TW552662B

TW552662B - Semiconductor testing apparatus

Info

Publication number: TW552662B
Application number: TW91125342A
Authority: TW
Inventors: Cheng-Ji Yu; Shou-Nan Tsai; Ching-Yuh Jang
Original assignee: Silicon Integrated Sys Corp
Priority date: 2002-10-25
Filing date: 2002-10-25
Publication date: 2003-09-11

Abstract

A semiconductor testing apparatus. The testing apparatus includes a server, a robot arm, a gear member, a drive member, a transmission member, a control member, and a testing head. The drive member drives the gear and the transmission members, so as to rotate the testing head. The control member controls the output of the drive member, so that the speed and direction of the testing head could be controlled.

Description

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^ 本發明係關於一種測試裝置，半導體元件用之半導體測試裝置。特別係有關於一種測試【習知技術】快速化以及人性化， ’因此也需要各種不隨著半導體測試設備的自動化、使得半導體的設計考量條件越來越多同的測試裝置。一 1知的一種半導體測試裝置丨，如圖丨所示，其係包含機11、一機械手臂12、一傳動變向單元13、一手動致動早元14、一傳動單元15、及一測試頭16。省主機11係用以收集、處理測試資料；該機械手臂i 2 =一端部係樞設於該主機丨丨，其另—端部之前端係設有一連結板121，且其另一端部之下方係設有一承載元件122，該承載元件122之一端係垂直延設有一固定元件123。該傳動變向單元13係設置於該承載元件丨22上，且該傳動變向單元13係設有不同方向之一第一傳動軸及一第二傳動軸（未示於圖中）。該手動致動單元14係設置於該固定元件123上，且與該傳動變向單元1 3之第一傳動軸相互連接，並用以致動該第一傳動軸。該傳動單元1 5係設有一第一旋轉元件1 5 1、一第二旋轉元件1 5 2、及一連動元件1 5 3，該第一旋轉元件丨5 1係軸设於该連結板1 2 1上’該第一旋轉元件1 5 2係連結於該傳動^ The invention relates to a test device, a semiconductor test device for semiconductor devices. In particular, it is related to a test. [Know-how] Faster and more user-friendly, ’Therefore, various test devices that do not follow the automation of semiconductor test equipment and make semiconductor design considerations more and more common. A semiconductor test device known as shown in FIG. 1 includes a machine 11, a robot arm 12, a transmission steering unit 13, a manually actuated early element 14, a transmission unit 15, and a test. Head 16. Provincial host 11 is used to collect and process test data; the robot arm i 2 = one end is pivotally mounted on the host, and the other end is provided with a connecting plate 121 at the front end and below the other end A supporting element 122 is provided, and one end of the supporting element 122 is vertically extended with a fixing element 123. The transmission redirection unit 13 is provided on the bearing element 22, and the transmission redirection unit 13 is provided with a first transmission shaft and a second transmission shaft (not shown in the figure) in different directions. The manual actuation unit 14 is disposed on the fixing element 123 and is connected to the first transmission shaft of the transmission redirection unit 13 and is used to actuate the first transmission shaft. The transmission unit 15 is provided with a first rotating element 1 5 1, a second rotating element 1 5 2, and a linking element 1 5 3. The first rotating element 5 1 is provided on the connecting plate 1 2. 1 上 'The first rotating element 1 5 2 is connected to the transmission

