TW583532B - Heat dissipation method and system - Google Patents
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- TW583532B TW583532B TW091116962A TW91116962A TW583532B TW 583532 B TW583532 B TW 583532B TW 091116962 A TW091116962 A TW 091116962A TW 91116962 A TW91116962 A TW 91116962A TW 583532 B TW583532 B TW 583532B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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[ 、發明說明(1) 發明領域] ΑΓΡΤ二種散熱方法及系統,更詳而言之,係有關於一種具 「Ϊ 0早^之電腦系統進行散熱處理之散熱方法及系統。 L發明背景] =於電子貢訊相關科技的研發日新月異,許多功能強 β價格合理的產品紛紛問世,就以電腦設備為例,不論 的超級電腦、伺服器主機乃至於人電 記 等’料已成為人們工作、生活中所不可或缺之 多的雷i敕ΐ腦產品隨著半導體製程的進步,可將越來越 小:運作、亲:一顆積體電路(IC)中,故其體積越來越 ^ 一運作速度越來越快,就以電腦的cpu而言,每四年就 遞增。替’、運作速度更是呈現指數式的向上 =隨:來的卻是因體積縮小而散熱不易 ^ 6 皿度间低會影響到系統運作的穩 疋性,一般而言,會於因電子 F幻穩 (如風扇)’:χ避免因為溫度過高造成系統當機甚散至將早二 再者,耗電量更直接影響到可攜式電腦裝置: 間’但如此卻會增加電池的重量,同 殼的溫度。 电版機 ::業界:要有兩種作法改善上述散熱及耗 題’其中,-為增進電源的管理技術,如過去電腦中的基[, Invention Description (1) Field of Invention] Two kinds of heat dissipation methods and systems of ΑΓΡΤ, more specifically, related to a heat dissipation method and system of a computer system with "Ϊ0 早 ^ for heat dissipation processing. Background of the invention] = The research and development of related technologies of Electronic Gongxun are constantly changing, and many powerful β products with reasonable prices have come out. Take computer equipment as an example. Regardless of the supercomputer, the server host, or even the people's memory, etc. With the advancement of semiconductor manufacturing processes, as many indispensable Thunderbolt products as possible can be made smaller and smaller: operation and pro: in an integrated circuit (IC), its volume is getting more and more ^ As soon as the operation speed is getting faster and faster, as far as the computer CPU is concerned, it will increase every four years. Instead, the operation speed is more exponential upward = follow: but it ’s because the volume is reduced and it is not easy to dissipate heat ^ 6 dishes The low degree will affect the stability of the system operation. Generally speaking, the electronic F will be stabilized (such as a fan). Battery power directly affects portability -Type computer device: "But this will increase the weight of the battery and the temperature of the same case. Electroplate machine :: Industry: There are two ways to improve the above-mentioned heat dissipation and consumption problems." Among them,-to improve the power management technology, such as Base in the past computer
583532 五、發明說明(2) 本輸入輸出系統(BIOS)及現今的先進架構電源界面 (Advanced Configuration and Power Interface e ACPI) 等就具有電源管理的能力;再者’二為藉由開發更佳的 池材料’使其有更大的容量及更小的體積。 承前所述,目前習知的技術為藉由散熱單元來降低 統運作的溫度,但伴隨而來的是散熱單元運作時所產生 嗓音’且散熱單元本身並不會隨著目前環境的離 調整其散熱能力;#著,使用者也無 ^ 境,動態控制散熱單元最大產生的噪音n 用=ΡΙ做^源皆理已較過去採用BIOS來得有很大的進步, 可讓使用者在⑽下㈣的透過語言及圖像下達指令㈣ 機器來:理-1刀。