TW568998B - Method and device for manufacturing positionable heat conductive tubes - Google Patents

Method and device for manufacturing positionable heat conductive tubes Download PDF

Info

Publication number
TW568998B
TW568998B TW92113298A TW92113298A TW568998B TW 568998 B TW568998 B TW 568998B TW 92113298 A TW92113298 A TW 92113298A TW 92113298 A TW92113298 A TW 92113298A TW 568998 B TW568998 B TW 568998B
Authority
TW
Taiwan
Prior art keywords
tube
copper
center rod
heat
copper tube
Prior art date
Application number
TW92113298A
Other languages
Chinese (zh)
Other versions
TW200426339A (en
Inventor
Jung-Shiung Lin
Original Assignee
Yeh Chiang Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yeh Chiang Technology Corp filed Critical Yeh Chiang Technology Corp
Priority to TW92113298A priority Critical patent/TW568998B/en
Application granted granted Critical
Publication of TW568998B publication Critical patent/TW568998B/en
Publication of TW200426339A publication Critical patent/TW200426339A/en

Links

Abstract

This invention relates to a method and device for manufacturing a positionable heat conductive tube, for working on a copper tube into a heat conductive tube having a uniform sintered layer. This invention is related to forming a plurality of protrusions on a surface of a central rod for making heat conductive tubes, where the protrusions are made by sintered powered with addition of organic bonding agent, such that after inserting the central rod into the copper tube, the contact between the protrusions and an inner wall of the copper tube align the central rod at a center of the copper tube. While subjecting the copper tube to sintering, the protrusions are able to detach from the central rod and integrate into the sintered layer. As such, upon drawing the central rod, a cylindrical hole and an even sintered layer are left in the copper center. The implementation of the method and device for manufacturing a positionable heat conductive tube eliminates problems found in conventional art, to obtain a heat conductive tube allowing even heat conduction and improved quality.

Description

568998 五、發明說明(1) (一)、【發明所屬之技術領域】 本發明係關於一種用於製造導熱管的制 具,特別是關於-種可製得均勻的導熱管二:方法及其製 法及其製具。 、 A…層之製程方 (一)、【先前技術】 隨著半導體晶片功能的整合化,運 展,使得晶片的發熱量亦大幅增加 ::朝高頻發 硬體’如硬式磁碟機,光碟機 :=统内部其它 此也會產生相當大的埶量, j 2円轉逮發展,因 系統内部溫度過高,:成熱’㈣使整個 於系統内硬體設備的壽命也有相當:損耗至-熱當機’對 種圓助系統散熱的裝s,包括-^, ^ M ^ ;;;'弟圖所示,此圓柱型導熱管係由易 2至f:成之氣密式柱狀導熱管100,導熱管100内部 氣體已事先抽出而呈現真空狀態,導熱管100内壁具有一 層由金屬粉末燒結而成的燒結層丨4,而導熱管丨〇〇中心則 留有一中空圓柱孔16,為了讓導熱效果更好,通常此種導 熱管100内部會注入-流體,且此流體利用毛細現象而佈 滿整個燒結層1 4 °當導熱管丨〇 〇底部或外壁吸收了孰量會 快速傳導至内部的燒結層14,佈滿燒結層14之流體吸收了 熱,並透過圓柱孔1 6蒸發至導熱管丨〇〇.頂部,再凝結於導 熱官1 0 0頂部,亚使熱量透過導熱管丨〇 〇頂部排出,釋放出 熱里的流體順著官壁流回底部,如此持續地循環將熱量排568998 V. Description of the invention (1) (1), [Technical field to which the invention belongs] The present invention relates to a tool for manufacturing a heat pipe, and in particular, to a kind of heat pipe that can be made uniform 2: Method and Manufacturing law and its manufacturing tools. , A ... layer process (1), [previous technology] With the integration of semiconductor chip functions, the development of the exhibition has caused a significant increase in the amount of heat generated by the chip :: towards the high-frequency hardware, such as hard disk drives, optical drives : = Others in the system will also generate a considerable amount of heat, j 2 円 turn to develop, because the internal temperature of the system is too high:: heat generation, so that the life of the entire hardware equipment in the system is also considerable: loss to- The heat-suppressing device is used to cool the system, including-^, ^ M ^ ;; As shown in the figure, this cylindrical heat-conducting tube system is from 2 to f: air-tight columnar heat conduction. The tube 100, the gas inside the heat transfer tube 100 has been drawn out in advance to show a vacuum state, the inner wall of the heat transfer tube 100 has a sintered layer made of metal powder sintered, and the center of the heat transfer tube has a hollow cylindrical hole 16, in order to To improve the heat conduction effect, usually a fluid is injected inside the heat pipe 100, and this fluid uses the capillary phenomenon to cover the entire sintered layer. 14 ° When the heat pipe is absorbed at the bottom or outer wall, it will be quickly conducted to Internal sintered layer 14, covered The fluid of the junction layer 14 absorbs heat and evaporates through the cylindrical holes 16 to the top of the heat transfer tube, and then condenses on the top of the heat transfer tube 100. The heat is discharged through the top of the heat transfer tube, and the heat is released. The fluid in the wall flows back to the bottom along the wall, so the heat is continuously circulated to discharge heat

