TWI223083B

TWI223083B - Probe card assembly, method of adjusting the planarization of the same and method of assembling the same

Info

Publication number: TWI223083B
Application number: TW91101839A
Authority: TW
Inventors: Alexander Brandorff; William P Pardee
Original assignee: Wentworth Lab Inc
Priority date: 2001-01-31
Filing date: 2002-01-31
Publication date: 2004-11-01

Abstract

A probe card assembly that compensates for differing rates of thermal expansion is disclosed herein. The assembly is comprised of a multi-layered dielectric plate (30) interposed between a probe head and a printed circuit board (10). The printed circuit board (10) has arrayed upon its surface a first plurality of electrical contacts arranged in a pattern. The dielectric plate (30) has a second plurality of electrical contacts arranged in a pattern matching the first plurality of contacts. A planarizing interposer (20) is interposed between the plate (30) and the printed circuit board (10) and has a pattern of holes matching the pattern of electrical contacts on the printed circuit board and plate. The assembly further includes a plurality of electrical connectors disposed within each of the holes arrayed in a pattern upon the planarizing interposer (20) a plurality conductive bumps (120) or fuzz buttons (90) making electrical contact with the first and second plurality of electrical contacts.

Description

A7A7

^ 發明背景 ^發明係關於用於測試形成於半導體晶圓，例如石夕或石申化錁’上之積體電路的電連續性的探針卡組合的製造。、在用以執仃此類測試之探針卡的標準設計中，會在具有複數個位於測試中之積體電路上用以接觸電路的小直徑探針之探針頭及與電錶或其它測試設備介面之印刷電路板 (PCB)之間***一多層陶瓷（MLc)板。該板係一種具有電導線及供‘線穿過之導電通道之空間變換器。該mlc空間變換器之用途係將電信號從該探針頭上之電接觸的極細微間距圖樣重新女排路徑至該印刷電路板上較粗間距的圖樣。‘‘間距（Pi tched)’’意指在相鄰的導線或通道之間的有空間存在^在測試積體電路的過程中，電連接必須在該MLC及該印刷包路板之間。此類的連接通常係藉由利用工業標準焊接技術將該MLC焊接至該pcb以形成堅硬的焊錫連接。當在高溫執灯此類測試時，舉例來說攝氏75度及125度之間，會希望利用熱膨脹係數（CTE)與測試中之矽晶圓的熱膨脹^數非常匹配的材質來製造該探針頭。矽的CTE為3· 2 。因此，較佳的探針頭的CTE係接近矽的2倍，例如小於7 ppm/degC 〇因為MLC會與該探針頭上之極細間距接觸產生電接觸，因此必須與矽之CTE非常地匹配。較佳的是，該MLC的CTE亦落在石夕的CTE的2倍托圍内。此條件會產生一問題，當結合mlc 與PCB時，因為PCB的CTE通常為1 7 ppm，所以高出石夕的CTE 非吊的多。因為MLC及PCB之間的膨嚴速率差異，所以當因 -4- 本纸裱尺度適用中國國家標準(CNS) A4規格(210X297公釐) 1223083^ BACKGROUND OF THE INVENTION ^ The invention relates to the manufacture of probe card assemblies for testing the electrical continuity of integrated circuits formed on semiconductor wafers, such as Shi Xi or Shi Shenhua. In the standard design of the probe card used to perform such tests, the probe head with a plurality of small-diameter probes used to contact the circuit on the integrated circuit under test and the meter or other tests A multilayer ceramic (MLc) board is inserted between the printed circuit boards (PCB) of the device interface. The board is a space transformer with electrical wires and a conductive path through which the wires pass. The purpose of the MLC space transformer is to reroute the electrical signal from the extremely fine pitch pattern of the electrical contacts on the probe head to the coarse pitch pattern on the printed circuit board. ‘Pictched’ means that there is space between adjacent wires or channels. During the testing of integrated circuits, the electrical connection must be between the MLC and the printed circuit board. Such connections are typically made by soldering the MLC to the pcb using industry standard soldering techniques to form a hard solder connection. When performing such tests on high-temperature lamps, for example between 75 ° C and 125 ° C, you will want to use a material with a coefficient of thermal expansion (CTE) that closely matches the thermal expansion coefficient of the silicon wafer under test to make the probe. head. The CTE of silicon is 3.2. Therefore, the CTE of the better probe head is close to twice that of silicon, for example, less than 7 ppm / degC. Because MLC will make electrical contact with the very fine pitch contact on the probe head, it must match the CTE of silicon very well. Preferably, the CTE of the MLC also falls within 2 times of the CTE of Shi Xi. This condition creates a problem. When the MLC is combined with the PCB, the CTE of the PCB is usually 17 ppm, so it is much higher than the CTE of Shi Xi. Due to the difference in the tightening rate between MLC and PCB, Dang Yin -4- This paper is mounted on the paper in accordance with China National Standard (CNS) A4 (210X297 mm) 1223083

為加熱或冷卻該結構而產生機械應力（stress)時便有可能使得該堅硬的焊錫連接斷裂。 b 通常，探針頭的全部探針都必須是只有幾千分之一英吋範圍内公差（tolerance)的平面。必須地小心控制製造及組合公差’以及額外的研磨及拋光處理以維持平面化之程度。現有的電路測試方法及設備都無法考慮到CTE的差異。舉例來說美國專利案號5, 623, 21 3標題為“電路之薄膜探針 (Membrane Probing 〇f Circuits)” 及美國專利案號 5, 841，291標題為“電路之可更換薄膜探針測試 (Exchangeable Membrane Probe Testing of Circuits) 都係關於利用撓性基板上之電導體凸起物或是薄膜以測試電路。並未提供任何建議或是討論關於補償該整體系統内既有的CTE差異的系統。同樣地，美國專利案號5, 973, 5〇4標題為“可程式高密度電子裝置測試（programmable High—Density Electi：〇nicWhen mechanical stress is generated to heat or cool the structure, the hard solder connection may break. b In general, all probes on the probe head must be planes with tolerances in the range of a few thousandths of an inch. Care must be taken to control manufacturing and assembly tolerances' as well as additional grinding and polishing processes to maintain the degree of planarization. Existing circuit testing methods and equipment cannot take into account the differences in CTE. For example, U.S. Patent No. 5,623,21 3 entitled "Membrane Probing Circuits" and U.S. Patent No. 5,841,291 entitled "Replaceable Membrane Probes for Circuits" (Exchangeable Membrane Probe Testing of Circuits) are all about testing circuits using electrical conductor bumps or films on flexible substrates. No suggestions or discussions are made about systems that compensate for existing CTE differences in the overall system Similarly, U.S. Patent No. 5,973,504 is entitled "Programmable High-Density Electi: Onic

