TWD206706S - Part of radiator - Google Patents
Part of radiator Download PDFInfo
- Publication number
- TWD206706S TWD206706S TW108302195F TW108302195F TWD206706S TW D206706 S TWD206706 S TW D206706S TW 108302195 F TW108302195 F TW 108302195F TW 108302195 F TW108302195 F TW 108302195F TW D206706 S TWD206706 S TW D206706S
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- 238000001816 cooling Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 2
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Abstract
【物品用途】;本物品係一種散熱器,使用於對半導體元件等進行冷卻之冷卻裝置。;【設計說明】;圖式所揭露之實線係本案欲主張設計之部分。圖式所揭露之虛線係本案不主張設計之部分。圖式所揭露之一點鏈線為本案欲主張設計之部分與不主張設計之部分之分界線,該一點鏈線本身為本案不主張設計之部分。;本物品具有:複數片鰭板,分別為長條狀且隔著間隙並排配置;以及連結部,連結複數片鰭板之長邊方向的兩端。;使用狀態參考立體圖1、使用狀態參考前視圖1、使用狀態參考後視圖1、使用狀態參考左側視圖1、使用狀態參考右側視圖1、使用狀態參考俯視圖1、使用狀態參考仰視圖1,以及使用狀態參考立體圖2、使用狀態參考前視圖2、使用狀態參考後視圖2、使用狀態參考左側視圖2、使用狀態參考右側視圖2、使用狀態參考俯視圖2、使用狀態參考仰視圖2中,係顯示將本案欲主張設計之部分應用於不同形狀之鰭板的應用例。[Use of article]; This article is a radiator, used as a cooling device for cooling semiconductor components, etc. ;[Design Description];The solid lines revealed in the drawing are the parts of the proposed design of this case. The dotted lines revealed in the diagram are parts of the case that are not intended to be designed. The dotted chain line disclosed in the drawing is the dividing line between the part where design is claimed and the part where design is not claimed. The dotted chain line itself is the part where design is not claimed in this case. ; This article has: a plurality of fins, each of which is strip-shaped and arranged side by side with a gap; and a connecting portion that connects both ends of the plurality of fins in the longitudinal direction. ;Usage status reference perspective view 1, usage status reference front view 1, usage status reference rear view 1, usage status reference left side view 1, usage status reference right side view 1, usage status reference top view 1, usage status reference bottom view 1, and use Status reference three-dimensional view 2, usage status reference front view 2, usage status reference rear view 2, usage status reference left side view 2, usage status reference right side view 2, usage status reference top view 2, usage status reference bottom view 2, the system will display This case intends to advocate application examples where part of the design is applied to fins of different shapes.
Description
本物品係一種散熱器,使用於對半導體元件等進行冷卻之冷卻裝置。 This article is a kind of radiator, which is used as a cooling device for cooling semiconductor components.
圖式所揭露之實線係本案欲主張設計之部分。圖式所揭露之虛線係本案不主張設計之部分。圖式所揭露之一點鏈線為本案欲主張設計之部分與不主張設計之部分之分界線,該一點鏈線本身為本案不主張設計之部分。 The solid line disclosed in the diagram is the part that the case intends to advocate for the design. The dotted line disclosed in the diagram is the part that does not advocate design in this case. The one-point chain line disclosed in the diagram is the dividing line between the part that the case intends to design and the part that does not advocate design. The one-point chain line itself is the part of the case that does not advocate design.
本物品具有:複數片鰭板,分別為長條狀且隔著間隙並排配置;以及連結部,連結複數片鰭板之長邊方向的兩端。 This article has: a plurality of fins, each of which is elongated and arranged side by side with a gap; and a connecting part, which connects the two ends of the plurality of fins in the longitudinal direction.
