558662 六、 申請專利範圍 二,· 刖 述 基 礎 部係面向基準三角柱的第3側面般地配置 ， 刖 述 電 子 構件係配置於面向前述第1基板及第 2基 板 之 雙 方 的 電 子構件配置區域。 10 . 如 串 請 專 利 範圍第1項之光資料傳輸器，其中 -ϋ 刖 述 殼 體 係具有第1導引面，該導引面係用以 限制 相 對 於前 述 另 一基準面以第1角度傾斜設置之前述: 第1 基 板的位 置 爲 目的。 11 •如 串 Ξ主 m 專 利 範圍第1項之光資料傳輸器，其中 刖 述 第 1 基板係具有載置前述電子元件之電路 基板 連 接 於前述 第1光通信次總成之連接基板、以及 連接 V，- 刖 述 電 路 基 板及前述連接基板之撓性印刷基板。 12 . ，如 串 m 專 利 範圍第1項之光資料傳輸器，其中 刖 述 第 1 基板具有載置前述電子構件之電路基 板、 連 接 於前 述 第 1光通信次總成之連接基板、以及連 接前 述 電 路 基 板及前述連接基板之撓性印刷基板， 刖 述 殼 體 之基礎部係具有連接於前述第1基板 之第 1 接 線 丄山 m 子 5 刖 述 第 1 接線端子連接於前述第1基板之前述 電路 基 板 ， 刖 述 殼 體 目S 係支持前述第1及第2光通信次總成 0 13 •如 甲 三主 m 專 利 範圍第1項之光資料傳輸器，其中 刖 述 第 1 基板係具有載置前述電子構件之電路 基板 連 接 於前述 第1光通信次總成之連接基板、以及 -3 - 連接 、.八 刖 558662 六、申請專利範圍 述電路基板及前述連接基板之撓性印刷基板， 前述第1光通信次總成係具有半導體光元件、及載置 前述半導體光元件之元件載置構件， 前述元件載置構件係具有朝前述半導體光元件之光軸 方向延伸的接線端子， 前述連接基板係以可連接前述接線端子之方式配置於 前述元件載置構件上。 1 4 .如申請專利範圍第1項之光資料傳輸器，其中 前述第1基板係具有載置前述電子構件之電路基板、 連接於前述第1光通信次總成之連接基板、以及連接前 述電路基板及前述連接基板之撓性印刷基板， 前述第1光通信次總成係具有半導體發光元件。 1 5 ·如申請專利範圍第1至1 4項之其中任一項之光資料傳 輸器，其中 前述第1角度爲1〇度以上、80度以下之範圍內。 1 6 . —種光資料傳輸器，其特徵爲： 具有殼體，該殼體具有配置著第1及第2接線端子且 沿著第1基準面延伸之基礎部，前述第1接線端子具有 貫通前述基礎部之第1部份、及第2部份，且該第2部 份相對於第1部份爲以π/2强以外之特定角度彎曲，前 述第2接線端子具有貫通前述基礎部之第1部份、及第 2部份，且該第2部份相對於第1部份爲以π/2强以外之 特定角度彎曲，且 -4 - 558662 六、 申請專利 範 圍 具 有 第 1 基板，該第1基板以對應前述第1 接 線 丄U4 m 子 之 彎 曲 而 傾 斜之方式收容於前述殻體內，且和 刖 述 第 1 接 線 上山 觸 子 爲 電性相連， 具 有 第 2 基板，該第2基板以對應前述第2 接 線 端 子 之 彎 曲 而 傾 斜之方式收容於前述殻體內，且和 刖 述 第 2 接 線 端 子 爲 電性相連， 具 有 電 性 連接至收容於前述殼體之前述第1 基 板的 第 1 光 通 信 次 總成，前述第1光通信次總成係光 接 收次 總 成 具 有 電 性 連接至收容於前述殼體之前述第2 基 板 的 第 2 光 通 信 次 總成，前述第2光通信次總成係光 傳 送 次 總 成 具 有 載 置 於前述第1基板上之電子構件， 具 有 載 置 於前述第2基板上之其他電子構件 〇 17 •如 串 請 專 利 範圍第1 6項之光資料傳輸器，其中 前 述 第 1 接線端子之前述特定角度爲1 0度 以 上 > 80 度 以 下之 範 圍內， 刖 述 第 2 接線端子之前述特定角度爲10度 以 上 80 度 以下 之 範 圍內。 18 •如 串 請 專 利 範圍第1 6或1 7項之光資料傳輸器 其 中 刖 述 第 1 基板係具有載置前述電子構件之電 路 基 板 連 接 於 刖 述 光傳送次總成之連接基板、以及連 接 刖 述 電 路 基 板及 刖 述連接基板之撓性印刷基板， -5 - 558662 六' 申請專利範圍 刖 述第2 基板係具有載置前述電子構件之電 路 基 板 連 接 於前述 光接收次總成之連接基板、以及連 接 前述 電 路 基 板及前 述連接基板之撓性印刷基板。 19 如 串 請專利 範圍第1 6或1 7項之光資料傳輸器 ，其中 刖 述第1 基板係具有載置前述電子構件之電 路 基 板 > 連 接 於前述 光傳送次總成之連接基板、以及連 接 刖 述 電 路 基 板及前 述連接基板之撓性印刷基板， _-\八 刖 述第2 基板係具有載置前述電子構件之電 路 基 板 連 接 於前述光接收次總成之連接基板、以及連 接 刖 述 電 路 基 板及前 述連接基板之撓性印刷基板， -W· 刖 述第1 接線端子連接至前述第1基板之前 述 電 路 基 板 ， Λ人 刖 述第2 接線端子連接至前述第2基板之前 述 電 路 基 板 0 20 •如 串 請專利 範圍第1 6或1 7項之光資料傳輸器 ，其1 中 刖 述第1 基板具有載置前述電子構件之電路 基 板 連 接 於 前述光 傳送次總成之連接基板、以及連接 刖 述 電 路 基 板及前述 連接基板之撓性印刷基板， 前 述第2 基板具有載置前述電子構件之電路 基 板 > 連 接 於 前述光 接收次總成之連接基板、以及連接 刖 述 電 路 基 板 及前述 連接基板之撓性印刷基板， 刖 述光傳 送次總成具有半導體發光元件、以 及 具 有 沿 著 ·ϋ 刖 述半導 體發光元件之軸方向延伸之接線端 -6 - 子 且 載 置 558662 六、申請專利範圍 著前述半導體發光元件之元件載置構件’ 前述連接基板係以連接至前述光傳送次總成之前述接 線端子的方式配置於前述元件載置構件上’ 前述光接收次總成係具有半導體受光元件、以及具有 沿著前述半導體受光元件之軸方向延伸之接線端子且載 置著前述半導體受光元件之元件載置構件， 前述連接基板係以連接至前述光接收次總成之前述接 線端子的方式配置於前述元件載置構件上。 21 . —種光資料傳輸器，其特徵爲： 具有殻體，該殼體具有沿著第1基準面延伸之基礎部 、及位於前述基礎部上且沿著和前述第1基準面相交之 第2基準面延伸的壁部，前述壁部具有相對於前述第1 基準面而以第1角度傾斜配置之第1支持面、以及相對 於前述第1基準面而以第2角度傾斜配置之第2支持面 具有以前述壁部之第1支持面支持的第1基板， 具有以前述壁部之第2支持面支持的第2基板， 具有第1光通信次總成，和載置於前述第1基板之電 子構件電性相連且收容於前述殼體內，前述第1光通信 次總成爲光接收次總成， 具有第2光通信次總成，和載置於前述第2基板之電 子構件電性相連且收容於前述殼體內，前述第2光通信 次總成爲光傳送次總成。 -7 - 558662 六、申請專利範圍 22 ·如申請專利範圍第2 1項之光資料傳輸器，其中 目丨J述第1基板係具有載置則述電子構件之電路基板、 連接於前述光傳送次總成之連接基板、以及連接前述電 路基板及前述連接基板之撓性印刷基板， 前述第2基板係具有載置前述電子構件之電路基板、 連接於前述光接收次總成之連接基板、以及連接前述電 路基板及前述連接基板之撓性印刷基板。 23 ·如申請專利範圍第21項之光資料傳輸器，其中 前述第1基板係具有載置前述電子構件之電路基板、 連接於前述光傳送次總成之連接基板、以及連接前述電 路基板及前述連接基板之撓性印刷基板， 前述第2基板係具有載置前述電子構件之電路基板、 連接於前述光接收次總成之連接基板、以及連接前述電 路基板及前述連接基板之撓性印刷基板， 前述殼體之基礎部係具有連接至前述第1基板之第1 接線端子、及連接至前述第2基板之第2接線端子， 前述第1接線端子連接至前述第1基板之前述電路基 板， 前述第2接線端子連接至前述第2基板之前述電路基 板， 以前述殼體固定前述光傳送次總成及光接收次總成。 24 .