TW577249B

TW577249B - Printed steel plate and process applied in SMT assembly of SMT electronic components

Info

Publication number: TW577249B
Application number: TW92112657A
Authority: TW
Inventors: Chi Chen
Original assignee: Asustek Comp Inc
Priority date: 2003-05-09
Filing date: 2003-05-09
Publication date: 2004-02-21
Also published as: TW200425809A

Abstract

There is provided a printed steel plate applied in SMT assembly of SMT electronic components, which is used to coat conductive adhesive layer on the solder pads on the surface of PCB. The solder pads correspond to the contact electrodes of the SMT electronic components. Plural hollowed trapezoid openings are formed on the printed steel plate, which are exactly corresponding to the solder pads, so that conductive adhesive layer is coated on the solder pads via the trapezoid openings. Because the conductive adhesive layer coated on the solder pads also have trapezoid shapes, only a slight extension to two sides incurs even through they are squeezed by the contact electrodes, thereby avoiding the defects such as the generation of bridge short circuit or void soldering.

Description

577249 五、#明說明（1) 發明所屬之技術領域：本發明與一種電子零件之表面黏著製程（Surface Mounted Technology; SMT)有關，特別是有關一種應用於表面黏著電子零件其表面黏著組裝之印刷鋼板與相關製程。先前技術：隨著積體·、電路製作技術的進步，電子元件的設計與製作持續朝著細微化的趨勢發展，並且由於其具備更大規模、高積集度的電子線路，因此其產品功能亦更加完整。在此種情形下，傳統的穿孔插件式元件（Thr〇ugh Hole Technology ; THT )由於尺寸無法進一步的縮小，而會佔用印刷電路板大里的二間°再加上「插件式」的組裝方式，需要為每隻接腳鑽一個洞’所以此種元件的接腳其實會佔掉印刷電路板兩面的空間狀而且連接處的焊點也比較大。是以，在現今的電子零件封衣程序中大量採用表面黏著技術（Surface Mounted Technology; SMT)，將電子零件組裝於印刷電路板上。使用表面黏著封同一面的印刷電路板以提供每個接腳*** 可同時在印刷電路板路板的空間利用率。較小，是以相較於傳術的印刷電路板上零骏的零件，由於其上，因此不需要在。換言之，在使用的兩面都焊上電子此外，由於表面黏統的穿孔插件式零件要密集很多。加接腳是焊接在與零件印刷電路板上鑽洞，表面黏著技術後，將零件，而大幅提昇電著的零件（SMT)體積件（THT)，使用SMT技上SMT封裝零件的造577249 V. # 明说明 (1) The technical field to which the invention belongs: The present invention relates to a surface mounting technology (SMT) of an electronic part, and particularly relates to a printing application for surface adhesive assembly of surface-mounted electronic parts Steel plates and related processes. Prior technology: With the advancement of integrated circuit and circuit manufacturing technology, the design and production of electronic components continue to trend toward miniaturization, and because it has larger-scale, high-integration electronic circuits, its product functions Also more complete. In this case, due to the inability to further reduce the size of the conventional through-hole plug-in components (Through Hole Technology; THT), it will occupy two large areas of the printed circuit board, plus the "plug-in" assembly method. You need to drill a hole for each pin, so the pins of this component will actually take up space on both sides of the printed circuit board and the solder joints at the connection are relatively large. Therefore, Surface Mounted Technology (SMT) is widely used in today's electronic part sealing procedures to assemble electronic parts on printed circuit boards. The surface of the printed circuit board is adhered to the same side to provide each pin insertion, which can simultaneously use space on the printed circuit board. Smaller, compared to conventional parts on printed circuit boards, because it is on top, it does not need to be on. In other words, the electronics are soldered on both sides of the device. In addition, the punched plug-in parts are much denser due to the surface bonding. The pins are soldered to the holes on the printed circuit board of the part, and the surface is adhered to the part, and the part is greatly improved. The SMT volume part (THT) is greatly improved.

第4頁 577249 五、發明說明（2) 價也比較便宜，因此已躍升為當今印刷電路板組裝製程的主流。然而，隨著電子零件的體積持續縮小，在SMT技術上亦遭遇相當的困難。 · 以電子產品中最基本、必要之元件---電阻器為例，由於其廣泛的應用於電子電路中電壓與電流的調整，因此舉凡電子、電器製品如計算機、電腦及週邊設備、電視、行動電 \Page 4 577249 V. Description of the invention (2) The price is also relatively cheap, so it has become the mainstream of today's printed circuit board assembly process. However, as the volume of electronic components continues to shrink, they have encountered considerable difficulties in SMT technology. · Taking the most basic and necessary element in electronic products --- resistors as an example, because it is widely used in the adjustment of voltage and current in electronic circuits, so electronics, electrical products such as computers, computers and peripherals, televisions, Mobile electricity

話及儀器等皆需利用大量使用電阻器。特別是，由於近年來對於電阻器的需求’，趨向小規格、高功率、高品質穩定度及高技術複雜度，是以應用於表面黏著技術之晶片排阻，因為產品精密度及複雜性高，而廣泛運用在電腦、通訊、太空、軍事、高科技等高附加價值產業中，並成為市場發展的主流。Telephones and instruments need to use a large number of resistors. In particular, due to the demand for resistors in recent years, they tend to have small specifications, high power, high quality stability, and high technical complexity, which is based on the exclusion of wafers used in surface adhesion technology because of the high precision and complexity of products. It is widely used in high value-added industries such as computers, communications, space, military, and high technology, and has become the mainstream of market development.

然而，隨著新一代厚膜電阻的尺寸規格，由0 6 0 3尺寸規格（1.6x0· 8x0. 45mm)縮小至 0402尺寸規格（lx 0.5x 0.35mm) 時，由於0 4 0 2排組的體積比0 6 0 3封裝排組小了 5 0 %以上，因此在使用SMT技術組裝於印刷電路板上時，相鄰銲墊間常常會因排列密集、尺寸細微而導致印刷塗佈的導電黏膠在迴焊程序後，發生空銲或短路等缺陷。請參照第一圖，此圖顯示了典型的0 4 0 2尺寸排組結構 1 0。如圖中所示，此排組結構1 0包括了一氧化鋁瓷基板1 2、以及形成於氧化鋁瓷基板12表面之厚膜電阻層14。在厚膜電However, with the new generation of thick film resistors, the size has been reduced from 0 6 0 3 (1.6x0 · 8x0. 45mm) to 0402 size (lx 0.5x 0.35mm). The volume is more than 50% smaller than the 0 6 0 3 package row. Therefore, when using SMT technology to assemble on a printed circuit board, the adjacent pads are often densely arranged and the size is small, which leads to the conductive adhesion of the printed coating. After the reflow process, defects such as empty soldering or short circuit occur. Please refer to the first figure, which shows a typical 0 4 0 2 size bank structure 10. As shown in the figure, the bank structure 10 includes an alumina ceramic substrate 12 and a thick film resistor layer 14 formed on the surface of the alumina ceramic substrate 12. In thick film

