TWI248872B - Highly antistatic laminate - Google Patents

Highly antistatic laminate Download PDF

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Publication number
TWI248872B
TWI248872B TW088110275A TW88110275A TWI248872B TW I248872 B TWI248872 B TW I248872B TW 088110275 A TW088110275 A TW 088110275A TW 88110275 A TW88110275 A TW 88110275A TW I248872 B TWI248872 B TW I248872B
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Taiwan
Prior art keywords
conductive layer
acid
substrate
antistatic laminate
high antistatic
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TW088110275A
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Chinese (zh)
Inventor
Shigeji Konagaya
Kazuhiro Abe
Mitsuhiro Harada
Hironobu Kitagawa
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Toyo Boseki
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Publication of TWI248872B publication Critical patent/TWI248872B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/128Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05FSTATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
    • H05F1/00Preventing the formation of electrostatic charges
    • H05F1/02Preventing the formation of electrostatic charges by surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21Anti-static

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laminated Bodies (AREA)
  • Elimination Of Static Electricity (AREA)

Abstract

A highly antistatic laminate containing a substrate and a conductive layer laminated on at least one side of the substrate, the conductive layer containing a conductive polymer and being cured, wherein a surface resistance (RS0) at 25 DEG C, relative humidity 15% of the conductive layer is not more than 10<11> Omega/□, a ratio (RS1/RS0) of surface resistance (RS1) at 25 DEG C, relative humidity 15% of the conductive layer after immersing the highly antistatic laminate in pure water at 40 DEG C for one hour, to RS0 is not more than 10, and a ratio (RS2/RS0) of surface resistance (RS2) at 25 DEG C, relative humidity 15% of the conductive layer after 150% stretching the highly antistatic laminate, to RS0 is preferably not more than 10. The highly antistatic laminate of the present invention provides a highly antistatic laminate having superior transparency, resistance to blocking and antistatic property under low humidity, after immersion in water and after forming, which certainly prevents occurrence of static electricity under any environment.

Description

12488721248872

五、發明說明(1) [發明之技術領域] 本發明係有關一種高抗靜電性疊層片其具有優良的低 濕度下抗靜電性質’防水性及防濕水性,且苴且有透明性 及防封阻性。更特定言之,本發明係有關具有^電性之高 抗靜電性昼層片,其可用於在電子材料例如IC、LSR、石夕 晶圓、硬碟、液晶基板’電子零件等的儲存,輸送盥安裝 期間’給予保護以免因靜電等引起破壞和灰塵黏著^^ 疊層片特別適用於載體膠帶,覆蓋膠帶,容器(如,托 盤)’清潔室用之分隔板等’且亦適用於QJJP,χ —射線照片 底片銀鹽塗覆照片底片/印刷紙,合成紙等的基板: [發明背景] ^ 於最近數年内,微小化電子零件,例如晶片型電子零 件,特別是1C、電晶艎、二極體、晶體振盪器等,已有逐 增地需求。彼等係封裝在用塑膠模子製成的載體膠帶之口 袋(凹洞)内,並用覆蓋膜密封而成為可供給或輸送之包裝 件。於使用時,將覆蓋膜剝離取出内容物供之後安裝在基 板等之上。 / 於該包裝件的供應與輸送中,易於載體膠帶上發生靜 電,導致帶電,且在將覆蓋膜剝離中易於在載體膠帶中發 生帶電化。載體膠帶的帶電化會使電子零件難以穩固地安 裝且會造成諸種問題例如靜電破壞等。 為了解決這些問題,乃經由捏合或塗覆碳黑和界面活 性劑,使用作為載體膠帶起始材料的熱塑性樹脂片材例如 聚苯乙烯、聚丙烯、聚氣乙烯、聚對苯二甲酸乙二醇酯和V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) [Technical Field of the Invention] The present invention relates to a highly antistatic laminate sheet which has excellent antistatic properties under water and water resistance, water repellency and moisture resistance, and has transparency and Anti-blocking. More specifically, the present invention relates to a highly antistatic enamel layer having electrical properties, which can be used for storage of electronic materials such as IC, LSR, Shihwa wafer, hard disk, liquid crystal substrate, electronic parts, and the like. During the installation of the conveyor, it is 'protected against damage caused by static electricity and dust. ^1 The laminate is particularly suitable for carrier tape, cover tape, container (eg tray), 'separator for cleaning room, etc.' and is also suitable for QJJP, χ-ray photo film, silver salt coated photo film, printing paper, synthetic paper, etc. [Background of the Invention] ^ In recent years, miniaturized electronic parts, such as wafer-type electronic parts, especially 1C, electro-crystal Helium, diodes, crystal oscillators, etc., have been increasing in demand. They are enclosed in a pouch (recess) of a carrier tape made of a plastic mold and sealed with a cover film to be a package that can be supplied or transported. At the time of use, the cover film is peeled off to take out the contents for later mounting on a substrate or the like. / In the supply and conveyance of the package, it is easy to generate static electricity on the carrier tape, resulting in electrification, and it is easy to electrify in the carrier tape in peeling off the cover film. The electrification of the carrier tape makes it difficult to securely mount the electronic component and causes various problems such as electrostatic breakdown. In order to solve these problems, a thermoplastic resin sheet such as polystyrene, polypropylene, polyethylene oxide, or polyethylene terephthalate is used as a carrier tape starting material by kneading or coating carbon black and a surfactant. Ester and

1248872 五、發明說明(2) 聚丙烯腈,賦與導電性或抗靜電性質。 不過’為了要得到來自含有捏合在其内的碳黑之熱塑 性樹脂片材的具有充足導電性之載體膠帶,碳黑必須以約 10至3 0重量%的比例加入其中。其結果會使模製成的載體 膠帶可能具有較低的抗張強度、斷裂強度、伸長率等。此 外,該膠帶具有不良的透明性,使得封裝在載體膠帶凹洞 内的;t子零件之確定有困難,由是使得用光學感測器進 的定位成為不可行。 為了解決上文所提諸項問題’乃應用含有分散在黏人 劑等之内的碳黑之塗料薄施於塑膠片材的表面形成導電^ 以確使其具有透明性。這種處理會導致稍經改良但仍 不足的透光性,而使封裝在載體膠帶凹洞内的電子零件之 確定仍然困難。再者與另一不同問題相關聯者在於在 深拉程序等形成凹洞之_,碳$、不會依循該#材㈣ 脹’因而難以達到合意的導電性。 此外,使周界面活性劑的片材所得到之載體膠帶具 優良的透明性’但具有與濕度大為相關的低導電性,因 損及穩定的抗靜電性質。 阳 電子材料所用抗靜電容,器 内正逐增著。當上文所提含有 用水清洗以供重複使用之時, 礙其回收使用。 的回收使用趨勢在最近數年 界面活性劑巧抗靜電容器在 界面活性劑會被洗提出而阻 而在用碎施加在教塑性谢 你…、2庇樹月曰片材,例如聚酯片材,的 表面上以防止封阻之時,欲Jo ^ 7可犯彳貝及可印刷性及熱封性。 1248872 五、發明說明(3) 本發明解決先前技藝技術之缺陷’且提出一種高抗靜 電性疊層片其在浸水後和成型後’具有優良的透明性,抗 封阻性及低濕度下的抗靜電性,且其必然可防止在任何環 境中的靜電發生。 [發明概述] 彼等目的可經由下面所宣布的本發明而達到。 據此,本發明提出下列諸項。 (1) 一種高抗靜電性疊層片’包括一基材與一經疊層 在該基材的至少一側面上之導電層,該導電層包括一導電 性聚合物且係經硬化者。 (2) 上面(1)項之高抗靜電性疊層片,其中該導電層更 包括一熱塑性聚合物。 (3) 上面(1)或(2)項之高抗靜電性疊層片,其中該導 電層係經用交聯劑以交聯反應予以硬化的。 (4) 上面(1)項之高抗靜電性疊層片,其中該導電性聚 合物係可溶於水或有機溶劑中之導電性聚合物。 (5) 上面(1)項之高抗靜電性疊層片,其中該導電性聚 合物係聚苯胺或其衍生物。 (6) 上面(1)項之高抗靜電性疊層片,其中該導電性聚 合物係含績酸基聚苯胺或其衍生物。 (7) 上面(1)項之高抗靜電性疊層片,其中該導電性聚 合物包括經烧氧基取代之胺苯磺酸作為可聚合成分。 (8) 上面(1)項之高抗靜電性疊層片,其中該導電性聚 合物包括胺基甲氧苯磺酸作為可聚合成分。1248872 V. INSTRUCTIONS (2) Polyacrylonitrile, imparting electrical or antistatic properties. However, in order to obtain a carrier tape having sufficient conductivity from a thermoplastic resin sheet containing carbon black kneaded therein, carbon black must be added thereto in a proportion of about 10 to 30% by weight. As a result, the molded carrier tape may have lower tensile strength, breaking strength, elongation, and the like. In addition, the tape has poor transparency, so that it is difficult to determine the sub-parts that are packaged in the recess of the carrier tape, so that positioning with the optical sensor is not feasible. In order to solve the above problems, a coating containing carbon black dispersed in an adhesive or the like is applied to the surface of the plastic sheet to form a conductive material to ensure transparency. This treatment results in a slightly improved but still insufficient light transmission, and the determination of the electronic components packaged in the recesses of the carrier tape is still difficult. Further, in connection with another different problem, the hole is formed in a deep drawing process or the like, and the carbon $ does not follow the #4 (4) expansion so that it is difficult to achieve a desired conductivity. Further, the carrier tape obtained by using the sheet of the surfactant is excellent in transparency, but has low electrical conductivity which is largely related to humidity, and is resistant to stable antistatic properties. The antistatic capacitance used in the electronic materials is increasing. When the above contains water for cleaning for reuse, it may be recycled. The trend of recycling use in recent years, surfactants in antistatic containers will be washed up in the surfactants and blocked in the use of crushing in the teaching plastic thank you..., 2 peony sapphire sheets, such as polyester sheets On the surface of the surface to prevent blockage, Jo ^ 7 can be used to make mussels and printability and heat sealability. 1248872 V. DESCRIPTION OF THE INVENTION (3) The present invention solves the defects of the prior art technology and proposes a high antistatic laminate sheet which has excellent transparency, sealing resistance and low humidity after water immersion and after molding. Antistatic properties, and it necessarily prevents static electricity from occurring in any environment. [Summary of the Invention] Their objects can be attained by the invention as hereinafter disclosed. Accordingly, the present invention proposes the following items. (1) A highly antistatic laminate sheet 'includes a substrate and a conductive layer laminated on at least one side of the substrate, the conductive layer comprising a conductive polymer and being cured. (2) The high antistatic laminate of the above item (1), wherein the conductive layer further comprises a thermoplastic polymer. (3) The high antistatic laminate of the above item (1) or (2), wherein the conductive layer is hardened by a crosslinking reaction with a crosslinking agent. (4) The highly antistatic laminate of the above item (1), wherein the conductive polymer is a conductive polymer soluble in water or an organic solvent. (5) The high antistatic laminate of the above item (1), wherein the conductive polymer is polyaniline or a derivative thereof. (6) The highly antistatic laminate of the above item (1), wherein the conductive polymer is a polyaniline or a derivative thereof. (7) The highly antistatic laminate of the above item (1), wherein the conductive polymer comprises an alkoxy-substituted aminene sulfonic acid as a polymerizable component. (8) The highly antistatic laminate of the above item (1), wherein the conductive polymer comprises amino methoxybenzenesulfonic acid as a polymerizable component.

C:\Program Files\Patent\310689.ptd 第9頁 1248872 五、發明說明(4) (9) 上面(2)項之兩抗靜電性疊層片,其中該熱塑性聚 合物為一具有親水基之聚酯。 (10) 上面(2)項之南抗靜電性昼層片,其中該熱塑性 聚合物為’經用具有親水基的一叛酸以全部二叛酸成分的 0 · 5至1 5莫耳%之比例,及/或具有親水基的二醇以全部二 醇成分的0 · 5至1 5莫耳%之比例共聚合而得到之共聚合聚 (11) 上面(2)項之高抗靜電性疊層片,其中該熱塑性 聚合物為經由用具有親水基的乙烯基單體接枝聚合到聚醋 而得到之接枝聚酯。 (12) 上面(3)項之南抗靜電性養層片,其中該交聯劑 為至少一種選自下列所組合中之成員:多官能性環氧化合 物,多官能性異氰酸酯化合物,多官能性噚唑啉化合物, 多官能性乙嫦基化合物,多官能性丙稀酸化合物,多官能 性羧酸化合物,多官能性胺化合物,多官能性經基化合 物,與多官能性氫硫基化合物。 (13) 上面(1)或(2)項之南抗靜電性整層片,其中該導 電層經由導電性聚合物及/或熱塑性聚合物之自交聯而硬 化的。 (14) 上面(1)項之高抗靜電性養層片,其中該導電層 更包括一界面活性劑。 (15) 上面(1)項之高抗靜電性疊層片,其中該基材為 用有機樹脂製成的膜或片’且該高抗靜電性番層片具有不 大於5. 0之濁度。C:\Program Files\Patent\310689.ptd Page 9 1248872 V. Inventive Note (4) (9) The two antistatic laminates of the above item (2), wherein the thermoplastic polymer has a hydrophilic group Polyester. (10) The south antistatic enamel layer of the above item (2), wherein the thermoplastic polymer is '0 to 5 to 15 mol% of a total of two repulsive components by using a resveric acid having a hydrophilic group a ratio of, and/or a diol having a hydrophilic group copolymerized in a ratio of from 0.5 to 15 mol% of the total diol component to obtain a copolymerized poly(11) high antistatic stack of the above item (2) A ply sheet wherein the thermoplastic polymer is a graft polyester obtained by graft polymerization of a vinyl monomer having a hydrophilic group to a polyester. (12) The south antistatic layer according to item (3) above, wherein the crosslinking agent is at least one member selected from the group consisting of polyfunctional epoxy compounds, polyfunctional isocyanate compounds, and polyfunctionality. An oxazoline compound, a polyfunctional acetamidine compound, a polyfunctional acrylic acid compound, a polyfunctional carboxylic acid compound, a polyfunctional amine compound, a polyfunctional thiol compound, and a polyfunctional thiol compound. (13) The south antistatic delamination sheet of the above item (1) or (2), wherein the conductive layer is hardened by self-crosslinking of the conductive polymer and/or the thermoplastic polymer. (14) The high antistatic layer of the above item (1), wherein the conductive layer further comprises a surfactant. The turbidity of the high-antistatic slab having a turbidity of not more than 5.00. .

C:\ProgramFiles\Patent\310689.ptd 第 10 頁 1248872C:\ProgramFiles\Patent\310689.ptd Page 10 1248872

五、發明說明(5) 其中該基材為 :聚酯,聚碳酸 (16)上面(1)項之兩抗靜電性疊層片 用選自下列所組成之材料所製成的膜或片 酯,聚烯烴和聚胺甲酸酯。 、/ (17) 一種南抗靜電性疊層片, 在該基材的至少一側面上之導電層 包括一基材與一經疊層 該導電層具有在25°C,相對濕度15%下不大於1〇11 Q/ □之表面電阻(RSG),及在將該高抗靜電性疊層片浸於4〇 °C純水中一小時後在25。(:,相對濕度15%下之表面電阻 (R S!)對R S〇之比例(R S! / R SQ )不大於1 〇。 (18)上面(17)項之兩抗靜電性疊層片,其中該導電層 更具有在將該高抗靜電性疊層片拉伸15〇%後在25艽,相對 濕度15%下之表面電阻(RS2)對RSg之比例(RS2/RSq)不大於 10 ° (19) 上面(17)或(18)項之高抗靜電性疊層片,其中該 導電層包括一導電性聚合物且係經硬化者。 (20) —種電子零件用之容器,其係經由將上面(1), (17)或(18)項所述高抗靜電性疊層片予以成型而得者。 (21) 上面(20)項之容器,其為一托盤。 (22) —種電子零件用之載體膠帶,其係經由將上面 (1) ’(17)或(18)項所述高抗靜電性疊層片予以成型而得 者0 (23) —種電子零件用之托盤,其係經由將包括一基材 與一經疊層在該基材的至少一側面上之導電層的高抗靜電 性疊層片予以成型而得者,該托盤包括一凹洞與一位於其5. Description of the invention (5) wherein the substrate is: polyester, polycarbonate (16), the two antistatic laminate sheets of the above item (1) are coated with a film or a tablet ester selected from the following materials; , polyolefins and polyurethanes. And (17) a south antistatic laminate, the conductive layer on at least one side of the substrate comprising a substrate and a laminated conductive layer having a thickness of not more than 25 ° C and a relative humidity of 15% Surface resistance (RSG) of 1〇11 Q/□, and 25 immersed in the high antistatic laminate sheet in 1 〇 ° C pure water for one hour. (: The ratio of surface resistance (RS!) to RS〇 at a relative humidity of 15% (RS! / R SQ ) is not more than 1 〇. (18) Two antistatic laminates of (17) above, The conductive layer further has a surface resistance (RS2) to RSg ratio (RS2/RSq) of not more than 10 ° at 25 艽 and a relative humidity of 15% after stretching the high antistatic laminate sheet by 15%. 19) The high antistatic laminate of the above item (17) or (18), wherein the conductive layer comprises a conductive polymer and is cured. (20) A container for electronic parts, which is via The high antistatic laminate according to the above item (1), (17) or (18) is molded. (21) The container of the above item (20) is a tray. (22) A carrier tape for an electronic component, which is obtained by molding the high antistatic laminated sheet described in the above item (1) (17) or (18), and is a tray for an electronic component. It is obtained by molding a high antistatic laminate comprising a substrate and a conductive layer laminated on at least one side of the substrate, the tray comprising a recess and a

C:\ProgramFiles\Patent\310689.ptd 第 11 頁 1248872 五、發明說明(6) 外周緣上之突緣。 其中該突緣之導電層具有在25 °C,相對濕度15%下不 大於ΙΟ11 Ω/ □之表面電阻(RS3),在將該托盤浸於40 °C純 水中一小時後,該突緣之導電層在25 °C,相對濕度15%下 之表面電阻(RS4)對RS3之比例(RS4/RS3)不大於1〇 ,及具有 相當於該突緣所具厚度的0.5至0,7倍厚度之該凹洞的導電 層在25°C,相對濕度15%下之表面電阻(RS5)對RS3之比例 (RS5/RS3)不大於100。 (24) 上面(23)項之電子零件用之托盤,其係經由將上 面(1),(17)或(18)項所述高抗靜電性疊層片予以成型而 得者。 (25) —種電子零件用之載體膠帶,其係經由將包括一 基材與一經疊層在該基材的至少一侧面上之導電層的高抗 靜電性疊層片予以成型而得者,該載體膠帶包括眾多凹洞 以封裝沿者縱向配置的眾多電子零件,與一位於其外周緣 上之突緣, 其中該突緣之導電層具有在25 °C,相對濕度15%下不 大於10ηΩ/□之表面電阻(RSe),在將該載體膠帶浸於 °C純水中一小時後’該突緣之導電層在251,相對濕度 15%下之表面電阻(RS?)對RSe之比例(Rs7/RS6)不大於1〇,具 有相當於該突緣所具厚度的〇·5至〇·7倍厚度之該凹洞的導 電層在25 C,相對濕度1 5%下之表面電阻(R、)對之比例 (RS8/RS6)不大於100。 (26) 上面(25)項之電子零件用之載體膠帶,其係經由C:\ProgramFiles\Patent\310689.ptd Page 11 1248872 V. INSTRUCTIONS (6) The flange on the outer circumference. The conductive layer of the flange has a surface resistance (RS3) of not more than ΙΟ11 Ω/□ at 25 ° C and a relative humidity of 15%, and the flange is immersed in pure water at 40 ° C for one hour. The conductive layer has a surface resistance (RS4) to RS3 ratio (RS4/RS3) of not more than 1 25 at 25 ° C and a relative humidity of 15%, and has a thickness equivalent to 0.5 to 0, 7 times the thickness of the flange. The conductive layer of the recess has a surface resistance (RS5) to RS3 ratio (RS5/RS3) of not more than 100 at 25 ° C and a relative humidity of 15%. (24) The tray for electronic parts of the above item (23), which is obtained by molding the high antistatic laminate according to the above item (1), (17) or (18). (25) A carrier tape for an electronic component obtained by molding a high antistatic laminated sheet comprising a substrate and a conductive layer laminated on at least one side of the substrate. The carrier tape includes a plurality of recesses for encapsulating a plurality of electronic components disposed along a longitudinal direction thereof, and a flange on an outer periphery thereof, wherein the conductive layer of the flange has a thickness of not more than 10 ηΩ at 25 ° C and a relative humidity of 15% Surface resistance (RSe) of /□, after immersing the carrier tape in °C pure water for one hour, the ratio of surface resistance (RS?) to RSe of the conductive layer of the flange at 251 and relative humidity of 15% (Rs7/RS6) is not more than 1 〇, and has a surface resistivity of a conductive layer of the pit corresponding to the thickness of the flange of 〇·5 to 〇·7 times at 25 C, relative humidity of 15% ( The ratio of R,) to (RS8/RS6) is not more than 100. (26) Carrier tape for electronic parts of (25) above, via

1248872 五、發明說明(7) 將上面(1),(17)或(18)項所述高抗靜電性疊層片予以成 型而得者。 (2 7) —種防護性包裝材料,包括一容器及一對拉伸膜 以承載要包裝在彼等之中間的物件,該拉伸膜具有一對經 固定在該容器内的相反末端,其中該拉伸膜為選自上面 (1),(17)和(18)項所述高抗靜電性疊層片所組合中之成 (28) —種1C卡其係經由使用上面(1),(17)或(18)項 所述高抗靜電性疊層片作為該卡的基材而得者。 [圖式之簡單說明] 第1圖顯示出本發明保護性包裝材料一實施例,其中1 為容器,2為高抗靜電性疊層片,3為要包裝的物件,4為 蓋子而5為框。 [發明之詳細說明] 本發明要在下面予以更詳細地解說。 本發明高抗靜電性疊層片包括一基材及疊層在該基材 的至少一側面上之導電層。 在本發明對於基材類別沒有特別限制之下,無機基材 及/或有機基材都可以使用。無機基材的例子包含用金屬 材料例如鋼、銘、不銹鋼等製成的基材;用二氧化矽、 銘、欽等的烧醇化物水解所得無機聚合物材料製成的基材 等。有機基材的例子包含用單種或多種熱塑性樹脂材料例 如聚酯,耐綸(如,6-耐綸,6, 6-耐綸等),聚烤(如,聚 丙烯,聚乙烯,聚甲基戊烯等),聚苯乙烯,聚氯乙烯,1248872 V. INSTRUCTION DESCRIPTION (7) The high antistatic laminated sheet described in the above item (1), (17) or (18) is molded. (2) a protective packaging material comprising a container and a pair of stretched films for carrying articles to be packaged in the middle thereof, the stretched film having a pair of opposite ends fixed in the container, wherein The stretched film is selected from the group consisting of the high antistatic laminates described in the above (1), (17) and (18) (28) - 1C khaki via the use of the above (1), The high antistatic laminate according to item 17) or (18) is obtained as a substrate of the card. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows an embodiment of the protective packaging material of the present invention, wherein 1 is a container, 2 is a high antistatic laminate, 3 is an article to be packaged, 4 is a cover, and 5 is frame. [Detailed Description of the Invention] The present invention will be explained in more detail below. The highly antistatic laminate of the present invention comprises a substrate and a conductive layer laminated on at least one side of the substrate. In the present invention, there is no particular limitation on the type of substrate, and an inorganic substrate and/or an organic substrate can be used. Examples of the inorganic substrate include a substrate made of a metal material such as steel, ingot, stainless steel, or the like; a substrate made of an inorganic polymer material obtained by hydrolyzing an alcoholate such as cerium oxide, methane, or the like. Examples of the organic substrate include a single or a plurality of thermoplastic resin materials such as polyester, nylon (e.g., 6-nylon, 6, 6-nylon, etc.), poly-baked (e.g., polypropylene, polyethylene, poly-methyl) Pentene, etc., polystyrene, polyvinyl chloride,

1248872 五、發明說明(8) 聚胺甲酸酯,聚碳酸酯等製成的單層或多層基材,及用熱 固性樹脂材料等製成的基材。於上文提及的熱塑性樹脂材 料中,可較佳地使用聚酯,聚碳酸酯,聚烯和聚胺甲酸 脂,也可以使用由上文所提無機材料與上文所提有機材料 的混成材料所製成的基材。 上文所提基材較佳者具有平面形式例如膜材,片材 等。例如,可用聚酯膜材或片材,鋼板,铭板,不銹鋼板 等01248872 V. INSTRUCTION DESCRIPTION (8) A single-layer or multi-layer substrate made of polyurethane, polycarbonate, or the like, and a substrate made of a thermosetting resin material or the like. Among the thermoplastic resin materials mentioned above, polyesters, polycarbonates, polyolefins, and polyurethanes may preferably be used, and the inorganic materials mentioned above may be mixed with the organic materials mentioned above. A substrate made of materials. The substrate as described above preferably has a planar form such as a film, a sheet or the like. For example, polyester film or sheet, steel plate, name plate, stainless steel plate, etc. can be used.

雖然下面的解說係焦注於以聚酯片材或膜材作為基 材,不過本發明高抗靜電性疊層片所含基材不限於聚酯片 材或膜材。“聚酯” 一詞於此意指主要由脂族及/或芳族 二羧酸成分與脂族及/或芳族二醇成分所得之聚合物。其 例子包含同元聚合物例如聚對苯二曱酸乙二醇酯(PET), 聚萘二甲酸乙二醇酯(PEN),經由用一或多種二羧酸成分 例如鄰苯二甲酸,間苯二甲酸,己二酸,二苯基羧酸,二 苯基醚羧酸,癸二酸,萘二羧酸等部份地或完全地取代 PET所含對苯二甲酸成分所得者,經由用一或多種二羧酸 成分例如對苯二甲酸,鄰苯二甲酸,間苯二甲酸,己二 酸,二苯基羧酸,二苯基醚羧酸,癸二酸等部份地或全部 地取代PEN所含萘二羧酸所得者,及經由用一或多種乙二 醇成分例如二甘醇’ 一縮二乙二醇,六亞甲二醇,丙二 醇’環己烷二醇,新戊二醇,丁二醇,伸丙二醇等部份地 或全部地取代PET及/或PEN所含乙二醇成分所得者。 這種聚酯片材或膜材可以含有無機或有機潤滑劑例如Although the following explanation is focused on a polyester sheet or a film as a substrate, the substrate contained in the highly antistatic laminate of the present invention is not limited to a polyester sheet or a film. The term "polyester" as used herein refers to a polymer derived primarily from aliphatic and/or aromatic dicarboxylic acid components and aliphatic and/or aromatic diol components. Examples thereof include a homopolymer such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), via one or more dicarboxylic acid components such as phthalic acid, The use of phthalic acid, adipic acid, diphenyl carboxylic acid, diphenyl ether carboxylic acid, sebacic acid, naphthalene dicarboxylic acid, etc. to partially or completely replace the terephthalic acid component contained in PET, One or more dicarboxylic acid components such as terephthalic acid, phthalic acid, isophthalic acid, adipic acid, diphenylcarboxylic acid, diphenyl ether carboxylic acid, sebacic acid, etc. partially or wholly Replacing the yield of naphthalene dicarboxylic acid contained in PEN, and by using one or more ethylene glycol components such as diethylene glycol 'diethylene glycol, hexamethylene glycol, propylene glycol 'cyclohexanediol, neopentyl The alcohol, butylene glycol, and propylene glycol are partially or wholly substituted for the ethylene glycol component of PET and/or PEN. Such a polyester sheet or film may contain an inorganic or organic lubricant such as

C:\Program Files\Patent\310689.ptd 第 14 頁 1248872 五、發明說明(9) 二氧化矽,滑石,碳酸鈣,氧化鋁,鋁氧矽石,氧化鈦, r ’弗石’聚笨乙烯粒子等。從透明性的方面來看,潤滑劑的 含量較佳者為小,其中該用量係決定於潤滑劑所具粒徑。 一般而言,潤滑劑較佳者具有不大於5微米,更佳者不大 於2微米之平均粒徑,且其添加量較佳者為不大於 SOOOppm ’更佳者不大於3000ρριη之比例。再者,也可以加 入添加劑,UV吸收劑,安定劑或顏料,只要不影響到聚合 物的固有性質即可。C:\Program Files\Patent\310689.ptd Page 14 1248872 V. INSTRUCTIONS (9) Cerium Oxide, Talc, Calcium Carbonate, Alumina, Axorite, Titanium Oxide, r 'Fostone' Polystyrene Particles, etc. From the viewpoint of transparency, the content of the lubricant is preferably small, and the amount is determined by the particle size of the lubricant. In general, the lubricant preferably has an average particle diameter of not more than 5 μm, more preferably not more than 2 μm, and is preferably added in an amount of not more than SOOOppm 'better than not more than 3000 ρηη. Further, an additive, a UV absorber, a stabilizer or a pigment may be added as long as it does not affect the intrinsic properties of the polymer.

於本發明中,係將一導電層疊層在上文所提基材的至 少一侧面之上,其中該導電層含有一導電性聚合物且係經 硬化者。藉由要加入的導電性聚合物之功能,可以賦與導 電性且可以改良抗靜電性質,特別是在低濕度之下者。 本發明中的導電性聚合物並沒有特別限制,只要使用 具有7Γ -電子共輛構造的導電性聚合物即可,例如聚苯 胺,聚吡咯,聚噻吩及其衍生物,較佳者為能夠溶解或分 散在水中或有機溶劑内,特別者為水中之導電性聚合物, 以及藉助摻雜劑經溶解或分散在水或有機,溶劑之内的骞雷 性聚合物。In the present invention, a conductive laminate is formed on at least one side of the substrate as described above, wherein the conductive layer contains a conductive polymer and is cured. By the function of the conductive polymer to be added, conductivity can be imparted and antistatic properties can be improved, especially under low humidity. The conductive polymer in the present invention is not particularly limited as long as it is a conductive polymer having a 7 Γ-electron conjugate structure, such as polyaniline, polypyrrole, polythiophene and derivatives thereof, preferably soluble. Or dispersed in water or an organic solvent, especially a conductive polymer in water, and a rubbed polymer dissolved or dispersed in water or an organic solvent by means of a dopant.

彼等導電性聚合物的例子包含藉助摻雜劑例如無機酸 (如鹽酸,過氣酸,硫酸等),含磺酸基化合物(如,苯續 酸,萘磺酸,聚苯乙烯磺酸等)而經溶解或經分散之聚苯 胺和其共聚物;磺酸化聚苯胺其中聚苯胺所含部份或全部 苯環的一或多個氫原子係經磺酸基所取代者,經長鍵院I 鍵結的聚吡咯或聚噻吩;及彼等之衍生物。於本發明中tExamples of such conductive polymers include dopants such as inorganic acids (e.g., hydrochloric acid, peroxyacid, sulfuric acid, etc.), sulfonic acid-containing compounds (e.g., benzoic acid, naphthalenesulfonic acid, polystyrenesulfonic acid, etc.) And polyaniline and its copolymer which are dissolved or dispersed; sulfonated polyaniline in which one or more hydrogen atoms of some or all of the benzene rings contained in polyaniline are replaced by a sulfonic acid group, I-bonded polypyrrole or polythiophene; and derivatives thereof. In the present invention t

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1248872 五、發明說明(12) —&quot; 該有機溶劑較佳者為醇類例如甲醇,乙醇,丙醇,異 丙醇等;酮類例如丙酮,丁酮和甲基異丁基酮;溶纖素類 例如甲基溶纖素,乙基溶纖素等;丙二醇類例如甲基丙二 醇,乙基丙二醇等;醯胺類例如二甲基甲醯胺,N—二甲基 乙酿胺等;及吡咯啶酮類例如N-甲基吡咯啶酮,n-乙基π比 洛啶酮等;彼等係以選用比例與水混合使用。 特殊例子包括水/甲醇,水/乙醇,水/丙醇,水/異丙 醇,水/甲基丙二醇,水/乙基丙二醇等。其比例較佳者為 水/有機溶劑= 1/10-10/1。 對於基材的黏著性,擴展性和強度方面來看,該導電 層除了導電性聚合物之外,較佳者含有一熱塑性聚合物。 要在本發明使用的熱塑性聚合物包含熱塑性聚合物例如聚 酯,聚醯胺(如,耐綸,芳族聚醯胺等),聚烯(如,聚乙 烯’聚丙烯等),聚氣乙烯,聚胺甲酸酯,聚醯胺醯亞 胺,聚醯亞胺等,且其形式未受特別限制。從在水中的分 散性之觀點來看’具有親水基的熱塑性聚合物對本發明為 較佳者。親水基顧不出對水的親和力,且其例子有酸性基 例如磺酸基,羧酸基,磷酸基等,彼等的鹼金屬鹽基,彼 等銨鹽基,胺基和羥基。也可以使用具有能夠轉化成親水 基的基之熱塑性聚合物及將此種聚合物轉換成具有親水基 之熱塑性聚合物。能夠轉化成親水基的基為,例如,醋 基,醯胺基,酸酐基,縮水甘油基,腈基,氣基等。 上文所提熱塑性聚合物的水分散液可以適宜地經由將 熱塑性聚合物溶解在適當的水溶性有機化合物内,及將該1248872 V. DESCRIPTION OF THE INVENTION (12) -&quot; The organic solvent is preferably an alcohol such as methanol, ethanol, propanol, isopropanol or the like; a ketone such as acetone, methyl ethyl ketone and methyl isobutyl ketone; Ordinary substances such as methyl cellosolve, ethyl cellosolve, etc.; propylene glycols such as methyl propylene glycol, ethyl propylene glycol, etc.; guanamines such as dimethylformamide, N-dimethyletheneamine, etc.; Pyrrolidones such as N-methylpyrrolidone, n-ethyl π piridone, etc.; they are used in admixture with water in selected ratios. Specific examples include water/methanol, water/ethanol, water/propanol, water/isopropyl alcohol, water/methyl propylene glycol, water/ethyl propylene glycol and the like. The ratio is preferably water/organic solvent = 1/10-10/1. The conductive layer preferably contains a thermoplastic polymer in addition to the conductive polymer in terms of adhesion, expandability and strength of the substrate. The thermoplastic polymer to be used in the present invention comprises a thermoplastic polymer such as polyester, polyamine (e.g., nylon, aromatic polyamine, etc.), polyene (e.g., polyethylene 'polypropylene, etc.), polystyrene , polyurethane, polyamidimide, polyimine, etc., and the form thereof is not particularly limited. From the standpoint of dispersibility in water, a thermoplastic polymer having a hydrophilic group is preferred for the present invention. The hydrophilic group does not have an affinity for water, and examples thereof include an acidic group such as a sulfonic acid group, a carboxylic acid group, a phosphoric acid group and the like, an alkali metal salt group thereof, and an ammonium salt group, an amine group and a hydroxyl group. It is also possible to use a thermoplastic polymer having a group capable of being converted into a hydrophilic group and converting the polymer into a thermoplastic polymer having a hydrophilic group. The group capable of being converted into a hydrophilic group is, for example, a hydroxy group, a decylamino group, an acid anhydride group, a glycidyl group, a nitrile group, a gas group or the like. The aqueous dispersion of the thermoplastic polymer mentioned above may suitably be prepared by dissolving the thermoplastic polymer in a suitable water-soluble organic compound, and

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1248872 五、發明說明(13) — :液:到。例如,n親水基的熱塑性聚合 -容解,且&amp;,水溶性有機化合物在50至2〇(rc下混合和 水中並授拌混分散液;或將此混合物加到 性聚合物在存::::::散液,或將具有親水基的熱塑 τ擦她 在於水中的水溶性有機化合物在40至120 t 下搜袢。 古/4+ &amp;提水溶性有機化合物具有在20 °C水中不低於20 ^解度,其特定言之為脂族或脂環醇,醚,酯,1248872 V. INSTRUCTIONS (13) — : Liquid: To. For example, a thermoplastic polymerization-capacitance of the n-hydrophilic group, and &lt;, a water-soluble organic compound mixed in water at 50 to 2 Torr (rc and mixed with water; or a mixture of the mixture added to the polymer: ::::: Dispersion, or rubbing a thermoplastic τ with a hydrophilic group. The water-soluble organic compound in water is searched at 40 to 120 t. The ancient / 4+ &amp; water-soluble organic compound has a temperature of 20 ° C water is not less than 20 ^ solution, which is specifically defined as aliphatic or alicyclic alcohols, ethers, esters,

嗣π哲了例子包含一價醇類例如甲醇,乙醇,▲丙醇,正 丁 ,乙一醇類例如乙二醇,丙二醇等;乙二醇衍生物 例^ r!基'合纖素,乙基溶纖素,正丁基溶纖素等;越類例 如一3烷,四氫呋喃等;酯類例如乙酸酯等;及酮類例如 丁酮等。這些有機化合物以單獨使用或組合使用。於上文 所提水溶性有機化合物之中,從在水中的分散性及對基材 的塗覆性質而言較佳者為異丙醇,丁基溶纖素及乙基溶纖 於本發明中,從傳導性觀點來看,較佳者為使用含親 水基的聚酯作為熱塑性聚合物。親水基可經由例如將聚酯 與濃硫酸反應以導入磺酸基,或使用具有親水基的單體作 為可共聚成分而導到聚酯之内,較佳者為了容易製造係採 用後述方法。 對於本發明較佳的含親水基聚酯係經由將具有親水基 的二缓酸以0 · 5至1 5莫耳%之比例,與沒有親水基的二綾酸 以85至99.5莫耳%的比例,兩者皆相對於總二羧酸成分,Examples of 嗣 π 哲 include monovalent alcohols such as methanol, ethanol, ▲ propanol, n-butyl, ethyl alcohols such as ethylene glycol, propylene glycol, etc.; ethylene glycol derivatives such as r-based 'synthetic fiber, ethyl Cellulite, n-butyl cellosolve, etc.; class such as trioxane, tetrahydrofuran, etc.; esters such as acetate; and ketones such as methyl ethyl ketone. These organic compounds are used singly or in combination. Among the water-soluble organic compounds mentioned above, preferred from the viewpoints of dispersibility in water and coating properties to a substrate are isopropyl alcohol, butyl cellosolve and ethyl cellosolve in the present invention. From the viewpoint of conductivity, it is preferred to use a hydrophilic group-containing polyester as a thermoplastic polymer. The hydrophilic group can be introduced into the polyester by, for example, reacting the polyester with concentrated sulfuric acid to introduce a sulfonic acid group, or using a monomer having a hydrophilic group as a copolymerizable component. Preferably, the method described later is used for the ease of production. Preferred hydrophilic group-containing polyesters for the present invention are at a ratio of from 0.5 to 15 mol% of the dibasic acid having a hydrophilic group and from 85 to 99.5 mol% of the diterpenic acid having no hydrophilic group. Proportion, both relative to the total dicarboxylic acid component,

C:\ProgramFiles\Patent\310689.ptd 第 19 頁 1248872 五、發明說明(14) 及/或具有親水基的二醇以〇· 5至15莫耳%之比例,與沒有 親水基的二醇以85至99· 5莫耳%之比例,兩者皆相對於總 一私成分一起聚合而得之實質非水溶性共聚合聚酯。當具 有親水基的二羧酸及/或二醇之含量超過15莫耳%時,共聚 合聚酯可能具有較低啲防水性,而當,其低(於〇 5、莫耳%時, 共聚合聚酯可鹎不容易分散在水中,其結果可'能促使水分 散液不能容易地施加到基材上。 ,4本發明中,該親水基特別較佳者為續酸金屬鹽基, 於該情況中,較佳者係使用含有確酸金屬鹽基的二羧酸作 為單體起始物。含有磺璇金屬鹽基的二羧酸之例子包含磺 酸基對苯二曱·.酸,5-磺酸基間苯二甲酸,4_磺丨酸基鄰苯二 曱/酸,4-磺酸基萘—2,7-二羧酸,5-(4-確酸基苯氧基)間 苯一甲酸等之金屬鹽,特別較佳者為5 -磺酸基間苯二甲酸 鈉和磺酸基對苯二甲綾鈉 彼等含磺释金屬鹽基的二羧酸 成分係以總二羧酸成分始'較佳者〇 · 5至1 5莫耳%,特別較佳 者2· 0至1 0莫耳%之比例包含在其内。 上文所提聚酯在水中”分散性會依可共聚成分,作為 溶劑的水溶性有機化合物等的種類和混合比例而變異。親 水基的含量基於較佳抗水性之故,較佳為小,只要不損及 水中分傲性即可。 上文所提聚酯所含沒有親水基的二羧酸可為芳族,脂 族或脂環二羧酸。可以使用對苯二甲酸,間笨二甲酸,鄰 苯二甲酸,2,6 -萘二羧酸等作為芳族二羧酸。彼等芳族二 羧酸的較佳者含有不低於總二羧酸成分的40莫耳%之比C:\ProgramFiles\Patent\310689.ptd Page 19 1248872 V. INSTRUCTIONS (14) and/or diols having a hydrophilic group in a ratio of 〇·5 to 15 mol%, and diol having no hydrophilic group A ratio of 85 to 99·5 mol%, both of which are substantially water-insoluble copolymerized polyesters obtained by polymerization together with a total of one private component. When the content of the dicarboxylic acid and/or diol having a hydrophilic group exceeds 15 mol%, the copolymerized polyester may have lower hydrazine water repellency, and when it is low (at 〇5, mol%, total The polymerized polyester can be easily dispersed in water, and as a result, the aqueous dispersion can be prevented from being easily applied to the substrate. 4 In the present invention, the hydrophilic group is particularly preferably a continuous acid metal salt group. In this case, it is preferred to use a dicarboxylic acid containing a metal acid group as a monomer starting material. Examples of the dicarboxylic acid containing a sulfonium metal salt group include a sulfonic acid p-benzoquinone·. 5-sulfoisophthalic acid, 4-sulfonate phthalic acid/acid, 4-sulfonic acid naphthalene-2,7-dicarboxylic acid, 5-(4-acid phenoxy) a metal salt of m-benzoic acid or the like, particularly preferably a sodium disulfonate isophthalate and a sulfonate terephthalic acid sodium sulfonate-containing metal salt-containing dicarboxylic acid component The proportion of the carboxylic acid component is preferably '5 to 15 mol%, particularly preferably 2 to 0 to 10 mol%. The above-mentioned polyester is dispersed in water.依可共The component varies depending on the type and mixing ratio of the water-soluble organic compound such as a solvent, and the content of the hydrophilic group is preferably small because it is preferably water-repellent, as long as the water is not impaired. The dicarboxylic acid containing no hydrophilic group in the polyester may be an aromatic, aliphatic or alicyclic dicarboxylic acid. Terephthalic acid, m-dicarboxylic acid, phthalic acid, 2,6-naphthalenedicarboxylic acid may be used. And the like as an aromatic dicarboxylic acid. Preferred of the aromatic dicarboxylic acids preferably has a ratio of not less than 40 mol% of the total dicarboxylic acid component.

1248872 五、發明說明(15) 例。當其低於40莫耳%脖,诗取 p ^ ^ ^ ^ ^ 時該聚知可能具有較低的機械強 #,八_ # , /及知%一羧酸的例子包含丁二酸,己二 4:環二竣酸等環戊烧二幾酸,U-環己烷二叛酸’丨, 的浐t所ί聚酯的乙二醇成分主要為具有2至8個碳原子 ^^一 一 β ’其7子為乙二醇,伸丙二醇,丙二醇,1, 4 一丁 一醇,新戊二醇,1 6- Ρ -絲1 蛘A,b己一酵,1,2-環己烷二甲醇, .—、元一甲醇,1,4一環己烷二甲醇,對二甲苯乙二 一甘醇,一縮三乙二醇等。也可以使用多醚類例如聚 聚丙二醇’聚四亞甲基乙二醇等。再者,可以共 聚氧基羧酸成分例如對氧基乙氧基苯甲酸,且也可以共聚 含有J量酿胺鍵,胺甲酸酯鍵,醚鍵,碳酸酯鍵等之二羧 酸及/或二醇成分。 ^上文所提含親水基之聚酯係經由用上文所提二羧酸成 分和上文所提乙二醇成分,根據習用方法進行酯交換反應 ,縮合聚合反應等而得到者。所得含親水基之聚酯經與, 例如’溶劑如正丁基溶纖素,加熱及攪拌,接著於攪拌下 加水而得水溶液或水分散液。 於本發明中,經由將具有親水基的乙烯基單體(其為 分枝聚合物的一聚合成分)接枝聚合到聚酯(其為主鏈聚合 物)的侧鏈所得到之接枝聚酯也可以用為熱塑性聚合物。 這種聚合物的使用會導致改良的透明性,對基材的黏著性 及耐久性。 可以用來接收到聚酯的具有親水基之乙烯基單體可為1248872 V. Description of invention (15). When it is lower than 40% of the neck, poetry takes p ^ ^ ^ ^ ^ when the polygraph may have a lower mechanical strength #, _ _ #, / and know that the example of carboxylic acid contains succinic acid, 2: 4: cyclopentanic acid and other cyclopentane diacids, U-cyclohexane di-retensive acid '丨, the polyester component of the polyester has a main component of 2 to 8 carbon atoms ^^ a β 'the 7th is ethylene glycol, propylene glycol, propylene glycol, 1, 4 - butanol, neopentyl glycol, 1 6- Ρ - silk 1 蛘 A, b one yeast, 1,2-cyclohexane Alkanediethanol, .-, meta-methanol, 1,4-cyclohexanedimethanol, p-xylene ethylene diethylene glycol, triethylene glycol, and the like. A polyether such as polypropylene glycol 'polytetramethylene glycol or the like can also be used. Further, an oxycarboxylic acid component such as p-oxyethoxybenzoic acid may be copolymerized, and a dicarboxylic acid containing a chiral amine bond, a urethane bond, an ether bond, a carbonate bond or the like may be copolymerized. Or a diol component. The polyester having a hydrophilic group as described above is obtained by a transesterification reaction, a condensation polymerization reaction or the like according to a conventional method using the above-mentioned dicarboxylic acid component and the above-mentioned ethylene glycol component. The resulting hydrophilic group-containing polyester is heated and stirred with, for example, a solvent such as n-butyl cellosolve, followed by adding water under stirring to obtain an aqueous solution or an aqueous dispersion. In the present invention, a graft polymerization obtained by graft-polymerizing a vinyl monomer having a hydrophilic group which is a polymerization component of a branched polymer to a side chain of a polyester which is a main chain polymer Esters can also be used as thermoplastic polymers. The use of such polymers results in improved transparency, adhesion to substrates and durability. A vinyl monomer having a hydrophilic group which can be used to receive a polyester can be

C:\Program Files\Patent\310689.ptd 第 21 頁 1248872 五、發明說明(16) 具有羧酸基,磺酸基,彼等的鹼金屬鹽基,彼等的銨鹽 基,羥基,醯胺基等之乙烯基單體,及具有能夠轉化成親 水基的基,例如酯基,醯胺基,酸酐基,縮水甘油基,氣 基,腈基等之乙烯基單體。其中,最佳者為具有羧酸基或 其驗金屬鹽基或其錢鹽基之乙稀型單體。 其例子包含具有缓酸基或其鹽基之單趙例如丙烯酸, :基丙烯酸,其鹼金屬Μ,其銨鹽;丙烯酸烷基醋例如丙 烯酸甲酯,丙烯酸乙酯,丙烯酸正丙酯,丙烯酸異丙酯, 丙烯酸正丁醋’丙烯酸第三丁醋$;甲基丙烯酸烷基醋例 如甲基丙烯酸曱醋,曱基丙烯酸乙酯,甲基丙烯酸正丙 酯丄甲基丙烯酸異丙酯,甲基丙烯酸正丁酯,甲基丙烯酸 第三丁酯等;含羥基單體例如丙烯酸2_羥基乙基酯,甲某 丙烯酸2-羥基乙基醋等;含醯胺基單體例如丙烯醯胺,$ 基丙烯醯胺,Ν-甲基丙烯醯胺,Ν一甲基甲基丙烯醯胺,ν_ 經甲基丙烯醯胺’Ν-羥甲基甲基丙烯醯胺,卜甲 丙烯醯胺,Ν-甲氧基甲基甲基丙烯醯胺,Ν,Ν_二羥^美 烯醯胺’Ν-苯基丙烯醯胺等;含環氧基單體例如丙烯 水甘油酯’曱基丙婦酸縮水甘油酯等;等等。 其它具有親水基的單體例子為含環氧基單體例如芳基 縮水甘油基醚等,含磺酸基或其鹽基之單體,例如苯乙烯 磧酸,乙烯基磺酸和其鹽;含羧酸基或其鹽基之單體,例 如巴豆酸,分解烏頭酸,順丁烯二酸,反丁烯二酸及彼等 的鹽,及含酸酐基之單體,例如脫水順丁烯二酸, 八 解烏頭酸等。 Θ C:\ProgramFiles\Patent\310689.ptd 第 22 頁 1248872C:\Program Files\Patent\310689.ptd Page 21 1248872 V. INSTRUCTIONS (16) Having a carboxylic acid group, a sulfonic acid group, the alkali metal bases thereof, their ammonium salts, hydroxyl groups, decylamine A vinyl monomer such as a group, and a vinyl monomer having a group capable of being converted into a hydrophilic group, such as an ester group, a guanamine group, an acid anhydride group, a glycidyl group, a gas group, a nitrile group or the like. Among them, the most preferred one is a ethylenic monomer having a carboxylic acid group or a metal salt thereof or a money salt thereof. Examples thereof include a mono-zinc having a slow acid group or a salt thereof such as acrylic acid, a acryl based acid, an alkali metal ruthenium thereof, an ammonium salt thereof, an alkyl acrylate acrylate such as methyl acrylate, ethyl acrylate, n-propyl acrylate or acrylic acid. Propyl ester, n-butyl acrylate 'acrylic acid third vinegar $; alkyl methacrylate such as methacrylic acid vinegar, ethyl methacrylate, n-propyl methacrylate isopropyl methacrylate, methyl N-butyl acrylate, butyl methacrylate, etc.; hydroxyl-containing monomer such as 2-hydroxyethyl acrylate, 2-hydroxyethyl acrylate, etc.; amide-containing monomer such as acrylamide, $ Acrylamide, Ν-methacrylamide, Νmethylmethacrylamide, ν_ methacrylamide Ν-hydroxymethylmethacrylamide, methacrylamide, hydrazine Methoxymethylmethacrylamide, hydrazine, hydrazine-dihydroxy methacrylate, hydrazine-phenyl acrylamide, etc.; epoxy-containing monomer such as propylene glyceryl hydrazide Glycerides, etc.; and so on. Examples of other monomers having a hydrophilic group are an epoxy group-containing monomer such as an aryl glycidyl ether or the like, a monomer having a sulfonic acid group or a salt thereof, such as styrene decanoic acid, vinyl sulfonic acid, and a salt thereof; a monomer having a carboxylic acid group or a salt thereof, such as crotonic acid, decomposed aconitic acid, maleic acid, fumaric acid and salts thereof, and an acid anhydride group-containing monomer such as dehydrated butylene Diacid, eight aconitine and so on. Θ C:\ProgramFiles\Patent\310689.ptd Page 22 1248872

五、發明說明(17) 彼等皆可以與其它單^時使用。其它單體的例 含異氰酸乙烯醋’異氰酸芳基酯,笨乙烯,乙烤美甲美 醚,乙稀基乙基謎,丙稀腈,甲基丙稀睛,二氣^乙ς, 乙酸-乙稀醋’氣乙婦等。可以其中的一或多種成員予以 共聚。具有親水基的單體對其它單體的莫耳比例較佳者 30/70至100/0 ^當具有親水基的乙歸基單體之比例係低二 30莫耳%之時,塗層可能不會具有充分高的透明性。 、 、作為上文所提接枝聚醋的主鏈聚合物之聚醋所含二羧 酸成刀可為方族,脂族或知環一竣酸。芳族二叛酸的例子 包含對苯二曱酸,間苯二甲酸,鄰苯二甲酸,2,b一萘二羧 酸等。彼等芳族二羧酸的較佳者含有不低於總二羧酸成分 的40莫耳%之比例。當其低於40莫耳%時,該接枝聚酯可能 具有較低的機械強度及抗水性。該脂族和脂環二羧酸一可 為丁二酸,己二酸,癸二酸,1,3 -環戊院二叛酸,1,2-環 己烷二羧酸,1,4-環己烷二羧酸等。有關乙二醇成份,主 要係使用有2至8個碳原子的脂族乙二醇,其特定言之為乙 二醇,伸丙二醇,丙二醇,1,4-丁二醇,新戊二醇,1,6 -己二醇,1,2 -環己烷二甲醇,1,3 -環己烷二甲醇,1,4 -環 己烷二甲醇,對二甲苯乙二醇,二縮三乙二醇等。此外, 也可以使用多醚類例如聚乙二醇,聚丙二醇,聚四亞甲基 乙二醇等。再者,可以共聚氧基羧酸成分例如對氧基乙氧 基苯甲酸,且也可以共聚含有少量醯胺鍵,胺甲酸醋鍵’ 鍵鍵,碳酸酯鍵等之二羧酸及/或乙二醇成分。 具有親水基的乙烯基單體可經由已知的接枝聚合方法V. INSTRUCTIONS (17) They can all be used with other singles. Examples of other monomers include isocyanic acid vinegar 'aryl isocyanate, stupid ethylene, B-baked memantine, ethylidene ether, acrylonitrile, methyl propyl phthalate, dioxane , acetic acid - ethyl vinegar 'qi women and so on. One or more of the members may be copolymerized. The molar ratio of the monomer having a hydrophilic group to the other monomer is preferably from 30/70 to 100/0 ^ When the ratio of the ethylenic monomer having a hydrophilic group is at least 30 mol%, the coating may be It does not have sufficiently high transparency. The dicarboxylic acid formed by the polycondensate as the main chain polymer of the grafted vinegar mentioned above may be a compound, an aliphatic or a perylene monodecanoic acid. Examples of the aromatic ditoponic acid include terephthalic acid, isophthalic acid, phthalic acid, 2,b-naphthalenedicarboxylic acid and the like. Preferably, the aromatic dicarboxylic acids contain a ratio of not less than 40 mol% of the total dicarboxylic acid component. When it is less than 40 mol%, the graft polyester may have low mechanical strength and water resistance. The aliphatic and alicyclic dicarboxylic acid may be succinic acid, adipic acid, azelaic acid, 1,3-cyclopentanol, 1 ,2-cyclohexanedicarboxylic acid, 1,4- Cyclohexanedicarboxylic acid and the like. Regarding the ethylene glycol component, mainly using aliphatic ethylene glycol having 2 to 8 carbon atoms, which is specifically ethylene glycol, propylene glycol, propylene glycol, 1,4-butanediol, neopentyl glycol, 1,6-hexanediol, 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 1,4-cyclohexanedimethanol, p-xylene glycol, diethylene glycol Alcohol, etc. Further, polyethers such as polyethylene glycol, polypropylene glycol, polytetramethylene glycol or the like can also be used. Further, an oxycarboxylic acid component such as p-oxyethoxybenzoic acid may be copolymerized, and a dicarboxylic acid and/or B containing a small amount of a guanamine bond, a urethane sulphate bond, a carbonate bond or the like may be copolymerized. The diol component. A vinyl monomer having a hydrophilic group can be subjected to a known graft polymerization method

1248872 _一 _ 五、發明說明(18) 接枝到聚酯。其典型例子包含下面所述者。 例如’可使用自由基聚合,其中係使用光、熱、輻射 等在作為主鏈聚合物的聚酯内產生自由基,再將乙烯基單 ,接枝聚合上去;陽離子聚合,其中係使用A1C13,TiC14 等作為觸媒以產生陽離子並將乙烯基單體接枝聚合;陰離 子聚合’其中係使用金屬Na,金屬Li等來產生陰離子並將 乙烯型單體接枝聚合;等。 此外’另一種方法包括將可聚合之不飽和雙鍵導到作 為主鏈聚合物的聚酯内,及用乙烯基單體與其反應。具有 可聚合之不飽和雙鍵的單體可為反丁烯二酸,順丁烯二 酸,順丁烯二酸酐,分解烏頭酸,檸康酸,2, 5-原冰片烯 二叛酸和其酸酐,脫水四氫鄰苯二甲酸等。其中,最佳者 為反丁埽二酸,順丁烯二酸和2, 5-原冰片烯二羧酸。 此外’可以使用包括將作為主鏈聚合物且在側鏈上具 有一官^基之聚酯與在末端具有可與上述官能基反應的基 之支鏈聚合物反應之方法。例如,將侧鏈上具有活性氫, 例如-0H,- SH,-NH2,-C00H,-C〇NH2等之聚酯與另一端且 有氩受納基,例如-N = 〇〇,-〇C = 0,環氧基,縮水甘油/、 基,硫化伸乙基等的乙烯基聚合物反應,或以相反的組人 進行該反應。 σ 於本發明令,作為主鏈聚合物的聚酯與要接枝的乙烯 基單體之使用重量比例較佳者為4〇/6〇至95/5 ,更佳者 55/45至93/7,特別佳者為6〇/4〇至9〇/1〇。當聚酯的重 比例低於40%時,乙烯基單體可能反應得不完全且剩餘者 C:\PrografflFiles\Patent\310689.ptd 第 24 頁 12488721248872 _ a _ five, invention description (18) grafted to polyester. Typical examples thereof include those described below. For example, 'radical polymerization can be used, in which a radical is generated in a polyester as a main chain polymer using light, heat, radiation, etc., and then a vinyl monomer is graft-polymerized; cationic polymerization is carried out using A1C13, TiC14 or the like acts as a catalyst to generate a cation and graft-polymerizes a vinyl monomer; anionic polymerization' uses a metal Na, a metal Li or the like to produce an anion and graft-polymerizes a vinyl-type monomer; Further, another method involves introducing a polymerizable unsaturated double bond into a polyester as a main chain polymer and reacting therewith with a vinyl monomer. The monomer having a polymerizable unsaturated double bond may be fumaric acid, maleic acid, maleic anhydride, decomposed aconitic acid, citraconic acid, 2, 5-norbornene diteric acid and Its anhydride, dehydrated tetrahydrophthalic acid and the like. Among them, the most preferred are dibutyric acid, maleic acid and 2, 5-norbornene dicarboxylic acid. Further, a method comprising reacting a polyester which is a main chain polymer and has a group on the side chain with a branched polymer having a group reactive with the above functional group at the terminal may be used. For example, a polyester having an active hydrogen such as -0H, -SH, -NH2, -C00H, -C〇NH2 or the like on the side chain and an argon accepting group at the other end, for example, -N = 〇〇, -〇 The reaction is carried out by reacting a vinyl polymer having C = 0, an epoxy group, a glycidyl group, a group, a sulfided ethyl group or the like, or in the opposite group. σ In the present invention, the weight ratio of the polyester as the main chain polymer to the vinyl monomer to be grafted is preferably from 4〇/6〇 to 95/5, and more preferably from 55/45 to 93/. 7, especially good for 6〇/4〇 to 9〇/1〇. When the weight ratio of the polyester is less than 40%, the vinyl monomer may not react completely and the remainder is C:\PrografflFiles\Patent\310689.ptd Page 24 1248872

五、 發明說明 〔19) 可 能 損 及 傳 統 聚 酯 所 具 性質 J 例 如 抗熱性,加 工性 等。 相 反 地 J 當 其 超 過95%時 ’作為本發明目的之在傳導性和透 明 性 上 的 改 良 有 時 候 可能 不 能 完 全地完成。 為 了 改 良 導 電 層 所 具表 面 硬 度 ,可以使用 會有 多羧 酸 基 之 單 體 9 例 如 偏 苯 甲酸 J 均 苯 三甲酸,1, 2, 4, 5-苯 四 甲 酸 &gt; 脫 水 偏 苯 三 甲 酸 ,脫 水1, 2, 4,5-苯四甲 酸等 ,以 不 大 於5莫耳% 的 比 例 作 為 上文 所 提 含 親水基的聚 酯與 接枝 聚 酯 之 可 聚 合 成 分 〇 不 過 ,當 其 超 過5莫耳%時, 所得 聚合 物 可 能 變 得 具 熱 不 穩 定 性 ,容 易 膠 凝 ,且較不適 合作 為本 發 明 導 電 層 所 含 成 分 〇 ( 如 後 文 要 提 及 者 9 當熱 塑 性 聚 合物能夠自 交聯 時, 係 在 此 熱 塑 性 聚 合 物 内 導 入交 聯 反 應 性基。交聯 反應 性基 的 例 子 包 含 丙 烯 酸 基 &gt; 乙 烯基 J 環 氧基,異氱酸 酯基 ,噚 口坐 啉 基 矽 醇 基 j 酸 氣 化 物基 羧 酸 基,胺基, 經基 ,氫 硫 基 等 0 彼 等 交 聯 反 應 性 基係 經 由 將 具有交聯反 應性 基的 可 聚 合成 分 予 以 聚 合 而 導 入者 〇 例 如 ,當該熱塑 性聚 合物 為 上 文 所 提含 親 水 基 的 聚雖之 時 9 係 使用具有交 聯反 應性 基 的 單 體 作 為 該 聚 酯 所 含 二羧 酸 成 分 及/或二醇成分, 而當 該 埶 塑 性 聚 合 物 為 上 文 所提接 板 聚 酯之時,係 使用 具有 交 聯 反 應 性 基 的 單 體 作 為 該聚 酯 所 含 二羧酸成分 及/或二醇 胃 成 分 或 使 用 具 有 交 聯 反 應性 基 的 單 體作為該乙 烯基 單體 〇 雖 然 對 上 文 所 提 熱 塑性 聚 合物 的含量沒有 特別 限制 ,· 不 過 從 所 得 導 電 層 的 傳 導性 及 機械 性質之觀點 來看 ,相 對 於100重量份數的導電性聚合物例如磺酸化聚苯胺等,其 C:\ProgramFiles\Patent\310689.ptd 第 25 頁 1248872V. Description of invention [19] It is possible to damage the properties of conventional polyesters such as heat resistance and workability. Conversely, when it exceeds 95%, the improvement in conductivity and transparency as the object of the present invention may not be completely completed. In order to improve the surface hardness of the conductive layer, a monomer having a polycarboxylic acid group such as benzoic acid J trimellitic acid, 1,2,4, 5-benzenetetracarboxylic acid &gt; dehydrated trimellitic acid may be used. Dehydration of 1,2,4,5-benzenetetracarboxylic acid, etc., in a ratio of not more than 5 mol% as the polymerizable component of the above-mentioned hydrophilic group-containing polyester and grafted polyester, but when it exceeds 5 When Moer%, the obtained polymer may become thermally unstable, easily gelled, and more uncomfortable cooperation is the composition of the conductive layer of the present invention (as will be mentioned later 9 when the thermoplastic polymer can self-crosslink) In the case of this thermoplastic polymer, a crosslinking reactive group is introduced. Examples of the crosslinking reactive group include an acrylic group &gt; vinyl J epoxy group, isononanoate group, and sulfonyl decyl group Acid-vaporated carboxylic acid group, amine group, trans group, thiol group, etc. Introduced by polymerizing a polymerizable component having a crosslinking reactive group, for example, when the thermoplastic polymer is a hydrophilic group-containing polymer as described above, 9 is a monomer having a crosslinking reactive group. As the dicarboxylic acid component and/or the diol component contained in the polyester, when the ruthenium plastic polymer is the above-mentioned spliced polyester, a monomer having a crosslinking reactive group is used as the poly The dicarboxylic acid component and/or the diol stomach component of the ester or the monomer having a crosslinking reactive group is used as the vinyl monomer. Although the content of the thermoplastic polymer mentioned above is not particularly limited, From the viewpoint of the conductivity and mechanical properties of the obtained conductive layer, with respect to 100 parts by weight of the conductive polymer such as sulfonated polyaniline, etc., C:\Program Files\Patent\310689.ptd, page 25, 1248872

較佳者為50至2000重量份數,更佳者iQ〇至1500重量份 數’最佳者200至1〇〇〇重量份數。 本發明高抗靜電性疊層片需要包含一經硬化的導電層 係因為三維交聯會改良該導電層所具抗水性及在浸水之後 抑止抗靜電性的減低程度。交聯方法包括一種使用交聯劑 之方法。一種包括經由將交聯反應性基導到導電性聚合物 及/或熱塑性聚合物内使其自交聯之方法,一種包括經由 過度加熱或輻射將導電性聚合物及/或熱塑性聚合物予以 交聯之方法;等。 要在本發明内使用之交聯劑可為在分子中具有兩個或 更多個反應性基(如,丙烯酸基,乙烯基,環氧基,異氱 酸醋基,噚唑啉基,矽醇基,酸氣化物基,羧酸基,胺 基’經基’氫硫基等)之化合物,或於正常狀況下不會在 溶劑例如水等之中反應,但經由加熱處理,ρΙΙ調整等,在 其分子内具有兩個或更多個基會產生上文所提反應性基例 如異氪酸醋基等,之化合物,這兩種化合物都能夠在其本 身進行分子間自交聯以形成三維網狀結構,或能夠與具有 、活性氮的有機化合物’具有活性氫的無機化合物或具有活 性氫的聚合物化合物(其可為上文所提的導電性聚合物或 熱塑性聚合物)反應以形成交聯鍵者。彼等化合物的例子 包含多官能性乙烯基化合物,多官能性丙烯酸化合物,多 S能性環乳化合物,多官能性異氱酸酯化合物,多官能性 嗜唾啉化合物,多官能性叛酸化合物,多官能性胺化合 物’多官能性羥基化合物,多官能性氫硫基化合物等。It is preferably 50 to 2000 parts by weight, more preferably iQ 〇 to 1500 parts by weight, and most preferably 200 to 1 part by weight. The high antistatic laminate of the present invention needs to contain a hardened conductive layer because three-dimensional crosslinking improves the water resistance of the conductive layer and suppresses the degree of reduction of the antistatic property after water immersion. The crosslinking method includes a method of using a crosslinking agent. One includes a method of self-crosslinking via crosslinking of a reactive group into a conductive polymer and/or a thermoplastic polymer, one comprising imparting a conductive polymer and/or a thermoplastic polymer via overheating or irradiation. Method of union; etc. The crosslinking agent to be used in the present invention may have two or more reactive groups in the molecule (e.g., acrylic group, vinyl group, epoxy group, isodecanoic acid group, oxazoline group, anthracene). a compound of an alcohol group, an acid vapor group, a carboxylic acid group, an amine group, a thiol group, or the like, or does not react in a solvent such as water under normal conditions, but is subjected to heat treatment, pH adjustment, etc. a compound having two or more groups in its molecule which produces the above-mentioned reactive group such as isophthalic acid sulfonate, etc., both of which are capable of self-crosslinking in themselves to form a three-dimensional network structure, or capable of reacting with an inorganic compound having an active nitrogen as an active compound or a polymer compound having active hydrogen (which may be the above-mentioned conductive polymer or thermoplastic polymer) Form crosslinks. Examples of such compounds include polyfunctional vinyl compounds, polyfunctional acrylic compounds, poly-S-energy cyclic emulsion compounds, polyfunctional isononate compounds, polyfunctional porphyrin compounds, polyfunctional retinoic compounds , a polyfunctional amine compound 'polyfunctional hydroxy compound, a polyfunctional thiol compound, and the like.

C:\ProgramFiles\Patent\310689.ptd 第 26 頁 1248872 五、發明說明(21) 多官能性環氧化合物的例子包含使用雙酚 A(bisphenol A)作為起始物的雙酚A環氧樹脂,葡萄糖醇 聚縮水甘油基醚,聚甘油聚縮水甘油基醚,異戊四醇聚縮 水甘油基醚,二甘油聚縮水甘油基醚,甘油聚縮水甘油基 醚,參(2 -羥基乙基)異聚氟酸三縮水甘油酯,三羥甲基丙 烷聚縮水甘油基醚,間苯二酚二縮水甘油基醚,新戊基乙 二醇二縮水甘油基醚,1,b-己二醇二縮水甘油基醚,雙紛 S二縮水甘油基醚,乙二醇二縮水甘油基醚,聚乙二醇二 縮水甘油基謎’聚丙^酵—縮水甘油基謎,丙二醇二縮水 甘油基謎’聚四亞甲基乙二醇二縮水甘油基鍵,己二酸縮 水甘油基醋’鄰苯二甲酸縮水甘油基醋,二漠新戊基乙二 醇二縮水甘油基醚,等。 上文所^多s能性環乳化合物除了與共同存在導電性 聚合物及/或熱塑性聚合物反應之外,可與具有活性氮的 化合物反應,彼等化合物可為,例如,脂族多元胺類例如 二伸乙基三胺,三伸乙基四胺,四伸乙基五胺,聚氧化丙 稀多元胺,二縮二乙二醇二胺,三縮四乙二醇二胺等;環 狀多元胺例如二甲苯二胺,螺縮醛二胺,異佛爾嗣二胺, 雙(3-曱基-4-胺基環己基)甲烷等;芳族多元胺例如二胺 基二苯基甲烷,二胺基二苯楓等;改質胺例如多胺基醯胺 其在分子内具有許多活性胺基且其係經由多元胺與二叛 酸,胺加成物硬化劑,曼尼其硬化劑(mannich curing agent)等合縮而成者;等。 多官能性異氣酸醋化合物為’例如,熱反應性水溶性C:\ProgramFiles\Patent\310689.ptd Page 26 1248872 V. INSTRUCTIONS (21) Examples of polyfunctional epoxy compounds include bisphenol A epoxy resin using bisphenol A as a starting material. Glucositol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerin polyglycidyl ether, glycerol polyglycidyl ether, ginseng (2-hydroxyethyl) Polyglycidyl polyfluorolate, trimethylolpropane polyglycidyl ether, resorcinol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,b-hexanediol diminish Glyceryl ether, double s-diglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl-mystery 'polypropyl-fermented-glycidyl-based mystery, propylene glycol diglycidyl-mystery' poly four Methylene glycol diglycidyl bond, adipic acid glycidyl vinegar 'phthalic acid glycidyl vinegar, two desert neopentyl glycol diglycidyl ether, and the like. The above s-energy cycloalcene compound can react with a compound having reactive nitrogen in addition to reacting with a co-existing conductive polymer and/or a thermoplastic polymer, and these compounds can be, for example, aliphatic polyamines. Such as di-ethyltriamine, tri-ethyltetramine, tetraethylamamine, polyoxypropylene polyamine, diethylene glycol diamine, triethylene glycol diamine, etc.; Polyamines such as xylene diamine, spiro aldehyde diamine, isophordine diamine, bis(3-indolyl-4-aminocyclohexyl)methane, etc.; aromatic polyamines such as diaminodiphenyl Methane, diaminodiphenyl maple, etc.; modified amines such as polyamine decylamines which have many reactive amine groups in the molecule and which are hardened by polyamines and diremediation, amine adduct hardeners, Mannich hardening A mannich curing agent or the like is condensed; The polyfunctional isogastric acid vinegar compound is, for example, thermally reactive water-soluble

1248872 五、發明說明(22)1248872 V. Description of invention (22)

胺甲酸酯樹脂,ELASTRON(註冊商標,係Dai ichi Kogyo Seiyaku所製)等。其為一種反應性胺甲酸酯樹脂,其中末 端異氣酸醋基係由封阻劑保護著,使其可在水中穩定地處 理。有關ELASTR0N所用的封阻劑,係使用具有強親水基稱 為胺甲醯基磺酸根(―NHC0S03-)的化合物。ELASTR0N在接 受某種熱處理之下會顯現出封阻劑的解離及活性異氱酸酯 基之再生。特定言之’其係在不超出1〇〇t下預先乾燥並 在120至170°C下熱處理數分鐘,因此使elaSTRON因再生的 異氟酸醋基而對其本身進行分子間自交聯,而得具有三維 網狀構造的聚胺甲酸酯塗覆膜。在用含有活性氫的不同化 合物與ELASTRON混合與加熱時,該化合物可經由交聯而獲 得改良。例如,將聚乙烯醇與ELASTR〇N混合及接受熱處 理,可藉此促成相同的抗水性。 例如’多官能性乙烯基化合物包含聚丁二烯和異戊二 烯0 例如,多官能性丙烯酸化合物包含AR〇NIX(註冊商 標’其為TOA GOSEI CO·,LTD.所製,其特定例子為雙酚F E0-改質(4莫耳)二丙烯酸酯(μ - 208 ),雙酚A E0-改質(4莫 耳)二丙烯酸酯(M-210),異三聚氰酸E0-改質二丙烯酸酯 (M-215),三丙二醇二丙烯酸酯(m-220),聚丙二醇二丙烯 酸酯(n=約7,PPG#400225),季戊四醇二丙烯酸酯甘 油一硬脂酸酯(M-233),聚乙二醇二丙烯酸酯(n=約4, PPG#200,M_240 ),聚乙二醇二丙烯酸酯(n=約9, PPG#400 ’M-245),聚-乙二醇二丙烯酸酯(n=約13至14,A urethane resin, ELASTRON (registered trademark, manufactured by Daiichi Kogyo Seiyaku), and the like. It is a reactive urethane resin in which the terminal isogastric acid vinegar is protected by a blocking agent so that it can be stably treated in water. As the blocking agent used for ELASTR0N, a compound having a strong hydrophilic group called an amine-mercaptosulfonate (-NHCOS03-) is used. ELASTR0N exhibits dissociation of the blocking agent and regeneration of the active isodecanoate group upon exposure to a heat treatment. Specifically, it is pre-dried at a temperature not exceeding 1 〇〇t and heat-treated at 120 to 170 ° C for several minutes, thus allowing elaSTRON to self-crosslink itself by regenerating isofluoric acid vinegar. A polyurethane coating film having a three-dimensional network structure is obtained. When mixed and heated with ELASTRON with different compounds containing active hydrogen, the compound can be improved by crosslinking. For example, mixing polyvinyl alcohol with ELASTR® N and subjecting to heat treatment can thereby promote the same water resistance. For example, the polyfunctional vinyl compound contains polybutadiene and isoprene. For example, the polyfunctional acrylic compound contains AR〇NIX (registered trademark 'which is manufactured by TOA GOSEI CO., LTD., and its specific example is Bisphenol F E0-modified (4 mol) diacrylate (μ - 208 ), bisphenol A E0-modified (4 mol) diacrylate (M-210), isomeric cyanuric acid E0-modified Diacrylate (M-215), tripropylene glycol diacrylate (m-220), polypropylene glycol diacrylate (n = about 7, PPG #400225), pentaerythritol diacrylate glyceryl monostearate (M- 233), polyethylene glycol diacrylate (n = about 4, PPG #200, M_240), polyethylene glycol diacrylate (n = about 9, PPG #400 'M-245), poly-ethylene glycol Diacrylate (n = about 13 to 14,

12488721248872

PPG#6O0 ’Μ-260),聚丙二醇二丙烯酸酯(11=約12, Μ - 270 ) ’季戊四醇三丙烯酸酯(Μ —3〇5),三羥甲基丙烷三 丙1酸醋(Μ-309),三羥甲基丙烷Ρ〇-改質(3莫耳)三丙烯 ,醋(Μ —310) ’異三聚氰酸ΕΟ-改質三丙烯酸酯(Μ-315), 二Μ曱基丙娱:ΡΟ-改質莫耳)三丙烯酸酯(Μ-32〇),三羥 甲基丙院Ε〇-改質(3莫耳)三丙烯酸酯(Μ - 350 ),三羥甲基 丙烧ΕΟ-改質(6莫耳)三丙烯酸酯(Μ —36〇),二季戊四醇五一 和六-丙稀酸酷(Μ-400),二三羥甲基丙烷四丙烯酸酯 (Μ-408 ) ’季戊四醇四丙烯酸酯(Μ_45〇),胺甲酸乙酯丙烯 酸醋(Μ —1100),及聚酯丙烯酸酯(Μ-7000系列,Μ-8000系 列,Μ-7100 , Μ-8060)。 例如,該多官能性噚唑啉化合物包含&amp;1&gt;〇(:1?〇%(註冊 商標’為NIPDON SYOKUBAI KOGYO CO·,LTD·所製)。 例如’該多官能性羧酸化合物包含脫水偏苯三甲酸, 脫水1,2, 4, 5-苯四甲酸,均苯三甲酸等。 例如’該多官能性胺化合物包含VARSAMINe和 VERSAMID(註冊商標,為Henkei japari Ltd·所製)。 例如,該多官能性羥基化合物包含聚乙烯醇,多醚多 凡醇’聚酯多元醇,丙烯酸多元醇,聚碳酸酯二醇,三羥 甲基乙燒’三羥甲基丙燒,甘油,季戊四醇等。 例如,該多官能性氫硫基化合物包含三乙烯基環己烷 -改質三亞甲基二醇等。 上文所提交聯劑可為任何一者只要其具穩定性且可溶 解於形成導電層所用的溶劑之内即可。其中,較佳者為多PPG#6O0 'Μ-260), polypropylene glycol diacrylate (11=about 12, Μ-270) 'pentaerythritol triacrylate (Μ-3〇5), trimethylolpropane tripropylene acid vinegar (Μ- 309), trimethylolpropane oxime-modified (3 moles) tripropylene, vinegar (Μ-310) 'iso-cyanuric acid-modified triacrylate (Μ-315), dimercapto C Entertainment: ΡΟ-modified mol) triacrylate (Μ-32〇), trimethylol propyl sulfonate-modified (3 moles) triacrylate (Μ - 350 ), trimethylol propyl Burning-modified (6 moles) triacrylate (Μ-36〇), dipentaerythritol 51 and hexa-acrylic acid (Μ-400), ditrimethylolpropane tetraacrylate (Μ-408) ) 'Pentaerythritol tetraacrylate (Μ_45〇), urethane acrylate vinegar (Μ-1100), and polyester acrylate (Μ-7000 series, Μ-8000 series, Μ-7100, Μ-8060). For example, the polyfunctional oxazoline compound contains &amp;1&gt;(:1?% (registered trademark 'NIPDON SYOKUBAI KOGYO CO., LTD.). For example, 'The polyfunctional carboxylic acid compound contains dehydration Trimellitic acid, dehydrated 1,2,4, 5-benzenetetracarboxylic acid, trimesic acid, etc. For example, the polyfunctional amine compound includes VARSAMINe and VERSAMID (registered trademark, manufactured by Henkei Japari Ltd.). The polyfunctional hydroxy compound comprises polyvinyl alcohol, polyether polyol alcohol 'polyester polyol, acrylic polyol, polycarbonate diol, trimethylol bromide' trimethylol propyl alcohol, glycerin, pentaerythritol For example, the polyfunctional thiol compound comprises trivinylcyclohexane-modified trimethylene glycol, etc. The crosslinking agent mentioned above may be any one as long as it is stable and soluble in formation. The solvent used in the conductive layer may be within. Among them, preferably more

C:\ProgramFiles\Patent\310689.ptd 第 29 頁 1248872 五、發明說明(24) -----— S能性環氧化合物和多官能性異氱酸酯化合物,特別是 /备於水中且在其中具穩定性之多官能性異氱酸酯化合物 溶液。 上文所提含有多官能性反應性基之化合物可含有單乙 烯基化合物,單丙烯酸化合物,單環氧基化合物,單異氱 酸酯化合物,單噚唑啉化合物,單羧酸化合物,單胺化合 物,單羥基化合物,單氫硫基化合物等。 σ 虽導電性聚合物及/或熱塑性聚合物能夠自交聯時, 彼等聚合物需要具有交聯反應性基。交聯反應性基的例子 包含丙烯酸基,乙烯基,環氧基,異氰酸酯基,噚唑啉 基,矽醇基,酸氣化物基,羧酸基,胺基,羥基,氩硫基 在使用本發明疊層片來形成供電子零件所用的容器 (特別疋托盤)之時’該托盤可在重複水洗之後重複使用。 經由交聯三可以防止因為水洗所致抗靜電性之減低,且可 將洗後附者在托盤上的水容易地搖掉,交聯硬化也可以有 效地縮短乾燥時間,係因為水洗後附著在導電層上的水較 少且導電層不膨脹之故。此外,附著的灰塵也較少且托 盤較不會因水洗而受損。 另一方面,於交聯硬化得太硬之情況中,且當高抗靜 電性疊層片於加工等之中被拉伸時,該導電層不能追循著 拉伸且在被拉伸部份的抗靜電性會減低。因此,交聯硬化 必須元成到使得表面電阻不會在15〇%拉伸下超過1〇倍。 在導電層含有聚乙二醇成分時,可拉伸性會有利地變C:\ProgramFiles\Patent\310689.ptd Page 29 1248872 V. INSTRUCTIONS (24) ------ S-energy epoxy compounds and polyfunctional isophthalic acid ester compounds, especially in water and A solution of a polyfunctional isononate compound having stability therein. The compound containing a polyfunctional reactive group as mentioned above may contain a monovinyl compound, a monoacrylic compound, a monoepoxy compound, a monoisodecanoate compound, a monooxazoline compound, a monocarboxylic acid compound, a monoamine A compound, a monohydroxy compound, a monohydrogenthio compound or the like. σ Although conductive polymers and/or thermoplastic polymers are capable of self-crosslinking, they need to have cross-linking reactive groups. Examples of the crosslinking reactive group include an acrylic group, a vinyl group, an epoxy group, an isocyanate group, an oxazoline group, a decyl group, an acid group, a carboxylic acid group, an amine group, a hydroxyl group, and an argon group. When the laminate is invented to form a container (particularly a tray) for use in electronic parts, the tray can be reused after repeated water washing. By cross-linking three, it is possible to prevent the antistatic property from being lowered due to water washing, and the water on the tray can be easily shaken off by the post-washing, and the cross-linking hardening can also effectively shorten the drying time because it is adhered to after washing. There is less water on the conductive layer and the conductive layer does not swell. In addition, there is less dust attached and the tray is less damaged by washing. On the other hand, in the case where the crosslinking hardening is too hard, and when the high antistatic laminate is stretched during processing or the like, the conductive layer cannot follow the stretching and is stretched. The antistatic properties will be reduced. Therefore, the cross-linking hardening must be such that the surface resistance does not exceed 1 〇 at 15% stretching. When the conductive layer contains a polyethylene glycol component, the stretchability is advantageously changed.

1248872 五、發明說明(25) 成良好。聚乙 水基的聚酯或 上文所提接枝 於本發明 如熔融擠壓法 物,需要時, 該熔融體從適 上文所提組成 以製備塗覆液 方法,因為塗 層片具有良好 在用塗覆 成物製成之塗 過,上文所提 可防止在塗覆 可以改良塗覆 要在本發 離子性或非離 性劑如氟烷基 氟烧基四級銨 界面活性劑例 醚,聚氧化乙 當導電性 時,例如藉助 二醇可被分開地含有,或用為上文所提含親 接枝聚醋所含可共聚合聚酯成分,或摻加到 聚醋的支鏈聚合物之内 中,可用任何方法在基材上形成導電層,例 ’其包括將含有導電性聚合物,熱塑性聚合 父聯劑等之導電層所用组成物予以溶化及將 當的模頭擠壓出來;以及塗覆法,其包括將 物分散或溶解在水或適當的有機溶劑之中, 體及將其塗佈在一基材之上。較佳者為德述 層厚度可製成薄者且其可受控制,且所得昼 的透明性之故。 法形成導電層之時,可以使用從上文所提組 覆液體以得到本發明高抗靜電性疊層片。不 組成物較佳地也含有一界面活性劑,因為其 時發生收縮(cissing),不均勻等現象,且 性之故。 明中使用的界面活性劑可為任何一者不論是 子性者’且較佳者可以使用例如,氟界面活 敌酸,全氟烷基羧酸,全氟烷基苯磺酸,全 ’全氟烧基聚氧化乙稀乙醇等;及非離子性 如聚氧化乙稀辛基苯基醚,聚氧化乙烯烧基 烯山梨糖醇酐脂肪酸酯等。 聚合物為水溶性或水可分散性導電性聚合物 滲雜劑經溶解或分散在水中的聚苯胺(如, C:\ProgramFiles\Patent\310689.ptd 第 31 頁 1248872 五、發明說明(26) 磺酸化聚苯胺),較佳者為使用非離子界面活性劑。 界面活性劑在本發明中的用量較佳者為〇 · 〇 〇 1至1 〇重 量份數每100重量份數的導電性聚合物例如磺酸化聚苯胺 等。當界面活性劑的用量超過10重量份數時,在高抗靜電 性疊層片係經疊置或輥壓並將導電層與基材的背面接觸之 際,界面活性劑會轉移到基材的背面,此舉容易在二次加 工例如積層,沈積,印刷,等之中造成問題。 為了改良所得疊層片的滑動性質,上文所提供導電層 所用的組成物可更含有脂肪酸金屬鹽與不活性粒子。 要在本發明中使用的脂肪酸金屬鹽包含廿九院酸納, 廿九烷酸鈣,三十烷酸鈉,油酸鈉,硬脂酸鈉,棕攔酸 鋼,月桂酸鈉,肉豆蔻酸鈉等,較佳者為鹼金屬鹽和鹼土 金屬鹽且特別較佳者為鈉鹽。 要在本發明中使用的不活性粒子包含無機粒子例如氧 化鈦(1\02),二氧化矽(Si02),高嶺土,碳酸鈣(CaC〇3), 氧化鋁(Al2〇3),硫酸鋇(BaS04),氧化辞(ZnO),滑石,雲 母,錯合物粒子等;有機粒子由聚苯乙烯,聚丙烯酸酯, 其交聯化合物等所組成者。從塗層的透明性之觀點來看, 彼等粒子較佳者具有不大於〇·2微米之平均原粒徑。此 外,其添加量較佳者不超過導電層組成物之1〇〇〇ρριη以期 得到合意的透明性。 為了進一步改良導電層之傳導性,可以加入塗覆著彼 之Sn〇2(氧化錫)或ZnO(氧化鋅)粉末,或無機粒子或有機 粒子,例如I\〇2,BaS04等;碳導電性填料,例如碳黑,石1248872 V. Description of invention (25) Good. a polyethylene-water-based polyester or a graft as described above, such as a melt-extruded article, if necessary, the melt is composed of the above-mentioned composition to prepare a coating liquid because the coated sheet has good In the case of coating with a coating composition, the above mentioned can prevent the coating from being improved in coating. In the case of the present ionic or non-separating agent such as fluoroalkyl fluoroalkyl quaternary ammonium surfactant, The ether, polyoxyethylene, when electrically conductive, for example, may be separately contained by means of a diol, or may be a copolymerizable polyester component contained in the above-mentioned affinity-grafted polyester, or a branch added to the vinegar In the chain polymer, a conductive layer can be formed on the substrate by any method, for example, which comprises melting a composition containing a conductive layer of a conductive polymer, a thermoplastic polymer-parent agent, and the like, and extruding the die. Pressed; and a coating process comprising dispersing or dissolving the material in water or a suitable organic solvent, and coating it onto a substrate. Preferably, the thickness of the layer can be made thin and it can be controlled, and the transparency of the resulting ruthenium. When the conductive layer is formed by the method, the liquid coated from the above may be used to obtain the highly antistatic laminate of the present invention. The non-composition preferably also contains a surfactant because of the phenomenon of cissing, unevenness, and the like. The surfactant used in the present invention may be any one of them, and preferably, for example, a fluorine interface active acid, a perfluoroalkyl carboxylic acid, a perfluoroalkyl benzene sulfonic acid, all Fluorinated polyoxyethylene ethanol, etc.; and nonionic such as polyethylene oxide octyl phenyl ether, polyoxyethylene decyl sorbitan fatty acid ester, and the like. The polymer is a polyaniline in which a water-soluble or water-dispersible conductive polymer dopant is dissolved or dispersed in water (for example, C:\Program Files\Patent\310689.ptd, p. 31, 1248872 V. Description of Invention (26) Sulfonated polyaniline), preferably a nonionic surfactant. The amount of the surfactant in the present invention is preferably 〇 · 〇 〇 1 to 1 〇 by weight per 100 parts by weight of the conductive polymer such as sulfonated polyaniline or the like. When the amount of the surfactant is more than 10 parts by weight, the surfactant is transferred to the substrate when the high antistatic laminate is laminated or rolled and the conductive layer is brought into contact with the back surface of the substrate. On the back side, this is easy to cause problems in secondary processing such as lamination, deposition, printing, and the like. In order to improve the sliding property of the resulting laminate, the composition for the conductive layer provided above may further contain a fatty acid metal salt and inactive particles. The fatty acid metal salt to be used in the present invention comprises saponin, sodium decanoate, sodium laurate, sodium oleate, sodium stearate, palmitic acid, sodium laurate, myristic acid Sodium or the like is preferably an alkali metal salt and an alkaline earth metal salt and particularly preferably a sodium salt. The inactive particles to be used in the present invention contain inorganic particles such as titanium oxide (1\02), cerium oxide (SiO 2 ), kaolin, calcium carbonate (CaC 3 ), alumina (Al 2 〇 3 ), barium sulfate ( BaS04), oxidized (ZnO), talc, mica, complex particles, etc.; organic particles are composed of polystyrene, polyacrylate, cross-linking compounds, and the like. From the standpoint of the transparency of the coating, the particles preferably have an average primary particle size of not more than 2 micrometers. Further, the amount of addition is preferably not more than 1 〇〇〇ρριη of the composition of the electroconductive layer in order to obtain a desired transparency. In order to further improve the conductivity of the conductive layer, it may be added with Sn Sn 2 (tin oxide) or ZnO (zinc oxide) powder coated thereon, or inorganic particles or organic particles, such as I\〇2, BaS04, etc.; carbon conductivity Filler, such as carbon black, stone

C:\ProgramFiles\Patent\310689.ptd 第 32 頁 1248872 五、發明說明(27) 墨,碳纖維等;或塗覆或積層著導電性聚合物,例如聚苯 胺,磺酸化聚苯胺,聚吡咯,可溶性聚吡咯,聚噻吩等之 無機粒子或有機粒子。從透明性方面來看,該等教子具有 較佳^不大於I 2微米之平均厚粒徑。上文所提添加劑的 添加篁較佳者為不大於4〇〇〇重量份數每1〇〇重量份數的導 電性聚合物例如續酸化聚苯胺等。當其超過4刚時,可能 因為塗覆液體所具黏度之增加而在塗覆時發生不均象 且可能使透明性劣化。 施加在基材上的量較佳者為〇· 〇1至6 〇克/平方米乾 重。當塗覆量低於〇· 01克/平方米時,可能不能提供合章 =傳導性。而當其超過6.0克/平方米時,可能使封阻性4受 可以使用石版輥塗法,逆輥塗法,刀塗法,浸塗法, 旋塗法,喷塗法等在基材之上,特別是熱塑性樹脂片和膜 形成導電層。適用於導電性組成物的塗覆方法並無特別限 制。可以串聯的塗覆方法,其中係在膜形成過程中施加塗 層,以及離線的塗覆方法,其中係在膜形成過程之後另外 分開施加塗層。可以沒有任何特別限制地選擇較適合所用 之方法。 要在本發明中使用的導電性聚合物,特別是確酸化聚 本胺’在不低於250 C的南溫下係不穩定者,但在2〇q°c下 以熱處理約3分鐘之過程中具安定性。所以,在2〇〇t加熱 短時間通常不會不利地影饗到傳導性,雖然會因共同存在 的熱塑性聚合物和添加劑之種類而有所變異,但是可以維 C:\ProgramFiles\Patent\310689.ptd 第 33 頁 1248872 五、發明說明(28) 2住透明性及良好的抗靜電性,同時較佳地提供高表面強 當基材為有機基材時,可施用電暈處理, 的電暈處理或紫外線照射,或在將含有導電性組=壓下 覆液體施加到基材之前可先形成一底塗層,由是 =^ 體具有優良的塗覆性質,且可以改良對基材的黏著性、 在形成導電層之後,可在導電層上施用電暈 = 外線照射’由是改良導電層表面的塗覆性質和印刷性:且 可在導電層上形成一層或可以順利地完成印刷。 $外’可在導電層上形成一薄保護層到不損及傳 之程度^ 本發明高抗靜電性疊層片具有非常低的表面電阻, 該導電層在2 5 t,相對濕度15%下的表面電阻(R 1〇11〇/口,較佳者不大於1〇1。0/口,更佳者不大於1〇9^/ 匚],因而顯示出在低濕度下的優良抗靜電性質。電荷衰減 時間較佳者不超過2· 〇秒,更佳者不超過〇· 5秒。如本^所 用者二,面電阻意指將電流動在導電層表面上之困難性, 且電荷衰減時間意指使充電一次的電荷散逸掉之容易性。 兩者皆為顯示抗靜電性質之指數。 本發明高抗靜電性疊層片具有優良的抗水性,其中在 將本發明高抗靜電性疊層片浸於4〇 t純水中一小時後,該 導電層在25 C,相對濕度1 5%下所具表面電阻(β\ )對的 比例(RSi/RSQ)不大於1〇,較佳者不大於8 ,更佳者5。於浸 水使抗靜電性很少減低之下,該疊層片可以用於與水洗後 C:\ProgramFiles\Patent\310689.ptd 第 34 頁 1248872 五、發明說明(29) 重複使用及可能被水濕潤相關聯的環境之中。 本發明疊層片具有優良的成型性質,其中在將本發明 高抗靜電性疊層片拉伸150%後該導電層在25 °C,相對濕度 15%下所具表面電阻(RS2)對RSG的比例(RS2/RSG)較佳者不大 於10,更佳者不大於8,最佳者5。於成型中的拉伸幾乎不 會減低抗靜電性質。 本發明疊層片也具有優良的抗熱性,其中在將本發明 高抗靜電性疊層片置於2 50 °C下加熱一分鐘後,該導電層 在25 °C,相對濕度15%下所具表面電阻(RS9)對RSG的比例 (RSq/RSq)較佳者不大於5.0,更佳者不大於3.0。成型所用 的熱幾乎不會減低抗靜電性質。 本發明高抗靜電性疊層片較佳者具有根據j IS 71 0 5測 量所得不低於75%,更佳者不低於80%,且最佳者不低於 8 5%之可見光透光率。經由將可見光透光率設定在不低於 75%,在使用該高抗靜電性疊層片作為包裝材料時,可以 容易地進行内容物的目視確定,用TV攝影機之自動監測, 接著於内容物的條碼處理等。 本發明高抗靜電性疊層片所含導電層較佳著具有根據 J IS 71 05測量所得不低於75%,更佳者不低於80% ,且最佳 者不低於8 5 %之可見光透光率。經由使用具有高可見光透 光率之導電層,也可以使用具有略為較低可見光透光率的 基材和半透明基材,由是增加可用基材之種類。在實施上 文所提内容物的光學監測時,需要施以表面無光處理等以 防止功能不良。高可見光透光率可彌補無光處理所引起的C:\ProgramFiles\Patent\310689.ptd Page 32 1248872 V. INSTRUCTIONS (27) Ink, carbon fiber, etc.; or coated or laminated conductive polymer, such as polyaniline, sulfonated polyaniline, polypyrrole, soluble Inorganic particles or organic particles such as polypyrrole or polythiophene. From the viewpoint of transparency, the teachings have an average thickness of not more than 12 μm. The addition of the above-mentioned additive is preferably not more than 4 parts by weight per 1 part by weight of the conductive polymer such as polyacidified polyaniline or the like. When it exceeds 4, it may cause unevenness at the time of coating due to an increase in viscosity of the coating liquid and may deteriorate transparency. The amount applied to the substrate is preferably 〇·〇1 to 6 g/m dry weight. When the coating amount is less than 〇·01 g/m 2 , it may not be possible to provide a seal = conductivity. When it exceeds 6.0 g/m 2 , it may be possible to use the lithographic roll coating method, the reverse roll coating method, the knife coating method, the dip coating method, the spin coating method, the spray coating method, etc. on the substrate. Above, in particular, a thermoplastic resin sheet and a film form a conductive layer. The coating method suitable for the conductive composition is not particularly limited. A coating method which can be connected in series, in which a coating layer is applied during film formation, and an off-line coating method in which a coating layer is additionally applied after the film formation process. The method suitable for use can be selected without any particular limitation. The conductive polymer to be used in the present invention, particularly the acidified polyamine, is unstable at a south temperature of not lower than 250 C, but is heat-treated at 2 〇 q °c for about 3 minutes. It has stability. Therefore, heating at 2 〇〇t for a short period of time usually does not adversely affect conductivity, although it may vary due to the type of co-existing thermoplastic polymer and additives, but can be dimensioned C:\ProgramFiles\Patent\310689 .ptd Page 33 1248872 V. INSTRUCTIONS (28) 2 Resistance and good antistatic properties, while preferably providing high surface strength Corona treatment can be applied when the substrate is an organic substrate. Treatment or ultraviolet irradiation, or forming an undercoat layer before applying the conductive group=pressing liquid to the substrate, which has excellent coating properties and can improve adhesion to the substrate. After the formation of the conductive layer, corona can be applied to the conductive layer = external illumination 'by improving the coating properties and printability of the surface of the conductive layer: and a layer can be formed on the conductive layer or printing can be smoothly completed. The outer layer can form a thin protective layer on the conductive layer to the extent that it does not damage. The high antistatic laminate of the present invention has a very low surface resistance, and the conductive layer has a relative humidity of 15% at 25 t. Surface resistance (R 1 〇 11 〇 / port, preferably not more than 1 〇 1. 0 / mouth, more preferably not more than 1 〇 9 ^ / 匚), thus showing excellent antistatic properties at low humidity The charge decay time is preferably not more than 2·〇 seconds, and more preferably not more than 〇·5 seconds. As used in this example, the surface resistance means the difficulty of moving the current on the surface of the conductive layer, and the charge is attenuated. Time means the ease of dissipating the charge once charged. Both are indices showing the antistatic properties. The high antistatic laminate of the present invention has excellent water resistance, wherein the high antistatic laminate of the present invention is laminated. After the sheet is immersed in 4〇t pure water for one hour, the ratio of surface resistance (β\ ) pairs (RSi/RSQ) of the conductive layer at 25 C and relative humidity of 1 5% is not more than 1 〇, preferably. Not more than 8, better. 5. Under the immersion in water, the antistatic property is rarely reduced. The laminate can be used after washing with water C: \ProgramFiles\Patent\310689.ptd Page 34 1248872 V. INSTRUCTIONS (29) Reuse and environment that may be wetted by water. The laminate of the present invention has excellent molding properties, wherein the invention is high After the antistatic laminate is stretched by 150%, the conductive layer has a surface resistance (RS2) to RSG ratio (RS2/RSG) of preferably not more than 10 at 25 ° C and a relative humidity of 15%, more preferably Not more than 8, the best one 5. The stretching in the molding hardly reduces the antistatic property. The laminated sheet of the present invention also has excellent heat resistance, wherein the high antistatic laminated sheet of the present invention is placed in 2 After heating at 50 °C for one minute, the ratio of surface resistance (RS9) to RSG (RSq/RSq) of the conductive layer at 25 ° C and relative humidity of 15% is preferably not more than 5.0, more preferably not more than 3.0. The heat used for molding hardly reduces the antistatic property. The high antistatic laminate of the present invention preferably has a basis of not less than 75%, more preferably not less than 80%, measured according to j IS 71 0 5 , And the best is not less than 85% of visible light transmittance. By setting the visible light transmittance to not less than 75 %, when the high antistatic laminate sheet is used as a packaging material, the content can be easily visually determined, automatically monitored by a TV camera, followed by bar code processing of the contents, etc. The high antistatic stack of the present invention The conductive layer contained in the layer preferably has a visible light transmittance of not less than 75%, more preferably not less than 80%, and preferably not less than 85 %, as measured according to J IS 71 05. For a conductive layer having high visible light transmittance, a substrate having a slightly lower visible light transmittance and a translucent substrate can also be used, which increases the kind of usable substrate. In the optical monitoring of the contents mentioned above, it is necessary to apply surface matte treatment or the like to prevent malfunction. High visible light transmittance can make up for the lack of light processing