552662 五、發明說明（2) 變向單兀13之第二傳動軸，該連動元件153係用以連結該第一旋轉元件151及該第二旋轉元件152。該測試頭16係電性連接至該主機n，其係設置於該機械手臂12之前端的連結板121，且能因第一旋轉元件轉動而轉動；當使用者轉動該手動致動單元14之手動桿141 日守’忒手動致動單元1 4之動力則經由該傳動變向單元1 3之第一傳動軸傳至該第二傳動軸，而位於該第二傳動軸上之第二旋轉元件152乃因而旋轉，再經由該連動元件丨53之作動而使該第一旋轉元件1 5 1旋轉，進而使該測試頭丨6轉動。然而，由於一般測試頭具有一定的重量，通常約 350〜80 OKG，利用人力的方式轉動該手動致動單元14，來將調整測試頭1 6從測試位置轉至裝卸位置，所需花費的時間約2分鐘，且相當費力。而且半導體測試裝置為了滿足彈性化的要求，測試頭被更換、轉向的頻率極高，因此對於操作半導體測試裝置的測試人員來說，是一重大的負荷。再者測試人員在轉動手動桿1 4 1時，常會因測試頭！ 6 轉向關係而卡到測試頭1 6，甚至因此導致職業傷宝。另外’由於半導體測試裝置以人力的方式輸入，實在不符合目前產業自動化及快速化的變遷。因此如何使半導體測試裝置符合自動化，並使其測試頭到達所需的測試位置及裝卸位置更快速、精準，進而使其符合人性化與彈性化的要求，實為目前半導體測試裝置的一大課題。552662 V. Description of the invention (2) The second transmission shaft of the direction changing unit 13 is used to connect the first rotating element 151 and the second rotating element 152. The test head 16 is electrically connected to the host n. The test head 16 is connected to the connecting plate 121 at the front end of the robot arm 12 and can be rotated by the rotation of the first rotating element. The power of the lever 141 Rishou 忒 manual actuation unit 14 is transmitted to the second drive shaft through the first drive shaft of the drive steering unit 13, and the second rotation element 152 on the second drive shaft Therefore, the first rotating element 151 is rotated by the action of the linkage element 53, and the test head 6 is rotated. However, because the general test head has a certain weight, usually about 350 ~ 80 OKG, the manual actuation unit 14 is manually rotated to adjust the test head 16 from the test position to the loading and unloading position. The time required About 2 minutes and quite laborious. In addition, in order to meet the requirements of flexibility of the semiconductor test device, the frequency of the test head being replaced and turned is extremely high. Therefore, it is a significant load for the testers who operate the semiconductor test device. In addition, when the tester rotates the manual lever 1 4 1, the test head is often caused by the test head! 6 Steering relationship and stuck to the test head 1 6 and even cause occupational injury. In addition, because the semiconductor test equipment is manually input, it does not meet the current industrial automation and rapid changes. Therefore, how to make the semiconductor test device comply with automation, and make the test head reach the required test position and loading and unloading position more quickly and accurately, so as to make it meet the requirements of humanization and flexibility, is a major issue for the current semiconductor test devices. .

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【發明概要】有省力之而單元及控制驅動速度緣裝置，動單元其端部之一承載傳係設有鑑於上述問半導體測試，本發明之傳動單元，動單元之驅以及轉動方是’為達上包含一主機、一傳動單中’機械手前端係設有元件，承載元件之一端係垂動變向單元係設置不同方向之一第一題’本發明之目裝置。的係提供一種可省時特徵係而使測動速度向。述目的利用一試頭轉向與驅動方驅動單元來驅動傳動變向。另藉由一控制單元來向，以控制測試頭之轉一機元 ’本發明械手臂、控制單元端部係樞臂之一一連結板，且其於承載元傳動軸及係提供一種半導體測試一傳動變向單元、一驅、及一測試頭。設於該主機上，其另— 另一端部之下方係設有直延设有固定元件。件上，且傳動變向單一一第二傳動轴。驅動單元係設置於固定元件上，且與傳動變向單元之第一傳動軸相互連接，用以驅動該第一傳動軸。傳動單元係設有一第一旋轉元件、一第二旋轉元件、及一連動元件，第一旋轉元件係軸設於該連結板上，第二旋轉元件係連結於傳動變向單元之第二傳動軸，連動元^ 係用以連結第一旋轉元件及第二旋轉元件。控制單元係與驅動單元電連接，用以控制驅動單元之轉動方向與轉動速度，其係設置於該固定元件上。測試頭[Summary of the invention] There is a labor-saving unit and a device for controlling the driving speed. One of the ends of the moving unit is provided with a transmission system. In view of the above-mentioned semiconductor test, the driving unit of the present invention, the driving unit and the rotating side of the driving unit are It includes a main unit and a transmission unit. "The front end of the manipulator is provided with components, and one end of the load-bearing component is provided with one of the different directions of the vertical direction changing unit." The system provides a time-saving feature system to drive the measurement speed. The purpose is to use a test head steering and drive side drive unit to drive the transmission to change direction. In addition, a control unit is used to control the rotation of the test head to a machine element. The present invention is an arm of the control unit, and one end of the control unit is a connecting plate, and a semiconductor test is provided on the bearing element drive shaft and system. Drive steering unit, one drive, and one test head. It is set on the main machine, and there is a straight-line fixing element below the other end. And the transmission changes to a single second transmission shaft. The driving unit is arranged on the fixed element and is connected with the first transmission shaft of the transmission steering unit to drive the first transmission shaft. The transmission unit is provided with a first rotation element, a second rotation element, and a linkage element. The first rotation element is provided on the connecting plate, and the second rotation element is connected to the second transmission shaft of the transmission changing unit. The linkage element ^ is used to connect the first rotation element and the second rotation element. The control unit is electrically connected to the driving unit for controlling the rotation direction and speed of the driving unit, and is arranged on the fixed element. Test head

