TW569415B

TW569415B - Routing layout of multi-layer metal lines

Info

Publication number: TW569415B
Application number: TW91135884A
Authority: TW
Inventors: Tzong-Shi Jan
Original assignee: Taiwan Semiconductor Mfg
Priority date: 2002-12-11
Filing date: 2002-12-11
Publication date: 2004-01-01
Also published as: TW200410387A

Abstract

A routing layout of multi-layer metal lines is disclosed. In the routing layout, one layer of metal lines is set vertically, and the other layers of metal lines are stacked and set horizontally, and between every two stacked metal lines there is a channel reserved. Then, vias or contact holes are put on the channel between every two stacked metal lines, thereby reducing the area of the routing layout.

Description

569415 五、發明說明（1) 發明所屬之技術領域：本發明係有關於一種多層金屬線之繞線佈局（R 〇 u t i n g Layout)，特別是有關於一種具有可降低繞線佈局面積並提升元件操作速度之多層金屬線的繞線佈局。先前技術：請同時參照第1圖至第3圖’其中第1圖係、緣示f知多層金屬之繞線佈爲的上視圖，第2圖係繪示沿第1圖之剖面線I - I 所獲得之别面圖，而第3圖則係繪尹沿第1圖之剖面線Π -Π 所獲得之剖面圖。在此多層金屬之繞線佈局1 0 0中’共有六層金屬，第一層之第一金屬線10 2與第二層之第二金屬線 1 0 4之間由絶緣層11 4隔開’第"一層之第·一金屬線10 4與第二層之第三金屬線1 0 6之間由絕緣層11 6隔開’第三層之第三金屬線1 0 6與第四層之第四金屬線$之間由絕緣層1 1 8隔開，第四層之第四金屬線1 0 8與第五層之第五金屬線1 1 0之間由絕緣層12 0隔開’而第五層之第五金屬線110與第六層之第六金廣線11 2之間則由絕緣層1 22所隔開。另外，每二條第一金廣線1 0 2之間由絕緣材料1 0 3所隔開，每二條第二金屬線1 0 4之間由絕緣材料1 0 5隔開’每二條第三金屬線1 0 6 之間由絕緣材料1 0 7隔開，每二條第四金屬線1 0 8之間由絕緣材料1 〇 9所隔開’每二條第五金屬線11 〇之間由絕緣材料 111隔開，真每二條第六金屬線112之間由絕緣材料113所隔開。其中，所有之第一金屬線1 0 2互相平行，所有之第二金屬線1 0 4互相平行’所有之第三金屬線1 0 6互相平行，所有之第四金屬線10 8互相平行，所有之第五金屬線11 〇互相平569415 V. Description of the invention (1) The technical field to which the invention belongs: The present invention relates to a winding layout of a multilayer metal wire, and more particularly to a device having a layout area capable of reducing the winding and improving component operation. Winding layout of multi-layer metal wires of speed. Prior art: Please refer to Figs. 1 to 3 at the same time, wherein Fig. 1 is a top view of the winding cloth of the multilayer metal, and Fig. 2 is a section line I along the line 1- I obtained a different view, and Figure 3 is a sectional view obtained by Yin along the section line Π -Π of Figure 1. In this multi-layer metal winding layout 100, 'there are six layers of metal, the first metal line 102 of the first layer and the second metal line 104 of the second layer are separated by the insulating layer 11 4' The first " first metal wire 10 4 of the first layer and the third metal wire 1 0 6 of the second layer are separated by an insulating layer 11 6 'the third metal wire 10 6 of the third layer and the fourth metal wire of the fourth layer The fourth metal wires $ are separated by an insulating layer 1 1 8, the fourth metal wires 108 of the fourth layer and the fifth metal wires 1 10 of the fifth layer are separated by an insulating layer 120. The fifth metal wire 110 in the fifth layer and the sixth gold-wire 112 in the sixth layer are separated by an insulating layer 12. In addition, every two first Jin-Guang lines are separated by an insulating material 103, and every two second metal wires are separated by an insulating material 1 0,5 every two third metal wires. 1 0 6 are separated by an insulating material 10 7, and every two fourth metal wires 10 8 are separated by an insulating material 1 0 9 'Every two fifth metal wires 11 0 are separated by an insulating material 111 On, every two sixth metal wires 112 are separated by an insulating material 113. Among them, all the first metal wires 102 are parallel to each other, all the second metal wires 104 are parallel to each other, all the third metal wires 106 are parallel to each other, all the fourth metal wires 108 are parallel to each other, all Fifth metal wire 11 〇 flat with each other

569415 五、發明說明（2) 行以及所有之第六金屬線1 1 2互相平行。569415 5. Description of the invention (2) The row and all sixth metal wires 1 1 2 are parallel to each other.

