TW535486B

TW535486B - An active heat exchanger with built-in pump and flexible coolant conduits

Info

Publication number: TW535486B
Application number: TW90105242A
Authority: TW
Inventors: Chia-Yuan Chang; Pei-Jen Wang; Tsung-Shuen Chin
Original assignee: Chin Tsung Shune
Priority date: 2001-03-05
Filing date: 2001-03-05
Publication date: 2003-06-01

Abstract

The present invention discloses a cooling system consisting of an active heat exchanger with built-in pump(s) and flexible coolant conduits. The active heat exchanger consists of at least one fluid pump inside or just outside of the cold-end of the heat-exchanger main-body to pump the already cooled coolant to the far end heat source(s) typically the electronic device(s) to be cooled through a coolant conduits those are flexible. The specific coolant is chosen from a group of high thermal conductivity, high specific-heat liquids chosen from a group consisting of non-corrosive aqueous or non-aqueous solutions and/or suspensions. This cooling system is characteristic of the active heat-exchanger that pumps the cooled coolant, very high efficiency, capable of easy adaptation, through the flexible coolant conduits, to cool a wide variety of electronic devices such as CPU of computers, power transistors, ultra-large-scale-integrated (ULSI) circuits and their packaging, and ease of extending into multi-channel and/or multi-pump cooling.

Description

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〔發明背景〕本發明主要係以外加電义刀L驅動磁潘發熱源進行冷卻。主要係針對新一、表内之冷卻液以對中央處理器（CPU)、功率電晶體、代古個人電腦或工作站之 (I C )、微機電系統内部電子零曰曰件、焉功率積體電路片模組（Multi-Chip - Module 孓積體電路及多晶冷卻。 ’ MCM)構裳等電子裝置進行〔先前與習知技術說明裝置利用產生熱。密度逐漸有中央處組構裝等須提供足作溫度範 0 . 2微米：組空間内之冷卻效頻率約在，傳統使，或使用電子量損失而部之電流裝置包含多晶片模損壞，必允許之工米（小於同一個模需要更大理器工作過5 0瓦特理器上方電能而運作，@時在運作過程中，因能隨著電子裝置日漸微型&，流經裝置内增f ’因此發熱量逐漸提高。此類電子理器、功率電晶體、高功率積體電路及相關零組件，為避免此類裝置因過熱而夠之冷卻方式，以使得此類裝置維持於圍内。相較於以往的製程，現今之次微 >製造技術逐漸將更多的電晶體製作於，導致相關電路組件產生更多熱量，故率。舉例而言，新一代之超快速中央處 1 0 9赫茲（GHz)以上，所需之冷卻功率超用自然對流、電風扇直接安裝於中央處熱管（H e a t P i p e )冷卻技術已無法達到[Background of the Invention] The present invention is mainly based on the fact that an external electric knife L drives a magnetic pan heating source for cooling. Mainly for the new one, the cooling liquid in the table to the central processing unit (CPU), power transistors, Daigu personal computers or workstations (IC), the internal electronic components of the micro-electromechanical system, and the power integrated circuit Chip modules (Multi-Chip-Module integrated circuits and polycrystalline cooling. 'MCM') and other electronic devices to perform [previous and conventional technical description of the device to generate heat. The density gradually has to be provided at the center of the component structure, etc., which must provide a sufficient operating temperature range of 0.2 micron: the cooling efficiency frequency in the group space is about, traditionally, or the use of electronic quantity loss and the internal current device contains multi-chip mode damage, must Allowable working meters (less than the same module requires a larger processor to work with 50 watts of power above the processor to operate. @ 时 During the operation, as the electronic device becomes smaller & it flows through the device to increase f ' As a result, the amount of heat is gradually increasing. Such electronic controllers, power transistors, high-power integrated circuits and related components are in order to prevent such devices from being cooled due to overheating, so that such devices are maintained within the enclosure. Phase Compared with the previous process, today's micro-> manufacturing technology gradually makes more transistors, which causes the related circuit components to generate more heat, so the rate. For example, the new generation of ultra-fast central center Above Hertz (GHz), the required cooling power is beyond the natural convection, and the electric fan is directly installed in the central heat pipe cooling technology.