第7頁 552662Page 7 552662

係電性連接至主機，其係設置板，且处闵篦一 # μ -从絲4 機械手臂之前端的連結日：且犯因第％轉兀件轉動而轉動。當驅動單：卞，驅動单兀之動力則經由傳動變向單元動至第二傳動軸，第二傳動軸上之第_ 軸傳轉’再經由連動元件之作動而使而旋使該測試頭轉動。乐疋轉兀件奴轉，進而，上所述^由於依本發明之半導體測，傳動早兀，進而得以使測試頭作動，而使測試因此可以符合自動化及省時的要喪 ° .. J要求並且也達到節省择作人力…。同時，測試人員也可因此避免職業傷害【較佳實施例之詳細說明】以下將參照圖2〜圖6來說明依本發明較佳實施導體測試裝置。如圖2及圖3所示，依本發明之半導體測試裝置2係包含一主機21、一機械手臂22、一傳動變向單元23、一驅動单元2 4、一傳動早元2 5、一控制単元2 6、及一測試頭2 7。該機械手臂22之一端部係樞設於該主機21上，其另_ 端部之前端係設有一連結板2 2 1，且其另一端部之下方係設有一承載元件2 2 2，該承載元件2 2 2之一端係垂直延設有一固定元件223。於本實施例中，該機械手臂22係為一雙臂多軸之機械手臂，如圖3所示該機械手臂22係可進行水平方向移動。It is electrically connected to the host, and it is installed on the board. It is connected to the front end of # 4-from the front end of the wire 4 robotic arm. When the drive unit: 卞, the power of the drive unit is moved to the second drive shaft via the transmission steering unit, and the _ axis on the second drive shaft is transmitted through the action of the linkage element to rotate the test head. Turn. Let ’s turn the hardware and slaves. Furthermore, because of the semiconductor test according to the present invention, the transmission is early, so that the test head can be moved, so that the test can meet the requirements of automation and time saving.. J Requirements and also achieve savings in optional manpower ... At the same time, testers can also avoid occupational injuries. [Detailed description of the preferred embodiment] The following will describe a preferred implementation of the conductor testing device according to the present invention with reference to FIGS. 2 to 6. As shown in FIG. 2 and FIG. 3, the semiconductor test device 2 according to the present invention includes a host 21, a robot arm 22, a transmission changing unit 23, a driving unit 2 4, a transmission early element 2 5, a control単元 2 6 and a test head 2 7. One end of the robot arm 22 is pivoted on the host 21, and the other end is provided with a connecting plate 2 2 1 at the front end, and a load-bearing element 2 2 2 is provided below the other end. One end of the element 2 2 2 is vertically extended with a fixing element 223. In this embodiment, the robot arm 22 is a dual-arm multi-axis robot arm. As shown in FIG. 3, the robot arm 22 can move horizontally.