568998 五、發明說明(2) 出。 上述圓柱狀導熱管的製造方法係由一易導熱金屬管, 通常為銅管,將其底端以易導熱金屬材質封住,再將一中 心棒由上方開口端***,使其置於金屬管之中心位置,由 開口端倒入金屬粉添加有機黏著劑,再進行高溫燒結製 程,於金屬管内壁形成一燒結層,將中心棒抽出,留下一 圓柱孔於金屬管中心位置,將一流體倒入金屬管内,此流 體可利用毛細現象分佈於燒結層,再將金屬管内之空氣抽 出,密封金屬管之開口端使此金屬管成為氣密式圓柱狀, 即完成整個導熱管之製造。 圓柱狀導熱管1 0 0於實際應用上已被證實具有相當好 的導熱、散熱的功效,然而此種導熱管1 0 0時常因製程的 偏差而導致導熱效能的降低,而最常見的問題是因製程偏 差而使導熱管1 0 0内燒結層1 4厚度不均勻,而圓柱孔1 6亦 未與導熱管1〇〇柱平行或未位於導熱管1〇〇中心,如第二圖 及第三圖所示,使導熱管1 0 0的導熱效果大打折扣,故提 供一種可製得具有均勻燒結層1 4的導熱管1 0 0製造方法及 其製具是相當重要的。 (三)、【發明内容】 本發明之主要目的,係在提供一種製作導熱管的製造 方法及其製具,使所製造出的導熱管具有均勻的燒結層。 本發明之另一目的,係在提供一種製作導熱管的製造方 法,以避免因製程偏差而導致導熱管效能降低的問題發568998 V. Description of Invention (2). The above-mentioned manufacturing method of the cylindrical heat-conducting pipe is a metal pipe with easy heat conduction, usually a copper pipe, whose bottom end is sealed with a metal material with easy heat conduction, and then a central rod is inserted from the upper open end to place it in the metal pipe. In the center position, pour metal powder from the open end to add organic adhesive, and then perform a high-temperature sintering process to form a sintered layer on the inner wall of the metal tube. The center rod is pulled out, leaving a cylindrical hole at the center of the metal tube. Poured into the metal tube, this fluid can be distributed in the sintered layer by capillary phenomenon, and then the air in the metal tube is drawn out, and the open end of the metal tube is sealed to make the metal tube into an airtight cylindrical shape. The cylindrical heat-conducting tube 100 has been proven to have a fairly good heat-conducting and heat-dissipating effect in practical applications. However, this type of heat-conducting tube 100 often causes a decrease in heat-conducting efficiency due to process deviations. The most common problem is Due to the process deviation, the thickness of the sintered layer 14 in the heat transfer tube 100 is uneven, and the cylindrical hole 16 is not parallel to the heat transfer tube 100 column or is not located at the center of the heat transfer tube 100, as shown in the second figure and the first. As shown in the three figures, the heat conducting effect of the heat conducting pipe 100 is greatly reduced, so it is quite important to provide a manufacturing method of heat conducting pipe 100 and a jig which can obtain a uniform sintered layer 14. (3) [Summary of the Invention] The main object of the present invention is to provide a manufacturing method and a jig for manufacturing a heat transfer pipe, so that the manufactured heat transfer pipe has a uniform sintered layer. Another object of the present invention is to provide a manufacturing method for manufacturing a heat pipe, so as to avoid the problem that the heat pipe performance is reduced due to process deviation.

