1221015 五、發明說明（1) 【發明所屬之技術領域】 本發明係有關於—接μ、， 、 種探測頭，供裝設於探測半導栌曰 圓之探測卡〔probe card〕。 千導體日曰 【先前技術】 習知探測卡係組配於一主 半導體測试设備之測試頭 〔test head〕，以供探觸待 ^ 係包含有一探測頭〔probe l j々 休而卞 e head〕及一具多層繞故 > 間加> 狀印刷電路板，由於該探測 按之圓盤 、頭之探觸疋件〔如探針或搜觸 凸塊〕被要求準確探觸待測I導體之鲜塾電 端，該探測頭之精準度與埶膨胳松奴而抑由〆^寻電極 测卡之其匕構件，％印刷電路板材f用以與測試頭结合之( 介面板，故該探測頭係為探測卡之關鍵零組件。 =申請人於我國專利公告第493 756號「晶圓通用探測 卡」中係揭示有一種探測卡，其包含有一探測頭、一介面 板及卩刷電路板，該探測頭係為可替換式，其具有複數 個探針，該介面卡係裝配於該印刷電路板與該探測頭之 間，，供模組化裝配該探測頭，但未揭露出該探測頭内部 連接該些探針之線路設計與探測頭之材質，習知探測頭之 材料係為多層陶竞電路板〔multi- layer ceramic board, MLC〕，’為了形成微間距電路，且其係無法運用目前的半< ，體製程加以製造，使得該多層陶瓷電路板之製造成本甚 高。 此外’美國專利第6, 35 9, 45 6號則揭示有一種探測 卡’其探測頭包含有一具有突起接觸元件〔rai sed1221015 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a probe card for connecting μ ,, and probes for detecting a probe card that is arranged in a semi-conductor. Thousands of conductor day [prior art] The conventional probe card is equipped with a test head [test head] of a main semiconductor test equipment for probing. The system includes a probe head [probe lj々 休 卞 卞 e head] and a multi-layer winding circuit board with a multi-layered winding pattern, and the probe head (such as a probe or a search bump) is required to accurately probe the object to be tested due to the disk and head of the probe. The fresh electric terminal of the I conductor, the accuracy of the probe head and the bulkiness of the probe head are limited by the dagger component of the probe electrode,% printed circuit board f is used to integrate the test head (the interface board, Therefore, the probe head is a key component of the probe card. = The applicant disclosed a probe card in China Patent Bulletin No. 493 756 "Wafer Universal Probe Card", which includes a probe head, an interface panel and a brush. Circuit board, the detection head is replaceable, it has a plurality of probes, and the interface card is assembled between the printed circuit board and the detection head for modular assembly of the detection head, but it is not exposed The design and detection of the line connecting the probes inside the probe The material of the head, the material of the conventional probe head is a multi-layer ceramic board (MLC), 'In order to form a micro-pitch circuit, and its system cannot be manufactured using the current semi- < The manufacturing cost of the multilayer ceramic circuit board is very high. In addition, 'U.S. Patent No. 6,35 9,45 6 discloses a detection card', the detection head of which includes a protruding contact element [rai sed
1221015 五、發明說明（2) contact substrate〕之互連基板〔interc〇nnect member〕，該互連基板係由矽材質所製成，依半導體製 程，由《亥矽材質之互連基板之顯露表面形成導接線路及該 些突起接觸元件，作為探測頭之探觸表面，且該互連基板 之對應背面無法形成有電性連接端，故該互連基板之導接 線路係形成於具有接觸元件之顯露表面並延伸至該顯露表 面之周邊，利用銲線連接該互連基板之導接線路至一接合 板〔mounting Plate〕，再以軟性電路板或ΤΑβ〔Tape Automated Bonding，捲帶自動接合〕引線連接該接合板 至該探測卡之多層印刷電路板，該些銲線與軟板在該矽材 質之互連基板之連接處係較凸起於該互連基板之顯露表鲁 面’ *以遠互連基板顯露表面上突起接觸元件探觸待測晶 圓之晶片電極時，該些銲線或軟板亦有可能接觸摩擦至該 待測晶圓，影響探測頭之測試性能。 【發明内容】 本發明之主要目的係在於提供一種模組化探測頭，利 用複數個探測晶片裝設在一矽基板，且該矽基板容置於一 承座，以組成一探測頭，每一探測晶片係具有複數個探觸 端及側面電極，以銲料接合該些側面電極至該矽基板，以 擴大6亥石夕基板周邊可結合軟性電路板之空間且增進該石夕基參 板之元件通用性。 