但對以電池做為電源的電腦設備而言,583532 5. Description of the invention (2) The input and output system (BIOS) and the current Advanced Configuration and Power Interface e ACPI have power management capabilities; moreover, the second is to develop better The pool material allows it to have greater capacity and smaller volume. According to the foregoing, the currently known technology is to reduce the temperature of the system by using a heat dissipation unit, but it is accompanied by the voice generated by the heat dissipation unit's operation, and the heat dissipation unit itself will not adjust its temperature with the current environment. Cooling ability; # 着, the user has no environment. Dynamically controlling the maximum noise generated by the cooling unit. N = PI is used as the source. It has been a great improvement over the past using the BIOS. Give instructions through language and images ㈣ Machine to: manage -1 knife. But for computer equipment that uses batteries as a power source,
此法仍無法取得目前電池運作的溫度,動態調整CPU運作 的速度,進而增進雷、、Α ϋ i A 電源管理的㈣。—’所以仍無法完全有效達到 電源的管理,仍無法;:蔽:“習知技術做系統散熱及 …、 思系統溫度改變而動態改變散熱單元 的強度icpu運作速度的能力,且無法讓使用者控制散熱 单元所產生的最大噪音量。 [發明目的及概述] 為解決上述I知技術之缺點,本發明之主要目的在於 提供《散熱方法及系%,透過溫度感測控制單元及先進 架構電^界面(ACP I ) ’動態偵測目前硬體的溫度資訊,並 隨溫度貝式的變化改變散熱單元的運作強度及CPU的工作 頻率,以達到系統散熱之目的。This method still cannot obtain the current battery operating temperature, and dynamically adjust the CPU operating speed, thereby improving the performance of Thunder, A and i A power management. —'Therefore, it is still impossible to fully and effectively achieve the management of power supply, and still cannot; Control the maximum amount of noise generated by the heat dissipation unit. [Objective and Summary of the Invention] In order to solve the above-mentioned shortcomings of the known technology, the main purpose of the present invention is to provide "heat dissipation methods and systems, through temperature sensing control unit and advanced architecture power ^ Interface (ACP I) 'Dynamic detection of the current temperature information of the hardware, and change the operating intensity of the cooling unit and the operating frequency of the CPU with the change of temperature to achieve the purpose of system cooling.
583532 五、發明說明(3) 本發明之另一目的在於提供一種散熱方法及***,讓 使用著可透過作業系統設定不同的散熱規則,使$统在3 大CPU工作效能下’亦可同時兼顧最大電池使用時間及最 低的散熱單元噪音。 為達成上述之目的’本發明提供了 —種散孰方法及 統。該散熱方法應用於一具有ACPI單元之電腦系統中,1 係根據該電腦系統之CPU、機殼及電池的溫度令用以降低、 該CPU及機殼溫度之各風扇驅動’並調整該電池耗電量, 藉此提升該電腦系統之散熱及運作效能,該散敎方法係包 =執行一 1設定程;f,用α提供使用者散熱溫度工作 ,式之設疋,其中,該散熱溫度工作模式係以CPU及機殼 在=同的溫度靶圍内分別使各風扇產生不同的散熱效能,· 接=,由該電腦系統之溫度感測控制單元感測CPU、機殼 及電池之溫度,以由該溫度感測控制溫 至該ACPI單元,佶拎ΑΓΡΤ留士扭祕# ^ J m ^ ^ ^ τ ^ ^使該ACP 1早兀根據使用者所設定的散熱溫 二雷4鉍=I各風扇對CPU及機殼進行散熱處理,並調整 ^内柹π戶里,其中,該散熱處理係包括在一高度溫度範 圍内使風屬達到古絲、* Φt U 网轉連、在一中度溫度範圍内使風扇達到 及在一低度溫度範圍内使風扇達到低轉速。 & β 熱系統應用於一電腦系統中,其係根據該電腦系 之各埒埶-_双及電池的溫度令用以降低該CPU及機殼溫度 躐备絲、早元驅動’並調整該電池耗電量’藉此提升該電 :m散熱及運作效能,該散熱系統係包括:-用以儲 子/皿又fe界值以及儲存可用以控制CPU運作速度及各散熱583532 V. Description of the invention (3) Another object of the present invention is to provide a heat dissipation method and system, which can be used to set different heat dissipation rules through the operating system, so that $ unified under the performance of 3 CPUs can also take into account Maximum battery life and lowest cooling unit noise. To achieve the above-mentioned object, the present invention provides a method and a system for dispersing. The heat dissipation method is applied to a computer system having an ACPI unit. 1 is based on the temperature of the computer system's CPU, case, and battery to reduce the fan and drive of the CPU and case temperature, and adjust the battery consumption. Power, thereby improving the heat dissipation and operating efficiency of the computer system. The method of dispersing is to perform a 1 setting process; f, use α to