如申請專利範圍第2 1項之光資料傳輸器，其中 前述第1基板係具有載置前述電子構件之電路基板、 -8 - 558662 六、申請專利範圍 連接於前述光傳送次總成之連接基板、以及連接前述電 路基板及前述連接基板之撓性印刷基板， 前述第2基板係具有載置前述電子構件之電路基板、 連接於前述光接收次總成之連接基板、以及連接前述電 路基板及前述連接基板之撓性印刷基板， 前述光傳送次總成係具有半導體發光元件、以及具有 沿著前述半導體發光元件之軸方向延伸之接線端子且載 置著前述半導體發光元件之元件載置構件， 前述連接基板係位於前述光傳送次總成之前述元件載 置構件上， 前述光接收次總成係具有半導體受光元件、以及具有 沿著前述半導體受光元件之軸方向延伸之接線端子且載 置著前述半導體受光元件之元件載置構件， 前述連接基板係位於前述光接收次總成前述元件載置 構件上。 25.—種光資料傳輸器，其特徵爲具有： 殼體，具有配置著第1及第2接線端子且沿著第1基 準面延伸之基礎部； 光接收次總成，配置於前述殼體內，具有端部彎曲之 複數接線端子，且相對於則述基準面’以這些接線端子 之彎曲端部朝向π/2强以下、〇强以上之第1角度的方向 配置； 光傳送次總成，配置於前述殼體內，具有端部彎曲之 558662 六、申請專利範圍 複數接線端子，且相對於前述基準面，以這些接線端子 之彎曲端部朝向π/2强以下、0强以上之第 2角度的方 向配置； 第1基板，對應前述光接收次總成之前述接線端子方 向的角度，使其和前述光接收次總成之前述接線端子電 性相連的方式，傾斜配置於前述殼體內； 第2基板，對應前述光傳送次總成之前述接線端子方 向的角度，使其和前述光傳送次總成之前述接線端子電 性相連的方式，傾斜配置於前述殻體內； 電子構件，載置於前述第1基板上；以及 其他電子構件，載置於前述第2基板上。 2 6 ·如申請專利範圍第1至1 4項、1 6項、1 7項、2 1項、及 25項之其中任一項之光資料傳輸器，其中 前述殼體會固定前述第1及第2光通信次總成，以使 前述第1光通信次總成及前述第2光通信次總成保持一 定間隔。 2 7 .如申請專利範圍第1至1 4項、1 6項、1 7項、2 1項、及 25項之其中任一項之光資料傳輸器，其中 前述殼體更具有覆蓋構件， 前述第1及第2基板係位於前述覆蓋構件及前述基礎 構件之間’ 該光資料傳輸器更具有和前述第1及第2光通信次總 成、前述第1及第2基板、以及前述覆蓋構件接觸之傳 -10 - 558662 六、申請專利範圍 熱構件。 28 .如申請專利範圍第1至1 4項、1 6項、1 7項、2 1項、及 25項之其中任一項之光資料傳輸器，其中 前述第1基板之兩面都載置著電子構件。 29 .如申請專利範圍第1至1 4項、1 6項、1 7項、2 1項、及 25項之其中任一項之光資料傳輸器，其中 前述殻體係具有覆蓋前述第1及第2基板之導電性覆 蓋構件，前述導電性覆蓋構件係具有接觸前述第1基板 之複數的彎曲爪部。 30 .如申請專利範圍第1至1 4項、1 6項、1 7項、2 1項、及 25項之其中任一項之光資料傳輸器，其中 前述殼體具有插座型構造。 3 1 .如申請專利範圍第1至1 4項、1 6項、1 7項、2 1項、及 25項之其中任一項之光資料傳輸器，其中 前述殼體具有插座構件，該插座構件之至少一部份爲 具有導電性。 -11 -558662 VI. Scope of patent application II. The basic unit is arranged facing the third side of the reference triangle, and the electronic components are arranged in the area where the two electronic components are arranged facing the first substrate and the second substrate. 10. For the optical data transmitter of the first scope of the patent, where -ϋ the housing has a first guide surface, the guide surface is used to limit the inclination at a first angle with respect to the other reference surface Set the foregoing: The position of the first substrate is for the purpose. 11 • For example, the optical data transmitter of the first item of the patent scope of the main m, wherein the first substrate is a connection substrate having a circuit substrate on which the aforementioned electronic components are placed and connected to the aforementioned first optical communication sub-assembly, and a connection V,-Describes the circuit board and the flexible printed circuit board of the aforementioned connection board. 12.. For example, the optical data transmitter of the first patent range of the string m, wherein the first substrate has a circuit substrate on which the aforementioned electronic components are placed, a connection substrate connected to the first optical communication sub-assembly, and the foregoing substrate. The circuit board and the flexible printed circuit board of the aforementioned connection substrate, the base portion of the case is provided with the first connection 丄 山 m sub 5 connected to the first substrate, and the first connection terminal is connected to the aforementioned first substrate. Circuit board, description case S is the optical data transmitter supporting the aforementioned first and second optical communication sub-assemblies 0 13 The circuit board with the aforementioned electronic components is connected to the connection board of the aforementioned first optical communication sub-assembly, and -3-connection, Hachiman 558662. 