Device Testing)”係關於測試高密度電子裝置之系統。更特別的是’此專利揭露使用具有多晶片模組之測試系統以便在測試中的裝置焊塾與測試電路之間傳送信號。此系統運用-薄㈣針卡及導體電路連接凸起物。會制框架環 (frame rlng)將該薄膜探針卡螺旋固定（screw)在外殼上並且放置於壓力機構與測試裝置之間。該導體凸起物會聚集在該薄膜上以對應該連接焊墊陣列。在另一具體實施例中s利用私按钮連接器保持電連接。同樣地還是並未提及該系統應該如何設計以補償該測試系統内既有的⑽差異。 •5- 本紙張尺度適财Μ家料(CNS) A4;W21G X 29^37 1223083 A7 B7 五、發明説明（3 ) 美國專利案號6, 1 63, 142及6, 297, 657共同所有，標題為 /里度補償垂直針腳探針裝置（了enlperature Compensated"Device Testing)" is a system for testing high-density electronic devices. More specifically, this patent discloses the use of a test system with multiple chip modules to transmit signals between the device solder under test and the test circuit. This system uses -Thin pin card and conductor circuit connection protrusion. Frame rlng will screw the film probe card to the housing and place between the pressure mechanism and the test device. The conductor protrusion Objects will be gathered on the film to correspond to the bonding pad array. In another specific embodiment, a private button connector is used to maintain the electrical connection. It is also not mentioned how the system should be designed to compensate for the test system. Existing differences. • 5- The paper size is suitable for household materials (CNS) A4; W21G X 29 ^ 37 1223083 A7 B7 5. Description of the invention (3) US Patent Nos. 6, 1 63, 142, and 6, Commonly owned by 297, 657 and titled / Lide Compensation Vertical Pin Probe Device (Enlperature Compensated

Vertical Pin Probing Device)” ，是關於可使用於大溫度範圍之測試積體電路中的改善後的探針裝置。兩項專利所揭路的之方法及設備都係與此處本文所揭露的方法及設備互補。因此’需要一種可用以在組合之後調整探針頭之平面度的方法及設備以便校正對位失準（fflisaligninent)。理想上此類方法及5又備應該將關鍵加工（critic^贴化丨ning) 及組合處理的需求降低至最小程度。發明簡單概要本發明的目的之一係尋求一種以電及機械方式連接mlc 至PCB的方法並允許在維持電接觸時可以有不同的膨脹速率。此外本發明的另一個目的係提供一種程序讓人可以調整該MLC相對於該ρα的平面化程度。本發明的一項新穎特徵包含允許不同的熱膨脹速率及允許探針頭平面化的情況下將該MLC黏結該PCB，同時保持該 MLC及該PCB之間的電接觸。為補償不同的熱膨脹速率，本發明適當地運用—平面化件/、匕括放置在該MLC及該pCB之間的平板，同時保持 -：的，接觸。對此揭露的目的而言，“一致的電連接,，所指的是即使是不同的熱膨脹速率都能保持電連接以及互相連接兩面之組件的完整性，並且允許該探針頭組合之平面化。與測試中之裝置（積體電路）的-致的電連接可利用 -6- 二張尺度適用中國國家標---- 1223083 A7 -—_ _______B7 五、發明説明（4 ) 彈按叙或疋導體凸起物以維持。在使用彈性按紐之具體實施例中，會在該平板上以與該PCB上電接觸之圖樣匹配的圖樣鑽出多個穿孔（hole)(亦稱為通道（via)或是通道穿孔 (via hole)。接著便會將彈性按鈕放置在該穿孔中。在運用導體凸起物之具體實施例中，會放置該導體凸起物或是將其放置在該MLC以及/或是該peg陸地格狀陣列焊墊上。在第一具體實施例中，所揭露的是一用以測試積體電路的探針卡組合，包括：一***於探針頭及印刷電路板之間的夕層；丨電板，該印刷電路板於其表面上已經配置排列成某個圖樣的第一群複數個電接觸，該介電板於其表面上已經配置實質上排列成與該第一群複數個電接觸匹配之某個圖樣的第=群複數個電接冑；一***於該陶竟板及印刷電路板之間的平面化插人件，該平面化插人件具有與該印刷電路板及該介電板上電接觸圖樣匹配之穿孔圖樣；一箝住該平板之固定環（mounting ring)而該固定環係貼附在該印刷電路板上；以及-放置在以該平面化***件上之圖樣方式排列的多個穿孔内的第三群複數個一致的電連接器，該電連接器會與電接觸的第一群複數個電接觸及電接觸的第二群複數個電接觸產生接觸。在第二具體實施例中，所揭露的是調整探針卡組合之平 =化的方法’包括步驟有：（a)將調整螺絲旋緊以使該固定環可以緊靠該印刷電路板；⑻決定該探針頭之平面化；以及（c)調整該螺絲的緊度以達到該探針頭所希望的平面化程度。本紙張尺度適财四家標準(CNS) A4規格㈣X挪公茇) A7Vertical Pin Probing Device) "is an improved probe device that can be used in test integrated circuits for a wide temperature range. The methods and equipment disclosed in the two patents are the methods disclosed herein. And equipment are complementary. Therefore, 'a method and equipment that can be used to adjust the flatness of the probe head after combination is needed in order to correct the misalignment. The need for bonding and combined processing is reduced to a minimum. A brief summary of the invention One of the objectives of the present invention is to find a method of electrically and mechanically connecting the MLC to the