依本發明之模組化探測頭，其係主要包含有一承座、 ^石夕基板、至少一探觸晶片及至少一軟性電路板，其中， 6亥承座係具有一底面及在底面周邊之側壁，以容置該石夕基1221015 V. Description of the invention (2) contact substrate] interconnect substrate [interc〇nnect member], the interconnect substrate is made of silicon material, according to the semiconductor process, the exposed surface of the "interconnect substrate of silicon silicon material" The conductive lines and the protruding contact elements are formed as the contact surface of the probe head, and the corresponding backside of the interconnect substrate cannot be formed with an electrical connection end, so the conductive lines of the interconnect substrate are formed with the contact elements The exposed surface extends to the periphery of the exposed surface, and the bonding wires of the interconnection substrate are connected to a mounting plate with a bonding wire, and then a flexible circuit board or TAB [Tape Automated Bonding, automatic tape bonding] The lead wire connects the bonding board to the multilayer printed circuit board of the detection card, and the bonding wires and the flexible board are more convex than the exposed surface of the interconnect substrate at the connection point of the silicon-based interconnect substrate. When the protruding contact elements on the exposed surface of the interconnection substrate touch the wafer electrodes of the wafer under test, the bonding wires or flexible boards may also contact and rub against the wafer under test, affecting the detection. The test performance. [Summary of the invention] The main purpose of the present invention is to provide a modular probe head, which uses a plurality of probe chips to be mounted on a silicon substrate, and the silicon substrate is housed in a holder to form a probe head. The detection chip is provided with a plurality of probe terminals and side electrodes, and the side electrodes are soldered to the silicon substrate to expand the space where the flexible circuit board can be combined around the perimeter of the substrate and to enhance the components of the stone substrate. Versatility. According to the modular probe head of the present invention, it mainly includes a base, a base plate, at least one touch-sensing chip, and at least one flexible circuit board. Among them, the 6Hai base has a bottom surface and a periphery of the bottom surface. Side wall to accommodate the Shi Xiji
1221015 五、發明說明（3) 板，該矽基板係具有一正面及一對應背面，其中該正面係 形成有複數個周邊銲墊、複數個連接墊以及連接線路，在 該些周邊銲墊與複數個連接墊上係形成有一銲料，該探觸 晶片係設於該矽基板之該正面，該探觸晶片係包含有複數 個第一探觸端與複數個側面電極，該些側面電極係與對應 之a亥些連接塾上輝料接合，而該軟性電路板係具有一第一 側及一第二側’其中該第一側係與對應之該些周邊銲墊上 銲料接合’而該第二側係延伸超過該承座之側壁，以組合 成一模組化探測頭。 【實施方式】 參閱所附圖式，本發明將列舉以下之實施例說明。_ 依本發明之一具體實施例，請參閱第1及2圖，一模組 化探測頭係主要包含有一金屬承座10〔metal holder〕、 一石夕基板20、至少一探觸晶片4〇以及至少一軟性電路板 50 ’其中該金屬承座1〇係為一種經陽極處理之鋁合金承 座’該承座1 〇係作為該探測頭之結合底座，以結合至一圓 盤狀多層印刷電路板8〇 ,該承座丨〇係具有一底面丨丨及在底 面11周邊之侧壁12，用以容置該矽基板2〇。 y该矽基板20係容置於該承座10，該矽基板20係具有與 待側曰a圓相匹配之熱膨脹係數，且又可利用半導體製程形 成積體電路，在本實施例中，該矽基板2〇係具有一形成有 正面21及一對應之背面22 ’其中該正面21係形 成有複數個周邊銲墊23、複數個連接墊24以及連接線路， 在該些周邊銲墊23與複數個連接墊24上係分別形成有一銲 12210151221015 V. Description of the invention (3) A board having a front surface and a corresponding back surface, wherein the front surface is formed with a plurality of peripheral pads, a plurality of connection pads, and a connection line. A solder is formed on each of the connection pads, and the probe chip is disposed on the front surface of the silicon substrate. The probe chip includes a plurality of first probe terminals and a plurality of side electrodes, and the side electrodes are corresponding to a. These connections are bonded with a bright material, and the flexible circuit board has a first side and a second side, wherein the first side is solder-bonded to corresponding peripheral pads and the second side is It extends beyond the side wall of the socket to form a modular probe. [Embodiment] With reference to the drawings, the present invention will be described by the following embodiments. _ According to a specific embodiment of the present invention, please refer to FIGS. 1 and 2, a modular probe head mainly includes a metal holder 10 (metal holder), a stone substrate 20, at least one touch sensor chip 40, and At least one flexible circuit board 50 'Where the metal socket 10 is an anodized aluminum alloy socket' The socket 10 is used as a bonding base of the probe head to be bonded to a disc-shaped multilayer printed circuit The board 80 has a bottom surface 丨 and a side wall 12 around the bottom surface 11 for receiving the silicon substrate 20. The silicon substrate 20 is housed in the holder 10, and the silicon substrate 20 has a thermal expansion coefficient that matches the a circle on the side, and can also be used to form a integrated circuit using a semiconductor process. In this embodiment, the silicon substrate 20 The silicon substrate 20 has a front surface 21 and a corresponding back surface 22 ′, wherein the front surface 21 is formed with a plurality of peripheral pads 23, a plurality of connection pads 24, and a connection line. A welding pad 1221015 is formed on each of the connection pads 24.
料31、32，該矽基板2〇之背面22係貼合於該承座1〇之底面 11，較佳地，在該矽基板20之背面22與該承座1〇之底面u 係形成有一緩衝層26，且在該承座1〇之側壁12與該矽 基板20之間係存在於有一可供調整之間隔13，利用裝設在 該^座10之調整機構14〔如調整螺桿〕微調整該矽基板 與該承座10之相對位置，而該矽基板2〇之正面21係接合有 該些探觸晶片4〇。 4些探觸晶片4 〇係作為該探測頭之每一探觸單元，每 一探觸晶片4 0係具有複數個第一探觸端4丨與侧面電極4 2， 該些第一探觸端4 1可為垂直探針、彈性探針、懸臂探針或 探觸凸塊，並結合在該探觸晶片40之上表面，第一探觸端鲁 41之排列係對應一待測晶圓中晶片之銲墊位置〔或凸塊位 置〕’該些側面電極42則設於該探觸晶片40之侧面且電性 連接對應之第一探觸端41，利用SMT技術〔Surface Mounting Technology〕以銲料32銲接該些側面電極42與 該石夕基板20之連接墊24，此外，亦可在該矽基板2〇之正面 2 1形成有至少一第二探觸端2 5，用以探觸待測晶圓。 該軟性電路板50係作為該探測頭矽基板2〇之電性連接 外端，該軟性電路板50係具有一第一側51及一第二侧52， 該第一侧51係形成有複數個金屬指，以銲料3丨與該矽基板· 2 0之對應該些周邊銲墊2 3接合，較佳地，一絕緣填充膠體 6 0係結合於該軟性電路板5 〇之第一側5 1與該矽基板2 〇，以 穩固該銲料3 1結合點，而該第二側5 2係延伸超過該承座j 〇 之側壁1 2，用以導接至一探測卡之多層印刷電路板8 〇，在Material 31, 32, the back surface 22 of the silicon substrate 20 is attached to the bottom surface 11 of the socket 10, preferably, a back surface 22 of the silicon substrate 20 and a bottom surface u of the socket 10 are formed with A buffer layer 26 exists between the side wall 12 of the holder 10 and the silicon substrate 20 with an adjustable interval 13. The adjustment mechanism 14 (such as an adjustment screw) installed in the holder 10 is used for micro adjustment. The relative positions of the silicon substrate and the pedestal 10 are adjusted, and the front surface 21 of the silicon substrate 20 is connected with the probe chips 40. The four probe chips 40 are used as each probe unit of the probe head, and each probe chip 40 is provided with a plurality of first probe terminals 4 丨 and side electrodes 42. The first probe terminals 41 can be a vertical probe, an elastic probe, a cantilever probe, or a probe bump, and is combined with the upper surface of the probe chip 40. The arrangement of the first probe terminal 41 corresponds to a wafer to be tested. The pad pad position (or bump position) of the chip. The side electrodes 42 are provided on the side of the probe chip 40 and are electrically connected to the corresponding first probe terminals 41. SMT technology [Surface Mounting Technology] is used for soldering. 