TW543922U - Ultra-thin type semiconductor device package structure - Google Patents
Ultra-thin type semiconductor device package structureInfo
- Publication number
- TW543922U TW543922U TW91216013U TW91216013U TW543922U TW 543922 U TW543922 U TW 543922U TW 91216013 U TW91216013 U TW 91216013U TW 91216013 U TW91216013 U TW 91216013U TW 543922 U TW543922 U TW 543922U
- Authority
- TW
- Taiwan
- Prior art keywords
- ultra
- semiconductor device
- type semiconductor
- package structure
- device package
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91216013U TW543922U (en) | 2002-10-09 | 2002-10-09 | Ultra-thin type semiconductor device package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW91216013U TW543922U (en) | 2002-10-09 | 2002-10-09 | Ultra-thin type semiconductor device package structure |
Publications (1)
Publication Number | Publication Date |
---|---|
TW543922U true TW543922U (en) | 2003-07-21 |
Family
ID=29708934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91216013U TW543922U (en) | 2002-10-09 | 2002-10-09 | Ultra-thin type semiconductor device package structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW543922U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113793810A (en) * | 2021-09-22 | 2021-12-14 | 宁波港波电子有限公司 | Chip glue overflow prevention packaging method and packaging structure |
CN113809037A (en) * | 2021-09-22 | 2021-12-17 | 宁波港波电子有限公司 | Chip packaging structure |
CN114023716A (en) * | 2021-11-16 | 2022-02-08 | 宁波港波电子有限公司 | Lead frame, manufacturing method and chip using lead frame |
-
2002
- 2002-10-09 TW TW91216013U patent/TW543922U/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113793810A (en) * | 2021-09-22 | 2021-12-14 | 宁波港波电子有限公司 | Chip glue overflow prevention packaging method and packaging structure |
CN113809037A (en) * | 2021-09-22 | 2021-12-17 | 宁波港波电子有限公司 | Chip packaging structure |
CN114023716A (en) * | 2021-11-16 | 2022-02-08 | 宁波港波电子有限公司 | Lead frame, manufacturing method and chip using lead frame |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |