TW545871U - Liquid cooling type heat-dissipating device - Google Patents

Liquid cooling type heat-dissipating device

Info

Publication number
TW545871U
TW545871U TW91217576U TW91217576U TW545871U TW 545871 U TW545871 U TW 545871U TW 91217576 U TW91217576 U TW 91217576U TW 91217576 U TW91217576 U TW 91217576U TW 545871 U TW545871 U TW 545871U
Authority
TW
Taiwan
Prior art keywords
type heat
liquid cooling
cooling type
dissipating device
dissipating
Prior art date
Application number
TW91217576U
Other languages
Chinese (zh)
Inventor
Jia-Hau Jang
Original Assignee
Jia-Hau Jang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jia-Hau Jang filed Critical Jia-Hau Jang
Priority to TW91217576U priority Critical patent/TW545871U/en
Publication of TW545871U publication Critical patent/TW545871U/en

Links

TW91217576U 2002-11-01 2002-11-01 Liquid cooling type heat-dissipating device TW545871U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91217576U TW545871U (en) 2002-11-01 2002-11-01 Liquid cooling type heat-dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91217576U TW545871U (en) 2002-11-01 2002-11-01 Liquid cooling type heat-dissipating device

Publications (1)

Publication Number Publication Date
TW545871U true TW545871U (en) 2003-08-01

Family

ID=29730829

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91217576U TW545871U (en) 2002-11-01 2002-11-01 Liquid cooling type heat-dissipating device

Country Status (1)

Country Link
TW (1) TW545871U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7472743B2 (en) 2005-05-07 2009-01-06 Foxconn Technology Co., Ltd. Liquid cooling system suitable for removing heat from electronic components
CN107436652A (en) * 2016-05-25 2017-12-05 奇鋐科技股份有限公司 Water cooling plant
TWI728768B (en) * 2020-03-31 2021-05-21 建準電機工業股份有限公司 Thin pump
CN114578933A (en) * 2022-03-02 2022-06-03 东莞市鸿盈电子科技有限公司 Integrated ultra-thin water-cooling radiator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7472743B2 (en) 2005-05-07 2009-01-06 Foxconn Technology Co., Ltd. Liquid cooling system suitable for removing heat from electronic components
CN107436652A (en) * 2016-05-25 2017-12-05 奇鋐科技股份有限公司 Water cooling plant
TWI728768B (en) * 2020-03-31 2021-05-21 建準電機工業股份有限公司 Thin pump
CN114578933A (en) * 2022-03-02 2022-06-03 东莞市鸿盈电子科技有限公司 Integrated ultra-thin water-cooling radiator
CN114578933B (en) * 2022-03-02 2024-03-19 东莞市鸿盈电子科技有限公司 Integrated ultrathin water-cooling radiator

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