32. Weld the side electrodes 42 and the connection pads 24 of the Shixi substrate 20, and in addition, at least one second probe terminal 25 can be formed on the front surface 21 of the silicon substrate 20 to probe the object to be measured. Wafer. The flexible circuit board 50 serves as the electrical connection outer end of the silicon substrate 20 of the detection head. The flexible circuit board 50 has a first side 51 and a second side 52. The first side 51 is formed with a plurality of The metal fingers are bonded to the silicon substrate · 20 corresponding to the peripheral pads 2 3 with solder 3 丨, preferably, an insulating filler 60 is bonded to the first side 5 1 of the flexible circuit board 5 0 And the silicon substrate 20 to stabilize the bonding point of the solder 31, and the second side 52 extends to the side wall 12 of the socket j0 for guiding to the multilayer printed circuit board 8 of a detection card 〇, in
第10頁 1221015Page 10 1221015
五、發明說明（5) 本實施例中，當該承座1〇機械結合在該多層印刷電路板 80，如螺桿或扣勾等結合件82，該軟性電路板5〇之第二側 52係可插拔地結合在該多層印刷電路板8〇之連接器“，並 以一壓板7 0固定該軟性電路板5 〇。 因此，依據本發明之模組化探測頭，利用「至少一具 有第一，觸端41之探觸晶片40裝設於該矽基板2〇之該正面 21，且該探觸晶片40之側面電極42以銲料32接合於該矽基 板2 0之4些連接墊2 4」之結構特徵，該些探觸晶片4 〇可擴 大该石夕基板2 0與該軟性電路板5 〇之可運用結合空間，不影 響該些第一探觸端41之探觸尖端，並且該些探觸晶片4〇之 第一探觸端4 1位置定義可與受測晶圓之銲墊位置〔即晶圓· 保護層之開口位置〕共用相同之光罩，以對應各式受測晶 圓之銲墊位置，而不需要重新設計新的矽基板丨〇，也就是 說，本發明之該矽基板1 〇可設計為公版規格，當相同產品 之受測晶圓有不同之銲墊位置或凸塊變更時，僅需要結合 對應之探觸晶片40，不需要重新設計新的矽基板1〇。 此外，在另一具體實施例中，請參閱第3圖，本發明 之探觸晶片1 1 〇係裝設於該矽基板2 〇之正面2 1 ,該探觸晶 片11 0係為探觸模組，該探觸晶片j j 〇係具有一探觸面 111、一對應之背面以及在該探觸面丨丨i與對應之背面之間❿ 的側面112，該探觸晶片110之探觸面lu係形成有凸起狀 之探觸端113，該探觸晶片110之側面112係形成有側面電 極1 1 4，該些側面電極11 4係呈條狀，該些側面電極11 4較 佳為貫通顯露該探觸面111與該背面，當該探觸晶片銲5. Description of the invention (5) In this embodiment, when the socket 10 is mechanically combined with the multilayer printed circuit board 80, such as a screw 82 or a hook 82, the second side 52 of the flexible circuit board 50 The connector of the multilayer printed circuit board 80 is pluggable, and the flexible circuit board 50 is fixed by a pressure plate 70. Therefore, according to the modular probe of the present invention, "at least one First, the probe chip 40 of the contact terminal 41 is mounted on the front surface 21 of the silicon substrate 20, and the side electrode 42 of the probe chip 40 is bonded to the silicon substrate 20 with 4 solder pads 2 4 The structural features of the touch probes 40 can expand the available bonding space between the Shixi substrate 20 and the flexible circuit board 50, without affecting the probe tips of the first probe terminals 41, and the The positions of the first probe terminals 41 of these probe wafers 40 can be shared with the pad position of the wafer under test (ie, the opening position of the wafer and the protective layer) to correspond to various types of wafers under test. Position of the solder pad without the need to redesign a new silicon substrate. The silicon substrate 1 can be designed as a public version. When the tested wafers of the same product have different pad positions or bump changes, only the corresponding touch probe chip 40 needs to be combined, and no new silicon substrate 1 needs to be redesigned. 