此外，第三金屬線1 0 6堆疊於第一金屬線1 0 2上方，第五金屬線11 0堆疊於第三金屬線1 0 6以及第一金屬線1 0 2上方，而第四金屬線108堆疊於第二金屬線104上方，第六金屬線1 12 則堆疊於第四金屬線1 0 8以及第二金屬線1 0 4之上方。也就是說，第一金屬線102、第三金屬線106、以及第五金屬線 110彼此平行，而第二金屬線104、第四金屬線108、以及第六金屬線11 2彼此平行。另一方面，第一金屬線102、第三金屬線106、以及第五金屬線110與第二金屬線104、第四金屬線1 0 8、以及第六金屬線11 2互相垂直。In addition, the third metal line 106 is stacked above the first metal line 102, the fifth metal line 110 is stacked above the third metal line 106 and the first metal line 102, and the fourth metal line 108 is stacked on the second metal line 104, and the sixth metal line 1 12 is stacked on the fourth metal line 108 and the second metal line 104. That is, the first metal line 102, the third metal line 106, and the fifth metal line 110 are parallel to each other, and the second metal line 104, the fourth metal line 108, and the sixth metal line 112 are parallel to each other. On the other hand, the first metal line 102, the third metal line 106, and the fifth metal line 110 are perpendicular to the second metal line 104, the fourth metal line 108, and the sixth metal line 112.

當要在兩元件間進行第一訊號的傳遞時，若其中一元件之第一訊號係由第一層之第一金屬線10 2的其中一條所傳遞，而另一元件之第一訊號係由第四層之第四金屬線10 8的其中一條所傳遞，則先需在此條第四金屬線1 0 8下方之絕緣層 11 8中設置導電插塞1 2 4，以電性連接第四金屬線1 0 8與第三金屬線106。接著，於第三金屬線106下方與第二金屬線104 上方之絕緣層11 6中設置導電插塞1 2 6，以電性連接第三金屬線106與第二金屬線104。然後，於此第二金屬線104下方之絕緣層11 4中設置導電插塞1 28，來電性連接第二金屬線 1 0 4與第一金屬線102，而形成如第4圖所示之結構。如此一來，這兩個元件間之第一訊號的傳遞即可透過上述電性連接之第四金屬線108、導電插塞124、第三金屬線106、導電插塞126、第二金屬線104、導電插塞128、以及第一金屬線 10 2來達成。When the first signal is to be transmitted between two elements, if the first signal of one element is transmitted by one of the first metal wires 102 of the first layer, and the first signal of the other element is transmitted by If one of the fourth metal wires 10 8 of the fourth layer is transmitted, a conductive plug 1 2 4 needs to be provided in the insulating layer 11 8 below the fourth metal wire 108 to electrically connect the fourth Metal wire 108 and third metal wire 106. Next, conductive plugs 1 2 6 are disposed in the insulating layer 116 below the third metal line 106 and above the second metal line 104 to electrically connect the third metal line 106 and the second metal line 104. Then, a conductive plug 1 28 is provided in the insulating layer 11 4 below the second metal line 104, and the second metal line 104 and the first metal line 102 are electrically connected to form a structure as shown in FIG. 4. . In this way, the transmission of the first signal between the two components can pass through the fourth metal wire 108, the conductive plug 124, the third metal wire 106, the conductive plug 126, and the second metal wire 104 electrically connected as described above. , A conductive plug 128, and a first metal wire 102.

第6頁 569415Page 6 569415

然而，若中一元件產生短路遞。當碰金屬線上除，並從成短路的會造成短是，這樣失，增加操作速度發明内容第4圖所緣示的這格笛― 之第- ％ % # 條第二金屬線106係用以傳遞其您笫一訊唬時，就會導致 ,而無法成功地谁耔笙甙现/、弟一 a唬間 _ ϋ? 進仃第一訊號與第二訊號的傳到此種狀況時，由於雪 ,RE! tL 4 田於電性連接用的插塞係製作在 '、必須先將導電插塞124與導電插塞126移 =眾多第三金屬線1〇6中選出另一條不會造屬、線Μ6,㈣整個的訊號繞線跳至這條不 2的第三金屬線106上，才得以有效傳遞訊號。但 =線方式不僅會造成整個繞線佈局面積的損繞線佈局面積，更因繞線距離變長而導致元件之下降，嚴重影響元件性能。 =上述習知冑介層冑或接冑窗設置在金 =繞線佈局，會造成佈局面積的損失，丄繞。印加’進而影響元件之操作速度。 =:本發明的…的…是在提供一種多層金屬線繞線佈局，係將其中一層金屬線與其他各層之堆疊金屬線呈垂直擺設，再於每兩條堆疊金屬線之間設置一條通道’而將介層窗或接觸窗設置於這些通道上。由於介層窗或接觸窗並不位於金屬線上，因此可避免佈局面積的損失’縮減繞線面積。 =發明之再一目的就是因為本發明之多層金屬線的繞線佈局係將介層窗或接觸窗設置於每兩條堆疊金屬線之間的通道上，因此可有效縮減繞線面積，進而提升元件之操作速However, if a short circuit occurs in the middle element. When it touches a metal wire, it will cause a short circuit if it is short-circuited. This will increase the operating speed. The content of this grid flute shown in Figure 4 is the--%% # second metal wire 106 is used to When you pass a message, it will lead to you, and you ca n’t succeed. Who ca n’t succeed? / Di Yi a 唬 _ ϋ? When the first signal and the second signal are transmitted to such a situation, because Snow, RE! TL 4 Tian Yu's plug for electrical connection is made in ', must first move the conductive plug 124 and conductive plug 126 = a number of third metal wires 106 to choose another non-generating , Line M6, the whole signal is wound and jumped to the third metal line 106 which is not 2, so that the signal can be effectively transmitted. However, the wire method not only causes damage to the entire winding layout area, but also reduces the component due to the longer winding distance, which seriously affects the performance of the component. = The above-mentioned conventional interface layer or connection window is set in gold = winding layout, which will cause loss of layout area and linger. Inca 'further affects the operating speed of the component. =: The ... of the present invention is to provide a multilayer metal wire winding layout, in which one layer of metal wires and the stacked metal wires of other layers are arranged vertically, and a channel is provided between each two stacked metal wires. Vias or contact windows are provided on these channels. Since the vias or contact windows are not located on the metal lines, the loss of the layout area can be avoided 'and the winding area can be reduced. = Another purpose of the invention is because the winding layout of the multilayer metal wire of the present invention is to place a via or a contact window on the channel between each two stacked metal wires, so the winding area can be effectively reduced, and the lift can be improved. Operating speed of components