6. The scope of the patent application describes the circuit board and the flexible printed circuit board of the connection board. The first optical communication sub-assembly includes a semiconductor optical element and an element carrier on which the semiconductor optical element is placed. Member, the mounting member having a terminal-based member extending toward the direction of the optical axis of the semiconductor optical element, the connecting board can be connected to the line terminals of the wiring member is disposed on the mounting member. 14. The optical data transmitter according to item 1 of the scope of patent application, wherein the first substrate is a circuit substrate on which the electronic components are placed, a connection substrate connected to the first optical communication subassembly, and the circuit is connected. The substrate and the flexible printed circuit board connected to the substrate, wherein the first optical communication sub-assembly has a semiconductor light emitting element. 15 · The optical data transmitter according to any one of claims 1 to 14 of the patent application range, wherein the aforementioned first angle is within a range of 10 degrees or more and 80 degrees or less. 16. An optical data transmitter characterized by having a housing having a base portion on which first and second connection terminals are arranged and extending along a first reference plane, and the first connection terminal has a through hole. The first part and the second part of the basic part, and the second part is bent at a specific angle other than the π / 2 strength with respect to the first part, and the second terminal has an Part 1 and Part 2, and the second part is bent at a specific angle other than π / 2 strength relative to the first part, and -4-558662 6. The scope of the patent application has the first substrate, The first substrate is housed in the housing in a manner corresponding to the bending and tilting of the first wiring unit U4 m, and is electrically connected to the first wiring uphill contact, and has a second substrate. The substrate is housed in the housing in a manner inclined to correspond to the bending of the second connection terminal, and is electrically connected to the second connection terminal described above, and has an electrical connection to the first connection housing the first connection housing. The first optical communication sub-assembly of the board, the aforementioned first optical communication sub-assembly is a light-receiving sub-assembly having a second optical communication sub-assembly electrically connected to the second substrate housed in the housing, and the aforementioned first 2 Optical communication sub-assembly is an optical transmission sub-assembly which has electronic components placed on the aforementioned first substrate and other electronic components placed on the aforementioned second substrate. Optical data transmitter, wherein the aforementioned specific angle of the first terminal is within a range of 10 degrees or more > 80 degrees or less, and the aforementioned specific angle of the second terminal is within a range of 10 degrees or more and 80 degrees or less . 18 • If the optical data transmitter of the patent scope No. 16 or 17 is requested, the first substrate is a connection substrate with a circuit substrate on which the aforementioned electronic components are placed, and a connection substrate for the optical transmission sub-assembly. A flexible printed circuit board that describes a circuit board and a connection board described in the following paragraphs: -5-558662 VI. Patent application description: The second board is a connection board having a circuit board on which the aforementioned electronic components are placed and connected to the aforementioned light receiving subassembly. And a flexible printed circuit board that connects the circuit board and the connection board. 