1242804 五、發明說明（1) 【發明所屬之技術領域】 本發明係有一種具可喷清洗液清洗頭之晶片清洗裝置 ，特別是有關於一種晶片清洗裝置具有接觸清洗晶片及同 時喷清洗液清洗頭裝置。 【先前技術】 習知晶片清洗裝置1 0 a具有一個晶片清洗頭2 0 a 及另一分離於該晶片清洗裝置1 0 a之純水喷頭3 0 a ， 如此利用清洗頭2 0 a進行晶片清洗動作，請參考第一圖 習知清洗頭之晶片清洗裝置1 0 a ，包含一支撐座4 0 a ，該支撐座4 0 a内部具有一驅動裝置（圖未標示）及一清 洗頭2 0 a ，其中清洗一晶片5 0 a的清洗動作包括支樓 座4 0 a擺動及該清洗頭2 0 a的自轉’該晶片5 0 a同 時也會藉由一晶片承載裝置（圖未標示）帶動旋轉，且沿 一清洗路徑清洗晶片5 0 a ，但該清洗路徑在清洗頭2 0 a與該晶片5 0 a的中心點位置時，兩者之間的相對運動 為零時，此時機械移除力小，因此清洗能力差，使該晶片 5 0 a於此位置之表面的微粒難以移除，因此微粒殘留相 對增加，所以需由該純水喷頭3 0 a喷出純水藉以衝離晶 片5 0 a上之微粒，但該純水喷頭3 0 a設置之遠近係關 係到衝擊力大小，加上清洗頭2 0 a壓住該晶片5 0 a之 位置上的微粒不易被純水喷頭3 0 a喷出純水衝離，因此 清潔能力無法提高。 緣是，發明人乃根據此等缺失及依據多年來從事製造 產品之相關經驗，悉心觀察且研究之，乃潛心研究並配合1242804 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a wafer cleaning device with a sprayable cleaning liquid cleaning head, and more particularly to a wafer cleaning device having a contact cleaning wafer and spraying cleaning liquid at the same time.头 装置。 Head device. [Prior art] The conventional wafer cleaning device 10 a has a wafer cleaning head 20 a and another pure water spray head 3 0 a separated from the wafer cleaning device 10 a. Thus, the wafer is cleaned using the cleaning head 20 a For cleaning operations, please refer to the first figure. The wafer cleaning device 10 a of the conventional cleaning head includes a support base 40 a. The support base 40 a has a driving device (not shown) and a cleaning head 20. a, wherein the cleaning action of cleaning a wafer 50a includes swinging of the supporting seat 40a and the rotation of the cleaning head 20a 'the wafer 50a will also be driven by a wafer carrier (not shown) Rotate and clean the wafer 50a along a cleaning path, but when the cleaning path is at the center point of the cleaning head 20a and the wafer 50a, the relative movement between the two is zero, and the machine moves at this time The removal force is small, so the cleaning ability is poor, making it difficult to remove the particles on the surface of the wafer 50 a at this position, so the particle residue is relatively increased, so the pure water spray head 30 a needs to spray pure water to wash away The particles on the chip 5 0 a, but the distance of the pure water nozzle 3 0 a Tied to the size of the impact force, together with the cleaning head 2 0 a pressed position of the particles on the wafer was hard-5 0 a 3 0 a water discharge nozzle from the pure water will, thus improving the cleaning capability can not. The reason is that the inventor carefully observed and researched based on these shortcomings and based on years of relevant experience in manufacturing products, and concentrated on research and cooperation
1242804 •_案號93108760 ___年 月 日_修正 _ 五、發明說明（3) 達到最佳清洗晶片效果。 為了使 貴審查員能進一步了解本發明之特徵及技術 内容，請參閱以下有關本發明之詳細說明及附圖，然而所 附圖示僅提供參考與說明用，並非用來對本發明加以限制 者。 【實施方式】 請參閱第二圖及第三圖所示，本發明提供一種具可喷 清洗液清洗頭之晶片清洗裝置1 〇 ，適用於一化學機械研 磨製程後之晶片清洗，其包括支撐座2 0、具可喷清洗液 之清洗頭3 0及流體管4 0 ，其中該具可喷清洗液之清洗 頭3 0下端與一晶片5 0接觸，且利用該支撐座2 0之驅 動裝置2 5驅動該具可喷清洗液之清洗頭3 0轉動並沿一 清洗路徑清洗該晶片5 0，且使清洗液通過流體管4 0連 通至該具可噴清洗液之清洗頭3 0喷出於該晶片5 0上， 如此藉由接觸力及液壓衝力以移除晶片上之微粒。 