the base material (glass substrate 1 1) is shown. The cutting direction is the direction in which the pressure rollers 15A and 15B pass, that is, the width direction of the substrate (glass substrate 1 1 ) serving as the conveyance path is two. As shown in Fig. 2(a), the interval between the front and rear cutting positions of the underlying films 6a and 6b of the disk cutter 32 is set as L6, and the disk cutter 32 is provided and the underlying films 6a, 6b are cut. The position is taken as a reference, and the film from the reference position in the first drawing to the center position of each of the inter-substrate processing units 21a and 21b (the center position of each of the pair of disk cutters 22a and 22b) The length on the conveyance path of 7a and 7b is N (= an arbitrary integer) times the above-described cutting position interval L6. The N-fold integer 値 is different between the film 7a and the film 7b. Therefore, the central position of each of the inter-substrate processing units 2 1 a and 2 1 b (the center position of each of the pair of disk cutters 22a and 22b) is the lowest and the distance between the front and rear cutting positions is only deviated. L6 component. By the deviation, the inter-substrate processing units 2 1 a and 2 1 b are arranged side by side in the transport direction of the glass substrate 11 or the transport direction of the films 7a and 7b in the left-right direction of the first film, in order to widen the width of the films 7a and 7b. In the direction of the inter-substrate processing units 2 1 a, 2 ] b do not interfere with each other, not only can the maintenance of the inter-substrate processing units 2 1 a, 2 b can be easily performed, but the film rolls 2 a, 2 b also Fig. (9) 1250937 The ground can be offset from the ground and the film rolls 2a, 2b can be easily replaced. At this time, the interval between the film rolls 2a and 2b which are offset from the ground axis is preferably the same as the processing unit 2 1 a and 2 1 b between the substrates, and the L 6 component is preferably formed at the front and rear cutting position intervals. Thereby, the positions of the inter-substrate processing portions (resist removal portions) processed in the film 7a and the film 7b are aligned in the width direction of the film, and various operations or processes for the film 7a and the film 7b can be simultaneously performed. It has the advantage of increasing the processing speed. Hereinafter, the case where the films 7a and 7b are adhered to the glass substrate 11 will be described. First, in the state shown in Fig. 4, three layers of film are fed from the film rolls 2a and 2b, and the cover film films 4a and 4b are peeled off, and the ruthenium peeling cover film films 4a and 4b are collected by the take-up rolls 8a and 8b to form two layers. The film 7a, 7b passes through the inter-substrate processing unit 2 1 a, 2 1 b or the adsorption roller 25, the film tension detecting unit 26, the film tension adjusting roller 27, and the film overheat preventing roller 28 through the crimping rolls 15A, 15B. In the meantime, the film holding means (not shown) is drawn toward the right side of the fourth drawing to be parallel to the conveyance path, and a film path is formed. While the films 7a and 7b pass through the inter-substrate processing units 21a and 21b, the inter-substrate processing units 2 1 a and 2 1 b are interposed between the inter-substrate processing units 2 1 a and 2 1 b while the front and rear cutting position intervals L6 are interposed. b. The interval between the two inter-substrate processing units 2 1 a and 2 1 b is at least the front-back cutting position interval L6. Therefore, the resist film 5 a which is removed between the inter-substrate processing units 2 1 a is moved only before and after the cutting position interval L6 component Then, the resist film 5b removed by the inter-substrate processing unit 21a is placed side by side. The tension of the film 7a, 7b is adjusted by the film tension adjusting roller 27 so that the side-by-side position is not biased (10) 1250937. Further, in the removal process of the cap film 5a, 5b of the inter-substrate processing units 21a, 21b, the force is applied from the disc cutters 22a, 22b or the bonding means 23a, 23b without loosening the films 7a, 7b. The adsorption roller 25 individually adsorbs and holds the respective films 7a, 7b, and simultaneously applies tension to the respective films 7a, 7b by the servo motors 3a, 3b or the servo motor 3''. After the removal processing of the resist films 5a, 5b, the individual adsorption holding of the respective films 7a, 7b of the adsorption roller 25 is released and the clutch 29 is opened, so that the driving force of the servo motor 30 is not applied to the films 7a, 7b, and It will hinder the passage of the films 7a, 7b. Further, the film overheat preventing roller 28 is moved to the side of the conveying path so that the films 7a, 7b are not heated by the pressure rollers 15A, 15B more than necessary. When it is detected by the sensor 17 that the first glass substrate 11 is carried in, as shown in FIG. 5, the adhesion front ends of the resist films 5a and 5b and the front end of the film adhesion region of the glass substrate 1 are identical to each other. After the resist films 5a and 5b and the glass substrate 1 are respectively moved at the pressurizing positions of the pressure rollers 1 5 A and 1 5 B, the pressure rollers 15A and 15B are moved