TWI248094B - Conductive paste for an electrode layer of a multi-layered ceramic electronic component and a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component - Google Patents

Conductive paste for an electrode layer of a multi-layered ceramic electronic component and a method for manufacturing a multi-layered unit for a multi-layered ceramic electronic component Download PDF

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TWI248094B
TWI248094B TW093136795A TW93136795A TWI248094B TW I248094 B TWI248094 B TW I248094B TW 093136795 A TW093136795 A TW 093136795A TW 93136795 A TW93136795 A TW 93136795A TW I248094 B TWI248094 B TW I248094B
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electrode layer
ceramic green
laminated
green sheet
binder
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TW200531099A (en
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Shigeki Satou
Takeshi Nomura
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Tdk Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)

Abstract

Disclosed is a method for producing a multilayer unit for multilayer ceramic electronic components which can surely prevent short-circuit defects in a multilayer ceramic electronic component. Such a multilayer unit for multilayer ceramic electronic components is produced by printing a conductive paste on a ceramic green sheet in a specific pattern, thereby forming an electrode layer. The ceramic green sheet contains a butyral resin as a binder, and the conductive paste contains an acrylic resin as a binder and at least one solvent selected from a group consisting of limonene, alpha-terpinyl acetate, I-dihydrocarvyl acetate, I-menthone, I-perillyl acetate, I-carvyl acetate and d-dihydrocarvyl acetate.

Description

1248094 (1) 九、發明說明 【發明所屬之技術領域】 本發明係關於層積陶瓷電子零件之電極層用導電糊及 層積陶瓷電子零件用層積體單元之製造方法，尤其是，與 不會溶解和層積陶瓷電子零件之電極層相鄰之層所含有之 黏結劑之可確實防止層積陶瓷電子零件發生短路不良之電 極層用導電糊、及可確實防止層積陶瓷電子零件發生短路 不良之層積陶瓷電子零件用層積體單元之製造方法相關。 【先前技術】 近年來，隨著各種電子機器之小型化，亦要求安裝於 電子機器之電子零件能更爲小型化及高性能化，層積陶瓷 電容器等層積陶瓷電子零件亦隨著層積數之增加而強烈要 求層積單位之薄層化。 製造以層積陶瓷電容器爲代表之層積陶瓷電子零件時 ，首先，要混合分散陶瓷粉末、丙烯酸樹脂，丁醛樹脂等 之黏結劑、鄰苯二甲酸酯類、乙二醇類、己二醇、磷酸酯 類等之可塑劑、以及甲苯、甲基乙基酮、丙酮等之有機溶 媒，調製陶瓷生胚薄片用介電糊。 其次，利用擠壓塗布器及凹板塗布器等將介電糊塗布 於由聚對苯二甲酸乙二酯（PET)及聚丙烯（PP)等所形成之 支持片上，進行加熱實施塗膜之乾燥，製成陶瓷生胚薄片 〇 此外，將鎳等導電體粉末及黏結劑溶解於萜品醇等之 -5- (2) (2)1248094 溶劑，調製導電糊，利用網板印刷機等以特定圖案將導電 糊印刷於陶瓷生胚薄片上，進行乾燥而形成電極層。 形成電極層後，從支持片剝離形成電極層之陶瓷生胚 薄片，形成含有陶瓷生胚薄片及電極層之層積體單元，實 施期望數之層積體單元之層積並進行加壓，將所得到之層 積體切割成晶片狀，製成生胚晶片。 最後，從生胚晶片除去黏結劑，烘焙生胚晶片而形成 外部電極，製成層積陶瓷電容器等之層積陶瓷電子零件。 因爲電子零件之小型化及高性能化之要求，現在要求 決定層積陶瓷電容器之層間厚度之陶瓷生胚薄片之厚度應 爲3"m或2//m以下，且要求實施300以上之含有陶瓷生 胚薄片及電極層之層積體單元之層積。 【發明內容】 然而，在使用被廣泛當做陶瓷生胚薄片用黏結劑使用 之丁醛樹脂之陶瓷生胚薄片上，印刷使用被廣泛當做以形 成電極層爲目的之導電糊用溶劑使用之萜品醇所調製成之 導電糊來形成電極層時，導電糊中之萜品醇會使陶瓷生胚 薄片之黏結劑產生溶解，而使陶瓷生胚薄片產生針孔及龜 裂，而成爲短路不良之原因。 爲了解決此問題，有人提出使用煤油及癸烷等碳氫系 溶劑當做導電糊之溶劑之方法，然而，因爲煤油及癸烷等 碳氫系溶劑亦無法溶解導電糊所使用之黏結劑成分，故無 法以煤油及癸烷等碳氫系溶劑完全置換傳統所使用之萜品 -6- (3) 1248094 醇等溶劑，因此，導電糊中之溶劑依然對陶瓷生胚薄片之 黏結劑之丁醛樹脂具有某種程度之溶解性，當陶瓷生胚薄 片之厚度極薄時，很難防止陶瓷生胚薄片產生針孔及龜裂 ，此外，因爲煤油及癸烷等碳氫系溶劑之黏度小於萜品醇 ，而有難以控制導電糊黏度之問題。 此外，日本特開平5 -3 25 63 3公報、日本特開平7-2 1 8 3 3號公報、及日本特開平7-2 1 8 3 2號公報等提出採用以 二氫萜品醇等之含氫萜品醇、及二氫萜品醇醋酸酯等之松 烯系溶劑代替萜品醇之導電糊之方法，然而，二氫萜品醇 等之含氫萜品醇、及二氫萜品醇醋酸酯等之松烯系溶劑依 然對陶瓷生胚薄片之黏結劑之丁醛樹脂具有某種程度之溶 解性，陶瓷生胚薄片之厚度極薄時，很難防止陶瓷生胚薄 片產生針孔及龜裂。 因此，本發明之目的係在提供不會溶解和層積陶瓷電 子零件之電極層相鄰之層所含有之黏結劑之可確實防止層 積陶瓷電子零件發生短路不良之電極層用導電糊。 本發明之其他目的係在提供可確實防止層積陶瓷電子 零件發生短路不良之層積陶瓷電子零件用層積體單元之製 造方法。 本發明者爲了達成上述本發明之目的，經過審慎硏究 後發現，黏結劑使用丙烯酸系樹脂、溶劑使用由檸檬酸、 α-乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、丨_紫 蘇醋酸酯、卜乙酸香芹酯、以及d·二氫乙酸香芹酯所構成 之群組所選取之至少其中一種溶劑來調製導電糊時，可以 (4) (4)1248094 如預期地使黏結劑溶解於溶劑，在使用丁醛系樹脂當做黏 結劑之陶瓷生胚薄片上印刷導電糊來形成電極層時’陶瓷 生胚薄片所含有之黏結劑不會因爲導電糊中含有之溶劑而 溶解，因此，即使陶瓷生胚薄片之厚度極薄，亦可確實防 止陶瓷生胚薄片產生針孔及龜裂。 依據本發明之發現，本發明之前述目的可以利用以下 以導電糊來達成，其特徵爲，含有當做黏結劑使用之丙烯 酸系樹脂，且含有由檸檬酸、α-乙酸萜烯醋酸酯、I-二 氫乙酸香芹酯、I-薄荷酮、紫蘇醋酸酯、I-乙酸香芹酯 、以及d-二氫乙酸香芹酯所構成之群組所選取之至少其 中一種溶劑。 本發明之前述目的亦可以利用以下之層積陶瓷電子零 件用層積體單元之製造方法來達成，其特徵爲，在含有當 做黏結劑使用之丁醛系樹脂之陶瓷生胚薄片上，以特定圖 案印刷含有當做黏結劑使用之丙烯酸系樹脂且含有由檸檬 酸、α-乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、卜薄荷酮、 I·紫蘇醋酸酯、I-乙酸香芹酯、以及d-二氫乙酸香芹酯所 構成之群組所選取之至少其中一種溶劑之導電糊來形成電 極層。 依據本發明，在含有當做黏結劑使用之丁醛系樹脂之 極薄陶瓷生胚薄片上印刷導電糊而形成電極層時，因爲導 電糊中含有之溶劑不會溶解陶瓷生胚薄片所含有之黏結劑 ，即使陶瓷生胚薄片之厚度極薄，亦可確實防止陶瓷生胚 薄片產生針孔及龜裂。 -8 - (5) (5)1248094 本發明之良好實施形態，係在形成前述電極層前、或 形成前述電極層且乾燥後，進一步在前述陶瓷生胚薄片上 ，以和前述電極層圖案爲互補之圖案印刷含有當做黏結劑 使用之丙烯酸系樹脂且含有由檸檬酸、α -乙酸萜烯醋酸 酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸 香芹酯、以及d-二氫乙酸香芹酯所構成之群組所選取之 至少其中一種溶劑之介電糊而形成隔離層。 依據本發明之良好實施形態，因爲在陶瓷生胚薄片上 形成與電極層圖案爲互補圖案之隔離層，可防止電極層之 表面及形成電極層之陶瓷生胚薄片之表面之間形成落差， 因此，可有效防止分別利用含有陶瓷生胚薄片及電極層之 多數層積體單元所層積而成之層積陶瓷電容器等層積電子 零件之變形，亦可有效防止脫離。 此外，到目前爲止當做以形成電極層爲目的之導電糊 及以形成隔離層爲目的之介電糊所含有之溶劑使用之萜品 醇及煤油之混合溶劑、二氫萜品醇、以及萜品醇等，會溶 解陶瓷生胚薄片所含有之當做黏結劑使用之丁醛系樹脂， 若將這些溶劑當做以形成隔離層爲目的之介電糊之溶劑使 用時，以形成隔離層爲目的之介電糊所含有之溶劑會溶出 至陶瓷生胚薄片中，而使陶瓷生胚薄片出現溶解或膨脹， 導致隔離層表面出現裂痕或皴紋，結果，分別利用含有陶 瓷生胚薄片及電極層之多數層積體單元所層積而成之層積 陶瓷電容器等層積電子零件有容易出現裂縫之問題，然而 ，依據本發明之良好實施形態，用以形成隔離層之介電糊 -9 - (6) (6)1248094 含有當做黏結劑使用之丙烯酸系樹脂且含有由檸檬酸、 α-乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫 蘇醋酸酯、I-乙酸香芹酯、以及d-二氫乙酸香芹酯所構成 之群組所選取之至少其中一種溶劑，由檸檬酸、α -乙酸 萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸 酯、I-乙酸香芹酯、以及d-二氫乙酸香芹酯所構成之群組 所選取之溶劑幾乎不會溶解陶瓷生胚薄片所含有之當做黏 結劑使用之丁醛系樹脂，故可確實防止陶瓷生胚薄片發生 溶解或膨脹而導致隔離層表面出現裂痕或皺紋之情形，因 此，可確實防止分別由含有陶瓷生胚薄片、電極層、以及 隔離層之多數層積體單元所層積而成之層積陶瓷電容器等 層積電子零件發生裂縫之情形。 本發明時，電極層用導電糊含有之當做黏結劑使用之 丙烯酸系樹脂、及隔離層用介電糊含有之當做黏結劑使用 之丙烯酸系樹脂之重量平均分子量皆應爲45萬以上、90萬 以下，使用重量平均分子量爲45萬以上、90萬以下之丙烯 酸系樹脂當做電極層用導電糊之黏結劑及隔離層用介電糊 之黏結劑，可調製成具有期望黏度之電極層用導電糊及隔 離層用介電糊。 本發明時，電極層用導電糊及隔離層用介電糊含有之 當做黏結劑使用之丙烯酸系樹脂之酸價應爲5mgKOH/g以 上、25mgKOH/g以下，使用酸價爲5mgKOH/g以上、 25mgKOH/g以下之丙烯酸系樹脂當做電極層用導電糊及 隔離層用介電糊之黏結劑時，可以調製成具有期望黏度之 -10- (7) (7)1248094 導電糊及隔離層用介電糊。 本發明時，陶瓷生胚薄片含有之當做黏結劑使用之丁 醛系樹脂之聚合度應爲1 000以上。 本發明時，陶瓷生胚薄片含有之當做黏結劑使用之丁 醛系樹脂之丁醛化度應爲64莫耳％以上、78莫耳％以下。 此外，在極薄陶瓷生胚薄片印刷電極層用導電糊而形成電 極層，且印刷隔離層用介電糊而形成隔離層時，電極層用 導電糊中之溶劑及隔離層用介電糊中之溶劑會使陶瓷生胚 薄片之黏結劑成分產生溶解或膨脹，另一方面，導電糊及 介電糊亦會滲入陶瓷生胚薄片中而導致短路不良，由本發 明者之硏究得知，應在其他支持片上形成電極層及隔離層 並實施乾燥後，再利用黏結層黏結於陶瓷生胚薄片之表面 ，如上所示，在其他支持片上形成電極層及隔離層時，爲 了很容易即可從電極層及隔離層剝離支持片，應在支持片 表面形成含有與陶瓷生胚薄片相同之黏結劑之剝離層，並 在剝離層上印刷導電糊而形成電極層且印刷介電糊而形成 隔離層。如上所示，在具有與陶瓷生胚薄片相同組成之剝 離層上印刷導電糊而形成電極層且印刷介電糊而形成隔離 層時’剝離層含有當做黏結劑使用之丁醛樹脂，且導電糊 及介電糊含有當做溶劑使用之萜品醇，剝離層含有之黏結 劑會因爲導電糊及介電糊含有之溶劑而溶解，故有剝離層 產生針孔及龜裂而使層積陶瓷電容器等層積陶瓷電子零件 出現不良之問題。 然而’依據本發明，使用含有當做黏結劑使用之丙烯 -11 - (8) (8)1248094 酸系樹脂且含有由檸檬酸、α -乙酸萜烯醋酸酯、1_二氫 乙酸香芹酯、I-薄荷酮、卜紫蘇醋酸酯、I-乙酸香芹酯、 以及d-二氫乙酸香芹酯所構成之群組所選取之至少其中 一種溶劑之導電糊來形成電極層時，最好進一步使用含有 當做黏結劑使用之丙烯酸系樹脂且含有由檸檬酸、α -乙 酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋 酸酯、I-乙酸香芹酯、以及d_二氫乙酸香芹酯所構成之群 組所選取之至少其中一種溶劑之介電糊來形成隔離層，因 爲由檸檬酸、α-乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸香芹酯、以及d-二氫乙酸 香芹酯所構成之群組所選取之溶劑幾乎不會溶解陶瓷生胚 薄片含有之當做黏結劑使用之丁醛系樹脂，形成含有與陶 瓷生胚薄片相同之黏結劑之剝離層，並在剝離層上印刷導 電糊而形成電極層，且印刷介電糊而形成隔離層時，可有 效防止剝離層產生針孔及龜裂之情形，故可有效防止層積 陶瓷電容器等層積陶瓷電子零件之不良。 依據本發明，可提供不會溶解和層積陶瓷電子零件之 電極層相鄰之層所含有之黏結劑之可確實防止層積陶瓷電 子零件之短路不良之電極層用導電糊。 此外，依據本發明，可提供可確實防止層積陶瓷電子 零件之短路不良之層積陶瓷電子零件用層積體單元之製造 方法。 【實施方式】 -12· (9) 1248094 本發明之層積體單元之製造方法之良好實施形態，首 先’調製含有當做黏結劑使用之丁醛系樹脂之陶瓷生胚薄 片用介電糊，利用擠壓塗布器及線條塗布器等塗布於長方 形支持片上，形成塗膜。 陶瓷生胚薄片形成用介電糊通常係揉和介電材料（陶 瓷粉末）及將丁醛系樹脂溶解於有機溶劑中之有機載體來 進行調製。 丁醛系樹脂之聚合度應爲1 000以上，丁醛系樹脂之丁 醛化度應爲64莫耳％以上、78莫耳％以下。 有機載體所使用之有機溶劑並無特別限制，可使用萜 品醇、二甘醇-丁醚、丙酮、甲苯、以及醋酸乙酯等之有 機溶劑。 介電材料可使用複合氧化物及氧化物之各種化合物， 從例如碳酸鹽、硝酸鹽、氫氧化物、以及有機金屬化合物 等適度選擇並混合使用。通常，介電材料使用平均粒子徑 爲約〇·1// m至約3.0// m程度之粉末。介電材料之粒徑應 小於陶瓷生胚薄片之厚度。 介電糊中之各成分之含有量並無特別限制，例如，相 對於介電材料100重量份，以含有約2.5重量份至約10重量 份之丁醛系樹脂、及約50重量份至約300重量份之溶劑之 方式調製介電糊。 必要時，介電糊亦可含有從各種分散劑、可塑劑、副 成分化合物、玻璃熔塊、以及絕緣體等選擇之添加物。在 介電糊中添加前述添加物時，總含有量應爲約1 〇重量％以 (10) (10)1248094 下。 塗布著介電糊之支持片係使用例如聚對苯二甲酸乙二 酯薄膜等，爲了改善剝離性，亦可在其表面塗布矽樹脂及 醇酸樹脂等。 其次，在例如約5 0 °C至約1 〇 〇 °C之溫度下實施塗膜之 約1分鐘至約20分鐘之乾燥，在支持片上形成陶瓷生胚薄 片。 乾燥後之陶瓷生胚薄片厚度應爲3//m以下，最好爲 1 .5 // m 以下。 其次，在形成於長方形支持片之表面之陶瓷生胚薄片 上，利用網板印刷機及凹板印刷機等以特定圖案印刷電極 層用導電糊，形成電極層。 乾燥後，電極層之厚度應爲約0.1//Π1至約5//m，最 好爲約〇 · 1 // m至約1 · 5 // m。 電極層用導電糊係以揉和由各種導電性金屬及合金所 構成之導電體材料、由經過烘焙之各種導電性金屬及合金 所構成之導電體材料、各種氧化物、有機金屬化合物、或 樹酯酸鹽等、以及將丙烯酸系樹脂溶解於溶劑中之有機載 體之方式調製。 本實施形態之導電糊係含有當做黏結劑使用之丙烯酸 系樹脂，且含有由檸檬酸、α -乙酸萜烯醋酸酯、I-二氫 乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸香芹酯、 以及d-二氫乙酸香芹酯所構成之群組所選取之至少其中 一種溶劑。 -14- (11) (11)1248094 因爲由檸檬酸、乙酸萜烯醋酸酯、I-二氫乙酸香 芹酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸香芹酯、以及d-二氫乙酸香芹酯所構成之群組所選取之溶劑幾乎不會溶解 陶瓷生胚薄片含有之當做黏結劑使用之丁醛系樹脂，在極 薄陶瓷生胚薄片上印刷導電糊而形成電極層時，可有效防 止陶瓷生胚薄片所含有之黏結劑因爲導電糊中含有之溶劑 而溶解，因此，即使陶瓷生胚薄片之厚度極薄，亦可有效 防止陶瓷生胚薄片產生針孔及龜裂。 導電糊含有之丙烯酸系樹脂之重量平均分子量應爲45 萬以上、90萬以下，使用重量平均分子量爲45萬以上、90 萬以下之丙烯酸系樹脂當做導電糊之黏結劑，可調製成具 有期望黏度之導電糊。 此外，導電糊含有之丙烯酸系樹脂之酸價應爲 5mgKOH/g 以上、25mgKOH/g 以下，使用酸價爲 5mgKOH/g以上、25mgKOH/g以下之丙儲酸系樹脂當做導 電糊之黏結劑，可調製成具有期望黏度之導電糊。 製造導電糊時所使用之導電體材料應爲Ni、Ni合金 、或其混合物。導電體材料之形狀並無特別限制，可以爲 球狀、鱗片狀、或前述形狀之混合。此外，導電體材料之 平均粒子徑並無特別限制，通常爲約〇. 1 // m至約2 // m， 最好使用約〇. 2 // m至約1 ν m之導電性材料。 導電糊含有之黏結劑，相對於導電體材料1 〇〇重量份 應爲約2.5重量份至約20重量份。 相對於導電糊整體之溶劑之含有量應爲約3 5重量％至 -15- (12) (12)1248094 約220重量％。 導電糊應含有可塑劑，可改善黏結性。導電糊含有之 可塑劑並無特別限制，可採用例如鄰苯二甲酸酯、己二醇 、磷酸酯、以及乙二醇類等。相對於黏結劑1 00重量份， 導電糊含有之可塑劑應爲約10重量份至約1〇〇重量份，最 好爲約10重量份至約70重量份。可塑劑之添加量若過多， 則電極層強度會呈現顯著降低之傾向。 必要時，導電糊中可含有從各種分散劑及副成分化合 物等所選擇之添加物。 最好在形成電極層前、或形成電極層且乾燥後，在陶 瓷生胚薄片之表面上，利用網板印刷機及凹板印刷機等， 以和電極層圖案爲互補之圖案印刷含有當做黏結劑使用之 丙烯酸系樹脂且含有由檸檬酸、α -乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸香芹 酯、以及d-二氫乙酸香芹酯所構成之群組所選取之至少 其中一種溶劑之隔離層用介電糊而形成隔離層。 如上所示，在陶瓷生胚薄片之表面以和電極層圖案爲 互補之圖案形成隔離層，可防止電極層之表面及形成電極 層之陶瓷生胚薄片之表面之間形成落差，可有效防止分別 利用含有陶瓷生胚薄片及電極層之多數層積體單元所層積 而成之層積陶瓷電容器等層積電子零件之變形，亦可有效 防止脫離。 此外，如上面所述，因爲由二氫乙酸萜烯羥基乙醇、 乙酸萜燒羥基乙醇、d-二氫香芹醇、I-香茅醇、I-紫蘇醇 -16- (13) (13)1248094 、以及乙酸基-甲氧基乙氧基-環已醇醋酸酯所構成之群組 所選取之溶劑幾乎不會溶解陶瓷生胚薄片含有之當做黏結 劑使用之丁醛系樹脂，在極薄陶瓷生胚薄片上印刷介電糊 而形成隔離層時，可有效防止陶瓷生胚薄片所含有之黏結 劑因爲介電糊中含有之溶劑而溶解之情形，因此，即使陶 瓷生胚薄片之厚度極薄，亦可有效防止陶瓷生胚薄片產生 針孔及龜裂。 以形成隔離層爲目的之介電糊，除了使用不同黏結劑 及溶劑以外，係以和用以形成陶瓷生胚薄片之介電糊相同 之方式來進行調製。 以形成隔離層爲目的之介電糊含有之丙烯酸系樹脂之 重量平均分子量應爲45萬以上、90萬以下，使用重量平均 分子量爲45萬以上、90萬以下之丙烯酸系樹脂當做隔離層 用介電糊之黏結劑，可調製成具有期望黏度之介電糊。 此外，丙烯酸系樹脂之酸價應爲5mgKOH/g以上、 25mgKOH/g 以下，使用酸價爲5mgKOH/g以上、 25mgKOH/g以下之丙烯酸系樹脂當做隔離層用介電糊之 黏結劑，可調製成具有期望黏度之介電糊。 其次，實施電極層、或電極層及隔離層之乾燥，在支 持片上製作陶瓷生胚薄片、以及由電極層、或電極層及隔 離層層積而成之層積體單元。 製作層積陶瓷電容器時，從層積體單元之陶瓷生胚薄 片剝離支持片，裁切成特定尺寸，將特定數之層積體單元 層積至層積陶瓷電容器之外層上，且在層積體單元上層積 -17- (14) (14)1248094 另一方之外層，對所得到之層積體實施冲壓成形，裁切成 特定尺寸，製成複數之陶瓷生胚晶片。 將以此方式製成之陶瓷生胚晶片置於還原氣體環境下 ’除去黏結劑並進一步實施烘焙。 其次，在經過烘焙之陶瓷生胚晶片上配設必要之外部 電極等，製成層積陶瓷電容器。 依據本實施形態，其構成上，係在含有當做黏結劑使 用之丁醛系樹脂之陶瓷生胚薄片上，以特定圖案印刷含有 當做黏結劑使用之丙烯酸系樹脂且含有由檸檬酸、α -乙 酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋 酸酯、I-乙酸香芹酯、以及d-二氫乙酸香芹酯所構成之群 組所選取之至少其中一種溶劑之導電糊來形成電極層，因 爲由二氫乙酸萜烯羥基乙醇、乙酸萜烯羥基乙醇、d-二氫 香芹醇、I-香茅醇、I-紫蘇醇、以及乙酸基-甲氧基乙氧 基-環已醇醋酸酯所構成之群組所選取之溶劑幾乎不會溶 解陶瓷生胚薄片含有之當做黏結劑使用之丁醛系樹脂，在 極薄陶瓷生胚薄片上印刷導電糊而形成電極層時，可有效 防止陶瓷生胚薄片所含有之黏結劑因爲導電糊中含有之溶 劑而溶解，因此，即使陶瓷生胚薄片之厚度極薄，亦可有 效防止陶瓷生胚薄片產生針孔及龜裂之情形，而可有效防 止層積陶瓷電子零件之短路不良。 此外，依據本實施形態，因爲在陶瓷生胚薄片上形成 與電極層圖案爲互補圖案之隔離層，可防止電極層之表面 及形成電極層之陶瓷生胚薄片之表面之間形成落差，因此 -18- (15) (15)1248094 ，可有效防止分別利用含有陶瓷生胚薄片及電極層之多數 層積體單元所層積而成之層積陶瓷電容器等層積電子零件 之變形，亦可有效防止脫離。 此外，依據本實施形態，其構成上，係在含有當做黏 結劑使用之丁醛系樹脂之陶瓷生胚薄片上，以和電極層圖 案爲互補之圖案印刷含有當做黏結劑使用之丙烯酸系樹脂 且含有由檸檬酸、α-乙酸萜烯醋酸酯、I-二氫乙酸香芹 酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸香芹酯、以及d-二 氫乙酸香芹酯所構成之群組所選取之至少其中一種溶劑之 介電糊來形成隔離層，因爲由檸檬酸、α -乙酸萜烯醋酸 酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸 香芹酯、以及d-二氫乙酸香芹酯所構成之群組所選取之 溶劑幾乎不會溶解陶瓷生胚薄片含有之當做黏結劑使用之 丁醛系樹脂，在極薄陶瓷生胚薄片上印刷介電糊而形成隔 離層時，可確實防止陶瓷生胚薄片所含有之黏結劑因爲介 電糊含有之溶劑而溶解進而導致陶瓷生胚薄片膨脹而使隔 離層表面出現裂縫及鈹紋，因此，可確實防止利用含有陶 瓷生胚薄片及電極層之多數層積體單元所層積而成之層積 陶瓷電容器等層積電子零件之裂縫。 本發明之其他良好實施形態時，係在以形成陶瓷生胚 薄片爲目的之長方形支持片以外，另行準備第2支持片， 在長方形之第2支持片之表面上，利用線條塗布器等塗布 含有與陶瓷生胚薄片所含有之介電材料爲實質相同組成之 介電材料粒子、及與陶瓷生胚薄片所含有之黏結劑相同之 -19- (16) (16)1248094 黏結劑之介電糊並進行乾燥，形成剝離層。 第2支持片係使用例如聚對苯二甲酸乙二酯薄膜等， 爲了改善剝離性，亦可在其表面塗布矽樹脂及醇酸樹脂等 ρ 剝離層之厚度應爲電極層之厚度以下，爲電極層厚度 之約60%以下更佳，電極層厚度之約30%以下最佳。 實施剝離層之乾燥後，和前面所述相同，利用網板印 刷機及凹板印刷機等，在剝離層之表面上以特定圖案印刷 調製成之電極層用導電糊並進行乾燥，形成電極層。 電極層應爲約〇. 1 // m至約5 m之厚度，最好爲約〇. 1 // m 至約 1 · 5 // m。 本實施形態之導電糊，含有當做黏結劑使用之丙烯酸 系樹脂且含有由檸檬酸、α-乙酸萜烯醋酸酯、I-二氫乙 酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、卜乙酸香芹酯、以 及d-二氫乙酸香芹酯所構成之群組所選取之至少其中一 種溶劑。 因爲由檸檬酸、α ·乙酸萜烯醋酸酯、I-二氫乙酸香 芹酯、卜薄荷酮、I-紫蘇醋酸酯、卜乙酸香芹酯、以及d-二氫乙酸香芹酯所構成之群組所選取之溶劑幾乎不會溶解 陶瓷生胚薄片含有之當做黏結劑使用之丁醛系樹脂，形成 含有與陶瓷生胚薄片相同之黏結劑之剝離層並在剝離層上 印刷導電糊而形成電極層時’可有效防止剝離層產生針孔 及龜裂之情形，故可有效防止層積陶瓷電容器等層積陶瓷 電子零件之不良。 -20- (17) (17)1248094 導電糊含有之丙烯酸系樹脂之重量平均分子量應爲45 萬以上、90萬以下，使用重量平均分子量爲45萬以上、90 萬以下之丙烯酸系樹脂當做導電糊之黏結劑，可調製成具 有期望黏度之導電糊。 此外，導電糊含有之丙烯酸系樹脂之酸價應爲 5mgKOH/g 以上、25mgKOH/g 以下，使用酸價爲 5mgKOH/g以上、25mgKOH/g以下之丙烯酸系樹脂當做導 電糊之黏結劑，可調製成具有期望黏度之導電糊。 最好在形成電極層前、或形成電極層且乾燥後，利用 網板印刷機及凹板印刷機等，在第2支持片之表面以和電 極層圖案爲互補之圖案印刷以前面所述方法所調製之含有 當做黏結劑使用之丙烯酸系樹脂且含有由檸檬酸、α -乙 酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋 酸酯、I-乙酸香芹酯、以及d-二氫乙酸香芹酯所構成之群 組所選取之至少其中一種溶劑之隔離層用介電糊，形成隔 離層。 如上所示，在陶瓷生胚薄片之表面以和電極層圖案爲 互補之圖案形成隔離層，可防止電極層之表面及形成電極 層之陶瓷生胚薄片之表面之間形成落差，因此，可有效防 止分別利用含有陶瓷生胚薄片及電極層之多數層積體單元 所層積而成之層積陶瓷電容器等層積電子零件之變形，亦 可有效防止脫離。 此外，如上面所述，因爲由檸檬酸、α -乙酸萜烯醋 酸酯、I-二氫乙酸香芹酯、I·薄荷酮、I-紫蘇醋酸酯、I-乙 -21 - (18) (18)1248094 酸香芹酯、以及d-二氫乙酸香芹酯所構成之群組所選取 之溶劑幾乎不會溶解陶瓷生胚薄片含有之當做黏結劑使用 之丁醛系樹脂，形成含有與陶瓷生胚薄片相同之黏結劑之 剝離層並在剝離層上印刷介電糊而形成隔離層時，可有效 防止剝離層產生針孔及龜裂之情形，故可有效防止層積陶 瓷電容器等層積陶瓷電子零件之不良。 以形成隔離層爲目的之介電糊含有之丙烯酸系樹脂之 重量平均分子量應爲45萬以上、90萬以下，使用重量平均 分子量爲45萬以上、90萬以下之丙烯酸系樹脂當做導電糊 之黏結劑，可調製成具有期望黏度之導電糊。 此外，介電糊含有之丙烯酸系樹脂之酸價應爲 5mgKOH/g 以上、25mgKOH/g 以下，使用酸價爲 5mgKOH/g以上、25mgKOH/g以下之丙烯酸系樹脂當做介 電糊之黏結劑，可調製成具有期望黏度之介電糊。 此外，準備長方形之第3支持片，利用棒塗布器、擠 壓塗布器、反向塗布器、浸漬塗布器、以及接觸塗布器等 將黏結劑溶液塗布於第3支持片表面並進行乾燥，形成黏 結層。 黏結劑溶液應含有與以形成陶瓷生胚薄片爲目的之介 電糊所含有之黏結劑爲同系之黏結劑、與陶瓷生胚薄片所 含有之介電材料粒子爲實質相同之組成之粒徑爲黏結層之 厚度爲以下之介電材料粒子、可塑劑、防止帶電劑、以及 剝離劑。 黏結層應爲約0.3 // m以下之厚度’約0.0 2 // m至約 -22- (19) 1248094 〇.3//m更佳，約0.02//m至約0.2//m之厚度最好。 將形成於長方形第3支持片上之黏結層黏結至形成於 長方形第2支持片上之電極層或電極層及隔離層、或形成 於支持片上之陶瓷生胚薄片之表面，黏結後，從黏結層剝 離第3支持片，複印黏結層。 將黏結層複印至電極層、或電極層及隔離層之表面後 ，將形成於長方形支持片之表面之陶瓷生胚薄片黏結至黏 結層之表面，黏結後，從陶瓷生胚薄片剝離支持片，陶瓷 0 生胚薄片會複印至黏結層之表面，製成含有陶瓷生胚薄片 及電極層之層積體單元。 以和將黏結層複印至電極層、或電極層及隔離層之表 面相同之方式，將黏結層複印至利用此方式得到之層積體 單元之陶瓷生胚薄片之表面，並將表面已複印著黏結層之 層積體單元裁切成特定尺寸。 同樣的，製作表面已複印著黏結層之特定數之層積體 單元，製成層積著特定數之層積體單元之層積體塊。 製作層積體塊時，首先，以使複印至層積體單元之表 面之黏結層接觸支持體之方式，使層積體單元定位於由聚 對苯二甲酸乙二酯等所形成之支持體上，利用冲壓機等進 行加壓，並利用黏結層將層積體單元黏結至支持體上。 其後，從剝離層剝離第2支持片，將層積體單元層積 於支持體上。 其次，以形成於表面之黏結層接觸層積於支持體上之 層積體單元之剝離層之表面之方式，實施新層積體單元之 -23- (20) (20)1248094 定位，利用冲壓機等進行加壓，並利用黏結層將新層積體 單元層積至層積於支持體上之層積體單元之剝離層，其後 ，從新層積體單元之剝離層剝離第2支持片。 重複同樣之處理，製成層積著特定數之層積體單元之 層積體塊。 另一方面，黏結層複印至陶瓷生胚薄片之表面後，將 形成於第2支持片上之電極層、或電極層及隔離層黏結至 黏結層之表面，黏結後，從剝離層剝離第2支持片，電極 層或電極層及隔離層、及剝離層會複印至黏結層之表面， 製成含有陶瓷生胚薄片及電極層之層積體單元。 以和將黏結層複印至陶瓷生胚薄片之表面相同之方式 ，將黏結層複印至利用此方式得到之層積體單元之剝離層 之表面，並將表面已複印著黏結層之層積體單元裁切成特 定尺寸。 同樣的，製作表面已複印著黏結層之特定數之層積體 單元，製成層積著特定數之層積體單元之層積體塊。 製作層積體塊時，首先，以使複印至層積體單元之表 面之黏結層接觸支持體之方式，使層積體單元定位於由聚 對苯二甲酸乙二酯等所形成之支持體上，利用冲壓機等進 行加壓，並利用黏結層將層積體單元黏結至支持體上。 其後，從陶瓷生胚薄片剝離支持片，將層積體單元層 積於支持體上。 其次，以形成於表面之黏結層接觸層積於支持體上之 層積體單元之陶瓷生胚薄片之表面之方式，實施新層積體 -24- (21) 1248094 單元之定位，利用冲壓機等進行加壓，將黏結層將新層積 體單元層積至層積於支持體上之層積體單元之陶瓷生胚薄 片，其後，從新層積體單元之陶瓷剝離支持片。 重複同樣之處理，製成層積著特定數之層積體單元之 層積體塊。 將含有以此方式製作之特定數之層積體單元在內之層 積體塊層積至層積陶瓷電容器之外層上，並在層積體塊上 層積另一方之外層，對所得到之層積體實施冲壓成形，裁 切成特定尺寸，製成複數之陶瓷生胚晶片。 將以此方式製成之陶瓷生胚晶片置於還原氣體環境下 ，除去黏結劑並進一步實施烘焙。 其次，在經過烘焙之陶瓷生胚晶片上配設必要之外部 電極等，製成層積陶瓷電容器。 依據本實施形態，因爲係在實施形成於第2支持片上 之電極層及隔離層之乾燥後，再利用黏結層黏結於陶瓷生 胚薄片之表面，在陶瓷生胚薄片之表面印刷導電糊而形成 電極層，且印刷介電糊而形成隔離層時，導電糊及介電糊 不會滲入陶瓷生胚薄片中，而可依期望在陶瓷生胚薄片之 表面上形成電極層及隔離層。 此外，本實施形態係使用含有當做黏結劑使用之丙烯 酸系樹脂且含有由檸檬酸、α-乙酸萜烯醋酸酯、I-二氫 乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I·乙酸香芹酯、 以及d-二氫乙酸香芹酯所構成之群組所選取之至少其中 一種溶劑之導電糊來形成電極層，因爲由檸檬酸、α -乙 -25- (22) (22)1248094 酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋 酸酯、I-乙酸香芹酯、以及d-二氫乙酸香芹酯所構成之群 組所選取之溶劑幾乎不會溶解陶瓷生胚薄片含有之當做黏 結劑使用之丁醛系樹脂，形成含有與陶瓷生胚薄片相同之 黏結劑之剝離層並在剝離層上印刷導電糊而形成電極層時 ，可有效防止剝離層產生針孔及龜裂之情形，故可有效防 止層積陶瓷電容器等層積陶瓷電子零件之不良。 此外，本實施形態係使用含有當做黏結劑使用之丙烯 酸系樹脂，且含有由檸檬酸、α-乙酸萜烯醋酸酯、I-二 氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I·乙酸香芹酯 、以及d-二氫乙酸香芹酯所構成之群組所選取之至少其 中一種溶劑之介電糊而形成隔離層，因爲由檸檬酸、α-乙酸萜烯醋酸酯、卜二氫乙酸香芹酯、I-薄荷酮、I-紫蘇 醋酸酯、卜乙酸香芹酯、以及d-二氫乙酸香芹酯所構成之 群組所選取之溶劑幾乎不會溶解陶瓷生胚薄片含有之當做 黏結劑使用之丁醛系樹脂，形成含有與陶瓷生胚薄片相同 之黏結劑之剝離層並在剝離層上印刷介電糊而形成隔離層 時，可有效防止剝離層產生針孔及龜裂之情形’故可有效 防止層積陶瓷電容器等層積陶瓷電子零件之不良。 本發明之其他實施形態，將黏結層複印至電極層、或 電極層及隔離層之表面後，在長方形之第2支持片上層積 剝離層、電極層或電極層及隔離層、黏結層、以及陶瓷生 胚薄片，將黏結層複印至形成之層積體單元之陶瓷生胚薄 片之表面後，不裁切成層積體單元’將由層積於長方形支 -26- (23) (23)1248094 持片上之陶瓷生胚薄片、黏結層、電極層或電極層及隔離 層、以及剝離層所形成之層積體單元之剝離層黏結於黏結 層，從陶瓷生胚薄片剝離支持片，而將2個層積體單元層 積於長方形第2支持片上。 其次，將形成於第3支持片上之黏結層複印至位於2個 層積體單元之表面之陶瓷生胚薄片上，並將由層積於長方 形支持片上之陶瓷生胚薄片、黏結層、電極層或電極層及 隔離層、以及剝離層所形成之層積體單元之剝離層黏結於 黏結層，從陶瓷生胚薄片剝離支持片。 重複同樣之處理，製作層積著特定數之層積體單元之 層積體單元組，並將形成於第3支持片上之黏結層複印至 位於層積體單元組之表面之陶瓷生胚薄片之表面後，裁切 成特定尺寸，製成層積體塊。 另一方面，黏結層複印至陶瓷生胚薄片之表面後，在 長方形支持片上層積陶瓷生胚薄片、黏結層、電極層或電 極層及隔離層、以及剝離層，並將黏結層複印至形成之層 積體單元之剝離層之表面後，不裁切成層積體單元，將由 層積於長方形第2支持片上之剝離層、電極層或電極層及 隔離層、黏結層、以及陶瓷生胚薄片所形成之層積體單元 之陶瓷生胚薄片黏結於黏結層，從剝離層剝離第2支持片 ，將2個層積體單元層積於長方形支持片上。 其次，將形成於第3支持片上之黏結層複印至位於2個 層積體單元之表面之剝離層上，並將由層積於長方形第2 支持片上之剝離層、電極層或電極層及隔離層、黏結層、 -27- (24) (24)1248094 以及陶瓷生胚薄片所形成之層積體單元之陶瓷生胚薄片黏 結於黏結層，從剝離層剝離第2支持片。 重複同樣之處理，製作層積著特定數之層積體單元之 層積體單元組，此外，將形成於第3支持片上之黏結層複 印至位於層積體單元組之表面之剝離層之表面後，裁切成 特定尺寸，製成層積體塊。 利用以此方式製作之層積體塊，以和前述實施形態相 同之方式，製成層積陶瓷電容器。 依據本實施形態，在長方形之第2支持片或支持片上 逐一實施層積體單元之層積，製作含有特定數之層積體單 元之層積體單元組，其後，將層積體單元組裁切成特定尺 寸，而製成層積體塊，故與逐一實施裁切成特定尺寸之層 積體單元之層積來製作層積體塊時相比，可大幅提高層積 體塊之製造效率。 本發明之其他實施形態，將黏結層複印至電極層、或 電極層及隔離層之表面後，在長方形之第2支持片上層積 剝離層、電極層或電極層及隔離層、黏結層、以及陶瓷生 胚薄片，將黏結層複印至形成之層積體單元之陶瓷生胚薄 片之表面後，不裁切成層積體單元，將形成於第2支持片 上之電極層、或電極層及隔離層黏結於黏結層，從剝離層 剝離第2支持片，將電極層或電極層及隔離層、及剝離層 複印至黏結層之表面。 其次，將形成於第3支持片上之黏結層複印至複印於 黏結層之表面之剝離層之表面，使形成於支持片上之陶瓷 -28- (25) (25)1248094 生胚薄片黏結於黏結層，從陶瓷生胚薄片剝離支持片，將 陶瓷生胚薄片複印至黏結層之表面。 此外，將形成於第3支持片上之黏結層複印至複印於 黏結層之表面之陶瓷生胚薄片之表面，而使形成於第2支 持片上之電極層、或電極層及隔離層黏結於黏結層，從剝 離層剝離第2支持片，將電極層或電極層及隔離層、及剝 離層複印至黏結層之表面。 重複同樣之處理，製作層積著特定數之層積體單元之 層積體單元組，並在將黏結層複印至位於層積體單元組之 表面之陶瓷生胚薄片之表面後，裁切成特定尺寸，製成層 ί* Bjjh frft 槓體塊。 另一方面，黏結層複印至陶瓷生胚薄片之表面後，在 長方形支持片上層積陶瓷生胚薄片、黏結層、電極層或電 極層及隔離層、以及剝離層，並將黏結層複印至形成之層 積體單元之剝離層之表面後，不裁切成層積體單元，將形 成於支持片上之陶瓷生胚薄片黏結於黏結層，從陶瓷生胚 薄片剝離支持片，將陶瓷生胚薄片複印至黏結層之表面。 其次，將形成於第3支持片上之黏結層複印至複印於 黏結層之表面之陶瓷生胚薄片之表面，使形成於第2支持 片上之電極層或電極層及隔離層黏結於黏結層，從剝離層 剝離第2支持片，將電極層或電極層及隔離層、及剝離層 複印至黏結層之表面。 此外，將形成於第3支持片上之黏結層複印至複印於 黏結層之表面之剝離層之表面，使形成於支持片上之陶瓷 -29- (26) (26)1248094 生胚薄片黏結於黏結層，從陶瓷生胚薄片剝離支持片，將 陶瓷生胚薄片複印至黏結層之表面。 重複同樣之處理，製作層積著特定數之層積體單元之 層積體單元組，並在將黏結層複印至位於層積體單元組之 表面之剝離層之表面後，裁切成特定尺寸，製成層積體塊 〇 利用以此方式製作之層積體塊，以和前述實施形態相 同之方式，製成層積陶瓷電容器。 依據本實施形態，在形成於長方形之第2支持片或支 持片上之層積體單元之表面上，重複實施黏結層之複印、 電極層或電極層及隔離層、及剝離層之複印、黏結層之複 印、以及陶瓷生胚薄片之複印，逐一實施層積體單元之層 積’製作含有特定數之層積體單元之層積體單元組，其後 ’將層積體單元組裁切成特定尺寸，而製成層積體塊，故 與逐一實施裁切成特定尺寸之層積體單元之層積來製作層 積體塊時相比，可大幅提高層積體塊之製造效率。 [實施例] 以下，係以說明本發明之效果爲目的之實施例及比較 例。 實施例1 陶瓷生胚薄片用介電糊之調製 混合1.48重量份之（BaCa)Si03、1.01重量份之 Y2〇3、 -30- (27) 1248094 〇·72重量份之MgC03、0.13重量份之MnO、以及0.045重 量份之V205，調製添加物粉末。 混合相對於以此方式調製之添加物粉末1 00重量份爲 72.3重量份之乙醇、72.3重量份之丙醇、25.8重量份之二 甲苯、以及0.93重量份之聚乙二醇系分散劑來調製原漿， 並粉碎原漿中之添加物。 粉碎原漿中之添加物時，係將n.65g之原漿及450g 之Zr02顆粒（直徑2mm)置入250cc之聚乙烯容器內，以圓 周速度45m/分使聚乙烯容器旋轉16小時，粉碎原漿中之添 加物而調製成添加物原漿。 粉碎後之添加物之中位直徑爲〇. 1 // m。 其次，將15重量份之聚乙烯丁醛（聚合度1450、丁醛 化度69莫耳％)在50 °C下溶解於42.5重量份之乙醇及42.5重 量份之丙醇，調製成有機載體之1 5 %溶液，此外，利用 5〇〇cc之聚乙烯容器以20小時混合具有以下之組成之原漿 ，調製成介電糊。混合時，將330.1g之原漿及900g之 Zr02顆粒（直徑2mm)置入聚乙烯容器內，以圓周速度45m/ 分旋轉聚乙烯容器。[Technical Field] The present invention relates to a method for manufacturing a conductive paste for an electrode layer of a laminated ceramic electronic component and a laminated body unit for laminating ceramic electronic components, in particular, The adhesive which is contained in the layer adjacent to the electrode layer which dissolves and laminates the ceramic electronic component can surely prevent the conductive paste of the electrode layer from being short-circuited by the laminated ceramic electronic component, and can reliably prevent the short circuit of the laminated ceramic electronic component. It is related to the manufacturing method of the laminated unit for the defective laminated ceramic electronic parts. [Prior Art] In recent years, with the miniaturization of various electronic devices, electronic components mounted on electronic devices have been required to be more compact and high-performance, and laminated ceramic electronic components such as laminated ceramic capacitors have been laminated. The increase in the number strongly requires thinning of the stratified units. When manufacturing laminated electronic parts represented by laminated ceramic capacitors, first, mix and disperse ceramic powder, acrylic resin, butadiene resin, etc., phthalate, ethylene glycol, hexanediol A plastic solvent such as a phosphate ester or an organic solvent such as toluene, methyl ethyl ketone or acetone to prepare a dielectric paste for ceramic green sheets. Next, a dielectric paste is applied onto a support sheet formed of polyethylene terephthalate (PET), polypropylene (PP) or the like by an extrusion coater, a gravure coater or the like, and heated to apply a coating film. Drying to form a ceramic green sheet, and further, a conductive powder such as nickel and a binder are dissolved in a solvent of -5-(2) (2)1248094 such as terpineol to prepare a conductive paste, and a screen printing machine or the like is used. The conductive paste is printed on the ceramic green sheet by a specific pattern and dried to form an electrode layer. After forming the electrode layer, the ceramic green sheet forming the electrode layer is peeled off from the support sheet to form a laminate unit including the ceramic green sheet and the electrode layer, and a desired number of laminated unit units are stacked and pressurized. The obtained laminate was cut into a wafer shape to prepare a green sheet. Finally, the binder is removed from the green sheet, and the green sheet is baked to form an external electrode, thereby forming a laminated ceramic electronic component such as a laminated ceramic capacitor. Due to the miniaturization and high performance requirements of electronic components, it is now required to determine the thickness of the ceramic green sheets of the interlayer thickness of the laminated ceramic capacitors to be 3 "m or less, and to require more than 300 ceramics. The layering of the green sheet and the layer unit of the electrode layer. In the case of using a ceramic green sheet of a butyral resin which is widely used as a binder for a ceramic green sheet, a product which is widely used as a solvent for a conductive paste for forming an electrode layer is used for printing. When the conductive paste is prepared by alcohol to form an electrode layer, the terpineol in the conductive paste dissolves the bonding agent of the ceramic green sheet, and causes pinholes and cracks in the ceramic green sheet to become a short circuit. the reason. In order to solve this problem, a method of using a hydrocarbon solvent such as kerosene or decane as a solvent for a conductive paste has been proposed. However, since a hydrocarbon solvent such as kerosene or decane cannot dissolve the binder component used in the conductive paste, Solvents such as -6-(3) 1248094 alcohol, which are conventionally used, cannot be completely replaced by a hydrocarbon solvent such as kerosene or decane. Therefore, the solvent in the conductive paste is still a butyral resin for the ceramic green sheet binder. It has a certain degree of solubility. When the thickness of the ceramic green sheet is extremely thin, it is difficult to prevent pinholes and cracks in the ceramic green sheet, and the viscosity of the hydrocarbon solvent such as kerosene and decane is less than that of the product. Alcohol, and there is a problem that it is difficult to control the viscosity of the conductive paste. In addition, Japanese Laid-Open Patent Publication No. Hei. No. 5 -3 25 63 3, Japanese Patent Publication No. 7-2 1 8 3 3, and Japanese Patent Laid-Open No. Hei 7-2 1 8 3 2, etc. A method of replacing a conductive paste of terpineol with a terpene-based solvent such as hydroquinone alcohol or dihydroterpineol acetate, however, hydroquinone-containing alcohol such as dihydroterpineol or the like The terpene-based solvent such as alcohol acetate still has a certain degree of solubility to the butadialdehyde resin of the ceramic green sheet adhesive. When the thickness of the ceramic green sheet is extremely thin, it is difficult to prevent the pinhole of the ceramic green sheet. And cracks. Accordingly, an object of the present invention is to provide a conductive paste for an electrode layer which can reliably prevent a short-circuit defect in a laminated ceramic electronic component by providing a binder which is not contained in a layer adjacent to the electrode layer of the ceramic electronic component. Another object of the present invention is to provide a method for producing a laminated body unit for laminated ceramic electronic parts which can reliably prevent short-circuit defects in laminated ceramic electronic parts. In order to achieve the object of the present invention, the inventors have found through careful investigation that the binder is made of acrylic resin, and the solvent is made of citric acid, α-acetic acid acetate, I-dihydroacetic acid, and I- When at least one solvent selected from the group consisting of menthone, strontium acetate, perilla acetate, and carmine ester of d-dihydroacetic acid is used to modulate the conductive paste, (4) (4) 1248094 When the binder is dissolved in a solvent as expected, when a conductive paste is printed on a ceramic green sheet using a butyral resin as a binder to form an electrode layer, the binder contained in the ceramic green sheet is not contained in the conductive paste. Since the solvent is dissolved, even if the thickness of the ceramic green sheet is extremely thin, it is possible to surely prevent pinholes and cracks in the ceramic green sheet. According to the findings of the present invention, the foregoing object of the present invention can be attained by using a conductive paste characterized by containing an acrylic resin as a binder and containing citric acid, α-acetic acid acetate, I- At least one of the solvents selected from the group consisting of carvone dihydroacetate, I-menthone, perillyl acetate, i-carveryl acetate, and d-dihydroacetic acid carvone. The above object of the present invention can also be attained by the following method for producing a laminate unit for laminated ceramic electronic parts, characterized in that it is specified on a ceramic green sheet containing a butyral resin used as a binder. The pattern printing contains an acrylic resin used as a binder and contains citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carcelyl ester, menthol ketone, I. perilla acetate, and I-carveryl acetate. And an electroconductive paste of at least one of the solvents selected from the group consisting of d-dihydroacetic acid carvone to form an electrode layer. According to the present invention, when a conductive paste is printed on an extremely thin ceramic green sheet containing a butyral resin used as a binder to form an electrode layer, since the solvent contained in the conductive paste does not dissolve the bond contained in the ceramic green sheet Even if the thickness of the ceramic green sheet is extremely