19 For example, the optical data transmitter of item 16 or 17 of the patent scope, wherein the first substrate is a circuit substrate having the aforementioned electronic components placed on it> a connection substrate connected to the aforementioned optical transmission sub-assembly, and A flexible printed circuit board that connects the circuit board and the connection board described above, the second board is a connection board having a circuit board on which the electronic components are placed and connected to the light receiving subassembly, and a connection description. Circuit board and flexible printed circuit board of the aforementioned connection board, -W · The first terminal is connected to the aforementioned circuit board of the first substrate, and the second terminal is connected to the aforementioned circuit board of the second substrate 0 20 • If the optical data transmitter of the 16th or 17th of the patent scope is requested, the first substrate described in the first substrate has a circuit substrate on which the aforementioned electronic components are placed and connected to the aforementioned optical transmission subassembly, And flexible printing for connecting said circuit board and said connection board Board, the second substrate has a circuit board on which the electronic components are placed > a connection board connected to the light receiving sub-assembly, and a flexible printed board connected to the circuit board and the connection board, and the light transmission times The assembly has a semiconductor light-emitting element, and has a terminal -6 extending along the axial direction of the semiconductor light-emitting element described in the above-mentioned and placing 558662. 6. The scope of application for a patent covers the aforementioned component mounting member of the semiconductor light-emitting element. The connection substrate is disposed on the element mounting member so as to be connected to the connection terminal of the light transmission sub-assembly. The light reception sub-assembly has a semiconductor light receiving element and has a direction along the axis of the semiconductor light receiving element. The extended wiring terminal mounts the component mounting member of the semiconductor light receiving element, and the connection substrate is disposed on the component mounting member so as to be connected to the wiring terminal of the light receiving subassembly. 21. An optical data transmitter, comprising: a housing having a base portion extending along a first reference plane, and a first portion located on the base portion and intersecting the first reference plane. 2 a wall portion extending from the reference surface, the wall portion having a first support surface inclined at a first angle relative to the first reference surface and a second support surface inclined at a second angle relative to the first reference surface The support surface includes a first substrate supported by the first support surface of the wall portion, a second substrate supported by the second support surface of the wall portion, a first optical communication subassembly, and a first optical communication subassembly. The electronic