PCB and allow different expansions while maintaining electrical contact In addition, another object of the present invention is to provide a program for adjusting the degree of planarization of the MLC with respect to the ρα. A novel feature of the present invention includes the case of allowing different thermal expansion rates and allowing the probe head to be planarized. The MLC is bonded to the PCB while maintaining electrical contact between the MLC and the PCB. To compensate for different thermal expansion rates, the present invention Appropriate use—a planarization piece /, a flat plate placed between the MLC and the pCB, while maintaining-:, contact. For the purpose of this disclosure, "consistent electrical connection," refers to Even the different thermal expansion rates can maintain the integrity of the electrical connection and the components on both sides that are connected to each other, and allow the planarization of the probe head assembly. The same electrical connection with the device under test (integrated circuit) can be used. -6- Two scales apply Chinese national standard ---- 1223083 A7-_ _______B7 V. Description of the invention (4) According to the description or 叙Conductor protrusions to maintain. In a specific embodiment using a flexible button, a plurality of holes (also known as vias or vias) are drilled on the plate with a pattern matching the pattern of electrical contact on the PCB. hole). Then the elastic button will be placed in the perforation. In the embodiment using the conductor protrusion, the conductor protrusion will be placed or it will be placed in the MLC and / or the peg land grid. In the first specific embodiment, what is disclosed is a probe card assembly for testing integrated circuits, which includes: a layer inserted between the probe head and the printed circuit board; Board, the printed circuit board has a first group of multiple electrical contacts arranged in a pattern on its surface, and the dielectric board has been configured on its surface substantially aligned to match the first group of multiple electrical contacts A plurality of electrical contacts of a certain pattern; a planarized insert inserted between the ceramic plate and the printed circuit board, the planarized insert having the same connection with the printed circuit board and the dielectric board Electrical contact pattern matching perforation pattern; a A mounting ring of the flat plate and the mounting ring is attached to the printed circuit board; and-a third group of plural placed in a plurality of perforations arranged in a pattern on the planarized insert A consistent electrical connector that makes contact with a first plurality of electrical contacts and a second plurality of electrical contacts in electrical contact. In a second specific embodiment, what is disclosed is an adjustment probe The method of leveling the pin card combination 'includes the steps of: (a) tightening the adjustment screw so that the fixing ring can abut the printed circuit board; ⑻ determining the planarization of the probe head; and (c) adjusting Tighten the screw to achieve the desired level of flatness of the probe head. This paper is compliant with the Four Standards (CNS) (A4 specification (X Norway)) A7

、、在第三具體實施例中，所揭露的是組裝探針卡組合之方 :’包括步驟有··（a) $用電導體工具將每一複數個彈性入至通道穿孔中；以及(b)確認該多層介電板及該印刷乾路板之間的電連接性。在第四具體實施例中，所揭露的是組裝如申請專利範圍 :1項之探針卡組合的方法，包括步财：U)提供-臨時 A以驗證電連接；以及⑻在測試之前以多層介電板替換該 b時板。圖式簡單說明、圖1所示的係根據本發明之探針卡組合圖式。圖2所示的係探針卡組合之剖面圖。圖3所示的係使用該彈性按紐之探針卡組合之剖面圖。圖3a所示的係在該PCB中具有穿孔作為校準排列用途之探針卡組合剖面圖。圖4所示的係使用具有已經填塞之通道穿孔之彈性/按鈕的探針卡組合之剖面圖。圖5所示的係使用該PCB及該空間變換器之間的導體凸起物的探針卡組合剖面圖。圖6所示的係使用該PCB及該MLC之間的導體凸起物的探針卡組合剖面圖。發明詳細說明本發明包括一放置在MLC或是其它多層介電及PCB之間的平面化***件。該***件利用一致的互相連接（一般如圖1 所示），例如彈性按鈕（如圖2, 3,及4所示），一針腳格狀 -8- 本紙張尺度適用中S @豕榡準(CNS) A4規格(⑽X 297公爱） 1223083 A7 ________B7 五、發明説明（6 ) 陣列（Pin Grid Array)(如圖5所示），或是導體凸起物（如圖6所示），以保持該pcb及該MLC之間的電連接。整篇規格中所謂的MLC希望亦能包括其它適當的多層介電板。返回圖1，***件20包括一平板其具有多個形成於與該 PCB 10之第一群複數個電接觸圖樣相匹配之圖樣的穿孔。較佳的疋’該平板係由介電質所形成的，例如堅硬的塑谬。取佳的疋，該平板係由Quadrant Engineering Pla§tic Product所製造之Tech tr on PPS所形成。該第一群複數個電接觸通常係排列成陣列之間距為1 · 27 mm( 0· 05英忖）的'陣列。雖然0· 05英吋係典型的間距，但是熟悉本技藝之人士將會發現其它的間距亦適用。電連接器係放置在該穿孔中以提供電路徑。較佳的電連接器係一種稱之為彈性按鈕的小型圓柱形元件。該彈性按鈕係一種由薄電導體金屬線，例如鈹銅製品，所組成之商用產品，其已經壓縮至一晶粒中以形成一圓柱形的物質並且具有彈簧特性。較佳的/彈性按鈕之實例包括該些由Cranf〇rd，New Jersey2Tecknit 所製造的部分。該MLC 30會夾住一固定環40，其接著會以下面所述的方式黏附到該PCB 10上，該方式是允許調整該環的平面化。該固定環40係利用多個螺絲45安裝在該？(^ 1〇上。較佳的結構使用二個螺絲。在每個螺絲上，介於環4〇&pcB 之間，放置著硬彈簧25,如圖2所示。適當的硬彈簧包括彈簧墊圈，例如由 HK Metalcraft Inc· of L〇di，New Jersey 所製造的Belleville墊圈。最佳的是，該螺絲“會穿過該 -9- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公爱) 1223083 A7 B7 五、發明説明（8In the third specific embodiment, what is disclosed is the method of assembling the probe card combination: 'The steps include ... (a) $ Electrical conductor tools are used to insert each of the plurality of elasticity into the channel perforations; and ( b) confirming the electrical connectivity between the multilayer dielectric board and the printed circuit board. In the fourth specific embodiment, a method for assembling a probe card combination such as the scope of patent application: 1 is disclosed, including steps: U) Provision-Temporary A to verify electrical connection; and The dielectric board replaces the b-time board. Brief description of the drawings, FIG. 1 is a combination diagram of a probe card according to the present invention. A cross-sectional view of the probe card assembly shown in FIG. 2. FIG. 3 is a cross-sectional view of a probe card assembly using the elastic button. Figure 3a is a cross-sectional view of a probe card assembly having perforations in the PCB for alignment purposes. Figure 4 is a cross-sectional view of a probe card combination using an elastic / button with a pierced channel perforation. Fig. 5 is a sectional view of a probe card assembly using a conductor protrusion between the PCB and the space transformer. Figure 6 is a cross-sectional view of a probe card assembly using a conductive protrusion between the PCB and the MLC. DETAILED DESCRIPTION OF THE INVENTION The present invention includes a planarized interposer placed between an MLC or other multilayer dielectric and a PCB. The insert uses a consistent interconnection (usually shown in Figure 1), such as a flexible button (see Figures 2, 3, and 4), a pin grid -8- S @ 纸张准 applicable in this paper size (CNS) A4 specifications (⑽X 297 public love) 1223083 A7 ________B7 V. Description of the invention (6) Pin Grid Array (as shown in Figure 5), or conductor bumps (as shown in Figure 6), to Maintain the electrical connection between the pcb and the MLC. The so-called MLC throughout the specification hopes to include other suitable multilayer dielectric boards as well. Returning to FIG. 1, the insert 20 includes a flat plate having a plurality of perforations formed in a pattern that matches the first plurality of electrical contact patterns of the PCB 10. Preferably, the plate is formed of a dielectric, such as a hard plastic film. In the best case, the flat plate is formed by Tech tr on PPS manufactured by Quadrant Engineering Pla§tic Product. The first plurality of electrical contacts are usually arranged in an 'array with an array spacing of 1.27 mm (0.05 inch). Although 0.05 inches are typical pitches, those skilled in the art will find that other pitches are also applicable. An electrical connector is placed in the perforation to provide an electrical path. The preferred electrical connector is a small cylindrical element called a spring button. The elastic button is a commercial product composed of a thin electrical conductor metal wire, such as a beryllium copper product, which has been compressed into a grain to form a cylindrical substance and has spring characteristics. Examples of preferred / flexible buttons include those made by Cranford, New Jersey 2 Tecknit. The MLC 30 clamps a fixing ring 40, which is then adhered to the PCB 10 in a manner described below, which allows adjusting the planarity of the ring. Is the fixing ring 40 mounted with multiple screws 45? (^ 10). The preferred structure uses two screws. On each screw, between the ring 40 & pcB, a hard spring 25 is placed, as shown in Figure 2. A suitable hard spring includes a spring Washers, such as Belleville washers manufactured by HK Metalcraft Inc. of Lodi, New Jersey. Optimally, the screws "will pass through the -9- This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297 public love) 1223083 A7 B7 V. Description of the invention (8

此具體實施例中，並不需要***件（圖2中的數字2〇)，因此可以節省非常多的***件2〇之成本，並且不需要將其與pcB 1 〇對齊排列。因此’因為本來就已經對齊排列，所以此具體實施例已經改善可靠度。較佳的是，彈性按鈕90係從PCB1〇的非測試端16〇***並且不斷地推入直到確認該彈性按鈕9〇及該MLC 3〇之間已經產生電接觸為止。該非測試端所指的係面對該測試頭5〇的電路板端。此類結構可以確保全部的彈性按鈕9〇相對於該 MLC 30的最後高度幾乎相同。為了簡化組合的過程，會希望臨犄使用鋁板取代該MLC。使用此類平板可以簡化電連接的確認動作。較佳的是，使用電導體的工具將該彈性按鈕 90推入通過通道，如此一來當從該工具產生封閉 (closed)的電路徑時，經過該彈性按鈕9〇到該臨時板並且回到該工具，便可以確認該接觸。此臨時板（未顯示）可以臨時取代MLC 30以便載入該彈性按鈕go然後再將其移/除並且以MLC 30取代。希望臨時板的厚度比實際的MLC 3〇稍微厚一些’使得該彈性按紐9 0可以受到該臨時板的壓擠。移除該板並且以MLC 30取代，接著便可以讓該彈性按鈕9〇稱微地鬆弛同時保持電接觸，從而將施加在該社〇 30上之壓擠力量降低至最小的程度。此結構可以確保該彈性按鈕90對齊排列該PCB 10。為進一步簡化該MLC 30對齊排列該彈性按鈕90，可以在該測試頭50對面的MLC端上的MLC接觸陣列（未顯示）中運用額外的焊墊185。該MLC接觸陣列的圖樣與該PCB 10上之LGA圖樣匹 -11 - 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐） 1223083 A7 B7 五、發明説明（9 配。PCB 1 0中的兩個對應的穿孔可用以經由該pCB 1 〇看到該焊墊。接著會調整該MLC 30以將該焊墊放置在該穿孔的中央位置。較佳的排列包括兩根對齊排列針腳，如使用於針腳格狀陣列MLC中的針腳，其係以銅鋅合金焊接至該焊塾上。該些焊墊會穿透該PCB 10上兩個對應的額外的穿孔，從而將該MLC之LGA陣列對齊排列該PCB之穿孔陣列。在另一具體實施例中（未顯示），會消除該堅硬的 8011”；1116墊圈25或是以硬度較小（1(^6卜討1^狀％)的墊圈取代，並且該平面化螺絲45埋入（counter —sunk)該-固疋環中。在此另一具體實施例中，該環可以相對於該peg 1 〇 Ik思地浮動並且在測試期間自行平面化，而當將該測試負載移除時該埋入螺絲可以適當地將該環重新定中心 (re-center)。該環及該PCB之間浮動的程度可利用一致的電接觸（彈性按鈕或是導體凸起物）補償。圖3a所示的係協助該組合之對齊排列的定位孔“丨忱 hole)200 。在另一具體實施例中，如圖4所示，會使用較長及較柔軟的彈I*生按紐以及多個遮敝穿孔（blind vias) 110。在此具體實例中，會填充穿孔11 〇的非測試端1 β 〇使得該穿孔的冰度會讓部份的彈性按紐突出該PCB 1 〇。在此具體實施例中，穿孔110的直徑比該彈性按鈕90大，因此不再希望利用摩擦力維持該彈性按鈕90的位置。在另一具體實施例中，如圖5所示，係將針腳格狀陣列 (PGA) 180以銅鋅合金焊接至該MLC 30的接觸焊墊上以建構 -12- 本紙張尺度適用中國國家標準(CNS) Α4規格(210X297公釐） 1223083In this specific embodiment, an insert is not required (number 20 in FIG. 2), so the cost of a very large number of inserts 20 can be saved, and it does not need to be aligned with pcB 10. Therefore, since the alignment is already aligned, this specific embodiment has improved reliability. Preferably, the flexible button 90 is inserted from the non-test terminal 160 of the PCB 10 and continuously pushed until it is confirmed that an electrical contact has been made between the flexible button 90 and the MLC 30. The non-test terminal refers to the circuit board side of the test head 50. Such a structure can ensure that the final height of all the flexible buttons 90 relative to the MLC 30 is almost the same. In order to simplify the assembly process, Lintong will want to replace the MLC with an aluminum plate. Using such a tablet can simplify the confirmation of the electrical connection. Preferably, the flexible button 90 is pushed into the passage through a tool using an electrical conductor, so that when a closed electrical path is generated from the tool, the flexible button 90 passes through the flexible button 90 to the temporary board and returns The tool then confirms the contact. This temporary board (not shown) can temporarily replace MLC 30 to load the flexible button go and then move / remove it and replace it with MLC 30. It is hoped that the thickness of the temporary plate is slightly thicker than the actual MLC 30, so that the elastic button 90 can be pressed by the temporary plate. The board was removed and replaced with MLC 30, and then the flexible button 90 could be slightly loosened while maintaining electrical contact, thereby minimizing the pressing force exerted on the company 30. This structure can ensure that the flexible button 90 is aligned with the PCB 10. To further simplify the alignment of the MLC 30 with the flexible button 90, additional pads 185 can be used in the MLC contact array (not shown) on the MLC end opposite the test head 50. The pattern of the MLC contact array and the LGA pattern on the PCB 10-11-This paper size applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1223083 A7 B7 V. Description of the invention (9 configurations. PCB Two corresponding perforations in 10 can be used to see the pad through the pCB 10. The MLC 30 is then adjusted to place the pad in the center of the perforation. A preferred arrangement includes two aligned arrangements The pins, such as those used in a pin grid array MLC, are soldered to the welding pad with a copper-zinc alloy. The pads will penetrate two corresponding additional perforations on the PCB 10, and thus the MLC The LGA array is aligned with the perforated array of the PCB. In another specific embodiment (not shown), the hard 8011 "; 1116 washer 25 may be less rigid (1 (^ 6 %) Washer was replaced, and the planarization screw 45 was counter-sunk into the -fixed ring. In another specific embodiment, the ring may float relative to the peg 1k and think about Self-planarization during the test, and when the test load is removed, the embedded screw The ring can be re-centered appropriately. The degree of floating between the ring and the PCB can be compensated with consistent electrical contacts (flexible buttons or conductor bumps). The system assistance shown in Figure 3a The alignment hole 200 of this combination is aligned. In another specific embodiment, as shown in FIG. 4, a longer and softer elastic button and a plurality of shadow perforations ( blind vias) 110. In this specific example, the non-test end 1 β 〇 of the perforation 11 〇 will be filled so that the ice of the perforation will cause some elastic buttons to protrude from the PCB 1 〇. In this specific embodiment, The diameter of the perforation 110 is larger than the elastic button 90, so it is no longer desirable to maintain the position of the elastic button 90 by friction. In another specific embodiment, as shown in FIG. 5, a pin grid array (PGA) 180 is used. Copper-zinc alloy is welded to the contact pads of the MLC 30 to construct -12- This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) 1223083

裝Hold

***件20。該PGA會與該PCB中的平板穿孔成對並且***至其中。彈簧墊圈25(例如Belleville墊圈）係放置在複數個位置的固定環40之下，最好是三個位置。調整螺絲45(亦顯示於圖1中）會穿過該墊圈25以調整該環的平面度。一旦適當地平面化之後，該PGA的尖端，其會穿透該pcB的背端（非測試端），會焊接到該PCB穿孔1〇〇的背端。非必要的是，為了縮短針腳180的電路徑，會將導體膠，例如導體環氧樹脂或是焊錫注入或遮蔽到該電路板之測試頭端的穿孔内。較佳的是，該穿孔的内徑大於該針腳，因此當該針腳***到該穿孔中時，該膠便會填滿該針腳及該穿孔之間的空間以產生電連接。此類結構可以縮短該電路徑，因此便可以使用較短的針腳。接著會利用上述的方法對齊排列該ΜΙχ 3〇。因為已經在該MLC 30及該PCB 10之間產生電連接，所以該測試頭可以安裝在該固定環及MLC 3〇，並且對已完成的組合進行最後的平面度檢查。如果需要的話，可以調整該平面度。一旦適當地對齊排列之後，便可以對該組合進行固化，例如以低溫固化循環進行，以凝固該導體膠。一旦平面度確認之後，便可以在該MLC 30下方注入環氧樹脂填充劑以填滿該MLC 30及該PCB 10之間的間隙，增加該MLC 3〇及該PCB 10之間的黏接強度。在另一具體實施例中，如圖6所示，會以一致的導體凸起物120取代彈性按鈕90。該些導體凸起物12〇，較佳的是由導體環氧樹脂’例如電阻係數低於〇· 005讣^㈣的金屬或是石墨（graphite)聚合物所組成，係遮蔽或放置在該Μιχ -13- 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1223083 A7 ---- - B7 五、發明説明（11 ) ，該PCB 10之陸地袼狀陣列焊墊上。當將該虬。3〇及該PCB 1G接觸在—起時，該凸起物12G會在該MLC 30及該 PCB—10之間形成一致的電路徑。接著會將該測試頭（未顯不）安裝到該固定環40並且與該MLC3(^f齊排列。接著會測試該測試頭之平面度以確保適當的平面度及調整，並：如果需要的話，可藉由轉動該調整螺絲45(圖υ進行調整以便讓心測試頭之較回端更靠近該pcB 1〇。接著會將該PGR u 及該二間變換器130加熱直到該環氧樹脂固化為止，如此一來該空間變換器130便可以目定在該pcB1〇上。接著 MIX 30下方注入環氧樹脂填塞劑。 θ μ s非必要的是，該導體凸起物係由焊錫膠所製成，較佳的是=用低熔點的焊錫，例如攝氏1〇〇度。較佳的是，該焊鍚在室溫下係固態的。當測試期間溫度上升時，該焊錫會軟化亚且重新流動，消除機械應力同時保持電接觸。當冷卻時，該焊錫會再度地凝固。因此，已經顯示及說明一種設備及方法在測試之前平面化探針卡組合。熟習該技藝的人士將會理解在不牴觸本發明，整體目的的條件下可以使用其它的具體實施例及修正。熟悉該技藝的Λ士將會理解任何此類的修改及應用都希望涵蓋於本申請案之範圍内。 -14- 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公爱)插件 20。 20 pieces. The PGA is paired with a plate punch in the PCB and inserted into it. The spring washer 25 (e.g., Belleville washer) is placed under the retaining ring 40 in a plurality of positions, preferably three positions. An adjustment screw 45 (also shown in Fig. 1) passes through the washer 25 to adjust the flatness of the ring. Once properly planarized, the tip of the PGA will penetrate the back end (not the test end) of the pcB and will be soldered to the back end of the PCB perforation 100. It is not necessary that, in order to shorten the electrical path of the pin 180, a conductive paste, such as a conductive epoxy resin or solder, is injected or shielded into the hole of the test head end of the circuit board. Preferably, the inner diameter of the hole is larger than the pin, so when the pin is inserted into the hole, the glue will fill the space between the pin and the hole to create an electrical connection. This type of structure shortens the electrical path, so shorter pins can be used. The MIX x 30 will then be aligned using the method described above. Because an electrical connection has been made between the MLC 30 and the PCB 10, the test head can be mounted on the retaining ring and MLC 30, and a final flatness check is performed on the completed combination. If necessary, adjust the flatness. Once properly aligned, the combination can be cured, for example in a low temperature curing cycle, to solidify the conductor glue. Once the flatness is confirmed, an epoxy filler can be injected under the MLC 30 to fill the gap between the MLC 30 and the PCB 10, and increase the bonding strength between the MLC 30 and the PCB 10. In another embodiment, as shown in FIG. 6, the elastic button 90 is replaced with a uniform conductor protrusion 120. The conductive protrusions 12 are preferably composed of a conductive epoxy resin, such as a metal or graphite polymer having a resistivity lower than 0.005㈣ ^ ㈣, which is shielded or placed in the Mix -13- This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) 1223083 A7 -----B7 V. Description of the invention (11), the PCB 10's land-like array pads. Dang that. When 30 and the PCB 1G are in contact, the protrusion 12G will form a consistent electrical path between the MLC 30 and the PCB-10. The test head (not shown) will then be mounted to the retaining ring 40 and aligned with the MLC3 (^ f. The flatness of the test head will be tested to ensure proper flatness and adjustment, and if necessary , Can be adjusted by turning the adjustment screw 45 (Figure υ so that the heart test head is closer to the pcB 10 than the back end. Then the PGR u and the two transformers 130 are heated until the epoxy resin is cured So far, the space transformer 130 can be visually determined on the pcB10. Then, an epoxy filler is injected under the MIX 30. θ μ s It is not necessary that the conductor protrusion is made of solder paste It is better to use a low melting point solder, such as 100 degrees Celsius. Preferably, the solder pad is solid at room temperature. When the temperature rises during the test, the solder will soften and restart. Flow, eliminate mechanical stress while maintaining electrical contact. When cooled, the solder will solidify again. Therefore, a device and method have been shown and illustrated to flatten the probe card assembly before testing. Those skilled in the art will understand that Not bad In the present invention, other specific embodiments and modifications can be used under the condition of the overall purpose. Those skilled in the art will understand that any such modifications and applications are intended to be covered by this application. -14- This paper Standards apply to China National Standard (CNS) A4 specifications (210 X 297 public love)

Claims

1223083 苐091101839號專利申請案中文申凊專利範圍替換本(93年2月) 修正補充1223083 Patent Application No. 091101839 Chinese Patent Application Replacement (February 1993) Amendment

用以測試積體電路其特徵為·· 1 · 一種探針卡組合，一***於一探針頭（5〇)及一印刷電路板（10)之間的多層介電板（30),該印刷電路板（1〇)於其表面上具有排列成囷樣的第群複數個電接觸，該介電板（3〇)具有於其表面上排列成與該第一群複數個電接觸實質上匹配之配置圖樣的第二群複數個電接觸；平面化之***件（2〇)其係***於該介電板及該印刷電路板（10)之間，該平面化之***件（2〇)具有與該印刷電路板（1〇)及該介電板（3〇)上之電接觸圖樣匹配之一穿孔一夾住該平板（30)的固定環（40)以及該固定環（40)係固著在該印刷電路板（丨〇)上；及一放置在以該平面化***件（20)上之圖樣方式排列的多個穿孔内的第三群複數個一致的電連接器，該電連接為與該第一群複數個電接觸及該第二群複數個電接觸產生電接觸。 2·如申請專利範圍第丨項之探針卡組合，其中，該固定環 (40)係以複數個螺絲（45)固定在該印刷電路板（1〇)。 3·如申請專利範圍第2項之探針卡組合，其中，一墊圈（25) 係***於該每一複數個螺絲（45)及該印刷電路板（1〇)之 4·如申凊專利範圍第3項之探針卡組合，其中，該墊圈（25) 係為一種彈簧塾圈。 5 ·如申明專利範圍第4項之探針卡組合，其中，該電接觸所It is used to test the integrated circuit and its characteristics are: · 1 · A probe card combination, a multilayer dielectric board (30) inserted between a probe head (50) and a printed circuit board (10), the The printed circuit board (10) has a plurality of groups of electrical contacts arranged in a pattern on its surface, and the dielectric board (30) has a plurality of electrical contacts arranged on the surface of the dielectric group (30) substantially A plurality of electrical contacts of the second group of matching configuration patterns; the planarized insert (20) is inserted between the dielectric board and the printed circuit board (10), and the planarized insert (20) ) Has one of the holes matching the electrical contact pattern on the printed circuit board (10) and the dielectric board (30), a fixing ring (40) for clamping the plate (30), and the fixing ring (40) Fastened to the printed circuit board (丨 0); and a third group of multiple uniform electrical connectors placed in a plurality of perforations arranged in a pattern on the planarized insert (20), the The electrical connection generates electrical contact with the first plurality of electrical contacts and the second plurality of electrical contacts. 2. The probe card assembly according to item 丨 of the application, wherein the fixing ring (40) is fixed to the printed circuit board (10) by a plurality of screws (45). 3. The probe card combination of item 2 in the scope of patent application, wherein a washer (25) is inserted into each of the plurality of screws (45) and the printed circuit board (10). The probe card assembly of the third item, wherein the washer (25) is a spring coil. 5 · The probe card combination as stated in item 4 of the patent scope, wherein the electrical contact

1223083 申請專利範圍排成的陣列之間距為丨·27毫米。 6.如申請專利範圍第4項之探針卡組合，其中該第二群複數個一致的電連接器包括複數個彈性按鈕（9〇)。 7 ·如申明專利範圍第2項之探針卡組合，其中該複數個螺絲 (45)埋入該固定環（4〇)中。 8·如申請專利範圍第6項之探針卡組合，其中，該印刷電路板（10)包括一個或多個通道穿孔（100，110)。 9·如申請專利範圍第8項之探針卡組合，其中，該彈性按鈕 (90)***該通道穿孔（1〇〇, 11〇)中。 10·如申凊專利範圍第9項之探針卡組合，其中，該彈性按鈕 (90)之直徑大於該通道穿孔（1〇〇 ’ 11〇)之直徑。 Η·如申請專利範圍第8項之探針卡組合，其中，該一個或多個通道穿孔係遮蔽穿孔（110)。 12·如申請專利範圍第丨丨項之探針卡組合，其中，該彈性按鈕（90)***該遮蔽穿孔（11〇)中。 13·如申請專利範圍第12項之探針卡組合，其中，該彈性按鈕（90)***該印刷電路板（1〇)從其上面突出朝向該多層介電板（3 0)。 14·如申請專利範圍第i項之探針卡組合，其中，該第三群複數個-致的電連接器係包括遮蔽該第一群複數個；接：上面之複數個導體凸起物（120)。 1 5 ·如申請專利範圍第1項之探針卡組合，其中，該第二群複數個一致的電連接器的特徵為放置在該第一群複數個^ 接觸上之複數個導體凸起物（120)。1223083 Patent application scope The distance between the arrays is 27mm. 6. The probe card combination according to item 4 of the patent application scope, wherein the plurality of uniform electrical connectors of the second group include a plurality of flexible buttons (90). 7. The probe card combination according to claim 2 of the patent scope, wherein the plurality of screws (45) are embedded in the fixing ring (40). 8. The probe card combination of claim 6 in the patent application scope, wherein the printed circuit board (10) includes one or more channel perforations (100, 110). 9. The probe card combination according to item 8 of the patent application scope, wherein the flexible button (90) is inserted into the channel perforation (100, 11). 10. The probe card combination according to item 9 of the patent application scope, wherein the diameter of the flexible button (90) is larger than the diameter of the channel perforation (100 '11). Η · If the probe card combination of item 8 of the patent application scope, wherein the one or more channel perforations are shielding perforations (110). 12. The probe card combination of item 丨丨 in the scope of patent application, wherein the elastic button (90) is inserted into the shielding perforation (11). 13. The probe card combination of claim 12 in which the elastic button (90) is inserted into the printed circuit board (10) and protrudes from the top toward the multilayer dielectric board (30). 14. The probe card combination of item i in the scope of patent application, wherein the third group of the plurality of identical electrical connectors includes a plurality of shields covering the first group; then: the plurality of conductor protrusions above ( 120). 1 5 · The probe card combination of item 1 in the scope of patent application, wherein the second plurality of uniform electrical connectors are characterized by a plurality of conductor protrusions placed on the first plurality of ^ contacts. (120).

裝蒙 -2 -Dress Mongolia -2-

16·如申請專利範圍第15項之探針卡組合，其中，在★玄、，化***件（20)中，其中該第一群複數個電接觸之一個或多個陸地格狀陣列焊墊（18〇)，並 /… T琢導體A 起物（120)係加諸於該焊墊上。 17·如申請專利範圍第16項之探針卡組合起物（120)係由焊錫膠所製成的。 18·如申請專利範圍第17項之探針卡組合具有低溶點。 19·如申請專利範圍第18項之探針卡組合之熔點低於或等於10CTC。 20·如申請專利範圍第1項之探針卡組 A 〆、γ 垓多層介電板（3〇)進-步包括-硬焊至該複數個電接格狀陣列（180)。公乏針腳 21. —種如申請專利範圍第5項之探針卡、 < δ周整平面化之方法’其特徵為該方法包含下列步驟. (a) 將該螺絲（45)旋緊以使該固定璟〜衣（4υ)可以緊靠嗜印刷電路板（10) ; # (b) 決定該探針頭（50)之平面化；以及 (c) 調整該螺絲（45)的緊度以達到嗜熘咬巧々彳木針碩（50)所希望的平面化程度。 ^ 22·如申請專利範圍第21項之方法，Α ^ τ 该固定環（40)可以相對該印刷電路板（10)浮動。、；J 23·如申請專利範圍第22項之方法，、， /、甲该螺絲（45)埋入亚且進一步包括利用該已埋入的螺碎— 累、、，糸(45)在測試期間將其中，該導體凸其中其中該焊錫膠該焊錫膠16. The probe card combination according to item 15 of the scope of patent application, wherein, in the xuan, hua insert (20), wherein the first group of a plurality of electrically contacted one or more land grid array pads (18), and / ... T conductor A (120) is added to the pad. 17. The probe card assembly (120) according to item 16 of the scope of patent application is made of solder paste. 18. The probe card combination of item 17 in the scope of patent application has a low melting point. 19. The melting point of the probe card combination of item 18 in the scope of patent application is lower than or equal to 10CTC. 20. The probe card set A （, γ 垓 multi-layer dielectric board (30) as described in item 1 of the patent application further includes-brazing to the plurality of electrical grid arrays (180). Male and female pins 21. A kind of probe card such as the scope of patent application No. 5 < δ-period planarization method 'is characterized in that the method includes the following steps. (A) Tighten the screw (45) to So that the fixing sleeve (4υ) can be close to the printed circuit board (10); # (b) determines the planarization of the probe head (50); and (c) adjusts the tightness of the screw (45) to It achieves the desired level of flattening of the entrapped bite (50). ^ 22 · If the method of applying for the scope of the patent No. 21, A ^ τ The fixing ring (40) can float relative to the printed circuit board (10). J23 · If the method of applying for the scope of the patent No. 22, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, (,) During which, the conductor is convex in which the solder paste and the solder paste

多ϋ月Ιο日丨朽咖财《•寫却….《外〜〜州」. 該固定環（40)重新定中心的步驟。 24. 一種如申請專利範圍第8項之探針卡組合之組裝方法，該方法包含下列步驟： (a) 利用一電導體工具將該每一複數個彈性按鈕（9〇) ***至3亥通道穿孔（1〇〇, 11〇)中；以及 (b) 確認該多層介電板（3〇)及該印刷電路板（1〇)之間的電連接性。 2 5 ·如申請專利範圍第24項之方法，其中該印刷電路板（丨〇) 具有一非測試端（1 60)，該彈性按紐（9〇)則自該非測試端 (1 60)***。 26· —種如申請專利範圍第}項之探針卡組合之組裝方法，其具有下面的步驟： (a) 提供一臨時板以確認該電連接；以及 (b) 在測試之前以該多層介電板（3〇)取代該臨時板。 27· —種探針卡組合，用以測試積體電路，該方法包含下列步驟：More than a month Ιο 丨 decaying coffee wealth "writing but ..." "outside ~ ~ state". The step of re-centering the fixed ring (40). 24. A method for assembling a probe card assembly as described in item 8 of the scope of patent application, the method includes the following steps: (a) inserting each of the plurality of flexible buttons (90) into a 30-meter channel using an electric conductor tool; Through holes (100, 11); and (b) confirming the electrical connectivity between the multilayer dielectric board (30) and the printed circuit board (10). 2 5 · The method according to item 24 of the patent application scope, wherein the printed circuit board (丨〇) has a non-test terminal (1 60), and the flexible button (90) is inserted from the non-test terminal (1 60) . 26 · —An assembling method of a probe card assembly as described in the scope of the patent application, which has the following steps: (a) providing a temporary board to confirm the electrical connection; and (b) using the multilayer interposer before testing The electric board (30) replaces the temporary board. 27 · —A probe card combination for testing integrated circuits. The method includes the following steps:

樣的第二群複數個電接觸；A second group of multiple electrical contacts;

在該印刷電路板（1〇)上；及群複數個電接觸及該第二群複數複數個以對應該第一On the printed circuit board (10); and a plurality of electrical contacts and a plurality of the second plurality of electrical contacts corresponding to the first

1223083 頁換替正修工 8 8 8 8 ABC D 六、申請專利範年ι月(〇日個電接觸之圖樣排列的彈性按鈕（90)以便與該第一群複數個電接觸及該第二群複數個電接觸產生電接觸，其中該印刷電路板（10)包括一個或多個遮蔽穿孔（11 〇)。 -5- 本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐)Page 1223083 Replaces the original repairman 8 8 8 8 ABC D VI. Patented flexible button (90) with a pattern of electrical contacts (90 days) for electrical contact with the first group of multiple electrical contacts and the second group A plurality of electrical contacts generate electrical contacts, wherein the printed circuit board (10) includes one or more shielding perforations (11 〇). -5- This paper size applies to China National Standard (CNS) A4 specifications (210 X 297 mm)