第5頁 568998 五、發明說明(3) 生。 為達到 製造方法及 結製程前, 係以燒結金 同,再將中 壁接觸而位 管内以進行 上脫落,並 管内壁留下 心,於完成 管,透過本 偏差而導致 底下藉 容易瞭解本 效。 JL — 成二 劑製 中心 金屬 燒結 成一 可得 導敎 4 4 上述之目 其製具, 先於中心 屬粉添加 心棒*** 於銅管中 燒結製程 與銅管燒 一均勻的 導熱管其 發明製造 的效能降 由具體實 發明之目 的,本發 其係於加 棒表面形 有機黏;著 銅管内, 心,加入 ,於高溫 結層形成 燒結層, 它製程後 方法所製 低專問題 施例配合 的、技術 明提出 銅管 個以 成且 棒可 粉添 製程 體,抽 並形 ,便 造之 所附的圖 内容、特 種可定位 以製成導 上的凸塊 每個凸塊 透過凸塊 加有機黏 中,凸塊 出中心棒 圓柱孔於 一效能良 管,可避 之導熱管 熱管的燒 ,此凸塊 厚度相 與銅管内 著劑於鋼 自中心才奉 後,於銅 銅管中 好的導熱 免因製裎 式詳加説明’當更 點及其所達成之功 實施方式 (四Page 5 568998 V. Description of the invention (3) Health. In order to achieve the manufacturing method and the fabrication process, the sintered metal is used, and then the middle wall is contacted to place the tube inside to lift off, and the inner wall of the tube is left with a heart. After completing the tube, the effect can be easily understood through the deviation. JL — sintering a two-component central metal to obtain a lead. 4 4 For the above purpose, the tool is made by inserting a core rod into the copper tube before the central metal powder. The reduction of the performance is due to the purpose of the invention. This invention is based on the stick-shaped organic adhesive on the surface of the rod; it is inserted into the copper tube, the core is added, and the sintered layer is formed at the high-temperature junction layer. The coordinated and technically proposed copper tube can be made into a rod and the powder can be added to the process body, drawn and shaped, and the attached drawings are made, and the special positioning can be made to make the bumps on the guide. Each bump passes through the bump. In the organic adhesive, the bumps emerge from the cylindrical hole of the central rod in a good performance tube, which can avoid the heat pipe heat pipe burning. The thickness of the bumps and the copper tube internal coating agent are only provided in the steel from the center, and then in the copper copper tube. The good thermal conductivity factor-free system is explained in detail 'Dangcian point and the implementation of the work achieved (four

習知圓柱狀導熱管因製程偏差而導致導熱管的燒% ^厚5不均勻及圓柱孔未能位於導熱管内中:部位,^ 日士熱:的效能及品質下降’ *主要原因係在進行燒結, :植中心棒12並非位於銅管1〇中心,如第四圖所禾’ 成坟結層12及圓柱孔的偏差,如第五圖所示。 為解決圓柱狀導熱管因製造過程中所使用之中心本It is known that the thermal conductivity of the cylindrical heat pipe is caused by the process deviation. ^ The thickness is 5 uneven and the cylindrical hole is not located in the heat pipe: part, ^ Japan ’s heat: the efficiency and quality are reduced. Sintering: The planting center rod 12 is not located in the center of the copper tube 10, as shown in the fourth figure, the deviation of the formation layer 12 and the cylindrical hole, as shown in the fifth figure. In order to solve the problem of the central heat pipe used in the manufacturing process

568998 五、發明說明(4) 位於銅管中 不均勻,造 圖,本發明 屬粉添加有 將此凸塊2 4 内時,可利 20内壁,進 於進行高溫 落,而與銅 心棒22後, 20正中心留 成導熱管的 心位置, 成導熱管 提出之解 機黏著劑 黏貼至中 用此預先 而使中心 燒結製程 管20内壁 銅管20内 下一圓柱 後續製程 該銅管2 0内部氣體抽 到一品質可靠、效能 上述將金屬粉添 棒表面,為得到較佳 不同水平面的表面上 期中心棒能準確位於 以銅粉或鋁粉等易導 由上面的說明可 製造方法及預先形成 棒表面的導熱管製具 使效能下降的功效, 易,且可直接與原本 而導致所製得之導熱管内燒結層分佈 導熱效能降低等問題,參考圖式第六 決方法係於加工銅管2 0過程中,以金 預先製作數個厚度相同的凸塊2 4,再 心棒22表面,使中心棒22置入銅管20 設計好高度的凸塊24,輕微接觸銅管 棒2 2可定位於銅管2 0中心部位,然後 時,此凸塊2 4可自中心棒2 2表面脫 燒結成的燒結層2 6形成一體,抽出中 壁形成一均勻的燒結層2 6,並於銅管 孔2 8,如第七圖所示。接下來繼續完 ,於該銅管2 0内部注入一流體,再將 出後,密封該銅管2 0開口端,便可得 不打折的導熱管成品。 加有機黏著劑製成之凸塊黏貼於中心 的定位效果,凸塊最好黏貼於中心棒 ,且凸塊的數目最好能三個以上,以 銅管正中心位置。而金屬結粉通常是 熱金屬粉末為主。 以確定本發明提出之可定位之導熱管 金屬粉添加有機黏著劑之凸塊於中心 ,的確具有避免導熱管因製程偏差而 且本發明提出之方法實施起來相當容 導熱管其它製程配合,不須修改其它568998 V. Description of the invention (4) It is not uniform in the copper pipe, and the drawing is made. When the powder of the present invention is added with the bump 2 4, the inner wall of the 20 can be used for high temperature falling, and after the copper core rod 22 The center of the 20 is left as the center position of the heat pipe, and the adhesive for the heat pipe is put into the middle. Use this in advance to make the central sintering process tube 20, the inner wall of the copper tube 20, the next cylinder, and the copper tube 20 internal gas. Extract a metal powder with reliable quality and efficiency. In order to obtain a surface with a better level, the center rod can be accurately located with copper powder or aluminum powder. It can be manufactured by the above description. The method can be manufactured and the rod surface can be formed in advance. The heat conduction control device has the effect of reducing the efficiency, is easy, and can directly lead to the original heat dissipation efficiency of the sintered layer distribution in the prepared heat pipe. The sixth decision method is based on the process of processing copper pipe 20 In the process, several bumps 2 4 of the same thickness are made in advance in gold, and then the surface of the core rod 22 is set so that the center rod 22 is inserted into the copper tube 20. A bump 24 having a designed height is slightly contacted with the copper tube rod 2 2. It is located at the center of the copper tube 20, and then, the bump 24 can be de-sintered from the surface of the center rod 22 to form a sintered layer 26. The middle wall is pulled out to form a uniform sintered layer 26, and the copper tube is formed on the copper tube. Holes 28, as shown in the seventh figure. The next step is to inject a fluid into the copper tube 20, and then seal the open end of the copper tube 20 after the liquid is discharged, so as to obtain a heat-dissipating tube product without discount. The positioning effect of the bumps made by adding organic adhesive sticks to the center. The bumps should stick to the center rod, and the number of bumps should be more than three, with the copper tube centered. The metal powder is usually hot metal powder. In order to determine the positionable heat pipe metal powder added with an organic adhesive in the center, it is indeed possible to avoid heat pipe deviation due to process and the method proposed by the present invention is quite compatible with other processes of heat pipe without modification. other

568998 五、發明說明(5) 製程及相關没備’對於導熱管產品的品質控制有相當大的 功效。 惟以上所述者,僅為本發明之較佳實施例而已,並非 用來限定本發明之實施範圍。故即凡依本發明申請專利範 圍所述之形狀、構造、特徵及精神所為之均等變化或修 飾,均應包括於本發明之申請專利範圍内。 圖 號說明: 100 導 軌 管 10 銅 管 12 中 心 棒 14 燒 結 層 16 圓 柱 20 銅 管 22 中 心 棒 24 凸 塊 26 燒 結 層 28 圓 柱 孔568998 V. Description of the invention (5) Manufacturing process and related equipment 'have a considerable effect on the quality control of heat pipe products. However, the above are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, all equal changes or modifications made in the shape, structure, characteristics and spirit described in the scope of patent application of the present invention shall be included in the scope of patent application of the present invention. Description of drawing number: 100 guide rail tube 10 copper tube 12 center rod 14 sintered layer 16 round column 20 copper tube 22 center rod 24 bump 26 sintered layer 28 round hole

第8頁 568998 圖式簡單說明 第一圖為習知圓柱狀導熱管剖視圖。 第二圖為習知導熱管内壁燒結層分佈不均之剖視圖。 第三圖為習知導熱管内圓柱孔未位於導熱管中心之剖視 圖。 第四圖為習知中心棒未置於銅管中心之剖視圖。 第五圖為因中心棒偏移而造成燒結層不均勻之剖視圖。 第六圖為本發明提出之具預先燒結凸塊的中心棒置入銅管 内之剖視圖。 第七圖為利用本發明之方法及製具所得到均勻燒結層及置 中之圓柱孔剖面示意圖。Page 8 568998 Brief description of the drawings The first picture is a sectional view of a conventional cylindrical heat pipe. The second figure is a sectional view of the uneven distribution of the sintered layer on the inner wall of the conventional heat transfer tube. The third figure is a cross-sectional view of a conventional cylindrical hole in a heat transfer tube which is not located at the center of the heat transfer tube. The fourth figure is a cross-sectional view of the conventional center rod without the center of the copper tube. The fifth figure is a cross-sectional view of the unevenness of the sintered layer due to the deviation of the center rod. The sixth figure is a cross-sectional view of a central rod with pre-sintered bumps placed in a copper tube according to the present invention. The seventh figure is a schematic cross-sectional view of a uniform sintered layer and a centered cylindrical hole obtained by the method and the tool of the present invention.