569415 五、發明說明（4) 度。根據以上所述之目的，本發明更提供了一種多層金屬線之繞線佈局，用以連接複數個元件之複數個訊號線，且此多層金屬線之繞線佈局至少包括：複數個第一金屬線層，其中每一個第一金屬線層至少包括互相平行之複數個第一金屬線，且每一個第一金屬線層之第一金屬線與其餘之第一金屬線層中之第一金屬線相互堆疊；一第二金屬線層，其中此第二金屬線層至少包括互相平行之複數個第二金屬線，而這些第二金屬線與上述之第一金屬線垂直，且此第二金屬線層與上述之第一金屬線層堆疊；複數個通道分別位於這些第一金屬線層之每二條第一金屬線旁；以及複數個介層窗位於這些通道上，其中這些介層窗可例如為多層堆昼介層窗而暴露出部分之第二金屬線。其中，上述之第二金屬線層可堆疊於上述之第一金屬線層上方、下方、或中間。而且，上述之介層窗中更具有導電插塞，可電性連接上述之第二金屬線。另外，在此多層金屬線之繞線佈局中更包括有複數個連接線位於上述之第一金屬線層中，藉以分別電性連接第一金屬線以及位於介層窗中之導電插塞，並可分別透過上述之導電插塞電性連接第一金屬線與第二金屬線，而將上述之元件之訊號線連接起來。連接元件之訊號線時，可根據訊號線之佈局，在一元件訊號線所處之第一金屬線層的第一金屬線與此第一金屬線旁之介層窗中的導電插塞之間，設置連接線，即可將此訊號569415 V. Description of invention (4) Degree. According to the above purpose, the present invention further provides a winding layout of a multilayer metal wire for connecting a plurality of signal lines of a plurality of components, and the winding layout of the multilayer metal wire includes at least: a plurality of first metals A wire layer, wherein each first metal wire layer includes at least a plurality of first metal wires parallel to each other, and the first metal wire of each first metal wire layer and the first metal wires in the remaining first metal wire layers Stacked on each other; a second metal line layer, wherein the second metal line layer includes at least a plurality of second metal lines parallel to each other, and the second metal lines are perpendicular to the first metal line, and the second metal line Layers are stacked with the first metal line layer described above; a plurality of channels are located beside each of the two first metal lines of the first metal line layers; and a plurality of via windows are located on the channels, where the via windows may be, for example, The multi-layer stacking dielectric layer window exposes part of the second metal wire. The second metal line layer may be stacked above, below, or in the middle of the first metal line layer. Moreover, the above-mentioned interlayer window further has a conductive plug, which can be electrically connected to the above-mentioned second metal line. In addition, the winding layout of the multi-layer metal wire further includes a plurality of connecting wires located in the first metal wire layer, so as to electrically connect the first metal wires and the conductive plugs in the interlayer window respectively, and The first metal line and the second metal line can be electrically connected through the above-mentioned conductive plugs, respectively, and the signal lines of the above components can be connected together. When connecting the signal lines of the component, according to the layout of the signal line, between the first metal line of the first metal line layer where a component signal line is located and the conductive plug in the interlayer window next to the first metal line , Set the cable, you can get this signal