provide the user's heat dissipation temperature work. The mode is to use the CPU and the case to make the fans have different heat dissipation performance within the same temperature target range. · Connect =, the temperature sensing control unit of the computer system senses the temperature of the CPU, the case and the battery. In order to control the temperature to the ACPI unit by the temperature sensing, ΓΑΓΡΤ 留 士 扭 秘 # ^ J m ^ ^ ^ τ ^ ^ makes the ACP 1 early according to the heat dissipation temperature set by the user. Each fan performs heat dissipation processing on the CPU and the case, and adjusts the internal temperature. The heat dissipation processing includes a high temperature range to make the wind reach the ancient silk, * Φt U network transfer, The temperature range makes the fan reach a low temperature Make the fan reach low speed within the range of degrees. & β thermal system is used in a computer system, which is used to reduce the temperature of the CPU and the case according to the temperature of the computer and the battery of the battery. 'Battery power consumption' to improve the power: m heat dissipation and operating efficiency, the cooling system includes:-used to store the sub / plate and fe threshold and storage can be used to control the CPU's operating speed and each heat dissipation
第6頁 583532 五、發明說明(4) 單元驅動強度之散熱控制程式的記憶單元;一用以偵測 CPU、機殼溫度以及電池溫度資料,並將該測得的溫度與 該臨界值進行比較以產生一與該比較結果相對之控制信號 的溫度感測控制單元;一用以接收由該溫度感測控制單元 所傳至之電池溫度並將其產生一電池池溫度資訊的KBC ; 以及一用以接收由該溫度感測控制單元所傳至之控制信號 並接收由該KBC所傳至之電池溫度資訊的ACPi單元,以由 該A C P I單元根據該控制信號自該記憶單元讀取並執行與其 對應之散熱控制程式,得以控制CPU運作速度、各散熱單 元之運作強度以及電池耗電量。 [發明實施例] 請參閱第1圖,其中顯示本發明之散熱系統1應用於一 筆記型電腦之一較佳實施例的基本架構。首先於此須注意 的是,本實施例雖以筆記塑電腦為例作說明,但本發明並 不限於應用於筆記型電腦上,亦可應用於各種具散熱處理 功能之電腦裝置上,用以控制如風扇之散熱裝置對電腦裝 置中較易產生熱源的部分(例如CPU以及機殼)進行散熱處 理。 於第1圖中,該筆記型電腦係為標號1所指之虛框所包 含之部分,其系統架構至少包含:一中央處理器(CentralPage 6 583532 5. Description of the invention (4) Memory unit of heat dissipation control program of unit driving strength; one for detecting CPU, case temperature and battery temperature data, and comparing the measured temperature with the critical value A temperature sensing control unit for generating a control signal opposite to the comparison result; a KBC for receiving the battery temperature transmitted by the temperature sensing control unit and generating a battery cell temperature information; and a The ACPi unit receives a control signal transmitted by the temperature sensing control unit and receives the battery temperature information transmitted by the KBC, and the ACPI unit reads from the memory unit according to the control signal and executes the corresponding operation. The thermal control program can control the operating speed of the CPU, the operating intensity of each thermal unit, and the battery power consumption. [Inventive Embodiment] Please refer to FIG. 1, which shows a basic structure of a preferred embodiment of a cooling computer 1 applied to a notebook computer. First of all, it should be noted here that although this embodiment uses a notebook computer as an example, the present invention is not limited to being applied to a notebook computer, and can also be applied to various computer devices with a heat dissipation processing function. Control the heat dissipation device such as a fan to dissipate heat from parts of the computer device that are likely to generate heat (such as the CPU and the case). In the first figure, the notebook computer is a part enclosed by a virtual frame indicated by reference numeral 1. Its system architecture includes at least: a central processing unit (Central