Claims (1)

568998 六、申請專利範圍 1 · 一種可定位之導熱管製造方法,用於加工一銅管使其製 成具有均勻燒結層之導熱管,該方法包括下列步驟: 提供一中心棒,其表面設有二個以上之凸塊,該凸塊係以 燒結金屬粉添加有機黏著劑所製成; 將該中心棒***該銅管内,使該凸塊可接觸到該銅管内 壁,進而使該中心棒定位於該銅管中心;以及 於銅管内進行燒結製程時,該凸塊可自該中心棒脫落而與 該銅管内形成之燒結層成為一體。 2. 如申請專利範圍第1項所述之可定位之導熱管製造方 法,其中該銅管内之該燒結層係以金屬粉燒結而成。 3. 如申請專利範圍第1項或第2項所述之可定位之導熱管製 造方法,其中該金屬粉係為銅粉或铭粉。 4. 如申請專利範圍第1項所述之可定位之導熱管製造方 法,其中該凸塊係為預先製作,再黏貼至該中心棒表面。 5. 如申請專利範圍第1項所述之可定位之導熱管製造方 法,其中該凸塊係分佈於該中心棒表面之不同平面上。 6. 如申請專利範圍第1項所述之可定位之導熱管製造方 法,其中,在形成燒結層後之步驟後,更包括將該中心棒 抽出而留下一圓柱孔,於該銅管内部注入一流體,再將該 銅管内部氣體抽出後,密封該銅管開口端,以完成一導熱 管。 7. —種可定位之導熱管製具,用於加工一銅管使其製成具 有均勻燒結層之導熱管,該製具為一中心棒,其表面凸設 有二個以上之凸塊,使該中心棒***該銅管内時,可藉由568998 VI. Scope of patent application1. A method for manufacturing a heat-transfer tube that can be positioned for processing a copper tube to make a heat-transfer tube with a uniform sintered layer. The method includes the following steps: A center rod is provided, and the surface is provided with Two or more bumps, which are made of sintered metal powder and an organic adhesive; insert the center rod into the copper tube so that the bump can contact the inner wall of the copper tube, and then make the center rod Positioned at the center of the copper tube; and when the sintering process is performed in the copper tube, the bump can fall off the center rod and become integrated with the sintered layer formed in the copper tube. 2. The locating heat-conducting pipe manufacturing method according to item 1 of the scope of patent application, wherein the sintered layer in the copper pipe is sintered with metal powder. 3. The positionable heat conduction control manufacturing method as described in item 1 or item 2 of the patent application scope, wherein the metal powder is copper powder or Ming powder. 4. The locating heat pipe manufacturing method as described in item 1 of the scope of patent application, wherein the bumps are made in advance and then adhered to the surface of the center rod. 5. The positioning heat pipe manufacturing method as described in item 1 of the patent application scope, wherein the bumps are distributed on different planes on the surface of the center rod. 6. The method for manufacturing a positionable heat transfer tube as described in item 1 of the scope of patent application, wherein after the step of forming the sintered layer, the method further includes drawing out the center rod to leave a cylindrical hole inside the copper tube. After injecting a fluid and extracting the gas inside the copper pipe, the open end of the copper pipe is sealed to complete a heat pipe. 7. A positionable heat conduction control device for processing a copper tube to make it into a heat conduction tube with a uniform sintered layer, the tool is a center rod, and the surface is provided with two or more projections, When the center rod is inserted into the copper tube, 第10頁 568998 六、申請專利範圍 該凸塊接觸銅管内壁而使該中心棒定位於銅管中心,且該 凸塊於導熱管燒結製程時,可自該中心棒脫落而與該銅管 内壁之燒結層形成一體。 8. 如申請專利範圍第7項所述之可定位之導熱管製具,其 中,該凸塊係以燒結金屬粉添加有機黏著劑所製成者。 9. 如申請專利範圍第7項所述之可定位之導熱管製具,其 中,其中該凸塊係為預先製作,再黏貼至該中心棒表面。Page 10 568998 6. Scope of the patent application The bump contacts the inner wall of the copper pipe to position the center rod at the center of the copper tube, and the bump can fall off from the center rod to the inner wall of the copper tube during the sintering process of the heat pipe. The sintered layers are integrated. 8. The positionable thermal conductivity control device as described in item 7 of the scope of patent application, wherein the bump is made of sintered metal powder and an organic adhesive. 9. The positionable thermal conductivity control device as described in item 7 of the scope of patent application, wherein the bump is made in advance and then stuck to the surface of the center rod. 1 0.如申請專利範圍第7項所述之可定位之導熱管製具,其 中,其中該凸塊係分佈於該中心棒表面之不同平面上。 1 1.如申請專利範圍第8項所述之可定位之導熱管製具,其 中,其中該金屬粉係為銅粉或鋁粉。10. The positionable thermal conductivity control device according to item 7 of the scope of patent application, wherein the bumps are distributed on different planes of the surface of the center rod. 1 1. The positionable thermal conductivity control device as described in item 8 of the scope of patent application, wherein the metal powder is copper powder or aluminum powder. 第11頁Page 11
TW92113298A 2003-05-16 2003-05-16 Method and device for manufacturing positionable heat conductive tubes TW568998B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92113298A TW568998B (en) 2003-05-16 2003-05-16 Method and device for manufacturing positionable heat conductive tubes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92113298A TW568998B (en) 2003-05-16 2003-05-16 Method and device for manufacturing positionable heat conductive tubes