components of the substrate are electrically connected and housed in the housing. The first optical communication subassembly is a light receiving subassembly, and the second optical communication subassembly is electrically connected to the electronic component placed on the second substrate. The second optical communication sub-assembly is connected to and housed in the casing, and becomes the optical transmission sub-assembly. -7-558662 6. Scope of patent application 22 • For the optical data transmitter of the 21st scope of the patent application, the first substrate described in the above item is a circuit substrate with electronic components mounted thereon, and is connected to the aforementioned optical transmission. A connection substrate of the sub-assembly, and a flexible printed circuit connected to the circuit substrate and the connection substrate; the second substrate includes a circuit substrate on which the electronic components are placed, a connection substrate connected to the light-receiving sub-assembly, and A flexible printed circuit board that connects the circuit board and the connection board. 23 · The optical data transmitter according to item 21 of the patent application range, wherein the first substrate is a circuit substrate on which the electronic components are placed, a connection substrate connected to the optical transmission sub-assembly, and the circuit substrate and the foregoing A flexible printed circuit board for connecting substrates, the second substrate is a circuit board on which the electronic components are placed, a connection substrate connected to the light receiving sub-assembly, and a flexible printed circuit board connected to the circuit substrate and the connection substrate, The base portion of the housing includes a first terminal connected to the first substrate, and a second terminal connected to the second substrate. The first terminal is connected to the circuit substrate of the first substrate. The second terminal is connected to the circuit board of the second substrate, and the light transmission sub-assembly and the light receiving sub-assembly are fixed by the casing. 24. For the optical data transmitter of item 21 of the scope of patent application, wherein the first substrate is a circuit substrate on which the aforementioned electronic components are placed, -8-558662 6. The scope of the patent application is connected to the aforementioned optical transmission subassembly. A connection substrate, and a flexible printed circuit connected to the circuit substrate and the connection substrate; the second substrate includes a circuit substrate on which the electronic components are placed, a connection substrate connected to the light receiving subassembly, and the circuit substrate And the flexible printed circuit board of the connection substrate, the light transmission sub-assembly has a semiconductor light emitting element and an element mounting member having a terminal extending along an axial direction of the semiconductor light emitting element and mounting the semiconductor light emitting element. The connection substrate is located on the component mounting member of the light transmitting sub-assembly, and the light receiving sub-assembly has a semiconductor light receiving element, and has a connection terminal extending along an axial direction of the semiconductor light receiving element and placed thereon. An element mounting member for the semiconductor light receiving element, the connection substrate It is located on the aforementioned component mounting member of the aforementioned light receiving sub-assembly. 