第8頁 569415 五、發明說明（5) 線所處之第一金屬線與另一元件訊號線所處之第二金屬線層上的第二金屬線與以電性連接。由於本發明之多層金屬線之繞線佈局的介層窗並不位於金屬線上，因此不需為防止短路而進行跳線處理，而可縮短繞線距離，進而縮小繞線面積，達到縮減佈局面積以及提升元件操作速度的目的。實施方式· 本發明揭露一種多層金屬線之繞線佈局，具有縮減繞線佈局面積以及縮短繞線距離等優勢，並可提升元件之操作性能。為了使本發明之敘述更加詳盡與完備，可參照下列描述並配合第5圖至第8圖之圖示。請一併參照第5圖至第7圖，其中第5圖係繪示本發明之一較佳實施例之多層金屬的繞線佈局上視圖，第6圖係繪示沿第 5圖之剖面線Π -皿所獲得之剖面圖，而第7圖則係繪示沿第 5圖之剖面線IV -IV所獲得之剖面圖。在本發明之多層金屬的繞線佈局200中，共有六層金屬，第一層之第一金屬線 2 0 2與第二層之第二金屬線2 0 4之間由絕緣層2 1 4隔開，第二層之第二金屬線2 0 4與第三層之第三金屬線2 0 6之間由絕緣層21 6隔開，第三層之第三金屬線20 6與第四層之第四金屬線2 0 8之間由絕緣層2 1 8隔開，第四層之第四金屬線2 0 8與第五層之第五金屬線2 1 0之間由絕緣層2 2 0隔開，而第五層之第五金屬線2 1 0與第六層之第六金屬線2 1 2之間則由絕緣層 2 2 2所隔開。另外，每二條第一金屬線2 0 2之間由絕緣材料 2 0 3所隔開，每二條第二金屬線2 04之間由絕緣材料2 0 5隔Page 8 569415 V. Description of the invention (5) The first metal line where the line is located and the second metal line where the signal line of another component is located are electrically connected to the second metal line on the layer. Since the interlayer window of the winding layout of the multilayer metal wire of the present invention is not located on the metal wire, there is no need to perform jumper processing to prevent short circuit, but the winding distance can be shortened, thereby reducing the winding area and reducing the layout area. And the purpose of increasing the speed of component operation. Embodiments · The present invention discloses a winding layout of a multilayer metal wire, which has the advantages of reducing the layout area of the winding and shortening the winding distance, and can improve the operability of the component. In order to make the description of the present invention more detailed and complete, reference may be made to the following descriptions in conjunction with the diagrams in FIGS. 5 to 8. Please refer to FIG. 5 to FIG. 7 together, where FIG. 5 is a top view of a winding layout of a multilayer metal according to a preferred embodiment of the present invention, and FIG. 6 is a cross-section line along FIG. 5 The cross-sectional view obtained by Π-plate, and FIG. 7 shows the cross-sectional view obtained along section line IV-IV of FIG. 5. In the multilayer metal winding layout 200 of the present invention, there are a total of six layers of metal. The first metal wire 2 0 2 of the first layer and the second metal wire 2 0 4 of the second layer are separated by an insulating layer 2 1 4 On, the second metal wire 2 0 4 of the second layer and the third metal wire 2 0 6 of the third layer are separated by an insulating layer 21 6, and the third metal wire 20 6 of the third layer and the fourth layer The fourth metal lines 2 0 8 are separated by an insulating layer 2 1 8, and the fourth layer of the fourth metal lines 2 0 8 and the fifth layer of the fifth metal lines 2 1 0 are separated by an insulating layer 2 2 0 On, and the fifth metal line 2 10 in the fifth layer and the sixth metal line 2 1 2 in the sixth layer are separated by an insulating layer 2 2 2. In addition, every two first metal wires 2 0 2 are separated by an insulating material 2 0 3, and every two second metal wires 2 04 are separated by an insulating material 2 0 5

JO 外 i：) 五、發明說明~^-------- 開，每二條笛一條第四金屬唆屬線206之間由絕緣材料207隔開，每二金屬線2lt；P^8之間由絕緣材料209所隔開，每二條第五之間由絕緣^ ^緣材料211隔開，每二條第六金屬線212 互相平行213所隔開。其中，所有之第一金屬線202 屬線20 6互相平，之第一金屬線204互相平行，所有之第三金之第五金屬線，所有=第四金屬線208互相平行，所有平行。 "互相平行’且所有之第六金屬線21 2互相此外，第= 屬線堆疊^線2〇6堆叠於第二金屬線204上方，第四金第四金屬線2nR^二金屬線2〇6上方，第五金屬線210堆疊於線210上方。介方，而第六金屬線21 2則堆疊於第五金屬金屬線208、^即，第二金屬線2〇4、第三金屬線20 6、第四且互相平行。五^屬線2 1 0、以及第六金屬線2 1 2呈堆疊狀 204、第=厶^ 一方面’第一金屬線202與第二金屬線以及第六金線20 6、第四金屬線208、第五金屬線210、矛八金屬線212互相垂直。層、以Ϊίίΐ堆疊之第二層、第三層、第四層、第五 224 »也就是、m線中’每兩條金屬線旁更具有通道 224,如第5圈-每條第六屬線212旁就設置一個通道五金屬線21〇卜所不/由於每一條第六金屬線21 2皆堆疊在第線208上’每一二母一條第五金屬線210皆堆疊在第四金屬上，且每一你贫第四金屬線208皆堆疊在第三金屬線206 、、餘第三金屬線20 6皆堆疊在第二金屬線204上，因此通道224亦位於每兩條第五金屬線21〇、每兩條第四金JO 外 i :) V. Description of the invention ~ ^ -------- On, every fourth flute metal line 206 is separated by insulating material 207, every two metal lines 2lt; P ^ 8 They are separated by an insulating material 209, every two fifths are separated by an insulating edge material 211, and every two sixth metal wires 212 are separated by 213 parallel to each other. Among them, all the first metal wires 202 belong to the lines 20 6 are flat to each other, the first metal wires 204 are parallel to each other, all the third gold fifth wires, all = the fourth metal wires 208 are parallel to each other, all are parallel. " Parallel with each other 'and all the sixth metal wires 21 2 are mutually besides, the third metal line is stacked on the second metal line 204, and the fourth gold fourth metal line 2nR is second metal line 2. Above 6, the fifth metal line 210 is stacked above the line 210. And the sixth metal line 21 2 is stacked on the fifth metal line 208, that is, the second metal line 204, the third metal line 20 6, and the fourth are parallel to each other. The five metal lines 2 1 0 and the sixth metal line 2 1 2 are stacked 204, the first = ^^ On the one hand, the first metal line 202 and the second metal line and the sixth gold line 20 6 and the fourth metal line 208. The fifth metal wire 210 and the spear metal wire 212 are perpendicular to each other. Layer, the second layer, the third layer, the fourth layer, and the fifth 224 that are stacked in a row, that is, there is a channel 224 beside each of the two metal lines in the m line, such as the fifth circle-each sixth genus There is a channel next to the line 212. Five metal wires 21 are not used / because each sixth metal wire 21 2 is stacked on the second wire 208. 'Every two mothers and one fifth metal wire 210 are stacked on the fourth metal. And each of the fourth metal line 208 is stacked on the third metal line 206, and the remaining third metal lines 206 are stacked on the second metal line 204, so the channels 224 are also located on every two fifth metal lines 21〇, every two fourth gold