請參閱第二圖及第三圖為本發明之具多清洗頭之晶片 清洗裝置1 0之較佳實施例上視圖及側視圖，該晶片清洗 裝置10包括一支撐座2 0 ，該支撐座2 0其上部有一延 伸手臂2 1 ，更有一驅動裝置2 5設置於其内，該驅動裝 置25包括第一轉動軸251 、第二轉動軸252 、馬達 253及第一傳動皮帶254、第二傳動皮帶255 ，且 該第一轉動軸2 5 1位於該支撐座2 0内部，另一第二轉 動軸2 5 2位於該延伸手臂2 1内部，且有第一傳動皮帶 2 5 4套合於該對第一轉動軸2 5 1及該第二傳動軸2 5 2之上端，另有一第二傳動皮帶2 5 5套合於該對第一轉1242804 • _ Case No. 93108760 _ Month Month Day _ Amendment _ V. Description of the Invention (3) Achieving the best wafer cleaning effect. In order to enable your examiner to better understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, but the drawings are provided for reference and explanation only, and are not intended to limit the present invention. [Embodiment] Please refer to the second and third figures. The present invention provides a wafer cleaning device 10 with a sprayable cleaning liquid cleaning head, which is suitable for wafer cleaning after a chemical mechanical polishing process, and includes a support seat. 20, a cleaning head 30 with a sprayable cleaning liquid and a fluid tube 40, wherein the lower end of the cleaning head 30 with a sprayable cleaning liquid is in contact with a wafer 50, and the driving device 2 of the support seat 2 is used 5 drives the cleaning head with sprayable cleaning liquid 30 to rotate and cleans the wafer 50 along a cleaning path, and makes the cleaning liquid communicate with the cleaning head with sprayable cleaning liquid 30 through the fluid pipe 40 and sprays out On the wafer 50, the particles on the wafer are removed by contact force and hydraulic pressure. Please refer to FIG. 2 and FIG. 3 for a top view and a side view of a preferred embodiment of a wafer cleaning device 10 with a multiple cleaning head according to the present invention. The wafer cleaning device 10 includes a support base 20, and the support base 2 0 There is an extension arm 2 1 at the upper part, and a driving device 25 is disposed therein. The driving device 25 includes a first rotation shaft 251, a second rotation shaft 252, a motor 253, a first transmission belt 254, and a second transmission belt. 255, and the first rotating shaft 2 5 1 is located inside the support base 20, another second rotating shaft 2 5 2 is located inside the extension arm 21, and a first driving belt 2 5 4 is fitted on the pair The first rotation shaft 2 5 1 and the upper end of the second transmission shaft 2 5 2, and a second transmission belt 2 5 5 is fitted on the pair of first rotations.
1242804 ’ __案號93108760 _年月曰_^_ 五、發明說明（4) 動軸2 5 1下端及與該馬達2 5 3連接，其中該具可喷清 洗液之清洗頭3 0連動於該第二傳動轴2 5 2 ，該具有喷 清洗液之清洗頭3 0下端與一晶片5 0接觸，藉由驅動裝 置2 5驅動旋轉以連動該具可喷清洗液之清洗頭3 0旋轉 清洗該晶片5 0 ，同時三該流體管4 0 、4 1 、4 2分別 流通氮氣、化學液及純水等，並延伸於該支撐座2 0及延 伸手臂2 1内部，且相互連通貫穿該第二轉動軸2 5 2並 藉由轉軸結構（圖未示）以連通於該具可喷清洗液之清洗 頭3 0，因此藉以使清洗液導入並由經該具可喷清洗液之 清洗頭3 0喷出，以輔助清洗該晶片5 0 。 請參閱第四圖及第五圖所示，其中具可喷清洗液清洗 頭3 0包括連接體3 1 、容置體3 2及清洗接觸頭3 3 ， 該容置體3 2内形成一上窄下寬（茲詳述於下一段）之第 一流道321，該連接體31内具有一第二流道311 ， 該清洗接觸頭3 3具有複數喷孔3 3 1及至複數清洗材3 3 2，如此藉由該連接體3 1及該清洗接觸頭3 3連接於 該容置體3 2之二端，且相互間以螺接之方式相互連接， 且更包括有三封環6 0 ( 〇-ring )其分別設置於該第二轉 動軸2 5 2及該連接體3 1間、該連接體3 1及該容置體 3 2間、該容置體3 2及該清洗接觸頭3 3間，並使三該 流體管4 0、4 1、4 2連通於該第一流道3 2 1 、該第 二流道3 1 1及該等喷孔3 3 1 ，而藉由該等喷孔3 3 1 喷出該清洗液，如此該清洗頭3 0下壓使該清洗接觸頭3 3之清洗材3 3 2接觸清洗該晶片5 0表面’並同時利用 喷孔3 3 1喷出水谦或水霧沖洗晶片5 0。1242804 '__Case No. 93108760 _ Year and Month _ ^ _ V. Description of the invention (4) The lower end of the movable shaft 2 5 1 is connected to the motor 2 5 3, in which the cleaning head with sprayable cleaning liquid 30 is linked to The lower end of the second transmission shaft 2 5 2, the cleaning head 30 with spraying cleaning liquid is in contact with a wafer 50, and is driven to rotate by the driving device 25 to link the cleaning head 30 with spraying cleaning liquid to rotate cleaning The wafer 50 and the three fluid pipes 40, 4 1 and 4 2 respectively circulate nitrogen, chemical liquid and pure water, etc., and extend inside the support base 20 and the extension arm 21, and communicate with each other through the first Two rotating shafts 2 5 2 and a rotating shaft structure (not shown) are connected to the cleaning head with sprayable cleaning liquid 3 0, so that the cleaning liquid is introduced and passed through the cleaning head with sprayable cleaning liquid 3 0 is ejected to assist in cleaning the wafer 50. Please refer to the fourth and fifth figures, wherein the cleaning head 30 with sprayable cleaning liquid includes a connecting body 3 1, a receiving body 3 2, and a cleaning contact head 3 3, and an upper surface is formed in the receiving body 32. A narrow lower width (detailed in the next paragraph) first flow path 321. The connecting body 31 has a second flow path 311. The cleaning contact 3 3 has a plurality of spray holes 3 3 1 and a plurality of cleaning materials 3 3 2 In this way, the connecting body 31 and the cleaning contact 33 are connected to the two ends of the accommodating body 32, and are connected to each other in a screw connection manner, and further include three sealing rings 6 0 (〇- ring) are respectively disposed between the second rotating shaft 2 5 2 and the connecting body 31, the connecting body 31 and the receiving body 32, the receiving body 32, and the cleaning contact head 33. And make the three fluid pipes 40, 4 1, 4 2 communicate with the first flow channel 3 2 1, the second flow channel 3 1 1 and the nozzle holes 3 3 1, and through the nozzle holes 3 3 1 spray the cleaning liquid, so that the cleaning head 30 is pressed down to make the cleaning contact 3 3 of the cleaning material 3 3 2 contact and clean the surface of the wafer 50 and to spray water at the same time using the nozzle 3 3 1 Water mist rinses wafer 50.
1242804 _；__案號 93108760_年月日 修正_ 五、發明說明（5) 該容置體3 2的第一流道3 2 1係包含有一第一開口 3 2 1 1和一第二開口 3 2 1 2 ，且該第一開口 3 2 1 1 之開口面積大於該第二開口 3 2 1 2之開口面積，藉以使 該第一流道3 2 1呈一如圖所示的喷嘴狀（η ο z z 1 e )。 另，請參閱第六圖所示，該清洗接觸頭3 3上係可具 有二該喷孔3 3 1並列地設置於二該清洗材3 3 2間，且 該二清洗材3 3 2係呈二分之一圓形。請參閱第七圖所 示，或該清洗接觸頭3 3上係可具有四該喷孔3 3 1及四 該清洗材3 3 2交互間隔地環設置於其上，且該等清洗材 3 3 2係可呈四分之一圓形。請參閱第八圖所示，或該清 洗接觸頭3 3上係可具有八該喷孔3 3 1及八該清洗材3 3 2交互間隔地環設置於其上，且該等清洗材3 3 2係呈 八分之一圓形。並且該等喷孔3 3 1係形成橢形狀，以使 該喷孔3 3 1喷出水谦，且同時利用該清洗頭3 0旋轉時 更能涵蓋該晶片5 0上更多的表面積，並且該清洗材3 3 2係可為海綿體以合適於清晶片5 0而不會刮傷其表面。 綜上所述，該「具可噴清洗液清洗頭之晶片清洗裝 置」係藉由改變晶片清洗裝置之清洗頭，使化學機械研磨 裝置後之清洗晶片過程中，利用清洗頭之機械移除力及加 上該清洗頭喷出之清潔液壓力，以更能移除殘留在晶片上 的微粒，達到最佳清洗效果。 以上所述僅為說明本發明之較佳實施例，並非用以限 定本發明之申請專利範圍，凡其他未脫離本發明所揭露之 精神下所作之改變或修正，均應包含在下述之申請專利範 圍内。1242804 _; __Case No. 93108760_ Year, Month, and Day Amendment _ V. Description of the Invention (5) The first flow channel 3 2 1 of the containing body 3 2 includes a first opening 3 2 1 1 and a second opening 3 2 1 2, and the opening area of the first opening 3 2 1 1 is larger than the opening area of the second opening 3 2 1 2, so that the first flow channel 3 2 1 has a nozzle shape as shown in the figure (η ο zz 1 e). In addition, as shown in the sixth figure, the cleaning contact head 3 3 may have two nozzle holes 3 3 1 arranged in parallel between the two cleaning materials 3 3 2, and the two cleaning materials 3 3 2 are present. Half round. Please refer to the seventh figure, or the cleaning contact head 3 3 may have four the spray holes 3 3 1 and four