thin, it can surely prevent pinholes and cracks in the ceramic green sheet. -8 - (5) (5) 1248094. A preferred embodiment of the present invention is further characterized in that the electrode layer is formed on the ceramic green sheet before the electrode layer is formed or after the electrode layer is formed and dried. Complementary pattern printing contains an acrylic resin used as a binder and contains citric acid, α-vinyl acetate, I-dihydroacetic acid, celery, I-mente, I-peracetate, I-acetic acid A separator is formed by a dielectric paste of at least one of the solvents selected from the group consisting of carvone and d-dihydroacetic acid carvone. According to a preferred embodiment of the present invention, since a barrier layer having a pattern complementary to the electrode layer pattern is formed on the ceramic green sheet, it is possible to prevent a gap from being formed between the surface of the electrode layer and the surface of the ceramic green sheet forming the electrode layer. It is possible to effectively prevent deformation of laminated electronic components such as laminated ceramic capacitors in which a plurality of laminated unit cells including ceramic green sheets and electrode layers are laminated, and to effectively prevent detachment. In addition, as a conductive paste for the purpose of forming an electrode layer, a mixed solvent of terpineol and kerosene, a dihydroterpineol, and a product for use as a solvent for forming a dielectric paste for forming a separator. An alcohol or the like dissolves a butyraldehyde-based resin used as a binder in a ceramic green sheet, and when these solvents are used as a solvent for a dielectric paste for forming a separator, the purpose of forming a separator is The solvent contained in the electric paste is eluted into the ceramic green sheet, and the ceramic green sheet is dissolved or expanded, resulting in cracks or crepe on the surface of the separator. As a result, the majority of the ceramic green sheets and the electrode layers are respectively used. A laminated electronic component such as a laminated ceramic capacitor in which a laminate unit is laminated has a problem that cracks are likely to occur. However, according to a preferred embodiment of the present invention, a dielectric paste for forming an isolation layer is provided. (6) 1248094 contains acrylic resin used as a binder and contains citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvone, I-menthone, I-perilla At least one solvent selected from the group consisting of esters, I-carvyl acetate, and d-dihydroacetic acid carvone, from citric acid, α-acetic acid acetate, and I-dihydroacetic acid The solvent selected from the group consisting of celery, I-menthone, I-peripate, I-carvyl acetate, and d-dihydroacetic acid carvone hardly dissolves the ceramic green sheets. As a butyral resin used as a binder, it can surely prevent the ceramic green sheet from dissolving or expanding, resulting in cracks or wrinkles on the surface of the separator. Therefore, it can be surely prevented from containing ceramic green sheets, electrode layers, A crack occurs in a laminated electronic component such as a laminated ceramic capacitor in which a plurality of laminated units of the isolation layer are laminated. In the present invention, the acrylic resin used as the binder in the conductive paste for the electrode layer and the acrylic resin used as the binder in the dielectric paste for the barrier layer should have a weight average molecular weight of 450,000 or more and 900,000. In the following, an acrylic resin having a weight average molecular weight of 450,000 or more and 900,000 or less is used as a binder for a conductive paste for an electrode layer and a binder for a dielectric paste for a separator, and can be adjusted to form a conductive paste for an electrode layer having a desired viscosity. And a dielectric paste for the isolation layer. In the present invention, the acid value of the acrylic resin used as the binder in the conductive paste for the electrode layer and the dielectric paste for the separator should be 5 mgKOH/g or more and 25 mgKOH/g or less, and the acid value is 5 mgKOH/g or more. When the acrylic resin of 25 mgKOH/g or less is used as the conductive paste for the electrode layer and the dielectric paste for the separator, it can be prepared to have a desired viscosity of -10 (7) (7) 1248094 conductive paste and barrier layer. Electric paste. In the present invention, the degree of polymerization of the butyral resin used as the binder in the ceramic green sheet should be 1,000 or more. In the present invention, the butyralization degree of the butyral resin used as the binder in the ceramic green sheet should be 64 mol% or more and 78 mol% or less. Further, when an electrode layer is formed by using a conductive paste on an extremely thin ceramic green sheet printed electrode layer, and a spacer is formed by using a dielectric paste for printing the isolation layer, a solvent for the electrode layer and a dielectric paste for the isolation layer are used. The solvent causes the binder component of the ceramic green sheet to dissolve or swell. On the other hand, the conductive paste and the dielectric paste may also penetrate into the ceramic green sheet to cause a short circuit defect, which is known by the inventors. After the electrode layer and the isolation layer are formed on the other support sheets and dried, and then bonded to the surface of the ceramic green sheet by the adhesive layer, as shown above, when the electrode layer and the isolation layer are formed on the other support sheets, it is easy to The electrode layer and the separation layer are peeled off from the support sheet, and a release layer containing the same binder as the ceramic green sheet is formed on the surface of the support sheet, and a conductive paste is printed on the release layer to form an electrode layer and a dielectric paste is printed to form an isolation layer. . As described above, when a conductive paste is printed on a peeling layer having the same composition as the ceramic green sheet to form an electrode layer and a dielectric paste is printed to form a separator, the peeling layer contains a butyral resin used as a binder, and a conductive paste And the dielectric paste contains terpineol used as a solvent, and the binder contained in the release layer is dissolved by the solvent contained in the conductive paste and the dielectric paste, so that the peeling layer generates pinholes and cracks, and the ceramic capacitor is laminated. Lamination of ceramic electronic components has a problem. However, according to the present invention, a propylene-11-(8)(8)1248094 acid resin containing as a binder is used and contains citric acid, α-acetic acid decene acetate, 1% dihydroacetic acid carvone, When the electroconductive paste of at least one of the solvents selected from the group consisting of I-menthone, bucksack acetate, I-carvyl acetate, and carotenoid d-dihydroacetate is used to form the electrode layer, it is preferable to further Uses an acrylic resin containing as a binder and contains citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvone, I-menthone, I-peracetate, I-carveryl acetate And a dielectric paste of at least one solvent selected from the group consisting of d_dihydroacetic acid carvone to form a separator because of citric acid, α-acetic acid acetate, and I-dihydroacetic acid The solvent selected from the group consisting of celery, I-menthol, I-peripate, I-carvyl acetate, and d-dihydroacetic acid carvone hardly dissolves the ceramic green flakes. The butyral resin used in the binder is formed to contain the ceramic green flakes. When the adhesive layer is peeled off and the conductive paste is printed on the peeling layer to form an electrode layer, and the dielectric paste is printed to form the separator, the pinhole and the crack of the peeling layer can be effectively prevented, so that the layer can be effectively prevented. Poor ceramic ceramic parts such as ceramic capacitors. According to the present invention, it is possible to provide a conductive paste for an electrode layer which can prevent the short-circuit defect of the laminated ceramic electronic component from being surely prevented by the binder contained in the layer adjacent to the electrode layer of the ceramic electronic component. Further, according to the present invention, it is possible to provide a method for manufacturing a laminated body unit for laminated ceramic electronic parts which can reliably prevent short-circuit defects in laminated ceramic electronic parts. [Embodiment] -12· (9) 1248094 A good embodiment of the method for producing a laminate unit of the present invention firstly uses a dielectric paste for a ceramic green sheet containing a butyral resin used as a binder. An extrusion applicator, a line applicator or the like is applied to the rectangular support sheet to form a coating film. The dielectric paste for forming a ceramic green sheet is usually prepared by dissolving a dielectric material and a dielectric material (ceramic powder) and an organic vehicle in which a butyral resin is dissolved in an organic solvent. The polymerization degree of the butyraldehyde-based resin should be 1,000 or more, and the butyraldehyde degree of the butyraldehyde-based resin should be 64 mol% or more and 78 mol% or less. The organic solvent to be used for the organic vehicle is not particularly limited, and an organic solvent such as terpineol, diethylene glycol-butyl ether, acetone, toluene or ethyl acetate can be used. As the dielectric material, various compounds of a composite oxide and an oxide can be used, and are appropriately selected and mixed from, for example, a carbonate, a nitrate, a hydroxide, and an organometallic compound. Typically, the dielectric material has an average particle diameter of from about 〇·1//m to about 3. 0// m level powder. The particle size of the dielectric material should be less than the thickness of the ceramic green sheet. The content of each component in the dielectric paste is not particularly limited, and is, for example, about 200% by weight based on 100 parts by weight of the dielectric material. The dielectric paste is prepared in an amount of from 5 parts by weight to about 10 parts by weight of the butyraldehyde-based resin, and from about 50 parts by weight to about 300 parts by weight of the solvent. The dielectric paste may also contain additives selected from various dispersants, plasticizers, by-component compounds, glass frits, and insulators, if necessary. When the aforementioned additive is added to the dielectric paste, the total content should be about 1% by weight to (10) (10) 1248094. For the support sheet coated with the dielectric paste, for example, a polyethylene terephthalate film or the like is used, and in order to improve the releasability, a ruthenium resin, an alkyd resin or the like may be applied to the surface. Next, the coating film is dried at a temperature of, for example, about 50 ° C to about 1 ° C for about 1 minute to about 20 minutes to form a ceramic green sheet on the support sheet. The thickness of the ceramic green sheet after drying should be 3 / / m or less, preferably 1 . 5 // m or less. Then, a conductive paste for an electrode layer is printed on a ceramic green sheet formed on the surface of the rectangular support sheet in a specific pattern by a screen printing machine or a gravure printing machine to form an electrode layer. After drying, the thickness of the electrode layer should be about 0. 1//Π1 to about 5//m, preferably about 〇 · 1 // m to about 1 · 5 // m. The conductive paste for the electrode layer is made of tantalum and a conductive material composed of various conductive metals and alloys, a conductive material composed of various conductive metals and alloys baked, various oxides, organometallic compounds, or trees. It is prepared in the form of an ester or the like and an organic vehicle in which an acrylic resin is dissolved in a solvent. The conductive paste of the present embodiment contains an acrylic resin used as a binder, and contains citric acid, α-acetate acetate, I-dihydroacetic acid carvness, I-menthol, and I-peracetate. At least one solvent selected from the group consisting of I-carvyl acetate and carvure d-dihydroacetic acid. -14- (11) (11)1248094 because of citric acid, decene acetate, carboxyl I-dihydroacetate, I-menthone, I-peripate, I-carvyl acetate, and d - The solvent selected from the group consisting of carboxyl dihydroacetate hardly dissolves the butyral resin used as the binder in the ceramic green sheet, and prints the conductive paste on the extremely thin ceramic green sheet to form an electrode. When the layer is layered, the binder contained in the ceramic green sheet can be effectively prevented from being dissolved by the solvent contained in the conductive paste. Therefore, even if the thickness of the ceramic green sheet is extremely thin, pinholes and turtles of the ceramic green sheet can be effectively prevented. crack. The weight average molecular weight of the acrylic resin contained in the conductive paste should be 450,000 or more and 900,000 or less. The acrylic resin having a weight average molecular weight of 450,000 or more and 900,000 or less is used as a binder of the conductive paste, and can be adjusted to have a desired viscosity. Conductive paste. In addition, the acid value of the acrylic resin contained in the conductive paste should be 5 mgKOH/g or more and 25 mgKOH/g or less, and a C storage acid resin having an acid value of 5 mgKOH/g or more and 25 mgKOH/g or less is used as a binder of the conductive paste. It can be adjusted to make a conductive paste with a desired viscosity. The conductor material used in the manufacture of the conductive paste should be Ni, a Ni alloy, or a mixture thereof. The shape of the conductor material is not particularly limited, and may be a spherical shape, a scale shape, or a mixture of the foregoing shapes. In addition, the average particle diameter of the conductor material is not particularly limited, and is usually about 〇.  1 // m to about 2 // m, it is best to use about 〇.  Conductive material from 2 // m to approx. 1 ν m. The conductive paste contains a binder, which should be about 2. by weight relative to the conductor material. 5 parts by weight to about 20 parts by weight. The solvent content of the entire conductive paste as a whole should be about 35 wt% to -15-(12) (12) 1248094 of about 220 wt%. The conductive paste should contain a plasticizer to improve the adhesion. The plasticizer contained in the conductive paste is not particularly limited, and examples thereof include phthalic acid ester, hexylene glycol, phosphoric acid ester, and ethylene glycol. The conductive paste should have a plasticizer content of from about 10 parts by weight to about 1 part by weight, preferably from about 10 parts by weight to about 70 parts by weight, based on 100 parts by weight of the binder. If the amount of the plasticizer added is too large, the strength of the electrode layer tends to be remarkably lowered. When necessary, the conductive paste may contain additives selected from various dispersants, subcomponent compounds, and the like. Preferably, before forming the electrode layer, or after forming the electrode layer and drying, on the surface of the ceramic green sheet, using a screen printing machine, a gravure printing machine, or the like, printing in a pattern complementary to the pattern of the electrode layer is contained as a bond. The acrylic resin used in the agent and contains citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carcyl ester, I-menthone, I-peric acid acetate, I-carveryl acetate, and d- The separator of at least one of the solvents selected from the group consisting of carboxyl dihydroacetate forms a separator with a dielectric paste. As described above, the surface of the ceramic green sheet is formed with a pattern complementary to the pattern of the electrode layer, thereby preventing a gap between the surface of the electrode layer and the surface of the ceramic green sheet forming the electrode layer, thereby effectively preventing the difference The deformation of the laminated electronic component such as a laminated ceramic capacitor in which a plurality of laminated unit cells including a ceramic green sheet and an electrode layer are laminated can also effectively prevent detachment. Further, as described above, since decyl alcohol diethanolate, hydroxyethanol acetate, d-dihydrocarvyl alcohol, I-citronellol, I-perillin-16-(13) (13) The solvent selected from the group consisting of 1248094 and acetate-methoxyethoxy-cyclohexanol acetate hardly dissolves the butadialdehyde-based resin used as a binder in the ceramic green sheet, which is extremely thin. When a dielectric paste is printed on a ceramic green sheet to form a separator, the binder contained in the ceramic green sheet can be effectively prevented from being dissolved by the solvent contained in the dielectric paste, and therefore, even if the thickness of the ceramic green sheet is extremely Thin, it can also effectively prevent pinholes and cracks in ceramic green sheets. The dielectric paste for the purpose of forming the spacer layer is prepared in the same manner as the dielectric paste for forming the ceramic green sheet except that a different binder and solvent are used. The weight average molecular weight of the acrylic resin contained in the dielectric paste for forming the separator is 450,000 or more and 900,000 or less, and an acrylic resin having a weight average molecular weight of 450,000 or more and 900,000 or less is used as a separator. The paste of the electric paste can be adjusted to form a dielectric paste having a desired viscosity. In addition, the acid value of the acrylic resin should be 5 mgKOH/g or more and 25 mgKOH/g or less, and an acrylic resin having an acid value of 5 mgKOH/g or more and 25 mgKOH/g or less can be used as a binder for a dielectric paste for a separator. Form a dielectric paste with the desired viscosity. Next, the electrode layer, or the electrode layer and the separator are dried, and a ceramic green sheet and a laminate unit in which an electrode layer or an electrode layer and an isolation layer are laminated are formed on the support sheet. When a laminated ceramic capacitor is produced, the support sheet is peeled off from the ceramic green sheet of the laminate unit, cut into a specific size, and a specific number of laminated unit units are laminated on the outer layer of the laminated ceramic capacitor, and laminated. The body unit is laminated -17-(14)(14)1248094 to the other outer layer, and the obtained laminate is subjected to press forming and cut into a specific size to form a plurality of ceramic green sheets. The ceramic green chip prepared in this manner is placed under a reducing gas atmosphere to remove the binder and further perform baking. Next, a necessary external electrode or the like is placed on the baked ceramic green chip to form a laminated ceramic capacitor. According to this embodiment, the composition is printed on a ceramic green sheet containing a butyral resin used as a binder, and the acrylic resin used as a binder is contained in a specific pattern and contains citric acid, α-acetic acid. At least selected from the group consisting of terpene acetate, I-dihydroacetic acid carvone, I-menthone, I-peripate acetate, I-carveryl acetate, and d-dihydroacetic acid carvone One of the solvent conductive pastes to form the electrode layer because of the decyl hydroxyethanol, the decyl hydroxyethanol, the d-dihydrocarvacol, the I-citronellol, the I-perillin, and the acetate group. The solvent selected from the group consisting of methoxyethoxy-cyclohexanol acetate hardly dissolves the butadialdehyde-based resin used as a binder in ceramic green sheets, and is printed on extremely thin ceramic green sheets. When the conductive paste is formed to form an electrode layer, the binder contained in the ceramic green sheet can be effectively prevented from being dissolved by the solvent contained in the conductive paste. Therefore, even if the thickness of the ceramic green sheet is extremely thin, the ceramic green sheet can be effectively prevented. Production Pinholes and cracks of the case, and can effectively prevent short-circuit failure laminated ceramic electronic part. Further, according to the present embodiment, since the isolation layer which is complementary to the pattern of the electrode layer is formed on the ceramic green sheet, it is possible to prevent a gap from being formed between the surface of the electrode layer and the surface of the ceramic green sheet on which the electrode layer is formed, and thus - 18-(15) (15)1248094, which can effectively prevent deformation of laminated electronic components such as laminated ceramic capacitors in which a plurality of laminate units including ceramic green sheets and electrode layers are laminated, and can also effectively Prevent detachment. Further, according to the present embodiment, in the ceramic green sheet containing the butyral resin used as the binder, the acrylic resin which is used as the binder is printed in a pattern complementary to the pattern of the electrode layer. Containing citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carcyl ester, I-menthone, I-peripate acetate, I-carveryl acetate, and d-dihydroacetic acid carvone Forming a separator by forming a dielectric paste of at least one of the solvents selected from the group because of citric acid, α-acetate acetate, I-dihydroacetic acid carvness, I-menthol, I-perilla The solvent selected from the group consisting of acetate, I-carvyl acetate, and d-dihydroacetic acid carvone hardly dissolves the butyral resin used as a binder in the ceramic green sheet. When a dielectric paste is printed on a thin ceramic green sheet to form a separator, it is possible to surely prevent the binder contained in the ceramic green sheet from being dissolved by the solvent contained in the dielectric paste, thereby causing the ceramic green sheet to expand and causing the surface of the separator to appear. Cracks and crepe Therefore, it is possible to reliably prevent the crack of the laminated electronic component such as the laminated ceramic capacitor which is formed by laminating a plurality of laminate units including the ceramic green sheet and the electrode layer. In another preferred embodiment of the present invention, the second support sheet is separately prepared in addition to the rectangular support sheet for forming the ceramic green sheet, and is coated on the surface of the rectangular second support sheet by a line coater or the like. The dielectric material particles which are substantially the same composition as the dielectric material contained in the ceramic green sheet, and the same as the binder contained in the ceramic green sheet, -19- (16) (16) 1248094 adhesive dielectric paste It is dried to form a release layer. For the second support sheet, for example, a polyethylene terephthalate film or the like is used. In order to improve the releasability, the thickness of the p-peeling layer such as a ruthenium resin or an alkyd resin may be applied to the surface thereof to be equal to or less than the thickness of the electrode layer. The electrode layer thickness is preferably about 60% or less, and the electrode layer thickness is preferably about 30% or less. After the drying of the peeling layer is carried out, the conductive paste for electrode layer is printed on a surface of the peeling layer in a specific pattern by a screen printing machine, a gravure printing machine or the like, and dried to form an electrode layer. . The electrode layer should be about 〇.  1 / m to a thickness of about 5 m, preferably about 〇.  1 // m to about 1 · 5 // m. The conductive paste of the present embodiment contains an acrylic resin used as a binder and contains citric acid, α-vinyl