〇. In addition, in another specific embodiment, please refer to FIG. 3. The probe chip 1 10 of the present invention is installed on the front surface 2 1 of the silicon substrate 2 0, and the probe chip 110 is a probe pattern. The probe chip jj 〇 has a probe surface 111, a corresponding back surface, and a side surface 112 between the probe surface 丨 i and the corresponding back surface. The probe surface 110 of the probe chip 110 A raised probe tip 113 is formed, and a side surface 112 of the probe chip 110 is formed with side electrodes 1 1 4. The side electrodes 11 4 are in a strip shape. The side electrodes 11 4 are preferably penetrating. The contact surface 111 and the back surface are exposed. When the contact chip is soldered,
第11頁 1221015 五、發明說明（6) -- --------- 碎基板20，銲料32接合該矽基板20之連接墊24與該 :貝，極114，一旦有多餘之銲料32將會溼潤地Γ攸 觸。 矣问又’不影響該些探觸端113之探 本發明之保護範圍當視德 為準，任何熟知此項技藝=後，之申請專利範圍所界定者 圍内所作之任何變化與修改，脫離本發明之精神和範 均屬於本發明之保護範園。 1221015 圊式簡單說明 【圖式簡單說明】 第1圖··依本發明，一模組化探測頭之截面示意圖。 第2圖··依本發明，該模組化探測頭之正面示意圖。 第3 圖：依本發明，另一種模組化探測頭之探觸晶片立體 示意圖。 元件符號簡單說明： 10 承座 11 底面 12 側壁 13 間隔 14 調整機構 20 矽基板 21 正面 22 背面 23 周邊銲墊 24 連接墊 25 第二探測端 26 緩衝層 31 銲料 32 銲料 40 探觸晶片 41 第一探觸端 42 側面電極 50 軟性電路板 51 第一側 52 第二側 60 填充膠體 70 壓板 80 多層印刷電路板 81 連接器 82 結合件 110 探觸晶片 111 探觸面 112 側面 113 探觸端 114 側面電極Page 11 1221015 V. Description of the invention (6) ----------- Broken substrate 20, solder 32 joins the connecting pad 24 of the silicon substrate 20 with the: shell, pole 114, once there is excess solder 32 will touch wetly. Ask and ask, 'Do not affect the exploration of these probes 113. The scope of protection of the present invention is subject to morality. Anyone who is familiar with this technology = any changes and modifications made within the scope defined by the scope of the patent application shall deviate from it. Both the spirit and scope of the present invention belong to the protected domain of the present invention. 1221015 Simple description of 圊 -style [Simplified description of drawings] Figure 1 ... According to the present invention, a schematic cross-sectional view of a modular probe. Figure 2 ... According to the present invention, a schematic front view of the modular probe. Fig. 3: Schematic diagram of a touch probe chip of another modular probe according to the present invention. Simple explanation of component symbols: 10 socket 11 bottom surface 12 side wall 13 interval 14 adjustment mechanism 20 silicon substrate 21 front 22 back 23 peripheral solder pad 24 connection pad 25 second detection end 26 buffer layer 31 solder 32 solder 40 contact chip 41 first Probe terminal 42 Side electrode 50 Flexible circuit board 51 First side 52 Second side 60 Filled with gel 70 Press plate 80 Multi-layer printed circuit board 81 Connector 82 Joint 110 Probe chip 111 Probe surface 112 Side 113 Probe terminal 114 Side electrode
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