第6頁 535486 五、發明說明（2) 所需之冷卻功率。一般而言，冷卻電子裝置的散熱器可分為被動式與主動式兩種，通常主動式散熱器需要外加能量方能進行冷卻動作，例如，外加電能驅動泵以推動冷卻液，藉由冷卻液在管路中流動帶走電子裝置所產生之熱。相反地，被動式散熱器無需外加能量即可進行冷卻動作，例如，使用高導熱性材料製成之散熱片直接接觸於待冷卻之物體，此類高導熱性材料包含銅、銀、甚至如果成本許可的話使用熱解石磨、鑽石膜材料等。常見之被動式散熱器為散熱鰭片或者披覆於電路板上的散熱層，此類型的專利之一例，如有美國專利號碼 5，9 3 3，3 2 4所揭示，然而，冷卻量有其限制是此類型散熱器之缺點。另一種被廣泛使用的被動式散熱器為熱管（Heat P i pe )，其原理在於内部結構為封閉型管路，管壁係由多孔性材質構成，稱之為芯體，因此低表面張力之流體可藉由毛細現象（C a p i 1 1 a r i t y )迅速浸入芯體中，但並不佔滿整個封閉管路。當熱管的某一端被加熱，則此受熱端内部原吸附於蕊體的液體將因吸熱而蒸發，因此從管壁上吸收蒸發熱，蒸發後的氣體會往熱管中心移動而竄往外部冷端，逐漸冷卻回液態，再被蕊體西收回到熱端，如此往復Page 6 535486 V. Description of the invention (2) Cooling power required. Generally speaking, radiators for cooling electronic devices can be divided into two types: passive and active. Generally, active radiators require external energy to perform the cooling action. For example, external power is used to drive the pump to promote the cooling liquid. The flow in the pipe takes away the heat generated by the electronics. In contrast, passive radiators can be cooled without external energy. For example, heat sinks made of highly thermally conductive materials directly contact the object to be cooled. Such highly thermally conductive materials include copper, silver, and even if the cost permits. If so, use pyrolytic stone mill, diamond film material, etc. Common passive heat sinks are heat sink fins or heat sinks coated on circuit boards. One example of this type of patent is disclosed in US Patent Nos. 5,9 3 3, 3 2 4. However, the cooling capacity varies. The limitation is the disadvantage of this type of heat sink. Another widely used passive radiator is the heat pipe (Heat Pi). Its principle is that the internal structure is a closed pipe. The pipe wall is made of a porous material called a core. Therefore, it has a low surface tension fluid. Capillary (C api 1 1 arity) can be quickly immersed in the core, but does not fill the entire closed pipeline. When one end of the heat pipe is heated, the liquid originally adsorbed on the core inside the heated end will evaporate due to heat absorption, so the evaporation heat is absorbed from the pipe wall, and the evaporated gas will move to the center of the heat pipe and channel to the cold end outside. , Gradually cooled back to the liquid, and then retracted to the hot end by the core body, so back and forth