the cleaning materials 3 3 2 alternately arranged on the ring, and the cleaning materials 3 3 Series 2 can be a quarter-round. Please refer to the eighth figure, or the cleaning contact head 3 3 may have eight the spray holes 3 3 1 and eight the cleaning material 3 3 2 alternately arranged on the ring, and the cleaning materials 3 3 The 2 series is one-eighth round. And the nozzle holes 3 3 1 are formed in an oval shape, so that the nozzle holes 3 3 1 can spray water, and at the same time, the cleaning head 30 can cover more surface area on the wafer 50 when rotating, and The cleaning material 3 3 2 can be a sponge body suitable for cleaning the wafer 50 without scratching its surface. To sum up, the "wafer cleaning device with sprayable cleaning liquid cleaning head" is to change the cleaning head of the wafer cleaning device to use the mechanical removal force of the cleaning head during the wafer cleaning process after the chemical mechanical polishing device. And the pressure of the cleaning liquid sprayed by the cleaning head is added to more effectively remove the particles remaining on the wafer and achieve the best cleaning effect. The above description is only for explaining the preferred embodiments of the present invention, and is not intended to limit the scope of patent application of the present invention. Any other changes or amendments made without departing from the spirit disclosed by the present invention shall be included in the following patent application Within range.
第9頁 1242804 案號 93108760 年 月 修正 圖式簡單說明 第一圖係習知技術之 明之具 第二圖係本發 視圖 第三圖係本發 視圖 第四圖係本發 弟五圖係本發 第六圖係本發 第七圖係本發 第八圖係本發 【圖示中參考 習知 晶片清洗 晶片清洗 純水喷頭 支撐座4 晶片5 0 晶片清洗裝置 可喷清洗液清洗頭之晶片清洗裝置俯 明之具可喷清洗液清洗頭之晶片清洗裝置側 明之具 明之具 明之清 明之清 明之清 號數】 裝置1 頭2 0 3 0a 0 a a 可喷清洗液之清洗頭組合圖 可噴清洗液之清洗頭分解圖 洗接觸頭第一實施例示意圖 洗接觸頭第二實施例示意圖 洗接觸頭第三實施例示意圖 0 a a 本發明 晶片清洗裝置1 0 支撐座2 0 延伸手臂2 1 驅動裝置2 5 第一轉動軸2 5 1 第二轉動軸2 5 2 馬達2 5 3 第一傳動皮帶2 5 4 第二傳動皮帶2 5 5 具可喷清洗液之清洗頭3 0 連接體3 1 第二流道3 1 1Page 9 1242804 Case No. 93108760 Revised diagrams Brief description The first picture is the knowledge of the conventional technology The second picture is the present view The third picture is the present view The fourth picture is the present brother The fifth picture is the present The sixth picture is the present picture. The seventh picture is the present picture. The eighth picture is the present picture. [Refer to the conventional wafer cleaning, wafer cleaning, pure water spray head support base, 4 wafers, 50 wafer cleaning devices, which can spray the wafers of the cleaning liquid. Wafer cleaning device with sprayable cleaning liquid cleaning head. Wafer cleaning device with clear and clear cleaning number] Device 1 head 2 0 3 0a 0 aa Combination diagram of spray head with sprayable cleaning liquid Spray cleaning Exploded view of liquid cleaning head Washing contact head First embodiment schematic diagram Washing contact head Second embodiment schematic diagram Washing contact head Third embodiment schematic diagram 0 aa Wafer cleaning device of the present invention 1 0 Support base 2 0 Extension arm 2 1 Driving device 2 5 First rotating shaft 2 5 1 Second rotating shaft 2 5 2 Motor 2 5 3 First driving belt 2 5 4 Second driving belt 2 5 5 Cleaning head with sprayable cleaning liquid 3 0 Connection body 3 1 Second flow Road 3 1 1
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