C:\ProgramFiles\Patent\310689.ptd 第 35 頁 1248872 五、發明說明(30) 可見光透光率之減低。 量 導電層的可見光透光率(X )可經由測量高抗靜電性疊 層片的可見光透光率(Z)與基材的可見光透光率,及從 關係式ζ=χγ而粗略地計算而得。基材的可見光透光率可經 由用溶劑等將該高抗靜電性疊層片的導電層予以膨脹,以 刮除等移除彼等,而對剩餘物進行測量而測得。於經無光 處理時,可以施用具有與測量目標物所具幾乎相同的折射 指數且不能侵入該目標物之適當溶劑於表面後再完成測 性 再者,本發明高抗靜電性疊層片較佳者具有不大於 ’更佳者不大於3· 0之濁度,且該疊層片具有良好透光 含有導電層其具有不大於1〇11 Ω/□的,不大於1〇 的RSyRS。,及不大於之高抗靜電性疊層片,可 經由使用上文所提含有導電性聚合物和熱塑性聚合物的組 成物作為導電層組成物來形成塗層並將該塗層硬化,及以 其它方法而製得。 , 本發明高抗靜電性疊層片在浸水後和成型後,於低濕 度下具有優良的抗靜電性質,透明性和抗封阻性。所以, 其f合作為高抗靜電性疊層片以用於載體膠帶,容器(特 別是托盤),軟片盒,包裝材料,IC卡等中用來保護電子 ^料例如1C,LSI ,矽晶圓,硬碟,液晶基材,電子零件 等,使彼等在貯存,輸送與裝置期間,不會因靜電致 破壞和黏附灰塵等。 1248872C:\ProgramFiles\Patent\310689.ptd Page 35 1248872 V. INSTRUCTIONS (30) Reduction of visible light transmittance. The visible light transmittance (X) of the conductive layer can be roughly calculated by measuring the visible light transmittance (Z) of the high antistatic laminate and the visible light transmittance of the substrate, and from the relationship ζ=χγ. Got it. The visible light transmittance of the substrate can be measured by expanding the conductive layer of the high antistatic laminate sheet with a solvent or the like, removing it by scraping or the like, and measuring the residue. In the case of matte treatment, it is possible to apply a suitable solvent having a refractive index almost the same as that of the measurement target and incapable of invading the target to complete the measurement after the surface, and the high antistatic laminate of the present invention is more Preferably, the laminate has a turbidity of not more than 'better than 3. 0, and the laminate has a good light transmission and contains a conductive layer having a RSyRS of not more than 1 〇 11 Ω/□ and not more than 1 Å. And a high antistatic laminate of not more than, the coating layer can be formed and cured by using the composition containing the conductive polymer and the thermoplastic polymer as described above as a conductive layer composition, and Made by other methods. The high antistatic laminate of the present invention has excellent antistatic properties, transparency and blocking resistance at low humidity after immersion in water and after molding. Therefore, it is a high antistatic laminate for use in carrier tapes, containers (especially trays), film cassettes, packaging materials, IC cards, etc. to protect electronic materials such as 1C, LSI, 矽 wafers. , hard disk, liquid crystal substrate, electronic parts, etc., so that they will not damage and adhere to dust due to static electricity during storage, transportation and installation. 1248872

於電子零件所用托盤與載體膠帶 樹脂成型及在其上形成一導雷屉私几 』以无將 地歧分你故:二成層。較佳者為將包括-熱塑 ?η雙高抗靜電性叠層片予以壓製(如,在“ο 二:)。本發明高抗靜電性叠層片於該導電層 :::或:除t,幾乎不會因為拉伸和加熱而使抗靜電性 ::低’使得可以經由壓縮成型而得到合意的托盤或載體 =於電子零件所用托盤時,本發明高抗靜電性疊層片 係經壓縮形成一凹洞(加工部份)及一在具外周緣上的突 子零件利托盤的情況中,該突緣的導電層在25 C,相對濕度15%下所具表面電阻(RS3)係不大於ι〇ηΩ/ □:較佳者不大於1〇ι〇 Ω / □,更佳者1〇9 Ω / □。因此,其 顯示出低濕度下優良的抗靜電性質。 、 J =盤浸潰於心純水中一小時之後,緣所含 導電層在25 C ’相對濕度15%下之表面電阻叫)對之比 例(RSj/RS3)係不大於10,較佳者不大於8 ,更佳者不大於 5。在浸水幾乎不引起抗靜電性質的減低之下,使其可以 用於與水洗後重複使用及可能被水濕潤相同聯之環境中。 對於具有相當於突緣厚度的〇·5至〇7倍厚度之凹洞, 其所含導電層在25 °C,相對濕度15%下之表面電阻(RS RS3之比例(RSs/RS3)係不大於1〇〇,較佳者不大於8〇,5更佳 者不大於50。所以,在壓縮成型中因為拉伸或加埶 靜電性質的減低係小者。 …π π沉 當本發明高抗靜電性壘層片係作為電子零件所用載艘For the trays and carrier tapes used in electronic parts, the resin is molded and a guide bar is formed on it to distinguish it from the ground. Preferably, the laminate comprising the - thermoplastic η double high antistatic laminate is pressed (eg, in "O2:"). The high antistatic laminate of the present invention is on the conductive layer::: or: t, almost no antistatic property due to stretching and heating:: low' makes it possible to obtain a desired tray or carrier via compression molding = when the tray for electronic parts is used, the high antistatic laminated sheet of the present invention is Compressed to form a cavity (machined portion) and a bumper part of the outer peripheral edge of the tray, the conductive layer of the flange has a surface resistance (RS3) at 25 C and a relative humidity of 15%. Not more than ι〇ηΩ/ □: preferably not more than 1〇ι〇Ω / □, more preferably 1〇9 Ω / □. Therefore, it exhibits excellent antistatic properties at low humidity. J = Dip After one hour of crushing in the pure water, the ratio of the surface resistance of the conductive layer containing the conductive layer at 15 C 'relative humidity of 15% is not more than 10, preferably not more than 8, and more preferably The best is no more than 5. Under the immersion of water, it does not cause the antistatic property to be reduced, so that it can be used repeatedly after washing with water. It may be wetted by water in the same environment. For a cavity with a thickness equivalent to the thickness of the flange of 〇·5 to 〇7 times, the surface resistance of the conductive layer contained at 25 °C and relative humidity of 15% (RS) The ratio of RS3 (RSs/RS3) is not more than 1〇〇, preferably not more than 8〇, and 5 is better than 50. Therefore, in compression molding, the reduction in static properties due to stretching or twisting is small. ...π π sinking when the high antistatic barrier layer of the invention is used as a carrier for electronic parts

12488721248872

膠帶時’係將本發明高抗靜電性疊層片壓縮形成眾多凹洞 (加工部份),以封裝沿著縱向配置之電子零件,及一在其 外部周緣之突緣。於電子零件所用載體膠帶的情況中,該 突緣所含導電層在25 °C,相對濕度15%下所具表面電阻 (RS6)係不大於1〇ηΩ/□,較佳者不大於ioigq/口,更佳 者ΙΟ9 Ω/□。因此,其顯示出在低濕度下的優良抗靜電性 質。 在將該載體帶浸於4 0 °C純水中一小時之後,該突緣所 含導電層在25C ’相對濕度15%下之表面電阻(rs7)對反86的 比例(RSVRS6)係不大於1〇,較佳者不大於8,更佳者不大 於5。於浸水很少引起抗靜電性的減低之下,使其可用於 與水洗後重複使用及可能被水濕潤之環境中。 對於具有相當於突緣厚度的〇· 5至〇· 7倍厚度之凹洞, 該凹洞所含導電層在25 °C,相對濕度15%下之表面電阻 (RSs)對RSe之比例(RS^/RSe)係不大於1〇〇,較佳者不大於 80,更佳者不大於50❶所以,在壓縮成型中因拉伸或加熱 所致抗靜電性質的減低係小者。 當本發明高抗靜電性疊層片用為包裝材料,特別是防 護性包裝材料,如第1圖中所示者,其包括例如一對夾置 著物件3例如電子零件等的拉伸膜2,和一對相對該拉伸膜 2的末端,且係固定在容器丨之内(於第1圖中,彼等末端係 由框5所固定)。本發明高抗靜電性疊層片可用為拉 , 2 〇 當本發明高抗靜電性疊層片用為載體膠帶、托盤、軟In the case of the tape, the high antistatic laminate of the present invention is compressed to form a plurality of cavities (processed portions) for encapsulating the electronic components disposed along the longitudinal direction and a flange at the outer periphery thereof. In the case of a carrier tape for an electronic component, the conductive layer of the flange has a surface resistance (RS6) of not more than 1 〇 Ω / □ at 25 ° C and a relative humidity of 15%, preferably not more than ioigq / The mouth is better, ΙΟ9 Ω/□. Therefore, it exhibits excellent antistatic properties at low humidity. After the carrier tape is immersed in pure water at 40 ° C for one hour, the ratio of the surface resistance (rs7) to the anti-86 (RSVRS6) of the conductive layer contained in the flange at 25 C 'relative humidity of 15% is not more than 1〇, preferably no more than 8, and more preferably no more than 5. Under the circumstance that water immersion rarely causes antistatic property, it can be used in an environment that is reused after washing and may be wetted by water. For a pit having a thickness corresponding to the thickness of the flange of 〇·5 to 〇·7 times, the ratio of surface resistance (RSs) to RSe of the conductive layer containing the conductive layer at 25 ° C and relative humidity of 15% (RS ^/RSe) is not more than 1 〇〇, preferably not more than 80, and more preferably not more than 50 Å. Therefore, the reduction in antistatic properties due to stretching or heating in compression molding is small. When the high antistatic laminate of the present invention is used as a packaging material, particularly a protective packaging material, as shown in FIG. 1, it includes, for example, a pair of stretched films 2 sandwiching an article 3 such as an electronic component or the like. And a pair of opposite ends of the stretched film 2, and are fixed in the container (in the first figure, the ends are fixed by the frame 5). The high antistatic laminate of the invention can be used for pulling, 2 〇 when the high antistatic laminate of the invention is used as carrier tape, tray, soft

1248872 五、發明說明(33) 片盒、包裝材料、1C卡等所用基材時,其具有在浸水後與 成型後的低濕度下優良抗靜電性,且可以在水洗後重複使 用’係因為成型後的凹洞所具抗靜電性幾乎不會減低之 故。 本發明於下文藉由實施例予以更詳細地解說,但本發 明不受限於彼等實施例。在本發明中使用到的評估方法要 在下面闞示。 1·濁度 根據JIS K 7105,係使用NIPPON DENSHOKU所製的溫 度計1 0 01 DP測定濁度。 2·表面電阻(rs。,RS3,RS6) 高抗靜電性疊層片所含導電層(於托盤和載體膠帶的 情況中為突緣所含導電層)係經由使用TAKEDA RIKEN所製 表面電阻計,在500伏的電壓,25°C,15%RH下測定的。 有關托盤和載體膠帶,其具有相當於突緣厚度的0.5 至〇·7倍厚度之凹洞所含導電層之表面電阻(RS5,rs8),係 在25 °c,相對濕度15%下測定為1,且測定出對(rs3,rs6) 之諸比例(RS5/RS3,RS8/RS6)。 有關托盤與載體膠帶,突緣和凹洞所具厚度係用數位 式厚度計予以確定並測量其表面電阻。以5點的平均厚度 計算厚度和表面電阻。 3·導電層的抗水性(表面電阻之變異) 將高抗靜電性疊層片,托盤或載體膠帶浸於40 °C純水 中一小時後,在25 t,1 5%RH下測量導電層(於托盤和載體1248872 V. INSTRUCTIONS (33) When using a substrate for a cassette, a packaging material, a 1C card, etc., it has excellent antistatic property after immersion in water and low humidity after molding, and can be reused after washing. The anti-static properties of the rear cavity are hardly reduced. The invention is explained in more detail below by way of examples, but the invention is not limited to the examples. The evaluation methods used in the present invention are shown below. 1. Turbidity According to JIS K 7105, the turbidity was measured using a temperature meter 10 01 DP manufactured by NIPPON DENSHOKU. 2. Surface resistance (rs., RS3, RS6) The conductive layer contained in the high antistatic laminate (the conductive layer contained in the flange in the case of the tray and the carrier tape) is a surface resistance meter manufactured by using TAKEDA RIKEN , measured at 500 volts, 25 ° C, 15% RH. The surface resistance (RS5, rs8) of the conductive layer contained in the pit and the carrier tape having a thickness corresponding to a thickness of 0.5 to 7 times the thickness of the flange is measured at 25 ° C and a relative humidity of 15%. 1, and the ratio of (rs3, rs6) (RS5/RS3, RS8/RS6) is determined. For pallets and carrier tapes, the thickness of the flanges and cavities is determined by a digital thickness gauge and the surface resistance is measured. The thickness and surface resistance were calculated from the average thickness of 5 points. 3. Water resistance of the conductive layer (variation of surface resistance) After immersing the high antistatic laminate sheet, tray or carrier tape in pure water at 40 ° C for one hour, measuring the conductive layer at 25 t, 1 5% RH (on tray and carrier

C:\ProgramFiles\Patent\310689.ptd 第 39 頁 1248872 五、發明說明(34) 膠帶的情況中為突緣所含導電層)之表面電阻(Rs ,RS , RS7)。經由相對於浸潰前導電層所具表面電阻(R&amp; ,, RS6)之比例(RSi/RS。,rs4/rs3,rs7/rs6)評估抗水^生。3 4. 伸長後表面電阻之變異 使用TOYO SEIKI所製雙轴定向裝置,在氮氣壓,預埶 時間15秒和拉張速率5米1分之下將高抗靜電性#層# (92 毫米X 92毫米)單轴拉伸150%。此時基材I ,π ^ li ,瓜,ιν 和 V 的溫度分別為 110°C,130°C,ll〇°C,i5(r(:。 在25°C ’ 15%RH下測定拉伸後導電層所具表面電阻 (RS2),並得到對拉伸前導電層所具表面電阻(Κ\)之比例 (RS2/RS。)。 〇 5. 抗封阻性 將高抗靜電性疊層片所含導電層與另一高抗靜^## 層片的基材背面(沒有導電層的側面)於40 °c,80%RH下番 置在一起,並施加100克/平方厘米之荷重。將叠層片靜置 24小時後將兩樣品剝開。依下面的準則進行評估 於剝開中沒有阻力:〇 於剝開中有某些程度的阻力:△C:\ProgramFiles\Patent\310689.ptd Page 39 1248872 V. INSTRUCTIONS (34) In the case of tape, the surface resistance (Rs, RS, RS7) of the conductive layer contained in the flange. The water resistance was evaluated by the ratio of the surface resistance (R&amp;, RS6) (RSi/RS., rs4/rs3, rs7/rs6) with respect to the pre-impregnation conductive layer. 3 4. Variation of surface resistance after elongation using a biaxial orientation device made by TOYO SEIKI, high antistatic property #层# (92 mm X) under nitrogen pressure, pre-twist time 15 seconds and tensile rate 5 m 1 min. 92 mm) uniaxial stretching 150%. At this time, the temperatures of the substrates I, π ^ li , melon, ιν and V were 110 ° C, 130 ° C, ll 〇 ° C, i 5 (r (:.) The tensile measurement was measured at 25 ° C '15% RH. The back conductive layer has a surface resistance (RS2) and a ratio of surface resistance (Κ\) to the conductive layer before stretching (RS2/RS.) 〇 5. Anti-blocking property will be high antistatic laminate The conductive layer contained in the sheet and the back surface of the substrate of another high anti-static layer (the side without the conductive layer) are placed together at 40 ° C, 80% RH, and a load of 100 g/cm 2 is applied. After the laminate was allowed to stand for 24 hours, the two samples were peeled off. The evaluation was carried out according to the following criteria: no resistance in the peeling: there was some resistance in the peeling: △

於剝開中有顯著的阻力:X 合成實施例1 :續酸化聚苯胺之合成及其水/醇溶液 (Paq)之製備 將2-胺基甲氧苯-4-磺酸(1〇〇毫莫耳)經由在23。(:銨水 溶液(4莫耳/升)中攪拌予以溶解’並滴加過氧二硫酸錢 (100毫莫耳)水溶液。於滴加完畢後,再於23 下進一步Significant resistance in stripping: X Synthesis Example 1: Synthesis of acidified polyaniline and preparation of its water/alcohol solution (Paq) 2-Aminomethoxybenzene-4-sulfonic acid (1 〇〇 Mohr) via at 23. (: Ammonium water solution (4 mol/L) was stirred and dissolved' and a peroxydisulfate (100 mmol) aqueous solution was added dropwise. After the addition was completed, further at 23

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五、發明說明(35) 時蔣渡出反應產物,洗清及乾燥而得粉末 狀聚〇物(13克)。將上述聚合物(3重量份數) μ 下於硫酸水溶液(〇·3莫耳/升,1〇〇重詈卜叙、 良勝 ^ ^ iUU篁量伤數)内攪拌溶解 付κ酸化聚本胺。此時,磺酸化聚苯胺的磺 人 100% ^將上述磺酸化聚苯胺(2重量份數)溶解在水£3〇重量 和異丙醇(5〇重量份數)的混合物中而得水/醇溶液 _(A)之合成及 合成實施例2 :含續酸鹽基的共聚合聚 其水/醇分散液(Aaq)之製備V. INSTRUCTIONS (35) When Jiang took out the reaction product, it was washed and dried to obtain a powdery polybenzate (13 g). The above polymer (3 parts by weight) μ was stirred and dissolved in an aqueous solution of sulfuric acid (〇·3 mol/liter, 1〇〇重詈卜, 良胜^^iUU篁), and the κ acidified polyamine was stirred and dissolved. . At this time, the sulfonated polyaniline sulfonate 100% ^ The above sulfonated polyaniline (2 parts by weight) was dissolved in a mixture of water and isopropyl alcohol (5 parts by weight) to obtain water / Synthesis and Synthesis of Alcohol Solution_(A) Example 2: Preparation of Co-Polymerized Poly(Hydrohydrate/Alcohol Dispersion (Aaq)

以下面的方法合成含有磺酸鹽基的共聚合聚酯且 述製備其分散液。有關其二羧酸成分,係使用對苯二 -二甲醋(48莫耳%),間苯二甲酸二甲輯(48莫耳%)和5酸 酸基間苯二甲酸鈉(4莫耳%),且有關其乙二醇成分只 ==醇(80莫耳%)和二甘醇(2〇莫耳%)以習用方法進行輯 交換反應和縮合聚合反應。所得含有磺酸鹽基的共聚合 酯具有61 °C之玻璃轉變溫度。將此含磺酸鹽基之^聚: 酯( 30 0份)和正丁基赛珞蘇(15〇份)加熱攪拌而得黏稠溶 液。於其中慢慢地攪拌加入水(5 50份)而得固體含量為3〇 重量%的均勻蒼白色水分散液。將此分散液加到等量水和The copolymerized polyester containing a sulfonate group was synthesized in the following manner and a dispersion thereof was prepared. Regarding its dicarboxylic acid component, p-phenylene-dimethyl vinegar (48 mol%), isophthalic acid dimethyl series (48 mol%) and sodium 5-acid isophthalate (4 mol%) were used. And, regarding its ethylene glycol component, only == alcohol (80 mol%) and diethylene glycol (2 mol%) are subjected to a conventional exchange reaction and a condensation polymerization reaction. The resulting sulfonate group-containing copolymerized ester had a glass transition temperature of 61 °C. The sulfonate-containing poly(ester) ester (30 parts) and n-butyl cyanidin (15 parts) were heated and stirred to obtain a viscous solution. Water (5 50 parts) was slowly stirred thereinto to give a uniform pale aqueous dispersion having a solid content of 3% by weight. Add this dispersion to the same amount of water and

異丙醇的混合物中而得固體含量為8重量%的含磺酸鹽基之 共聚合聚酯水分散液(Aaq)。 合成實施例3 :接枝聚酯(B)之合成與其水分散液 (Baq)之製備 於裝有一攪拌器,一溫度計和一部份自流冷凝器的不A sulfonate group-containing copolymerized polyester aqueous dispersion (Aaq) having a solid content of 8% by weight was obtained in a mixture of isopropyl alcohol. Synthesis Example 3: Synthesis of grafted polyester (B) and preparation of its aqueous dispersion (Baq) without a stirrer, a thermometer and a partial self-flow condenser

1248872 五、發明說明(36) 錄鋼熱壓器中’裝滿對苯·一甲酸一甲醋(5莫耳),間苯二 甲酸二甲酯(4.5莫耳),乙二醇(6.5莫耳),1,3-丙二醇 (3.5莫耳)和鈦酸四正丁酯(〇·〇〇2莫耳),並在160 °C至220 °C下進行酯交換反應4小時。然後,加入反丁烯二酸(0 . 5 莫耳)並於一小時期間將混合物從20 0 °C加熱到220 °C。將 反應系統逐漸減壓,並在〇· 2mmHg減壓下使混合物反應1. 5 小時而得聚酯(Bo)。1248872 V. Description of invention (36) Recording steel autoclave 'filled with p-benzoic acid-methyl ketone (5 m), dimethyl isophthalate (4.5 m), ethylene glycol (6.5 m Ear), 1,3-propanediol (3.5 mol) and tetra-n-butyl titanate (〇·〇〇2 mol), and transesterification at 160 ° C to 220 ° C for 4 hours. Then, fumaric acid (0.5 mol) was added and the mixture was heated from 20 ° C to 220 ° C over one hour. The reaction system was gradually depressurized, and the mixture was reacted for 1.5 hours under a reduced pressure of 2 mmHg to obtain a polyester (Bo).