Processing Uni t,以下將其簡稱為CPU)10、一記憶單元 11、一溫度感測控制單元12、一 CPU散熱單元13、一電池 14、一鍵盤控制單元(Keyboard Controller;以下將其簡 稱為KBC)15、一 ACPI單元16、一機殼17以及一機殼散熱單Processing Uni (hereinafter referred to as CPU) 10, a memory unit 11, a temperature sensing control unit 12, a CPU heat dissipation unit 13, a battery 14, a keyboard controller (hereinafter referred to as KBC) ) 15, an ACPI unit 16, a case 17 and a case heat sink
第7頁 583532 五、發明說明(5) 元1 8 〇 該CPU10用以執行記憶單元u中之各個程式,其為一 般熟知之資料處理装置,因此以下將不對其功能及内部架 構作進一步詳細之說明。 該記憶單元11係用儲存該筆記型電腦1操作及應用上 所需之各個程式,包括一系統程式(〇perat i ng Sy stem )110、散熱溫度設定程式m、散熱啟動程式112以 及電池電量控制程式丨丨3。 該系統程式11 〇用以控制筆記型電腦1之整體運作,其 為一般電腦系統於運作時所需之必要程式,亦為習於電腦 技術者所熟知之系統,因此以下將不對其功能及内部架構 作進一步詳細之說明。 該散熱溫度設定程式111、散熱啟動程式112以及電池 電量控制程式113即根據本發明之散熱方法所撰寫而成之 程式。該散熱溫度設定程式111用以提供使用者設定該筆 記型電腦1在其散熱處理上所需的溫度參考,亦即由使用 者設定工作模式以取得臨界溫度;該散熱啟動程式112’ 用以提供該筆記型電腦1根據使用者所設定的工作模式以 及CPU 10與機殼17的溫度以驅動該CPU散熱單元13及機殼散 熱單元1 8 ;以及電池電量控制程式1 1 3,用以提供該筆記 型電腦1根據使用者所設定的工作模式以及CPU10與機殼17 的溫度以控制電池1 4耗電量。其中之詳細流程揭露於第 4、5 圖。 該電池14内部具有一電熱調節器(thermistor)(未圖Page 7 583532 V. Description of the invention (5) RMB 18 The CPU 10 is used to execute various programs in the memory unit u. It is a generally known data processing device, so its functions and internal structure will not be further detailed below. Instructions. The memory unit 11 stores various programs required for operation and application of the notebook computer 1, including a system program (〇perat ng Sy stem) 110, a heat dissipation temperature setting program m, a heat dissipation startup program 112, and battery power control. Program 丨 丨 3. The system program 11 is used to control the overall operation of the notebook computer 1. It is a necessary program for general computer systems to operate and a system familiar to computer technicians. Therefore, its functions and internals will not be described below. The architecture is explained in further detail. The heat dissipation temperature setting program 111, the heat dissipation startup program 112, and the battery power control program 113 are programs written according to the heat dissipation method of the present invention. The heat dissipation temperature setting program 111 is used to provide a user to set a temperature reference required by the notebook computer 1 in its heat dissipation processing, that is, the user sets a working mode to obtain a critical temperature; the heat dissipation startup program 112 'is used to provide The notebook computer 1 drives the CPU heat dissipating unit 13 and the case heat dissipating unit 18 according to the working mode set by the user and the temperature of the CPU 10 and the case 17; and a battery power control program 1 1 3 for providing the The notebook computer 1 controls the power consumption of the battery 14 according to the working mode set by the user and the temperature of the CPU 10 and the casing 17. The detailed process is disclosed in Figures 4 and 5. The battery 14 includes a thermistor (not shown).
16817.ptd 第 8 頁 583532 五、發明說明(6) 示)’其可測得因該電池丨4電量耗用情況所對應的溫度, 並將該測钎的溫度傳送至該K B C 1 5以將該接收到的溫度產 生一電池溫度資訊(由於該電熱調節器以以及ΚβΠ5為一般 熟知之電子元件,因此以下將不對其功能及内部架構作進 一步詳細之說明),接著由該0(:15將該接收到的溫度資訊 傳至ACP I單元1 6 ;另一方面,該溫度感測控制單元丨2係用 以接收C P U1 0以及機殼1 7的溫度,以根據該接收到的溫度 產生對應之溫度信號並將其傳至該ACPI單元16。如第2圖 所示,其用以說明該CPU 1 0以及該溫度感測控制單元1 2間 的電路關係,該溫度感測控制單元1 2係採用由Max i m公司 所開發之產品型號為MAX6657的溫度感測器,其中,該溫 度感測器上的接腳信號SMBDATA、SMBCLK以及/ALERT係採 用 SMbus介面(System Management Bus)或 IIC介面(均未圖 示)作為與該ACP I單元1 6間進行資料傳輸之匯流排。由於 產品型號為MAX6657的溫度感測器、SMbus介面以及lie介 面均為習知技術,故在此將不對其功能及架構贅述。 因此,將使該ACP I單元1 6根據該記憶單元11所儲存且 由使用者所設定之工作模式(該工作模式即執行該散熱溫 度設定程式111而得者)與該KBC15以及溫度感測控制單元 1 2各別傳來的溫度資訊及溫度信號進行比較,並依據比較 結果控制該電池1 4的耗電量(該控制程序係執行該電池電 量控制程式113而運作者)以及驅使各散熱單元(13、18)執 行相對運作(該驅使程序係執行該散熱啟動程式n 2所 者)。16817.ptd Page 8 583532 V. Description of the Invention (6)) 'It can measure the temperature corresponding to the power consumption of the battery, and transmit the temperature of the tester to the KBC 1 5 to The received temperature generates a battery temperature information (because the thermistor and κβΠ5 are generally well-known electronic components, its function and internal structure will not be described in further detail below), and then 0 (: 15 will The received temperature information is transmitted to the ACP I unit 16; on the other hand, the temperature sensing control unit 丨 2 is used to receive the temperature of the CP U1 0 and the case 17 to generate a response according to the received temperature The temperature signal is transmitted to the ACPI unit 16. As shown in FIG. 2, it is used to explain the circuit relationship between the CPU 10 and the temperature sensing control unit 12, and the temperature sensing control unit 12 It is a temperature sensor with the product model MAX6657 developed by the company Maxim. Among them, the pin signals SMBDATA, SMBCLK, and / ALERT on the temperature sensor use SMbus interface (System Management Bus) or IIC interface ( Even (Pictured) as a bus for data transmission with the ACP I unit 16. Since the temperature sensor, SMbus interface and lie interface of the product model MAX6657 are all known technologies, their functions and architecture will not be included here. Therefore, the ACP I unit 16 will be made according to the working mode stored by the memory unit 11 and set by the user (the working mode is obtained by executing the heat dissipation temperature setting program 111), the KBC15 and the temperature sense. The temperature information and temperature signals sent by the control unit 12 are compared, and the power consumption of the battery 14 is controlled according to the comparison result (the control program is executed by executing the battery power control program 113) and the heat is driven. The unit (13, 18) performs a relative operation (the driving program is the one that executes the thermal activation program n 2).
583532 五、發明說明(7) 言备參閱第3(A)圖至3(D)圖,其用以顯示本發明之散熱 系統及方法在特定溫度範圍内控制各散熱單元轉速之示意 表;該第3(A)圖及圖3(B)圖皆有關於CPU散熱單元13運作 參考表(114、115),而該第3(C)圖及第3(D)圖皆有關於機 殼散熱單元18運作參考表(116、117)。該些參考表(114至 11 7)中的數據係作為供該筆記型電腦1執行散熱溫度設定 程式111以及散熱啟動程式112時之資料存取之用,該些參 考表(114至117)中的nALn&nACn係指,當CPU10或機殼17 溫度達到一特定溫度範圍之最高臨界值時驅使其散熱單元 (13或18)以一特定轉速進行運作,直到該CPU10或機殼17 溫度下降至該特定溫度範圍之最低臨界值。 該第3(A)圖及3(C)圖之運作參考表(114、116)係屬靜 態(Silence)工作模式,而該第3(B)圖及3(D)之運作參考 表(115、117)係屬動態(Active)工作模式,該些工作模式 係由使用者執行該記憶單元11之散熱溫度設定程式1丨丨所 設得者。當工作模式設為靜態時,該散熱單元(13或18)之 轉速將較設為動態工作模式時的轉速為慢,且其轉動噪音 亦較小。 因此’藉由本發明之散熱方法及系統將可提供使用者583532 5. Description of the invention (7) Please refer to Figures 3 (A) to 3 (D), which are used to show the schematic diagram of the cooling system and method of the present invention for controlling the speed of each cooling unit within a specific temperature range; the Figures 3 (A) and 3 (B) both refer to the reference tables (114, 115) for the operation of the CPU heat dissipation unit 13, and Figures 3 (C) and 3 (D) both refer to the chassis heat dissipation. Unit 18 operates reference tables (116, 117). The data in the reference tables (114 to 11 7) are used for data access when the notebook computer 1 executes the thermal temperature setting program 111 and the thermal startup program 112. The reference tables (114 to 117) NALn & nACn means that when the temperature of the CPU 10 or the case 17 reaches the highest threshold of a specific temperature range, the cooling unit (13 or 18) is driven to operate at a specific speed until the temperature of the CPU 10 or the case 17 drops to The lowest critical value for this particular temperature range. The operation reference tables (114, 116) of Figs. 3 (A) and 3 (C) are static operation modes, while the operation reference tables of Fig. 3 (B) and 3 (D) (115 117) are active working modes, which are set by the user to execute the heat dissipation temperature setting program 1 丨 丨 of the memory unit 11. When the working mode is set to static, the speed of the heat dissipation unit (13 or 18) will be slower than that when it is set to the dynamic working mode, and its rotation noise will be smaller. Therefore, ‘the cooling method and system of the present invention will provide users
行的流程步驟。於筆記 I ’,、用以顯示本發明之散熱方法所需執 於筆記型電腦1開機後,首先執行步驟Line of process steps. In the note I ', which is used to display the heat dissipation method of the present invention, after the notebook computer 1 is turned on, first execute the steps
16817.ptd 第10頁 58353216817.ptd Page 10 583532
五、發明說明(8) 1101=ΐ作模式設定程序,亦即執行該記憶單元11之散熱 =度=疋程式111,以供使用者設定所需的散熱工作模式 為動悲或靜態。 接著於步驟S102中,該CPU1〇將使用者所設定的工作 模式儲,於該記憶單元丨丨中的一儲存區(未圖示)内。 接著於步驟S103中,該ACPI單元16執行該散熱啟動程 式11 2及電池電董控制程式丨丨3,使該單元1 6在筆記型 電腦1運jf乍過程中’可根據使用者所設定的工作模式驅動 各散熱早元(13或18)的轉速以及控制該電池14的耗電情 請接著參閲第5圖,其用以顯示第4圖之步驟sl〇3所述 =散熱,理流程。首先執行步驟32〇1,由該溫度感測控制 早兀12偵測目前CPU10溫度。 f著於步驟5202中,由該溫度感測控制單元12偵測目 刖機破1 7溫度。 接著於步驟S203中,由電池14内部之電熱調節器(未 圖示)因該電池14電量耗用而感測出對應之溫度。 接著於步驟S204中,於該溫度感測控制單元12感測出 CPU10以及機殼17的溫度後,即根據該感測到的溫度產生 對應之溫度信號並將其傳至該ACPI單元16。 =於步驟S20 5中,於該電池14之電熱調節器感測出 電池服度後,將該測得的電池溫度傳至該ΚΒΠ 5,以透過 ΐίϊϋ將元其 16所接收到的溫度產生一對應之溫度資訊並傳V. Explanation of the invention (8) 1101 = setting mode of operation mode, that is, executing the heat dissipation of the memory unit 11 = degree = operation mode 111, for the user to set the required cooling operation mode as dynamic or static. Then in step S102, the CPU 10 stores the working mode set by the user in a storage area (not shown) in the memory unit 丨 丨. Then, in step S103, the ACPI unit 16 executes the heat dissipation startup program 11 2 and the battery electric board control program 丨 3, so that the unit 16 can be used according to the user's setting during the operation of the notebook computer 1 The working mode drives the speed of each heat dissipation element (13 or 18) and controls the power consumption of the battery 14. Please refer to FIG. 5, which is used to display the step S103 in FIG. 4 = heat dissipation, the process . First execute step 3201, the temperature sensing control early 12 to detect the current temperature of the CPU10. f At step 5202, the temperature sensing control unit 12 detects that the temperature of the camera is 17. Then in step S203, a corresponding temperature is sensed by a thermistor (not shown) inside the battery 14 due to the power consumption of the battery 14. Then in step S204, after the temperature sensing control unit 12 senses the temperatures of the CPU 10 and the case 17, it generates a corresponding temperature signal according to the sensed temperature and transmits it to the ACPI unit 16. = In step S20 5, after the battery thermistor of the battery 14 senses the battery service, the measured battery temperature is transmitted to the ΚΒΠ 5 to generate a temperature of 16 which is received by ΐίΐ. Corresponding temperature information
第11頁 583532Page 583532
五、 發明說明 (9) 接 著 於 步 驟S2 0 6中,由該 ACPI 單元16執行記憶單元11 之 散 熱 啟 動 程 式112及電池電量控制程式113,並根據使用 者 所 設 定 的 工 作模式取得溫度 臨 界 值,將該溫度臨界值與 該 溫 度 感 測 控 制單元1 2所傳來 的 溫 度信號或與該KBC15所 傳 來 的 溫 度 資 訊進行比較,以 決 定 各散熱單元(13及18)的 驅 動 強 度 C P U1 0的操作頻率以及電池1 4耗電量。其中, 於 該 ACPI 單 元 1 6將溫度信號或 溫 度 資訊與溫度臨界值進行 比 較 後 若 溫 度信號大於該溫 度 臨 界值時,將由ACPI 16傳 送 控 制 命 令 至溫度感測控制 單 元 1 2 ’以令該溫度感測控 制 單 元 12控 制 CPU散熱單元13或機殼散熱單元18的驅動強 度 若 溫 度 信 號大於該溫度臨 界 值 時,將由CPU10傳送一 控 制 命 令 至 KBC15以令KBC15控 制 電 池1 4之耗電量。 因 此 本 發明之散熱方法 及 系 統係將使用者所設定之 溫 度 臨 界 值 與CPU10或機殼17溫度進行比較以決定cpu盥機 體 各 散 熱 單 元 之運作強度及控 制 C P U之操作頻率,以辦進 電 腦 系 統 散 熱 之目的,並增加 其 電 池使用時間及降低各散 熱 單 元 之 運 作 噪音。 以 上 所 述 僅為本發明之散 熱 方 法以及系統之較佳實施 例 > 非 用 以 限 定本發明之實質 技 術 内谷之範圍,如第2圖 所 示 之 溫 度 感 測控制單元1 2, 其 除 採用產品型號為MAX 6 6 5 7 的 溫 度 感 測器外,亦可採 用 由 Maxim公司所開發之產 品 型 號 為 MAX6658以及MAX6659 的 溫 度感測器,亦即,端視 實 施 型 態 而 定 。本發明之散熱 方 法 以及系統其實質技術内 容 係 廣 義 地 定 義於下述之申請 專 利 範圍中,任何他人所完 583532 五、發明說明(ίο) 成之技術實體或方法,若是與下述之申請專利範圍所定義 者完全相同,或是為同一等效之變更,均將被視為涵蓋於 此專利範圍之中。V. Description of the invention (9) Then in step S206, the ACPI unit 16 executes the thermal activation program 112 and the battery power control program 113 of the memory unit 11, and obtains the temperature critical value according to the working mode set by the user. The temperature critical value is compared with the temperature signal transmitted from the temperature sensing control unit 12 or the temperature information transmitted from the KBC15 to determine the driving strength CP U1 0 of each heat dissipation unit (13 and 18). Operating frequency and battery power consumption. Wherein, after the ACPI unit 16 compares the temperature signal or temperature information with the temperature critical value, if the temperature signal is greater than the temperature critical value, the ACPI 16 will send a control command to the temperature sensing control unit 12 'to make the temperature If the sensing control unit 12 controls the driving strength of the CPU heat dissipation unit 13 or the chassis heat dissipation unit 18 if the temperature