TW557480B - Automatic wafer sorting system and method - Google Patents
Automatic wafer sorting system and method Download PDFInfo
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- TW557480B TW557480B TW91117359A TW91117359A TW557480B TW 557480 B TW557480 B TW 557480B TW 91117359 A TW91117359 A TW 91117359A TW 91117359 A TW91117359 A TW 91117359A TW 557480 B TW557480 B TW 557480B
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557480 五、發明說明(2) 備的自動化工作,以改善設備使用率以及提升產出效率, 更減少人為錯誤操作時所可能帶來的損失。因此,將晶圓 分類機、δ又備控制模組、自動搬運系統(a u f 〇 m a七e d557480 V. Description of the invention (2) The automation of the equipment is used to improve the equipment utilization rate and the output efficiency, and to reduce the loss that may be caused by human error operation. Therefore, the wafer sorter, δ control module, and automatic handling system (a u f 〇 m a7 e d
Material Handling System,AMHS)、製造執行系統 (Manufacture Execution System,MES)與派工系統 (Dispatching/Schedule System)的整合將是晶圓分類自 動化的重要議題,透過系統的整合可以大幅改善設備使用 率以及提升產出效率。 有鑑於此,本發明之主要目的為提供一種將晶圓分類 機自動化,從而使得晶圓分類操作由手動模式轉變為自動 模式’進而大幅改善晶圓分類的效率。 為了達成本發明之上述目的,可藉由本發明所提供之 自動化晶圓分類系統及方法來達成。依據本發明實施例之 自動化晶,分類系統,包括製造執行系統、晶圓分類機、 自動派工單元、自動搬運單元與設備控制模组。 自動派工單元,傳送一搬運資訊至自動搬運單元以要 求依據搬運資訊搬運包含多個晶圓之晶圓盒至晶圓分類機 。設備控制模組讀取晶圓分類機上晶圓盒上之晶圓資訊, 且依據晶圓資訊由製造執行系統查詢相應之分類資訊。設 備控制模組致能晶圓分類機依據分類資訊將晶圓盒中之晶 設備控制模組更送出一空晶圓盒要求訊號至自動派工 單元,且自動派工單元傳送-空晶圓盒搬運f訊至自動搬 運單元’卩要求搬運-空晶圓盒至晶圓分類機中分The integration of Material Handling System (AMHS), Manufacturing Execution System (MES) and Dispatching / Schedule System will be an important issue for wafer classification automation. The integration of the system can greatly improve the equipment utilization rate and Improve output efficiency. In view of this, the main object of the present invention is to provide a method for automating a wafer sorter, so that the wafer sorting operation is changed from a manual mode to an automatic mode ', thereby greatly improving the efficiency of wafer sorting. In order to achieve the above-mentioned object of the present invention, it can be achieved by the automated wafer sorting system and method provided by the present invention. The automatic crystal and classification system according to the embodiment of the present invention includes a manufacturing execution system, a wafer sorter, an automatic dispatching unit, an automatic handling unit, and an equipment control module. The automatic dispatching unit sends a transfer information to the automatic transfer unit to request a wafer cassette containing a plurality of wafers to a wafer sorter according to the transfer information. The equipment control module reads the wafer information on the wafer box on the wafer sorter, and according to the wafer information, the manufacturing execution system queries the corresponding classification information. The device control module enables the wafer sorter to send an empty wafer box request signal to the automatic dispatching unit based on the classification information, and the automatic dispatching unit transmits the empty wafer cassette handling f message to automatic handling unit '卩 Required to move-empty wafer cassette to wafer sorter
0503-8122TWf * TSMC2001-1312 *» Yianhou.ptd0503-8122TWf * TSMC2001-1312 * »Yianhou.ptd
557480557480
類資訊將晶圓盒中之晶圓抽換至空晶圓盒。 另外,當晶圓完成分類時,設備控制模組傳送一搬出 Ξϊ工單元…動派工單元傳送一晶圓盒搬出 圓;類機運單&,以要求將晶圓盒與空晶圓盒搬離晶 八中’晶圓盒係存放於一晶圓儲存櫃(St〇cker)中。 依據本發明之一型態,晶圓分類機係嵌建於晶圓儲存 且自動搬運單元為該晶圓儲存櫃中之搬運手臂 (fr^ane)。依據本發明之另一型態,晶圓分類機係獨立於 晶圓儲存櫃之外,且自動搬運單元為高架起吊搬運 (Overhead Hoisting Transport , 0ΗΤ)系統。 依據本發明實施例之自動化晶圓分類方法,首先,自 動派工單元傳送一搬運資訊至自動搬運單元。自動搬運單 元,收搬運資訊之後,依據搬運資訊搬運包含複數晶圓之 晶圓盒至晶圓分類機。接著,設備控制模組讀取晶圓分類 機上之晶圓盒上之晶圓資訊,並依據晶圓資訊由製造執行 系統查詢相應之分類資訊。 之後’設備控制模組送出一空晶圓盒要求訊號至自動 派工單元,且自動派工單元因應空晶圓盒要求訊號傳送一 空晶圓盒搬運資訊至自動搬運單元。自動搬運單元接收空 晶圓盒搬運資訊之後,依據空晶圓盒搬運資訊搬運一空晶 圓盒至晶圓分類機。之後,設備控制模組致能晶圓分類機 依據分類資訊將晶圓盒中之晶圓進行分類。 最後,當晶圓完成分類時,設備控制模組送出一搬出The class information swaps the wafers in the wafer cassette to an empty wafer cassette. In addition, when the wafers are sorted, the equipment control module transmits a moving out of the masonry unit ... The dispatching unit transmits a wafer box out of the circle; machine-style shipping order & The wafer box of Lijing Bazhong is stored in a wafer storage cabinet (Stocker). According to a form of the present invention, the wafer sorter is embedded in the wafer storage, and the automatic transfer unit is a transfer arm (fr ^ ane) in the wafer storage cabinet. According to another aspect of the present invention, the wafer sorter is independent of the wafer storage cabinet, and the automatic handling unit is an overhead hoisting transport (Overhead Hoisting Transport (0ΗΤ) system. According to the automated wafer sorting method according to the embodiment of the present invention, first, the automatic dispatch unit transmits a transfer information to the automatic transfer unit. Automatic transfer unit, after receiving the transfer information, transfer the wafer cassette containing the multiple wafers to the wafer sorter according to the transfer information. Then, the equipment control module reads the wafer information on the wafer box on the wafer sorter, and according to the wafer information, the manufacturing execution system queries the corresponding classification information. After that, the equipment control module sends an empty wafer cassette request signal to the automatic dispatch unit, and the automatic dispatch unit transmits an empty wafer cassette handling information to the automatic transport unit in response to the empty wafer cassette request signal. After the automatic handling unit receives the empty wafer box handling information, it moves an empty wafer round box to the wafer sorter based on the empty wafer box handling information. After that, the equipment control module enables the wafer sorter to sort the wafers in the wafer cassette based on the sorting information. Finally, when the wafers are sorted, the equipment control module sends out
0503-8122TWf ; TSMC2001-1312 ; Yianhou.ptd 第7頁 557480 五、發明說明(4) 訊號至自動派工 晶圓盒搬出資訊 盒搬出資訊之後 盒搬離晶圓分類 類似地,晶 明之一型態,晶 搬運單元為該晶 一型態,晶圓分 運單元為高架起 以上述兩型 存櫃之中,其結 搬運效率。 實施例 單元,自動 給自動搬運 ’依據晶圓 圓盒係存放 圓分類機係 圓儲存櫃中 類機係獨立 吊搬運系統 態進行比較 合晶圓儲存 派工單 XtXJ 一 早兀。 盒搬出 於一晶 嵌建於 之搬運 於晶0 〇 ,將晶 櫃之搬 元因應搬出訊號傳送一 自動搬運單元接收晶圓 資訊將晶圓盒與空晶圓 圓儲存植中。依據本發 晶圓儲存櫃中,且自動 手臂。依據本發明之另 儲存摄之外’且自動搬 圓分類機嵌建於晶圓儲 運手臂可以達到較佳之 第2圖係顯示依據本發明實施例之自動化晶 統之系統架構。 糸 /一依據本發明實施例之自動化晶圓分類系統,包括製造 執行系統100、晶圓分類機11()、設備控制模組12〇、自動 派工單元130、自動搬運單元ho。0503-8122TWf; TSMC2001-1312; Yianhou.ptd Page 7 557480 V. Description of the invention (4) Signal to the automatic dispatch wafer box out of the information box After the information is moved out of the box, the classification of the box is similar. The crystal transfer unit is in this crystal type, and the wafer distribution unit is elevated to the above two types of cabinets, and its knot transfer efficiency is high. Example Unit: Automatically transported automatically ’According to wafers, round boxes, storage, circular sorters, circular storage cabinets, independent machines, lifting systems, and status comparison. Wafer storage dispatch order XtXJ early. The box is moved out of Yijing, built in, and transferred to Jing0 0, and the relocation of the crystal cabinet is transmitted to an automatic transfer unit to receive the wafer information in response to the removal signal. The wafer box and the empty wafer are stored in a circle. According to this issue, the wafer storage cabinet is automatic arm. According to another aspect of the present invention, the automatic round sorter can be better embedded in the wafer storage and transportation arm. The second figure shows the system architecture of the automatic crystal system according to the embodiment of the present invention. / / An automated wafer sorting system according to an embodiment of the present invention includes a manufacturing execution system 100, a wafer sorter 11 (), an equipment control module 120, an automatic dispatch unit 130, and an automatic transfer unit ho.
製造執行系統100中紀錄晶圓製造廠中每一批貨、每 一晶圓盒中的晶圓以及所有晶圓分別相應需進行之製程的 相關資訊。設備控制模組丨2 〇係用以控制與管理晶圓分類 f 1 1 〇之所有操作,晶圓分類機1 1 0係用以將晶圓盒中的晶 圓進行抽換之用。自動派工單元丨30對於所有的晶圓盒的曰曰 狀態、資訊以及置放位置進行管理,其可以知道哪一個曰The manufacturing execution system 100 records information about each lot in the wafer manufacturing plant, the wafers in each wafer box, and the corresponding processes required for all wafers. The equipment control module 丨 2 is used to control and manage all operations of wafer sorting f 1 1 0, and the wafer sorter 1 10 is used to exchange wafers in the wafer cassette. Automatic dispatching unit 丨 30 manages the status, information, and placement of all wafer cassettes, which can know which
557480 五、發明說明(5) ----- ^盒需要優先進行晶圓分類或其他的製程處理。自動搬運 早兀140則可以是自動搬運系統(AMHS)或是自動 的一部分。 逆乐統 一自動派工單元130可以傳送一搬運資訊至自動搬運單 以要求自動搬運單元14〇依據搬運資訊搬運包含複數 晶圓之晶圓盒至晶圓分類機丨丨〇。其中,搬運資訊包括此 曰曰圓盒的識別資料與置放位置等資訊。 當晶圓盒置放於晶圓分類機丨丨〇的載入埠後,設備控 制模組1 2 0讀取晶圓分類機丨丨〇上晶圓盒之晶圓資訊。注意 的疋j對於每一晶圓盒上皆具有一可以紀錄晶圓盒内晶圓 之晶圓資訊的標籤(Tag),設備控制模組丨2〇可以透過紅外 線等方式來讀取。 之後,設備控制模組1 20依據讀取之晶圓資訊由製造 執行系統1 00查詢相應之分類資訊。其中,分類資訊包含 此晶圓盒内所有晶圓所應進行抽換與否的相關資訊。此 外’設備控制模組1 2 0更送出一空晶圓盒要求訊號至自動 派工單元1 3 0,且自動派工單元1 3 0因應該空晶圓盒要求訊 號傳送一空晶圓盒搬運資訊至自動搬運單元丨4〇,以要求 自動搬運單元1 4 0搬運一空晶圓盒至晶圓分類機11 〇中。類 似地’空晶圓盒搬運資訊中包括空晶圓盒的置放位置等資 訊。 當空晶圓盒置放於晶圓分類機1 1 0的另一載入埠後, 設備控制模組1 2 0致能晶圓分類機1 1 〇來依據由製造執行系 統1 0 0查詢之分類資訊將晶圓盒中之晶圓進行分類(需要抽557480 V. Description of the invention (5) ----- ^ The box needs to be prioritized for wafer classification or other process processing. Automated handling The Early 140 can be an automatic handling system (AMHS) or part of an automated system. An automatic dispatching unit 130 can send a transfer information to an automatic transfer order to request the automatic transfer unit 14 to transfer a wafer box containing a plurality of wafers to a wafer sorter according to the transfer information. Among them, the handling information includes information such as the identification data of the round box and the storage location. After the wafer cassette is placed in the loading port of the wafer sorter, the equipment control module 120 reads the wafer information of the wafer sorter on the wafer sorter. Note: For each wafer box, there is a tag that can record the wafer information of the wafers in the wafer box. The device control module can be read through infrared rays and other methods. After that, the equipment control module 1 20 inquires the corresponding classification information from the manufacturing execution system 100 according to the read wafer information. Among them, the classification information includes information about whether all wafers in this wafer box should be swapped or not. In addition, the 'equipment control module 1 2 0 sends an empty wafer box request signal to the automatic dispatch unit 1 3 0, and the automatic dispatch unit 1 3 0 responds to the empty wafer box request signal to transmit an empty wafer box handling information to The automatic handling unit 丨 40 requires the automatic handling unit 1400 to carry an empty wafer cassette to the wafer sorter 11 〇. Similarly, the empty wafer box handling information includes information such as the location of the empty wafer box. When the empty wafer cassette is placed in another loading port of the wafer sorter 1 110, the device control module 12 enables the wafer sorter 1 1 0 to perform classification based on the query by the manufacturing execution system 1 0 0 Information sorts the wafers in the cassette (requires extraction
0503-8122W ; TSMC2001-1312 ; Yianhou.ptd 第 9 頁 5574800503-8122W; TSMC2001-1312; Yianhou.ptd page 9 557480
換ίΐί之晶圓被抽換至空晶圓盒)。當晶圓完成分類後 5 控制模組1 20傳送一搬出訊號至自動派工單元丨 且自動派工單兀13〇傳送一晶圓盒搬出資訊至自動搬運 。八要求Λ動㈣單元140將晶圓盒與空晶圓盒搬離 曰日0刀類機。其中,晶圓盒搬出資訊中包含晶圓盒與空曰 圓盒需置放於何位置或送至哪一半導體設備機台的;目; 訊0 第3圖為一時序圖係顯示依據本發明實施例之自 晶圓分類方法之操作流程。 依據本發明實施例之自動化晶圓分類方法,首先,自 動派工單元130傳送一搬運資訊至自動搬運單元14〇 (S1)。 其中’搬運資訊包括一晶圓盒的識別資料與置放位置等資 訊。自動搬運單元140接收搬運資訊之後,依據搬運資訊 所指定之位置搬運該晶圓盒至晶圓分類機(s 2 )。 接著’設備控制模組1 2 0可以透過紅外線讀取晶圓分 類機110上之晶圓盒的標籤上之晶圓資訊(S3),並依據晶 圓資訊由製造執行系統1 〇 〇查詢相應之分類資訊(S 4)。其 中’分類資訊包含晶圓盒内所有晶圓所應進行抽換與否的 相關資訊。 之後’設備控制模組1 2 0送出一空晶圓盒要求訊號至 自動派工單元13〇(S5),且自動派工單元130因應空晶圓盒 要求訊號傳送一空晶圓盒搬運資訊至自動搬運單元丨4〇 (S6)。自動搬運單元140接收到空晶圓盒搬運資訊之後, 依據空晶圓盒搬運資訊搬運一空晶圓盒至晶圓分類機The changed wafer is drawn to an empty wafer cassette). After the wafers are sorted, 5 the control module 1 20 sends a removal signal to the automatic dispatch unit 丨 and the automatic dispatch unit 130 transmits a wafer box removal information to the automatic transfer. Eighth, the Λ moving unit 140 is required to remove the wafer cassette and the empty wafer cassette from the Japanese-style 0 knife machine. Among them, the wafer box removal information includes where the wafer box and the empty round box need to be placed or to which semiconductor equipment machine; heading; News 3 FIG. 3 is a timing diagram showing a sequence according to the present invention The operation flow of the self-wafer classification method of the embodiment. According to the automated wafer sorting method according to the embodiment of the present invention, first, the automatic dispatching unit 130 transmits a transfer information to the automatic transfer unit 14 (S1). The 'handling information' includes information such as the identification information of a wafer cassette and the placement location. After receiving the transfer information, the automatic transfer unit 140 transfers the wafer cassette to the wafer sorter according to the position designated by the transfer information (s 2). Then the 'equipment control module 1 2 0 can read the wafer information (S3) on the label of the wafer box on the wafer sorter 110 through infrared, and according to the wafer information, the manufacturing execution system 1 00 queries the corresponding one. Classification information (S 4). The 'classification information' contains information about whether all wafers in the wafer box should be swapped or not. After that, the 'equipment control module 120' sends an empty wafer cassette request signal to the automatic dispatch unit 13 (S5), and the automatic dispatch unit 130 transmits an empty wafer cassette transport information to the automatic transport in response to the empty wafer cassette request signal. Cell 丨 40 (S6). After the automatic handling unit 140 receives the empty wafer box handling information, it transfers an empty wafer box to the wafer sorter according to the empty wafer box handling information.
0503-8122W ; TSMC2001-1312 ; Yianhou.ptd 第10頁 557480 五、發明說明(7) 11〇(S7)。之後,設備控制模組120致能晶圓分類機11〇依 據分,資訊將晶圓盒中之晶圓進行分類(S8)。 取後’當晶圓完成分類時,晶圓分類機丨丨〇傳送一分 類完成訊號給設備控制模組12〇(S9)。設備控制模組12〇收 到分類完成訊號時,送出一搬出訊號至自動派工單元 130CS10) ’自動派工單元13〇因應搬出訊號傳送一晶圓盒 搬出資訊給自動搬運單元14〇(sl丨)。自動搬運單元14〇接 收曰曰圓I搬出負汛之後,依據晶圓盒搬出資訊將晶圓盒與 空晶圓盒搬離晶圓分類機丨丨〇 (s丨2 )。 注意的是,晶圓盒係存放於一晶圓儲·存櫃(St〇cked 中。依據本發明之一型態,晶圓分類機係嵌建於晶圓儲存 櫃中’且自動搬運單元為該晶圓儲存櫃中之搬運手臂 (Crane)。依據本發明之另一型態,晶曲分類機係獨立於 晶圓儲存櫃之外,且自動搬運單元為高架起吊搬運 (Overhead Hoisting Transport , OHT)系統。 以上述兩型態進行比較,將晶圓分類機嵌建於晶圓儲 存櫃之中’其結合晶圓儲存櫃之搬運手臂可以達到較佳之 搬運效率。第4圖顯示嵌建於晶圓儲存櫃中之晶圓分類機 的外貌’第5圖顯示晶圓儲存櫃内晶圓分類機的兩載入淳 外貌,由於將晶圓分類機嵌建於晶圓儲存櫃之中其晶圓各 搬運的距離最近以及晶圓儲存櫃之搬運手臂相較^ =架二 吊搬運系統的搬運速度為快。因此,若將晶圓分類2嵌建 於晶圓儲存櫃之中則可以使自動化晶圓分類系統及方^ 到最佳之效率。 / $ 0503-8122W ; TSMC2001-1312 ; Yianhou.ptd 第11頁 557480 反、發明說明(8) 因此,藉由本發明所提供之自動化晶圓分類系統及方 手動:=2類機自動化,⑼而使得晶圓分類操作由 式轉變為自動模式,冑而大幅改善晶圓 =率以及提升產出效率,更減少人 :、 帶來的損失。 口狩表彳呆作時所可能 雖然本發明已以較佳實施例揭露如上 限疋本發明,任何熟悉此項技藝者 ::並非用以 範圍當視後附之申請專利範圍;斤=者=本發明之保護0503-8122W; TSMC2001-1312; Yianhou.ptd page 10 557480 V. Description of the invention (7) 11 (S7). After that, the device control module 120 enables the wafer sorter 110 to sort the wafers in the wafer cassette based on the information and classification (S8). After taking out 'When the wafers are sorted, the wafer sorter 丨 丨 sends a sort completion signal to the device control module 12 (S9). When the equipment control module 120 receives the classification completion signal, it sends a removal signal to the automatic dispatching unit 130CS10) 'The automatic dispatching unit 13 transmits a wafer cassette removal information to the automatic conveying unit 14 ° (sl 丨). After the automatic conveying unit 14 receives the negative circle I moved out of the negative flood, it moves the wafer cassette and the empty wafer cassette away from the wafer sorter 丨 丨 0 (s 丨 2) according to the wafer cassette removal information. Note that the wafer cassette is stored in a wafer storage cabinet. According to one aspect of the present invention, the wafer sorter is embedded in the wafer storage cabinet, and the automatic handling unit is A crane in the wafer storage cabinet. According to another aspect of the present invention, the crystal sorter is independent of the wafer storage cabinet, and the automatic handling unit is an overhead hoisting transport (Overhead Hoisting Transport, OHT). ) System. Based on the above two types of comparison, the wafer sorter is embedded in the wafer storage cabinet. Its handling arm combined with the wafer storage cabinet can achieve better handling efficiency. Figure 4 shows the embedded in the wafer The appearance of the wafer sorter in a circular storage cabinet 'Figure 5 shows the two-loaded appearance of the wafer sorter in the wafer storage cabinet. Because the wafer sorter is embedded in the wafer storage cabinet, The distance between each transfer is closest and the transfer arm of the wafer storage cabinet is faster than that of the ^ = rack two crane handling system. Therefore, if the wafer classification 2 is embedded in the wafer storage cabinet, the automatic crystal can be made. Circle classification system and square ^ to the best Efficiency. / $ 0503-8122W; TSMC2001-1312; Yianhou.ptd Page 11 557480 Anti-Invention Description (8) Therefore, with the automated wafer sorting system and manual operation provided by the present invention: = Class 2 machine automation, ⑼ As a result, the wafer sorting operation is changed from a type to an automatic mode, which greatly improves the wafer rate and the output efficiency, and further reduces the loss caused by humans. Although the present invention may It is disclosed in the preferred embodiment that if the upper limit is the present invention, anyone who is familiar with the art: is not intended to be used as a scope of patent application attached to the scope;
557480 圖式簡單說明 為使本發明之上述目的、特徵和優點能更明顯易懂, 下文特舉實施例,並配合所附圖示,進行詳細說明如下: 第1 A、1 B圖顯示晶圓分類機的外貌。 第2圖係顯示依據本發明實施例之自動化晶圓分類系 統之系統架構。 第3圖為一時序圖係顯示依據本發明實施例之自動化 晶圓分類方法之操作流程。 第4圖顯示嵌建於晶圓儲存櫃中之晶圓分類機的外 貌。 第5圖顯示晶圓儲存櫃内晶圓分類機的兩載入埠外 貌。 符號說明 I 0 0〜製造執行系統; II 0〜晶圓分類機; 1 2 0〜設備控制模組; 130〜自動派工單元; 140〜自動搬運單元; S1.....S1 2〜操作步驟。557480 Brief description of the drawings In order to make the above-mentioned objects, features, and advantages of the present invention more comprehensible, the following specific examples are given in conjunction with the accompanying drawings to explain in detail as follows: Figures 1A and 1B show wafers The appearance of the classifier. FIG. 2 shows a system architecture of an automated wafer sorting system according to an embodiment of the present invention. FIG. 3 is a timing chart showing an operation flow of an automated wafer sorting method according to an embodiment of the present invention. Figure 4 shows the appearance of a wafer sorter built into a wafer storage cabinet. Figure 5 shows the appearance of the two loading ports of the wafer sorter in the wafer storage cabinet. Explanation of symbols I 0 0 ~ Manufacturing execution system; II 0 ~ Wafer sorter; 1 2 0 ~ Equipment control module; 130 ~ Automatic dispatch unit; 140 ~ Automatic handling unit; S1 ..... S1 2 ~ Operation step.
0503-8122TWf ; TSMC2001-1312 ; Yianhou.ptd 第13頁0503-8122TWf; TSMC2001-1312; Yianhou.ptd page 13
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7925380B2 (en) | 2006-07-19 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated transportation control for wafer fabrication facility |
TWI464433B (en) * | 2009-11-25 | 2014-12-11 | Hon Hai Prec Ind Co Ltd | System and method for classifying signal wires of pcb |
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2002
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US7925380B2 (en) | 2006-07-19 | 2011-04-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated transportation control for wafer fabrication facility |
TWI464433B (en) * | 2009-11-25 | 2014-12-11 | Hon Hai Prec Ind Co Ltd | System and method for classifying signal wires of pcb |
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