第7頁 535486Page 7 535486

而形成一個循環，每一次循環所帶走的熱量即為該液體蒸發所需之潛熱（L a te n t H e a t )。此類專利有很多，舉例而言’美國專利號碼6, 0 5 6, 044乃針對上述熱管進行改良，其係利用微加工技術製作芯體結構以增加冷卻量。另一種被動式散熱器係使用熱虹吸管，此褒置係利用傳熱流體（Heat Transfer Fluid)的密度改變' 進而驅動流體於管路中循環，此類型之應用例有美國專利號碼5， 1 8 3，1 0 4所發表之閉環衝擊式冷卻裝置，使用於半導體晶片之冷卻。此專利不使用外部移動磁場，而利用流體管件丨蒙内的虹吸現象來推動傳熱流體。；目前雖然被動式冷卻方法有其重要應用，但是立冷卻功率將無法滿足下一代高發熱量之電子產品（例如5>〇瓦或上百瓦）’且製造成本亦將大幅提高。相對而言，主動式冷卻器可達到較大之冷卻功率，此類型之冷卻器主要有兩種形式，一為熱電式冷卻（Thermo —electric C()Qling)，另一為泵驅動式。後者係利用機械或非機械泵推動冷卻液達到冷卻成效。有關熱電式冷卻裝置如美國專利號碼 6,094,91 9所述，十分細密而簡易，然而，目前的白第耳裝置（Peltier Devices)效率低且成本過高，不適用於低價位電子產品之冷卻° 許多主動式冷卻系統係使用外加電能與磁能來推動〆A cycle is formed, and the heat taken away by each cycle is the latent heat (L a te n t H e a t) required for the evaporation of the liquid. There are many such patents. For example, 'U.S. Patent No. 6, 0 5, 6, 044 is an improvement on the above-mentioned heat pipe, which uses micro-machining technology to make the core structure to increase the cooling capacity. Another type of passive radiator uses a thermosiphon. This arrangement uses the density change of the Heat Transfer Fluid to drive the fluid to circulate in the pipeline. An example of this type of application is US Patent No. 5, 1 8 3 The closed-loop impact cooling device published in 2004 was used for cooling semiconductor wafers. This patent does not use an external moving magnetic field, but uses the siphon phenomenon inside the fluid pipe to promote the heat transfer fluid. ; Although the passive cooling method has its important applications, the cooling power will not be able to meet the next generation of high-heat-generation electronic products (such as 5 > 0 watts or hundreds of watts) 'and the manufacturing cost will also increase significantly. Relatively speaking, active coolers can achieve larger cooling power. There are two main types of coolers of this type, one is thermoelectric cooling (Thermo-electric C () Qling), and the other is pump-driven. The latter uses mechanical or non-mechanical pumps to push the coolant to achieve cooling results. The related thermoelectric cooling device is described in US Patent No. 6,094,91 9, which is very compact and simple. However, the current Peltier Devices are inefficient and costly, and are not suitable for the cooling of low-priced electronic products. ° Many active cooling systems use external electrical and magnetic energy to drive 〆

