TWD181167S - Cooling device for electronic component heat sink - Google Patents

Cooling device for electronic component heat sink

Info

Publication number
TWD181167S
TWD181167S TW105303084D01F TW105303084D01F TWD181167S TW D181167 S TWD181167 S TW D181167S TW 105303084D01 F TW105303084D01 F TW 105303084D01F TW 105303084D01 F TW105303084D01 F TW 105303084D01F TW D181167 S TWD181167 S TW D181167S
Authority
TW
Taiwan
Prior art keywords
electronic component
heat sink
cooling device
component heat
symmetrical
Prior art date
Application number
TW105303084D01F
Other languages
Chinese (zh)
Inventor
Eiji Anzai
Takumi Nakamura
Original Assignee
日本輕金屬股份有限公司
Nippon Light Metal Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本輕金屬股份有限公司, Nippon Light Metal Co filed Critical 日本輕金屬股份有限公司
Publication of TWD181167S publication Critical patent/TWD181167S/en

Links

Abstract

【物品用途】;;【設計說明】;仰視圖與俯視圖對稱，故省略[Use of item];;[Design description];The bottom view and the top view are symmetrical, so omitted

TW105303084D01F 2015-12-04 2016-05-31 Cooling device for electronic component heat sink TWD181167S (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2015-27272F JP1548555S (en) 2015-12-04 2015-12-04

Publications (1)

Publication Number Publication Date
TWD181167S true TWD181167S (en) 2017-02-01

Family

ID=55762037

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105303084D01F TWD181167S (en) 2015-12-04 2016-05-31 Cooling device for electronic component heat sink

Country Status (3)

Country Link
US (1) USD798829S1 (en)
JP (1) JP1548555S (en)
TW (1) TWD181167S (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1653095S (en) * 2018-11-26 2020-02-17
JP1653096S (en) * 2018-11-26 2020-02-17
JP1653094S (en) * 2018-11-26 2020-02-17

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014117A (en) * 1990-03-30 1991-05-07 International Business Machines Corporation High conduction flexible fin cooling module
US6478082B1 (en) * 2000-05-22 2002-11-12 Jia Hao Li Heat dissipating apparatus with nest wind duct
CN2594989Y (en) * 2001-11-29 2003-12-24 王清风 Heat exchange fin plate for improving heat exchange efficience
TWI267337B (en) * 2003-05-14 2006-11-21 Inventor Prec Co Ltd Heat sink
US7306028B2 (en) * 2005-06-23 2007-12-11 Thermal Corp. Modular heat sink
US20080017360A1 (en) * 2006-07-20 2008-01-24 International Business Machines Corporation Heat exchanger with angled secondary fins extending from primary fins
USD567343S1 (en) * 2006-09-08 2008-04-22 Spx Cooling Technologies, Inc. Film fill pack
US8051896B2 (en) * 2007-07-31 2011-11-08 Adc Telecommunications, Inc. Apparatus for spreading heat over a finned surface
USD586763S1 (en) * 2007-08-23 2009-02-17 Hon Hai Precision Industry Co., Ltd. Heat dissipation device
US7715197B2 (en) * 2008-06-05 2010-05-11 International Business Machines Corporation Coined-sheet-metal heatsinks for closely packaged heat-producing devices such as dual in-line memory modules (DIMMs)
US20090321045A1 (en) * 2008-06-30 2009-12-31 Alcatel-Lucent Technologies Inc. Monolithic structurally complex heat sink designs
USD601515S1 (en) * 2008-12-17 2009-10-06 Celsia Technologies Taiwan, Inc. Heat sink
CN101839654B (en) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 Heat sink
US20130020060A1 (en) * 2010-09-02 2013-01-24 Cooper-Standard Automotive, Inc. Heat exchanger
CN103119387A (en) * 2010-09-21 2013-05-22 开利公司 Micro-channel heat exchanger including independent heat exchange circuits and method
USD676118S1 (en) * 2011-06-24 2013-02-12 Hiform As Heat exchanger panel
EP2704190A1 (en) * 2012-09-03 2014-03-05 ABB Technology AG Modular cooling system
USD689835S1 (en) * 2013-01-08 2013-09-17 Eryn Smith Electrostatic carrier tray
USD763804S1 (en) * 2014-02-06 2016-08-16 Kobe Steel, Ltd. Plate for heat exchanger
EP2988578B1 (en) * 2014-08-19 2021-05-19 ABB Schweiz AG Cooling element
CN105636407A (en) * 2014-11-27 2016-06-01 英业达科技有限公司 Radiating fin group
FR3030708B1 (en) * 2014-12-22 2018-02-16 Airbus Operations Sas COLD PLATE, IN PARTICULAR A STRUCTURAL PART OF A HEAT-GENERATING COMPONENT EQUIPMENT
TWI650522B (en) * 2015-05-21 2019-02-11 萬在工業股份有限公司 Refrigerant heat sink
TWM512730U (en) * 2015-08-20 2015-11-21 Cooler Master Co Ltd Water-cooling radiator

Also Published As

Publication number Publication date
USD798829S1 (en) 2017-10-03
JP1548555S (en) 2016-10-17

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