TWD193022S - Wireless integrated circuit tag - Google Patents

Abstract

【物品用途】;本設計物品的用途在於，利用射頻訊號，回應已存儲的識別編號等資訊或資產追蹤。;【設計說明】;本設計物品是一種無線積體電路標籤的新穎設計，在一基板的頂面設有一積體電路晶片、二條導接線以及一個小型電子元件跨接於二條導接線的末端，每一導接線的中間各具有一個拓寬部；拓寬部與小型電子元件之間的導接線長度大致等於拓寬部與積體電路晶片之間的導接線長度；基板的底面設有多個表面黏著技術的金屬墊，多個金屬墊靠近基板的側邊，其中包括一個呈五邊形的辨識金屬墊。本設計物品的外觀設計可使消費者產生獨特的視覺感受。[Purpose of item]; The purpose of this designed item is to use radio frequency signals to respond to stored identification numbers and other information or asset tracking. ;[Design Description];This design item is a novel design of a wireless integrated circuit tag. On the top surface of a substrate, there is an integrated circuit chip, two wires and a small electronic component connected across the ends of the two wires. There is a widened portion in the middle of each lead wire; the length of the lead wire between the widened portion and the small electronic component is roughly equal to the length of the lead wire between the widened portion and the integrated circuit chip; the bottom surface of the substrate is provided with multiple surface mount technology There are multiple metal pads close to the side of the substrate, including a pentagonal identification metal pad. The appearance design of this design item can give consumers a unique visual experience.

Description

無線積體電路標籤 Wireless integrated circuit label

本設計物品的用途在於，利用射頻訊號，回應已存儲的識別編號等資訊或資產追蹤。 The purpose of this design item is to use RF signals to respond to information such as stored identification numbers or asset tracking.

本設計物品是一種無線積體電路標籤的新穎設計，在一基板的頂面設有一積體電路晶片、二條導接線以及一個小型電子元件跨接於二條導接線的末端，每一導接線的中間各具有一個拓寬部；拓寬部與小型電子元件之間的導接線長度大致等於拓寬部與積體電路晶片之間的導接線長度；基板的底面設有多個表面黏著技術的金屬墊，多個金屬墊靠近基板的側邊，其中包括一個呈五邊形的辨識金屬墊。本設計物品的外觀設計可使消費者產生獨特的視覺感受。 The design article is a novel design of a wireless integrated circuit label. On the top surface of a substrate, an integrated circuit chip, two conductive wires, and a small electronic component are connected across the ends of the two conductive wires, in the middle of each of the conductive wires. Each has a widened portion; the length of the conductive wire between the widened portion and the small electronic component is substantially equal to the length of the conductive wire between the widened portion and the integrated circuit chip; the bottom surface of the substrate is provided with a plurality of metal pads of surface adhesion technology, and a plurality of The metal pad is adjacent to the side of the substrate and includes a pentagonal identification metal pad. The design of the design item allows the consumer to create a unique visual experience.