第10頁 569415 五、發明說明（7) 屬線2 0 8、每兩條第三金屬線2 〇 6、以及每兩條第二金 2 0 4旁。亦即，通道2 2 4係從第六層之第六金屬線2 1 2往第〜層之第二金屬線204的方向一直延伸，直至第二層之第一〜屬線2 0 4為止，如第7圖所示。一金請再次參照第5圖與第7圖，通道224上設置有多個介層窗 226,其中這些介層窗22 6為多層堆疊介層窗，也就是這些介層窗22 6從通道224上方的第六金屬線212所處之^ ’ 第一金屬線202所處之層的方向貫穿而過，直至暴露 ^ 之第一金屬線20 2為止。在這些介層窗226中填入導刀而形成導電插塞228,其中這些導電插塞228與介 ^ 暴露出之第一金屬線2 02電性連接。固^6所在兩元件之間’假設其中一元件之第一訊號係由第一第一金屬線2 02的其中一條所傳遞，而另一元件之清气係由第五層之第五金屬線21G的其中—條所傳遞。因:3 在：疋件間進打第-訊號的傳遞時，僅需將介* ^即可，如第7所示之結構，其中連接線230分別Ϊ = 金屬線210以及導電插塞228電性連接。於是，這兩、第五間之第一訊號即可透過此條第五金屬線21〇、連接線^件以及導電插塞22 8而達到有效的傳遞。 ύυ' 由於’導電插塞228係獨立於金屬線以外的區域，因訊號傳遞的需求’將所需之金屬線電性連接至導電插塞丁^ 上’相當方便且輕易，完全沒有跳線的困擾。因此，具有相當高的應用性，更可省下跳線所増加之繞線僅Page 10 569415 V. Description of the invention (7) Belonging to line 208, every two third metal lines 206, and every two second gold lines 204. That is, the channel 2 2 4 extends from the sixth metal line 2 1 2 of the sixth layer to the second metal line 204 of the first layer to the second metal line 204 until the first to the second line 2 0 4 of the second layer. As shown in Figure 7. Please refer to FIG. 5 and FIG. 7 again for a gold. The channel 224 is provided with a plurality of interlayer windows 226, wherein these interlayer windows 22 6 are multilayer stacked interlayer windows, that is, these interlayer windows 22 6 are from the channel 224 The direction of the upper layer where the sixth metal line 212 is located passes through the direction of the layer where the first metal line 202 is located, until the first metal line 202 is exposed. A conductive blade is filled in these interlayer windows 226 to form conductive plugs 228, wherein the conductive plugs 228 are electrically connected to the first metal wires 202 exposed by the dielectric. Between the two components where the solid 6 is located, it is assumed that the first signal of one component is transmitted by one of the first and first metal wires 202, and the clear gas of the other component is by the fifth metal wire of the fifth layer. 21G of which-the article passed. Because: 3 In the transmission of the-signal between the files, only need to pass * ^, as shown in the structure shown in Figure 7, where the connection line 230 = metal wire 210 and conductive plug 228 respectively Sexual connection. Therefore, the first signals of the two and the fifth rooms can be effectively transmitted through the fifth metal wire 21o, the connecting wire ^, and the conductive plug 228. ύυ 'Because' Conductive plug 228 is independent of areas other than metal wires, due to the need for signal transmission, it is very convenient and easy to electrically connect the required metal wire to the conductive plug Ding ^, and there is no jumper at all Troubled. Therefore, it has a very high applicability, and it can save the jumper and the winding only

569415 五、發明說明（8) " " -一" 達到縮減繞線面積的目的。 f本^明之較佳實施例中，雖然所有之介層窗為多層堆疊 "層窗’然本發明之介層窗亦可依訊號傳遞的其連通的區域。舉例而言，若在兩元件之間，假設其中一元件之第二訊號係由第一層金屬線的其中一條所傳遞，而另一元件之第二訊號係由第三層金屬線的其中一條所傳遞時’僅需使介層窗貫穿第三層至第一層之間的通道區域即可。569415 V. Description of the invention (8) " " -A " The purpose of reducing the winding area is achieved. f In the preferred embodiment of the present invention, although all the interlayer windows are multi-layer stacked " layer windows ", the interlayer windows of the present invention can also transmit their connected areas according to signals. For example, if between two components, it is assumed that the second signal of one component is transmitted by one of the first-layer metal wires, and the second signal of the other component is transmitted by one of the third-layer metal wires. It is only necessary to pass the via window through the channel area from the third layer to the first layer.