第5頁 577249 五、發明說明（3) 阻層1 4與氧化鋁瓷基板1 2的表面上，並彼覆了一保護層1 6。值得注意的是，在排組結構1 0底面的兩個側邊上，並製作了數個電極1 8，連結於所述的厚膜電阻層1 4。這些電極1 8可以根據分佈於氧化鋁瓷基板1 2側邊位置的不同，而區分為位於四個角落的端電極1 8 a、以及位於基板側邊沿線上的沿線電極18b。如圖中所示，端電極18a呈"Ln型外觀，並略大於長方形的沿線電極1 8 b。如此一來，在進行表面黏著技術時， \ 便可藉著將這些電極1 8焊接於印刷電路板上的焊墊，而達到組裝固定零件的目的。Page 5 577249 V. Description of the invention (3) The surface of the resist layer 14 and the alumina ceramic substrate 12 are covered with a protective layer 16 each other. It is worth noting that, on the two sides of the bottom surface of the bank structure 10, a plurality of electrodes 18 are fabricated and connected to the thick-film resistor layer 14 described above. These electrodes 18 can be divided into terminal electrodes 18 a located at four corners and line electrodes 18 b located on the side edges of the substrate according to the positions of the sides of the alumina ceramic substrate 12. As shown in the figure, the terminal electrode 18a has a " Ln-type appearance, and is slightly larger than the rectangular line electrode 18b. In this way, when the surface adhesion technology is performed, the purpose of assembling fixed parts can be achieved by soldering these electrodes 18 to the pads on the printed circuit board.

在進行表面黏著程序時，會先利用鋼板印刷的方式，將導電黏膠塗佈於印刷電路板的焊墊上。請參照第二圖，以上述0 4 0 2晶片排組為例，製作於印刷電路板上的矩形焊墊2 0共有八個，分別棑列成兩行，並各自對應排組結構1 0上的電極 1 8。在進行導電黏膠塗佈時，會將一塊鋼板2 2覆蓋於印刷電路板上。此鋼板2 2上具有八個矩形開口 2 4，正好分別曝露出上述矩形焊墊2 0，以便在進行塗佈程序時，能藉著這些矩形開口 2 4，將導電黏膠塗佈於矩形焊墊2 0表面上。如此一來，在移除鋼板2 2後，於每一個矩形焊墊2 0上皆會遺留矩形的導電黏膠層。接著，便可將0 4 0 2排組結構1 0壓置於這些焊墊2 C 上，並藉由後續的迴焊程序加以組裝固定，而使排組結構1〔的電極1 8與焊墊2 0產生電性連結。然而，值得注意的是，在排組規格由原來的0 6 0 3尺寸進When performing the surface adhesion process, the conductive adhesive is applied to the pads of the printed circuit board by means of stencil printing. Please refer to the second figure. Taking the above-mentioned 0 2 0 2 chip row group as an example, there are eight rectangular solder pads 20 produced on the printed circuit board, which are respectively arranged in two rows and correspond to the row group structure 10. Of electrodes 1 8. When conducting conductive adhesive coating, a steel plate 22 will be covered on the printed circuit board. The steel plate 22 has eight rectangular openings 24, and the rectangular solder pads 20 are exposed respectively, so that the conductive adhesive can be applied to the rectangular welding through these rectangular openings 24 during the coating process. Pad 2 on the surface. In this way, after removing the steel plate 22, a rectangular conductive adhesive layer will be left on each rectangular solder pad 20. Then, the 0 4 0 2 row structure 10 can be pressed onto these pads 2 C and assembled and fixed by the subsequent reflow process, so that the row structure 1 [of the electrode 18 and the pads 2 0 creates an electrical connection. However, it is worth noting that the specifications of the row group are adjusted from the original 0 6 0 3 size.

第6頁 577249 五、發明說明（4) 入0 4 0 2尺寸後，由於位於相鄰的導電黏膠間距離縮小至約 8m i 1左右，加上在擺置排組結構1 0時，受到電極1 8的壓擠，矩形導電黏膠層往往還會向兩側沿展，因此很容易在後續的迴焊程序中，造成焊接失誤的情形。特別是當導電黏膠層受熱融化時，相鄰的導電黏膠可能流動橋接而導致短路效應，或著受到錫球表面張力的牵引而導致部份電極發生空焊的情形。如此一來，除‘ 了造成相關零件的組裝良率下降外，亦需要耗費更多的人工成本，進行修復檢測的工作。更者，為了進一步的縮減各式電子零件的尺寸，來提昇印刷電路板的積集度與相關效能，新式的晶片排組更由0 4 0 2尺寸縮小到0 2 0 1 的尺寸規格。可預見的在0 2 0 1尺寸規格下’矩形導電黏膠間的距離將更加縮減，而使上述短路或空焊的問題變得更加嚴重 ° 發明内容：黏橋面止表防於可用其應，種程一製供與提板為鋼的刷目印的之明裝。發組題本著問，黏等題面陷問表缺述其銲上件空對零或針子路電短著接為達上述目的，本發明提供了一種表面黏著電子零件印刷鋼板設計。此印刷鋼板係用來塗佈導電黏膠層於印刷電路Page 6 577249 V. Description of the invention (4) After the size of 0 4 0 2 is entered, the distance between adjacent conductive adhesives is reduced to about 8 m i 1, and when placing the row structure 10, it is subject to When the electrode 18 is squeezed, the rectangular conductive adhesive layer often spreads to both sides, so it is easy to cause welding errors in the subsequent reflow process. Especially when the conductive adhesive layer is melted by heat, the adjacent conductive adhesive may flow and bridge, which may cause short-circuit effect, or may be pulled by the surface tension of the solder ball, causing some electrodes to be soldered. In this way, in addition to reducing the assembly yield of related parts, it also requires more labor costs for repair and inspection work. In addition, in order to further reduce the size of various electronic components to improve the integration degree and related performance of printed circuit boards, the new chip array group has been reduced from 0 4 0 2 size to 0 2 0 1 size specification. It is foreseeable that the distance between 'rectangular conductive adhesives' will be further reduced under the 0 2 0 1 size specification, and the above short-circuit or air-soldering problems will become more serious. , The seeding system is used for the surface mounting of the steel plate. Group questions Based on questions, sticky questions, etc. The problem table is missing, and the welding piece is empty to zero or the pin is short. To achieve the above purpose, the present invention provides a design of a printed steel plate with surface-mounted electronic parts. This printed steel plate is used to apply conductive adhesive layer to printed circuits