Publications (2)

Publication Number Publication Date
TW568998B true TW568998B (en) 2004-01-01
TW200426339A TW200426339A (en) 2004-12-01

Family

ID=32591175

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92113298A TW568998B (en) 2003-05-16 2003-05-16 Method and device for manufacturing positionable heat conductive tubes

Country Status (1)

Country Link
TW (1) TW568998B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102954721A (en) * 2011-08-19 2013-03-06 纬创资通股份有限公司 Heat pipe manufacturing method and jig for manufacturing heat pipe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102954721A (en) * 2011-08-19 2013-03-06 纬创资通股份有限公司 Heat pipe manufacturing method and jig for manufacturing heat pipe
CN102954721B (en) * 2011-08-19 2014-10-29 纬创资通股份有限公司 Heat pipe manufacturing method and jig for manufacturing heat pipe

Also Published As

Publication number Publication date
TW200426339A (en) 2004-12-01

Similar Documents

Publication Publication Date Title
Zhu et al. Thermal performance of a thin flat heat pipe with grooved porous structure
CN103868385B (en) Heat pipe and manufacturing method thereof
CN105865243A (en) Novel flat plate thiele tube and preparation method thereof
US20070095506A1 (en) Heat pipe and method for making the same
Choi et al. Interface engineering to enhance thermal contact conductance of evaporators in miniature loop heat pipe systems
US20100126701A1 (en) Plate-type heat pipe and method for manufacturing the same
CN105716461A (en) Temperature equalizing plate with gradient porous capillary cores in plane direction and manufacturing method for temperature equalizing plate
TW201423023A (en) Flat heat pipe and method of manufacturing the same
CN106594691A (en) Heat dissipation and waste heat recovery system for high-heat-flux device
WO2019019857A1 (en) Heat dissipation element and preparation method therefor, and igbt module
JP5112374B2 (en) Heat dissipating device for electronic equipment and manufacturing method thereof
TW568998B (en) Method and device for manufacturing positionable heat conductive tubes
CN110828404A (en) Micro-channel vapor chamber with recess structure
TW201420986A (en) Method for manufacturing ultra-thin vapor chamber and ultra-thin vapor chamber manufactured therefrom
CN101526321B (en) Phase-change type micro-passage flowing cooler
CN105689717A (en) Manufacturing method for part with capillary-structure pipe embedded therein
CN206037798U (en) Novel dull and stereotyped thiele tube
TW201317532A (en) Heat-dissipating device
CN211400897U (en) Novel heat pipe structure
TW201423021A (en) Heat pipe and method of manufacturing the same
US20150122460A1 (en) Heat pipe structure
TWI259264B (en) Composite capillary structure of heat pipe
CN209169140U (en) A kind of new-energy automobile power supply copper base
WO2019019867A1 (en) Heat dissipation element and preparation method therefor, and igbt module
TWI478658B (en) A heat sink and a method for making the same

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent