TW548708B

TW548708B - Support table apparatus, exposure apparatus, and manufacturing method of device

Info

Publication number: TW548708B
Application number: TW091106100A
Authority: TW
Inventors: Makoto Kondo
Original assignee: Nikon Corp
Priority date: 2001-03-28
Filing date: 2002-03-28
Publication date: 2003-08-21
Also published as: JPWO2002080185A1; WO2002080185A1

Abstract

On the action point of thrust when using linear motor (36X) to drive the wafer support table (WST) in the X-axis direction, the weight center position of the wafer support table for placing the wafer (W) is set. Therefore, when driving the wafer support table (WST) in the X-axis direction, the unnecessary rotation torque of the wafer support table will not be generated such as vertical swing and lateral swing. Thus, the vibration of wafer support table caused by the vertical swing and lateral swing can be suppressed so as to increase the posture stability and position controllability of the wafer support table.

Description

548708 A7 ______ B7 ________ 五、發明說明（/ ) [技術領域] 本發明係有關於載台裝置及曝光裝置、以及元件製造方法，詳而言之，係有關具備有固定物體而移動的載台與驅動該載台之驅動裝置的載台裝置、以及及備有該載台裝置之曝光裝置、以及使用該曝光裝置之元件製造方法。 [習知技術] 傳統上，製造半導體元件（積體電路)或液晶顯示元件等的微影製程，會使用種種的曝光裝置。近年來，隨著半導體元件的高度積體化，步進重覆方式的縮小投影曝光裝置（所謂的步進器），或對該步進型加以改良的步進掃描方式的掃描型投影曝光裝置（所謂的掃描步進器）等的逐次移動型的投影曝光裝置，即形成一種主流。此種曝光裝置’由於必須將形成於光罩或標線片(以下，稱標線片)的圖案，予以依次轉印至晶圓等基板上之複數個曝光照射區域’故使用具有載台之載台裝置，此載台係保持標線片或晶圓以進行1維或2維移動。該載台裝置’由於必須實現高精度的曝光，故在要求載台之高定位性能的同時，亦爲了提昇曝光動作的產率 (throughput)，也被要求高加速度及高速移動時的高度位置之控制性。因應於此，近年來基於在更高速、不受機械性導引面的精度#響下以筒精度進彳了晶圓或標線片之位置控制、且避免機械性的磨擦而能延長使用壽命的需求，開發了以非接觸狀態來驅動用以保持晶圓等載台之載台裝置。本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公爱） (請先閱讀背面之注意事項再填寫本頁)548708 A7 ______ B7 ________ V. Description of the Invention (/) [Technical Field] The present invention relates to a stage device, an exposure device, and a method for manufacturing a component. Specifically, the invention relates to a stage that has a fixed object and moves. A stage device that drives a stage driving device, and an exposure device provided with the stage device, and a method for manufacturing a component using the exposure device. [Conventional Technology] Conventionally, various lithographic processes for manufacturing semiconductor devices (integrated circuits) or liquid crystal display devices have used various exposure devices. In recent years, as semiconductor elements are highly integrated, a step-and-repeat method of reducing projection exposure (a so-called stepper) or a step-scan type projection-exposure device which is an improved step-scan method (So-called scan stepper) and other successive projection type exposure devices have become a mainstream. Such an exposure device 'uses a pattern formed on a photomask or a reticle (hereinafter, referred to as a reticle) and sequentially transfers it to a plurality of exposure irradiation areas on a substrate such as a wafer'. A stage device that holds a reticle or wafer for 1-dimensional or 2-dimensional movement. Since the stage device 'must achieve high-precision exposure, while requiring high positioning performance of the stage, in order to improve the throughput of the exposure operation, it is also required to have high acceleration and high position during high-speed movement. Controllable. Because of this, in recent years, based on the higher speed and accuracy of the mechanical guide surface, the position control of the wafer or the reticle is carried out with the accuracy of the cylinder, and the mechanical life can be extended to avoid mechanical friction. In order to meet the needs, we developed a stage device that drives a stage such as a wafer in a non-contact state. This paper size applies to Chinese National Standard (CNS) A4 (21〇 X 297 public love) (Please read the precautions on the back before filling this page)

548708 A7 —___B7 __ 五、發明說明（2 ) 作爲此種載台裝置的驅動源，採用電磁力驅動方式之線性馬達爲目前之主流。例如使用該線性馬達作爲基板載台的驅動源時，一般來說，係在載置基板的保持台下側，配置線性馬達的可動構件構件，藉由該可動構件與固定構件（線性導件）間之電石放相互作用所產生的洛倫玆(lorentz)力，沿固定構件、且沿形成於載台基座(平台)上面的導引面驅動載台。然而，即使是在習知技術中，爲了能達到載台之位置控制性的提昇，亦對載台的驅動方法(例如線性馬達的驅動控制方法等），或作爲載台移動基準的導引面的平坦度等的改善，進行各種技術改良。但是，隨著近年來半導體元件的高度積體化，對於基板載台等的位置控制性的要求變得更爲嚴苛，而現今的載台驅動方法，或導引面平坦度的改善等的手法，確越來越無法達成所要求之載台之位置控制性。亦即，原本幾乎不被視爲是問題點的載台裝置本身(載台或驅動裝置、或兩者之組合)所造成之位置控制性的下降要因，例如因線性馬達驅動載台時所產生的載台振動等逐漸成爲無法忽視的程度。與上述相同的問題，亦能發生於曝光裝置以外的精密機器的載台裝置。本發明，有鑑於上述問題，其第1目的 ’係提供能達成載台的位置控制性的提昇之載台裝置。本發明桌2目的’係提供能實現局精度曝光之曝光裝置。 (請先閱讀背面之注意事項再填寫本頁)548708 A7 —___ B7 __ V. Description of the invention (2) As a driving source of such a stage device, a linear motor using an electromagnetic force driving method is the current mainstream. For example, when the linear motor is used as a driving source of a substrate stage, generally, a movable member member of the linear motor is arranged below the holding table on which the substrate is placed, and the movable member and the fixed member (linear guide) The lorentz force generated by the interaction between the calcium carbide discharges drives the stage along the fixed member and along the guide surface formed on the stage base (platform). However, even in the conventional technology, in order to improve the controllability of the position of the carrier, the driving method of the carrier (such as the drive control method of a linear motor, etc.) or the guide surface used as a reference for the movement of the carrier To improve the flatness, etc., various technical improvements have been made. However, with the recent high integration of semiconductor devices, the requirements for position controllability of substrate stages and the like have become more stringent, and today's stage driving methods and the improvement of the flatness of the guide surface have become more demanding. It is indeed increasingly difficult to achieve the required position control of the carrier. That is, the factor of the decrease in position control caused by the stage device itself (the stage or the driving device, or a combination of the two) which is hardly regarded as a problem point, for example, caused by the linear motor driving the stage The vibration of the stage gradually becomes a degree that cannot be ignored. The same problem as described above can also occur in the stage device of a precision machine other than the exposure device. In view of the above-mentioned problems, a first object of the present invention is to provide a stage device capable of improving the position controllability of a stage. The object of the table 2 of the present invention is to provide an exposure device capable of achieving local-accurate exposure. (Please read the notes on the back before filling this page)

紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） 548708 A7 ------ B7 _________ 五、發明說明（3 ) 本發明第3目的，係提供能提昇高積體度元件之生產性之元件製造方法。 [用以解決課題之手根據第1觀點，本發明之第1載台裝置，其特徵在於，具備：載置物體的載台；及驅動該載台於至少既定之1軸方向之驅動裝置； ^ 即述載台的重心位置，係設定於前述驅動裝置在驅動則述載台於至少前述既定之丨軸方向時的驅動軸上。本說明書中’所謂的「驅動軸」，並非指如進給螺桿驅動方式的物理性驅動軸，而是意味在驅動載台時驅動裝置賦予載台之推力的作用點(存在複數個作用點時，則係綜合該等作用點之實質作用點）、與以該推力方向所規定的假想性軸(亦包a依據驅動方式，該軸與物理性驅動軸一致之情形）。據此’裝載物體之載台的重心位置，係設定在藉由驅動裝置驅動載台於至少既定之i軸方向時的驅動軸上。亦即’由於載台被驅動於前述既定1軸方向時，該推力作用點與載台的重心位置一致，故能防止繞與前述1軸(通過載台的重心)正交之軸的旋轉力矩產生。據此，即能有效的抑制載台產生繞正交於前述1軸之軸的旋轉、進而抑制起因於此的振動。因此，能提昇載台的姿勢安定性及位置控制性。 _____ 5 _ 本紙張尺度適用中國國豕標準（CNS)A4規格（210 X 297公爱） (請先閱讀背面之注意事項再填寫本頁) ;0 ϋ II ϋ ;! n n 一 · M·— SI 11 SI 1 βΜΜβ s KM 1 548708 A7 —-^-__B7________ 五、發明說明U ) 此時，前述驅動裝置可在移動面內，驅動前述載台於前述既定1軸方向及正交於此的另1軸方向。此情形中，關於另1軸方向，其驅動軸與載台重心位置一致者較佳。本發明之第1載台裝置中，作爲驅動裝置雖可考量進給螺桿與旋轉馬達的組合、或平面馬達等種種構成，但前述驅動裝置，例如可以是線性馬達。本發明之第1載台裝置中，前述載台，具備用以保持前述物體的保持台、及用以支撐該保持台的載台本體部，前述重心位置至前述驅動軸上的設定，可藉由前述載台本體部重心位置的調整來進行。此情形中，可進一步具備安裝於前述載台本體部之前述重心位置調整用的配重構件。本發明之第1載台裝置，在前述載台爲具備前述保持台與前述載台本體部時，前述載台本體部重心位置的調整 ’可藉由使用高密度構件來作爲構成前述載台本體部的局部構件而實現。此情形中，進一步具備氣體靜壓軸承，以相對作爲前述載台移動基準的導引面，透過既定間隙懸浮支持前述載台本體部及前述保持台；前述局部構件，係設置前述氣體靜壓軸承的底面構件。此情形中，在前述底面構件的底面，能形成有既定深度的凹部。本發明之第1載台裝置中，在前述載台的位置，係藉由干涉計加以測量時，進一步具備前述干涉計用的移動鏡 —-—________6__ 幸、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) -The paper size applies the Chinese National Standard (CNS) A4 specification (210 χ 297 mm) 548708 A7 ------ B7 _________ V. Description of the invention (3) The third object of the present invention is to provide components that can improve the high-level physical fitness Production method of component manufacturing. [Hand to solve the problem According to the first viewpoint, the first stage device of the present invention is characterized by comprising: a stage on which an object is placed; and a driving device that drives the stage in at least a predetermined one-axis direction; ^ The position of the center of gravity of the carrier is set on the drive shaft when the drive device drives the carrier in at least the predetermined axis direction. In this specification, the so-called "drive shaft" does not refer to a physical drive shaft such as a feed screw drive method, but means a point of action of the thrust force given to the stage by the driving device when the stage is driven (when there are multiple points of action) , It is the synthesis of the actual action points of these action points), and the imaginary axis specified by the thrust direction (also includes a according to the driving mode, the axis is consistent with the physical drive axis). Based on this, the position of the center of gravity of the stage on which the object is loaded is set on the drive shaft when the stage is driven by at least the predetermined i-axis direction by the drive device. That is, 'when the stage is driven in the predetermined one-axis direction, the thrust acting point is consistent with the position of the center of gravity of the stage, so it is possible to prevent a rotation moment about an axis orthogonal to the aforementioned one axis (through the center of gravity of the stage). produce. Accordingly, it is possible to effectively suppress the rotation of the stage about the axis orthogonal to the first axis, and further suppress the vibration caused by this. Therefore, the posture stability and position control of the stage can be improved. _____ 5 _ This paper size is applicable to China National Standard (CNS) A4 (210 X 297 public love) (Please read the precautions on the back before filling out this page); 0 ϋ II ϋ;! Nn I · M · — SI 11 SI 1 βΜΜβ s KM 1 548708 A7 —- ^ -__ B7________ V. Description of the invention U) At this time, the aforementioned driving device can drive the aforementioned stage in the predetermined 1-axis direction and the other 1 orthogonal thereto in the moving plane. Axis direction. In this case, it is preferable that the position of the drive shaft and the center of gravity of the stage with respect to the other axis direction be the same. In the first stage device of the present invention, although various configurations such as a combination of a feed screw and a rotary motor, or a planar motor can be considered as a driving device, the aforementioned driving device may be, for example, a linear motor. In the first stage device of the present invention, the stage includes a holding stage for holding the object, and a stage body for supporting the holding stage. The setting of the position of the center of gravity to the driving shaft can be borrowed. This is performed by adjusting the position of the center of gravity of the stage body. In this case, a weight member for adjusting the position of the center of gravity of the stage body may be further provided. According to the first stage device of the present invention, when the stage includes the holding stage and the stage body, the position of the center of gravity of the stage body can be adjusted by using a high-density member as the stage body. It is implemented as a local component. In this case, it is further provided with a hydrostatic bearing to support the carrier body portion and the holding platform through a predetermined gap with a guide surface that is a reference for the movement of the carrier, and the local member is provided with the aerostatic bearing.的 bottom face member. In this case, a recess of a predetermined depth can be formed on the bottom surface of the bottom surface member. In the first stage device of the present invention, when the position of the stage is measured by an interferometer, it is further provided with a moving mirror for the interferometer —-________ 6__ Fortunately, the paper size applies the Chinese National Standard (CNS) A4 size (210 X 297 mm) (Please read the notes on the back before filling this page)-

— — — — — — — · I I 548708 A7 -----------B7________ 五、發明說明（金） ’其係在與前述載台之間形成空隙之狀態下，至少以2點固定於前述載台。根據第2觀點，本發明之第2載台裝置其特徵在於，具備·· 載台，係用以載置物體，且相對作爲移動基準的導引面透過既定間隙被懸浮支持；及驅動裝置，係沿前述導引面驅動前述載台於至少既定之1軸方向；在構成前述載台之底面構件底面，形成有既定深度的凹部。據此，在構成裝載物體之載台的底面構件之底面，形成有既定深度的凹部。亦即，對於載台的移動基準的導引面其凹部之部份，係具有底面構件的其他部份以上的間隙。因此，在載台爲藉由驅動裝置來驅動於例如前述既定的 1軸方向時，因該驅動而在載台產生振動時，藉由存在於載台凹部與導引面間的氣體，能衰減載台主要爲重力方向的振動。亦即，例如在載台係振動於重力方向時，存在於前述凹部與導引面間的氣體(例如空氣)即在凹部內移動、或欲自凹部脫離而出，但此時，因該氣體的粘性而使該氣體發揮一種減震器之作用，而主要衰減載台重力方向的振動。因此，藉由該載台振動的衰減能提昇載台的位置控制性。此情形中，在前述載台的位置，係藉由干涉計加以測量時，進一步具備前述干涉計用的移動鏡，其係在與前述木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)— — — — — — — · II 548708 A7 ----------- B7________ V. Description of the invention (gold) 'It is at least 2 points in the state where a gap is formed with the aforementioned carrier. It is fixed to the aforementioned stage. According to a second aspect, the second stage device of the present invention is provided with: a stage for placing an object, which is suspended and supported through a predetermined gap with respect to a guide surface serving as a movement reference; and a driving device, The carrier is driven along the guide surface in at least a predetermined one-axis direction; a recess of a predetermined depth is formed on a bottom surface of a bottom member constituting the carrier. Accordingly, a recessed portion having a predetermined depth is formed on the bottom surface of the bottom surface member constituting the stage on which the object is loaded. That is, the recessed part of the guide surface of the movement reference of the stage has a clearance above the other parts of the bottom member. Therefore, when the stage is driven in a predetermined one-axis direction by a drive device, for example, when the stage vibrates due to the driving, the gas existing between the stage recess and the guide surface can be attenuated. The stage is mainly a vibration in the direction of gravity. That is, for example, when the stage system vibrates in the direction of gravity, the gas (for example, air) existing between the recessed portion and the guide surface moves within the recessed portion, or exits from the recessed portion, but at this time, the gas The viscosity of the gas makes the gas act as a shock absorber, and mainly attenuates the vibration of the gravity direction of the carrier. Therefore, the position controllability of the stage can be improved by the attenuation of the stage vibration. In this case, when the position of the aforementioned stage is measured by an interferometer, a moving mirror for the interferometer is further provided, which is in accordance with the Chinese National Standard (CNS) A4 standard (210 X) with the aforementioned wood and paper scale. 297 mm) (Please read the notes on the back before filling this page)