第8頁 552662 、發明說明（5) 一該傳動變向單元23係設置於該承載元件222上，如圖4 所不’該傳動變向單元2 3係設有不同方向之一第一傳動軸 231及一第二傳動軸232。請再參考圖4所示，該驅動單元24係設置於該固定元件223上’其係與該傳動變向單元23之第一傳動軸相231互連接’用以驅動該第一傳動軸2 3 1。於本實施例中，該驅動單元2 4係為一馬達。如圖4及圖5所示，該傳動單元25係設有一第一旋轉元件251、一第二旋轉元件252、及一連動元件253。該第一旋轉元件2 5 1係軸設於該連結板2 2 1上，該第二旋轉元件 2 52係連結於該傳動變向單元23之第二傳動軸232。該連動元件253係用以連結第一旋轉元件2 51及第二旋轉元件 2 52 ’於本實施例中，該第一旋轉元件25ι及第二旋轉元件 2 5 2係分別為一直徑大小不同之齒輪，而該連動元件2 5 3係為一具有齒紋之皮帶。當然，配合該第一旋轉元件2 5 1及第二旋轉元件252之型態，該連動元件253亦可有不同之態樣0 請再參考圖4所示，該控制單元2 6係與該驅動單元2 4 電連接（未不於圖）’其係设有一電源開關261、一正反轉控制器262、及一轉速控制器263。該電源開關261係用以控制該驅動單元2 4之啟動、關閉，該正反轉控制器2 6 2及轉速控制器263係分別用以控制該驅動單元24之轉動方向與轉動速度。如圖4所示，該控制單元26其係設置於該固定元件22 3上。Page 8 552662, description of the invention (5) A transmission changing unit 23 is arranged on the bearing element 222, as shown in Fig. 4. The transmission changing unit 23 is provided with a first transmission shaft in a different direction. 231 and a second transmission shaft 232. Please refer to FIG. 4 again, the driving unit 24 is disposed on the fixing element 223 'which is interconnected with the first transmission shaft phase 231 of the transmission changing unit 23' to drive the first transmission shaft 2 3 1. In this embodiment, the driving unit 24 is a motor. As shown in Figs. 4 and 5, the transmission unit 25 is provided with a first rotating element 251, a second rotating element 252, and a linkage element 253. The first rotation element 25 1 is connected to the connecting plate 2 21, and the second rotation element 2 52 is connected to the second transmission shaft 232 of the transmission changing unit 23. The linking element 253 is used to connect the first rotating element 2 51 and the second rotating element 2 52 ′. In this embodiment, the first rotating element 25 ι and the second rotating element 2 5 2 are respectively different diameters. Gear, and the linkage element 2 5 3 is a toothed belt. Of course, according to the shape of the first rotating element 251 and the second rotating element 252, the linkage element 253 may have different appearances. 0 Please refer to FIG. 4 again, the control unit 26 and the drive The unit 24 is electrically connected (not shown in the figure). It is provided with a power switch 261, a forward and reverse controller 262, and a speed controller 263. The power switch 261 is used to control the driving unit 24 to be turned on and off, and the forward and reverse controller 26 and the rotation speed controller 263 are used to control the rotation direction and the rotation speed of the driving unit 24, respectively. As shown in FIG. 4, the control unit 26 is disposed on the fixed element 223.

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機21 考圖2及圖3所示’該測試頭27係電性連接至主其係設置於該機械手臂22之前端的連結板2?1，0 能因該第一旋轉元件251轉當^ 單 23 ^ Μ I .，、、動早兀24之動力則經由該傳動變向單元 z d之弟一傳動軸2 3 1傳一動軸232上之第- J 動軸232 ’此時’該第二傳該連動开杜H 件乃因而旋轉。之後，再經由使該測試頭27轉之動作動而使該第一旋轉元件251旋轉，進而 # w i外，上述半導體測試裝置更包含一電源單元（未示 J ! ’該電源單元係電連接於該控制單元26，該控制 ^ ^之電源開關26 1係用以控制該電源單元，俾使該驅動皁元作動。 ^上所述’由於依本發明之半導體測試裝置係藉由一，制單元2 6來控制驅動單元2 4，再將其動力傳入傳動變向，元2 3及傳動單元2 5，進而得以使測試頭2 7作動，並使測 4頭2=轉向’因此可以符合自動化及省時的要求，並且也達到卽省操作人力的目的。同時，測試人員也可因此避免職業傷害。以上所述僅為舉例性，而非為限制性者。任何未脫離本發明之精神與範疇，而對其進行之等效修改或變更，均應包含於後附之申請專利範圍中。Machine 21 considers Fig. 2 and Fig. 3 'The test head 27 is electrically connected to the main connecting plate 2? 1,0 which is set at the front end of the robot arm 22, and can be turned by the first rotating element 251. ^ single The power of 23 ^ Μ I. ,, and Diaozao 24 is transmitted through the transmission direction changing unit zd-a transmission shaft 2 3 1-a first on the moving shaft 232-J moving shaft 232 'at this time' the second transmission The linked Kaidu H pieces are thus rotated. After that, the first rotating element 251 is rotated by rotating the test head 27, and the above-mentioned semiconductor test device further includes a power supply unit (not shown). The power supply unit is electrically connected to The control unit 26 and the control power switch 261 are used to control the power supply unit and actuate the driving soap unit. ^ The above-mentioned 'since the semiconductor test device according to the present invention is manufactured by one unit 2 6 to control the drive unit 24, and then transfer its power to the drive to change the direction, yuan 23 and drive unit 25, so that the test head 27 can be actuated, and the test head 2 2 = steering, so it can meet the automation And time-saving requirements, and also achieve the goal of saving manpower. At the same time, testers can also avoid occupational injuries. The above is only exemplary, not restrictive. Anything that does not depart from the spirit of the present invention and The scope, and equivalent modifications or changes made to it shall be included in the scope of patent application attached.

552662 圖式簡單說明【圖式簡單說明】圖1係習知半導體測試裝置之要部示意圖。圖2係本發明之導體測試裝置之要部示意圖。圖3係本發明之導體測試裝置之要部作動示意圖。圖4係本發明之導體測試裝置之部分要部放大示意圖。圖5係本發明之導體測試裝置之另一部分要部放大示意圖。圖6係本發明之導體測試裝置之另一部分要部放大示意圖，圖中，半導體測試裝置之測試頭係呈轉動狀態。【圖式符號說明】 2 半導體測試裝置 21 主機 2 2 機械手臂 221 連結板 222承載元件 2 2 3固定元件 23 傳動變向單元 231第一傳動轴 232第二傳動軸 24 驅動單元 25 傳動單元 2 5 1第一旋轉元件552662 Brief description of the drawings [Simplified description of the drawings] Figure 1 is a schematic diagram of the main parts of a conventional semiconductor test device. FIG. 2 is a schematic diagram of the main parts of the conductor testing device of the present invention. FIG. 3 is a schematic diagram of the main parts of the conductor testing device of the present invention. Fig. 4 is an enlarged schematic view of a main part of a conductor testing device of the present invention. Fig. 5 is an enlarged view of a main part of another part of the conductor testing device of the present invention. Fig. 6 is an enlarged view of another part of the conductor testing device of the present invention. In the figure, the test head of the semiconductor testing device is in a rotating state. [Symbol description] 2 Semiconductor test device 21 Host 2 2 Robotic arm 221 Link plate 222 Carrying element 2 2 3 Fixing element 23 Drive changing unit 231 First drive shaft 232 Second drive shaft 24 Drive unit 25 Drive unit 2 5 1First rotating element

第11頁 552662 圖式簡單說明 2 5 2第二旋轉元件 2 5 3 連動元件 2 6 控制單元 2 6 1電源開關 2 6 2正反轉控制器 2 6 3轉速控制器 27 測試頭 ΙΙΙΙϋΙΙ 第12頁Page 11 552662 Brief description of the drawing 2 5 2Second rotating element 2 5 3 Linking element 2 6 Control unit 2 6 1 Power switch 2 6 2 Forward and reverse controller 2 6 3 Speed controller 27 Test head ΙΙΙΙϋΙΙ Page 12

Claims

552662 六、申請專利範圍 1、一種半導體測試裝置，包含：一主機，係用以收集、處理測試資料；一機械手臂，其一端部係枢設於該主機，其另一端部之前端係設有一連結板，且該另一端部之下方係設有一承載元件，該承載元件之一端係垂直延設有一固定元件；一傳動變向單元，係設置於該承載元件上，且該傳動變向單元係具有不同方向之一第一傳動轴及一第二傳動轴；一驅動單元，係設置於該固定元件上，且與該傳動變向單元之第一傳動軸相互連接，用以驅動該第一傳動軸；一傳動單元，係設有一第一旋轉元件、一第二旋轉元件、及一連動元件，該第一旋轉元件係軸設於該連結板上，該第二旋轉元件係連結於該傳動變向單元之第二傳動軸，該連動元件係用以連結該第一旋轉元件及該第二旋轉元件；一控制單元，係與該驅動單元電連接，用以控制該驅動單元之轉動方向與轉動速度，其係設置於該固定元件上；以及一測試頭’係電性連接至該主機5設置於該機械手臂之前端的連結板，且能因第一旋轉元件轉動而轉動；當該驅動單元被啟動時，該驅動單元之動力則經由該傳動變向單元之第一傳動軸傳至該第二傳動軸，該第二傳動軸上之第二旋轉元件乃因而旋轉，再經由該連動元件之作動而使該第一旋轉元件旋轉，進而使該測試頭轉動。552662 VI. Application for Patent Scope 1. A semiconductor test device, including: a host computer for collecting and processing test data; a robotic arm, one end of which is pivotally mounted on the host, and the other end of which is provided with a A connecting plate, and a load bearing element is arranged below the other end, and one end of the load bearing element is vertically extended with a fixing element; a transmission changing unit is arranged on the bearing element, and the transmission changing unit is A first transmission shaft and a second transmission shaft with different directions; a driving unit is arranged on the fixing element and is connected with the first transmission shaft of the transmission changing unit to drive the first transmission A shaft; a transmission unit provided with a first rotation element, a second rotation element, and a linkage element, the first rotation element is provided on the connecting plate, and the second rotation element is connected to the transmission A second transmission shaft of the steering unit, the linkage element is used to connect the first rotation element and the second rotation element; a control unit is electrically connected to the drive unit For controlling the rotation direction and rotation speed of the driving unit, which are arranged on the fixed element; and a test head 'is electrically connected to the connecting plate of the host 5 disposed at the front end of the robot arm, and A rotating element rotates and rotates; when the drive unit is started, the power of the drive unit is transmitted to the second drive shaft through the first drive shaft of the drive steering unit, and the second rotation on the second drive shaft The element is thus rotated, and then the first rotating element is rotated by the action of the linking element, so that the test head is rotated.

第13頁六、申請專利範圍 2如申凊專利範圍第1項半導體測試裝置更包含」於該控制單元。所述之半導體測試裝置，電源單元，該電源單元係其中該電連接、如申請專利範圍傳動單…-旋轉：V:/利動述之半導體測試裝置5傳動如星申一睛專利範圍第3項所述之半導體测試裝置傳動…連動元件為齒紋皮帶。 ’置其中該其中該其中該丐區# w申明專利範圍第1項所述之半導體測試裝置， .動早元係為馬達。 7 如申请專利範圍第1項所述之半導體測試裝置，控制單元係包含一電源開關、一正反轉控制器、及希J器其中’ S亥電源開關係用以控制該驅動單元 ^、關閉，該正反轉控制器及轉速控制器係分別用該驅動單元之轉動方向與轉動速度。其中該其中該一轉速之啟以控制Page 13 6. Scope of patent application 2 If the scope of patent application item 1 of the semiconductor testing device is included in the control unit. Said semiconductor test device, power supply unit, the power supply unit is in which the electrical connection, such as the scope of patent application, transmission unit ... The transmission of the semiconductor testing device described in the above item ... the linkage element is a toothed belt. The semiconductor test device described in the first item of the patent scope is set as the motor. 7 The semiconductor test device as described in item 1 of the scope of the patent application, the control unit includes a power switch, a forward and reverse controller, and a J device, wherein the power supply is connected to control the drive unit, and closed. The forward and reverse controller and the speed controller use the rotation direction and speed of the drive unit, respectively. Where the speed of one is controlled by