in the direction of the conveyance path via the back rollers 16A and 16B. The film overheat preventing roller 28 is moved from the conveyance path to the upper side, and increases the contact area of the resist films 5a, 5b with respect to the pressure rollers 15A, 15B, and is preheated by the pressure rollers 15A, 15B to make the resist The films 5a and 5b are suitable for bonding. The pressure rollers 15A, 15B are rotated in opposite directions to each other, and the films 7a, 7b are passed through the pressure roller 1 5 A, 1 5 B together with the glass substrate 1 1 , and the resist films 5 a, 5 b are pressed by The bonding rolls 1 5 A, 1 5 B are adhered to the glass substrate 11 by heat and pressure. -14- 1250937 (11) In the pasting, the film tension detecting unit 26 detects the tension of each of the films 7a and 7b, and controls the driving force of each of the servo motors 3a and 3b or the position adjustment of the film tension adjusting roller 27. The tension of each of the films 7a, 7b is made equal. When it is adhered to the first glass substrate 11 as shown in Fig. 6, the pressure roller 5 A, 5 B is opened together with the back rolls 16A, 16B, and the film overheat prevention roller 2 8 is moving to the side of the transport road. Further, the glass substrate 11 and the films 7a and 7b are moved by the length component of the processing length L 4 between the substrates, and are moved to the downstream (the right side of Fig. 6) side of the conveyance path, and the second glass substrate 11 is carried in. When the second glass substrate 11 is carried in, the operation described above is repeated, and as shown in FIG. 6, the third glass substrate 等待 is waited for, and the third glass substrate 1 1 and the pressure roller 1 are formed. 5 A, 1 5 B The state of the first picture that is pasted. Here, the support table 3 3 of the separation unit 31 is moved toward the side of the conveyance path until it comes into contact with the underlying films 6a, 6b. The disk cutter 32 also moves toward the side of the conveyance path, and is positioned to rotate in the width direction at the end portions in the width direction of the films 7a and 7b, and cuts the films 7a and 7b in the width direction. The glass substrates 1 1 connected by the underlying films 6a and 6b are cut in the width direction of the films 7a and 7b, and are formed in the separated state in the most downstream of the conveyance path, and are formed in the third figure. Then, the disc cutter 3 2 of the separation unit 3丨 and the support table 3 are pulled apart from the conveyance path, and the anti-fake films 5 a and 5 b are adhered to the third glass substrate, and the following operations are repeated. Until it is not necessary to carry in the required number of glass -15-1250937 (12) glass substrates 11, a plurality of separated glass substrates to which the resist films 5a and 5b are adhered can be obtained. When the position of the two-point chain line in the third (b) is cut, the cutting direction of the glass substrate 11 (base material) becomes the direction of passage between the pressure-contact rolls, that is, the glass substrate (base material) 11 of the conveyance path. Take two directions in the width direction of the conveying direction (two sides in the width direction). If the number of side-by-side sets of the film roll is increased, the number of the excess components is increased by a large number. Since the width of each film roll corresponds to the width of the final display panel, a plurality of film rolls ‘without the maximum width can be taken from a single glass substrate. Further, either of the two sensors 9a and 9b detects that the residual amount of the film rolls 2a and 2b is set to be 'previously and the film is replaced with an alarm', and the adhesion to the glass substrate 1 1 in the adhesive film is applied. After the end, the two film rolls 2a, 2b are replaced with new ones, and are restarted from the state of Fig. 4. Each of the pressure rollers 15A, 15B is a flat roller, and in combination with the back rollers 16A, 16B, a uniform pressing force is applied to the two films 7a, 7b, and the two films 7a' 7b of the respective pressure rollers 15A, 15B can also be prevented. Snake. The meandering of the two films 7a, 7b which can be produced from the film rolls 2a, 2b at the respective crimping rolls 15A, 15B is made by finely adjusting the film winding-out shafts la, lb or direction-changing rolls in the width direction of the films 7a, 7b. The adjustment position unit of the position of 20a, 20b or the adsorption roller 25 or the film tension adjusting roller 27 can match the position of the glass substrate 1 in the width direction to the desired position. In the embodiment of Fig. 1, the interval 161650937 (13) of the processing units 2 1 a, 2 1 b between the two substrates is set as the front and rear cutting position interval L6, but the inter-substrate processing unit 2 1 a, 2 1 b the same unit is disposed between the two substrates between the processing units 2 1 a , 2 1 b, and the anti-hungry film 5 a is stripped between the two substrates between the processing units 2 1 a, 2 1 b , 5 b. Further, the unit for peeling off the resist films 5a and 5b at the intermediate position is referred to as a resist film intermediate peeling unit, and the same thing as that shown in Fig. 1 is equivalent to the same as Fig. 1 mark. Further, when each of the glass substrates 11 is adhered to the resist films 5a and 5b by the pressure rollers 15A and 15B, and separated, the glass substrate shown in Fig. 7 can be obtained. The cross-sectional view along the line III-III shown in Figure 7(a) is the same as in Figure 3(b), but cut along the IV-IV shown in Figure 7(a). The longitudinal section of the line is shown as the 7th (b). The dimension L7 shown in Fig. 7(a) is obtained by stripping the lengths of the resist films 5a, 5b at the intermediate position between the inter-substrate processing units 2 1 a, 2 1 b by the anti-uranium film intermediate stripping unit. The peeling length L7 is set to a setting interval L4 (= LI + L2 + L3 ) of the pair of disc cutters 2 2 a and 22b between the inter-substrate processing units 2 1 a and 2 1 b described in the third (b). Further, as shown in Fig. 7(b), the glass substrate 1 is cut together with the films 7a and 7b as indicated by a two-dot chain line, and the glass substrate 1 1 shown in Fig. 3 is obtained. In the embodiment, in addition to a plurality of width directions corresponding to the uranium-resistant films 5a and 5b, the film is separated in the transport direction (the state in which the resist film 5b is separated into 5bR and 5bF in FIG. 7). Thin -17- (14) 1250937 The film 5 a and 5 b are transported in a plurality of directions, and the glass substrate 1 can be separated in a field shape, and a plurality of vertical and horizontal directions are adopted. In the eighth embodiment, the inter-substrate processing units 21a and 21b of the film bonding apparatus shown in Fig. 1 are not provided, and the two film winding-out shafts 2a and 2b are provided in the connection direction switching roller 19 and The conveyance positions of the film 7a, 7b of the direction changing rolls 2 0 a, 2 0 b are also above. Further, in this embodiment, as the direction changing rolls 20a and 20b, those having anti-urethane films 5a and 5b have non-adhesive properties. Further, in Fig. 8, the same thing as shown in Fig. 1 corresponds to the same symbol as that of Fig. 1. The space in which the back rolls 1 6 A, 16 B of the respective pressure rollers 1 5 A, 1 5 B are provided can be made wider, and the worker can easily perform maintenance inspection. After the separation unit 31 cuts the films 7a and 7b, the glass substrate 11 shown in Fig. 9 can be obtained. Since the inter-substrate processing is not performed, the resist films 5a and 5b are adhered to the end portion of the glass substrate 11 in the width direction (the conveyance direction of the glass substrate 11), and the glass substrate 1 1 is adhered side by side. The anti-caries films 5 a and 5 b have the same effects as those of the embodiment of Fig. 1 . In the above-mentioned first to third embodiments, the resist film is adhered to the upper surface of the glass substrate 1, but it may be adhered to the lower surface or may be adhered to the upper and lower surfaces. The substrate to which the film is adhered is not limited to the glass substrate, but may be a resin substrate for printing the substrate or a thick sheet which is flexible. As described above, according to the present invention, the cutting direction of the substrate becomes the direction of passage between the pressure rollers, that is, the conveyance direction of the substrate serving as the conveyance path can be -18-(15) 1250937, and the divided portions are obtained. Adjacent substrates are film-bonded simultaneously by a pair of pressure-bonding rolls, so that the adhesion performance is consistent. Further, according to the present invention, even if the substrate is made large in size, a film which is blended in the width direction of the divided substrate can be used. Therefore, it is not necessary to use a film having a high cost, and the production cost is not high. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a film sticking apparatus according to an embodiment of the present invention. Figs. 2(a) and 2(b) are diagrams showing the state of the film adhered to the glass substrate by the film bonding apparatus shown in Fig. 1, and Fig. 3(a) and 3 (b) is a view for explaining a state in which a film is adhered to a glass substrate by the film bonding apparatus shown in Fig. 1 and separated. Fig. 4 is a view for explaining a state of preparation in which a film is adhered to a glass substrate by the film bonding apparatus shown in Fig. 1 . Fig. 5 is a view for explaining a state in which a film is adhered to a first glass substrate by the film bonding apparatus shown in Fig. 1. Fig. 6 is a view for explaining a state in which the film is adhered to the second glass substrate by the film bonding apparatus shown in Fig. 1 . Figs. 7(a) and 7(b) are views for explaining a state in which a film is adhered to a glass substrate by a film bonding apparatus which is another embodiment of the present invention. -19- 1250937 (16) Fig. 8 is a schematic view showing a film sticking device which is another embodiment of the present invention. Fig. 9(a) and Fig. 9(b) are diagrams showing a state in which a film is adhered to a glass substrate by the film bonding apparatus shown in Fig. 8. [Main component comparison table] la, lb film winding shaft 2a, 2b film early ratio 4a, 4b 芸 J3XL layer film 5a > 5b glass substrate 6a, 6b underlying film 7a, 7b film 10 carrying roller 11 glass substrate (substrate 12 Press roller 1 5 A , 15B crimping shot earlier than 1 6 A, 16B back roller 2 1a , 21b inter-substrate processing port early 22a, 22b disc cutter