acetate, I-dihydroacetic acid carvness, I-menthone, I-peracetate, At least one solvent selected from the group consisting of carvone acetate and carmine d-dihydroacetic acid. Because it consists of citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvone, bumone, I-peripate acetate, carvyl acetate, and d-dihydroacetic acid carcyl acetate. The solvent selected by the group hardly dissolves the butyral resin used as the binder in the ceramic green sheet, forms a peeling layer containing the same binder as the ceramic green sheet, and prints a conductive paste on the peeling layer to form In the case of the electrode layer, it is possible to effectively prevent the occurrence of pinholes and cracks in the peeling layer, so that it is possible to effectively prevent the defects of the laminated ceramic electronic components such as the laminated ceramic capacitor. -20- (17) (17) 1248094 The weight average molecular weight of the acrylic resin contained in the conductive paste should be 450,000 or more and 900,000 or less, and an acrylic resin having a weight average molecular weight of 450,000 or more and 900,000 or less is used as the conductive paste. The adhesive can be adjusted to form a conductive paste having a desired viscosity. In addition, the acid value of the acrylic resin contained in the conductive paste should be 5 mgKOH/g or more and 25 mgKOH/g or less, and an acrylic resin having an acid value of 5 mgKOH/g or more and 25 mgKOH/g or less can be used as a binder of the conductive paste. A conductive paste having a desired viscosity. Preferably, before the electrode layer is formed or after the electrode layer is formed and dried, the surface of the second support sheet is printed on the surface of the second support sheet in a pattern complementary to the electrode layer pattern by a screen printing machine, a gravure printing machine, or the like. The prepared acrylic resin is used as a binder and contains citric acid, α-vinyl acetate, I-dihydroacetic acid, celery, I-menthone, I-peracetate, I-acetic acid The separator of at least one of the solvents selected from the group consisting of celyllone and d-dihydroacetic acid carvone is formed into a separator by a dielectric paste. As described above, the spacer layer is formed on the surface of the ceramic green sheet in a pattern complementary to the pattern of the electrode layer, thereby preventing a gap from being formed between the surface of the electrode layer and the surface of the ceramic green sheet forming the electrode layer, thereby being effective It is possible to prevent deformation of laminated electronic components such as laminated ceramic capacitors in which a plurality of laminated unit cells including ceramic green sheets and electrode layers are laminated, and to prevent detachment. Further, as described above, since it is composed of citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvone, I. menthone, I-periacetate, I-ethyl-21 - (18) ( 18) 1248094 The solvent selected from the group consisting of celery and d-dihydroacetic acid carvone hardly dissolves the butyral resin used as a binder in the ceramic green sheet to form a ceramic and a ceramic. When the peeling layer of the same binder of the raw sheet is printed and the dielectric paste is printed on the peeling layer to form the separator, the pinhole and the crack of the peeling layer can be effectively prevented, so that the lamination of the laminated ceramic capacitor or the like can be effectively prevented. Poor ceramic electronic parts. The weight average molecular weight of the acrylic resin contained in the dielectric paste for forming the separator should be 450,000 or more and 900,000 or less, and the acrylic resin having a weight average molecular weight of 450,000 or more and 900,000 or less is used as the bonding of the conductive paste. The agent can be adjusted to form a conductive paste having a desired viscosity. In addition, the acid value of the acrylic resin contained in the dielectric paste should be 5 mgKOH/g or more and 25 mgKOH/g or less, and an acrylic resin having an acid value of 5 mgKOH/g or more and 25 mgKOH/g or less is used as a binder of the dielectric paste. It can be made into a dielectric paste with a desired viscosity. Further, a rectangular third support piece is prepared, and a binder solution is applied onto the surface of the third support sheet by a bar coater, a squeeze coater, a reverse coater, a dip coater, a contact coater or the like, and dried to form Bonding layer. The binder solution should contain a binder of the same type as the binder contained in the dielectric paste for forming the ceramic green sheet, and a particle having substantially the same composition as the dielectric material particles contained in the ceramic green sheet. The thickness of the bonding layer is the following dielectric material particles, a plasticizer, a charge preventing agent, and a release agent. The bonding layer should be about 0. 3 / / m thickness below 'about 0. 0 2 // m to about -22- (19) 1248094 〇. 3//m is better, about 0. 02//m to about 0. The thickness of 2//m is the best. Bonding the adhesive layer formed on the rectangular third support sheet to the electrode layer or electrode layer and the isolation layer formed on the rectangular second support sheet, or the surface of the ceramic green sheet formed on the support sheet, and after being bonded, peeling off from the adhesive layer The third support piece, copy the adhesive layer. After the adhesive layer is copied onto the surface of the electrode layer or the electrode layer and the isolation layer, the ceramic green sheet formed on the surface of the rectangular support sheet is bonded to the surface of the adhesive layer, and after bonding, the support sheet is peeled off from the ceramic green sheet. The ceramic 0 green foil is copied onto the surface of the bonding layer to form a laminate unit containing the ceramic green sheet and the electrode layer. The adhesive layer is copied to the surface of the ceramic green sheet of the laminate unit obtained by the method in the same manner as the surface of the electrode layer or the electrode layer and the spacer layer is copied, and the surface is copied. The laminate unit of the bonded layer is cut to a specific size. Similarly, a laminate unit having a specific number of bonded layers on the surface is formed, and a laminate block in which a specific number of laminate units are laminated is formed. When the laminated body block is produced, first, the laminated body unit is positioned in a support formed of polyethylene terephthalate or the like so that the adhesive layer copied onto the surface of the laminate unit contacts the support. The pressure is applied by a press or the like, and the laminate unit is bonded to the support by a bonding layer. Thereafter, the second support sheet is peeled off from the release layer, and the laminate unit is laminated on the support. Next, the -23-(20) (20) 1248094 positioning of the new laminate unit is performed by the bonding layer formed on the surface contacting the surface of the peeling layer of the laminate unit laminated on the support. Pressing the press or the like, and laminating the new laminate unit to the release layer of the laminate unit laminated on the support by the adhesive layer, and then peeling off the second support from the release layer of the new laminate unit sheet. The same processing is repeated to form a laminated body block in which a specific number of laminated unit units are stacked. On the other hand, after the adhesive layer is copied onto the surface of the ceramic green sheet, the electrode layer formed on the second support sheet, or the electrode layer and the separator are bonded to the surface of the adhesive layer, and after bonding, the second support is peeled off from the peeling layer. The sheet, the electrode layer or the electrode layer, the separator layer, and the release layer are copied onto the surface of the adhesive layer to form a laminate unit including the ceramic green sheet and the electrode layer. The adhesive layer is copied to the surface of the peeling layer of the laminate unit obtained in this manner in the same manner as the surface of the ceramic green sheet is copied, and the laminated unit on which the surface has been pasted with the adhesive layer Cut to a specific size. Similarly, a laminate unit having a specific number of bonded layers on the surface is formed, and a laminate block in which a specific number of laminate units are laminated is formed. When the laminated body block is produced, first, the laminated body unit is positioned in a support formed of polyethylene terephthalate or the like so that the adhesive layer copied onto the surface of the laminate unit contacts the support. The pressure is applied by a press or the like, and the laminate unit is bonded to the support by a bonding layer. Thereafter, the support sheet is peeled off from the ceramic green sheet, and the laminate unit is laminated on the support. Next, the positioning of the new laminate-24-(21) 1248094 unit is performed by the bonding layer formed on the surface contacting the surface of the ceramic green sheet of the laminate unit laminated on the support, using stamping The machine or the like pressurizes the laminated layer unit to laminate the new laminate unit to the ceramic green sheet of the laminate unit laminated on the support, and thereafter, the support sheet is peeled off from the ceramic of the new laminate unit. The same processing is repeated to form a laminated body block in which a specific number of laminated unit units are stacked. The laminated body block including the specific number of laminated body units fabricated in this manner is laminated on the outer layer of the laminated ceramic capacitor, and the other outer layer is laminated on the laminated body block to obtain the layer The integrated body is subjected to press forming and cut into a specific size to form a plurality of ceramic green sheets. The ceramic green chip prepared in this manner is placed in a reducing gas atmosphere, the binder is removed and baking is further carried out. Next, a necessary external electrode or the like is placed on the baked ceramic green chip to form a laminated ceramic capacitor. According to this embodiment, after the electrode layer and the separator formed on the second support sheet are dried, the adhesive layer is adhered to the surface of the ceramic green sheet, and a conductive paste is printed on the surface of the ceramic green sheet to form a conductive paste. When the electrode layer is printed and the dielectric paste is printed to form the isolation layer, the conductive paste and the dielectric paste do not penetrate into the ceramic green sheet, and the electrode layer and the isolation layer can be formed on the surface of the ceramic green sheet as desired. Further, in the present embodiment, an acrylic resin which is used as a binder and contains citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvone, I-menthol, I-peracetate, I. The conductive paste of at least one of the solvents selected from the group consisting of carvone acetate and carmine ester of d-dihydroacetic acid to form an electrode layer because of citric acid, α-ethyl-25- (22) (22) 1248094 Group of acid terpene acetate, I-dihydroacetic acid carvone, I-menthone, I-peripate acetate, I-carveryl acetate, and d-dihydroacetic acid carvone The solvent selected in the group hardly dissolves the butyral resin used as the binder in the ceramic green sheet, forms a peeling layer containing the same binder as the ceramic green sheet, and prints a conductive paste on the peeling layer to form an electrode. In the case of the layer, pinholes and cracks can be effectively prevented from occurring in the peeling layer, so that it is possible to effectively prevent the defects of the laminated ceramic electronic components such as the laminated ceramic capacitor. Further, in the present embodiment, an acrylic resin containing a binder is used, and contains citric acid, α-vinyl acetate, I-dihydroacetic acid, celery, I-mente, and I-peracetate. a dielectric paste of at least one of the solvents selected from the group consisting of: I. celery acetate, and a mixture of picolinyl d-dihydroacetic acid to form a separator because of citric acid, α-acetic acid decene acetate The solvent selected from the group consisting of carboxyl dihydroacetate, I-menthol, I-peracetate, carvure acetate, and d-dihydroacetic acid carvone hardly dissolves the ceramic. The embryonic sheet contains a butyral resin as a binder, forms a release layer containing the same binder as the ceramic green sheet, and prints a dielectric paste on the release layer to form a separator, thereby effectively preventing the needle from being generated in the release layer. In the case of holes and cracks, it is possible to effectively prevent the defects of laminated ceramic electronic components such as laminated ceramic capacitors. In another embodiment of the present invention, after the adhesive layer is copied onto the surface of the electrode layer or the electrode layer and the isolation layer, the release layer, the electrode layer or the electrode layer, the isolation layer, the adhesion layer, and the layer are laminated on the second support sheet of the rectangle. The ceramic green sheet, after copying the adhesive layer to the surface of the ceramic green sheet formed by the laminated unit, is not cut into a laminated unit 'will be laminated on the rectangular branch -26- (23) (23) 1248094 The peeling layer of the laminated body unit formed by the ceramic green sheet, the bonding layer, the electrode layer or the electrode layer and the separator, and the peeling layer is adhered to the bonding layer, and the supporting piece is peeled off from the ceramic green sheet, and 2 The laminate units are stacked on the rectangular second support sheet. Next, the adhesive layer formed on the third support sheet is copied onto the ceramic green sheet on the surface of the two laminate units, and the ceramic green sheet, the adhesive layer, the electrode layer or the layer deposited on the rectangular support sheet or The peeling layer of the electrode unit, the separator, and the laminate unit formed by the release layer is adhered to the adhesive layer, and the support sheet is peeled off from the ceramic green sheet. The same process is repeated to form a laminate unit group in which a specific number of laminate units are laminated, and the adhesive layer formed on the third support sheet is copied to the ceramic green sheet on the surface of the laminate unit group. After the surface, it is cut into a specific size to form a laminated body block. On the other hand, after the adhesive layer is copied onto the surface of the ceramic green sheet, the ceramic green sheet, the adhesive layer, the electrode layer or the electrode layer and the separation layer, and the release layer are laminated on the rectangular support sheet, and the adhesive layer is copied to form. After the surface of the release layer of the laminate unit is not cut into a laminate unit, the release layer, the electrode layer or the electrode layer and the separation layer, the adhesion layer, and the ceramic green body laminated on the rectangular second support sheet are laminated. The ceramic green sheet of the laminate unit formed of the sheet is bonded to the adhesive layer, and the second support sheet is peeled off from the release layer, and the two laminate units are laminated on the rectangular support sheet. Next, the adhesive layer formed on the third support sheet is copied onto the release layer on the surface of the two laminate units, and the release layer, the electrode layer or the electrode layer and the isolation layer which are laminated on the rectangular second support sheet are laminated. The bonding layer, -27-(24) (24) 1248094, and the ceramic green sheet of the laminate unit formed of the ceramic green sheet are bonded to the bonding layer, and the second supporting sheet is peeled off from the peeling layer. The same process is repeated to produce a laminate unit group in which a specific number of laminated unit units are laminated, and further, the adhesive layer formed on the third support sheet is copied onto the surface of the peeling layer on the surface of the laminated unit group. After that, it is cut into a specific size to form a laminated body block. By using the laminated body block produced in this manner, a laminated ceramic capacitor was produced in the same manner as in the above embodiment. According to the present embodiment, the laminate of the laminate unit is performed one by one on the second support sheet or the support sheet of the rectangular shape, and a laminate unit group including a specific number of laminate units is produced, and thereafter, the laminate unit group is formed. By cutting into a specific size and forming a laminated body block, the manufacturing of the laminated body block can be greatly improved as compared with the case of performing lamination of a laminated body unit of a specific size one by one to form a laminated body block. effectiveness. In another embodiment of the present invention, after the adhesive layer is copied onto the surface of the electrode layer or the electrode layer and the isolation layer, the release layer, the electrode layer or the electrode layer, the isolation layer, the adhesion layer, and the layer are laminated on the second support sheet of the rectangle. The ceramic green sheet is formed by copying the adhesive layer to the surface of the ceramic green sheet of the formed laminate unit, and then cutting the electrode layer, or the electrode layer and the isolation layer formed on the second support sheet without cutting into a laminate unit. The layer is bonded to the adhesive layer, and the second support sheet is peeled off from the release layer, and the electrode layer, the electrode layer, the separator, and the release layer are copied onto the surface of the adhesive layer. Next, the adhesive layer formed on the third support sheet is copied to the surface of the release layer which is copied on the surface of the adhesive layer, and the ceramic -28-(25)(25)1248094 green sheet formed on the support sheet is bonded to the adhesive layer. The support piece is peeled off from the ceramic green sheet, and the ceramic green sheet is copied onto the surface of the adhesive layer. Further, the adhesive layer formed on the third support sheet is copied onto the surface of the ceramic green sheet which is formed on the surface of the adhesive layer, and the electrode layer formed on the second support sheet or the electrode layer and the isolation layer are bonded to the adhesive layer. The second support sheet is peeled off from the release layer, and the electrode layer, the electrode layer, the separator, and the release layer are copied onto the surface of the adhesive layer. The same process is repeated to form a laminate unit group in which a specific number of laminated unit units are laminated, and after the adhesive layer is copied onto the surface of the ceramic green sheet on the surface of the laminated unit group, the cut is performed. For a specific size, make a layer ί* Bjjh frft bar block. On the other hand, after the adhesive layer is copied onto the surface of the ceramic green sheet, the ceramic green sheet, the adhesive layer, the electrode layer or the electrode layer and the separation layer, and the release layer are laminated on the rectangular support sheet, and the adhesive layer is copied to form. After the surface of the peeling layer of the laminated unit is not cut into the laminated unit, the ceramic green sheet formed on the supporting sheet is bonded to the bonding layer, and the supporting sheet is peeled off from the ceramic green sheet to form the ceramic green sheet. Copy to the surface of the bonding layer. Next, the adhesive layer formed on the third support sheet is copied onto the surface of the ceramic green sheet which is copied on the surface of the adhesive layer, and the electrode layer or the electrode layer and the isolation layer formed on the second support sheet are bonded to the adhesive layer. The peeling layer peels off the second support sheet, and the electrode layer, the electrode layer, the separator, and the peeling layer are copied onto the surface of the adhesive layer. Further, the adhesive layer formed on the third support sheet is copied to the surface of the release layer which is formed on the surface of the adhesive layer, and the ceramic -29-(26) (26) 124894 green sheet formed on the support sheet is bonded to the adhesive layer. The support piece is peeled off from the ceramic green sheet, and the ceramic green sheet is copied onto the surface of the adhesive layer. The same process is repeated to form a laminate unit group in which a specific number of laminated unit units are laminated, and after the adhesive layer is copied onto the surface of the peeling layer on the surface of the laminated unit group, it is cut into a specific size. A laminated body block was produced by using the laminated body block produced in this manner, and a laminated ceramic capacitor was produced in the same manner as in the above embodiment. According to the embodiment, the copying of the adhesive layer, the electrode layer or the electrode layer and the separator, and the copying and bonding layer of the peeling layer are repeatedly performed on the surface of the laminate unit formed on the rectangular second support sheet or the support sheet. Copying and copying of ceramic green sheets, performing layering of laminate units one by one to make a layer unit group containing a specific number of layered unit units, and then 'cutting the layer unit group into specific ones Since the size is formed into a laminated body block, the manufacturing efficiency of the laminated body block can be greatly improved as compared with the case where the laminated body block which is cut into a specific size is laminated one by one to form a laminated body block. [Examples] Hereinafter, examples and comparative examples for the purpose of explaining the effects of the present invention will be described. Example 1 Preparation of Ceramic Green Sheets with Dielectric Paste Mixing 1. 48 parts by weight of (BaCa)Si03, 1. 01 parts by weight of Y2〇3, -30- (27) 1248094 〇·72 parts by weight of MgC03, 0. 13 parts by weight of MnO, and 0. 045 parts by weight of V205 was prepared to prepare an additive powder. The mixing is 100 parts by weight relative to the additive powder prepared in this manner. 3 parts by weight of ethanol, 72. 3 parts by weight of propanol, 25. 8 parts by weight of xylene, and 0. 93 parts by weight of a polyethylene glycol-based dispersant was prepared to prepare a puree, and the additive in the original slurry was pulverized. When pulverizing the additive in the puree, it will be n. 65 g of the original slurry and 450 g of Zr02 particles (2 mm in diameter) were placed in a 250 cc polyethylene container, and the polyethylene container was rotated at a peripheral speed of 45 m/min for 16 hours to pulverize the additive in the original slurry to prepare an additive puree. . The median diameter of the additive after pulverization is 〇.  1 // m. Next, 15 parts by weight of polyvinyl butyraldehyde (degree of polymerization 1450, degree of butyralization 69 mol%) was dissolved at 42 ° C at 42 ° C. 5 parts by weight of ethanol and 42. Five parts by weight of propanol was prepared to prepare a 15% solution of an organic vehicle, and a dielectric paste having a composition of the following composition was mixed in a polyethylene container of 5 cc for 20 hours to prepare a dielectric paste. When mixing, it will be 330. 1 g of the original slurry and 900 g of ZrO 2 particles (2 mm in diameter) were placed in a polyethylene container, and the polyethylene container was rotated at a peripheral speed of 45 m/min.