548708 A7 ____B7_____ 五、發明說明（心）載台之間形成空隙之狀態下，至少以2點固定於前述載台〇此情形中，前述移動鏡對向於前述載台的部份，設定有與前述載台接觸的至少2處的接觸部、及不與前述載台接觸的非接觸部。此情形中，前述接觸部係設置於前述移動鏡的前述載台對向面的凸部。又，前述移動鏡係以前述接觸部螺固於前述載台，前述移動鏡的螺固位置周邊部份與其他的部份相較，爲低剛性。本發明之第2載台裝置中，前述載台的重心位置，能設定在前述載台之驅動軸上。根據第3觀點，本發明之第3載台裝置，特徵在於，具備：載台，係用以載置物體，且其位置以干渉計加以測量 ;及前述干涉計用的移動鏡，係在與前述載台之間形成空隙之狀態下，至少以2點固定於前述載台。據此，測量載台位置之干涉計用的移動鏡，係在與載台之間形成空隙的狀態下，以至少2點固定於載台。是故 ’例如在載台驅動時載台產生振動，當該振動傳達至移動鏡’即藉由存在於移動鏡與載台間的氣體(例如空氣）即能衰減移動鏡的振動。亦即，因移動鏡之振動使氣體在前述空隙內移動、或欲自空隙脫離而出時，因該氣體的粘性而使該氣體發揮一種減震器之作用，來衰減移動鏡的振動。 _______8 ______ 私紙張尺度適用中國國家標準（CNS)a4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) I _ ϋ n ϋ n 11 n n I SI n —fi li ii Βϋ I I · 548708 A7 --—____B7____ 五、發明說明（Π ) 承上所述’由於係透過振動被哀減的移動鏡以干涉計測量載台的位置，故能進行載台的高精度的位置測量、進而進行高精度的位置控制。此時’前述移動鏡對向於前述載台的部份，設定有與則述載台接觸的至少2處的接觸部、及不與前述載台接觸的非接觸部。此情形中，前述接觸部，可以是前述移動鏡之對向面所設置的凸部。又，前述移動鏡係以前述接觸部螺固於前述載台’前述移動鏡的螺固位置周邊部份與其他的部份相較，爲低剛性之構成。本發明之第3載台裝置中，前述載台的重心位置，能設定在前述載台之驅動軸上。根據第4觀點，本發明之曝光裝置，係將第1物體上形成之圖案轉印至第2物體上，其特徵在於：具備本發明之第1〜第3載台裝置之任一者，來作爲前述第1物體與前述第2物體中至少一方之驅動裝置。據此，由於具備高位置控制性的載台裝置來作爲第1 物體與第2物體之至少一方的驅動裝置，故能提昇第1物體與第2物體之對位精度、或對第2物體之圖案的重疊精度。亦即，能達成曝光精度的提昇。此外，在微影製程中，藉由使用本發明之曝光裝置將第1物體的圖案轉印於第2物體上，即能在第2物體上形成精度佳的圖案，據此，而能以較佳的製造良率(yield)製造更高積體度的微元件。因此，自本發明的另一觀點而言各紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂----------線-fP-丨548708 A7 ____B7_____ 5. Description of the Invention (Heart) In the state where a gap is formed between the carriers, it is fixed to the aforementioned carriers at least 2 points. In this case, the part of the aforementioned moving mirror facing the aforementioned carriers is set with A contact portion at least two places where the carrier contacts, and a non-contact portion which does not contact the carrier. In this case, the contact portion is a convex portion provided on an opposite surface of the stage of the moving mirror. In addition, the moving mirror is screwed to the stage with the contact portion, and the peripheral portion of the screwing position of the moving mirror is lower in rigidity than other parts. In the second stage device of the present invention, the position of the center of gravity of the stage can be set on the drive shaft of the stage. According to a third aspect, a third stage device of the present invention is characterized by comprising: a stage for placing an object, and the position of the stage is measured by a dry meter; and the moving mirror for the interferometer is connected with In a state where a gap is formed between the carriers, the carrier is fixed to the carrier at least two points. Accordingly, the moving mirror for the interferometer for measuring the position of the stage is fixed to the stage at least two points in a state where a gap is formed between the stage and the stage. Therefore, ‘for example, the stage generates vibration when the stage is driven, and when the vibration is transmitted to the moving mirror’, the vibration of the moving mirror can be attenuated by the gas (such as air) existing between the moving mirror and the stage. That is, when the gas moves in the aforementioned space due to the vibration of the moving mirror, or when it is about to escape from the space, the gas acts as a shock absorber due to the viscosity of the gas to attenuate the vibration of the moving mirror. _______8 ______ The private paper size applies to the Chinese National Standard (CNS) a4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) I _ ϋ n ϋ n 11 nn I SI n —fi li ii Βϋ II · 548708 A7 --- ____B7____ V. Description of the invention (Π) According to the above description, "The position of the stage is measured by the interferometer because of the moving mirror that is attenuated by vibration, so it can measure the position of the stage with high accuracy And then perform high-precision position control. At this time, the portion of the moving mirror facing the carrier is provided with at least two contact portions that are in contact with the carrier and non-contact portions that do not contact the carrier. In this case, the contact portion may be a convex portion provided on the facing surface of the moving mirror. In addition, the moving mirror has a lower rigidity compared with other parts by screwing the contact portion to the stage of the screw position of the moving mirror. In the third stage device of the present invention, the position of the center of gravity of the stage can be set on the drive shaft of the stage. According to a fourth aspect, the exposure apparatus of the present invention transfers a pattern formed on a first object onto a second object, and is characterized by including any one of the first to third stage devices of the present invention. As a driving device for at least one of the first object and the second object. Accordingly, since the stage device having high position controllability is used as a driving device for at least one of the first object and the second object, the alignment accuracy of the first object and the second object can be improved, or the accuracy of the second object can be improved. Pattern overlap accuracy. That is, improvement in exposure accuracy can be achieved. In addition, in the lithography process, by using the exposure device of the present invention to transfer the pattern of the first object onto the second object, it is possible to form a pattern with high accuracy on the second object. Good manufacturing yield (yield) to manufacture higher integrated micro-components. Therefore, from another point of view of the present invention, each paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) Order ------ ---- line-fP- 丨

f n n 1 ϋ 1· ι ϊ I I— a«l n H 8— 81 n 1 memMm 1 ϋ 548708 A7 一1 ' — .. B7 —--___^f n n 1 ϋ 1 · ι ϊ I I— a «l n H 8— 81 n 1 memMm 1 ϋ 548708 A7 a 1 '— .. B7 —--___ ^

五、發明說明U ，可說是使用本發明的曝光裝置之元件製造方法。 [圖式之簡單說明] 圖1，係槪略顯示本發明之一實施形態之曝光裝置白勺圖。圖2A ’係自斜上方所見之晶圓載台的立體圖，圖2b 係自斜下方所見之晶圓載台的立體圖。圖3,係用以說明晶圓載台重心位置之調整方法的圖〇圖4A，係放大顯示移動鏡的立體圖，圖4B係放大顯示形成於移動鏡之螺固部附近的圖，圖4C係圖4B之A-A 線截面圖。圖5，係用以說明本發明之元件製造方法的流程圖。圖6，係顯示圖5之步驟216之詳細例的流程圖。 [符號元件說明] (請先閱讀背面之注意事項再填寫本頁) 訂----------線—▲ 10 曝光裝置 15 移動鏡 16 標線片雷射干涉計 20 主控制裝置 21X，21Y 移動鏡 21yf, 2lye 螺固部 22 標線片載台驅動部 23 晶圓雷射干涉計 _ ____10 參纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 548708 A7 ___B7 五、發明說明（？） 24 晶圓載台驅動部 25 晶圓保持具 26 防振單元 30 晶圓載台本體部 32x 可動構件 34x X軸線性導件 34yl Y軸線性導件 36x X軸線性馬達 36Y1，36Y2 Y軸線性馬達 40 載台基座 40a 導引面 42A，42B 支持構件 44Al5 44A2 加重構件 46 底面構件 46a 凹部 46b，46c 平面部 48 頂板 50 晶圓載台裝置 52 可動構件桿軛 54N、54S 磁鐵 56Y 座板 62 圓孔 62a 矩形狀槽部 62c，62d 矩形孔 11 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 548708 A7 五、發明說明（5. Description of the invention U can be said to be a method for manufacturing a device using the exposure apparatus of the present invention. [Brief description of the drawings] FIG. 1 is a diagram showing an exposure apparatus according to an embodiment of the present invention. FIG. 2A ′ is a perspective view of a wafer stage as viewed from above, and FIG. 2b is a perspective view of a wafer stage as viewed from below. FIG. 3 is a diagram for explaining a method of adjusting a center of gravity position of a wafer stage. FIG. 4A is an enlarged view showing a perspective view of a moving mirror, and FIG. 4B is an enlarged view showing a portion near a screw portion of the moving mirror, and FIG. 4C is a view Sectional view of line A of 4B. FIG. 5 is a flowchart illustrating a method for manufacturing a device according to the present invention. FIG. 6 is a flowchart showing a detailed example of step 216 in FIG. 5. [Description of Symbol Components] (Please read the precautions on the back before filling this page) Order ---------- Lines-▲ 10 Exposure Device 15 Moving Mirror 16 Graticule Laser Interferometer 20 Main Control Device 21X, 21Y moving mirror 21yf, 2lye screwing part 22 reticle stage driving part 23 wafer laser interferometer _ ____10 reference paper size applicable to China National Standard (CNS) A4 specification (210 X 297 public love) 548708 A7 ___B7 V. Description of the invention (?) 24 Wafer stage driving unit 25 Wafer holder 26 Anti-vibration unit 30 Wafer stage body 32x Movable member 34x X-axis linear guide 34yl Y-axis linear guide 36x X-axis linear motor 36Y1 36Y2 Y-axis linear motor 40 Stage base 40a Guide surface 42A, 42B Support member 44Al5 44A2 Weighting member 46 Bottom member 46a Recess 46b, 46c Flat portion 48 Top plate 50 Wafer stage device 52 Movable member lever yoke 54N, 54S Magnet 56Y Seat plate 62 Round hole 62a Rectangular groove portion 62c, 62d Rectangular hole 11 (Please read the precautions on the back before filling this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 male) ) 548708 A7 V. invention will be described (

72 80 102 l〇2a 102b F IL ΙΟΡ R RST PL W WST WTB 螺栓螺絲孔氣體靜壓軸承噴出口槽地面曝光用照明用光照明系統標線片標線片載台投影光學系統晶圓晶圓載台晶圓保持台 [發明之最佳實施形態] 以下，根據圖1〜圖4C說明本發明之一實施形態。圖1，係槪略顯示本發明之一實施形態之曝光裝置1< 的圖。該曝光裝置10係步進掃描方式之投影曝光裝置。該曝光裝置10，具備：照明系統I0P，用以保持作爲光罩(物體、第1物體)的標線片R之標線片載台RST，投影光學系鋪 PL，構成作爲基板(物體、第2物體)之晶圓W的驅動裝置之載台裝置的晶圓載台裝置50,以及控制此等的控制系鋪 12 (請先閱讀背面之注意事項再填寫本頁) -------訂--------- !線—來莽紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） 548708 A7 ------- B7_______ 五、發明說明（f| ) 等。照明系統IOP，係例如特開平10-112433號公報、特開平6-349701號公報及對應的美國專利第5,534,970號公報等所揭示的，具備光源、含有光學積分器之照度均勻化光學系統、中繼透鏡、可變ND濾波器、可變視野光圏(亦稱爲標線片遮簾或遮蔽葉片）、及分色鏡等（均未圖示）。此處’作爲光學積分器係使用複眼透鏡、內面反射型積分器( 棒狀積分器等）、或繞射光學元件等。在本案國際申請所指定的國家或選擇的國家的國內法令所允許的範圍內，援用上述美國專利之揭示作爲本說明書記載的一部份。該照明系統IOP，係在描繪有電路圖案等的標線片R 上，藉由作爲能量光束的照明用光IL，而以均勻的照度照射以標線片遮簾規定的狹縫狀的照明區域(在Y軸方向爲狹長之長方形狀的照明區域)部份。此處，作爲照明用光IL，係使用KrF準分子雷射光(波長248nm)等的遠紫外光、ArF 準分子雷射光(波長193nm)、或F2雷射光(波長157nm)等的真空紫外光等。作爲照明用光IL，亦可使用來自超高壓水銀燈的紫外光區域的輝線(g線、i線等）。在前述標線片載台RST上，標線片R係例如以真空吸附方式加以固定。標線片載台RST係藉由標線片載台驅動部22，而能在垂直於照明系統IOP之光軸(與後述投影光學系統PL之光軸一致)的XY平面內進行微驅動，且亦能在既定的掃描方向(此處係圖1中的紙面內左右方向的X軸方向），以指定的掃描速度進行驅動。又，標線片載台驅動 __ 13____ 幸、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)72 80 102 l〇2a 102b F IL ΙΟΡ R RST PL W WST WTB Bolt screw hole Gas static pressure bearing ejection slot Groove light exposure system reticle reticle stage projection optical system wafer wafer stage Wafer Holder [Best Embodiment of Invention] Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 to 4C. FIG. 1 is a diagram schematically showing an exposure apparatus 1 < according to an embodiment of the present invention. The exposure device 10 is a projection exposure device of a step-and-scan method. This exposure device 10 includes an illumination system I0P, a reticle stage RST that holds a reticle R as a photomask (object, first object), a projection optical system PL, and constitutes a substrate (object, first 2 objects) Wafer stage drive unit 50, wafer stage unit 50, and control system 12 that controls these (please read the precautions on the back before filling this page) ------- Order ---------! Line-Laimeng paper size applies Chinese National Standard (CNS) A4 (210 x 297 mm) 548708 A7 ------- B7_______ V. Description of the invention (f | ) Wait. The lighting system IOP is disclosed in, for example, Japanese Unexamined Patent Publication No. 10-112433, Japanese Unexamined Patent Publication No. 6-349701, and corresponding U.S. Patent No. 5,534,970, and includes a light source, an illuminance uniformization optical system including an optical integrator, Relay lens, variable ND filter, variable field of view light (also known as reticle curtain or shielding blade), and dichroic mirror (all not shown). Here, as the optical integrator, a fly-eye lens, an internal reflection type integrator (such as a rod integrator), or a diffractive optical element is used. To the extent permitted by the domestic laws of the country designated or the country selected in the international application in this case, the disclosure of the aforementioned U.S. patent is incorporated as part of this specification. This lighting system IOP is on a reticle R on which a circuit pattern or the like is drawn, and illuminates a slit-shaped illumination area defined by a reticle curtain with uniform illuminance with illumination light IL as an energy beam. (A narrow rectangular illumination area in the Y-axis direction). Here, as the illumination light IL, far-ultraviolet light such as KrF excimer laser light (wavelength 248nm), vacuum ultraviolet light such as ArF excimer laser light (wavelength 193nm), or F2 laser light (wavelength 157nm) is used. . As the illumination light IL, a glow line (g-line, i-line, etc.) from the ultraviolet light region of an ultra-high pressure mercury lamp can also be used. On the reticle stage RST, the reticle R is fixed by, for example, vacuum suction. The reticle stage RST is micro-driven in the XY plane perpendicular to the optical axis of the lighting system IOP (which is consistent with the optical axis of the projection optical system PL described later) by the reticle stage driving unit 22, and It can also be driven at a predetermined scanning speed in a predetermined scanning direction (here, the X-axis direction in the left-right direction on the paper surface in FIG. 1). In addition, the reticle stage drive __ 13____ Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page)

548708 A7 --- --- B7__ _ 五、發明說明（A ) 部22係以線性馬達、音圈馬達等作爲驅動源的機構，但爲了方便在圖1僅以方塊表示。標線片載台RST於移動面內的位置，係藉由標線片雷射干涉計(以下稱「標線片干涉計」）16，透過移動鏡15以例如0.5〜lnm程度的分解能力隨時加以檢測。此處，實際上，在標線片載台RST上設有具有正交於γ軸方向之反射面的移動鏡，及具有正交於X軸方向之反射面的移動鏡，且對應此等移動鏡設有標線片Y干涉計與標線片X干涉計，但圖1中係代表性的以移動鏡15、標線片干涉計16加以顯示。又，例如將標線片載台RST的端面進行加工而形成反射面(相當於移動鏡15的反射面)亦可。此外，亦可取代標線片載台RST之掃描方向(本實施形態爲X軸方向)位置檢測所使用之延伸於Y軸方向的反射面，而使用至少1 個角隅稜鏡型移動鏡。此處，標線片Y干涉計與標線片X 干涉計的至少一方，例如標線片X干涉計，係具有2測長軸之2軸干涉計，根據該標線片X干涉計之測量値，除了能測量標線片載台RST的X位置，亦能測量0 z(繞z軸的旋轉方向）的旋轉量(偏位量）。來自標線片干涉計16的標線片載台RST的位置資訊(含有偏位量等的旋轉資訊），係供應至主控裝置20。主控裝置20根據標線片載台RST的位置資訊’透過標線片載台驅動部22來驅動控制標線片載台 RST。投影光學系統PL，係配置於標線片載台RST的圖1 的下方，其光軸AX的方向爲Z軸方向。作爲投影光學系 t紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）一 —- (請先閱讀背面之注意事項再填寫本頁) 111 i 111*tr°J· 線· 548708 A7 ----- B7________ 五、發明說明（G ) 統PL，係使用例如具有兩側遠心式之既定縮小倍率(例如 1/5、或1/4)的折射光學系統。因此，當藉由來自照明系統 IOP的照明用光IL照射標線片R的照明區域時，標線片R 的電路圖案的照明領域部份的縮小像(部份倒立像），即透過投影光學系統PL投影至與晶圓W上前述照明區域共軛之投影光學系統視野內的投影區域，轉印至晶圓W表面的光阻層。前述晶圓載台裝置50，具備：在地面（或基座平台、框體架)F上透過防振單元26而以3處或4處大致支撐爲水平的載台基座40，配設於該載台基座40上方之作爲載台的晶圓載台WST，以及作爲該晶圓載台WST的驅動裝置的晶圓載台驅動部24。前述各防振單元26，係分別以微G程度，將自地面F 傳至載台基座40的微振動予以隔離。作爲此類的防振單元 26，當然可使用所謂的主動型防振裝置，該主動型防振裝置係依據固定於載台基座40之既定位置的半導體加速度計等的振動感測器的輸出，而積極地抑制載台基座40的振動〇前述載台基座40的+Z側面(上面），係加工成平坦度極高之狀態，作爲晶圓載台WST的移動基準面的導引面 40a 〇則述晶圓載台WST，係在投影光學系統PL的圖1的下方’藉由晶圓載台驅動部24加以驅動，保持晶圓w沿上述導引面40a而進行XY2維移動。 ---- -J5_ +、紙張尺度適用中國國家標準(CNS)A4規格（210 X 297公f ) --- (請先閱讀背面之注意事項再填寫本頁) 1---訂--------- -Elfl is S30 i afie an —Et flfls — ia ΒΠ3 89· 9_s Βϋ *9— τϋ —8 He Safi ibbn 548708 A7 ______B7_ 五、發明說明（〜）前述晶圓載台WST，具備作爲保持晶圓用的保持台之晶圓保持台WTB、及透過包含音圈馬達之未圖示的Z傾斜驅動機構來自下側支撐晶圓保持台WTB的晶圓載台本體部30。在前述晶圓保持台WTB的上面，透過晶圓保持物25 而以真空吸附(或靜電吸附)方式吸附保持晶圓W。前述Z 傾斜驅動機構在晶圓載台本體部30上，進行微小驅動晶圓保持台WTB於Z，0 χ(繞X軸的旋轉方向）、Θ y(繞Y軸的旋轉方向)的3自由度方向者，亦稱爲Z傾斜載台。晶圓保持台WTB的側面，固定有移動鏡21，該移動鏡21係將來自具有干涉計功能的晶圓雷射干涉計(以下稱「晶圓干涉計」）23的雷射光束予以反射，藉由配置於外部的晶圓干涉計23，例如以0.5〜lnm程度的分解能力，隨時檢測晶圓保持台WTB的X方向、Y方向及0z方向( 繞Z軸的旋轉方向)的位置。此處，在晶圓保持台WTB上，實際上係如圖2A所示 ’在+ X方向的端部設有具有正交於X軸方向的反射面的移動鏡21X、並在-Y方向的端部設有具有正交於γ軸方向的反射面的移動鏡21Y。而且，對應於此，晶圓干涉計亦分別設有對移動鏡21X、移動鏡21Y照射雷射光，用以分別測量晶圓保持台WTB之X軸方向、Y軸方向之位置的X軸干涉計、Y軸干涉計。本實施形態中，X軸及Y軸干涉計係各設置複數個，或X軸及Y軸干涉計由具有複數測量長軸的多軸干涉計所 _______ 16______ 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ϋ 1 n ί 1 f n I i SI I I— 線丨赢 548708 A7 B7 五、發明說明（/s ) 構成，除了測量晶圓保持台WTB的X、Y位置之外，亦可測量旋轉（縱向搖擺（繞Z軸旋轉的0 z旋轉)）、橫搖(繞 X軸旋轉的θ X旋轉）、上下搖擺(rolling)(繞Y軸旋轉的0 y旋轉）。雖以上述方式分別設置複數個晶圓干涉計、及移動鏡，但圖1中僅代表性的顯示移動鏡21、晶圓干涉計23。此處，例如，將晶圓保持台WTB的端面進行鏡面加工來形成反射面(相當於移動鏡21X，21Y的反射面)亦可。又，移動鏡21X，21Y的具體構成容後敘述。此外，前述多軸干涉計爲傾斜45°透過晶圓保持台WTB所設的反射面，照射雷射光束於載置投影光學系統PL之架台(未圖示)所設的反射面，以檢測投影光學系統PL之光軸方向(Z軸方向）的相對位置資訊亦可。經晶圓干涉計23測量的晶圓保持台WTB的位置資訊( 或速度資訊)傳送至主控制裝置20，主控制裝置20即依據前述位置資訊(或速度資訊），透過構成晶圓載台驅動部24 的線性馬達36X，36Y1，36Y2(有關含有此類線姓馬達的晶圓載台驅動部的構成容後述），來控制晶圓載台WST的ΧΥ 面內的位置。前述晶圓載台本體部30係如圖2Α及2Β所示，具備 :對向於前述載台基座40上面的導引面40a所配置之矩形板狀的底面構件46，分別固定於底面構件46上面Y軸方向兩端部之一對支持構件42A，42B，藉由這些支持構件 42A，42B而平行地支撐於底面構件上面之天板48等。 __17 __ 本紙張用中國國家標準（CNS)A4規格（210 x 297公β (請先閱讀背面之注意事項再填寫本頁) ;«548708 A7 --- --- B7__ _ V. Description of the Invention (A) Section 22 is a mechanism that uses linear motors, voice coil motors, etc. as the drive source, but for convenience, it is only shown in blocks in Figure 1. The position of the reticle stage RST in the moving plane is determined by a reticle laser interferometer (hereinafter referred to as a "reticle interferometer") 16 through the moving mirror 15 at a resolution of, for example, 0.5 to 1 nm at any time. Be detected. Here, actually, the reticle stage RST is provided with a moving mirror having a reflecting surface orthogonal to the γ-axis direction and a moving mirror having a reflecting surface orthogonal to the X-axis direction, and corresponds to these movements The mirror is provided with a reticle Y interferometer and a reticle X interferometer, but the moving mirror 15 and the reticle interferometer 16 are representatively shown in FIG. 1. Alternatively, for example, the end surface of the reticle stage RST is processed to form a reflecting surface (equivalent to the reflecting surface of the moving mirror 15). In addition, it is also possible to use at least one corner-type moving mirror instead of the reflective surface extending in the Y-axis direction for position detection of the reticle stage RST (X-axis direction in this embodiment) for position detection. Here, at least one of the reticle Y interferometer and the reticle X interferometer, for example, the reticle X interferometer, is a two-axis interferometer having a two-length axis. According to the measurement of the reticle X interferometer, Alas, in addition to measuring the X position of the reticle stage RST, it can also measure the rotation amount (offset amount) of 0 z (the direction of rotation around the z axis). The position information (including rotation information such as offset amount) of the reticle stage RST from the reticle interferometer 16 is supplied to the main control device 20. The main control device 20 drives and controls the reticle stage RST through the reticle stage driving section 22 based on the position information of the reticle stage RST. The projection optical system PL is disposed below the reticle stage RST in FIG. 1, and the direction of the optical axis AX is the Z-axis direction. As the paper standard for projection optics, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable. (Please read the precautions on the back before filling this page) 111 i 111 * tr ° J · Line · 548708 A7 ----- B7________ 5. Description of the Invention (G) The system PL uses a refractive optical system with a predetermined reduction magnification (for example, 1/5, or 1/4) of a telecentric type on both sides. Therefore, when the illumination area of the reticle R is irradiated with the illumination light IL from the lighting system IOP, a reduced image (partial inverted image) of the illumination area portion of the circuit pattern of the reticle R is transmitted through the projection optics. The system PL is projected onto a projection area within the field of view of the projection optical system conjugated to the aforementioned illumination area on the wafer W, and transferred to the photoresist layer on the surface of the wafer W. The wafer stage device 50 is provided with a stage base 40 that is approximately horizontally supported at three or four places through a vibration isolating unit 26 on the ground (or a base platform, a frame frame) F, and is disposed on the ground. A wafer stage WST as a stage above the stage base 40 and a wafer stage driving section 24 as a driving device for the wafer stage WST. Each of the aforementioned anti-vibration units 26 isolates the micro-vibrations transmitted from the ground F to the stage base 40 to a degree of micro-G. As such an anti-vibration unit 26, of course, a so-called active anti-vibration device can be used, which is based on the output of a vibration sensor such as a semiconductor accelerometer fixed to a predetermined position of the stage base 40. And actively suppress the vibration of the stage base 40. The + Z side surface (upper surface) of the aforementioned stage base 40 is processed into a state of extremely high flatness, and serves as a guide surface for the movement reference surface of the wafer stage WST. 40a, the wafer stage WST is described below in FIG. 1 of the projection optical system PL. The wafer stage WST is driven by the wafer stage driving unit 24, and the wafer w is moved along the guide surface 40a to perform XY 2-dimensional movement. ---- -J5_ +, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 male f) --- (Please read the precautions on the back before filling this page) 1 --- Order --- ------ -Elfl is S30 i afie an —Et flfls — ia ΒΠ3 89 · 9_s Βϋ * 9— τϋ —8 He Safi ibbn 548708 A7 ______B7_ 5. Description of the invention (~) The aforementioned wafer stage WST is provided as A wafer holding table WTB for holding a wafer holding table, and a wafer stage main body portion 30 supporting the wafer holding table WTB from below by a Z tilt drive mechanism (not shown) including a voice coil motor. On the upper surface of the wafer holding table WTB, the wafer W is sucked and held in a vacuum suction (or electrostatic suction) manner through the wafer holder 25. The aforementioned Z tilt drive mechanism performs a micro-drive of the wafer holding table WTB on the wafer stage body 30 by 3 degrees of freedom at Z, 0 χ (direction of rotation around the X axis) and θ y (direction of rotation around the Y axis). The direction is also known as the Z tilt stage. On the side of the wafer holding table WTB, a moving mirror 21 is fixed. The moving mirror 21 reflects a laser beam from a wafer laser interferometer (hereinafter referred to as "wafer interferometer") 23 having an interferometer function. With an external wafer interferometer 23 disposed, for example, the position of the wafer holding table WTB in the X direction, the Y direction, and the 0z direction (the rotation direction around the Z axis) is detected at any time with a resolution of about 0.5 to 1 nm. Here, on the wafer holding table WTB, as shown in FIG. 2A, a moving mirror 21X having a reflecting surface orthogonal to the X-axis direction is provided at an end portion in the + X direction, and the A moving mirror 21Y having a reflecting surface orthogonal to the γ-axis direction is provided at the end. In addition, corresponding to this, the wafer interferometer is also provided with X-axis interferometers that respectively irradiate the moving mirror 21X and the moving mirror 21Y with laser light to measure the positions of the X-axis direction and the Y-axis direction of the wafer holding table WTB , Y-axis interferometer. In this embodiment, a plurality of X-axis and Y-axis interferometers are respectively provided, or the X-axis and Y-axis interferometers are used by a multi-axis interferometer with a long axis of multiple measurement. _______ 16______ Wood and paper dimensions are applicable to Chinese national standards (CNS ) A4 specification (210 X 297 mm) (please read the precautions on the back before filling this page) ϋ 1 n ί 1 fn I i SI II — line 丨 win 548708 A7 B7 V. Description of the invention (/ s) In addition to measuring the X and Y positions of the wafer holding table WTB, it can also measure rotation (vertical swing (0 z rotation around the Z axis)), roll (θ X rotation around the X axis), and up and down ( rolling) (0 y rotation around the Y axis). Although a plurality of wafer interferometers and moving mirrors are respectively provided in the above-mentioned manner, only the moving mirror 21 and the wafer interferometer 23 are representatively shown in FIG. 1. Here, for example, the end surface of the wafer holding table WTB may be mirror-finished to form a reflecting surface (equivalent to the reflecting surfaces of the moving mirrors 21X and 21Y). The specific configuration of the moving mirrors 21X and 21Y will be described later. In addition, the aforementioned multi-axis interferometer passes through a reflecting surface provided on the wafer holding table WTB at a tilt of 45 °, and irradiates a laser beam onto a reflecting surface provided on a stage (not shown) on which the projection optical system PL is placed to detect the projection. The relative position information of the optical axis direction (Z-axis direction) of the optical system PL may also be used. The position information (or speed information) of the wafer holding table WTB measured by the wafer interferometer 23 is transmitted to the main control device 20, and the main control device 20 forms a wafer stage driving unit based on the aforementioned position information (or speed information). The 24 linear motors 36X, 36Y1, and 36Y2 (the structure of the wafer stage driving unit including such a motor of the line name are described later) are used to control the position in the XY plane of the wafer stage WST. As shown in FIGS. 2A and 2B, the wafer stage body portion 30 includes a rectangular plate-shaped bottom surface member 46 arranged opposite to the guide surface 40 a on the upper surface of the stage base 40, and is fixed to the bottom surface member 46. One pair of support members 42A, 42B on both ends in the upper Y-axis direction are supported in parallel by a top plate 48 and the like on the bottom member by these support members 42A, 42B. __17 __ This paper uses Chinese National Standard (CNS) A4 specifications (210 x 297 male β (please read the precautions on the back before filling this page); «

n I S ϋ n n^OJt ϋ n n I— 1 I 548708 A7 — _______B7___________ 五、發明說明（) 前述天板48係由矩形板狀的構件所構成，其上方，透過音圈馬達等所構成的未圖示之Z傾斜機構載置有晶圓保持台WTB。此外，在該天板48的下面固定有構成X軸線性馬達36X(後述)的可動構件X。有關此類構件容後述。前述底面構件46，係由較天板48小的平板狀構件所構成，如圖2B所示，在其底面的Y軸方向中央部，係以深度數μηι(例如7μιη)程度沿X軸方向形成有既定寬度的帶狀凹部46a。此外，位於該凹部46a的Υ軸方向兩側的平面部46b，46c，係設置有各2個合計4個的真空預壓型氣體靜壓軸承(以下簡單稱「氣體靜壓軸承」）102。此類之氣體靜壓軸承102，由圖2B可知，其具備：在其中央部份噴出加壓氣體(此處爲氦或氮等的惰性氣體)噴出口 102a，及形成於該噴出口的周圍，且連通於未圖示的真空吸引路徑的槽102b。此處，在使用ArF準分子雷射光、或F2雷射光等波長 200μιη〜150μηι頻帶所屬的稱爲真空紫外光的波長帶的光束，來作爲曝光用光時，由於受氧氣或有機物(若係F2雷射光時，亦包含水蒸氣、碳化氫氣體等)的吸收極大，故曝光用光所通過的光程上的空間中此類氣體的濃度應降低至數ppm以下的濃度，且必須以吸收較小之氮或氦等惰性氣體(以下，非僅氦亦包含氮而總稱惰性氣體)替換(進行洗淨) 。此處，本實施形態非僅照明系統IOP及投影光學系統PL ，在照明系統IOP和投影光學系統PL之間之標線片R所配置的第1空間、及投影光學系統PL和晶圓W之間的第 ί紙張尺度適闬中國國家標準（CNS)A4規格（210_χ 297公釐) 一一 (請先閱讀背面之注意事項再填寫本頁)n IS ϋ nn ^ OJt ϋ nn I— 1 I 548708 A7 — _______B7___________ V. Description of the invention () The above-mentioned top plate 48 is composed of a rectangular plate-shaped member, and the upper part is not shown by a voice coil motor or the like The Z tilt mechanism mounts a wafer holding table WTB. A movable member X constituting an X-axis linear motor 36X (described later) is fixed to the lower surface of the top plate 48. The details of such components will be described later. The bottom surface member 46 is composed of a flat plate-shaped member smaller than the top plate 48. As shown in FIG. 2B, at the central portion of the bottom surface in the Y-axis direction, the bottom surface member 46 is formed along the X-axis direction with a depth of several μηι (for example, 7 μιη). There is a band-shaped recess 46a of a predetermined width. In addition, the flat surface portions 46b and 46c located on both sides in the y-axis direction of the recessed portion 46a are provided with two vacuum preloading type gas static pressure bearings (hereinafter, simply referred to as "gas static pressure bearings") 102 of two in total. As shown in FIG. 2B, such a gas static pressure bearing 102 is provided with a discharge port 102a that discharges a pressurized gas (here, an inert gas such as helium or nitrogen) in a central portion thereof, and is formed around the discharge port. And communicates with a groove 102b of a vacuum suction path (not shown). Here, when a light beam of a wavelength band called vacuum ultraviolet light belonging to a frequency band of 200 μm to 150 μm, such as an ArF excimer laser light or an F2 laser light, is used as the exposure light, it is exposed to oxygen or an organic substance (if F2 Laser light also contains water vapor, hydrocarbon gas, etc.), so the concentration of such gases in the space on the optical path through which the exposure light passes should be reduced to a concentration of several ppm or less, and Inert gas such as small nitrogen or helium (hereinafter, not only helium also contains nitrogen but collectively called inert gas) is replaced (cleaned). Here, this embodiment is not only the lighting system IOP and the projection optical system PL, but the first space in which the reticle R between the lighting system IOP and the projection optical system PL is arranged, and the projection optical system PL and the wafer W The first paper size is suitable for the Chinese National Standard (CNS) A4 specification (210_χ 297 mm) one by one (please read the precautions on the back before filling this page)

-ϋ 1 I -....... I I 一· B—· Is HH In BSK I ί B S9 ϋ n B— I —1 503 i 18 n 1 1-5 aoi -3i ii n to— BiB i— -aai _ 548708 A7 ___B7__________ 五、發明說明（β ) 2空間亦進行洗淨(或單純的惰性氣體的送風)處理。因此，本實施形態中作爲加壓氣體，係使用例如和曝光用光IL所通過的空間當中之至少供應至前述的第2空間的惰性氣體相同種類，或相同種類但相異的其他惰性氣體。但，在使用波長爲200nm程度以上的照明用光(例如 KrF準分子雷射光等的遠紫外光、或I線等的紫外光)作爲曝光用光IL時，作爲加壓氣體，例如可使用經化學過濾器除去有機物等雜質之空氣、或化學性的洗淨乾燥空氣。再者，即使是使用ArF準分子雷射光來作爲曝光用光IL，對曝光用光IL所通過的空間中之至少前述第2空間若無供應惰性氣體，亦可使用前述空氣或乾燥空氣等來作爲加壓氣體。亦即，對至少前述第2空間不供應惰性氣體時，可使用任意之氣體作爲加壓氣體，反之，在有供應惰性氣體時 ’則使用惰性氣體作爲加壓氣體較佳。又’作爲氣體靜壓軸承，在使用連通軸承面的加壓氣體的噴出口周圍的真空吸引路徑具有槽的類型時，來自各氣體靜壓軸承對導引面40a所噴出的氣體，因被立即真空排放，故能防止氣體漏出至周圍。因此，必須高度地維持氦等的純度，而在不能有因氣體的流出而污染到周圍氣體之環境下，相較於空氣（包含乾燥空氣）、或進行前述之洗淨之空間，其純度相對地降低，亦即能使用使曝光用光衰減的不純物（氧、有機物、水蒸氣等）的濃度相對提高之惰性氣體作爲加壓氣體。本實施形態中，係藉由自4個氣體靜壓軸承1〇2之軸 -----—_\9___ 紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂--------:線- 548708 A7 B7 五、發明說明（Λ?) 承面分別朝導引面40a噴出的加壓氣體軸承面與導引面 40a間的靜壓(所謂的間隙內壓力），及晶圓載台WST全體的本身重量與真空預壓力之間的平衡，而在載台基座40的上面的導引面40a的上方透過數μπι程度的空隙，以非接觸方式支撐晶圓載台WST。前述晶圓載台驅動部24，如圖1所示，具備驅動晶圓載台WST於掃描方向的X軸方向的X軸線性馬達36Χ，以及與X軸線性馬達36Χ爲一體且驅動晶圓載台WST於非掃描方向的Υ軸方向之一對的Υ軸線性馬達36Yl5 36Υ2 ο 一方的Υ軸線性馬達36Υ!，具備：在載台基座40的 -X側之地面F上延伸設置於Υ軸方向之作爲固定構件的 Υ軸線性導件34Υ!，及沿著該Υ軸線性導件34Υ1移動的 Υ可動構件32Yi。在前述Y軸線性導件34Y!的內部，以既定間隔沿Y 軸方向設有未圖示之電樞線圈。前述Y可動構件32Yi具有XZ截面反U字狀之形狀，在內側的一對對向面，沿著 Y軸方向以既定間隔排列有未圖示之複數個電場磁鐵。亦即，Y軸線性馬達36Yi係可移動磁鐵型的電磁力驅動方式的線性馬達。因此，Y軸線性馬達36Yi係藉由Y軸線性導件34Y!與Y可動構件32Yi之間的電磁相互作用，而產生驅動Y可動構件32¥!於Y軸方向的驅動力(洛倫茲力）。另一方的Y軸線性馬達36Y2，亦具有與Y軸線性馬達36Y!相同之構成。亦即，Y軸線性馬達36Y2，具備： ___ 20___ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) I I 訂-------- Ϊ 548708 A7 __B7______ 五、發明說明（J ) 在載台基座40的+ X側之地面F上延伸設置於Y軸方向的Υ軸線性導件34Υ2，及沿該Υ軸線性導件34Υ2移動的 γ可動構件32Υ2。該Υ軸線性馬達36Υ2係在Υ軸線性導件34Υ2與Υ可動構件32Υ2之間進行電磁相互作用，而產生相對於Υ可動構件32Υ2的Υ軸方向的驅動力(洛倫茲力) 〇前述X軸線性馬達36Χ，具備以X軸方向爲長邊方向之作爲固定構件的X軸線性導件34Χ，及沿該X軸線性導件34Χ朝X軸方向移動的X可動構件32Χ。在前述X軸線性導件34Χ的長邊方向的一端部，固定有前述一方的 32Yi，且在他端部固定有另一可動構件32Υ2。此外，X軸線性導件34Χ，具備延伸於X軸方向的固定構件軛，及在其內部以既定間隔沿X軸方向設置的複數個電樞線圏。前述X可動構件32Χ，如圖2Β所示，具備固定於構成前述晶圓載台本體部30的天板下面、截面爲矩形且延伸於X軸方向的可動構件軛52，以及在該可動構件軛52內面側的上下對向面，沿X軸方向以既定間隔交互排列之複數個電場磁鐵54Ν，54S。在可動構件軛52的內部空間，沿著X軸方向形成有交替磁場。在X可動構件32Χ之可動構件軛52的內部空間***X軸線性導件34Χ之狀態，構成圖1之X軸線性馬達3 6Χ。此情形下，藉由X可動構件32Χ與X軸線性導件34Χ 之間的電磁相互作用，來產生驅動X可動構件32Χ於X軸方向之驅動力(洛倫茲力）。該X軸線性馬達36Χ係可移動 ____21_____— 幸、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)-ϋ 1 I -....... II I · B— · Is HH In BSK I ί B S9 ϋ n B— I —1 503 i 18 n 1 1-5 aoi -3i ii n to— BiB i — -Aai _ 548708 A7 ___B7__________ V. Description of the Invention (β) 2 The space is also cleaned (or simply supplied with inert gas). Therefore, in this embodiment, as the pressurizing gas, for example, another inert gas of the same type as the inert gas supplied to at least the aforementioned second space from among the spaces through which the exposure light IL passes, is used. However, when using illumination light having a wavelength of about 200 nm or more (for example, far-ultraviolet light such as KrF excimer laser light or ultraviolet light such as I rays) as the exposure light IL, for example, a pressurized gas may be used. The chemical filter removes air such as organic matter or chemically cleaned and dried air. In addition, even if ArF excimer laser light is used as the exposure light IL, if at least the second space in the space through which the exposure light IL passes is not supplied with an inert gas, the aforementioned air or dry air may be used. As a pressurized gas. That is, when no inert gas is supplied to at least the second space, any gas may be used as the pressurized gas, and when an inert gas is supplied, it is preferable to use an inert gas as the pressurized gas. Also, as a gas static pressure bearing, when a vacuum suction path around a discharge port of a pressurized gas communicating with a bearing surface is used, the gas ejected from each gas static pressure bearing toward the guide surface 40a is immediately lost. Vacuum discharge prevents gas from leaking to the surroundings. Therefore, the purity of helium and the like must be maintained to a high degree. Compared with air (including dry air) or the above-mentioned washing space, its purity is relatively low in an environment where the surrounding gas cannot be polluted by the outflow of gas. As the pressurizing gas, an inert gas having a relatively increased concentration of impurities (oxygen, organic matter, water vapor, etc.) that attenuates the light for exposure can be used. In this embodiment, the shaft is made from 4 aerostatic bearings 10-2 -----——_ \ 9___ The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please first Read the notes on the back and fill in this page) Order --------: Line-548708 A7 B7 V. Description of the invention (Λ?) The bearing surface and guide of the pressurized gas ejected from the bearing surface toward the guide surface 40a respectively The static pressure (so-called gap pressure) between the leading surfaces 40a and the balance between the entire weight of the wafer stage WST and the vacuum pre-pressure are transmitted through the guide surface 40a above the stage base 40. Several μm gaps support the wafer stage WST in a non-contact manner. As shown in FIG. 1, the wafer stage driving unit 24 includes an X-axis linear motor 36 × that drives the wafer stage WST in the X-axis direction of the scanning direction, and is integrated with the X-axis linear motor 36 × and drives the wafer stage WST at One pair of non-linear linear motors 36Yl36 36Υ2 ο one pair of non-linear linear motors 36Y1! One of the single linear axial motors 36Υ! Is provided on the floor F on the -X side of the stage base 40 and is extended in the The Υ-axis linear guide 34Υ !, which is a fixed member, and the Υmovable member 32Yi, which moves along the Υ-axis linear guide 34Υ1. An armature coil (not shown) is provided in the Y-axis linear guide 34Y! At a predetermined interval along the Y-axis direction. The Y movable member 32Yi has an X-shaped cross-inverse U-shape, and a plurality of electric field magnets (not shown) are arranged at a predetermined interval along the Y-axis direction on a pair of facing surfaces on the inner side. That is, the Y-axis linear motor 36Yi is a linear motor of a movable magnet type electromagnetic force driving method. Therefore, the Y-axis linear motor 36Yi generates a driving force (Lorentz force) in the Y-axis direction by the electromagnetic interaction between the Y-axis linear guide 34Y! And the Y movable member 32Yi. ). The other Y-axis linear motor 36Y2 also has the same structure as the Y-axis linear motor 36Y !. That is, the Y-axis linear motor 36Y2 has: ___ 20___ This paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) II Order --- ----- Ϊ 548708 A7 __B7______ 5. Description of the invention (J) The Υ-axis linear guide 34Υ2 extending in the Y-axis direction is extended on the ground F on the + X side of the stage base 40, and along the Υ-axis The γ movable member 32Υ2 where the guide 34Υ2 moves. The Υaxis linear motor 36Υ2 performs electromagnetic interaction between the Υaxis linear guide 34Υ2 and the Υmovable member 32Υ2 to generate a driving force (Lorentz force) in the Υaxis direction of the Υmovable member 32Υ2. The axis linear motor 36X includes an X-axis linear guide 34X as a fixed member with the X-axis direction as the long side direction, and an X movable member 32X moving along the X-axis linear guide 34X in the X-axis direction. One end of the X-axis linear guide 34X in the long-side direction is fixed with the aforementioned one 32Yi, and the other movable member 32 固定 2 is fixed at the other end thereof. In addition, the X-axis linear guide 34X includes a fixed member yoke extending in the X-axis direction, and a plurality of armature wires 设置 provided at predetermined intervals in the X-axis direction. The X movable member 32X is provided with a movable member yoke 52 fixed to the underside of the top plate constituting the wafer stage body 30 and having a rectangular cross-section and extending in the X-axis direction, as shown in FIG. 2B, and the movable member yoke 52. The plurality of electric field magnets 54N, 54S arranged alternately at predetermined intervals along the X-axis direction on the upper and lower facing surfaces on the inner surface side. An alternating magnetic field is formed in the internal space of the movable member yoke 52 along the X-axis direction. The X-axis linear guide 34X is inserted into the internal space of the movable member yoke 52 of the X-movable member 32X to constitute the X-axis linear motor 36 of Fig. 1. In this case, a driving force (Lorentz force) that drives the X movable member 32X in the X-axis direction is generated by the electromagnetic interaction between the X movable member 32X and the X-axis linear guide 34X. The X-axis linear motor 36 × is movable ____ 21 _____— Fortunately, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page)

548708 A7 ____B7_______ 五、發明說明（/ ) 磁鐵型的電磁力驅動方式的線性馬達。又，正如前述，由於X軸線性導件34X的兩端部係分別固定於Y可動構件32Yl5 32Y2，故當軸線性馬達36Yl5 36Υ2產生Υ軸方向的驅動力時，晶圓載台WST即與X軸線性馬達36Χ同時被驅動於Υ軸方向。此時，藉由使軸線性馬達36Yl5 36Υ2產生相異的驅動力，即能透過X軸線性馬達36χ來控制晶圓載台WST繞Ζ軸的旋轉。在前述底面構件46的土Υ側的面，如圖2Α及圖2Β所示，固定著具有與底面構件46Χ軸方向長度相同長度的正方體狀的配重構件44Al5 44Α2。該等配重構件44Al5 44Α2 係分別形成爲相同形狀、相同質量(此處，質量爲(Μ!/2))。配重構件44AU 44Α2之各重心Gl5 Gi’，如圖3所示，設定爲同一 Z位置且距離底面構件46的重心GB等距離位置。亦即，如上述般，由於配置2個配重構件44A,，44A2 因此配重構件44A!，44A2的總重量(MiXg)係在與底面構件 46的的重心GB同一 Z軸上產生作用。進一步的，在底面構件46的Y軸方向中央部份，如圖2A所示，載置有由複數個塊狀的配重物所構成的配重群44B。此時，如圖3所示，配重群44B的重心G2，係設定成位於與底面構件46的重心GB同一 Z軸上。又，該配重群44B的質量，於以下之說明中係以質量m2加以表示〇本實施形態中，配重構件44A〗，44A2合計質量及配重群44B的質量M2係設定如下。 --~厂 ____22_____ 衣紙張尺度適用中國國家標準（CNS)A4規格（210 x 297公釐） " ~ (請先閱讀背面之注意事項再填寫本頁)548708 A7 ____B7_______ V. Description of the Invention (/) A linear motor of the magnetic type driven by an electromagnetic force. As mentioned above, the X-axis linear guide 34X is fixed to the Y movable member 32Yl32 32Y2 at both ends, so when the linear motor 36Yl 36 36Υ2 generates a driving force in the y-axis direction, the wafer stage WST is connected to the X axis. The sex motor 36 × is simultaneously driven in the direction of the Z axis. At this time, by causing the linear motors 36Y15 to 36Υ2 to generate different driving forces, the X-axis linear motor 36x can be used to control the rotation of the wafer stage WST about the Z axis. As shown in FIG. 2A and FIG. 2B, a rectangular-shaped weight member 44Al5 44A2 having the same length as that of the bottom member 46 in the X-axis direction is fixed to the surface of the soil member side of the bottom member 46. The weight members 44Al5 and 44A2 are each formed in the same shape and the same mass (here, the mass is (M! / 2)). Each center of gravity G15 Gi 'of the weight members 44AU 44A2, as shown in FIG. 3, is set at the same Z position and equidistant from the center of gravity GB of the bottom member 46. That is, as described above, since the two weight members 44A, 44A2 are arranged, the total weight (MiXg) of the weight members 44A !, 44A2 acts on the same Z axis as the center of gravity GB of the bottom member 46. . Further, as shown in Fig. 2A, a center portion 44B of a plurality of block-shaped weights is placed on the center portion of the bottom member 46 in the Y-axis direction. At this time, as shown in Fig. 3, the center of gravity G2 of the weight group 44B is set on the same Z axis as the center of gravity GB of the bottom member 46. The mass of the weight group 44B is expressed as mass m2 in the following description. In this embodiment, the total mass of the weight member 44A, 44A2 and the mass M2 of the weight group 44B are set as follows. -~ Factory ____22_____ Applicable to China National Standard (CNS) A4 size (210 x 297 mm) for clothing paper size " ~ (Please read the precautions on the back before filling this page)

ϋ n .1— SMS am^ n n 一 ον f in 1_1 n n mm i_3 B A7 548708 ____B7 五、發明說明（J ) 亦即，如圖3所示，設定驅動晶圓載台WST於χ軸方向的X軸線性馬達36X的驅動力(推力)所作用的軸(驅動軸）的Z方向位置爲P、扣除底面構件46及配重構件44Αι， 44A2及配重群44B之晶圓載台WST(該質量爲Ms)重心爲 Gs ’該重心Gs與驅動軸距離爲5、驅動軸與底面構件46 的重心GB距離爲LB、驅動軸與重心G!的高度方向距離爲 L!、驅動軸與配重群44B的重心G2的距離爲l2時，質量係設定成滿足下式（1)。ϋ n .1— SMS am ^ nn aον f in 1_1 nn mm i_3 B A7 548708 ____B7 V. Description of the invention (J) That is, as shown in FIG. 3, the X axis that drives the wafer stage WST in the χ-axis direction is set The Z-direction position of the shaft (drive shaft) to which the driving force (thrust) of the linear motor 36X acts is P, and the wafer stage WST (the mass of which is excluding the bottom member 46 and the weight member 44Aι, 44A2, and the weight group 44B) Ms) The center of gravity is Gs' The distance between the center of gravity Gs and the drive shaft is 5, the distance between the center of gravity of the drive shaft and the bottom member 46 is GB, the distance between the drive shaft and the center of gravity G! Is L !, and the drive shaft and the weight group 44B When the distance of the center of gravity G2 is l2, the mass system is set to satisfy the following formula (1).

Ms · δ = Mb · Lb+Mj · L1 + M2 · L2 "(1) 如前所述，由於係以滿足上式（1)之方式決定配重構件 44Al5 44A2總質量Mi(配重構件44Al5 44A2的各質量 (Mi/2))、配重群44B的質量M2，故其結果晶圓載台WST 全體的重心位置，即被設定於驅動晶圓載台WST朝X軸方向時的驅動軸上。又，由上式（1)可知，爲了減輕各配重構件44Al5 44A2 、配重群44B的各質量(重量），亦即，減輕晶圓載台WST( 可動部)全體的重量，最好是儘可能的將距離Lb，，及L2 設定得較大。其次，根據圖4A〜圖4C，說明晶圓保持台WTB側面所設之前述移動鏡21X，21Y的構成等。圖4A中，顯示了一移動鏡21Y之具體構成。由該圖 4A可知，移動鏡21Y係以自晶圓保持台WTB的一 Y側端部下側突出於-Y方向之方式，載置於座板56Y(以螺固方式固定於晶圓保持台WTB的下面)上。而固定的。該座板 ____ 23_ - 各紙張尺度適用中國國家標準（CNS)A4規格（210 χ 297公釐） (請先閱讀背面之注意事項再填寫本頁)Ms · δ = Mb · Lb + Mj · L1 + M2 · L2 " (1) As mentioned above, since the system satisfies the above formula (1), the total weight of the weight member 44Al5 44A2 Mi (reconfiguration) The mass (Mi / 2) of each piece 44Al5 44A2 and the mass M2 of the weight group 44B. As a result, the position of the center of gravity of the entire wafer stage WST is set to the drive shaft when the wafer stage WST is driven in the X-axis direction. on. From the above formula (1), it can be seen that, in order to reduce the mass (weight) of each weight member 44Al5 44A2 and weight group 44B, that is, to reduce the weight of the entire wafer stage WST (movable portion), Set the distances Lb, and L2 as large as possible. Next, the configuration of the aforementioned moving mirrors 21X and 21Y provided on the side of the wafer holding table WTB will be described with reference to Figs. 4A to 4C. In Fig. 4A, the specific structure of a moving mirror 21Y is shown. As can be seen from FIG. 4A, the moving mirror 21Y is placed on the seat plate 56Y (fixed to the wafer holding table WTB by screwing) so as to protrude from the lower side of a Y-side end of the wafer holding table WTB in the -Y direction. Below). And fixed. The seat plate ____ 23_-Chinese paper standard (CNS) A4 (210 x 297 mm) is applicable for each paper size (please read the precautions on the back before filling this page)

548708 A7 _B7_ 五、發明說明（ 56Y的上面，係加工成滿足既定的平坦度。移動鏡21Y，具有大至呈正方體狀的形狀，其一 γ側的面21Ym經鏡面加工，而能反射來自前述干涉計23的雷射。又，以下在方便上該一 Y側的面21Ym稱爲「鏡面 21Ym」。鏡面21Ym的相反面的面（+Y側的面），在其X軸方向兩端部附近位置，於移動鏡21Y之上端部至下端部處，形成有突出於+ Y方向數μηι(例如7μηι)程度的凸部21Ya， 21Yb。又，移動鏡21Y的下面，在與上述凸部21Ya，21Yb 相同的X方向位置，於移動鏡21Y之+ Y端部至一 Y端部處，形成有突出於-Ζ方向數μηι(例如7μηι)程度之凸部 21Yc，21Yd。此處，晶圓保持台WTB的一 Y側面與移動鏡21Y係僅凸部21Ya，21Yb部份成接觸之狀態。而且相同地，座板 56Y的上面與移動鏡21Y係僅凸部21 Yc，21 Yd成接觸之狀態。亦即，在移動鏡21Y當中，凸部21Ya，21Yb以外的 + Y側面部份係對晶圓保持台WTB具有數μηι(例如7μιη)程度的空隙，且凸部21Yc，21Yd以外的下面部份係對座板 56Y具有數μηι程度的空隙。此外，如圖4Α所示，移動鏡21Υ其在鏡面21Ym的凸部21Yc，21Yd的近傍，形成有對晶圓保持台WTB用以固定移動鏡21Y之用的螺固部21 Ye、21 Yf。圖4B，係放大上述螺固部21Ye，21Yf當中的一方之 _24_ 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） (請先閱讀背面之注意事項再填寫本頁) ---訂·-------- I ΙΑ 548708 A7 ______El_________ 五、發明說明（乃）螺固部21Ye附近而自一 γ方向所見之圖。圖4c係表示自圖4B之狀態取下螺栓72的狀態時之圖4B的A-A線截面圖。自此類圖可知，螺固部21Ye，係藉由：自鏡面21Ym 到Y軸方向中央部略靠+ Y側的位置呈控下狀態之矩形狀槽部62a，自矩形狀槽部62a內部的底面進而達至+ Y側面進一步貫通形成的圓孔62b，以及位於圓孔62b的±X側，自該矩形狀槽部62a內部的底面至+ Y側面貫通所形成的矩形孔62c62D來形成。又，另一螺固部21Yf亦與上述螺固部21Ye爲相同之構成。亦即螺固部21Yf係藉由：自自鏡面21Ym到Y軸方向中央部靠+ Y側的位置而下挖的狀態之矩形狀槽部，及自該矩形狀槽部的內部至+ Y側面貫通形成的圓孔，以及2個矩形孔所形成。在圖4C中，如螺固部21Ye代表性地表示，移動鏡 21Y係藉由形成於螺固部21Ye(及螺固部21Yf)的圓孔62b 、及透過形成於晶圓保持台WTB的-Y側面的孔80的螺栓72來螺止於晶圓保持台WTB。螺固部21Ye，21Yf之所以如上述般的形成，係當移動鏡21Y因螺栓72而固定於晶圓保持台WTB的側面時，雖由於固定用的力在螺栓72的周邊部產生作用，但形成該螺栓72的周邊部作爲如上述螺固部21Ye，21Yf，因較其他的部份作成低剛性的情形下，而藉由螺栓72之力集中產生應力於低剛性部份(螺固部），則在螺固部21Ye，21Yf以外的 __25____ 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)548708 A7 _B7_ V. Description of the invention (The top of 56Y is processed to meet the predetermined flatness. The moving mirror 21Y has a shape that is as large as a cuboid. One of the γ-side surfaces 21Ym is mirror-processed to reflect from the aforementioned. The laser of the interferometer 23. In the following, the Y-side surface 21Ym is referred to as "mirror surface 21Ym". The opposite surface (+ Y-side surface) of the mirror surface 21Ym is at both ends in the X-axis direction. In a nearby position, convex portions 21Ya and 21Yb protruding from the upper end portion to the lower end portion of the moving mirror 21Y by several μm (for example, 7 μm) in the + Y direction are formed. Also, the lower surface of the moving mirror 21Y is in the same position as the convex portion 21Ya. At the same position in the X direction of 21Yb, convex parts 21Yc and 21Yd are formed at the + Y end to a Y end of the moving mirror 21Y to protrude to the -Z direction by several μηι (for example, 7μηι). Here, the wafer One Y side of the holding table WTB is in contact with only the convex portions 21Ya and 21Yb of the moving mirror 21Y. Also, the upper surface of the seat plate 56Y is in contact with only the convex portions 21 Yc and 21 Yd of the moving mirror 21Y. That is, among the moving mirror 21Y, the convex portions 21Ya, 21Yb are The + Y side portion of the + Y has a gap of several μηι (for example, 7 μιη) to the wafer holding table WTB, and the lower portions other than the convex portions 21Yc, 21Yd have a gap of several μηι to the seat plate 56Y. In addition, if As shown in Fig. 4A, the moving mirror 21: near the convex portions 21Yc and 21Yd of the mirror surface 21Ym, the wafer holding table WTB is provided with screwing portions 21 Ye and 21 Yf for fixing the moving mirror 21Y. Fig. 4B, One of the 21Ye, 21Yf of the above-mentioned screwing part is enlarged. _24_ This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210x297 mm) (Please read the precautions on the back before filling this page) --- Order · -------- I ΙΑ 548708 A7 ______El_________ V. Description of the invention (that is, the view from the direction of a gamma near the screwed portion 21Ye. Figure 4c shows the state when the bolt 72 is removed from the state of Figure 4B A cross-sectional view taken along line AA in FIG. 4B. From this type of drawing, it can be seen that the screw portion 21Ye is formed by a rectangular groove portion 62a in a controlled state from the mirror surface 21Ym to the center of the Y-axis direction on the + Y side. , From the bottom surface inside the rectangular groove portion 62a to the + Y side to further penetrate the shape The circular hole 62b and the rectangular hole 62c62D which is located on the ± X side of the circular hole 62b and penetrates from the bottom surface to the + Y side of the rectangular groove portion 62a are formed. Another screwing portion 21Yf is also the same as the above. The screwing portion 21Ye has the same structure. That is, the screwing portion 21Yf is a rectangular groove portion in a state dug from the mirror surface 21Ym to the + Y-side position of the central portion in the Y-axis direction, and from the rectangle. It is formed by a circular hole penetrating from the inside of the groove-shaped portion to the + Y side, and two rectangular holes. In FIG. 4C, as the screw portion 21Ye is representatively represented, the moving mirror 21Y is formed by a circular hole 62b formed in the screw portion 21Ye (and the screw portion 21Yf) and through the wafer holding table WTB- The bolt 72 of the hole 80 on the Y side is screwed to the wafer holding table WTB. The reason why the screwing portions 21Ye and 21Yf are formed as described above is that when the moving mirror 21Y is fixed to the side of the wafer holding table WTB by the bolt 72, although the fixing force acts on the periphery of the bolt 72, As the bolts 21Ye and 21Yf as described above, the peripheral part of the bolt 72 is formed with a lower rigidity than the other parts, and stress is generated by the force of the bolt 72 to the low-rigidity part (screw). , __25____ for wood and paper sizes other than 21Ye and 21Yf of the screwing part are applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)

548708 A7 _______B7________ 五、發明說明（A) 鏡面21Ym部份即幾乎不產生變形之故。因此，藉由將螺固部21Ye，21Yf形成於移動鏡2ΐγ上，即能高度維持鏡面 21 Ym的平面度。此外’移動鏡21Y採用在上述之既定位置具有凸部之形狀，則係既使伴隨著晶圓載台WST的驅動而來的振動是傳達至移動鏡21Y，移動鏡21Y和其固定面之間的氣體，因振動而在間隙內移動或欲自間隙脫出，故藉由該氣體的粘性而能使振動衰減之故。又，另一移動鏡21X亦與移動鏡21Y同樣，具有相同之構成。亦即，如圖2A、2B所示，移動鏡21X係載置於固定於晶圓保持台WTB的下面的+ X端部近傍的座板56X上，在移動鏡21X上與移動鏡2ΐγ同樣的，分別形成有2個凸部於-X側及-Z側的面。而且，各凸部係與晶圓保持台WTB的+ X側面及座板56X的上面（+z側面)相接觸。而且，中介從移動鏡21X的+ X側的面(鏡面)至其背面所形成的未圖示之螺固部，而固定於晶圓保持台WTB。在此情形中，在移動鏡21X與晶圓保持台WTB之間，及移動鏡21X與座板56X之間，除了凸部之外，亦設置有數μηι(例如7μιη)程度的空隙。圖1中，控制系統主要係由主控制裝置20構成。主控制裝置20，係由含有cpu(中央運算處理裝置）、R〇M(唯讀記憶體）、RAM(隨機存取記憶體）等組成的所謂微電腦( 或工作站）而構成，統籌控制全體裝置。主控制裝置20， —_ ----J6_ 一木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂· 線」 548708 A7 B7 五、發明說明（β) 例如爲能確實地進行曝光動作，係例如控制標線片R與晶圓W的同步掃描、晶圓W的步進動作等。其次，簡單說明依據上述構成之本實施形態之曝光裝置10，將標線片R之圖案依序轉印於晶圓W的各曝光照射區域時的曝光動作。又，前提上，係設未圖示之標線片顯微鏡、晶圓保持台WTB上的未圖示之基準標記板、及使用未圖示之晶圓對準系統的標線片對準、晶圓對準系統的基線測量、及晶圓對準(EGA等)的準備作業已結束。又，有關上述之標線片對準、基線測量等，係例如詳細揭示於特開平7 - 176468號公報及對應之美國專利第 5,646,413號，此外，有關EGA係詳細揭示於特開昭61 -44429號公報及對應之美國專利第4,780,617號等。在本案國際申請所指定的國家或選擇的國家的國內法令所允許的範圍內，係援用上述美國專利中的揭示來作爲本說明書之記述的一部份。首先’主控制裝置20開始進行標線片R與晶圓W，亦即標線片載台RST與晶圓載台WST之X軸方向的相對掃描。當兩載台RST、WST爲分別達於目標掃描速度、等速同步狀態時，即以來自IOP照明系統的紫外脈衝光開始照明標線片R的圖案區域，以開始掃描曝光。上述相對掃描中’係藉由主控制裝置20持續監視前述晶圓干涉計23 及標線片干涉計16的測量値，並控制標線片驅動部22及晶圓載台驅動部24而進行。主控制裝置20，特別是在上述掃描曝光時，係進行標尺適用中國國家標準（CNS)A4規格（210 X 297公釐） ~ (請先閱讀背面之注意事項再填寫本頁)548708 A7 _______B7________ 5. Description of the invention (A) The 21Ym part of the mirror surface has almost no deformation. Therefore, by forming the screw portions 21Ye, 21Yf on the moving mirror 2ΐγ, the flatness of the mirror surface 21 Ym can be maintained at a high level. In addition, the 'moving mirror 21Y has a shape having a convex portion at the above-mentioned predetermined position, even if the vibration accompanying the driving of the wafer stage WST is transmitted to the moving mirror 21Y, the moving mirror 21Y and its fixed surface The gas moves in the gap due to vibration or is intended to escape from the gap, so the viscosity of the gas can damp the vibration. The other moving mirror 21X has the same configuration as the moving mirror 21Y. That is, as shown in FIGS. 2A and 2B, the moving mirror 21X is placed on the seat plate 56X near the + X end portion fixed to the lower surface of the wafer holding table WTB, and the moving mirror 21X is the same as the moving mirror 2ΐγ. , Two convex portions are formed on the -X side and the -Z side, respectively. Each convex portion is in contact with the + X side surface of the wafer holding table WTB and the upper surface (+ z side surface) of the seat plate 56X. The intermediary is fixed to the wafer holding table WTB from the + X side surface (mirror surface) of the moving mirror 21X to a screw portion (not shown) formed on the rear surface thereof. In this case, a gap of several μm (for example, 7 μm) is provided between the moving mirror 21X and the wafer holding table WTB and between the moving mirror 21X and the seat plate 56X. In FIG. 1, the control system is mainly composed of a main control device 20. The main control device 20 is composed of a so-called microcomputer (or workstation) including a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), etc., and controls the entire device in an integrated manner. . Main control device 20, —_ ---- J6_ Yimu paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) Order and line "548708 A7 B7 5. Description of the Invention (β) For example, in order to perform the exposure operation reliably, for example, the synchronous scanning of the reticle R and the wafer W, the stepping operation of the wafer W, and the like are controlled. Next, the exposure operation when the exposure device 10 of the present embodiment configured as described above sequentially transfers the pattern of the reticle R to each exposure irradiation area of the wafer W will be briefly described. In addition, on the premise, a reticle microscope (not shown), a reference mark plate (not shown) on the wafer holding table WTB, and a reticle alignment and crystal using a wafer alignment system (not shown) are provided. The baseline measurement of the circle alignment system and preparations for wafer alignment (EGA, etc.) have been completed. The above-mentioned reticle alignment and baseline measurement are disclosed in detail in, for example, Japanese Patent Application Laid-Open No. 7-176468 and corresponding US Patent No. 5,646,413, and the EGA system is disclosed in detail in Japanese Patent Application Laid-Open No. 61-44429. Gazette and corresponding US Patent No. 4,780,617. To the extent permitted by the domestic laws of the country designated or selected in the international application in this case, the disclosure in the aforementioned U.S. patent is used as part of the description of this specification. First, the main control device 20 starts the relative scanning of the reticle R and the wafer W, that is, the X-axis direction of the reticle stage RST and the wafer stage WST. When the two stages RST and WST reach the target scanning speed and isokinetic synchronization, respectively, the ultraviolet pulse light from the IOP lighting system starts to illuminate the pattern area of the reticle R to start scanning exposure. The above-mentioned relative scanning is performed by the main control device 20 continuously monitoring the measurement of the wafer interferometer 23 and the reticle interferometer 16 and controlling the reticle drive section 22 and the wafer stage drive section 24. The main control device 20, especially in the above-mentioned scanning exposure, the scale is applied to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ~ (Please read the precautions on the back before filling this page)

訂-—------β I 548708 A7 ___B7 五、發明說明（W ) 線片載台RST之X軸方向的移動速度Vr與晶圓載台WST 的X軸方向的移動速度Vw之同步控制，俾能因應於投影光學系統PL的投影倍率（1/4倍或1/5倍)之速度比。之後，以紫外脈衝光逐次不同於照明標線片R之圖案區域的區域，完成對圖案區域全面的照明，而結束晶圓W 上的第1曝光照射的掃描曝光。據此，標線片R的圖案即透過投影光學系統PL而縮小轉印於第1曝光照射區域。以上述方式，結束第1曝光照射區域的掃描曝光後，即藉由主控制裝置20，透過晶圓載台驅動部24，而步進移動晶圓載台WST於X、Y軸方向，且移動至第2曝光照射區域的曝光用掃描開始位置(加速開始位置）。接著，藉由主控制裝置20，和上述相同地控制各部的動作，並對晶圓W上的第2曝光照射區域進行與上述相同的掃描曝光。如此，重覆進行晶圓W上之曝光照射區域之掃描曝光與曝光照射間的步進動作，依序將標線片R的圖案轉印於晶圓W上之曝光對象的全部曝光照射區域。當結束對晶圓W上曝光對象之曝光照射區域的圖案轉印後，即換成下個晶圓，並和上述同樣地，重覆進行對準、曝光動作。如上述之說明，根據本實施形態之曝光裝置10，在進行如上述之曝光動作時，晶圓載台WST被線性馬達所驅動，但因晶圓載台WST的重心位置係設定於晶圓載台WST 驅動於X軸方向時的驅動軸上，故在驅動晶圓載台wst _______28 ___ 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) n· n ϋ αϋ 8sa —訂------ 線」 548708 A7 _____B7_______ 五、發明說明（yrj ) 於X軸方向時，不致產生不須要的旋轉力矩。因此，能有效地抑制產生於晶圓載台WST的縱向搖擺(Y軸轉動的旋轉）、橫搖(繞Z軸的旋轉)等，據此即能提昇晶圓載台的姿勢安定性及位置控制性。在晶圓載台WST的驅動之際，本實施形態雖係使用固定於晶圓保持台WTB的移動鏡21X，21Y來進行晶圓保持台WTB的的位置測量，但如上述般，由於移動鏡21X， 21Y係透過數μηι程度的空隙固定於晶圓保持台WTB的側面、座板56Χ，56Υ的上面，故即使晶圓載台WST隨著驅動而振動，且該振動傳達至移動鏡21Χ，21Υ，亦能藉由存在於移動鏡21Χ，21Υ各固定面之間的氣體，來衰減移動鏡 21Χ，21Υ的振動。此係移動鏡21Χ，21Υ與各固定面間的氣體因振動而在間隙內移動、或欲自間隙脫出時，因該氣體的粘性而衰減了振動之故。因此，藉由極力地抑制移動鏡21Χ，21Υ的振動，即能高精度地進行晶圓載台WST(晶圓保持台WTB)的位置控制。此外，由於在晶圓載台本體部30的底面，亦形成有用以形成數μηι空隙用的凹部46a，藉由存在於該空隙內氣體的粘性，亦由於和上述相同的理由而能抑制晶圓載體全體的振動。因此，即能高精度地進行晶圓載台WST的位置控制。此外，本實施形態係如上述，使用位置控制性爲高的晶圓載台裝置50而進行晶圓的移動，故特別是在掃描型的曝光裝置中，能提昇掃描曝光時之標線片和晶圓的同步精 __29___ 表紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) I 丨 I · I I I ---III 1^ 548708 A7 B7 五、發明說明（J ) 度’且能提昇對晶圓的圖案的轉印精度亦即曝光精度。又，上述實施形態中，因係設定晶圓載台的重心位置於驅動軸上，故固定於晶圓載台本體部30的配重構件並不限於圖2A、圖2B的構成，例如形狀、數量、質量、材質、及設置處所(位置)等可爲任意，且加工構成晶圓載台本體部30的至少1個的構件(底面構件46等），使其一部份形成凸部，而不須配重構件亦可。此外，上述實施形態中，爲了設定晶圓載台的重心位置於驅動軸上，而對晶圓載台本體部30固定配重構件、配重群，但本發明並不限於此。亦即，在調整晶圓載台的重心位置時，不使用配重構件等外在的附加，而改變構成晶圓載台本體部30的至少1個的構件的材質，亦即將其至少 1個的構件作成與其他構件相異的較重材質。例如，將作爲構成晶圓載台本體部30的一局部構件的底面構件，變更成白金鋼等的合金鋼、錬合金、銷、鶴、及此類的合金等高密度構件等亦可。此時，在構成晶圓載台本體部30的1個或複數個構件的各個，其全部均作成高密度構件等較爲理想，但亦可僅將其中一部份作成高密度構件。此外，上述實施形態中，係例如作成附加配重構件等來加重晶圓載台本體部30(可動部)之一部份，以將其重心位置設定於驅動軸上，但與此相反地，減輕晶圓載台本體部30之一部份(使構成晶圓載台本體部30的至少1個的構件輕量化），例如將晶圓保持台WTB等作成蜂巢構造，或將其至少1個的構件作成和 ___30___ 私紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) --------訂------- ——線」 548708 A7 — -----一 —_B7___ 五、發明說明（y ) 其他構件相異的較輕材質等，而設定晶圓載台本體部30的重心位置於驅動軸上亦可。此處，上述應作成較重或較輕的至少1個的構件，係可構成晶圓載台本體部30(可動部) 的任何構件。而且，上述實施形態中，在上述式（1)的晶圓載台WST(可動部)的質量Ms爲作成包含有其一部份，例如設置於晶圓保持台WTB的移動鏡21X、21Y或未圖示的基準標記板等的質量之一種構成，但晶圓載台WST因係固定晶圓W而移動，故作成包含有晶圓W的質量之一種構成爲佳。又，上述實施形態中，係作成在移動鏡形成凸部，而在移動鏡和固定對象面之間設置空隙之一種構成，但本發明並不自限於此，亦可作成在晶圓載台或座板的上面等之固定有移動鏡的對象面側形成凸部之一種構成、亦可作成在移動鏡和固定對象面之間的間隙中介其他的構件而固定之一種構成。重點係只要在移動鏡和固定對象面之間的一部份中介空隙之狀態下，能固定移動鏡於晶圓載台（晶圓保持台)即可。又’上述實施形態中，係採用螺固之構成以作爲封晶圓載台固定移動鏡之機構，但本發明並不限於此，例如，藉由凸部以黏著劑等來加以固定亦可。此時，如上述實施形態般，不設置低剛性部亦可。又，上述實施形態中，係說明在重心位置設定於驅動軸上的晶圓載台上，設置能抑制振動的移動鏡，進一步在晶圓載台的底面構件的底面形成凹部的情形，但本發明並 — _____31___ +紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂--------線-赢 548708 A7 ___B7 _ 五、發明說明（？。）不限於此。亦即，本發明之載台裝置，可在設定重心位置於驅動軸上的第1特徵、在移動鏡與其固定對象面之間設置空隙的第2特徵、以及在載台（底面構件）的底面設置凹部的第3特徵中，組合任意的2個特徵，或具有任意的1 個特徵。特別是不具有第2特徵而具有第1及第3特徵的至少一方的晶圓載台，在無設置移動鏡21X，21Y的情形下，將其中的一部份例如晶圓保持台WTB的端面予以鏡面加工來作爲反射面亦可。又，上述實施形態中，係說明將本發明之載台裝置使用於用以驅動晶圓之圓載台的情形，但並不限於此，亦可採用本發明之載台裝置來作爲標線片載台。又，上述實施形態中，係說明有關採用線性馬達來作爲驅動載台的驅動裝置，但本發明並不限於此，例如採用螺桿進給方式的驅動裝置來作爲驅動裝置亦可。此外，在圖1中雖省略圖示，但上述實施形態的曝光裝置係以相異的防振機構來分別固定晶圓載台(載台基座40)與投影光學系統PL之一種構成，但本發明之曝光裝置當然不限於此。例如藉由相同的防振機構來支撐固定投影光學系統PL的柱件與載台基座亦可。此時，亦可將載台基座懸吊支撐於前述柱件。或在載台基座上設置另外的防振機構，透過該防振機構來支撐前述柱件亦可。亦即，曝光裝置的本體構造係並不限於圖 1所示之構成，其構成係可任意之構成。再者，上述實施形態的曝光裝置中，係可採用在晶圓載台與標線片載台的至少一方，和載台所配置的基台相異 ___32 __ 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)Order ----------- β I 548708 A7 ___B7 V. Description of the invention (W) Synchronous control of X-axis moving speed Vr of wafer stage RST and X-axis moving speed Vw of wafer stage WST , Can not respond to the speed ratio of the projection magnification (1/4 times or 1/5 times) of the projection optical system PL. After that, the area different from the pattern area of the reticle R is sequentially illuminated with ultraviolet pulsed light, and the pattern area is completely illuminated, and the scanning exposure of the first exposure irradiation on the wafer W is ended. Accordingly, the pattern of the reticle R passes through the projection optical system PL and is reduced and transferred to the first exposure irradiation area. In the manner described above, after the scanning exposure of the first exposure irradiation area is ended, the main control device 20 is used to step through the wafer stage driving section 24 to move the wafer stage WST in the X and Y axis directions and move to the first stage. 2 Exposure scan start position (acceleration start position) for the exposure irradiation area. Next, the main control device 20 controls the operation of each part in the same manner as described above, and performs the same scanning exposure on the second exposure irradiation area on the wafer W as described above. In this way, the stepwise operation between the scanning exposure and the exposure irradiation on the wafer W is repeatedly performed, and the pattern of the reticle R is sequentially transferred to all the exposure irradiation regions of the exposure target on the wafer W. When the pattern of the exposure irradiation area of the exposure object on the wafer W is finished, it is replaced with the next wafer, and the alignment and exposure operations are repeated as described above. As described above, according to the exposure apparatus 10 of this embodiment, the wafer stage WST is driven by the linear motor during the exposure operation as described above, but the position of the center of gravity of the wafer stage WST is set to the wafer stage WST drive. It is on the drive axis in the X-axis direction, so when driving the wafer stage wst _______28 ___ The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling in this page ) n · n ϋ αϋ 8sa — order ------ line "548708 A7 _____B7_______ V. Description of the invention (yrj) When it is in the X-axis direction, it will not cause unnecessary rotation torque. Therefore, it is possible to effectively suppress the longitudinal swing (rotation of the Y-axis rotation) and the roll (rotation about the Z-axis) of the wafer stage WST, thereby improving the posture stability and position controllability of the wafer stage. . When the wafer stage WST is driven, although this embodiment uses the moving mirrors 21X and 21Y fixed to the wafer holding stage WTB to measure the position of the wafer holding stage WTB, as described above, the moving mirror 21X 21Y is fixed to the side of the wafer holding table WTB and the upper surface of the seat plates 56 ×, 56 透过 through a gap of several μm, so even if the wafer stage WST vibrates with driving, the vibration is transmitted to the moving mirrors 21 ×, 21Υ, It is also possible to attenuate the vibrations of the moving mirrors 21X, 21Υ by the gas existing between the fixed surfaces of the moving mirrors 21X, 21Υ. When the gas between this moving mirror 21 ×, 21Υ and each fixed surface moves in the gap due to vibration, or when it is about to get out of the gap, the vibration is attenuated due to the viscosity of the gas. Therefore, by suppressing the vibration of the moving mirrors 21X and 21Υ as much as possible, the position control of the wafer stage WST (crystal wafer holding stage WTB) can be performed with high accuracy. In addition, since a recess 46a for forming several μm voids is also formed on the bottom surface of the wafer stage body portion 30, the viscosity of the gas existing in the voids can also suppress the wafer carrier for the same reasons as described above. The whole vibration. Therefore, the position control of the wafer stage WST can be performed with high accuracy. In addition, in this embodiment, as described above, the wafer is moved using the wafer stage device 50 having high position controllability. Therefore, especially in a scanning-type exposure device, the reticle and the crystal during scanning exposure can be improved. Synchronous fineness of the circle __29___ The paper size of the table applies to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page) I 丨 I · III --- III 1 ^ 548708 A7 B7 V. Description of the invention (J) degree, and can improve the transfer accuracy of the pattern of the wafer, that is, the exposure accuracy. Moreover, in the above-mentioned embodiment, since the position of the center of gravity of the wafer stage is set on the drive shaft, the weight member fixed to the wafer stage body portion 30 is not limited to the configuration of FIG. 2A and FIG. 2B, such as the shape and number , Quality, material, and installation location (position) can be arbitrary, and at least one component (bottom surface component 46, etc.) constituting the wafer stage body portion 30 is processed so that a part of it forms a convex portion, without the need to Counterweight members are also possible. In addition, in the above-mentioned embodiment, in order to set the center of gravity of the wafer stage on the drive shaft, a weight member and a weight group are fixed to the wafer stage body 30, but the present invention is not limited to this. That is, when adjusting the position of the center of gravity of the wafer stage, external materials such as a weight member are not used, and the material of at least one of the members constituting the wafer stage body portion 30 is changed, that is, at least one of them is changed. The component is made of a heavier material that is different from other components. For example, the bottom member, which is a partial member constituting the wafer stage body portion 30, may be changed to a high-density member such as alloy steel such as platinum steel, samarium alloy, pin, crane, and the like. At this time, in each of the one or a plurality of members constituting the wafer stage main body portion 30, it is preferable to make all of them a high-density member, but only a part of them may be made to a high-density member. In addition, in the above-mentioned embodiment, for example, an additional weight member or the like is used to increase a portion of the wafer stage body portion 30 (movable portion) to set the center of gravity position on the drive shaft. Reducing a portion of the wafer stage body portion 30 (lightening at least one member constituting the wafer stage body portion 30), for example, forming a wafer holding table WTB or the like into a honeycomb structure, or at least one of the members Made and ___30___ private paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the notes on the back before filling this page) -------- Order ----- -——Line ”548708 A7 — ----- 一 —_B7 ___ 5. Description of the Invention (y) Lighter materials with different components, etc., and the position of the center of gravity of the wafer stage body 30 on the drive shaft is also set. can. Here, at least one of the above-mentioned components which should be made lighter or lighter is any component which can constitute the wafer stage body portion 30 (movable portion). Furthermore, in the above-mentioned embodiment, the mass Ms of the wafer stage WST (movable part) in the above formula (1) is prepared to include a part thereof, for example, the moving mirrors 21X, 21Y, or unmounted mirrors mounted on the wafer holding table WTB. The quality of the reference mark plate and the like is shown in the figure, but the wafer stage WST moves because the wafer W is fixed. Therefore, it is preferable to have a structure including the quality of the wafer W. In the above embodiment, a structure is formed in which a convex portion is formed in the moving mirror and a gap is provided between the moving mirror and the fixed target surface. However, the present invention is not limited to this, and may be made in a wafer stage or a base. The upper surface of the plate, or the like, has a structure in which a convex portion is formed on the object surface side to which the moving mirror is fixed, or a structure in which a gap between the moving mirror and the fixed object surface is fixed through other members. The important point is that the moving mirror can be fixed on the wafer stage (wafer holding stage) in a state of a part of the intermediate space between the moving mirror and the fixed object surface. In addition, in the above-mentioned embodiment, a screw-fixed structure is used as a mechanism for fixing the moving mirror as a sealed wafer round stage, but the present invention is not limited to this. For example, the convex portion may be fixed by an adhesive or the like. In this case, as in the above embodiment, a low rigidity portion may not be provided. In the above-mentioned embodiment, a case where a moving mirror capable of suppressing vibration is provided on a wafer stage having a center of gravity position set on a drive shaft, and a recessed portion is further formed on a bottom surface of a bottom surface member of the wafer stage is described. — _____31___ + The paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the notes on the back before filling this page) Order -------- line-win 548708 A7 ___B7 _ V. Description of the invention (?) It is not limited to this. That is, in the stage device of the present invention, the first feature of setting the center of gravity on the drive shaft, the second feature of providing a gap between the moving mirror and its fixed target surface, and the bottom surface of the stage (bottom member) In the third feature in which the recess is provided, any two features are combined, or any one feature is provided. In particular, a wafer stage having at least one of the first and third features without the second feature, when no moving mirror 21X, 21Y is provided, a part of the wafer stage, such as the end surface of the wafer holding stage WTB, is provided. Mirror processing may be used as the reflecting surface. In the above embodiment, the case where the stage device of the present invention is used to drive a round stage for driving a wafer is described, but it is not limited to this, and the stage device of the present invention can also be used as a reticle. station. In the above-mentioned embodiment, a description is given of a drive device using a linear motor as a drive stage. However, the present invention is not limited to this. For example, a drive device using a screw feed system may be used as the drive device. Although the illustration is omitted in FIG. 1, the exposure apparatus of the above embodiment has a structure in which the wafer stage (stage base 40) and the projection optical system PL are respectively fixed by different vibration isolation mechanisms. The exposure device of the invention is of course not limited to this. For example, the pillars and the stage bases for fixing the projection optical system PL may be supported by the same anti-vibration mechanism. At this time, the stage base can also be suspended and supported on the pillar. Alternatively, an additional anti-vibration mechanism may be provided on the base of the stage, and the post may be supported by the anti-vibration mechanism. That is, the body structure of the exposure apparatus is not limited to the structure shown in Fig. 1, and the structure can be any structure. In addition, in the exposure apparatus of the above embodiment, at least one of the wafer stage and the reticle stage may be adopted, and the base station is different from the base station configured _32 __ This paper standard applies Chinese National Standard (CNS) A4 size (210 X 297 mm) (Please read the notes on the back before filling this page)

548708 A7 ____B7__ 五、發明說明（；丨）的設置面上，配置驅動裝置的一部份之反作用框架機構，或藉由反力來抵消產生於載台移動時之反作用力的反力機構亦可，亦可採用配置有2個載台的雙載台方式，或能保持2個物體(標線片或晶圓)的雙夾具方式等。又，上述實施形態中，係使用F2雷射、ArF準分子雷射等的真空紫外帶的脈衝雷射光源來作爲光源，但並不限於此，使用水銀燈，KrF準分子雷射光源(輸出波長248nm) 等的紫外或遠紫外光源，或Ar2雷射光源(輸出波長i26nm) 等的其他真空紫外光源亦可。此外，例如，作爲真空紫外光並不限於來自上述各光源所輸出的雷射光，將DFB半導體雷射或光纖雷射所振盪的紅外線帶、或可視帶的單一波長雷射光，以例如摻雜有餌(E〇(或餌和鏡(Yb)的兩種)的光纖放大器予以放大，使用以非線形光學結晶加以波長變換成紫外光的高次諧波亦可。進一步的，作爲曝光用照明用光IL，不僅紫外光等，亦可使用X射線(包含EUV光)或電子線或離子光束等的荷電粒子線等。又，上述實施形態中，雖係說明將本發明適用於步進掃描方式等的掃描型曝光裝置，但本發明之適用範圍，當然並不限於此。亦即，本發明亦適合使用於步進重覆方式之縮小投影曝光裝置。又’將由複數個透鏡構成的照明光學系統、投影光學系統，予以組裝至曝光裝置本體，且進行光學調整的同時，並安裝由多數的機械部件所組成的標線片載台或晶圓載台至曝光裝置本體，並連接配線或配管，進而，藉由實施 ___ _33___ 木紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) I 1 ^ I I--1111— 548708 A7 ---—-----------Β7__________ 五、發明說明（> ) 綜合調整（電氣調整、動作確認），即能製造上述實施形態的曝光裝置。又，曝光裝置的製造以在溫度及淸潔度等受到管理的無塵室中進行較佳。此外’上述實施形態中，雖說明有關本發明之適用於半導體製造用的曝光裝置之情形，但並不限於此，例如，本發明亦能廣泛地適用於轉印液晶顯示元件圖案於方型的玻璃基板之曝光裝置、電漿顯示器或有機EL等的顯示裝置、薄膜磁頭、攝影元件、微機械、DNA晶片等之製造用的曝光裝置等。此外，並非僅半導體元件等的微裝置，光曝光裝置、 EUV曝光裝置、X射線曝光裝置、及電子射線曝光裝置等所使用的標線片或光罩之製造用之轉印電路圖案於玻璃基板或矽晶圓等的曝光裝置，亦能適用本發明。此處，使用 DUV(遠紫外)光或VUV(真空紫外)光等的曝光裝置，一般係使用透過型標線片，而作爲標線片基板係使用摻雜石英玻璃、氟的石英玻璃、螢石、氟化鎂、或水晶等。半導體元件，係經過進行元件功能及性能設計的步驟、根據該設計步驟製作標線片的步驟、自矽材料製作晶圓的步驟、以上述實施形態之曝光裝置將標線片圖案轉印至晶圓的步驟、元件組裝步驟(含切割製程、打線製程、封裝製程）、檢查步驟來加以製造。以下，詳述有關該元件製造方法。 _______34 ^紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ,0 訂， 548708548708 A7 ____B7__ 5. The installation surface of the description of the invention (; 丨) is equipped with a reaction frame mechanism that is part of the driving device, or a reaction force mechanism that counteracts the reaction force generated when the stage moves by reaction force. It is also possible to use a dual stage method with two stages, or a double jig mode capable of holding two objects (reticle or wafer). In the above embodiment, a pulsed laser light source in a vacuum ultraviolet band such as an F2 laser or an ArF excimer laser is used as the light source, but it is not limited to this. A mercury lamp, a KrF excimer laser light source (output wavelength 248nm) and other ultraviolet or extreme ultraviolet light sources, or other vacuum ultraviolet light sources such as Ar2 laser light source (output wavelength i26nm). In addition, for example, the vacuum ultraviolet light is not limited to the laser light output from each of the above light sources, and a single-wavelength laser light in an infrared band or a visible band oscillated by a DFB semiconductor laser or an optical fiber laser is doped with, for example, The optical fiber amplifier of the bait (E0 (or two types of bait and mirror (Yb)) is amplified, and a higher-order harmonic of wavelength conversion into ultraviolet light by a non-linear optical crystal may be used. Further, it may be used as illumination light for exposure. IL, not only ultraviolet light, but also X-rays (including EUV light), charged particle beams such as electron beams, ion beams, etc. Also, in the above embodiment, it has been described that the present invention is applied to a step scanning method, etc. Scanning exposure device, but the scope of application of the present invention is of course not limited to this. That is, the present invention is also suitable for use in a step-and-repeat type projection reduction exposure apparatus. Also, an illumination optical system composed of a plurality of lenses The projection optical system is assembled into the exposure device body and optical adjustment is performed, and a reticle stage or crystal composed of most mechanical parts is installed. The stage is connected to the exposure device body, and the wiring or piping is connected. Furthermore, by implementing ___ _33___ wood paper standards apply Chinese National Standard (CNS) A4 specifications (210 X 297 mm) (Please read the precautions on the back before filling (This page) I 1 ^ I I--1111— 548708 A7 ---------------- B7__________ V. Description of the invention (>) Comprehensive adjustment (electrical adjustment, operation confirmation) The exposure device according to the above embodiment is manufactured. The exposure device is preferably manufactured in a clean room in which temperature, cleanliness, and the like are managed. In addition, in the above embodiment, the application of the present invention to semiconductor manufacturing has been described. The present invention is not limited to such an exposure device. For example, the present invention can also be widely applied to an exposure device for transferring a liquid crystal display element pattern to a square glass substrate, a plasma display, an organic EL display device, or the like. Exposure devices for the manufacture of thin-film magnetic heads, photographic elements, micromachines, DNA wafers, etc. In addition, not only microdevices such as semiconductor elements, but also light exposure devices, EUV exposure devices, and X-ray exposure devices. The present invention can also be applied to an exposure device that transfers a pattern of a reticle used in an electron beam exposure device or a photomask to a glass substrate or a silicon wafer. Here, DUV (far ultraviolet) is used. Exposure devices such as light or VUV (Vacuum Ultraviolet) light generally use transmissive reticle, and as the reticle substrate, doped quartz glass, fluorine-doped quartz glass, fluorite, magnesium fluoride, or crystal is used. The semiconductor device is a step of designing the function and performance of the device, a step of making a reticle according to the design step, a step of making a wafer from a silicon material, and transferring the reticle pattern to the exposure device of the above embodiment. Wafer steps, component assembly steps (including dicing processes, wire bonding processes, packaging processes), and inspection steps to manufacture. The manufacturing method of this element will be described in detail below. _______34 ^ The paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling out this page), Order 0, 548708