然後,於裝有一攪拌器,一溫度計,一回流裝置與一 全量過濾裝置的反應器内,裝滿上述聚酯(Bo)( 300份), 丁酮( 360份)和異丙醇(120份),並將混合物加熱攪拌以在 回流下溶解該樹脂。當樹脂完全溶解時,將順丁烯二酸 (25份),丙烯酸乙酯(65份)和辛硫醇(1.5份)的混合物, 與溶於丁酮(90份)和異丙醇(30份)混合物中的偶氮雙異丁 腈(6份)溶液,於1 · 5小時期間分別滴加到聚酯溶液内,接 著反應3小時以得接枝聚合物(B)溶液。將此接枝聚合物溶 液冷卻到室溫並加入三乙胺(59份)以進行中和。然後,加 入離子交換水(800份)並攪拌混合物30分鐘。加熱該混合 物以脫除殘餘溶劑而得水分散液。將此分散液加到水和異 丙醇的等量混合物中而得固體含量為8重量!^之醇/水分散 液(Baq)。 合成實施例4 :含有聚乙烯醇/聚異氟酸酯水溶液交聯 劑的水分散液(Caq)之製備Then, in a reactor equipped with a stirrer, a thermometer, a reflux device and a full amount of filtration device, the above polyester (Bo) (300 parts), butanone (360 parts) and isopropanol (120 parts) are filled. And the mixture was heated and stirred to dissolve the resin under reflux. When the resin is completely dissolved, a mixture of maleic acid (25 parts), ethyl acrylate (65 parts) and octyl mercaptan (1.5 parts) is dissolved in butanone (90 parts) and isopropanol (30). A solution of azobisisobutyronitrile (6 parts) in the mixture was added dropwise to the polyester solution over a period of 1.5 hours, followed by a reaction for 3 hours to obtain a graft polymer (B) solution. The graft polymer solution was cooled to room temperature and triethylamine (59 parts) was added for neutralization. Then, ion-exchanged water (800 parts) was added and the mixture was stirred for 30 minutes. The mixture is heated to remove residual solvent to obtain an aqueous dispersion. This dispersion was added to an equal mixture of water and isopropyl alcohol to give an alcohol/water dispersion (Baq) having a solid content of 8 wt. Synthesis Example 4: Preparation of aqueous dispersion (Caq) containing a polyvinyl alcohol/polyisofluoride aqueous solution crosslinking agent

製備10%聚乙烯醇(皂化百分率98%)水溶液,並於其中 每100重量份數聚乙烯醇固體含量,加入ELASTR0NPrepare an aqueous solution of 10% polyvinyl alcohol (saponification percentage 98%), and add ELASTR0N per 100 parts by weight of polyvinyl alcohol solid content.

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1248872 五、發明說明(37) --- BN6 9(10重量份數,第一工業製藥所製)而得含聚乙歸醇/ 交聯劑之水分散液(Caq)。 合成實施例5 :基材板之製備 諸實施例中所用的基材板為下文所列者,其製備方I 亦如下所述。 ' [基材板I ] 將PET(聚對苯二曱酸乙二醇酯)在290 °C下熔融擠壓及 在3 0 °C冷卻輥上冷卻,而得500微米厚之未經定向拉伸 板。該板係用為基材板I 。可見光透光率為95%。 [基材板Π ] 將PEN(聚萘二甲酸乙二醇酯)在300 °C下溶融擠壓及在 3 0 °C冷卻輥上冷卻,而得5 0 0微米厚的未經定向拉伸板。 該板係用為基材板E。可見光透光率94%。 [基材板瓜] 將聚對苯二甲酸乙二醇酯中30莫耳%乙二醇成分以環 己烷二甲醇取代之共聚物,在290 °C熔融擠壓並在30 °C冷 卻輥上冷卻,而得500微米厚的未經定向拉伸板。該板係 用為基材板(1)。可見光透光率9 5%。 [基材板IV] 將聚苯二甲酸乙二醇酯所含3〇莫耳%乙二醇成分以新 戊二醇取代之共聚物,在290 °C熔融擠壓並在30 °C冷卻輥 上冷卻,而得500微米厚之未經定向拉伸板。此板係用為 基材板IV。可見光透光率95%。 [基材板V ]1248872 V. Inventive Note (37) --- BN6 9 (10 parts by weight, manufactured by Daiichi Kogyo Co., Ltd.) obtained an aqueous dispersion (Caq) containing polyglycol/crosslinking agent. Synthesis Example 5: Preparation of substrate sheet The substrate sheets used in the examples are listed below, and the preparation I thereof is also as follows. '[Substrate plate I ] PET (polyethylene terephthalate) was melt extruded at 290 ° C and cooled on a chill roll at 30 ° C to obtain a 500 μm thick unoriented pull. Stretch the board. This board is used as a substrate sheet I. The visible light transmittance was 95%. [Substrate plate Π] PEN (polyethylene naphthalate) was melt-extruded at 300 ° C and cooled on a cooling roll at 30 ° C to obtain a 500 μm thick unoriented stretch. board. This board is used as a substrate sheet E. The visible light transmittance is 94%. [Substrate sheet melon] A copolymer of 30 mol % ethylene glycol in polyethylene terephthalate substituted with cyclohexane dimethanol, melt extruded at 290 ° C and cooled at 30 ° C It was cooled to obtain a 500 micrometer thick unoriented stretched plate. This board is used as a substrate board (1). The visible light transmittance is 9 5%. [Substrate plate IV] A copolymer of 3 〇 mol % ethylene glycol component of polyethylene terephthalate substituted with neopentyl glycol, melt extruded at 290 ° C and a cooling roll at 30 ° C It was cooled to obtain a 500 micrometer thick unoriented stretched plate. This board is used as a substrate sheet IV. The visible light transmittance is 95%. [Substrate plate V ]

1248872 五、發明說明(38) 將聚碳酸酯在290 °C熔融擠壓並在30 °C冷卻輥上冷卻 而得50 0微米厚的未經定向拉伸板。此板係用為基材板 V。可見光透光率95%。 實施例卜1至1 -5 將合成實施例1中所得磺酸化聚苯胺溶液(paq)與合成 實施例2中所得含磺酸鹽基共聚合聚酯分散液(Aaq)以 2 0/80的固體比例(重量比例)混合,將非離子性界面活性 劑Emulgen810(花王公司所製)以對磺酸化聚苯胺溶液 (Paq)呈8/1 00重量比例加入,及將聚乙烯醇/聚異氱酸酯 水溶液^交聯劑水分散液(Caq)以對分散液(Aag)呈2 0 / 1 0 0的 .,固體比例(重量比例)加入,而得本實施例之塗覆液體。 將上文所提塗覆液體以〇 ♦ 5克/平方米之固體濃液塗佈 到基材板I 、Ε、Π、ιν和V之上,並用70°C熱空氣予以 乾燥。這#板的評估結果皆列於表1之中。 實施例2 -1至2 - 5 除了使用合成實施例3中所得接枝聚酯分散液(Baq)取 代為合成實施例2中所得分散故(a aqi)之外,以實施例1中 之相同方式而製備一塗覆液體。 將上述塗覆液體以〇· 5克/平方米之固體濃度塗佈到基 材板工〜^^皿〜:^和又之上’並用”它熱空氣予以乾 燥。這些板的評估結果皆列於表1之中。 實施例3-1至3-5 除了使用甘油聚縮水甘油基醚取代γ合成實施例4中 所得水分散液(Caq),且該甘油聚縮水甘油基醚係經添加1248872 V. INSTRUCTIONS (38) The polycarbonate was melt extruded at 290 ° C and cooled on a 30 ° C cooling roll to obtain a 50 μm thick unoriented stretched plate. This board is used as a substrate sheet V. The visible light transmittance is 95%. EXAMPLES 1 to 1-5 The sulfonated polyaniline solution (paq) obtained in Synthesis Example 1 and the sulfonate-containing copolymerized polyester dispersion (Aaq) obtained in Synthesis Example 2 were treated at 20/80. The solid ratio (weight ratio) was mixed, and the nonionic surfactant Emulgen 810 (manufactured by Kao Corporation) was added in a ratio of 8/100 by weight to the sulfonated polyaniline solution (Paq), and the polyvinyl alcohol/polyisophthalide was added. The aqueous acid ester solution/crosslinking agent aqueous dispersion (Caq) was added to the dispersion (Aag) at a ratio of 20% to 100%, and the solid ratio (weight ratio) was added to obtain a coating liquid of the present example. The above-mentioned coating liquid was applied to a substrate plate of I, Ε, Π, ιν and V at a solid dope of ♦ 5 g/m 2 and dried with hot air at 70 °C. The evaluation results of this # board are listed in Table 1. Example 2 -1 to 2 - 5 The same as in Example 1 except that the graft polyester dispersion (Baq) obtained in Synthesis Example 3 was used instead of the dispersion obtained in Synthesis Example 2 (a aqi) A coating liquid is prepared in a manner. The above coating liquid is applied to the substrate plater at a solid concentration of 〇·5 g/m 2 to the substrate plate ^^^ and above and used to dry it with hot air. The evaluation results of these plates are listed. In Table 1. Examples 3-1 to 3-5 except that glycerol polyglycidyl ether was used in place of γ to synthesize the aqueous dispersion (Caq) obtained in Example 4, and the glycerol polyglycidyl ether was added.

C:\ProgramFiles\Patent\310689.ptd 第 44 頁 1248872 五、發明說明(39) 使其對合成實施例2中所得分散液(Aaq)之固體比例(重量 比例)為2/1 00,以實施例1中的相同方式而製備一塗覆液 膊上述塗覆液體以0 · 5克/平方米之固體濃度塗佈到基 材板I 、Ε、Π、ΐν和V之上,並用70°C熱空氣予以乾 燥。這些板的評估結果皆列於表1之中。 實施例4_1至4-5 將合成實施例1中所得磺酸化聚苯胺溶液(paq),合成 實施例2中所得含磺酸鹽基共聚合聚酯分散液(Aaq)和 SUMIMAL M-30W(甲基化三聚氱胺樹脂,住友化學工業有限 公司所製),以10/85/5的固體比例(重量比例)混合後加到 一混合溶劑(水/異丙醇=50/ 50 (重量比例))之中,而得具 有2至5 %固髏濃度之溶液。於此溶液中加入Mega fac F-142DC氟界面活性劑,為大日本油墨化學工業所製),其 比例為0.08重量%,而得一塗覆液體。 將上述塗覆液體以0.3克/平方米之固體濃度塗佈在基 材板I 、Ε、Π、ΐν和V之上,並用7〇°C熱空氣予以乾 燥。這些板的評估結果皆列於表1之中。 比較實施例1,2 除了不加入合成實施例4中所得水分散液(Caq)之外, 以實施例1和2中的相同方式製得一塗覆液體,用該液體以 實施例1,2中的相同方式製備一板。 比較f施例3 除了不加入甘油聚縮水甘油基鍵之外,以實施例3中C:\ProgramFiles\Patent\310689.ptd Page 44 1248872 V. Description of Invention (39) The solid ratio (weight ratio) of the dispersion (Aaq) obtained in Synthesis Example 2 was 2/100 00 to carry out A coating liquid was prepared in the same manner as in Example 1 and the above coating liquid was applied to the substrate sheets I, Ε, Π, ΐν and V at a solid concentration of 0.5 g/m 2 and used at 70 ° C. Hot air is dried. The evaluation results of these plates are listed in Table 1. Examples 4_1 to 4-5 The sulfonated polyaniline solution (paq) obtained in Synthesis Example 1 was synthesized, and the sulfonate-containing copolymerized polyester dispersion (Aaq) and SUMIMAL M-30W obtained in Synthesis Example 2 were synthesized. The basic trimeric guanamine resin, manufactured by Sumitomo Chemical Industries Co., Ltd., is mixed in a solid ratio of 10/85/5 (weight ratio) and added to a mixed solvent (water/isopropanol = 50/50 (weight ratio) Among them, a solution having a solid concentration of 2 to 5% is obtained. To this solution, Mega fac F-142DC fluorosurfactant (manufactured by Dainippon Ink Chemical Industry Co., Ltd.) was added in a ratio of 0.08% by weight to obtain a coating liquid. The above coating liquid was coated on the substrate plates I, Ε, Π, ΐν and V at a solid concentration of 0.3 g/m 2 and dried with hot air of 7 ° C. The evaluation results of these plates are listed in Table 1. Comparative Example 1, 2 A coating liquid was prepared in the same manner as in Examples 1 and 2 except that the aqueous dispersion (Caq) obtained in Synthesis Example 4 was not added, and the liquid was used as Example 1, 2 A plate was prepared in the same manner as in the middle. Comparative Example 3 except that the glycerol polyglycidyl bond was not added, in Example 3

C:\ProgramFiles\Patent\310689.ptd 第 45 頁 1248872 五、發明說明(40) \ 的相同方式製得一塗覆液體,用該液體以實施例1,2中的 相同方式製備一板。 這些板的評估結果皆列於表1之中。 表1 基材 RS〇 RSi RSi/RSo RS. RS2/RS〇 V.L.T.* 濁度 抗封 阻性 Μ I 3.7 X 108 9.3 XIO8 2.5 9.6 XIO8 2.6 88% 2.8 0 1-2 Π 2.6 x 10s 4.2 xiO8 1.6 5.7 xiO8 2.2 87% 2.5 Ο 1-3 m 4.5 X108 1.1 XIO9 2.5 1.5X109 3.4 87% 2 ο 1-4 IV 3.8 X103 1.1 XIO9 3 1X109 2.7 88% 2.3 0 1-5 V 3.5 x 10s 9.5 XIO8 2.7 9.1 XIO8 2.6 88% 2.2 0 2-1 I lx 10s. 1.8X108 1.8 2.1 xiO8 2.1 89% 2.8 ο 2-2 π 1.1 xiO8 1.7X108 1.5 2.9 x 10s 2.6 89% 2.9 0 2-3 m 1X108 1.3 XIO3 1.3 3.4 x 10s 3.4 89% 3 .0 2-4 rv 1.2 XIO8 1.4X108 1.2 3.8 x10s 3.2 89% 2.5 0 2-5 V 1.2 XIO8 1.3 xiO3 1.1 3.6X10® 3 90% 2.1 0 3-1 I 7.2 x10s 7.9 XIO8 1.1 2.9 XIO9 4 89% 2.5 0 3-2 π 6.3 x10s 8.2 XIO8 1.3 2X109 3.2 88% 2.3 0 3-3 m 7.6 xiO8 9.1 xiO3 1.2 2.1 xiO9 2.7 90% 2 0 3-4 IV 7.6 XIO8 7.6 XIO3 1 1.9 xiO9 2.5 88% 2.1 0 3-5 V 7.5X108 9 xiO8 1.2 1.9 xiO9 2.5 90% 2.4 0 4-1 I 4.2 XIO8 5.5 xiO8 1.3 1X109 2.4 88% 2.1 0 4-2 π 3 XIO8 4.5 xiO8 1.5 7.8 xiO8 2.6 -88%^ 2.3 0 4-3 in 3.4 XIO3 4.1 XIO3 1.2 1X109 3 89% 2.1 0 4-4 IV 2.9 XIO8 3.2 XIO3 1.1 6.1 xiO3 2.1 89% 2.1 0 4·5 V 2.8 XIO8 3.6 XIO8 1.3 6.2 XIO8 2.2 88% 2.2 0 比較 例1 I 2 XIO8 &gt;101S &gt;10000 4.4 X 108 2.2 89% 2.2 Λ 比較 例2 I 7.8X10® &gt;1015 &gt;10000 2 XIO9 2.5 89% 1.9 X 比較 例3 I 8xlOd &gt;1015 &gt;10000 2 XIO9 2.5 85% 1.8 Δ *V.L.T.:高抗靜電性疊層片的可見光透光率C:\ProgramFiles\Patent\310689.ptd Page 45 1248872 V. Inventive Note (40) In the same manner, a coating liquid was prepared, and a plate was prepared in the same manner as in Examples 1 and 2. The evaluation results of these plates are listed in Table 1. Table 1 Substrate RS〇RSi RSi/RSo RS. RS2/RS〇VLT* Turbidity Blocking Μ I 3.7 X 108 9.3 XIO8 2.5 9.6 XIO8 2.6 88% 2.8 0 1-2 Π 2.6 x 10s 4.2 xiO8 1.6 5.7 xiO8 2.2 87% 2.5 Ο 1-3 m 4.5 X108 1.1 XIO9 2.5 1.5X109 3.4 87% 2 ο 1-4 IV 3.8 X103 1.1 XIO9 3 1X109 2.7 88% 2.3 0 1-5 V 3.5 x 10s 9.5 XIO8 2.7 9.1 XIO8 2.6 88% 2.2 0 2-1 I lx 10s. 1.8X108 1.8 2.1 xiO8 2.1 89% 2.8 ο 2-2 π 1.1 xiO8 1.7X108 1.5 2.9 x 10s 2.6 89% 2.9 0 2-3 m 1X108 1.3 XIO3 1.3 3.4 x 10s 3.4 89% 3 .0 2-4 rv 1.2 XIO8 1.4X108 1.2 3.8 x10s 3.2 89% 2.5 0 2-5 V 1.2 XIO8 1.3 xiO3 1.1 3.6X10® 3 90% 2.1 0 3-1 I 7.2 x10s 7.9 XIO8 1.1 2.9 XIO9 4 89% 2.5 0 3-2 π 6.3 x10s 8.2 XIO8 1.3 2X109 3.2 88% 2.3 0 3-3 m 7.6 xiO8 9.1 xiO3 1.2 2.1 xiO9 2.7 90% 2 0 3-4 IV 7.6 XIO8 7.6 XIO3 1 1.9 xiO9 2.5 88% 2.1 0 3-5 V 7.5X108 9 xiO8 1.2 1.9 xiO9 2.5 90% 2.4 0 4-1 I 4.2 XIO8 5.5 xiO8 1.3 1X109 2.4 88% 2.1 0 4-2 π 3 XIO8 4.5 xiO8 1.5 7.8 xiO8 2.6 -88%^ 2.3 0 4-3 in 3.4 XIO3 4.1 XIO3 1.2 1X109 3 89% 2.1 0 4-4 IV 2.9 XI O8 3.2 XIO3 1.1 6.1 xiO3 2.1 89% 2.1 0 4·5 V 2.8 XIO8 3.6 XIO8 1.3 6.2 XIO8 2.2 88% 2.2 0 Comparative Example 1 I 2 XIO8 &gt;101S &gt;10000 4.4 X 108 2.2 89% 2.2 Λ Comparative Example 2 I 7.8X10® &gt;1015 &gt;10000 2 XIO9 2.5 89% 1.9 X Comparative Example 3 I 8xlOd &gt;1015 &gt;10000 2 XIO9 2.5 85% 1.8 Δ *VLT: visible light transmittance of high antistatic laminate

C:\ProgramFiles\Patent\310689.ptd 第 46 頁 1248872 五、發明說明(41) 實施例5 :托盤 使用三和工業株式會社所製的真空成型機(PL a VAC)於 110 °C,13秒預熱及55 °C,15秒成型諸條件下,製得具有3 列X4行凹洞(9厘米x6厘米,深4厘米)及3厘米寬突緣之 托盤。其中係使用實施例1 -1,1 - 3,2-1,3 -1,4 - 1,4-3 和4- 5中所得之板。 這些板的評估結果皆列於表2之中。 實施例6 :載體膠帶 在與托盤所用相同的成型條件下,製備具有一列凹洞 (8毫米X8毫米,深5毫米)之50厘米X50厘米扳。將一列 凹洞切成20毫米長條,其再與不同的長條接合而得一模型 載體膠帶。其中係使用實施例1-1,1-3,2-1,3-1, 4-1,4-3和4 -5中所得之板。 這些板的評估結果皆列於表3之中。 表2 托盤C:\ProgramFiles\Patent\310689.ptd Page 46 1248872 V. Description of Invention (41) Example 5: Pallet using a vacuum forming machine (PL a VAC) manufactured by Sanwa Industrial Co., Ltd. at 110 ° C for 13 seconds Preheating and 55 ° C, 15 seconds molding conditions, a tray with 3 columns of X4 rows of holes (9 cm x 6 cm, 4 cm deep) and 3 cm wide flanges. Among them, the sheets obtained in Examples 1-1, 1-3, 2-1, 3-1, 4-1,4-3 and 4-5 were used. The evaluation results of these plates are listed in Table 2. Example 6: Carrier tape A 50 cm X 50 cm plate having a row of cavities (8 mm x 8 mm, depth 5 mm) was prepared under the same molding conditions as used for the tray. A row of dimples was cut into 20 mm strips which were joined to different strips to obtain a model carrier tape. Among them, the sheets obtained in Examples 1-1, 1-3, 2-1, 3-1, 4-1,4-3 and 4-5 were used. The evaluation results of these plates are listed in Table 3. Table 2 tray

基材 rs3 rs5 RS5/RS3 厚度比例 rs4 rs4/rs3 Μ 6.00 ΧΙΟ3 4.98 ΧΙΟ9 8.3 0.64 9.60 xlO8 1.6 1-3 4.70 x10s 2.44 ΧΙΟ9 5.2 0.61 9.40 Χ108 2 2-1 3.20 ΧΙΟ8 1.34 ΧΙΟ9 4.2 0.58 3.84 ΧΙΟ3 1.2 3-1 1.10 ΧΙΟ9 6.27 ΧΙΟ9 5.7 0.6 1.54 ΧΙΟ9 1.4 4-1 5.80 ΧΙΟ8 2.6lx ΙΟ9 4.5 1 0.55 6.96 ΧΙΟ8 1.2 4-3 4.60 ΧΙΟ8 2.58 ΧΙΟ9 5.6 0.58 5.06 Χ108 1.1 4-5 5.40 ΧΙΟ8 2.97 ΧΙΟ9 5.5 0.58 9.18 Χ108 17.Substrate rs3 rs5 RS5/RS3 Thickness ratio rs4 rs4/rs3 Μ 6.00 ΧΙΟ3 4.98 ΧΙΟ9 8.3 0.64 9.60 xlO8 1.6 1-3 4.70 x10s 2.44 ΧΙΟ9 5.2 0.61 9.40 Χ108 2 2-1 3.20 ΧΙΟ8 1.34 ΧΙΟ9 4.2 0.58 3.84 ΧΙΟ3 1.2 3-1 1.10 ΧΙΟ9 6.27 ΧΙΟ9 5.7 0.6 1.54 ΧΙΟ9 1.4 4-1 5.80 ΧΙΟ8 2.6lx ΙΟ9 4.5 1 0.55 6.96 ΧΙΟ8 1.2 4-3 4.60 ΧΙΟ8 2.58 ΧΙΟ9 5.6 0.58 5.06 Χ108 1.1 4-5 5.40 ΧΙΟ8 2.97 ΧΙΟ9 5.5 0.58 9.18 Χ108 17.

C:\ProgramFiles\Patent\310689.ptd 第 47 頁 1248872 表3 五、發明說明(42) 膠帶 基材 RSs RSs rs8/rs6 厚度比例 RSy RSy/RSa 1-1 5.20 ΧΙΟ8 5.93 ΧΙΟ9 11.4 0.52 6.76 x10s 1.3 1-3 5.00 ΧΙΟ3 3.95 ΧΙΟ9 7ν9 0.6 9.00 ΧΙΟ3 1.8 2·1 3.40 x10s 1.97 ΧΙΟ9 5.8 0.55 3.74 xiO8 1.1 3-1 1.10 χιό3 9.13 ΧΙΟ8 8.3 0.52 1.32 ΧΙΟ3 1.2 4-1 5.50 ΧΙΟ8 3.74 ΧΙΟ9 6.8 0.55 6.05 ΧΙΟ8 LI 4-3 4.80 ΧΙΟ8 3.46 ΧΙΟ9 7.2 0.52 7.20 ΧΙΟ8 1.5 4-5 5.20 ΧΙΟ8 4.63 ΧΙΟ9 8.9 0.55 8.32 x10s 1.6 實施例7 :包裝材料 將聚乙烯與聚胺甲酸酯多層擠壓,並用充氣膜成型機 製得聚乙烯-聚胺甲酸酯雙層膜(各層厚度為100微米,80 微米),其用為基材板VI。 將實施例2的塗覆液體塗佈在基材板VI的聚胺甲酸酯 表面上。於充分乾燥之後,剝掉聚乙烯層而得導電性聚胺 甲酸酯膜。此膜的導電層在25 °C,1 5MH下具有2Χ109Ω/ □之表面電阻。該膜在1 50%拉伸之後於25 °C,1 5%RH下的 表面電阻為不大於101ϋΩ/(ΙΙ。 如第1圖中所示者,將此膜2用雙面膠帶黏著到一瓦楞 紙框5之上(25厘米Χ30厘米,具有一個15厘米Χ20厘米之 開口)。在膜2與兩個瓦楞紙框5之間夾置一電路基板3,並 放置在一瓦楞紙盒1之内,其方式為藉助該膜使電路基板3 保持在盒1内的空氣中。 本發明高抗靜電性疊層片具有優良的抗靜電性質,透C:\ProgramFiles\Patent\310689.ptd Page 47 1248872 Table 3 V. Description of invention (42) Tape substrate RSs RSs rs8/rs6 Thickness ratio RSy RSy/RSa 1-1 5.20 ΧΙΟ8 5.93 ΧΙΟ9 11.4 0.52 6.76 x10s 1.3 1 -3 5.00 ΧΙΟ3 3.95 ΧΙΟ9 7ν9 0.6 9.00 ΧΙΟ3 1.8 2·1 3.40 x10s 1.97 ΧΙΟ9 5.8 0.55 3.74 xiO8 1.1 3-1 1.10 χιό3 9.13 ΧΙΟ8 8.3 0.52 1.32 ΧΙΟ3 1.2 4-1 5.50 ΧΙΟ8 3.74 ΧΙΟ9 6.8 0.55 6.05 ΧΙΟ8 LI 4-3 4.80 ΧΙΟ8 3.46 ΧΙΟ9 7.2 0.52 7.20 ΧΙΟ8 1.5 4-5 5.20 ΧΙΟ8 4.63 ΧΙΟ9 8.9 0.55 8.32 x10s 1.6 Example 7: Packaging material Polyethylene and polyurethane are extruded in multiple layers and formed into a polyethylene-poly A urethane bilayer film (each layer having a thickness of 100 microns, 80 microns) was used as the substrate sheet VI. The coating liquid of Example 2 was coated on the polyurethane surface of the substrate sheet VI. After sufficiently drying, the polyethylene layer was peeled off to obtain a conductive polyurethane film. The conductive layer of this film had a surface resistance of 2 Χ 109 Ω / □ at 25 ° C, 1 5 MH. The surface resistance of the film at 150 ° C and 1 5% RH after 150% stretching is not more than 101 ϋ Ω / (ΙΙ. As shown in Fig. 1, the film 2 is adhered to the film with double-sided tape. Above the corrugated cardboard frame 5 (25 cm Χ 30 cm, having an opening of 15 cm Χ 20 cm). A circuit substrate 3 is sandwiched between the film 2 and the two corrugated cardboard frames 5, and placed in a corrugated box 1 The method is to hold the circuit substrate 3 in the air in the cartridge 1 by means of the film. The high antistatic laminate of the invention has excellent antistatic properties and is transparent.

C:\ProgramFiles\Patent\310689.ptd 第 48 頁 1248872 五、發明說明(43) 明性,抗水性及抗封阻性,係因為該導電層已經藉由一導 電性聚合物,一熱塑性聚合物與一交聯劑的反應予以硬化 之故。 本申請案係以在日本提出申請的專利申請案第 1 74 74 8/1998為基礎,其内容係於本文作為參考。 [元件符號] 1 容器 2 疊層片 3 物件 4 蓋子 框C:\ProgramFiles\Patent\310689.ptd Page 48 1248872 V. INSTRUCTIONS (43) Brightness, water resistance and blocking resistance, because the conductive layer has been made of a conductive polymer, a thermoplastic polymer The reaction with a crosslinking agent hardens. The present application is based on a patent application No. 1 74 74 8/1998 filed in Japan, the disclosure of which is incorporated herein by reference. [component symbol] 1 container 2 laminated sheet 3 object 4 lid frame

C:\Program Files\Patent\310689.ptd 第 49 頁C:\Program Files\Patent\310689.ptd Page 49

Claims (1)

1248872 〜〜第88110275號專利申請案 申請專利範圍修正本 1 一播古&gt; 4 (M年9月29 ,日j 小一二 匕括基材與豐層在該基材的至 夕 面上之導電層,該導雷 性 / θ ^導屯層包括導電性聚合物及熱塑 °,且係經交聯劑以交聯反應予以硬化者,其中 二包:生來合物係聚苯胺或其衍生物或含磺酸基聚笨 知1、其何生物,且該基材為用有機樹脂製成的膜或片。 •'申請,利範圍第1項之高抗靜電性疊層片,其中,該 導電性聚合物係可溶於水或有冑溶劑中之導電性聚合 物。 3·如申料利範圍帛Μ之高抗靜電性疊層片,其中,該 電!·生t 0物包括經燒氧基取代之胺苯續酸作為可聚 合成分。 I如申胡專利範圍帛1項之高抗靜電性疊層片,其中,該 導電性聚合&amp;包括㉟|曱氧苯石黃酸作》可聚合成分。 如申”月專利範圍第2項之高抗靜電性疊層片,其中,該 熱塑性聚合物為具有親水基之聚酯。 6·如申请專利範圍第1項之高抗靜電性疊層片,其中,該 熱塑性聚合物為經用總二羧酸成分的〇·5至15莫耳% 比例之具有親水基的二羧酸,或總二酹成分的0·5至1 5 莫耳%比例之具有親水性基的二醇,戒該兩成分共聚合 而得到之共聚合聚酯。 7·如申請專利範圍第1項之高抗靜電性疊層片,其中,該 (修正本)3] 0689 1248872 =塑性聚合物為經由用具有親水基的乙烯基單體接技 小合至聚酿而得到之接枝聚酯。 8.=申5月專利範圍第1項之高抗靜電性疊層片,其中,該 =聯劑為至少—種選自下列所組合中之成員:多官能性 :氧化合物,多官能性異氰酸酯化合物,多官能性唔唑 2合物’多官能性乙稀基化合物,多官能性丙歸酸化 :物’多官能性羧酸化合物’多官能性胺化合 能性經基化合物,與多官能性氫硫基化合物。 申”月專利範圍第i項之高抗靜電性疊層片,苴兮 導電層經由導電性聚合物或熱塑性聚合物或導電性聚/ σ物與熱塑性聚合物之自交聯而硬化。 12 =圍第1項之高抗靜電性㈣片,其中,該 ^电層更包括一界面活性劑。 U.”請專利範圍第1項之高抗靜電性疊層片,其中,該 回抗靜電性疊層片具有不大於5〇之濁度。 以 12:申請專利範圍第i項之高抗靜電性叠層片,i中咳 ;材為用選自下列所組成之材料所製成的膜或片 酉曰,聚碳酸酯,聚烯烴和聚胺曱酸酯。 α-種高抗靜電性㈣片,包括基材與經㈣ 至少一面上作為表面層之導電層 、 取人、, 等包禮包括導雷性 t合物及熱塑性聚合物,且係經 ,.^ ^ 乂聯劑以交聯劑予以硬 二 電性聚合物係聚笨胺或其衍生物或含培 膜或片, A材為用有機樹脂製成的 (修正本)310689 1248872 &quot;該‘电層具有在25 °C,相對濕度15%下不大於 1〇&quot;Ω/□之表面電阻(RS〇),及在將該高抗靜電性疊層 片浸於贼純水中一小時後,在25〇c及相對濕度15% 了 ::面電阻(叫)對RS。之比例(rs】/rs。)不大於1〇, :亥導電層更具有在將該高抗靜電性疊層片拉伸15〇% 後在25 C及相對濕度15%下之表面電阻(RS2)對RS〇 之比例(RS2/RS〇)不大於1〇。。 士申《月專利範圍帛丨或i 3項之高抗靜電性疊層#,其 係用於製造電子零件用之容器。 一 15·如申請專利範圍第14項之高抗靜電性叠層片,其中, 該電子零件用之容器為托盤。 16·如申請專利範圍第1或13項之高抗靜電性疊層片,其 係用於製造電子零件用之載體膠帶。 17.種電子令件用之托盤,其係經由將如申請專利範圍第 1或13項之高抗靜電性疊層片,其為包括基材與經疊 層在該基材的至少一面上之導電層的高抗靜電性叠層 片’予以成型而得者,該托盤包括凹洞與位於其外周緣 上之突緣, 其中該突緣之導電層具有在坑及相對濕度15% 下。不大於10&quot;Ω/□之表φ電阻(RS3),在將該托盤浸於 机純水中一小時後’該突緣之導電層在25t及相對 濕度㈣下之表面電阻(RS4)對叫之比例(rs4/叫不 大於1〇’及具有才目當於該突緣所具厚度的〇5至〇7倍 厚度之該凹洞的導電層在25t及相對濕度15%下之表 3 ^ (修正本)3】0689 1248872 m„RS3之比例(rs5/rs3)不大於ι〇〇。 a第T I 之用:裁體膠帶,係經由將如申請專利範圍 晶思/且、南抗靜電性疊層片,其為包括基材與經 且曰在該土材的至少_面上之導電層的高抗靜電性疊 層片,予以成型而得者,該載體膠帶包括眾多凹洞以封 裝沿著縱㈣置的眾多電子零件,與位於其外 之 突緣, 其中,該突緣之導電層具有在饥及相對渴度 15%T不大於1〇&quot;Ω/□之表面電阻陶,在將該載體 膠Τ /叉於40 C純水中一小時後,該突緣之導電層在υ C及相對濕度15%下之表面電阻(RS7)對队之比例 (RS7/RS6)不大於10,及具有相當於該突緣所具厚度的 〇·5至〇·7倍厚度之該凹洞的導電層在25。〔及相對濕度 I5%下之表面電阻RS6之比例(RS8/RS6)不大於 100。 19·一種防護性包裝材料,包括容器及一對拉伸膜用以承載 要包裝在彼等之間的物件,該拉伸膜具有一對經固定在 該容器内之相對末端,其中該拉伸膜係選自由根據申請 專利範圍第1或13項所述高抗靜電性疊層片所組合中 之成員。 2 0.如申請專利範圍第1或1 3項所述高抗靜電性疊層片, 其係作為1C卡的基材。 4 (修正本)3106891248872 ~ ~ No. 88110275 Patent Application Patent Application Amendment 1 Ipoh Ancient &gt; 4 (September 29, M, J, J, 1 and 2, including the substrate and the layer on the eve of the substrate a conductive layer, the lightning conductivity / θ ^ guiding layer comprises a conductive polymer and a thermoplastic °, and is cured by a crosslinking reaction by a crosslinking agent, wherein the second package: a raw material polyaniline or a derivative or a sulfonic acid group-containing polyunsatus 1, which organism, and the substrate is a film or sheet made of an organic resin. • 'Application, a high antistatic laminate of the first item, wherein The conductive polymer is a conductive polymer which is soluble in water or a solvent. 3. A high antistatic laminate according to the scope of the application, wherein the electricity is produced. The invention relates to a high-antistatic laminate according to the patent application scope of claim 1, wherein the conductive polymerization &amp;amp; Acid as a polymerizable component. Such as the high antistatic laminate of the second paragraph of the patent scope of the patent, wherein the thermoplastic polymerization The polyester having a hydrophilic group. The high antistatic laminate according to claim 1, wherein the thermoplastic polymer is 〇·5 to 15 mol% of the total dicarboxylic acid component. a dicarboxylic acid having a hydrophilic group, or a diol having a hydrophilic group in a proportion of from 0.5 to 15 mol% of the total diterpene component, or a copolymerized polyester obtained by copolymerizing the two components. A high antistatic laminate according to claim 1, wherein the (revision) 3] 0689 1248872 = the plastic polymer is bonded to the polymer by using a vinyl monomer having a hydrophilic group. The obtained graft polyester. 8. The high antistatic laminate according to item 1 of the patent scope of May, wherein the binder is at least one member selected from the group consisting of: polyfunctionality: Oxygen compound, polyfunctional isocyanate compound, polyfunctional carbazole compound 'polyfunctional ethylenic compound, polyfunctional acrylation: polyfunctional carboxylic acid compound' polyfunctional amination ability Base compounds, and polyfunctional thiol compounds. The high antistatic laminate, the conductive layer of the tantalum is hardened by self-crosslinking of the conductive polymer or the thermoplastic polymer or the conductive poly/σ and the thermoplastic polymer. 12 = High antistatic against the first item The (4) sheet, wherein the electro-chemical layer further comprises a surfactant. U. The high-resistance laminate of the first aspect of the patent, wherein the back antistatic laminate has a thickness of not more than 5 〇. The turbidity. 12: The high antistatic laminate of the scope of the patent application item i, i cough; the material is a film or sheet made of a material selected from the following, polycarbonate, Polyolefin and polyamine phthalate. α-type high antistatic (4) sheet, including substrate and (4) at least one side of the conductive layer as a surface layer, taking people, etc. a thermoplastic polymer, and is a compound of a hard dielectric polymer polyphenylamine or a derivative thereof or a film or sheet containing a crosslinking agent, and the material A is made of an organic resin ( Amendment) 310689 1248872 &quot; The 'electrical layer has a temperature of 25 ° C, relative humidity of 15% is not greater than 1 〇 &quot; Ω / □ The surface resistance (RS〇), and after immersing the high antistatic laminate in thief pure water for one hour, at 25 ° C and relative humidity of 15% :: face resistance (called) vs. RS. The ratio (rs)/rs.) is not more than 1 〇, and the conductive layer of the hai has a surface resistance (RS2) at 25 C and a relative humidity of 15% after stretching the high antistatic laminate sheet by 15%. The ratio of RS〇 (RS2/RS〇) is no more than 1〇. . Shishen's "Monthly Patent Range i or i. 3 High Antistatic Lamination #, which is used to manufacture containers for electronic parts. A high antistatic laminate according to claim 14, wherein the container for the electronic component is a tray. 16. A high antistatic laminate according to claim 1 or 13 which is used for the manufacture of carrier tape for electronic parts. 17. A tray for an electronic component, comprising a high antistatic laminate according to claim 1 or 13 which comprises a substrate and is laminated on at least one side of the substrate. A highly antistatic laminate of a conductive layer is formed which includes a recess and a flange on an outer periphery thereof, wherein the conductive layer of the flange has a pit and a relative humidity of 15%. Not more than 10 &quot; Ω / □ table φ resistance (RS3), after immersing the tray in machine pure water for one hour, the surface resistance (RS4) of the conductive layer of the flange at 25t and relative humidity (four) The ratio (rs4/ is not more than 1〇' and the conductive layer of the cavity having a thickness of 〇5 to 〇7 times which is the thickness of the flange is at 25t and relative humidity of 15%. (Revised) 3] 0689 1248872 m „RS3 ratio (rs5/rs3) is not greater than ι〇〇. a TI for use: tailored tape, which will pass through the patent scope, and antistatic properties. A laminated sheet obtained by molding a high antistatic laminate comprising a substrate and a conductive layer on at least the surface of the soil material, the carrier tape comprising a plurality of cavities for encapsulation The plurality of electronic parts placed in the vertical (four), and the flange located outside thereof, wherein the conductive layer of the flange has a surface resistance of hunger and relative craving 15% T is not more than 1 〇 &quot; Ω / □ After the carrier is glued/forked in 40 C pure water for one hour, the conductive layer of the flange is surface-electricized at υ C and relative humidity of 15%. (RS7) The ratio of the team to the team (RS7/RS6) is not more than 10, and the conductive layer of the cavity having a thickness corresponding to the thickness of the flange is 〇·5 to 〇·7 times at 25. [and relative humidity The ratio of surface resistance RS6 (RS8/RS6) under I5% is not more than 100. 19. A protective packaging material comprising a container and a pair of stretched films for carrying articles to be packaged between them, the stretching The film has a pair of opposite ends that are secured within the container, wherein the stretched film is selected from the group consisting of a combination of the high antistatic laminates according to claim 1 or claim 13. 2 0. The high antistatic laminate according to claim 1 or 3, which is used as a substrate for a 1C card. 4 (Revised) 310689
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JP3309264B2 (en) * 1994-10-19 2002-07-29 タキロン株式会社 Antistatic paint and antistatic film and sheet formed with the coating film
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SG92643A1 (en) 2002-11-19
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CN1243062A (en) 2000-02-02
CN1290697C (en) 2006-12-20
MY136978A (en) 2008-12-31

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