BaTi03粉末（堺化學工業株式會社製：商品名稱「BT-〇2」：粒徑〇·2 // m) 100重量份 添加物原漿 1 1 · 6 5重量份 乙醇 丙醇BaTi03 powder (product name: "BT-〇2": 〇·2 // m) 100 parts by weight Additive slurry 1 1 · 6 5 parts by weight Ethyl alcohol

3 5.3 2重量份 3 5.3 2重量份 -31 - 1248094 (28) 一*甲苯 16.32重量份 鄰苯二甲酸丁酯苯甲酯（可塑劑） 2.61重量份 石油醚 7.3重量份 聚乙二醇系分散劑 2.3 6重量份 咪D坐咻系帶電輔助劑 0.42重量份 有機載體 3 3.74重量份 甲基乙基酮 4 3 · 8 1重量份 2 - 丁氧基乙醇 4 3.8 1重量份 聚乙二醇系分散劑係使用以脂肪酸實施變性後之聚乙 一酉孚（HLB = 5 〜6) 〇 陶瓷生胚薄片之形成 利用壓鑄膜塗布器以50m/分之塗布速度，將所得到之 介電糊塗布於聚對苯二甲酸乙二酯薄膜上，形成塗膜，在 保持80 °C之乾燥爐中實施所得到之塗膜之乾燥，形成具有 厚度之陶瓷生胚薄片。 極用導電糊之調製 混合1·48重量份之（BaCa)Si03、1.01重量份之 γ2〇3、 0.72重量份之MgC03、0·13重量份之ΜηΟ、以及0.045重 量份之V 2 〇 5 ’調製添加物粉末。3 5.3 2 parts by weight 3 5.3 2 parts by weight -31 - 1248094 (28) a *toluene 16.32 parts by weight of butyl phthalate phthalate (plasticizer) 2.61 parts by weight of petroleum ether 7.3 parts by weight of polyethylene glycol dispersion 2.36 parts by weight of the microphone D sitting on the lanthanide charged adjuvant 0.42 parts by weight of the organic carrier 3 3.74 parts by weight of methyl ethyl ketone 4 3 · 8 1 part by weight of 2 - butoxyethanol 4 3.8 1 part by weight of polyethylene glycol The dispersing agent is formed by using a fatty acid to be denatured (HLB = 5 to 6). The formation of a ceramic green sheet is applied by a die casting film coater at a coating speed of 50 m/min. A coating film was formed on the polyethylene terephthalate film, and the obtained coating film was dried in a drying furnace maintained at 80 ° C to form a ceramic green sheet having a thickness. 1.48 parts by weight of (BaCa) SiO 3 , 1.01 parts by weight of γ 2 〇 3 , 0.72 parts by weight of MgC03, 0.13 parts by weight of ΜηΟ, and 0.045 parts by weight of V 2 〇 5 ' were prepared by using a conductive paste. The additive powder was prepared.

混合相對於以此方式調製之添加物粉末1 0 0重量份爲 150重量份之丙酮、104.3重量份之檸檬酸、以及1.5重量 份之聚乙二醇系分散劑來調製原漿，利用ASHIZAWA -32- (29) (29)1248094 FINETECH Ltd·製粉碎機「LMZ0.6」（商品名稱）粉碎原漿 中之添加物。 粉碎原漿中之添加物時，將Zr〇2顆粒（直徑〇.lmm)以 容器容量之80%之方式裝入容器內，以圓周速度14m/分旋 轉轉子，使原漿整體滯留於容器內之時間達到5分鐘爲止 之方式在容器及原漿槽之間循環，粉碎原漿中之添加物。 粉碎後之添加物之中位直徑爲0.1 // m。 其次，利用蒸發器蒸發丙酮，將其從原漿中除去，調 製成添加物分散於檸檬酸之添加物糊。添加物糊中之非揮 發成分濃度爲49.3重量％。 其次，將8重量份之酸價爲5mgKOH/g之甲基丙烯酸 甲酯及丙烯酸丁酯之共聚合物（共聚合比（莫耳比）82 : 18 、重量平均分子量70萬）在70 °C下溶解於92重量份之檸檬 酸，調製成有機載體之8%溶液，此外，利用球磨機對具 有以下組成之原漿實施1 6小時之分散。分散條件係球磨機 中之Zr02(直徑2.0mm)之充塡量爲30容積％、球磨機中之 原漿量爲60容積％、球磨機之圓周速度爲4 5 m/分。 川鐵工業株式會社製之鎳粉末（粒徑0.2// m) 1〇〇重量份 添加物糊 1 .77重量份The raw slurry was prepared by mixing 100 parts by weight of acetone, 104.3 parts by weight of citric acid, and 1.5 parts by weight of a polyethylene glycol-based dispersant, in an amount of 100 parts by weight of the additive powder prepared in this manner, using ASHIZAWA - 32- (29) (29) 12490094 FINETECH Ltd. pulverizer "LMZ0.6" (trade name) is used to pulverize the additives in the puree. When pulverizing the additive in the puree, the Zr〇2 particles (diameter l.lmm) were placed in the container at 80% of the container capacity, and the rotor was rotated at a peripheral speed of 14 m/min to keep the whole slurry in the container. The time between the container and the raw slurry tank was circulated by the time of 5 minutes, and the additive in the original slurry was pulverized. The median diameter of the pulverized additive is 0.1 // m. Next, acetone was evaporated by an evaporator, and it was removed from the original slurry to prepare an additive paste in which the additive was dispersed in citric acid. The concentration of the non-volatile component in the additive paste was 49.3% by weight. Next, 8 parts by weight of a copolymer of methyl methacrylate and butyl acrylate having an acid value of 5 mg KOH/g (copolymerization ratio (mole ratio) 82:18, weight average molecular weight 700,000) at 70 ° C The solution was dissolved in 92 parts by weight of citric acid to prepare an 8% solution of an organic vehicle, and further, the original slurry having the following composition was subjected to dispersion for 16 hours by a ball mill. The dispersion condition was that the Zr02 (diameter 2.0 mm) in the ball mill had a volume of 30% by volume, the amount of the slurry in the ball mill was 60% by volume, and the peripheral speed of the ball mill was 4 5 m/min. Nickel powder (particle size 0.2//m) manufactured by Kawasaki Kogyo Co., Ltd. 1 part by weight Additive paste 1.77 parts by weight

BaTi03粉末（堺化學工業株式會社製：粒徑0.05/zm) 1 9.1 4重量份 有機載體 56.25重量份 聚乙二醇系分散劑 1 · 1 9重量份 -33- (30) (30)1248094 磷苯二甲酸二異辛酯（可塑劑） 2.25重量份 檸檬酸 8 3.9 6重量份 丙酮 5 6重量份 其次，利用具有蒸發器及加熱機構之攪拌裝置，從利 用此方式得到之原漿蒸發丙酮，除去混合物而得到導電糊 。導電糊中之導電體材料濃度爲4 7重量％。 電極層之形成及層積體單元之製作 利用網板印刷機以特定圖案將以此方式調製之導電糊 列印於陶瓷生胚薄片上，實施9(TC、5分鐘之乾燥，形成 具有l//m厚度之電極層，製成在聚對苯二甲酸乙二醋薄 膜之表面層積著陶瓷生胚薄片及電極層之層積體單元。 利用株式會社小（土反）硏究所製「SURFCORDER(SE-30D)」（商品名稱）檢測到以上述方式形成之電極層之表面 粗度（Ra)爲 0.070 // m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及皺紋。 陶瓷生胚晶片之製作 如上面所述，利用壓鑄膜塗布器將調製成之介電糊塗 布於聚對苯二甲酸乙二酯薄膜之表面，形成塗膜，實施塗 膜之乾燥而形成具有厚度之陶瓷生胚薄片。 從聚對苯二甲酸乙二酯薄膜剝離以此方式製作之1 〇 // m厚度之陶瓷生胚薄片，進行裁切，實施經過裁切之5片 -34- (31) 1248094 陶瓷生胚薄片之層積，形成具有50/zm厚度之覆蓋層，並 從聚對苯二甲酸乙二酯薄膜剝離層積體單元，進行裁切， 將經過裁切之50片層積體單元層積於覆蓋層上。 其次，從聚對苯二甲酸乙二酯薄膜剝離具有1 0 // m厚 度之陶瓷生胚薄片，進行裁切，將經過裁切之5片陶瓷生 胚薄片層積於層積層積體單元上，製成層積著：含有具有 50//m厚度之下部覆蓋層、具有Ι/zm厚度之陶瓷生胚薄 片、以及具有1/zm厚度之電極層之50片層積體單元之具 有100/zm厚度之有效層；及具有50//m厚度之上部覆蓋 層；之層積體。 此外，70 °C之溫度條件下，對利用此方式得到之層積 體施加lOOMPa之壓力進行冲壓成形，利用切塊加工機裁 切成特定尺寸，製成陶瓷生胚晶片。 層積陶瓷電容器樣本之製作 將以此方式製成之陶瓷生胚晶片置於空氣中依以下條 件處理，除去黏結劑。 昇溫速度：50°C /小時 維持溫度：240°C 維持時間：8小時 除去黏結劑後，在控制於露點20 °C之氮氣及氫氣之混 合氣環境下，以下述條件對各陶瓷生胚晶片進行烘焙處理 。混合氣中之氮氣及氫氣之含有量爲95容積％及5容積％。 昇溫速度：3 00 °C /小時 (32) 1248094 維持溫度：120(TC 維持時間：2小時 冷卻速度：3 00 °C /小時 此外，在控制於露點20。(：之氮氣環境下，以下述條件 對經過烘焙之陶瓷生胚晶片實施退火處理。BaTi03 powder (manufactured by Seiko Chemical Co., Ltd.: particle size 0.05/zm) 1 9.1 4 parts by weight of organic vehicle 56.25 parts by weight of polyethylene glycol-based dispersant 1 · 19 parts by weight - 33 - (30) (30) 1248094 phosphorus Diisooctyl phthalate (plasticizer) 2.25 parts by weight of citric acid 8 3.9 6 parts by weight of acetone 5 6 parts by weight Next, the acetone obtained by this method is used to evaporate acetone using a stirring device having an evaporator and a heating mechanism. The mixture was removed to obtain a conductive paste. The concentration of the conductor material in the conductive paste was 47% by weight. Formation of electrode layer and fabrication of laminate unit The conductive paste prepared in this manner is printed on a ceramic green sheet by a screen printing machine in a specific pattern, and dried (9, TC, 5 minutes, formed to have l/ The electrode layer having a thickness of m/m is a laminate unit in which a ceramic green sheet and an electrode layer are laminated on the surface of a polyethylene terephthalate film. SURFCORDER (SE-30D) (trade name) detected that the surface roughness (Ra) of the electrode layer formed in the above manner was 0.070 // m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and was not observed. To cracks and wrinkles. Preparation of ceramic green sheet The coating of the dielectric paste is applied to the surface of the polyethylene terephthalate film by a die-cast film coater to form a coating film, and the coating film is applied. Drying to form a ceramic green sheet having a thickness. The ceramic green sheet having a thickness of 1 〇//m produced in this manner is peeled off from the polyethylene terephthalate film, and cut, and 5 pieces are cut. -34- (31) 1248094 Lamination of porcelain green sheets to form a cover layer having a thickness of 50/zm, and peeling the laminate unit from the polyethylene terephthalate film, cutting, and cutting the 50 laminated units Laminated on the cover layer. Next, the ceramic green sheet having a thickness of 10 // m is peeled off from the polyethylene terephthalate film, and cut, and the cut 5 pieces of ceramic green sheets are laminated. On the laminated laminate unit, a laminate is formed: a ceramic green sheet having a thickness of 50//m, a ceramic green sheet having a thickness of Ι/zm, and an electrode layer having a thickness of 1/zm. An active layer of the integrated unit having a thickness of 100/zm; and a laminate having an overcoat layer having a thickness of 50//m; and further, applying a laminate obtained by this method at a temperature of 70 ° C The pressure of lOOMPa is press-formed, and the ceramic green chip is cut into a specific size by a dicing machine. The production of the laminated ceramic capacitor sample is placed in the air by the ceramic green chip prepared in this way according to the following conditions. Treatment, remove the binder. Heating rate: 50 C / hour maintenance temperature: 240 ° C Maintenance time: 8 hours After removing the binder, the ceramic green sheets were baked under the following conditions under a mixture of nitrogen and hydrogen controlled at a dew point of 20 ° C. The content of nitrogen and hydrogen in the gas is 95% by volume and 5% by volume. Temperature increase rate: 3 00 °C / hour (32) 1248094 Maintenance temperature: 120 (TC maintenance time: 2 hours Cooling rate: 3 00 °C / In addition, the baked ceramic green sheet was annealed under the following conditions under a nitrogen atmosphere controlled by a dew point of 20.

昇溫速度：300°C /小時 維持溫度：l〇〇〇°C 維持時間：3小時 冷卻速度：3 00°C /小時 以噴砂對利用此方式得到之燒結體之端面進行硏磨後 ，塗布In-Ga合金，形成端子電極而製成層積陶瓷電容器 樣本。 同樣的，製作合計5 0個層積陶瓷電容器樣本。 短路率之檢測 利用多用電表檢測以此方式製作之50個層積陶瓷電容 器樣本之電阻値，檢査層積陶瓷電容器樣本之短路不良。 將所得到之電阻値爲1 〇〇k Ω以下者視爲短路不良，計 算確認爲短路不良之層積陶瓷電容器樣本數，並計算相對 於層積陶瓷電容器樣本總數之比例（％)，檢測短路率。 結果，短路率爲16%。 實施例2 除了調製導電糊時之溶劑以α -乙酸萜烯醋酸酯取π -36- (33) 1248094 檸檬酸以外，其餘與實施例1相同，在陶瓷生胚薄片上形 成電極層，檢測到電極層之表面粗度（R a)爲〇 · 〇 6 9 // m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及皺紋。 此外，與實施例1相同，製作50個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 4%。 實施例3 除了調製導電糊時之溶劑以I-二氫乙酸香芹酯取代檸 檬酸以外，其餘與實施例1相同，在陶瓷生胚薄片上形成 電極層，檢測到電極層之表面粗度（Ra)爲0.070 // m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及皴紋。 此外，與‘實施例1相同，製作50個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 8%。 實施例4 除了調製導電糊時之溶劑以I·薄荷酮取代檸檬酸以外 ，其餘與實施例1相同，在陶瓷生胚薄片上形成電極層， 檢測到電極層之表面粗度（Ra)爲0.066// m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及皺紋。 -37- (34) (34)1248094 此外，與實施例1相同，製作5 0個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 〇%。 實施例5 除了調製導電糊時之溶劑以I-紫蘇醋酸酯取代檸檬酸 以外，其餘與實施例1相同，在陶瓷生胚薄片上形成電極 層，檢測到電極層之表面粗度（Ra)爲0.074 // m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及鈹紋。 此外，與實施例1相同，製作5 0個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 6%。 實施例6 除了調製導電糊時之溶劑以I-乙酸香芹酯取代檸檬酸 以外，其餘與實施例1相同，在陶瓷生胚薄片上形成電極 層，檢測到電極層之表面粗度（Ra)爲0.076 # m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及皺紋。 此外，與實施例1相同，製作5 0個層積陶瓷電容器樣 本，利用多用電表檢測5 0個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲8 %。 •38- (35) (35)1248094 實施例7 除了調製導電糊時之溶劑以d-二氫乙酸香芹酯取代 檸檬酸以外，其餘與實施例1相同，在陶瓷生胚薄片上形 成電極層，檢測到電極層之表面粗度（Ra)爲0.076 μ m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及皺紋。 此外，與實施例1相同，製作5 0個層積陶瓷電容器樣 本，利用多用電表檢測5 0個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 0%。 比較例1 除了調製導電糊時之溶劑以萜品醇及煤油之混合溶劑 (混合比（質量比）5 0 : 5 0)取代檸檬酸以外，其餘與實施例1 相同，在陶瓷生胚薄片上形成電極層，檢測到電極層之表 面粗度（Ra)爲 0.102 // m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，電極層之表面觀察到裂縫及皴紋。 此外，與實施例1相同，製作50個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ’檢測到之層積陶瓷電容器樣本之短路率爲90%。 比較例2 . 除了調製導電糊時之溶劑以萜品醇取代檸檬酸以外， 其餘與實施例1相同，在陶瓷生胚薄片上形成電極層，檢 -39- (36) (36)1248094 測到電極層之表面粗度（Ra)爲0.112/z m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，電極層之表面觀察到裂縫及皺紋。 此外，與實施例1相同，製作5 0個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲88%。 由實施例1至7及比較例1及2可知，在利用含有當做黏 結劑使用之聚乙烯丁醛（聚合度1450、丁醛化度69%)之介 電糊所形成之陶瓷生胚薄片上，印刷含有當做黏結劑使用 之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之 共聚合物且含有當做溶劑使用之萜品醇及煤油之混合溶劑 (混合比（質量比）5 0 : 5 0)之導電糊而形成電極層時，或者 ，在利用含有當做黏結劑使用之聚乙烯丁醛（聚合度1450 、丁醛化度69%)之介電糊所形成之陶瓷生胚薄片上，印刷 含有當做黏結劑使用之重量平均分子量70萬之甲基丙烯酸 甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使用之萜品 醇之導電糊而形成電極層時，電極層之表面粗度（Ra)會惡 化，而使利用層積體單元之層積所製作之層積陶瓷電容器 更可能產生裂縫，相對於此，在利用含有當做黏結劑使用 之聚乙烯丁醛（聚合度1 450、丁醛化度69%)之介電糊所形 成之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量平 均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物 且含有當做溶劑使用之檸檬酸之導電糊而形成電極層時， 或者，在利用含有當做黏結劑使用之聚乙烯丁醛（聚合度 -40- (37) (37)1248094 1 450、丁醛化度69%)之介電糊所形成之陶瓷生胚薄片上， 印刷含有當做黏結劑使用之重量平均分子量70萬之甲基丙 烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使用之 α-乙酸萜烯醋酸酯之導電糊而形成電極層時，或者，在 利用含有當做黏結劑使用之聚乙烯丁醛（聚合度1 4 5 0、丁 醛化度69%)之介電糊所形成之陶瓷生胚薄片上，印刷含有 當做黏結劑使用之重量平均分子量70萬之甲基丙烯酸甲酯 及丙烯酸丁酯之共聚合物且含有當做溶劑使用之卜二氫乙 酸香芹酯之導電糊而形成電極層時，或者，在利用含有當 做黏結劑使用之聚乙烯丁醛（聚合度1450、丁醛化度69%) 之介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏結劑 使用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁 酯之共聚合物且含有當做溶劑使用之1_薄荷酮之導電糊而 形成電極層時，或者，在利用含有當做黏結劑使用之聚乙 烯丁醛（聚合度1 45 0、丁醛化度69%)之介電糊所形成之陶 瓷生胚薄片上，印刷含有當做黏結劑使用之重量平均分子 量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有 當做溶劑使用之I-紫蘇醋酸酯之導電糊而形成電極層時， 或者，在利用含有當做黏結劑使用之聚乙烯丁醛（聚合度 1 4 50、丁醛化度69%)之介電糊所形成之陶瓷生胚薄片上， 印刷含有當做黏結劑使用之重量平均分子量70萬之甲基丙 烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使用之 I-乙酸香芹酯之導電糊而形成電極層時，或者，在利用含 有當做黏結劑使用之聚乙烯丁醛（聚合度1 4 5 0、丁醛化度 (38) (38)1248094 6 9%)之介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏 結劑使用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯 酸丁酯之共聚合物且含有當做溶劑使用之d-二氫乙酸香 芹酯之導電糊而形成電極層時，電極層之表面粗度（Ra)已 獲得改善。 此外，由實施例1至7及比較例1及2可知，在利用含有 當做黏結劑使用之聚乙烯丁醛（聚合度1 45 0、丁醛化度 69%)之介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏 結劑使用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯 酸丁酯之共聚合物且含有當做溶劑使用之萜品醇及煤油之 混合溶劑（混合比（質量比）50 : 50)之導電糊來製作層積體 單元，並實施50片層積體單元之層積而製成層積陶瓷電容 器時，或者，在利用含有當做黏結劑使用之聚乙烯丁醛（ 聚合度1 450、丁醛化度69%)之介電糊所形成之陶瓷生胚薄 片上，印刷含有當做黏結劑使用之重量平均分子量70萬之 甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑 使用之萜品醇之導電糊來製作層積體單元，並實施50片層 積體單元之層積而製成層積陶瓷電容器時，層積陶瓷電容 器之短路率明顯較高，相對於此，在利用含有當做黏結劑 使用之聚乙烯丁醛（聚合度1450、丁醛化度69%)之介電糊 所形成之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重 量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚 合物且含有當做溶劑使用之檸檬酸之導電糊來製作層積體 單元，並實施50片層積體單元之層積而製成層積陶瓷電容 (39) (39)1248094 器時，或者，在利用含有當做黏結劑使用之聚乙烯丁醛（ 聚合度1 45 0、丁醛化度69%)之介電糊所形成之陶瓷生胚薄 片上，印刷含有當做黏結劑使用之重量平均分子量70萬之 甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑 使用之α -乙酸萜烯醋酸酯之印刷導電糊來製作層積體單 元，並實施50片層積體單元之層積而製成層積陶瓷電容器 時，或者，在利用含有當做黏結劑使用之聚乙烯丁醛（聚 合度1 450、丁醛化度69%)之介電糊所形成之陶瓷生胚薄片 上，印刷含有當做黏結劑使用之重量平均分子量70萬之甲 基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使 用之I-二氫乙酸香芹酯之導電糊來製作層積體單元，並實 施50片層積體單元之層積而製成層積陶瓷電容器時，或者 ，在利用含有當做黏結劑使用之聚乙烯丁醛（聚合度1450 、丁醛化度69%)之介電糊所形成之陶瓷生胚薄片上，印刷 含有當做黏結劑使用之重量平均分子量70萬之甲基丙烯酸 甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使用之I-薄 荷酮之導電糊來製作層積體單元，並實施5 0片層積體單元 之層積而製成層積陶瓷電容器時，或者，在利用含有當做 黏結劑使用之聚乙烯丁醛（聚合度1 450、丁醛化度69%)之 介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏結劑使 用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯 之共聚合物且含有當做溶劑使用之I-紫蘇醋酸酯之導電糊 來製作層積體單元，並實施5 0片層積體單元之層積而製成 層積陶瓷電容器時，或者，在利用含有當做黏結劑使用之 -43- (40) (40)1248094 聚乙烯丁醛（聚合度1450、丁醛化度69%)之介電糊所形成 之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量平均 分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且 含有當做溶劑使用之I-乙酸香芹酯之導電糊來製作層積體 單元，並實施5 0片層積體單元之層積而製成層積陶瓷電容 器時，或者，在利用含有當做黏結劑使用之聚乙烯丁醛（ 聚合度1450、丁醛化度69%)之介電糊所形成之陶瓷生胚薄 片上，印刷含有當做黏結劑使用之重量平均分子量70萬之 甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑 使用之d-二氫乙酸香芹酯之導電糊來製作層積體單元， 並實施50片層積體單元之層積而製成層積陶瓷電容器時， 可大幅降低層積陶瓷電容器之短路率。 在比較例1及2中，當做導電糊之溶劑使用之萜品醇及 煤油之混合溶劑（混合比（質量比）5 0 : 5 0)及萜品醇會溶解 以形成陶瓷生胚薄片爲目的之介電糊所含有之聚乙烯丁醛 ，故電極層之表面會發生裂縫及鈹紋，而導致表面粗度 (Ra)惡化，並在陶瓷生胚薄片產生針孔及龜裂，相對於此 ，實施例1至7時，當做導電糊之溶劑使用之檸檬酸、α -乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇 醋酸酯、卜乙酸香芹酯、以及d-二氫乙酸香芹酯幾乎不會 溶解以形成陶瓷生胚薄片爲目的之介電糊所含有之聚乙烯 丁醛，因此，可有效防止電極層表面產生裂縫及皺紋之情 形，而防止陶瓷生胚薄片產生針孔及龜裂。 -44- (41) (41)1248094 實施例8 陶瓷生胚薄片用介電糊之調製 與實施例1相同，調製陶瓷生胚薄片用介電糊。 陶瓷生胚薄片之形成 與實施例1相同，將陶瓷生胚薄片用介電糊塗布於聚 對苯二甲酸乙二酯薄膜上，形成具有l//m厚度之陶瓷生 胚薄片。 隔離層用介電糊之調製 混合1.48重量份之（BaCa)Si03、1.01重量份之 Y203、 0.72重量份之 MgC03、0.13重量份之ΜηΟ、以及0.045重 量份之V 2 Ο 5，調製添加物粉末。 相對於以此方式調製之添加物粉末1 00重量份，混合 150重量份之丙酮、104.3重量份之檸檬酸、以及1.5重量 份之聚乙二醇系分散劑來調製原漿，利用 ASHIZAWA FINETECH Ltd.製粉碎機「LMZ0.6」（商品名稱）粉碎原漿 中之添加物。 粉碎原漿中之添加物時，將Zr02顆粒（直徑0.1mm)以 容器容量之80 %之方式裝入容器內，以圓周速度14 m/分旋 轉轉子，使原漿整體滯留於容器內之時間達到5分鐘爲止 之方式在容器及原漿槽之間循環，粉碎原漿中之添加物。 粉碎後之添加物之中位直徑爲0.1 /i m。 其次’利用蒸發器蒸發丙酮，將其從原漿中除去，調 -45- (42) 1248094 製成添加物分散於檸檬酸之添加物糊。添加物糊中之非揮 發成分濃度爲4 9.3重量％。Heating rate: 300 ° C / hr Maintaining temperature: l 〇〇〇 ° C Maintenance time: 3 hours Cooling rate: 3 00 ° C / hr After sand blasting the end face of the sintered body obtained by this method, coating In A -Ga alloy was formed into a terminal electrode to form a laminated ceramic capacitor sample. Similarly, a total of 50 samples of laminated ceramic capacitors were fabricated. Detection of short-circuit rate The resistance 値 of 50 laminated ceramic capacitor samples fabricated in this manner was detected by a multi-meter to check for short-circuit defects in the laminated ceramic capacitor samples. When the obtained resistance 値 is 1 〇〇k Ω or less, it is regarded as a short-circuit defect, and the number of laminated ceramic capacitor samples confirmed to be short-circuit defects is calculated, and the ratio (%) to the total number of laminated ceramic capacitor samples is calculated, and the short circuit is detected. rate. As a result, the short circuit rate was 16%. Example 2 An electrode layer was formed on a ceramic green sheet, except that the solvent in the preparation of the conductive paste was π-36-(33) 1248094 citric acid using α-acetic acid decene acetate, and the same as in Example 1, an electrode layer was formed on the ceramic green sheet. The surface roughness (R a) of the electrode layer is 〇· 〇 6 9 // m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and wrinkles were not observed. Further, in the same manner as in the first embodiment, 50 laminated ceramic capacitor samples were prepared, and the resistance 値 of the 50 laminated ceramic capacitor samples was measured by a multimeter, and the short circuit rate of the laminated ceramic capacitor samples was found to be 14%. Example 3 An electrode layer was formed on a ceramic green sheet, and the surface roughness of the electrode layer was detected, except that the solvent in the preparation of the conductive paste was substituted with citric acid with 1 - dihydroacetic acid carvone (Example 1). Ra) is 0.070 // m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and crepe lines were not observed. Further, in the same manner as in the first embodiment, 50 laminated ceramic capacitor samples were produced, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by a multimeter, and the short circuit rate of the laminated ceramic capacitor samples was detected to be 1 8%. . Example 4 An electrode layer was formed on a ceramic green sheet, and the surface roughness (Ra) of the electrode layer was found to be 0.066, except that the solvent in the preparation of the conductive paste was substituted with citric acid by I. menthone. // m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and wrinkles were not observed. -37- (34) (34) 1248094 In the same manner as in the first embodiment, 50 samples of laminated ceramic capacitors were fabricated, and the resistance 値 of 50 stacked ceramic capacitor samples was detected by a multimeter, and the laminated product was detected. The short circuit rate of the ceramic capacitor sample is 1 〇%. Example 5 An electrode layer was formed on a ceramic green sheet, and the surface roughness (Ra) of the electrode layer was detected, except that the solvent in the preparation of the conductive paste was substituted with citric acid by I-periolan acetate. 0.074 // m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and crepe lines were not observed. Further, in the same manner as in the first embodiment, 50 samples of the laminated ceramic capacitor were fabricated, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by the multimeter, and the short circuit rate of the laminated ceramic capacitor sample was detected to be 6%. . Example 6 An electrode layer was formed on a ceramic green sheet, and the surface roughness (Ra) of the electrode layer was detected, except that the solvent in the preparation of the conductive paste was substituted with citric acid with 1 -carvyl acetate. Is 0.076 # m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and wrinkles were not observed. Further, in the same manner as in the first embodiment, 50 samples of the laminated ceramic capacitor were fabricated, and the resistance 値 of the sample of the 50 laminated ceramic capacitors was detected by the multimeter, and the short circuit rate of the sample of the laminated ceramic capacitor was detected to be 8%. . • 38-(35) (35) 1240894 Example 7 An electrode layer was formed on a ceramic green sheet, except that the solvent in the preparation of the conductive paste was substituted with citric acid with d-dihydroacetic acid carvone. The surface roughness (Ra) of the electrode layer was detected to be 0.076 μm. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and wrinkles were not observed. Further, in the same manner as in the first embodiment, 50 samples of the laminated ceramic capacitor were fabricated, and the resistance 値 of the sample of the 50 laminated ceramic capacitors was detected by the multimeter, and the short circuit rate of the sample of the laminated ceramic capacitor was detected to be 10. %. Comparative Example 1 The solvent in the preparation of the conductive paste was replaced with citric acid in a mixed solvent of terpineol and kerosene (mixing ratio (mass ratio) of 50:50), and the same as in Example 1, on the ceramic green sheet. The electrode layer was formed, and the surface roughness (Ra) of the electrode layer was detected to be 0.102 // m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and crepe lines were observed on the surface of the electrode layer. Further, in the same manner as in the first embodiment, 50 laminated ceramic capacitor samples were prepared, and the short-circuit rate of the laminated ceramic capacitor samples detected by the resistance 値' of 50 samples of the 50-layer ceramic capacitor samples was measured by a multimeter. Comparative Example 2. An electrode layer was formed on a ceramic green sheet, except that the solvent in the preparation of the conductive paste was replaced with terpineol to replace the citric acid, and the test was carried out, and the test was carried out by -39-(36)(36)1248094. The surface roughness (Ra) of the electrode layer was 0.112 / zm. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and wrinkles were observed on the surface of the electrode layer. Further, in the same manner as in the first embodiment, 50 samples of the laminated ceramic capacitors were prepared, and the resistance 値 of the samples of the 50 laminated ceramic capacitors was detected by the multimeter, and the short circuit rate of the laminated ceramic capacitor samples was found to be 88%. From Examples 1 to 7 and Comparative Examples 1 and 2, it was found that ceramic green sheets formed by using a dielectric paste containing polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) used as a binder were used. , printing a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing a mixed solvent of terpineol and kerosene as a solvent (mixing ratio (mass ratio) 5 0 : 5 0) Conductive paste to form an electrode layer, or a ceramic green sheet formed using a dielectric paste containing polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) used as a binder The surface of the electrode layer is formed by printing a conductive paste containing a weight average molecular weight of 700,000 methyl methacrylate and butyl acrylate which is used as a binder and containing a conductive paste of terpineol as a solvent to form an electrode layer. The thickness (Ra) is deteriorated, and the laminated ceramic capacitor fabricated by the lamination of the laminate unit is more likely to cause cracks. In contrast, the use of polyvinyl butyral (polymerized) as a binder is used. a ceramic green sheet formed by a dielectric paste of 1 450 and a butyralization degree of 69%), which is printed with a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder. When the electrode layer is formed by using a conductive paste of citric acid as a solvent, or by using polyvinyl butyral (polymerization degree -40-(37) (37) 1248940 1 450, butyraldehyde degree) which is used as a binder 69%) of the ceramic green sheets formed by the dielectric paste, printing a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing α as a solvent. When the electrode layer is formed by the conductive paste of decene acetate, or by using a dielectric paste containing polyvinyl butyral (degree of polymerization 1 450, 69% butylation) used as a binder. On the ceramic green sheet, a conductive paste containing a weight average molecular weight of 700,000 methyl methacrylate and butyl acrylate which is used as a binder and containing a conductive paste of carboxyl dihydroacetate as a solvent is printed. In the case of the electrode layer, or on the ceramic green sheet formed by using a dielectric paste containing polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) used as a binder, the printing contains the use as a binder. a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 and containing an electroconductive paste of 1_mentone used as a solvent to form an electrode layer, or a polyethylene containing a binder as a binder A ceramic green sheet formed of a dielectric paste of butyraldehyde (degree of polymerization 1 450 0, degree of butyralization 69%) was printed with methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder. a copolymer of an ester and a conductive paste of I-Pursyl acetate used as a solvent to form an electrode layer, or a polyvinyl butyral containing a binder as a binder (degree of polymerization 1 4 50, degree of butyralization) 69%) of the ceramic green sheets formed by the dielectric paste, printed with a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing When the electrode layer is formed by using a conductive paste of I-carvyl acetate as a solvent, or by using polyvinyl butyral as a binder (degree of polymerization 1 4 50, degree of butyralization (38) (38) ) 1248094 6 9%) of the ceramic green sheet formed by the dielectric paste, printed with a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and used as a solvent When the electrode layer is formed by the conductive paste of d-dihydroacetic acid carvacrol, the surface roughness (Ra) of the electrode layer has been improved. Further, from Examples 1 to 7 and Comparative Examples 1 and 2, it was found that a ceramic formed using a dielectric paste containing polyvinyl butyral (polymerization degree 150 0, butyral degree 69%) used as a binder was used. On the green sheet, a co-polymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing a mixture of terpineol and kerosene as a solvent (mixing ratio (mass) Ratio of 50: 50) conductive paste to make a laminate unit, and to laminate a 50-layer laminate unit to form a laminated ceramic capacitor, or to use a polyvinyl butyral used as a binder (The ceramic green sheet formed by the dielectric paste having a degree of polymerization of 1 450 and a degree of butyralization of 69%) was printed with a total weight of 700,000 methyl methacrylate and butyl acrylate as a binder. When the polymer contains a conductive paste of terpineol as a solvent to form a laminate unit, and a laminate of 50 laminate units is implemented to form a laminated ceramic capacitor, the short circuit rate of the laminated ceramic capacitor is significantly higher. high, On the other hand, on the ceramic green sheet formed by using a dielectric paste containing polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) used as a binder, the printing contains the weight average used as a binder. a copolymer of methyl methacrylate and butyl acrylate having a molecular weight of 700,000 and containing a conductive paste of citric acid used as a solvent to form a laminate unit, and performing lamination of 50 laminate units to form a layer Ceramic capacitors (39) (39) 1248094, or ceramics formed using a dielectric paste containing polyvinyl butyral (degree of polymerization 1 405, 69% butyralization) used as a binder On the embryo sheet, a printed conductive paste containing a weight average molecular weight of 700,000 methyl methacrylate and butyl acrylate which is used as a binder and containing α-acetic acid acetate as a solvent is printed to form a layer. When the integrated unit is used to laminate a 50-layer laminate unit to form a laminated ceramic capacitor, or in the use of a polyvinyl butyral used as a binder (degree of polymerization 1 450, degree of butyralization 69%) ) On the ceramic green sheet formed by the paste, a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing I-dihydroacetic acid as a solvent is printed. The conductive paste is used to form a laminate unit, and a laminate of 50 laminate units is used to form a laminated ceramic capacitor, or a polyvinyl butyral (polymerization degree of 1450, butyl) used as a binder is used. On a ceramic green sheet formed by a dielectric paste having a degree of hydroformylation of 69%), a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder is used and used as a solvent. A conductive paste of I-menthol to prepare a laminate unit, and a laminate of 50 laminate units is used to form a laminated ceramic capacitor, or a polyvinyl butyral used as a binder is used. On a ceramic green sheet formed by a dielectric paste having a degree of polymerization of 1 450 and a degree of butyralization of 69%, a methyl methacrylate and a propylene having a weight average molecular weight of 700,000 as a binder are printed. a copolymer of butyl acrylate and a conductive paste of I-periolan acetate used as a solvent to form a laminate unit, and a laminate of 50 laminate units is used to form a laminated ceramic capacitor, or On the ceramic green sheet formed by using a dielectric paste containing -43- (40) (40) 1248094 polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) used as a binder, the printing contains As a binder, a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 and a conductive paste of I-carvyl acetate used as a solvent is used to form a laminate unit, and 50 0 is implemented. When the laminated body unit is laminated to form a laminated ceramic capacitor, or by using a dielectric paste containing polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) used as a binder On the ceramic green sheet, a conductive paste containing a weight average molecular weight of 700,000 methyl methacrylate and butyl acrylate as a binder and containing a d-dihydroacetic acid caraway ester as a solvent is printed. Making a laminate When laminated embodiments and laminate unit 50 is made of laminated ceramic capacitors, can significantly reduce the short-circuiting of the ceramic laminate capacitors. In Comparative Examples 1 and 2, a mixed solvent of terpineol and kerosene (mixing ratio (mass ratio) of 50:50) used as a solvent for a conductive paste and terpineol were dissolved to form ceramic green sheets. The polyvinyl butyral contained in the dielectric paste causes cracks and crepe on the surface of the electrode layer, which causes surface roughness (Ra) to deteriorate and pinholes and cracks in the ceramic green sheet. In the examples 1 to 7, citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvness, I-menthone, I-periacetate, and acetic acid parsley are used as a solvent for the conductive paste. The ester and the salicylate of d-dihydroacetic acid hardly dissolve the polyvinyl butyral contained in the dielectric paste for the purpose of forming the ceramic green sheet, and therefore, it is possible to effectively prevent cracks and wrinkles on the surface of the electrode layer. It prevents pinholes and cracks in the ceramic green sheets. -44- (41) (41) 1248094 Example 8 Preparation of dielectric paste for ceramic green sheets A dielectric paste for ceramic green sheets was prepared in the same manner as in Example 1. Formation of ceramic green sheet A ceramic green sheet was coated with a dielectric paste on a polyethylene terephthalate film in the same manner as in Example 1 to form a ceramic green sheet having a thickness of 1/m. The separator was mixed with 1.48 parts by weight of (BaCa) SiO 3 , 1.01 part by weight of Y203, 0.72 parts by weight of MgC03, 0.13 parts by weight of ΜηΟ, and 0.045 parts by weight of V 2 Ο 5 by a dielectric paste to prepare an additive powder. . The raw paste was prepared by mixing 150 parts by weight of acetone, 104.3 parts by weight of citric acid, and 1.5 parts by weight of a polyethylene glycol-based dispersant with 100 parts by weight of the additive powder prepared in this manner, using ASHIZAWA FINETECH Ltd. The pulverizer "LMZ0.6" (trade name) pulverizes the additive in the puree. When the additive in the puree is pulverized, Zr02 particles (0.1 mm in diameter) are placed in a container at a capacity of 80% of the container, and the rotor is rotated at a peripheral speed of 14 m/min to allow the entire slurry to remain in the container. The mixture was circulated between the container and the raw slurry tank in a manner of up to 5 minutes, and the additive in the raw slurry was pulverized. The median diameter of the pulverized additive was 0.1 /i m. Next, the acetone was evaporated by an evaporator, and it was removed from the original slurry, and -45-(42) 1248094 was prepared to prepare an additive paste in which the additive was dispersed in citric acid. The concentration of the non-volatile component in the additive paste was 49.3 wt%.

其次，將8重量份之酸價爲5mgKOH/g之甲基丙烯酸 甲酯及丙烯酸丁酯之共聚合物（共聚合比（重量比）82 : 18 、重量平均分子量70萬）在70 °C下溶解於92重量份之檸檬 酸，調製成有機載體之8%溶液，此外，將具有以下組成 之原漿利用球磨機實施1 6小時之分散。分散條件係球磨機 中之Zr02(直徑2.0mm)之充塡量爲30容積％、球磨機中之 原漿量爲60容積％、球磨機之圓周速度爲45m/分。 添加物糊 8.87重量份Next, 8 parts by weight of a copolymer of methyl methacrylate and butyl acrylate having an acid value of 5 mg KOH/g (copolymerization ratio (weight ratio) 82:18, weight average molecular weight 700,000) at 70 ° C The solution was dissolved in 92 parts by weight of citric acid to prepare an 8% solution of an organic vehicle. Further, the original slurry having the following composition was dispersed by a ball mill for 16 hours. The dispersion condition was such that the amount of Zr02 (diameter: 2.0 mm) in the ball mill was 30% by volume, the amount of the slurry in the ball mill was 60% by volume, and the peripheral speed of the ball mill was 45 m/min. Additive paste 8.87 parts by weight

BaTi03粉末（堺化學工業株式會社製：商品名稱「BT-02」：粒徑 0.2 // m) 95.70重量份 有機載體 1 04.36重量份 聚乙二醇系分散劑 1.0重量份BaTi03 powder (product name "BT-02": 0.20.2 / m) 95.70 parts by weight Organic carrier 1 04.36 parts by weight Polyethylene glycol dispersant 1.0 part by weight

磷苯二甲酸二異辛酯（可塑劑） 2.61重量份 咪唑咻系界面活性劑 0.4重量份 丙酮 57.20重量份 其次，利用具有蒸發器及加熱機構之攪拌裝置，從利 用此方式得到之原漿蒸發丙酮，除去混合物而得到介電糊 電極層用導電糊之調製 與實施例1相同，調製電極層用導電糊。 -46- (43) (43)1248094 隔離層之形成 利用網板印刷機以特定圖案將以此方式調製介電糊印 刷於陶瓷生胚薄片上，實施90 °C、5分鐘之乾燥，在陶瓷 生胚薄片上形成隔離層。 其次，與實施例1相同，利用株式會社小（土反）硏究 所製「SURFCORDER(SE-30D)」（商品名稱）進行檢測，檢 測到之隔離層之表面粗度（Ra)爲0.070 /z m。 此外，利用金屬顯微鏡放大400倍，觀察隔離層之表 面，隔離層之表面未觀察到裂縫及皴紋。 電極層之形成及層積體單元之製作 此外，利用網板印刷機以與隔離層圖案爲互補之圖案 將導電糊印刷於陶瓷生胚薄片上，實施90 °C、5分鐘之乾 燥，形成具有1/im厚度之電極層，製成在聚對苯二甲酸 乙二酯薄膜之表面層積著陶瓷生胚薄片、電極層、以及隔 離層之層積體單元。 與實施例1相同，利用株式會社小（土反）硏究所製「 SURFCORDER(SE-30D)」（商品名稱）進行檢測，檢測到之 以此方式形成之電極層之表面粗度（Ra)爲0.070 // m。 此外，利用金屬顯微鏡放大400倍，觀察電極層之表 面，未觀察到裂縫及皴紋。 陶瓷生胚晶片之製作 與實施例1相同，在聚對苯二甲酸乙二酯薄膜之表面 -47- (44) 1248094 塗布介電糊，製成l〇//m厚度之陶瓷生胚薄片。 從聚對苯二甲酸乙二酯薄膜剝離以此方式製作之1 〇 # m厚度之陶瓷生胚薄片，進行裁切，實施經過裁切之5片 陶瓷生胚薄片之層積，形成具有50#m厚度之覆蓋層，並 從聚對苯二甲酸乙二酯薄膜剝離層積體單元，進行裁切， 將經過裁切之50片層積體單元層積於覆蓋層上。 其次，從聚對苯二甲酸乙二酯薄膜剝離具有l〇//m厚 度之陶瓷生胚薄片，進行裁切，將經過裁切之5片陶瓷生 胚薄片層積於層積層積體單元上，形成製成層積著：含有 具有50//m厚度之下部覆蓋層、具有l//m厚度之陶瓷生 胚薄片、具有l//m厚度之電極層、以及具有l//m厚度之 隔離層之50片層積體單元之具有100/zm厚度之有效層； 及具有50//m厚度之上部覆蓋層；之層積體。 其次，在70 °C之溫度條件下，對利用此方式得到之層 積體施加lOOMPa之壓力進行冲壓成形，利用切塊加工機 裁切成特定尺寸，製成陶瓷生胚晶片。 層積陶瓷電容器樣本之製作 與實施例1相同，利用以此方式製成之陶瓷生胚晶片 製作層積陶瓷電容器樣本。 同樣的，製作合計50個層積陶瓷電容器樣本。 短路率之檢測 與實施例1相同，利用多用電表檢測以此方式製作之 (45) 1248094 50個層積陶瓷電容器樣本之電阻値，檢測層積陶瓷電容器 樣本之短路率。 結果，短路率爲16%。 實施例9 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以α -乙酸萜烯醋酸酯取代檸檬酸以外，其餘與實施例8相 同，在陶瓷生胚薄片上形成隔離層及電極層，檢測到之隔 離層之表面粗度（Ra)及電極層之表面粗度（Ra)分別爲0.069 //m 及 0.069// m。 此外，利用金屬顯微鏡放大400倍，觀察電極層及隔 離層之表面，未觀察到裂縫及皺紋。 此外，與實施例8相同，製作5 0個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 4%。 實施例1 〇 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以I -二氫乙酸香芹酯取代檸檬酸以外，其餘與實施例8相 同，在陶瓷生胚薄片上形成隔離層及電極層，檢測到之隔 離層之表面粗度（Ra)及電極層之表面粗度（Ra)分別爲〇.070 // m 及 0.070// m 〇 此外，利用金屬顯微鏡放大400倍，觀察電極層及隔 離層之表面，未觀察到裂縫及皺紋。 此外，與實施例8相同，製作5 0個層積陶瓷電容器樣 -49- (46) (46)1248094 本，利用多用電表檢測5 0個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 8%。 實施例1 1 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以I-薄荷酮取代檸檬酸以外，其餘與實施例8相同，在陶 瓷生胚薄片上形成隔離層及電極層，檢測到之隔離層之表 面粗度（Ra)及電極層之表面粗度（Ra)分別爲0.066 // m及 0 · 0 6 6 // m 〇 此外，利用金屬顯微鏡放大400倍，觀察電極層及隔 離層之表面，未觀察到裂縫及皺紋。 此外，與實施例8相同，製作50個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 〇%。 實施例1 2 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以I _紫蘇醋酸酯取代檸檬酸以外，其餘與實施例8相同， 在陶瓷生胚薄片上形成隔離層及電極層’檢測到之隔離層 之表面粗度（Ra)及電極層之表面粗度（Ra)分別爲0.074// m 及 0 · 0 74 // m 0 此外，利用金屬顯微鏡放大40〇倍’觀察電極層及隔 離層之表面，未觀察到裂縫及皺紋。 此外，與實施例8相同，製作5 0個層積陶瓷電容器樣 50- (47) (47)1248094 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 6%。 實施例1 3 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以I-乙酸香芹酯取代檸檬酸以外，其餘與實施例8相同’ 在陶瓷生胚薄片上形成隔離層及電極層，檢測到之隔離層 之表面粗度（Ra)及電極層之表面粗度（Ra)分別爲0.076 // m 及 0.0 7 6 // m 〇 此外，利用金屬顯微鏡放大400倍，觀察電極層及隔 離層之表面，未觀察到裂縫及皺紋。 此外，與實施例8相同，製作50個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲8%。 實施例1 4 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以d-二氫乙酸香芹酯取代檸檬酸以外，其餘與實施例8相 同，在陶瓷生胚薄片上形成隔離層及電極層，檢測到之隔 離層之表面粗度（Ra)及電極層之表面粗度（Ra)分別爲0.076 //m 及 0.076//m〇 此外，利用金屬顯微鏡放大400倍，觀察電極層及隔 離層之表面，未觀察到裂縫及皴紋。 此外，與實施例8相同，製作50個層積陶瓷電容器樣 -51 - (48) 1248094 本，利用多用電表檢測5 0個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲1 〇 %。 比較例3 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以萜品醇及煤油之混合溶劑（混合比（質量比）5 0 ·· 5 0 )取代 檸檬酸以外，其餘與實施例8相同，在陶瓷生胚薄片上形 成隔離層及電極層，檢測到之隔離層之表面粗度（Ra)及電 極層之表面粗度（Ra)分別爲0.102// m及0.102// m。 此外，利用金屬顯微鏡放大400倍，觀察電極層及隔 離層之表面，電極層及隔離層之表面觀察到裂縫及皺紋。 此外，與實施例8相同，製作5 0個層積陶瓷電容器樣 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲90%。 比較例4 除了調製電極層用導電糊及隔離層用介電糊時之溶劑 以萜品醇取代檸檬酸以外，其餘與實施例8相同，在陶瓷 生胚薄片上形成隔離層及電極層，檢測到之隔離層之表面 粗度（Ra)及電極層之表面粗度（Ra)分別爲0.112 // m及 0 · 1 1 2 // m 〇 此外，利用金屬顯微鏡放大400倍’觀察電極層及隔 離層之表面，電極層及隔離層之表面觀察到裂縫及皺紋。 此外，與實施例8相同，製作5 〇個層積陶瓷電容器樣 -52- (49) 1248094 本，利用多用電表檢測50個層積陶瓷電容器樣本之電阻値 ，檢測到之層積陶瓷電容器樣本之短路率爲8 8%。 由實施例8至14及比較例3及4可知，在利用含有當做 黏結劑使用之聚乙烯丁醛（聚合度1 450、丁醛化度69%)之 介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏結劑使 用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯 之共聚合物且含有當做溶劑使用之萜品醇及煤油之混合溶 劑（混合比（質量比）5 0 : 50)之介電糊而形成隔離層時，或 者，印刷含有當做黏結劑使用之重量平均分子量70萬之甲 基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使 用之萜品醇及煤油之混合溶劑（混合比（質量比）50 : 50)之 導電糊而形成電極層時，或者，在利用含有當做黏結劑使 用之聚乙烯丁醛（聚合度1450、丁醛化度69%)之介電糊所 形成之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量 平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合 物且含有當做溶劑使用之萜品醇之介電糊而形成隔離層時 ，或者，印刷含有當做黏結劑使用之重量平均分子量70萬 之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶 劑使用之萜品醇之導電糊而形成電極層時’隔離層之表面 粗度（Ra)及電極層之表面粗度（Ra)會惡化’而使利用層積 體單元之層積所製作之層積陶瓷電容器更可能產生裂縫， 相對於此，在利用含有當做黏結劑使用之聚乙烯丁醛（聚 合度1 45 0、丁醛化度69%)之介電糊所形成之陶瓷生胚薄片 上，印刷含有當做黏結劑使用之重量平均分子量70萬之甲 -53- (50) (50)1248094 基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使 用之檸檬酸之介電糊而形成隔離層時，或者，印刷含有當 做黏結劑使用之重量平均分子量70萬之甲基丙烯酸甲酯及 丙烯酸丁酯之共聚合物且含有當做溶劑使用之檸檬酸之導 電糊而形成電極層時，或者，在利用含有當做黏結劑使用 之聚乙烯丁醛（聚合度1 45 0、丁醛化度69%)之介電糊所形 成之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量平 均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物 且含有當做溶劑使用之α -乙酸萜烯醋酸酯之介電糊而形 成隔離層時，或者，印刷含有當做黏結劑使用之重量平均 分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且 含有當做溶劑使用之α -乙酸萜烯醋酸酯之導電糊而形成 電極層時，或者，在利用含有當做黏結劑使用之聚乙烯丁 醛（聚合度1450、丁醛化度69%)之介電糊所形成之陶瓷生 胚薄片上，印刷含有當做黏結劑使用之重量平均分子量70 萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做 溶劑使用之I-二氫乙酸香芹酯之介電糊而形成隔離層時， 或者，印刷含有當做黏結劑使用之重量平均分子量70萬之 甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑 使用之I-二氫乙酸香芹酯之導電糊而形成電極層時，或者 ，在利用含有當做黏結劑使用之聚乙烯丁醛（聚合度1450 、丁醛化度69%)之介電糊所形成之陶瓷生胚薄片上，印刷 含有當做黏結劑使用之重量平均分子量70萬之甲基丙烯酸 甲酯及丙烯酸丁酯之共聚合物且含有當做溶劑使用之I-薄 (51) 1248094 荷酮之介電糊而形成隔離層時，或者，印刷含有當做黏結 劑使用之重量平均分子量7〇萬之甲基丙烯酸甲酯及丙烯酸 丁酯之共聚合物且含有當做溶劑使用之I-薄荷酮之導電糊 而形成電極層時，或者，在利用含有當做黏結劑使用之聚 乙烯丁醛（聚合度1 450、丁醛化度69%)之介電糊所形成之 陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量平均分 子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含 有當做溶劑使用之I-紫蘇醋酸酯之介電糊而形成隔離層時 ，或者，印刷含有當做黏結劑使用之重量平均分子量70萬 之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有當做溶 劑使用之I-紫蘇醋酸酯之導電糊而形成電極層時，或者， 在利用含有當做黏結劑使用之聚乙烯丁醛（聚合度1 450、 丁醛化度69%)之介電糊所形成之陶瓷生胚薄片上，印刷含 有當做黏結劑使用之重量平均分子量70萬之甲基丙烯酸甲 酯及丙烯酸丁酯之共聚合物且含有當做溶劑使用之I-乙酸 香芹酯之介電糊而形成隔離層時，或者，印刷含有當做黏 結劑使用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯 酸丁酯之共聚合物且含有當做溶劑使用之I-乙酸香芹酯之 導電糊而形成電極層時，或者，在利用含有當做黏結劑使 用之聚乙烯丁醛（聚合度1 450、丁醛化度69%)之介電糊所 形成之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量 ‘平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合 物且含有當做溶劑使用之d-二氫乙酸香芹酯之介電糊而 形成隔離層時，或者，印刷含有當做黏結劑使用之重量平 -55- (52) 1248094 均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物 且含有當做溶劑使用之d-二氫乙酸香芹酯之導電糊而形 成電極層時，隔離層之表面粗度（Ra)及電極層之表面粗度 (Ra)已獲得改善。 此外，由貧施例8至14及比較例3及4可知，在利用含 有當做黏結劑使用之聚乙烯丁醛（聚合度1 450、丁醛化度 6 9%)之介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏 結劑使用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯 酸丁酯之共聚合物且含有當做溶劑使用之萜品醇及煤油之 混合溶劑（混合比（質量比）5 0 : 5 0)之介電糊及導電糊來製 作層積體單元，並實施50片層積體單元之層積而製成層積 陶瓷電容器時，或者，在利用含有當做黏結劑使用之聚乙 烯丁醛（聚合度1 45 0、丁醛化度69%)之介電糊所形成之陶 瓷生胚薄片上，印刷含有當做黏結劑使用之重量平均分子 量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含有 當做溶劑使用之萜品醇之介電糊及導電糊而製成層積體單 元，並實施50片層積體單元之層積而製成層積陶瓷電容器 時，層積陶瓷電容器之短路率明顯較高，相對於此，在利 用含有當做黏結劑使用之聚乙烯丁醛（聚合度1 450、丁醛 化度69%)之介電糊所形成之陶瓷生胚薄片上，印刷含有當 做黏結劑使用之重量平均分子量70萬之甲基丙烯酸甲酯及 丙烯酸丁酯之共聚合物且含有當做溶劑使用之檸檬酸之介 電糊及導電糊而製成層積體單元，並實施50片層積體單元 之層積而製成層積陶瓷電容器時，或者，在利用含有當做 -56- (53) 1248094 黏結劑使用之聚乙烯丁醛（聚合度1 450、丁醛化度69%)之 介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏結劑使 用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯 之共聚合物且含有當做溶劑使用之α -乙酸萜烯醋酸酯之 介電糊及導電糊而製成層積體單元，並實施50片層積體單 元之層積而製成層積陶瓷電容器時，或者，在利用含有當 做黏結劑使用之聚乙烯丁醛（聚合度1450、丁醛化度69%) 之介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏.結劑 使用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁 酯之共聚合物且含有當做溶劑使用之卜二氫乙酸香芹酯之 介電糊及導電糊而製成層積體單元，並實施50片層積體單 元之層積而製成層積陶瓷電容器時，或者，在利用含有當 做黏結劑使用之聚乙烯丁醛（聚合度1 450、丁醛化度69%) 之介電糊所形成之陶瓷生胚薄片上，印刷含有當做黏結劑 使用之重量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁 酯之共聚合物且含有當做溶劑使用之I-薄荷酮之介電糊及 導電糊而製成層積體單元，並實施50片層積體單元之層積 而製成層積陶瓷電容器時，或者，在利用含有當做黏結劑 使用之聚乙烯丁醛（聚合度1450、丁醛化度69%)之介電糊 所形成之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重 量平均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚 合物且含有當做溶劑使用之I-紫蘇醋酸酯之介電糊及導電 糊而製成層積體單元，並實施50片層積體單元之層積而製 成層積陶瓷電容器時，或者，在利用含有當做黏結劑使用 -57- (54) (54)1248094 之聚乙烯丁醛（聚合度1 450、丁醛化度69%)之介電糊所形 成之陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量平 均分子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物 且含有當做溶劑使用之卜乙酸香芹酯之介電糊及導電糊而 製成層積體單元，並實施50片層積體單元之層積而製成層 積陶瓷電容器時，或者，在利用含有當做黏結劑使用之聚 乙烯丁醛（聚合度1 450、丁醛化度69%)之介電糊所形成之 陶瓷生胚薄片上，印刷含有當做黏結劑使用之重量平均分 子量70萬之甲基丙烯酸甲酯及丙烯酸丁酯之共聚合物且含 有當做溶劑使用之d-二氫乙酸香芹酯之介電糊及導電糊 而製成層積體單元，並實施50片層積體單元之層積而製成 層積陶瓷電容器時，可大幅降低層積陶瓷電容器之短路率 〇 比較例3及4中，因爲當做隔離層用介電糊及導電糊之 溶劑使用之萜品醇及煤油之混合溶劑（混合比（質量比）50 ·· 5 0)及萜品醇會溶解以形成陶瓷生胚薄片爲目的之介電 糊所含有之聚乙烯丁醛，故隔離層及電極層之表面會發生 裂縫及皺紋，而導致隔離層之表面粗度（Ra)及電極層之表 面粗度（Ra)惡化，並在陶瓷生胚薄片產生針孔及龜裂，相 對於此，實施例8至14時，當做隔離層用介電糊及導電糊 之溶劑使用之檸檬酸、α -乙酸萜烯醋酸酯、I-二氫乙酸 香芹酯、卜薄荷酮、I-紫蘇醋酸酯、I-乙酸香芹酯、以及 d-二氫乙酸香芹酯幾乎不會溶解以形成陶瓷生胚薄片爲目 的之介電糊所含有之聚乙烯丁醛，因此，可有效防止隔離 -58- (55) (55)1248094 層及電極層表面產生裂縫及皺紋之情形，而防止陶瓷生胚 薄片產生針孔及龜裂。 本發明並未受限於以上之實施形態及實施例，在專利 申請範圍內可進行各種變更，且皆包涵於本發明之範圍內Diisooctyl phthalate (plasticizer) 2.61 parts by weight of imidazolium-based surfactant 0.4 parts by weight of acetone 57.20 parts by weight, followed by evaporation of the puree obtained by this method using a stirring device having an evaporator and a heating mechanism Acetone was removed, and the mixture was removed to obtain a dielectric paste electrode layer. The conductive paste was prepared in the same manner as in Example 1, and a conductive paste for an electrode layer was prepared. -46- (43) (43) 1248094 Formation of the barrier layer The dielectric paste was printed on the ceramic green sheet in a specific pattern by a screen printing machine, and dried at 90 ° C for 5 minutes in ceramics. An isolation layer is formed on the green sheet. Then, in the same manner as in the first embodiment, "SURFCORDER (SE-30D)" (trade name) manufactured by Kobayashi Co., Ltd. was used for the detection, and the surface roughness (Ra) of the separator was detected to be 0.070 / Zm. Further, by magnifying 400 times with a metal microscope, the surface of the separator was observed, and cracks and crepe were not observed on the surface of the separator. Formation of electrode layer and production of laminate unit Further, a conductive paste is printed on a ceramic green sheet by a screen printing machine in a pattern complementary to the pattern of the spacer layer, and dried at 90 ° C for 5 minutes to form An electrode layer having a thickness of 1/im was formed by laminating a ceramic green sheet, an electrode layer, and a separator layer on the surface of the polyethylene terephthalate film. In the same manner as in the first embodiment, "SURFCORDER (SE-30D)" (trade name) manufactured by Kosei Co., Ltd. was used to detect the surface roughness (Ra) of the electrode layer formed in this manner. Is 0.070 // m. Further, the surface of the electrode layer was observed by magnifying 400 times with a metal microscope, and cracks and crepe lines were not observed. Production of ceramic green sheet Wafer was applied to a surface of a polyethylene terephthalate film of -47-(44) 1248094 in the same manner as in Example 1 to prepare a ceramic green sheet having a thickness of 10 Å/m. The ceramic green sheet of 1 〇# m thickness prepared in this manner is peeled off from the polyethylene terephthalate film, and cut, and the laminated 5 pieces of ceramic green sheets are laminated to form 50#. The cover layer of m thickness was peeled off from the polyethylene terephthalate film, and the laminate unit was cut, and the cut 50-layer laminate unit was laminated on the cover layer. Next, the ceramic green sheet having a thickness of l〇//m is peeled off from the polyethylene terephthalate film, and cut, and the cut five pieces of ceramic green sheets are laminated on the laminated layer unit. Formed to be laminated: a ceramic green sheet having a thickness of 50//m, a ceramic green sheet having a thickness of 1//m, an electrode layer having a thickness of 1//m, and a thickness of 1//m. An effective layer having a thickness of 100/zm of 50 laminated units of the insulating layer; and a laminated body having an upper covering layer of 50//m thickness; Next, at a temperature of 70 ° C, a laminate obtained by this method was subjected to press forming by applying a pressure of 100 MPa, and cut into a specific size by a dicing machine to prepare a ceramic green sheet. Production of a laminated ceramic capacitor sample In the same manner as in Example 1, a laminated ceramic capacitor sample was produced using the ceramic green wafer prepared in this manner. Similarly, a total of 50 laminated ceramic capacitor samples were produced. Detection of short-circuit rate As in the first embodiment, the resistance 値 of the (45) 1248094 50-layer ceramic capacitor sample produced in this manner was detected by a multi-meter to detect the short-circuit rate of the laminated ceramic capacitor sample. As a result, the short circuit rate was 16%. [Example 9] A separator was formed on the ceramic green sheet, except that the solvent for preparing the conductive paste for the electrode layer and the dielectric paste for the separator was replaced with α-acetic acid acetate instead of citric acid. In the electrode layer, the surface roughness (Ra) of the isolated layer and the surface roughness (Ra) of the electrode layer were 0.069 //m and 0.069//m, respectively. Further, the surface of the electrode layer and the separation layer was observed by a magnification of 400 times using a metal microscope, and cracks and wrinkles were not observed. Further, in the same manner as in the eighth embodiment, a sample of 50 laminated ceramic capacitors was fabricated, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by a multimeter, and the short circuit rate of the laminated ceramic capacitor samples was detected to be 14%. . Example 1 The same procedure as in Example 8 was carried out except that the solvent for the conductive paste for the electrode layer and the dielectric paste for the separator was replaced with the citric acid of the i-dihydroacetic acid celery. The layer and the electrode layer, the surface roughness (Ra) of the isolated layer and the surface roughness (Ra) of the electrode layer were respectively 〇.070 // m and 0.070//m, respectively, and magnified 400 times by a metal microscope. The surfaces of the electrode layer and the separator were observed, and cracks and wrinkles were not observed. Further, in the same manner as in the eighth embodiment, 50 laminated ceramic capacitor samples -49-(46)(46)1248094 were prepared, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by a multimeter, and detected. The short circuit rate of the laminated ceramic capacitor sample was 1 8%. [Example 1] In the same manner as in Example 8, except that the solvent for the electrode paste for the electrode layer and the dielectric paste for the separator was replaced by I-menthol, the separator and the electrode layer were formed on the ceramic green sheet. The surface roughness (Ra) of the isolated layer and the surface roughness (Ra) of the electrode layer were respectively 0.066 // m and 0 · 0 6 6 // m 〇 In addition, the metal microscope was used to magnify 400 times, and the electrode was observed. No cracks or wrinkles were observed on the surface of the layer and the barrier layer. Further, in the same manner as in the eighth embodiment, 50 laminated ceramic capacitor samples were prepared, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by a multimeter, and the short circuit rate of the laminated ceramic capacitor samples was found to be 1 〇%. [Example 1 2] The separator and the electrode were formed on the ceramic green sheet except that the solvent for the conductive paste for the electrode layer and the dielectric paste for the separator was substituted with citric acid with I_ perilla acetate. The surface roughness (Ra) of the layer detected by the layer and the surface roughness (Ra) of the electrode layer were 0.074//m and 0 · 0 74 // m 0 , respectively, and the magnification was 40 〇 by the metal microscope. No cracks or wrinkles were observed on the surfaces of the electrode layer and the separator. Further, in the same manner as in the eighth embodiment, 50 laminated ceramic capacitor samples 50-(47)(47)1248094 were prepared, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by a multi-meter, and the laminated product was detected. The short circuit rate of the ceramic capacitor sample was 16.6%. Example 1 3 In the same manner as in Example 8, except that the solvent for the conductive paste for the electrode layer and the dielectric paste for the barrier layer was replaced with the citric acid of the salt of I-acetate, the spacer layer was formed on the ceramic green sheet. In the electrode layer, the surface roughness (Ra) of the isolated layer and the surface roughness (Ra) of the electrode layer were respectively 0.076 // m and 0.0 7 6 // m 〇 In addition, the metal microscope was used to magnify 400 times, and the electrode was observed. No cracks or wrinkles were observed on the surface of the layer and the barrier layer. Further, in the same manner as in the eighth embodiment, 50 laminated ceramic capacitor samples were produced, and the resistance 値 of the 50 laminated ceramic capacitor samples was measured by a multimeter, and the short circuit rate of the laminated ceramic capacitor samples was 8%. [Example 1] In the same manner as in Example 8, except that the solvent for the electrode paste for the electrode layer and the dielectric paste for the separator was replaced with the citric acid of the d-dihydroacetic acid carcinoate, the isolation was formed on the ceramic green sheet. The layer and the electrode layer, the surface roughness (Ra) of the isolated layer and the surface roughness (Ra) of the electrode layer were respectively 0.076 //m and 0.076//m, respectively, and magnified 400 times by a metal microscope to observe the electrode. No cracks or crepe lines were observed on the surface of the layer and the barrier layer. Further, in the same manner as in the eighth embodiment, 50 laminated ceramic capacitor samples -51 - (48) 1248094 were produced, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by a multimeter, and the laminated ceramic capacitor was detected. The short circuit rate of the sample is 1 〇%. Comparative Example 3 In addition to the solvent for preparing the conductive paste for the electrode layer and the dielectric paste for the separator, the solvent of the mixture of terpineol and kerosene (mixing ratio (mass ratio) 5 0 ·· 5 0 ) was used instead of citric acid. In the same manner as in the embodiment 8, the isolation layer and the electrode layer were formed on the ceramic green sheet, and the surface roughness (Ra) of the isolation layer and the surface roughness (Ra) of the electrode layer were detected to be 0.102//m and 0.102//, respectively. m. Further, the surface of the electrode layer and the separation layer was observed by a metal microscope at a magnification of 400 times, and cracks and wrinkles were observed on the surfaces of the electrode layer and the separator. Further, in the same manner as in the eighth embodiment, 50 samples of the laminated ceramic capacitor were produced, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by the multimeter, and the short circuit rate of the laminated ceramic capacitor sample was detected to be 90%. Comparative Example 4 A separator and an electrode layer were formed on a ceramic green sheet, except that the solvent for the electrode paste for the electrode layer and the dielectric paste for the separator was replaced with terpineol instead of citric acid. The surface roughness (Ra) of the isolation layer and the surface roughness (Ra) of the electrode layer are 0.112 // m and 0 · 1 1 2 // m 〇 in addition, a metal microscope is used to magnify 400 times of the observation electrode layer and Cracks and wrinkles were observed on the surface of the separator, on the surfaces of the electrode layer and the separator. Further, in the same manner as in the eighth embodiment, five layers of laminated ceramic capacitors were fabricated - 52-(49) 1248094, and the resistance 値 of the 50 laminated ceramic capacitor samples was detected by a multimeter, and the laminated ceramic capacitor was detected. The short circuit rate of the sample was 8 8%. From Examples 8 to 14 and Comparative Examples 3 and 4, ceramic green sheets formed using a dielectric paste containing polyvinyl butyral (degree of polymerization 1 450, degree of butyralization 69%) used as a binder were known. A co-polymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing a mixed solvent of terpineol and kerosene as a solvent (mixing ratio (mass ratio) 5) 0: 50) When a dielectric paste is formed to form a separator, or a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing a solvent as a solvent is printed. When a conductive paste is mixed with an alcohol and kerosene (mixing ratio (mass ratio) 50: 50) to form an electrode layer, or a polyvinyl butyral containing a binder is used (degree of polymerization 1450, degree of butanaldehyde 69) %) of the ceramic green sheet formed by the dielectric paste, printed with a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing as a solvent When a separator is formed by using a dielectric paste of terpineol, or a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing a solvent as a solvent is used. When the electrode layer is formed by the conductive paste of alcohol, the surface roughness (Ra) of the separator and the surface roughness (Ra) of the electrode layer are deteriorated, and the laminated ceramic capacitor fabricated by laminating the laminate unit is used. It is more likely to cause cracks. On the other hand, on the ceramic green sheet formed by using a dielectric paste containing polyvinyl butyral (polymerization degree 150 0, butyral degree 69%) used as a binder, the printing contains As a binder, a weight average molecular weight of 700,000 A-53-(50) (50) 1248094-based copolymer of methyl acrylate and butyl acrylate and a dielectric paste of citric acid used as a solvent to form an isolation layer Or, by printing, a conductive polymer containing a weight average molecular weight of 700,000 methyl methacrylate and butyl acrylate used as a binder and containing a conductive paste of citric acid used as a solvent to form an electrode At the time of, or in the use of a ceramic green sheet formed of a dielectric paste containing polyvinyl butyral (polymerization degree 150 0, butyralization degree 69%) used as a binder, printing is used as a binder. a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 and containing a dielectric paste of α-acetic acid acetate as a solvent to form a separator, or printing containing as a binder When a weight average molecular weight of 700,000 of a copolymer of methyl methacrylate and butyl acrylate and a conductive paste of α-acetic acid acetate used as a solvent to form an electrode layer, or in use as a binder On the ceramic green sheet formed by the dielectric paste of polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%), methyl methacrylate having a weight average molecular weight of 700,000 as used as a binder is printed. a copolymer of butyl acrylate and a dielectric paste of I-dihydroacetic acid as a solvent to form a separator, or printing containing a weight as a binder When a conductive layer of methyl methacrylate and butyl acrylate having an average molecular weight of 700,000 and a conductive paste of I-dihydroacetic acid as a solvent is used to form an electrode layer, or in the use of a binder as a binder The ceramic green sheet formed by the dielectric paste of polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) was used to print methyl methacrylate having a weight average molecular weight of 700,000 as a binder. a copolymer of butyl acrylate and a dielectric paste of I-thin (51) 1248094 ketone used as a solvent to form a separator, or a methyl group having a weight average molecular weight of 70,000 as a binder a copolymer of methyl acrylate and butyl acrylate and containing an electroconductive paste of I-menthol as a solvent to form an electrode layer, or a polyvinyl butyral (containing a polymerization degree of 1,450, which is used as a binder) a ceramic green sheet formed by a dielectric paste having a butyralization degree of 69%), which is printed with a methyl methacrylate and a butyl acrylate having a weight average molecular weight of 700,000 as a binder. Polymer and containing a dielectric paste of I-Perilla acetate as a solvent to form a separator, or printing a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder And when the electrode layer is formed by using a conductive paste of I-Perilla acetate as a solvent, or by using polyvinyl butyral (degree of polymerization 1 450, degree of butyralization 69%) which is used as a binder. On the ceramic green sheet formed by the electric paste, a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing I-carveryl acetate as a solvent is printed. When a dielectric paste is formed to form a separator, or a copolymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing I-carveryl acetate as a solvent is printed. When the conductive paste is formed to form an electrode layer, or by using a dielectric paste containing polyvinyl butyral (degree of polymerization 1 450, degree of butyralization 69%) used as a binder On the ceramic green sheet, a dielectric containing a weight average of 700,000 methyl methacrylate and butyl acrylate as a binder and containing d-dihydroacetic acid as a solvent is printed. When the paste is formed into a separator, or a copolymer containing methyl methacrylate and butyl acrylate having a weight of -55-(52) 1248094 and a molecular weight of 700,000 as a binder is used, and d is used as a solvent. When the electrode layer is formed by the conductive paste of the dihydroacetic acid carvacrol, the surface roughness (Ra) of the separator and the surface roughness (Ra) of the electrode layer have been improved. Further, from Examples 8 to 14 and Comparative Examples 3 and 4, it was found that a dielectric paste containing polyvinyl butyral (degree of polymerization 1 450, degree of butyralization of 6 9%) used as a binder was used. On the ceramic green sheet, a co-polymer containing methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing a mixed solvent of terpineol and kerosene as a solvent (mixing ratio ( Mass ratio) 5 0 : 5 0) Dielectric paste and conductive paste to form a laminate unit, and laminate a 50-layer laminate unit to form a laminated ceramic capacitor, or use it as a bond The ceramic green sheet formed by the dielectric paste of polyvinyl butyral (degree of polymerization 1 405, degree of butyralization 69%) was used to print methacrylic acid having a weight average molecular weight of 700,000 as a binder. A copolymer of a methyl ester and a butyl acrylate and a dielectric paste and a conductive paste of terpineol used as a solvent to form a laminate unit, and a laminate of 50 laminate units is formed to form a laminate. Laminated ceramic capacitors for ceramic capacitors The short-circuit rate is significantly higher. In contrast, printing is carried out on ceramic green sheets formed using a dielectric paste containing polyvinyl butyral (degree of polymerization 1 450, degree of butyralization 69%) used as a binder. A laminate comprising a dielectric polymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing a citric acid dielectric paste and a conductive paste used as a solvent, and is implemented as a laminate unit When a laminate of 50 laminate units is fabricated to form a laminated ceramic capacitor, or a polyethylene butyral containing a binder as -56-(53) 1248094 is used (degree of polymerization 1 450, degree of butanaldehyde 69 %) of the ceramic green sheet formed by the dielectric paste, printed with a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and containing α-acetic acid as a solvent A dielectric paste of a terpene acetate and a conductive paste to form a laminate unit, and a laminate of 50 laminate units is used to form a laminated ceramic capacitor, or a composite containing a binder is used. Ethylene On the ceramic green sheet formed by the dielectric paste of aldehyde (degree of polymerization 1450, degree of butyralization 69%), methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder were printed. a co-polymer and a dielectric paste of a dihydroacetic acid carboidate used as a solvent to form a laminate unit, and a laminate of 50 laminate units to form a laminated ceramic capacitor At the time of, or in the use of a ceramic green sheet formed of a dielectric paste containing polyvinyl butyral (degree of polymerization 1 450, degree of butyralization 69%) used as a binder, the printing contains the weight used as a binder. A copolymer of methyl methacrylate and butyl acrylate having an average molecular weight of 700,000 and containing a dielectric paste of I-menthone used as a solvent and a conductive paste to form a laminate unit, and implementing 50 laminates When a unit is laminated to form a laminated ceramic capacitor, or a ceramic green sheet formed by using a dielectric paste containing polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69%) used as a binder On, printing contains as sticky A layered body unit is prepared by using a dielectric paste of a weight average molecular weight of 700,000 methyl methacrylate and butyl acrylate, and a dielectric paste and a conductive paste of I-peresa acetate used as a solvent. When 50 layers of laminate units are laminated to form a laminated ceramic capacitor, or, in the case of using a binder containing -57-(54) (54) 1248094, polyvinyl butyral (degree of polymerization 1 450, butyraldehyde) a ceramic green sheet formed by a dielectric paste of 69%), which is printed with a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and used as a solvent. A dielectric paste of a vinyl acetate and a conductive paste to form a laminate unit, and a laminate of 50 laminate units is used to form a laminated ceramic capacitor, or a use as a binder is used. A ceramic green sheet formed of a dielectric paste of polyvinyl butyral (degree of polymerization 1 450, degree of butyralization 69%) was printed with methyl methacrylate and acrylic acid having a weight average molecular weight of 700,000 as a binder. Total butyl ester And a laminate containing a dielectric paste of d-dihydroacetic acid caraway ester as a solvent to form a laminate unit, and performing lamination of 50 laminate units to form a laminated ceramic capacitor The short circuit rate of the laminated ceramic capacitor can be greatly reduced. In Comparative Examples 3 and 4, the mixed solvent of terpineol and kerosene used as the solvent for the dielectric paste and the conductive paste for the separator (mixing ratio (mass ratio) 50) ··· 0 0) and terpineol dissolve the polyvinyl butyral contained in the dielectric paste for the purpose of forming ceramic green sheets, so cracks and wrinkles may occur on the surface of the separator and the electrode layer, resulting in the isolation layer. The surface roughness (Ra) and the surface roughness (Ra) of the electrode layer are deteriorated, and pinholes and cracks are generated in the ceramic green sheet. In contrast, in Examples 8 to 14, the dielectric paste for the separator is used. The solvent of the conductive paste uses citric acid, α-acetic acid terpene acetate, I-dihydroacetic acid carvone, bumone, I-peripate acetate, I-carveryl acetate, and d-dihydroacetic acid. The celery ester hardly dissolves the dielectric for the purpose of forming ceramic green sheets The polyvinyl butyral contained in the paste can effectively prevent the occurrence of cracks and wrinkles on the surface of the -58- (55) (55) 1248094 layer and the electrode layer, and prevent pinholes and cracks in the ceramic green sheet. The present invention is not limited to the above embodiments and examples, and various modifications can be made within the scope of the patent application, and are included in the scope of the present invention.