signal is greater than the temperature critical value, the CPU 10 sends a control command to the KBC15 to cause the KBC15 to control the power consumption of the battery 14. Therefore, the heat dissipation method and system of the present invention compare the temperature critical value set by the user with the temperature of the CPU 10 or the casing 17 to determine the operating intensity of each heat dissipation unit of the CPU and control the operating frequency of the CPU to implement the computer system. The purpose of heat dissipation, and increase its battery life and reduce the operating noise of each heat dissipation unit. The above description is only a preferred embodiment of the heat dissipation method and system of the present invention. It is not intended to limit the range of the essential technology of the present invention, such as the temperature sensing control unit 12 shown in FIG. In addition to the temperature sensor with the product model MAX 6 6 5 7, temperature sensors with the product models MAX6658 and MAX6659 developed by Maxim can also be used, that is, depending on the implementation type. The essential technical content of the heat dissipation method and system of the present invention is broadly defined in the scope of the following patent applications. Any other person completed 583532 5. The technical entity or method formed by the invention description (ίο), if it is related to the following patent application The scope of the patent is defined as the same or the same equivalent change.
16817.ptd 第13頁 583532 圖式簡單說明 [圖式之簡易說明] 以下,將以較佳實施例,配合所附圖式,進一步詳細 說明本發明之特點及功效: 第1圖為一系統方塊圖,用以顯示本發明之散熱系統 之一較佳實施例的基本架構; 第2圖為一電路圖,用以顯示於第1圖中的CPU以及溫 度感測控制單元間的電路關係; 第3(A)圖至3(D)圖為溫度與風扇轉速對應表,用以顯 示本發明之散熱方法在特定溫度範圍内控制風扇的轉速狀 況; 第4圖為一流程圖,用以顯示本發明之散熱方法於實 際運作時之流程步驟;以及 第5圖為一流程圖,用以顯示第4圖之散熱方法中散熱 處理之流程步驟。 [圖式標號] 1 筆記型電腦 10 CPU 11 記憶單元 12 溫度感測控制單元 13 CPU散熱單元 14 電池 15 KBC 16 ACPI單元 17 機殼 18 機殼散熱單元 110 系統程式 111 散熱溫度設定程式 112 散熱啟動程式 113 電池電量控制程式 115 運作參考表16817.ptd Page 13 583532 Brief description of the drawings [Simplified description of the drawings] In the following, the characteristics and effects of the present invention will be further described in detail with preferred embodiments and the accompanying drawings: Figure 1 is a system block Figure 2 is a diagram showing the basic structure of a preferred embodiment of the heat dissipation system of the present invention; Figure 2 is a circuit diagram showing the circuit relationship between the CPU and the temperature sensing control unit in Figure 1; Figure 3 (A) to 3 (D) are the temperature and fan speed correspondence tables, which are used to show the cooling method of the present invention to control the fan speed in a specific temperature range. Figure 4 is a flowchart showing the present invention. The process steps of the heat dissipation method in actual operation; and FIG. 5 is a flowchart showing the process steps of the heat dissipation process in the heat dissipation method of FIG. 4. [Symbol] 1 Notebook computer 10 CPU 11 Memory unit 12 Temperature sensing control unit 13 CPU cooling unit 14 Battery 15 KBC 16 ACPI unit 17 Chassis 18 Chassis cooling unit 110 System program 111 Cooling temperature setting program 112 Cooling start Program 113 Battery level control program 115 Operation reference table
16817.ptd 第14頁16817.ptd Page 14
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