第7頁 577249 五、發明說明（5) 板表面之銲墊上，這些銲墊對應於表面黏著電子零件之接觸電極。而印刷鋼板上具有複數個梯形開口，正好對應於這些 . 銲墊，以便透過梯形開口，在銲墊上塗佈出梯形的導電黏膠層。 % 在一實施例中，印刷鋼板表面黏著電子零件表面黏著電子零件上的數個開口可排列成彼此平行的兩行，並且根據開‘ \ 口位於每一行中的位置，可將其區分為第一梯形開口與第二‘ 梯形開口。第一梯、開口係位於所述每一行開口的兩端。每一個第一梯形開口並具有互相平行的第一短邊與第一長邊，φ 第一長邊較靠近另一行開口，第一短邊則較遠離另一行開 · 口。第二梯形開口係位於左右兩個第一梯形開口之間，每一. 個第二梯形開口亦具有互相平行的第二短邊與第二長邊，第二短邊較靠近另一行開口，第二長邊則較遠離另一行開口。 ‘ 藉著將上述印刷鋼板覆蓋於印刷電路板上，可塗佈導電黏膠層於每一個銲墊表面。其中，由上述第一梯形開口所塗佈的第一導電黏膠層，亦具有互相平行的第一短邊與第一長邊。其第一長邊位於焊塾外側’而第一短邊則位於鮮塾内側。至於，透過第二梯形開口所塗佈的第二導電黏膠層，亦籲具有互相平行的第二短邊與第二長邊。其第二短邊位於銲墊内側，而第二長邊則位於銲墊外側。在移除印刷鋼板後，可將表面黏著電子零件放置於印刷Page 7 577249 V. Description of the invention (5) On the pads on the surface of the board, these pads correspond to the contact electrodes on the surface of which the electronic parts are adhered. The printed steel plate has a plurality of trapezoidal openings, which correspond to these. Pads, so that a trapezoidal conductive adhesive layer is coated on the pads through the trapezoidal openings. % In an embodiment, the openings on the surface of the printed steel plate are bonded to the electronic parts. The several openings on the surface-attached electronic parts can be arranged in two rows parallel to each other. A trapezoidal opening and a second 'trapezoidal opening. The first ladder and the opening are located at both ends of each row of openings. Each first trapezoidal opening has a first short side and a first long side that are parallel to each other, φ the first long side is closer to the opening of the other row, and the first short side is farther from the opening of the other row. The second trapezoidal opening is located between the left and right two first trapezoidal openings, each of which has a second short side and a second long side parallel to each other, and the second short side is closer to the other row of openings. The two long sides are farther away from the other row of openings. ‘By covering the printed circuit board with a printed circuit board, a conductive adhesive layer can be applied to the surface of each pad. The first conductive adhesive layer coated by the first trapezoidal opening also has a first short side and a first long side that are parallel to each other. Its first long side is on the outer side of the welding grate and the first short side is on the inside of the fresh grate. As for the second conductive adhesive layer applied through the second trapezoidal opening, it is also desirable to have a second short side and a second long side parallel to each other. Its second short edge is on the inside of the pad, and the second long edge is on the outside of the pad. After the printed steel plate is removed, the surface can be placed with printed electronic parts

第8頁 577249 五、發明說明C6) 電路板上，並使每一個該電極碰觸對應之該導電黏膠層。接著，再進行迴銲程序將表面黏著電子零件固定於印刷電路板上。依據本發明，藉著將印刷鋼板上的開口形狀改為梯形，可使開口内側端的導電黏膠塗佈量減少，而避免在後續迴銲程序中發生上^述缺陷。實施方式：Page 8 577249 V. Description of the invention C6) On the circuit board, make each electrode touch the corresponding conductive adhesive layer. Then, a reflow process is performed to fix the surface-attached electronic parts on the printed circuit board. According to the present invention, by changing the shape of the opening on the printed steel plate to a trapezoid, the coating amount of the conductive adhesive at the inner end of the opening can be reduced, and the above-mentioned defects can be avoided in the subsequent reflow process. Implementation:

請參照第三圖，此圖顯示由本發明之一實施例所提供之印刷鋼板3 0。如上所述，此印刷鋼板3 0係應用於表面黏著電子零件（例如表面黏著元件，surface mounting device;Please refer to the third figure, which shows a printed steel sheet 30 provided by an embodiment of the present invention. As mentioned above, this printed steel sheet 30 is applied to surface-attached electronic parts (such as surface-mounted components, surface mounting device;

SMD)之表面黏著製程，以便將表面黏著電子零件之數個電極，與印刷電路板上之數個銲墊連結在一起。在印刷鋼板3〔上製作了複數個開口 3 2，當此印刷鋼板3 0覆蓋於印刷電路板上時，這些開口正好會曝露出位於印刷電路板上的銲墊，以便透過鋼板印刷的方式’塗佈導電黏膠（例如導電黏膠）於這些銲墊上。此印刷鋼板3 0上之開口 3 2係排列成彼此平行的兩行，並且根據每一行中開口 3 2的位置，可區分為第一梯形開口 3 2 a與第二梯形開口 3 2 b。如第三圖所示，第一梯形開口 3 2 a係位於每一行開口的左、右兩端，且每一個第一梯形開口 3 2 a的四個鄰邊，分別為互相平行的第一短邊與第一長邊（即上、下兩個底邊）、以SMD) surface bonding process, in order to connect several electrodes on the surface with electronic parts and several pads on the printed circuit board. A plurality of openings 3 2 are made on the printed steel plate 3 [. When this printed steel plate 30 is covered on the printed circuit board, these openings will just expose the pads on the printed circuit board so as to pass through the method of steel plate printing. ' Apply conductive adhesive (such as conductive adhesive) to these pads. The openings 3 2 on the printed steel sheet 30 are arranged in two rows parallel to each other, and according to the positions of the openings 3 2 in each row, they can be divided into a first trapezoidal opening 3 2 a and a second trapezoidal opening 3 2 b. As shown in the third figure, the first trapezoidal openings 3 2 a are located at the left and right ends of each row of openings, and the four adjacent edges of each of the first trapezoidal openings 3 2 a are first short parallel to each other. Side and the first long side (that is, the top and bottom sides),

第9頁 577249 五、發明說明（7) . 及第一斜邊與第一直邊（即左、右兩個側邊）。至於，第二梯形開口 3 2 b則位於左右兩端的第一梯形開口 3 2 a之間，並且每一個第二梯形開口 3 2 b的四個鄰邊，分別為互相平行的第二短邊與第二長邊（即上、下兩個底邊）、以及兩個第二斜邊 (即左、右兩個側邊）。值得注意的是，對位於同一行中的第一梯形開口 3 2 a與 \ 第二梯形開口 3 2 b而言，第一梯形開口 3 2 a的第一長邊係位於這開口的内側，而較接近另一行開口 32，至於其第一短邊則因為位在第一梯形開口 3 2 a的外側，而會較遠離另一行開口 3 2。至於，對第二梯形開口 3 2 b而言，其第二短邊由於位在此第二梯形開口 3 2 b的内側，是以會比較接近另一行開口 3 2，至於其第二長邊則由於位在此第二梯形開口 3 2 b的外側，因此會較遠離另一行開口 3 2。此外，對第一梯形開口 3 2 a而言，其第一斜邊係位於開口外側，至於第一直邊則位於開口内側位置。如第三圖中所示，其第一直邊會較接近同一行中的第二梯形開口 32b，反之，其第一斜邊則會較遠離同一行中的第二梯形開口 3 2 b。以0 4 0 2尺寸排組結構1 0為例（參照第一圖所示），此排組結構1 0底部的電極1 8共有八個，分別排列成兩行，且每一行有四個電極1 8。根據每一個電極1 8於行中的分佈位置，可區分成位於每一行左右兩端的端電極18a、以及位於兩個端電Page 9 577249 V. Description of the invention (7). And the first hypotenuse and the first straight side (ie, the left and right sides). As for the second trapezoidal openings 3 2 b are located between the left and right first trapezoidal openings 3 2 a, and the four adjacent sides of each second trapezoidal opening 3 2 b are second short sides parallel to each other and The second long side (the top and bottom bottom edges), and the two second hypotenuse (the left and right side edges). It is worth noting that, for the first trapezoidal opening 3 2 a and the second trapezoidal opening 3 2 b in the same row, the first long side of the first trapezoidal opening 3 2 a is located inside the opening, and It is closer to the opening 32 in the other row, and its first short side is farther away from the opening 32 in the other row because it is located outside the first trapezoidal opening 3 2 a. As for the second trapezoidal opening 3 2 b, since the second short side is located inside the second trapezoidal opening 3 2 b, it will be closer to another row of openings 3 2. As for the second long side, Since it is located outside the second trapezoidal opening 3 2 b, it is farther away from the other row of openings 3 2. In addition, for the first trapezoidal opening 3 2 a, the first oblique side is located outside the opening, and the first straight side is located inside the opening. As shown in the third figure, the first straight edge is closer to the second trapezoidal opening 32b in the same row, and the first hypotenuse is farther away from the second trapezoidal opening 32b in the same row. Take the 0 4 0 2 size group structure 10 as an example (refer to the first figure), there are eight electrodes 18 at the bottom of the group structure 10, arranged in two rows, and each row has four electrodes. 1 8. According to the distribution position of each electrode 18 in the row, it can be divided into terminal electrodes 18a located at the left and right ends of each row, and two terminal electrodes

第10頁 577249 五、發明說明（8) 極18a之間的沿線電極18b。的印刷電路板40上亦會製作盥^此=第四圖所示，在所提供這些銲墊42共有八個， ^ =二電極18相對應的銲墊42 兩行，以各自對應上述的：電的:卜广其分別排列成據其在每一行中的位置，樣的，這些銲塾42亦可根一 4曰執區刀成位在一行中左、右兩端之第紅墊42&、巧及位於其間的第二銲墊42b “，進仃導電黏膠印刷程序時，可先將上述印刷鋼板⑽覆盍於=刷電路板40上，再將導電黏膠層塗佈於此印刷鋼板3〔亡。藉由鎮空的第一梯形開口 32a與第二梯形開口 32b，能在· 鮮塾42上表面形成所需的導電黏膠層。如第四圖所示，在取下印刷鋼板3 0後，塗佈於第一銲墊42a上之第一導電黏膠層 4 4 a會具有與苐一梯形開口 3 2 a相同的梯形外觀，亦即每一個第一導電黏膠層44a也會具有互相平行的第一短邊與第一長 · 邊’且其第一長邊因為位於第一銲墊4 2 a的内側，而會比較接近另一行銲墊4 2，至於其第一短邊則因為位於第一銲墊 4 2 a的外側，故會較遠離另一行銲墊4 2。同樣的，塗佈於第二銲墊42b上之第二導電黏膠層44b亦具有與第二梯形開口 32b相同的梯形外觀。亦即每一個第二導電黏膠層44b會具有鲁互相平行的第二短邊與第二長邊，且其第二短邊由於位在第二銲墊4 2 b的内側，故會比較接近另一行銲墊4 2，至於其第二長邊則由於位在第二銲墊4 2 b的外側，故會比較遠離另一行銲塾4 2。Page 10 577249 V. Description of the invention (8) Line electrode 18b between electrodes 18a. The printed circuit board 40 will also be manufactured. This = as shown in the fourth figure, there are eight pads 42 provided in the provided, ^ = two rows of pads 42 corresponding to the two electrodes 18, respectively corresponding to the above: Electrical: Bu Guangqi is arranged separately according to its position in each row. For example, these welding pads 42 can also be placed on the left and right ends of the red pad 42 in a row. And the second solder pad 42b "between them, when the conductive adhesive printing process is performed, the printed steel plate can be coated on the printed circuit board 40, and then the conductive adhesive layer is coated on the printed steel plate 3 [Dead. With the first trapezoidal opening 32a and the second trapezoidal opening 32b emptied, the required conductive adhesive layer can be formed on the upper surface of the fresh pan 42. As shown in the fourth figure, the printed steel plate 3 is removed After 0, the first conductive adhesive layer 4 4 a coated on the first pad 42 a will have the same trapezoidal appearance as the first trapezoidal opening 3 2 a, that is, each first conductive adhesive layer 44 a will also It has a first short side and a first long side that are parallel to each other, and its first long side is located inside the first pad 4 2 a, and It is closer to another row of pads 4 2, and the first short side is located outside the first row of pads 4 2 a, so it will be farther away from the other row of pads 4 2. Similarly, it is coated on the second row of pads 42b The second conductive adhesive layer 44b also has the same trapezoidal appearance as the second trapezoidal opening 32b. That is, each second conductive adhesive layer 44b will have a second short side and a second long side that are parallel to each other, and Since the second short side is located inside the second pad 4 2 b, it will be closer to the other row of pads 4 2, while the second short side is located outside the second pad 4 2 b, so Will be farther away from the other row of welding pads 4 2.