在此實施例中，雖然與堆疊之數層金屬線垂直之一金属線層係位於此堆疊之數層金屬線的下方，然，以上所述僅用以舉例說明’本發明並不在此限。在本發明中，與堆疊之數層金屬線垂直的金屬線可位於此堆疊之數層金屬線的上方，亦可位於此堆疊之數層金屬線之間。綜合以上所述，本發明之優點就是因為本發明之多層金屬線之繞線佈局的介層窗並不位於金屬線上，因此佈局彈性相當高，且沒有跳線的問題產生。因此，不僅可應用性極高，更可有效縮短繞線距離以及繞線面積，進而達到縮減佈局面積以及提升元件操作速度的目的。In this embodiment, although a metal line layer perpendicular to the stacked metal lines is located below the stacked metal lines, the above description is used for illustration only. The present invention is not limited thereto. In the present invention, the metal lines perpendicular to the stacked metal lines may be located above the stacked metal lines, or may be located between the stacked metal lines. To sum up, the advantage of the present invention is that the interlayer window of the winding layout of the multilayer metal wire of the present invention is not located on the metal wire, so the layout flexibility is quite high, and there is no problem of jumpers. Therefore, not only is the applicability extremely high, but also the winding distance and the winding area can be effectively shortened, thereby achieving the purpose of reducing the layout area and increasing the component operation speed.

如熟悉此技術之人員所瞭解的，以上所述僅為本發明之較佳實施例而已，姐并用以限定本發明之申請專利範圍；凡其它未脫離本發明所揭示之精神下所完成之等效改變或修飾，均應包含在下述之申請專利範圍内。As understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and it is used to limit the scope of patent application for the present invention; all other things that have been completed without departing from the spirit disclosed by the present invention Effective changes or modifications should be included in the scope of patent application described below.

第12頁 569415 圖式簡單說明本發明的較佳實施例已於前述之說明文字中辅以下列圖形做更詳細的闡述，其中：第1圖係緣示習知多層金屬之繞線佈局的上視圖；第2圖係繪示沿第1圖之剖面線I -1所獲得之剖面圖；第3圖係繪示沿第1圖之剖面線Π -Π所獲得之剖面圖；第4圖係繪示習知多層金屬於傳遞訊號時的繞線佈局剖面圖；第5圖係繪示本發明之一較佳實施例之多層金屬的繞線佈局上視圖；第6圖係繪示沿第5圖之剖面線瓜-皿所獲得之剖面圖；第7圖係繪示沿第5圖之剖面線IV -IV所獲得之剖面圖；以及第8圖係繪示本發明之一較佳實施例之多層金屬於傳遞訊號時的繞線佈局剖面圖。圖號對照說明： 100 繞線佈局 102 第一金屬線 103 絕緣材料 104 第二金屬線 105 絕緣材料 106 第三金屬線 107 絕緣材料 108 第四金屬線 109 絕緣材料 110 第五金屬線 111 絕緣材料 112 第六金屬線 113 絕緣材料 114 絕緣層 116 絕緣層 118 絕緣層 120 絕緣層 122 絕緣層Page 12 569415 The schematic illustration of the preferred embodiment of the present invention has been described in more detail in the preceding explanatory text with the following figures, where: Figure 1 shows the top of the conventional multi-layer metal winding layout View; Figure 2 is a sectional view taken along section line I -1 of Figure 1; Figure 3 is a sectional view taken along section line Π -Π of Figure 1; Figure 4 is FIG. 5 is a cross-sectional view of a winding layout of a conventional multilayer metal when transmitting a signal; FIG. 5 is a top view of a winding layout of a multilayer metal according to a preferred embodiment of the present invention; FIG. Fig. 7 is a cross-sectional view obtained from a melon-dish; Fig. 7 is a cross-sectional view obtained along the cross-section line IV-IV of Fig. 5; and Fig. 8 is a preferred embodiment of the present invention A cross-sectional view of the winding layout of a multilayer metal when transmitting a signal. Comparative drawing description: 100 winding layout 102 first metal wire 103 insulating material 104 second metal wire 105 insulating material 106 third metal wire 107 insulating material 108 fourth metal wire 109 insulating material 110 fifth metal wire 111 insulating material 112 Sixth metal wire 113 insulating material 114 insulating layer 116 insulating layer 118 insulating layer 120 insulating layer 122 insulating layer

569415569415

第14頁圖式簡單說明 124 導電插塞 126 導電插塞 128 導電插塞 200 繞線佈局 202 第一金屬線 203 絕緣材料 204 第二金屬線 205 絕緣材料 2 06 第三金屬線 207 絕緣材料 208 第四金屬線 209 絕緣材料 210 第五金屬線 211 絕緣材料 212 第六金屬線 213 絕緣材料 214 絕緣層 216 絕緣層 218 絕緣層 220 絕緣層 222 絕緣層 224 通道 226 介層窗 228 導電插塞 230 連接線Brief description of drawings on page 14 124 conductive plug 126 conductive plug 128 conductive plug 200 winding layout 202 first metal wire 203 insulating material 204 second metal wire 205 insulating material 2 06 third metal wire 207 insulating material 208 Four metal wires 209 Insulating material 210 Fifth metal wire 211 Insulating material 212 Sixth metal wire 213 Insulating material 214 Insulating layer 216 Insulating layer 218 Insulating layer 220 Insulating layer 222 Insulating layer 224 Channel 226 Intermediate window 228 Conductive plug 230 Connecting line

Claims

569415 六、申請專利範圍 1. 一種多層金屬線之繞線佈局（Routing Layout)，用以連接複數個元件之複數個訊號線，且該多層金屬線之繞線佈局至少包括：複數個第一金屬線層，其中每一該些第一金屬線層至少包括互相平行之複數個第一金屬線，且每一該些第一金屬線層之該些第一金屬線與其餘之該些第一金屬線層之該些第一金屬線相互堆疊；一第二金屬線層，其中該第二金屬線層至少包括互相平行之複數個第二金屬線，而該些第二金屬線與該些第一金屬線垂直，且該第二金屬線層與該些第一金屬線層堆疊；複數個通道分別位於該些第一金屬線層之每二個該些第一金屬線旁；以及複數個介層窗位於該些通道上。 2. 如申請專利範圍第1項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層上。 3. 如申請專利範圍第1項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層下。 4. 如申請專利範圍第1項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層之間。569415 6. Scope of patent application 1. A routing layout of a multilayer metal wire for connecting a plurality of signal lines of a plurality of components, and the routing layout of the multilayer metal wire includes at least: a plurality of first metals A wire layer, wherein each of the first metal wire layers includes at least a plurality of first metal wires parallel to each other, and the first metal wires of each of the first metal wire layers and the remaining of the first metal wires The first metal lines of the line layer are stacked on each other; a second metal line layer, wherein the second metal line layer includes at least a plurality of second metal lines parallel to each other, and the second metal lines and the first metal lines The metal lines are vertical, and the second metal line layer is stacked with the first metal line layers; a plurality of channels are respectively located beside each of the first metal lines of the first metal line layers; and a plurality of interlayers Windows are located on these passages. 2. The winding layout of the multilayer metal wire as described in item 1 of the scope of the patent application, wherein the second metal wire layer is stacked on the first metal wire layers. 3. The winding layout of the multilayer metal wire as described in item 1 of the scope of the patent application, wherein the second metal wire layer is stacked under the first metal wire layers. 4. The winding layout of the multilayer metal wire according to item 1 of the scope of the patent application, wherein the second metal wire layer is stacked between the first metal wire layers.

第15頁 569415 六、申請專利範圍範與利窗專層請介申些 j該 5 中其局佈線繞之線屬金層多之述所項 IX 第圍疊堆線屬金二第些該其局佈線繞之線屬金多之述所15 第圍第些該之分部出露利窗專層請介申些 j該 6 中線屬金所 i多頃 1¾個第數圍複範為利窗專層請介申些如該 7·中其局佈線繞之線屬金多之述窗層介疊堆層線屬金層多之述所至員J 1更第中圍窗範層利介專些請該申一如·每 8 中括少其局佈A I g 線lu 繞PI 之局佈線繞之線屬金層多之述所藉電，導中該層之線窗屬層金介一些第該些一該每於及位以線線項接屬办連金第個一圍數第範複些利括該專包接請少連申至性如更電 9 中以其接 *-ec 性電塞指電導該之。窗線層屬介金些二該第 1些每該過與透線別屬分金並一，第塞些插該 10.—種多層金屬線之繞線佈局，用以連接複數個元件之複數個訊號線，且該多層金屬線之繞線佈局至少包括：複數個第一鲞屬線層，其中每一該些第一金屬線層至少包括互相平行之複數個第一金屬線，且每一該些第一金屬線層之該些第一金屬線與其餘之該些第一金屬線層之該些第Page 15 569415 VI. Application scope of patents and special window special layers Please introduce some of the 5 lines in which the local wiring is more than the gold layer. IX The surrounding stacking line belongs to the second line in Jin Er. The wiring of the winding line belongs to Jin Duo's report. The first and second divisions of the department should have a special window. Please introduce some of the 6 center lines belonging to the Jinsuo i. Please refer to the application of the 7th in the local wiring winding line is Jinduo's description of the window layer interlayer stacking line is a description of the gold layer and more members J 1 more middle window window layer layer special introduction Please apply as follows: Every 8th, including the local AI g line, lu, PI, the local wiring, and the wiring, the wire is borrowed from the gold layer, and the wire window in this layer is a layer of gold. Some of these should be connected to the line by the line to connect the first line of the first round of the number of the compound to cover some of the benefits of this exclusive package, please apply for the connection, such as the more electricity 9 in its connection * -ec sex electricity Plug means conduct it. The layer of the window wire belongs to the intermediary metal, the first one is the same as the perforation line, and the first plugs are inserted into the 10.—a kind of multi-layer metal wire winding layout, which is used to connect a plurality of multiple components. Signal wires, and the winding layout of the multilayer metal wire includes at least: a plurality of first metal wire layers, wherein each of the first metal wire layers includes at least a plurality of first metal wires parallel to each other, and each The first metal lines of the first metal line layers and the first metal lines of the remaining first metal line layers

第16頁 569415 六、申請專利範圍一金屬線相互堆疊；一第二金屬線層，其中該第二金屬線層至少包括互相平行之複數個第二金屬線，而該些第二金屬線與該些第一金屬線垂直，且該第二金屬線層與該些第一金屬線層堆疊；複數個通道分別位於該些第一金屬線層之每二個該些第一金屬線旁；以及複數個多層堆疊介層窗位於該些通道上，且該些多層堆疊介層窗暴露出部分之該些第二金屬線。 11.如申請專利範圍第1 0項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層上。 1 2.如申請專利範圍第1 0項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層下。 1 3.如申請專利範圍第1 0項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層之間。 1 4.如申請專利範圍第1 0項所述之多層金屬線之繞線佈局，其中每一該些多層堆疊介層窗中更至少包括一導電插塞。 1 5.如申請專利範圍第1 4項所述之多層金屬線之繞線佈局，其中更至少包括複數個連接線位於該些第一金屬線層中，藉以電性連接該些第一金屬線以及每一該些多層堆疊介層Page 16 569415 6. The scope of the patent application: a metal wire is stacked on each other; a second metal wire layer, wherein the second metal wire layer includes at least a plurality of second metal wires parallel to each other, and the second metal wires and the The first metal lines are vertical, and the second metal line layer is stacked with the first metal line layers; a plurality of channels are respectively located beside each of the two first metal lines of the first metal line layers; and A plurality of stacked stacked vias are located on the channels, and the plurality of stacked stacked vias expose a portion of the second metal lines. 11. The winding layout of the multilayer metal wire according to item 10 of the scope of the patent application, wherein the second metal wire layer is stacked on the first metal wire layers. 1 2. The winding layout of the multilayer metal wire according to item 10 of the scope of the patent application, wherein the second metal wire layer is stacked under the first metal wire layers. 1 3. The winding layout of the multilayer metal wire according to item 10 of the scope of the patent application, wherein the second metal wire layer is stacked between the first metal wire layers. 14. The winding layout of the multilayer metal wires as described in item 10 of the scope of the patent application, wherein each of the multilayer stacked interlayer windows further includes at least one conductive plug. 15. The winding layout of the multilayer metal wire as described in item 14 of the scope of the patent application, which further includes at least a plurality of connection wires located in the first metal wire layers, thereby electrically connecting the first metal wires. And each of those multilayer stacked interposers

第17頁 569415 六、申請專利範圍窗之該導電插塞，並分別透過每一該些多層堆疊介層窗之該導電插塞電性連接該些第一金屬線與該些第二金屬線。 1 6 · —種多層金屬線之繞線佈局，用以連接複數個元件之複數個訊號線，且該多層金屬線之繞線佈局至少包括：複數個第一金屬線層，其中每一該些第一金屬線層至少包括互相平行之複數個第一金屬線，且每一該些第一金屬線層之該些第一金屬線與其餘之該些第一金屬線層之該些第一金屬線相互堆疊；一第二金屬線層，其中該第二金屬線層至少包括互相平行之複數個第二金屬線’而該些第二金屬線與該些第一金屬線垂直，且該第二金屬線層與該些第一金屬線層堆疊；複數個通道分別位於該些第一金屬線層之每二個該些第一金屬線旁；複數個多層堆疊介層窗位於該些通道上，且該些多層堆疊介層窗暴露出部分之該些第二金屬線；複數個導電插塞分別位於該些多層堆疊介層窗中，且該些導電插塞分別與該些第二金屬線電性連接；以及複數個連接線位於該些第一金屬線層中，藉以分別電性連接該些第一金屬線以及該些多層堆疊介層窗之該導電插塞，並分別透過該些導電插塞電性連接該些第一金屬線與該些第二金屬線。 17.如申請專利範圍第16項所述之多層金屬線之繞線佈局，Page 17 569415 6. Scope of patent application The conductive plugs of the windows are electrically connected to the first metal lines and the second metal lines through the conductive plugs of each of the multilayer stacked interlayer windows, respectively. 1 6 · A winding layout of a multilayer metal wire for connecting a plurality of signal lines of a plurality of components, and the winding layout of the multilayer metal wire includes at least: a plurality of first metal wire layers, each of which The first metal line layer includes at least a plurality of first metal lines parallel to each other, and the first metal lines of each of the first metal line layers and the first metals of the remaining first metal line layers Lines are stacked on each other; a second metal line layer, wherein the second metal line layer includes at least a plurality of second metal lines parallel to each other, and the second metal lines are perpendicular to the first metal lines, and the second A metal line layer is stacked with the first metal line layers; a plurality of channels are respectively located beside each of the first metal lines of the first metal line layers; a plurality of multilayer stacked vias are located on the channels, And the multilayer stacked interlayer windows expose a part of the second metal lines; a plurality of conductive plugs are respectively located in the multilayer stacked interlayer windows, and the conductive plugs are electrically connected to the second metal lines respectively; Sexual connection; and A plurality of connection lines are located in the first metal line layers, thereby electrically connecting the first metal lines and the conductive plugs of the multilayer stacked interlayer windows, and electrically connecting the conductive plugs through the conductive plugs, respectively. The first metal lines and the second metal lines. 17. The winding layout of the multilayer metal wire as described in item 16 of the scope of patent application,

第18頁 569415 六、申請專利範圍其中該第二金屬線層係堆疊於該些第一金屬線層上。 1 8 ·如申請專利範圍第1 6項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層下。 1 9.如申請專利範圍第1 6項所述之多層金屬線之繞線佈局，其中該第二金屬線層係堆疊於該些第一金屬線層之間。第19頁Page 18 569415 6. Scope of patent application Wherein the second metal line layer is stacked on the first metal line layers. 18 · The winding layout of the multilayer metal wire according to item 16 of the scope of the patent application, wherein the second metal wire layer is stacked under the first metal wire layers. 19 9. The winding layout of the multilayer metal wire according to item 16 of the scope of the patent application, wherein the second metal wire layer is stacked between the first metal wire layers. Page 19