使用狀態參考立體圖1、使用狀態參考前視圖1、使用狀態參考後視圖1、使用狀態參考左側視圖1、使用狀態參考右側視圖1、使用狀態參考俯視圖1、使用狀態參考仰視圖1,以及使用狀態參考立體圖2、使用狀態參考前視圖2、使用狀態參考後視圖2、使用狀態參考左側視圖2、使用狀態參考右側視圖2、使用狀態參考俯視圖2、使用狀態參考仰視圖2中,係顯示將本案欲主張設計之部分應用於不同形狀之鰭板的應用例。 Refer to the perspective view of the use state 1, refer to the front view of the use state 1, refer to the rear view of the use state 1, refer to the left view of the use state 1, refer to the right view of the use state 1, refer to the top view of the use state, refer to the bottom view 1, and use state Refer to the three-dimensional view 2. Refer to the front view of the use state 2. Refer to the rear view of the use state 2. Refer to the left view of the use state 2. Refer to the right view of the use state 2. Refer to the top view of the use state 2. Refer to the bottom view of the use state. I want to advocate the application of the design part to different shapes of fins.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPD2018-28950F JP1642782S (en) | 2018-12-28 | 2018-12-28 | |
JP2018-028950 | 2018-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWD206706S true TWD206706S (en) | 2020-08-21 |
Family
ID=68095438
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108302195F TWD206706S (en) | 2018-12-28 | 2019-04-16 | Part of radiator |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP1642782S (en) |
TW (1) | TWD206706S (en) |
Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW566826U (en) | 2003-04-04 | 2003-12-11 | Chin-Wen Wang | Heat fin structure with a flow guiding function |
TW580167U (en) | 2002-07-02 | 2004-03-11 | Waffer Technology Corp | Positioning structure of heat dissipation fin plate |
TWM249442U (en) | 2003-12-31 | 2004-11-01 | Golden Sun News Tech Co Ltd | Heat sink of assembled fin type |
TWM257091U (en) | 2004-05-07 | 2005-02-11 | Augux Co Ltd | Improved structure of heatsink fin set |
TWM336671U (en) | 2008-01-21 | 2008-07-11 | Kwo Ger Metal Technology Inc | Heat sink fin assembly structure |
TWM346264U (en) | 2008-04-10 | 2008-12-01 | Asia Vital Components Co Ltd | Heat dissipation fin |
TWM346779U (en) | 2008-06-27 | 2008-12-11 | Guang Shr Technology Co Ltd | Structure of heat-dissipation fin |
TWM366025U (en) | 2009-04-17 | 2009-10-01 | Tigon Lighting Mfg Ltd | Improved heat-dissipation fin structure for LED lamp |
TWM407289U (en) | 2010-12-20 | 2011-07-11 | Uni Calsonic Corp | Assembled structure for cooling pipe and heat-dissipation fin of water tank |
TWM421693U (en) | 2011-07-08 | 2012-01-21 | Jun-Hong Lin | Fin heat sink structure improvement |
TWM444026U (en) | 2012-06-15 | 2012-12-21 | Cooler Master Co Ltd | Heat dissipating fin, heat dissipating fin assembly and heat dissipating device |
TWM444027U (en) | 2012-07-27 | 2012-12-21 | Huang-Han Chen | Fins assembly |
TWM445162U (en) | 2012-04-10 | 2013-01-11 | chong-xian Huang | Assembly structure of cooling fin and base |
TWM465560U (en) | 2013-04-23 | 2013-11-11 | chong-xian Huang | Undulating fin and heat spreader thereof |
TWM506272U (en) | 2014-12-31 | 2015-08-01 | Celestica Int Inc | Heat-dissipating fin structure |
TWM507158U (en) | 2015-03-27 | 2015-08-11 | Cooler Master Co Ltd | Heat dissipating device and heat dissipating fin |
TWM549432U (en) | 2017-06-28 | 2017-09-21 | 士林電機廠股份有限公司 | Heat dissipating fin structure of radiator |
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2018
- 2018-12-28 JP JPD2018-28950F patent/JP1642782S/ja active Active
-
2019
- 2019-04-16 TW TW108302195F patent/TWD206706S/en unknown
Patent Citations (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW580167U (en) | 2002-07-02 | 2004-03-11 | Waffer Technology Corp | Positioning structure of heat dissipation fin plate |
TW566826U (en) | 2003-04-04 | 2003-12-11 | Chin-Wen Wang | Heat fin structure with a flow guiding function |
TWM249442U (en) | 2003-12-31 | 2004-11-01 | Golden Sun News Tech Co Ltd | Heat sink of assembled fin type |
TWM257091U (en) | 2004-05-07 | 2005-02-11 | Augux Co Ltd | Improved structure of heatsink fin set |
TWM336671U (en) | 2008-01-21 | 2008-07-11 | Kwo Ger Metal Technology Inc | Heat sink fin assembly structure |
TWM346264U (en) | 2008-04-10 | 2008-12-01 | Asia Vital Components Co Ltd | Heat dissipation fin |
TWM346779U (en) | 2008-06-27 | 2008-12-11 | Guang Shr Technology Co Ltd | Structure of heat-dissipation fin |
TWM366025U (en) | 2009-04-17 | 2009-10-01 | Tigon Lighting Mfg Ltd | Improved heat-dissipation fin structure for LED lamp |
TWM407289U (en) | 2010-12-20 | 2011-07-11 | Uni Calsonic Corp | Assembled structure for cooling pipe and heat-dissipation fin of water tank |
TWM421693U (en) | 2011-07-08 | 2012-01-21 | Jun-Hong Lin | Fin heat sink structure improvement |
TWM445162U (en) | 2012-04-10 | 2013-01-11 | chong-xian Huang | Assembly structure of cooling fin and base |
TWM444026U (en) | 2012-06-15 | 2012-12-21 | Cooler Master Co Ltd | Heat dissipating fin, heat dissipating fin assembly and heat dissipating device |
TWM444027U (en) | 2012-07-27 | 2012-12-21 | Huang-Han Chen | Fins assembly |
TWM465560U (en) | 2013-04-23 | 2013-11-11 | chong-xian Huang | Undulating fin and heat spreader thereof |
TWM506272U (en) | 2014-12-31 | 2015-08-01 | Celestica Int Inc | Heat-dissipating fin structure |
TWM507158U (en) | 2015-03-27 | 2015-08-11 | Cooler Master Co Ltd | Heat dissipating device and heat dissipating fin |
TWM549432U (en) | 2017-06-28 | 2017-09-21 | 士林電機廠股份有限公司 | Heat dissipating fin structure of radiator |
Also Published As
Publication number | Publication date |
---|---|
JP1642782S (en) | 2021-09-27 |
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