-59--59-

Claims (1)

(1) 1248094 十、申請專利範圍 1. 一種導電糊，其特徵爲： 含有當做黏結劑使用之丙烯酸系樹脂，且含有由檸檬 酸、乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、 I -紫蘇醋酸酯、I -乙酸香芹酯、以及d -二氫乙酸香芹酯所 構成之群組所選取之至少其中一種溶劑。 2. 如申請專利範圍第i項之導電糊，其中 前述丙烯酸系樹脂之重量平均分子量爲45萬以上、90 萬以下。 3. 如申請專利範圍第1或2項之導電糊，其中 前述丙烯酸系樹脂之酸價爲5mgKOH/g以上、 25mgKOH/g 以下。 4. 一種層積陶瓷電子零件用之層積體單元之製造方法 ，其特徵爲： 在含有當做黏結劑使用之丁醛系樹脂之陶瓷生胚薄片 上，以特定圖案印刷含有當做黏結劑使用之丙烯酸系樹脂 且含有由檸檬酸、α-乙酸萜烯醋酸酯、I-二氫乙酸香芹 酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸香芹酯、以及d-二 氫乙酸香芹酯所構成之群組所選取之至少其中一種溶劑之 導電糊來形成電極層。 5 ·如申請專利範圍第4項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 電極層乾燥後，進一步在前述陶瓷生胚薄片上，以和 前述電極層圖案爲互補之圖案印刷含有當做黏結劑使用之 -60- (2) 1248094 丙烯酸系樹脂且含有由檸檬酸、α -乙酸萜烯醋酸酯、I-二氫乙酸香芹酯、I-薄荷酮、I·紫蘇醋酸酯、I-乙酸香芹 酯、以及d-二氫乙酸香芹酯所構成之群組所選取之至少 其中一種溶劑之介電糊而形成隔離層。 6·如申請專利範圍第4項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 形成前述電極層前，在前述陶瓷生胚薄片上，以和應 形成之前述電極層圖案爲互補之圖案印刷含有當做黏結劑 使用之丙烯酸系樹脂且含有由檸檬酸、α -乙酸萜烯醋酸 酯、I-二氫乙酸香芹酯、I-薄荷酮、I-紫蘇醋酸酯、I-乙酸 香芹酯、以及d-二氫乙酸香芹酯所構成之群組所選取之 至少其中一種溶劑之介電糊而形成隔離層。 7.如申請專利範圍第4至6項之其中任一項之層積陶瓷 電子零件用之層積體單元之製造方法，其中 前述丙烯酸系樹脂之重量平均分子量爲45萬以上、90 萬以下。 8·如申請專利範圍第4至6項之其中任一項之層積陶瓷 電子零件用之層積體單元之製造方法，其中 前述丙烯酸系樹脂之酸價爲5mgKOH/g以上、 25mgKOH/g 以下。 9 ·如申請專利範圍第7項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 前述丙烯酸系樹脂之酸價爲5mgKOH/g以上、 25mgKOH/g 以下。 1248094(1) 1248094 X. Patent application scope 1. A conductive paste characterized by: containing an acrylic resin used as a binder, and containing citric acid, decene acetate, carboxyl ester of I-dihydroacetic acid, At least one solvent selected from the group consisting of I-menthol, I-peripate acetate, i-carveryl acetate, and d-dihydroacetic acid carvone. 2. The conductive paste according to item i of the patent application, wherein the acrylic resin has a weight average molecular weight of 450,000 or more and 900,000 or less. 3. The conductive paste according to claim 1 or 2, wherein the acrylic resin has an acid value of 5 mgKOH/g or more and 25 mgKOH/g or less. 4. A method for producing a laminate unit for a laminated ceramic electronic component, characterized in that: in a ceramic green sheet containing a butyral resin used as a binder, printing in a specific pattern contains a use as a binder. Acrylic resin and containing citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvone, I-menthone, I-peripate acetate, I-carveryl acetate, and d-dihydroacetic acid An electroconductive paste of at least one of the solvents selected from the group consisting of carvone esters forms an electrode layer. 5. The method of manufacturing a laminate unit for laminated ceramic electronic parts according to claim 4, wherein after the electrode layer is dried, further on the ceramic green sheet, a pattern complementary to the pattern of the electrode layer is used. Printing contains -60- (2) 1248094 acrylic resin as a binder and contains citric acid, α-acetic acid decene acetate, I-dihydroacetic acid carvone, I-menthone, I·Perilla acetate A dielectric paste of at least one of the solvents selected from the group consisting of I-carvyl acetate and carmine ester of d-dihydroacetic acid forms an isolation layer. 6. The method of manufacturing a laminate unit for laminated ceramic electronic parts according to claim 4, wherein before the electrode layer is formed, the pattern of the electrode layer to be formed on the ceramic green sheet is Complementary pattern printing contains an acrylic resin used as a binder and contains citric acid, α-vinyl acetate, I-dihydroacetic acid, celery, I-mente, I-peracetate, I-acetic acid A separator is formed by a dielectric paste of at least one of the solvents selected from the group consisting of carvone and d-dihydroacetic acid carvone. The method for producing a laminate unit for laminated ceramic electronic parts according to any one of claims 4 to 6, wherein the acrylic resin has a weight average molecular weight of 450,000 or more and 900,000 or less. The method for producing a laminate unit for laminated ceramic electronic parts according to any one of claims 4 to 6, wherein the acrylic resin has an acid value of 5 mgKOH/g or more and 25 mgKOH/g or less. . The method for producing a laminate unit for a laminated ceramic electronic component according to the seventh aspect of the invention, wherein the acrylic resin has an acid value of 5 mgKOH/g or more and 25 mgKOH/g or less. 1248094 1 〇 ·如申請專利範圍第4至6項之其中任一項之層積陶 瓷電子零件用之層積體單元之製造方法，其中 前述丁醛系樹脂之聚合度爲1 000以上。 1 1·如申請專利範圍第7項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 前述丁醛系樹脂之聚合度爲1 00 0以上。 12.如申請專利範圍第8項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 前述丁醛系樹脂之聚合度爲1 000以上。 13·如申請專利範圔第9項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 前述丁醛系樹脂之聚合度爲1000以上。 14·如申請專利範圍第4至6項之其中任一項之層積陶 瓷電子零件用之層積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳％以上、78莫耳 %以下。 1 5 ·如申請專利範圍第7項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳％以上、78莫写: %以下。 1 6 ·如申請專利範圍第8項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳％以上、78莫$ (4) 1248094 %以下。 17·如申請專利範圍第9項之層積陶瓷電子零件用之層 積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳％以上、78莫耳 %以下。 18·如申請專利範圍第1〇項之層積陶瓷電子零件用之 層積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳％以上、78莫耳 %以下。 19·如申請專利範圍第11項之層積陶瓷電子零件用^ 層積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳。/〇以上、78莫耳: %以下。 20.如申請專利範圍第12項之層積陶瓷電子零件用之 層積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳％以上、78莫耳; %以下。 2 1 ·如申請專利範圍第1 3項之層積陶瓷電子零件用$ 層積體單元之製造方法，其中 前述丁醛系樹脂之丁醛化度爲64莫耳％以上、78莫g %以下。The method for producing a laminate unit for laminated ceramic electronic parts according to any one of claims 4 to 6, wherein the degree of polymerization of the butyraldehyde-based resin is 1,000 or more. The method for producing a laminate unit for a laminated ceramic electronic component according to the seventh aspect of the invention, wherein the polymerization degree of the butyraldehyde-based resin is 100 or more. 12. The method for producing a laminate unit for laminated ceramic electronic parts according to the eighth aspect of the invention, wherein the polymerization degree of the butyraldehyde-based resin is 1,000 or more. 13. The method for producing a laminate unit for laminated ceramic electronic parts according to claim 9, wherein the butyral resin has a degree of polymerization of 1,000 or more. The method for producing a laminate unit for laminated ceramic electronic parts according to any one of claims 4 to 6, wherein the butyraldehyde resin has a degree of butyraldehyde degree of 64 mol% or more. 78% of the following. The method for producing a laminate unit for laminated ceramic electronic parts according to the seventh aspect of the invention, wherein the butyraldehyde-based resin has a degree of butyraldehyde degree of 64 mol% or more and 78 m or less: % or less . 1 6 . The method for producing a laminate unit for laminated ceramic electronic parts according to claim 8 , wherein the butyraldehyde resin has a degree of butyraldehyde degree of 64 mol% or more and 78 mol $ (4) 1248094% or less. The method for producing a laminate unit for a laminated ceramic electronic component according to the ninth aspect of the invention, wherein the butyraldehyde-based resin has a butyraldehyde degree of 64 mol% or more and 78 mol% or less. The method for producing a laminate unit for a laminated ceramic electronic component according to the first aspect of the invention, wherein the butyraldehyde-based resin has a butyraldehyde degree of 64 mol% or more and 78 mol% or less. 19. The method for producing a laminated body unit for laminated ceramic electronic parts according to claim 11, wherein the butyraldehyde-based resin has a degree of butyralization of 64 moles. /〇 above, 78 moles: % below. The method for producing a laminate unit for laminated ceramic electronic parts according to claim 12, wherein the butyraldehyde-based resin has a butyraldehyde degree of 64 mol% or more and 78 mol% or less. 2 1 . The method for producing a laminate unit for laminated ceramic electronic parts according to claim 13 wherein the butyraldehyde resin has a butyraldehyde degree of 64 mol% or more and 78 mol% or less. .
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