五、發明說明（e ) [元件製造方法] 圖5係顯示元件(IC或LSI等的半導體晶片、液晶面板' iCD、薄膜磁頭、微機械等)之製造例的流程圖。如圖 5所不’首先’於步驟201，進行元件的功能及性能設計( 例如，半導體元件的電路設計等），肺用顧現該功能的圖案設§十°繼之’於步驟202(光罩製作步驟），製作形成有設計之電路圖案的光罩。另一方面，於步驟2〇3(晶圓製造步驟），使用矽等的材料製造晶圓。其次’於步驟204(晶圓處理步驟），使用步驟201〜步驟203所準備的光罩與晶圓，如後述般地，藉由微影技術等在晶圓上形成實際的電路。接著，於步驟205(元件組裝步驟），使用經步驟204所處理的晶圓進行組裝。在該步驟 205 ’視需要包含有切割製程、打線製程、及封裝製程（晶片封裝)等的製程。最後’於步驟206(檢查步驟），進行步驟205所作成的元件的動作確認的檢測、耐久檢測等的檢查。經過如此之製程後完成元件製作，即可出貨。圖6係顯示半導體元件之上述步驟2〇4之詳細的流程例。圖6中’步驟211(氧化步驟），係使晶圓表面氧化。於步驟212(CVD步驟），係形成絕緣膜於晶圓表面。於步驟 213(電極形成步驟），係藉由蒸鍍法將電極形成於晶圓上。步驟214(離子植入步驟），係將離子植入晶圓。以上的步驟 211〜步驟214 ’係構成晶圓處理的各階段的前處理製程，在各階段中視需要選擇性地實施。 _______ 35 __ 衣紙張尺度適用中國國家標準（CNS)A4規格（2川x 297公釐） (請先閱讀背面之注意事項再填寫本頁)V. Description of the invention (e) [Element manufacturing method] Fig. 5 is a flowchart of a manufacturing example of a display element (semiconductor wafer such as IC or LSI, liquid crystal panel 'iCD, thin-film magnetic head, micro-machine, etc.). As shown in FIG. 5, the function and performance design of the component (for example, the circuit design of a semiconductor device, etc.) is not performed first in step 201, and the pattern of the function that takes into account the function is set to §10 ° followed by step 202 (light Mask manufacturing step), a mask with a designed circuit pattern is manufactured. On the other hand, in step 203 (wafer manufacturing step), a wafer is manufactured using a material such as silicon. Next, in step 204 (wafer processing step), the photomask and wafer prepared in steps 201 to 203 are used to form an actual circuit on the wafer by a lithography technique as described later. Next, in step 205 (component assembly step), the wafer processed in step 204 is used for assembly. In this step 205 ′, a process including a cutting process, a wire bonding process, and a packaging process (wafer packaging) is included as necessary. Finally, at step 206 (inspection step), inspections such as operation confirmation detection and durability detection of the elements made in step 205 are performed. After such a process is completed, the components are manufactured and ready for shipment. Fig. 6 shows a detailed flow example of the above-mentioned step 204 of the semiconductor element. The step 211 (oxidation step) in FIG. 6 is to oxidize the wafer surface. In step 212 (CVD step), an insulating film is formed on the wafer surface. In step 213 (electrode formation step), an electrode is formed on the wafer by a vapor deposition method. Step 214 (ion implantation step) is to implant ions into the wafer. The above steps 211 to 214 ′ are pre-processing processes constituting each stage of wafer processing, and are selectively implemented in each stage as necessary. _______ 35 __ Applicable to China National Standard (CNS) A4 size (2 Sichuan x 297 mm). (Please read the precautions on the back before filling this page)

548708 A7 --_B7________ 五、發明說明（W ) 於晶圓製程的各階段中，當結束上述的前處理製程，即如下述般進行後處理製程。該後處理製程中，首先，於步驟215(光阻形成步驟），將感光劑塗佈於晶圓。接著，於步驟216(曝光步驟），藉由以上所說明的曝光裝置及其曝光方'法’將光罩的電路圖案轉印於晶圓。其次，於步驟217( 顯影步驟），將己曝光的晶圓加以顯像，於步驟218(蝕刻步驟）’藉由蝕刻除去光阻殘留部份之以外的露出構件。接著 ’於步驟219(光阻除去步驟），將完成蝕刻之不要的光阻予以去除。藉由重覆進行此等前處理製程及後處理製程，在晶圓上形成多重的電路圖案。若使用以上所說明的本實施形態的元件製造方法，由於在曝光製程中(步驟216)係使用上述實施形態之曝光裝置，故能高精度地將作爲第1物體的標線片的圖案轉印於作爲第2物體的晶圓上，其結果即能提昇高積體度元件的生產性(包括良率）。 [產業上的可利用性] 如以上所說明，本發明之第丨〜第3載台裝置，極適合以良好地姿勢的安定性及位置控制性驅動載台。此外，本發明之曝光裝置，極適合將電路圖案轉印於物體上之處理。再者’本發明之元件製造方法，極適合生產高積體^ 的元件。 /垃又 (請先閱讀背面之注意事項再填寫本頁) 嫌訂· *—--- 線」 36548708 A7 --_ B7________ 5. Description of the Invention (W) In the various stages of the wafer process, when the pre-processing process mentioned above is ended, the post-processing process is performed as follows. In this post-processing process, first, in step 215 (photoresist formation step), a photosensitizer is applied to the wafer. Next, in step 216 (exposure step), the circuit pattern of the photomask is transferred to the wafer by the exposure apparatus and its exposure method described above. Next, in step 217 (development step), the exposed wafer is developed, and in step 218 (etching step) ', the exposed members other than the remaining portion of the photoresist are removed by etching. Next, at step 219 (photoresist removal step), the unnecessary photoresist after the etching is removed. By repeating these pre-processing and post-processing processes, multiple circuit patterns are formed on the wafer. If the device manufacturing method of this embodiment described above is used, the exposure device of the above embodiment is used in the exposure process (step 216), so that the pattern of the reticle as the first object can be transferred with high accuracy. On the wafer as the second object, as a result, the productivity (including yield) of the high-integration component can be improved. [Industrial Applicability] As described above, the third to third stage devices of the present invention are extremely suitable for driving the stage with good posture stability and position controllability. In addition, the exposure device of the present invention is very suitable for the process of transferring a circuit pattern onto an object. Furthermore, the component manufacturing method of the present invention is extremely suitable for the production of high-volume components. / Spam (Please read the precautions on the back before filling this page)

Claims

548708 ab DO C8 D8 六、申請專利範圍 1、一種載台裝置，其特徵在於，具備：載置物體的載台；及驅動該載台於至少既定之1軸方向之驅動裝置；前述載台的重心位置，係設定於前述驅動裝置在驅動前述載台於至少前述既定之1軸方向時的驅動軸上。 2、如申請專利範圍第1項之載台裝置，其中，前述驅動裝置，係在移動面內驅動前述載台於前述既定之1軸方向及與此正交的另1軸方向。 3、如申請專利範圍第1項之載台裝置，其中，前述驅動裝置係線性馬達。 4、如申請專利範圍第1項之載台裝置，其中，前述載台，具有保持前述物體的保持台、及支持該保持台的載台本體部；前述重心位置於前述驅動軸上的設定，係藉由前述載台本體部重心位置的調整來進行。 5、如申請專利範圍第4項之載台裝置，其中，其進一步具備安裝於前述載台本體部的前述重心位置調整用的配重構件。 6、如申請專利範圍第4項之載台裝置，其中，前述載台本體部重心位置的調整，係藉由使用高密度構件來作爲構成前述載台本體部的局部構件而實現。 7、如申請專利範圍第6項之載台裝置，其中，進一步具備氣體靜壓軸承，以相對作爲前述載台移動基準的導引面，透過既定間隙懸浮支持前述載台本體部及前述保持台 (請先閲讀背面之注意事項再塡寫本頁) -嫌、1T: 線本紙張尺度適用中國國家標準（CNS)A4規格(210 X 297公釐) 548708548708 ab DO C8 D8 6. Scope of patent application 1. A stage device, comprising: a stage for placing an object; and a driving device for driving the stage in at least a predetermined one-axis direction; The position of the center of gravity is set on the drive shaft when the drive device drives the stage in at least the predetermined one-axis direction. 2. For example, the stage device of the scope of the patent application, wherein the aforementioned driving device drives the stage in the moving plane in the predetermined one-axis direction and the other one-axis direction orthogonal thereto. 3. For example, the stage device of the scope of patent application, wherein the aforementioned driving device is a linear motor. 4. The stage device according to item 1 of the scope of patent application, wherein the aforementioned stage has a retaining stage that holds the aforementioned object and a stage body portion supporting the retaining stage; the setting of the position of the center of gravity on the driving shaft, This is performed by adjusting the position of the center of gravity of the stage body. 5. The stage device according to item 4 of the scope of patent application, further comprising a weight member for adjusting the position of the center of gravity of the stage body. 6. The stage device according to item 4 of the scope of patent application, wherein the position of the center of gravity of the stage body is adjusted by using a high-density member as a partial member constituting the stage body. 7. For example, the stage device of the scope of application for patent No. 6 further includes an aerostatic bearing to support the carrier body portion and the retaining platform through a predetermined gap with a guide surface relative to the carrier movement reference. (Please read the precautions on the back before copying this page)-Suspect, 1T: The size of thread paper is applicable to China National Standard (CNS) A4 (210 X 297 mm) 548708

六、申請專利範圍 ,則述局部構件，係設有前述氣體靜壓軸承的底面構件。 8、如申請專利範圍第7項之載台裝置，其中，前述底面構件的底面，形成有既定深度的凹部。 9、如申請專利範圍第1項之載台裝置，其中，前述載台的iu置，係藉由干涉計加以測量，並進一步具備前述干涉計用的移動鏡，其係在與前述載台之間形成空隙之狀態下’至少以2點固定於前述載台。 10、一種載台裝置，其特徵在於，具備：載台’係用以載置物體，且相對作爲移動基準的導引面透過既定間隙被懸浮支持；及驅動裝置，係沿前述導引面驅動前述載台於至少既定之1軸方向；在構成前述載台之底面構件底面，形成有既定深度的凹部。 11、如申請專利範圍第10項之載台裝置，其中，前述載台的位置，係藉由干涉計加以測量，並進一步具備前述干涉計用的移動鏡，其係在與前述載台之間形成空隙之狀態下，至少以2點固定於前述載台。 12、如申請專利範圍第11項之載台裝置，其中，前述移動鏡對向於前述載台的部份，設定有與前述載台接觸的至少2處的接觸部、及不與前述載台接觸的非接觸部。 13、如申請專利範圍第12項之載台裝置，其中，前述接觸部係設置於前述移動鏡的前述載台對向面的凸部。 14、如申請專利範圍第12項之載台裝置，其中，前本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再塡寫本頁) 、1T·— 線Lfl 548708 as B8 C8 D8 六、申請專利範圍述移動鏡係以前述接觸部螺固於前述載台，前述移動鏡的螺固位置周邊部份與其他的部份相較，爲低剛性。 15、如申請專利範圍第10項之載台裝置，其中，前述載台的重心位置，係設定於前述載台的驅動軸上。 16、一種載台裝置，其特徵在於，具備：載台，係用以載置物體，且其位置以干涉計加以測量體測量；及前述干涉計用的移動鏡，係在與前述載台之間形成空隙之狀態下，至少以2點固定於前述載台。 17、如申請專利範圍第16項之載台裝置，其中，前述移動鏡對向於前述載台的部份，設定有與前述載台接觸的至少2處的接觸部、及不與前述載台接觸的非接觸部。 18、如申請專利範圍第17項之載台裝置，其中，前述接觸部係設置於前述移動鏡的前述載台對向面的凸部。 19、如申請專利範圍第17項之載台裝置，其中，前述移動鏡係以前述接觸部螺固於前述載台，前述移動鏡的螺固位置周邊部份與其他的部份相較，爲低剛性。 20、如申請專利範圍第16項之載台裝置，其中，前述載台的重心位置，係設定於前述載台的驅動軸上。 21、一種曝光裝置，係將第1物體上形成之圖案轉印至第2物體上，其特徵在於：具備如申請專利範圍第1〜20項中任一項之載台裝置，來作爲前述第1物體與前述第2物體中至少一方之驅動裝置。本紙張尺度適用中國國家標準（CNS)A4規格(210χ 297公釐) (請先閲讀背面之注意事項再塡寫本頁) -vtl 線 548708 as B〇 C8 D8 六、申請專利範圍 22、一種元件製造方法，係含有微影製程，其特徵在於：前述微影製程，係使用如申請專利範圍第21項之曝光裝置，以將第1物體之圖案轉印至第2物體上。 (請先閲讀背面之注意事項再塡寫本頁) 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)Sixth, the scope of the patent application, the local component is the bottom surface component provided with the aforementioned aerostatic bearing. 8. The stage device according to item 7 of the scope of patent application, wherein a recess of a predetermined depth is formed on the bottom surface of the aforementioned bottom surface member. 9. For example, the stage device of the scope of the patent application, wherein the iu position of the aforementioned stage is measured by an interferometer, and further provided with a moving mirror for the aforementioned interferometer, which is connected with the stage of the aforementioned stage. In a state where a gap is formed therebetween, it is fixed to the aforementioned stage at least two points. 10. A stage device, comprising: the stage 'is used for placing objects, and is relatively suspended and supported through a predetermined gap with respect to a guide surface serving as a reference for movement; and a driving device for driving along the aforementioned guide surface The stage is in at least a predetermined one-axis direction; a recess of a predetermined depth is formed on a bottom surface of a bottom surface member constituting the stage. 11. For example, the stage device of claim 10, wherein the position of the aforementioned stage is measured by an interferometer, and a moving mirror for the aforementioned interferometer is further provided between the stage and the aforementioned stage. When the gap is formed, it is fixed to the aforementioned stage at least two points. 12. For the stage device according to item 11 of the scope of the patent application, the part of the moving mirror facing the stage is provided with at least two contact portions that are in contact with the stage, and not in contact with the stage. Non-contact parts. 13. The stage device according to item 12 of the scope of patent application, wherein the aforementioned contact portion is a convex portion provided on the opposite surface of the stage of the moving mirror. 14. For the stage device of the scope of application for patent No. 12, in which the previous paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before writing this page) 1T · —line Lfl 548708 as B8 C8 D8 6. The scope of the patent application states that the moving mirror is screwed to the aforementioned stage with the aforementioned contact portion, and the peripheral part of the screwing position of the aforementioned moving mirror is compared with other parts as Low rigidity. 15. The stage device according to item 10 of the scope of patent application, wherein the position of the center of gravity of the aforementioned stage is set on the drive shaft of the aforementioned stage. 16. A stage device, comprising: a stage for placing an object, and the position of the stage is measured by an interferometer; and a moving mirror for the interferometer is connected to the stage. In a state where a gap is formed between them, it is fixed to the carrier at least two points. 17. For example, the stage device of the scope of application for a patent, wherein the part of the moving mirror facing the stage is provided with at least two contact portions that are in contact with the stage, and not in contact with the stage. Non-contact parts. 18. The stage device according to item 17 of the scope of patent application, wherein the aforementioned contact portion is a convex portion provided on an opposite surface of the stage of the moving mirror. 19. For example, the stage device of the scope of application for patent No. 17, wherein the aforementioned moving mirror is screwed to the aforementioned stage with the aforementioned contact portion, and the peripheral part of the screwing position of the aforementioned movable mirror is compared with other parts as Low rigidity. 20. The stage device according to item 16 of the scope of patent application, wherein the position of the center of gravity of the aforementioned stage is set on the drive shaft of the aforementioned stage. 21. An exposure device that transfers a pattern formed on a first object to a second object, characterized in that it is provided with a stage device such as any one of items 1 to 20 of the scope of patent application as the aforementioned first A driving device for at least one of the first object and the second object. This paper size applies to China National Standard (CNS) A4 specification (210 x 297 mm) (Please read the precautions on the back before writing this page) -vtl line 548708 as B〇C8 D8 VI. Application scope 22, a component The manufacturing method includes a lithography process, which is characterized in that the aforementioned lithography process uses an exposure device such as the item 21 of the patent application scope to transfer the pattern of the first object onto the second object. (Please read the precautions on the back before copying this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)