第11頁 577249 五、發明說明（9) 在移開印刷鋼板3 0後，可將諸如0 4 0 2排組之表面黏著電子零件，擺置於印刷電路板4 0上，並使每一個電子零件的電極，觸壓到對應的導電黏膠層44。其中，0 4 0 2排組結構1 0的端電極18a會壓觸於第一導電黏膠層44a，至於沿線電極1 8b 則會壓觸於第二導電黏膠層44b。接著，藉由進行迴銲程序’能將表面黏者電子零件組裝、固定於印刷電路板4 0上’ \ 並使0 4 0 2排組的電極經由銲錫而與銲墊4 2產生電性連結。Page 11 577249 V. Description of the invention (9) After the printed steel plate 30 is removed, the surface of a group such as 0 4 0 2 can be adhered with electronic parts, and placed on the printed circuit board 40, and each electronic The electrode of the component is pressed against the corresponding conductive adhesive layer 44. Among them, the terminal electrode 18a of the 0 4 0 2 row structure 10 will be pressed against the first conductive adhesive layer 44a, and the line electrode 18b will be pressed against the second conductive adhesive layer 44b. Next, by performing the reflow process, 'the surface-attached electronic parts can be assembled and fixed on the printed circuit board 40', and the electrodes of the 0 4 0 2 row group are electrically connected to the pad 4 2 through solder. .

在較佳實施例中，當製作於印刷電路板4 0上的矩形銲墊 42具有大約20 mil的長度與10 mil的寬度，並且同一行中兩個相鄰銲墊4 2間的距離為8. 8 m i 1，而上、下兩行銲墊距離為1 7 m i 1時，上述第一梯形開口 3 2 a的第一短邊可控制在約 7 . 5〜1 2 . 5 m i 1、其第一長邊則控制在1 1 . 5〜1 6 . 5 m i 1左右。至於第二梯形開口 32b的第二短邊約為3. 2〜8. 4 mil、而其第二長邊則約為8〜1 4 m i 1。並且，不論是第一梯形開口 3 2 a或第二梯形開口 3 2 b的高度，皆會大於矩形銲墊4 2的長度（2 0 mil)。換言之，對第二梯形開口 3 2 b而言，其第二短邊大約為其第二長邊的2/5〜3/5。In a preferred embodiment, when the rectangular pads 42 fabricated on the printed circuit board 40 have a length of about 20 mil and a width of 10 mil, and the distance between two adjacent pads 42 in the same row is 8 8 mi 1, and when the distance between the top and bottom rows of pads is 17 mi 1, the first short side of the first trapezoidal opening 3 2 a can be controlled to about 7.5 to 1 2.5 mi 1. The first long side is controlled at 1 1.5 to 16.5 mi 1. As for the second short side of the second trapezoidal opening 32b, it is about 3.2 to 8.4 mil, and its second long side is about 8 to 14 m i 1. Moreover, whether the height of the first trapezoidal opening 3 2 a or the second trapezoidal opening 3 2 b is larger than the length (20 mil) of the rectangular pad 4 2. In other words, for the second trapezoidal opening 3 2 b, its second short side is approximately 2/5 to 3/5 of its second long side.

由於第二梯形開口 3 2 b的第二短邊僅為其第二長邊的 2 / 5〜3 / 5，是以透過此開口 3 2 b所塗佈的第二導電黏膠層亦會具有相同的梯形形狀。對於相鄰的兩行銲墊而言，由於第二導電黏膠層的第二短邊，係位於第二銲墊4 2 b的内側位置，Since the second short side of the second trapezoidal opening 3 2 b is only 2/5 to 3/5 of its second long side, the second conductive adhesive layer coated through the opening 3 2 b will also have The same trapezoidal shape. For the two adjacent rows of pads, since the second short side of the second conductive adhesive layer is located inside the second pad 4 2 b,

第12頁 577249 五、發明說明（ίο) 是以如第四圖所示，銲墊内側表面將祇有部份導電黏膠塗佈。如此一來，當擺置0 4 0 2排組結構時，即便受到沿線電極 18b的壓擠，但是由於位於第二銲墊42b内側的導電黏膠量較小，是以向兩側沿展的情形將較為輕微。在後續的迴焊程序中，此第二導電黏膠層44b也比較不會與相鄰的導電黏膠層發生橋接而發生短路的情形。並且由於熔融態的銲錫，不會發生橋接情形，因此傳統製程中受到熔錫表面張力所導致的空銲情形，也可有效的防止。此外，本實施例中並將第一梯形開口 3 2 a，朝外側進行偏移，使其與同行的第二梯形開口 3 2 b間具有較大的間距。因此，如第四圖所示，第一導電黏膠層44a其内側的第一直邊，並不會完全覆蓋住第一銲墊42a的内側，而會曝露出第一銲墊4 2 a内側的部份邊線區域。亦即，當第一銲墊4 2 a與第二銲墊4 2 b間的間距為8 . 8 m i 1時，第一導電黏膠層4 4 a會往外側偏移，而使其與第二導電黏膠層44b間的間距大於8. 8 mil。如此一來，藉著增加第一導電黏膠層44a與第二導電黏膠層44b間的距離，可大幅降低其間發生橋接效應之機會。由於有效的防止短路、空銲等問題，因此整體表面黏著製程的良率可獲得大幅的提昇。並且，因為不需要再耗費大量的人力成本，進行檢測除錯的工作，是以能有效的減少相關的製程週期，而達到提升產能的目的。更者，由於本發明所設計的鋼板開口，具有較小的面積，是以所塗佈的導電黏Page 12 577249 V. Description of the Invention (ίο) As shown in the fourth figure, the inner surface of the pad will only be partially covered with conductive adhesive. In this way, when the 0 4 0 2 row structure is placed, even if it is squeezed by the electrode 18b along the line, the amount of conductive adhesive located inside the second pad 42b is small, so it is stretched to both sides. The situation will be mild. In the subsequent reflow process, the second conductive adhesive layer 44b is also less likely to be short-circuited due to bridging with adjacent conductive adhesive layers. And because the molten solder does not cause bridging, the empty soldering caused by the surface tension of the molten solder in the traditional process can also be effectively prevented. In addition, in this embodiment, the first trapezoidal opening 3 2 a is shifted to the outside so as to have a larger distance from the second trapezoidal opening 3 2 b of the counterpart. Therefore, as shown in the fourth figure, the first straight side of the inner side of the first conductive adhesive layer 44a will not completely cover the inner side of the first pad 42a, but will expose the inner side of the first pad 4a. Part of the border area. That is, when the distance between the first bonding pad 4 2 a and the second bonding pad 4 2 b is 8.8 mi 1, the first conductive adhesive layer 4 4 a will be shifted to the outside, so that it will be offset from the first bonding pad 4 4 a. 8 mil。 The distance between the two conductive adhesive layers 44b is greater than 8.8 mil. In this way, by increasing the distance between the first conductive adhesive layer 44a and the second conductive adhesive layer 44b, the chance of a bridging effect occurring therebetween can be greatly reduced. Due to the effective prevention of short circuits and air soldering, the yield of the overall surface adhesion process can be greatly improved. In addition, because there is no need to consume a large amount of labor costs, the detection and debugging work can effectively reduce the related process cycle and achieve the purpose of increasing production capacity. Furthermore, due to the opening of the steel plate designed by the present invention, it has a smaller area and is coated with the conductive adhesive.