25. An optical data transmitter, comprising: a housing having a base portion on which first and second connection terminals are arranged and extending along a first reference plane; a light receiving subassembly is disposed in the aforementioned housing , Has a plurality of terminal blocks with curved ends, and is arranged with respect to the reference plane 'with the curved ends of these terminal blocks oriented in the direction of the first angle below π / 2 strength and above 0 strength; the light transmission subassembly, It is arranged in the aforementioned housing and has a curved end 558662. 6. The scope of patent application is for multiple terminal blocks, and the curved ends of these terminal blocks are oriented at the second angle below π / 2 strength and above 0 strength relative to the aforementioned reference plane. The first substrate corresponds to the angle of the direction of the terminal of the light-receiving sub-assembly, so that it is electrically connected to the terminal of the light-receiving sub-assembly in an inclined manner in the case; 2 substrate, corresponding to the angle of the direction of the terminal of the light transmission sub-assembly, so that it is electrically connected to the terminal of the light transmission sub-assembly in an inclined manner, Said inner housing; electronic components, mounted on the first substrate; and other electronic components, mounted on the second substrate. 2 6 · If you apply for an optical data transmitter in any one of items 1 to 14, 16, 16, 17, 21, and 25, the aforementioned housing will fix the aforementioned first and first 2 optical communication sub-assemblies so that the first optical communication sub-assembly and the second optical communication sub-assembly are kept at a certain interval. 27. If the optical data transmitter of any one of items 1 to 14, 16, 16, 17, 21, and 25 of the scope of patent application, wherein the aforementioned housing further has a covering member, the aforementioned The first and second substrates are located between the cover member and the base member. The optical data transmitter further includes the first and second optical communication sub-assemblies, the first and second substrates, and the cover member. Biography of Contact -10-558662 VI. Patent application for thermal components. 28. For the optical data transmitter of any one of the items 1 to 14, 16, 16, 21, and 25 of the scope of patent application, wherein both sides of the aforementioned first substrate are placed on Electronic components. 29. The optical data transmitter of any one of the items 1 to 14, 16, 16, 21, and 25 of the scope of application for a patent, wherein the aforementioned housing has a cover covering the aforementioned first and A conductive cover member of 2 substrates, wherein the conductive cover member has a plurality of curved claw portions that contact the first substrate. 30. The optical data transmitter of any one of the items 1 to 14, 16, 16, 21, and 25 in the scope of application for a patent, wherein the aforementioned housing has a socket-type structure. 31. The optical data transmitter of any one of items 1 to 14, 16, 16, 21, and 25 in the scope of patent application, wherein the aforementioned housing has a socket member, and the socket At least a part of the component is conductive. -11-