第13頁 577249 五、發明說明（1-1) 膠量亦較小，而達到節省成本的效果。本發明雖以較佳實例闡明如上，然其並非用以限定本發明精神與發明實體，僅止於上述實施例爾。對熟悉此項技術者，當可輕易了解並利用其它元件或方式來產生相同的功效。是以，在不脫離本發明之精神與範圍内所作之修改，均應包含在下述λ之申請專利範圍内。Page 13 577249 V. Description of the invention (1-1) The amount of glue is also small, which achieves the effect of saving costs. Although the present invention is explained as above with a preferred example, it is not intended to limit the spirit and the inventive substance of the present invention, but only to the above embodiments. For those familiar with this technology, it is easy to understand and use other components or methods to produce the same effect. Therefore, all modifications made without departing from the spirit and scope of the present invention should be included in the scope of patent application of the following λ.

第14頁 577249 圖式簡單說明1 圖式簡單說明：藉由以下詳細之描述結合所附圖示，將可輕易的了解上述内容及此項發明之諸多優點，其中：第一圖顯示0 4 0 2排阻元件之結構圖；第二圖顯示傳統技術中應用於表面黏著電子零件之印刷鋼板開口設計；第三圖顯示本發明之一實施例中應用於表面黏著電子零 \ 件之印刷鋼板開口設計；及Page 14 577249 Brief description of the drawings 1 Brief description of the drawings: Through the following detailed description combined with the attached drawings, the above content and the many advantages of this invention can be easily understood, of which: The first picture shows 0 4 0 Structure diagram of 2 exclusion elements; the second diagram shows the opening design of the printed steel plate applied to the surface-adhesive electronic parts in the traditional technology; the third diagram shows the opening of the printed steel plate applied to the surface-adhesive electronic parts in one embodiment of the present invention Design; and

第四圖顯示使用本發明一實施例之印刷鋼板塗佈於印刷電路板上之導電黏膠層。圖號對照表： 0 4 0 2尺寸排組結構 1 0 厚膜電阻層 1 4 電極 18 沿線電極 1 8 b 鋼板 2 2 印刷鋼板 30 第一梯形開口 3 2 a 印刷電路板 4 0 第一銲墊 4 2 a 第一導電黏膠層 44a 導電黏膠層 44 氧化铭曼基板1 2 保護層 1 6 端電極 1 8 a 矩形焊墊 2 0 矩形開口 2 4 開口 3 2 第二梯形開口 3 2 b 銲墊 4 2 第二銲墊 4 2 b 第二導電黏膠層 44bThe fourth figure shows a conductive adhesive layer coated on a printed circuit board using a printed steel sheet according to an embodiment of the present invention. Drawing number comparison table: 0 4 0 2 size row structure 1 0 thick film resistance layer 1 4 electrode 18 line electrode 1 8 b steel plate 2 2 printed steel plate 30 first trapezoidal opening 3 2 a printed circuit board 4 0 first solder pad 4 2 a First conductive adhesive layer 44a Conductive adhesive layer 44 Oxidized Mingman substrate 1 2 Protective layer 1 6 Terminal electrode 1 8 a Rectangular pad 2 0 Rectangular opening 2 4 Opening 3 2 Second trapezoidal opening 3 2 b Soldering Pad 4 2 Second pad 4 2 b Second conductive adhesive layer 44b

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Claims

577249 六、申請專利範圍 - 1. 一種應用於表面黏著電子零件其表面黏著製程之印刷鋼板，其中該印刷鋼板係用來塗佈導電黏膠層於印刷電路板表面之銲墊上，該些銲墊係對應於該表面黏著電子零件之接觸電極’該印刷鋼板具有· 至少一個梯形開口，對應於該些銲墊，導電黏膠可透過該梯形開口塗佈於該銲墊上。 2. 如申_專利範圍第1項之印刷鋼板，其中上述梯形開- 口係排列成兩行，且每一個該梯形開口具有相互平行之一短邊與一長邊，該等梯形開口之至少一的該短邊較接近另一行φ 該梯形開口，且該長邊較遠離另一行該梯形開口。 - 3. 如申請專利範圍第2項之印刷鋼板，其中上述梯形開口之該短邊約為3.2〜8.4 mil，該長邊約為8〜14 mil。 ‘ 4. 如申請專利範圍第2項之印刷鋼板，其中上述梯形開口之該短邊長度，大約為該長邊長度的2/5〜3/5。 5. 如申請專利範圍第2項之印刷鋼板，其中在每一行該梯形開口中，各梯形開口較鄰近於另一行該梯形開口部份的· 間距，係大於各梯形開口較遠離於另一行該梯形開口部份的間距。 6. 如申請專利範圍第2項之印刷鋼板，其中每一行該梯577249 6. Scope of patent application-1. A printed steel plate applied to the surface adhesion process of surface-adhesive electronic parts, wherein the printed steel plate is used to coat the conductive adhesive layer on the pads on the surface of the printed circuit board, the pads Corresponding to the contact electrode on the surface with the electronic component adhered, the printed steel sheet has at least one trapezoidal opening, and corresponding to the pads, a conductive adhesive can be applied to the pad through the trapezoidal opening. 2. Ruo Shen_ The printed steel plate of the first item of the patent scope, wherein the trapezoidal openings are arranged in two rows, and each of the trapezoidal openings has a short side and a long side parallel to each other. The short side of one is closer to the trapezoidal opening of the other line φ, and the long side is farther from the trapezoidal opening of the other line. -3. For the printed steel sheet in the scope of patent application, the short side of the trapezoidal opening is about 3.2 ~ 8.4 mil, and the long side is about 8 ~ 14 mil. ‘4. For example, the printed steel sheet in the scope of patent application No. 2 wherein the length of the short side of the trapezoidal opening is approximately 2/5 to 3/5 of the length of the long side. 5. As for the printed steel sheet in the scope of patent application item 2, in each row of the trapezoidal openings, the distance between each trapezoidal opening and the portion of the trapezoidal opening in another row is larger than that of each trapezoidal opening and the distance from the other row. The pitch of the trapezoidal opening. 6. If the printed steel sheet in the scope of patent application No. 2, each row of the ladder

第16頁 577249 六、申請專利範圍形開口區分為第一梯形開ΰ ，係位於所述每一行梯形開口的兩端，第一梯形開口的長邊係鄰近於另一行梯形開口，第一梯形開口的短邊則遠離於另一行該梯形開口，第二梯形開口，係位於所述第一梯形開口之間，該第二梯形開口的短邊鄰近於另一行該梯形開口，該第二梯形開口的長邊則遠離f另一行該梯形開口。 7. 如申請專刹範圍第6項之印刷鋼板，其中上述第一梯形開口並具有不互相平行之一直邊與一斜邊，該斜邊係較遠離同一行中之該第二梯形開口，該直邊則較接近同一行中之該第二梯形開口，且該直邊的延伸方向係垂直於該行梯形開口的排列方向。 8. 一種印刷鋼板，係應用於表面黏著電子零件其表面黏著製程，其中在一印刷電路板上具有數個銲墊，用來與該無延伸腳電子零件之數個電極連結，該印刷鋼板上具有數個開口，當該印刷鋼板覆蓋於該印刷電路板上時，正好曝露出該些銲墊表面，以便塗佈導電黏膠於該些銲墊上，該印刷鋼板上之該數個開口係排列成彼此平行的兩行，其中每一行該開口區分為第一梯形開口，係位於所述每一行開口的兩端，每一個該第一梯形開口具有互相平行的第一短邊與第一長邊，該第一長邊鄰近於另一行開口，而該第一短邊則遠離於該另’一行Page 16 577249 6. The patent application scope is divided into first trapezoidal slits, which are located at the two ends of each row of trapezoidal openings. The long side of the first trapezoidal opening is adjacent to another row of trapezoidal openings, and the first trapezoidal opening. The short side of the second trapezoidal opening is located between the first trapezoidal opening and the second trapezoidal opening is located between the first trapezoidal opening and the second trapezoidal opening. The long side is far away from the trapezoidal opening on the other line. 7. If the printed steel plate for item 6 of the special brake application is applied, wherein the first trapezoidal opening has a straight side and a hypotenuse that are not parallel to each other, the hypotenuse is farther away from the second trapezoidal opening in the same row. The straight edge is closer to the second trapezoidal opening in the same row, and the extending direction of the straight edge is perpendicular to the arrangement direction of the trapezoidal opening in the row. 8. A printed steel plate, which is applied to the process of surface adhesion of electronic parts, wherein a printed circuit board has several pads for connecting with electrodes of the non-extended leg electronic parts, There are several openings. When the printed steel plate covers the printed circuit board, the surfaces of the pads are just exposed, so that conductive adhesive is coated on the pads. The openings on the printed steel plate are arranged. In two rows parallel to each other, each row of the opening is divided into first trapezoidal openings, which are located at two ends of each row of the openings. Each of the first trapezoidal openings has a first short side and a first long side parallel to each other , The first long side is adjacent to the other row of openings, and the first short side is away from the other row

第17頁 577249 六、申請專利範圍開口，第二梯形開口，係位於所述第一梯形開口之間，每一個該第二梯形開口具有互相平行的第二短邊與第二長邊，該第二短邊鄰近於另一行開口，而該第二長邊則遠離於該另一行開口。 9 ·如申請專利範圍第8項之印刷鋼板，其中上述第一梯形開口之該第一短邊約為7. 5〜1 2. 5 m i 1，該第一長邊約為 11. 5〜16. 5 mi卜‘ 10. 如申請專利範圍第8項之印刷鋼板，其中上述第二梯形.開口之該第二短邊長度，大約為該第二長邊長度的 2/5〜3/5 ° 11. 如申請專利範圍第8項之印刷鋼板，其中上述第二梯形開口之該第二短邊約為3. 2〜8. 4 m i 1，該第二長邊約為 8 〜14 mil。 12. 如申請專利範圍第8項之印刷鋼板，其中上述第一梯形開口並具有第一直邊與第一斜邊，該第一斜邊係較遠離同一行中之該第二梯形開口，該第一直邊係較接近同一行中之該第二梯形開口，該第一直邊的延伸方向係平行於該行梯形開口的排列方向。Page 17 577249 VI. Patent application openings, second trapezoidal openings are located between the first trapezoidal openings, and each of the second trapezoidal openings has a second short side and a second long side parallel to each other. The two short sides are adjacent to the other row of openings, and the second long side is away from the other row of openings. 9 · If the printed steel sheet of the scope of application for the patent No. 8 item, wherein the first short side of the first trapezoidal opening is about 7. 5 ~ 1 2. 5 mi 1, the first long side is about 11. 5 ~ 16 5 mi Bu '10. If the printed steel sheet of the scope of patent application No. 8 wherein the second trapezoid. The length of the second short side of the opening is about 2/5 ~ 3/5 of the length of the second long side 11. For example, the printed steel sheet of the scope of the patent application No. 8, wherein the second short side of the second trapezoidal opening is about 3.2 to 8. 4 mi 1, and the second long side is about 8 to 14 mil. 12. For the printed steel sheet of the scope of application for patent No. 8, wherein the first trapezoidal opening has a first straight edge and a first hypotenuse, the first hypotenuse is farther from the second trapezoidal opening in the same row, the The first straight edge is closer to the second trapezoidal opening in the same row, and the extending direction of the first straight edge is parallel to the arrangement direction of the trapezoidal opening in the row.

第18頁 577249 六、申請專利範圍 1 3. —種將表面黏著電子零件以表面黏著技術（SMT)組裝於一印刷電路板上之方法，其中該表面黏著電子零件底部具有分別排列成兩行的複數個電極，該些電極包括了位於每一行兩端的第一電極、以及位於兩個該端電極之間的第二電極，該方法至少包括下列步驟：提供一印刷電路板，在該印刷電路板上具有複數個銲墊，正好各自對應於該表面黏著電子零件之該複數個電極， \ 該複數個銲墊亦排列成兩行，包括了位於每一行兩端之第一銲墊、以及位於兩’個該第一銲墊之間的第二銲墊；塗佈導電黏膠層於每一個該銲墊上，其中塗佈於該第一銲墊上之第一導電黏膠層具有梯形外觀，且每一個該第一導電黏膠層具有互相平行的第一短邊與第一長邊，該第一長邊鄰近於另一行該銲墊，而該第一短邊則遠離於該另一行銲墊，其中塗佈於該第二銲墊上之第二導電黏膠層具有梯形外觀，且每一個該第二導電黏膠層具有互相平行的第二短邊與第二長邊，該第二短邊鄰近於該另一行銲墊，而該第二長邊則遠離於該另一行銲墊；及將該表面黏著電子零件放置於該印刷電路板上，並使每一個該電極碰觸對應之該導電黏膠層。 1 4.如申請專利範圍第1 3項之方法，更包括：進行迴銲程序將表面黏著電子零件固定於該印刷電路板上0Page 18 577249 VI. Application for Patent Scope 1 3. —A method for assembling surface-attached electronic parts on a printed circuit board by surface adhesion technology (SMT), wherein the bottom of the surface-attached electronic parts are arranged in two rows respectively. A plurality of electrodes, the electrodes including a first electrode located at both ends of each row, and a second electrode located between the two end electrodes, the method includes at least the following steps: providing a printed circuit board on the printed circuit board There are a plurality of pads on the surface, each of which corresponds to the plurality of electrodes with electronic components adhered to the surface. The plurality of pads are also arranged in two rows, including the first pads at the ends of each row, and two A second pad between the first pads; a conductive adhesive layer is coated on each of the pads, wherein the first conductive adhesive layer coated on the first pads has a trapezoidal appearance, and each One of the first conductive adhesive layers has a first short side and a first long side parallel to each other, the first long side is adjacent to another row of the bonding pads, and the first short side is far from the other row. A row of pads, wherein the second conductive adhesive layer applied on the second pad has a trapezoidal appearance, and each of the second conductive adhesive layers has a second short side and a second long side that are parallel to each other. Two short sides are adjacent to the other row of pads, and the second long side is away from the other row of pads; and the surface-attached electronic parts are placed on the printed circuit board, and each of the electrodes touches correspondingly The conductive adhesive layer. 1 4. The method according to item 13 of the scope of patent application, further comprising: performing a reflow process to fix the surface-attached electronic parts on the printed circuit board. 0

第19頁 577249 六、申請專利範Ίϋ 1 5 ·如申請專利範圍第1 3項之方法，其中在上述塗佈導電黏膠層於該辉墊上之前，更包括：覆蓋一印刷鋼板於該印刷電路板上，其中該印刷鋼板上具有數個開口，正好曝露出該些鮮墊表面。 16. 如申請專利範圍第1 3項之方法，其中上述印刷鋼板之該數個開口/系排列成彼此平行的兩行，其中每一行該開口區分為Page 19 577249 VI. Application for Patent Application Ίϋ 15 · The method according to item 13 of the patent application scope, wherein before applying the conductive adhesive layer on the glow pad, further includes: covering a printed steel plate on the printed circuit On the board, the printed steel plate has several openings, which just expose the surfaces of the fresh pads. 16. For the method according to item 13 of the scope of patent application, wherein the openings / systems of the printed steel plate are arranged in two rows parallel to each other, and the openings in each row are divided into

第一梯形開口 ’，係位於所述每一行開口的兩端，每一個該第一梯形開口具有互相平行的第一短邊與第一長邊，該第一長邊鄰近於另一行開口，而該第一短邊則遠離於該另一行開口，第二梯形開口，係位於所述第一梯形開口之間，每一個該第二梯形開口具有互相平行的第二短邊與第二長邊，該第二短邊鄰近於另一行開口，而該第二長邊則遠離於該另一行開口。The first trapezoidal opening is located at two ends of each row of openings. Each of the first trapezoidal openings has a first short side and a first long side parallel to each other, and the first long side is adjacent to another row of openings, and The first short side is far from the other row of openings, and the second trapezoidal opening is located between the first trapezoidal openings, and each of the second trapezoidal openings has a second short side and a second long side parallel to each other, The second short side is adjacent to the other row of openings, and the second long side is away from the other row of openings.

17. 如申請專利範圍第1 3項之方法，其中上述第二導電黏膠層梯形開口之該第二短邊長度，大約為該第二長邊長度的 2/5〜3/5 。 18. 如申請專利範圍第1 3項之方法，其中上述第一導電黏膠層會曝露出該第一銲墊内側的部份邊線區域。17. The method according to item 13 of the scope of patent application, wherein the length of the second short side of the trapezoidal opening of the second conductive adhesive layer is approximately 2/5 ~ 3/5 of the length of the second long side. 18. The method according to item 13 of the patent application scope, wherein the first conductive adhesive layer will expose a part of the edge area on the inner side of the first pad.

第20頁 577249 六、申請專利範圍 - 19.如申請專利範圍第15項之方法，其中上述第一導電黏膠層與該第二導電黏膠層之間距，會大於該第一銲墊與該第二銲墊之間距。 2 0. —種印刷電路板，包括：複數個銲墊，其排列成兩行；一表面黏著電子零件，其具有複數個排列成兩行的電 \ 極，且各該等電極的位置係對應該等銲墊的位置；以及 · 複數個銲錫層，其排列成兩行以分別連接該等銲墊與該等電極，其中在每一行該銲錫層中，各銲錫層較鄰近於另一 φ 行該銲錫層部份的間距，係大於各銲錫層較遠離於另一行該-銲錫層部份的間距。 · 21.如申請專利範圍第2 0項所述之印刷電路板，其中每 ^ 一行的銲錫層可區分為 - 第一導電黏膠層，係位於所述每一行銲錫層的兩端，且各第一導電黏膠層較接近另一行導電黏膠層的部份的寬度係大於較遠離另一行導電黏膠層的部份的寬度，第二導電黏膠層，係位於該等第一銲錫層之間，且各第二導電黏膠層較接近另一行導電黏膠層的部份的寬度係小於鲁較遠離另一行導電黏膠層的部份的寬度。Page 20 577249 6. Scope of patent application-19. For the method of the 15th scope of patent application, the distance between the first conductive adhesive layer and the second conductive adhesive layer will be greater than the distance between the first pad and the The distance between the second pads. 2 0. A printed circuit board comprising: a plurality of pads arranged in two rows; an electronic part adhered to the surface having a plurality of electrodes arranged in two rows; The positions of the pads should be waited for; and · a plurality of solder layers arranged in two rows to connect the pads and the electrodes, respectively, wherein in each row of the solder layer, each solder layer is closer to another φ row The distance between the solder layer portions is larger than the distance between each solder layer and the distance from the other solder layer portion. · 21. The printed circuit board as described in item 20 of the scope of patent application, wherein the solder layer of each ^ row can be divided into-a first conductive adhesive layer, which is located at both ends of the solder layer of each row, and each The width of the portion of the first conductive adhesive layer that is closer to the other conductive adhesive layer is greater than the width of the portion that is further away from the other conductive adhesive layer. The second conductive adhesive layer is located on the first solder layers. The width of the portion of each second conductive adhesive layer closer to the other conductive adhesive layer is smaller than that of the portion of the second conductive adhesive layer that is further away from the other conductive adhesive layer.

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