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，採用機械泵 5，7 3 1，9 5 4及丨，0 1 9，1 6 5所發主動式散熱板冷卻糸統，以冷卻系統需要產生成本過高能轉換所衍生對此項缺點，用外加線圈環合，轉子組件，以此取代原專利形式，可配件特別是轴佔空間過大、作為推力表之專利取代傳統數個馬達之缺點。之可靠度美國專利繞於熱管可完全密先密封式歸納其共與軸承造耗能高，卻液進行循環冷卻，在此類系統中源的專利很多，例如美國專利號石馬 6, 0 2 9, 724，另外，美國專利號碼（形式，是一種可將傳熱流體併入於 (spreader plate geometry)中之的被動式散熱板。由於此種類型< 以分別推動傳熱流體及空氣，因此同時，其利用密封式穿轴進行機械問題，亦使用者極度關切之處。針號碼6，0 2 9，7 4 2與6，0 9 4，9 1 9提出採四周以產生轉動磁場，經由磁力轉封於熱管内，受外部轉動磁場驅動穿軸之使用。然而，綜合這數些種通缺點包括：零組件成本過高、管成的可靠度問題，而且整組系統所還可能產生噪音的缺點。磁流栗簡稱MHD係利用羅倫茲力（L〇rentz F〇rc 為推動流體之動力，主要係將外加直流電通過在靜磁場= 的導電液體，&中，直流電、磁場與液體流動方向正交。經由電流與磁場交互作用後，可產生一與液體、土 = 方向平行之羅倫。此種磁流泵對導電液體的：已廣為人知，自西元1 9 65年發行迄今之西文期刊又果 ” Magnetohydrodynamics’，内迭有許多理論計算及實驗結, Using mechanical pumps 5, 7 3 1, 9 5 4 and 丨, 0 1 9, 1 6 5 issued by the active cooling plate cooling system, in order to cool the system needs to generate high cost energy conversion derived from this shortcoming, using With the addition of a coiled ring and a rotor assembly, this replaces the original patent form, and the accessories, especially the shaft, occupy too much space, and the patent as a thrust meter replaces the disadvantages of traditional motors. The reliability of the U.S. patent around the heat pipe can be completely sealed and sealed first. The common bearing has high energy consumption, but the liquid is circulated for cooling. There are many patents in such systems, such as U.S. Patent No. Shima 6, 0 2 9, 724, In addition, the U.S. patent number (in the form of a passive heat sink that incorporates heat transfer fluid into (spreader plate geometry). Since this type < promotes the heat transfer fluid and air respectively, At the same time, it uses a sealed shaft to perform mechanical problems, which is also extremely concerned by the user. Needle numbers 6, 0 2 9, 7 4 2 and 6, 0 9 4, 9 1 9 propose to pick around to generate a rotating magnetic field. The magnetic force is sealed in the heat pipe, and the shaft is driven by the external rotating magnetic field. However, these common shortcomings include: the high cost of components, the reliability of the tube formation, and the entire system may generate noise. The shortcomings of magnetic current pumps are referred to as MHD, which uses Lorentz force (Lorrentz F〇rc to promote fluid power, mainly by applying an external direct current through a conductive liquid in a static magnetic field =, & The magnetic field and the direction of liquid flow are orthogonal. After the interaction between the current and the magnetic field, a Loren that is parallel to the direction of the liquid and the soil can be produced. This type of magnetic current pump is widely known for conductive liquids: it has been widely known since 1965 To date, Western journals have achieved "Magnetohydrodynamics'" with many theoretical calculations and experimental results.

535486 五、發明說明（5) 果之刊載’並已經由此發展出諸如磁流致動器等應用。以下效舉一例說明，V. A · G ο 1 〇 d n y a k於1 9 7 7年第1 3期，頁數 219-225，發表一篇名為”An Experimental Study 〇f An MHD DC Pumpn。在專利方面，Philip Barkan早於 1973 年首次發表MHD冷卻使用於整流系統之可行性研究，其美國專利號碼為3, 8 1 2, 404，發明要旨係使用電磁鐵作為磁力來源。Jr. Wiech於1 984年發表應用磁流泵於1C零件冷卻之研究’其美國專利號碼為4, 5丨9, 477，其係針對直^ 電與靜磁場交互作用以推動導電液體而冷卻陶瓷基板。另有美國專利5，763，95 1提出一種以非機械式之磁流泵作為動力源’推動導電液體於内建於電路板内之微米尺寸管路’以進行相關零組件之冷卻。綜合上述三種專利，其主要缺點在於磁流泵被完全固定於待冷卻之元件、組件或熱分散塊（heat spreader)上面或其周圍，無法因應系統多樣化而產生適當應對；此外，其磁流泵並未設計或其設計並非最佳形式。〃叹〔本案發明綜合概述〕本專利提出一種内建磁流泵之熱交換器，磁流栗產生推力以推動冷卻液流動於毫米化丨丨卜…忟:^尺寸之内部管路’採模組化形式可外接於任意之電子零件、構裝組件^ 系統，藉由具撓性之管路連結熱交換器與電子零件，本專利可同時冷卻多組不同位置的電子零件，亦可串連多組磁535486 V. Description of the invention (5) Publication of the result ’and has developed applications such as magnetic current actuators. The following is an example to illustrate, V. A · G ο 1 〇dnyak, Issue 13 of 1977, pages 219-225, published an article entitled "An Experimental Study 〇f An MHD DC Pumpn. In the patent On the other hand, Philip Barkan first published the feasibility study of MHD cooling used in rectifier systems as early as 1973. Its US patent number is 3, 8 1 2, 404. The main idea of the invention is to use electromagnets as the source of magnetic force. Jr. Wiech in 1 984 Published a research on the application of magnetic current pumps in 1C parts cooling in the year of 'U.S. Patent No. 4, 5 丨 9, 477, which is based on the interaction of direct electric and static magnetic fields to promote conductive liquids to cool ceramic substrates. Another U.S. patent 5,763,95 1 proposes a non-mechanical magnetic current pump as a power source to 'push conductive liquid in micron-sized pipelines built in circuit boards' for cooling related components. Based on the above three patents, The main disadvantage is that the magnetic current pump is completely fixed on or around the component, component or heat spreader to be cooled, and cannot respond appropriately to the diversification of the system. In addition, its magnetic current pump is not Design or its design is not the best form. Sigh [Comprehensive Overview of the Invention of the Case] This patent proposes a heat exchanger with a built-in magnetic current pump. The magnetic current pump generates thrust to push the coolant to flow in millimeters. ^ The internal pipeline of size 'adopts a modular form and can be connected to any electronic parts and components. ^ The system connects the heat exchanger and electronic parts with flexible pipelines. This patent can cool multiple groups at the same time. Position electronic parts, can also connect multiple sets of magnetic

535486 五、發明說明（6) 流泵達到更大之推力，或並聯多組磁流泵以推動更多流量之冷卻流媒。此外，本專利之磁流泵有特定的磁路、採用的導電冷卻液係經設計的特殊冷卻液；尺寸、位置等均經過最佳化設計，能夠以極低能量之消耗達到超過5 0瓦特之冷卻功率，相關計算細節，如以下專利實施案例所述。種内建磁流以靜磁場與選自非腐蝕、或低熔點制流媒在具冷卻作用者向流動時，由於流體流此感應電流羅倫兹力F: 行，因此可可加強感應本專利提出一中，磁流泵是一種電流體控制閥，以基或非水基懸浮液作為冷卻流媒，控鰭片或裝置以達到導電流體沿水平方方向均互相正交，電流於流體内部，行，由電磁理論的與流體流動方向平動，而外加直流電泵之主動式熱交換器，其外加直流電方法所形成之導性高導電水溶液、高導電水液態金屬等導電性流體之一撓性流媒管道流動進入散熱。其控制原理主要如下：若此方向與磁場、外加直流電動切割磁力線，因此感應出方向與外加直流電方向平 =J X B，可得到電磁力方向推動或抑制導電流體之流之羅倫茲力的強度。本主動式熱交換器可適用之導電性冷卻流媒選自下列之 1.非腐蝕性高導電水溶液，係選自包含無機強電解質如鹼金屬矽酸鹽、含有硫酸根、硝酸根、氯氧根等的無 111 I mil 圓ΒΙ_ I _1臓_画11_11 第11頁 535486 五、發明說明（7) 機鹽類之一者。 2·高導電非水溶液，係選自高導電的有機電解質，導電性塑膠溶液，或無機電解質溶解於有機溶劑之一者。 3 ·冋導電水基或非水基懸浮液，係選自微米（1 〇 — 6米）或奈米（1 0 - 9米）級導電顆粒分散、懸浮於水基或非水基溶液’所成之高導電性懸浮液者。其中，微米或奈米級導電顆粒可以為：（丨）金屬，例如銅、銀、金、欽、辞、錫、鐵、鎳，貴金屬、或其合金者；（2)石黑顆粒；（3)導電高分子；或其組合者。土金V二 Γ4晶)鎵點 2°.5°c)、共晶共晶鎵銀合金（炫％ )、八日曰鎵鋁合金（熔點26t )、 °C )、或是共晶鎵锯C )、共晶鎵錫鋅合金（炫點1 7 叙锡鋅鋁合金（熔點丨9〇c )。就專利中所兩—人的量，在成本許;^冷卻流媒而言，只需約1至5毫升（ml、然鉀納合金的炫：：:兄下，，類合金較能夠符合所Π 燒危險。在考慮此㊁:下但：：旦發线漏情形將產生燃鋅等表面塗層處理，祐甘利，整體外部經鋁、錫^ 散熱面積，並能豹W使八粗化或高孔隙化，不僅τ描3 問題產生。：夠：收…漏之卸納“，SI:進卻流媒。因為環保因素，不考慮使用535486 V. Description of the invention (6) The flow pump reaches a greater thrust, or multiple sets of magnetic current pumps are connected in parallel to promote more flow of cooling fluid. In addition, the magnetic current pump of this patent has a specific magnetic circuit, and the conductive coolant used is a specially designed special coolant; the size and position are optimized to achieve more than 50 watts with extremely low energy consumption. The cooling power and related calculation details are described in the following patent implementation examples. This built-in magnetic current uses a static magnetic field and a medium selected from non-corrosive or low-melting point flow medium. When the cooling effect flows, the induced current Lorentz force F: of the fluid flow, so the induction can be enhanced by this patent. In one, the magnetic current pump is a kind of current body control valve. It uses a base or non-aqueous suspension as the cooling flow medium, and controls the fins or devices to achieve that the conductive fluids are orthogonal to each other in the horizontal direction. The current is inside the fluid. The electromagnetic theory is used to translate in parallel with the direction of fluid flow, and an active heat exchanger with a direct current pump, which is a flexible flow of one of conductive fluids, such as a conductive highly conductive aqueous solution and a highly conductive water liquid metal, formed by a direct current method. The medium pipe flows into the heat sink. The control principle is mainly as follows: If this direction and the magnetic field, plus the DC electric force cut the magnetic field lines, the induced direction is equal to the direction of the applied DC electric current = J X B, and the strength of the Lorentz force that pushes or suppresses the flow of the conductive fluid in the direction of the electromagnetic force can be obtained. The conductive cooling fluid suitable for this active heat exchanger is selected from the following: 1. Non-corrosive highly conductive aqueous solution, selected from the group consisting of inorganic strong electrolytes such as alkali metal silicates, sulfates, nitrates, and oxygen Roots and other 111 I mil circles ΒΙ_ I _1 臓 _ 画 11_11 Page 11 535486 V. Description of the invention (7) One of organic salts. 2. Highly conductive non-aqueous solution, which is selected from highly conductive organic electrolytes, conductive plastic solutions, or inorganic electrolytes dissolved in one of the organic solvents. 3, 冋 conductive water-based or non-aqueous suspension, selected from micron (10-6 meters) or nanometer (10-9 meters) grade conductive particles dispersed, suspended in water-based or non-aqueous solution Into a highly conductive suspension. Among them, the micron or nano-scale conductive particles can be: (丨) metal, such as copper, silver, gold, copper, tin, iron, nickel, precious metals, or alloys thereof; (2) stone black particles; (3) ) Conductive polymer; or a combination thereof. Earth gold V2Γ4 crystal) gallium point 2 ° .5 ° c), eutectic eutectic gallium silver alloy (hyun%), eight-day gallium aluminum alloy (melting point 26t), ° C), or eutectic gallium saw C), eutectic gallium tin-zinc alloy (dazzle point 17 stannous tin-zinc aluminum alloy (melting point 丨 9c). As far as the amount of two people in the patent is concerned, the cost may be low; ^ for cooling fluid media, only About 1 to 5 milliliters (ml, of potassium and nano-alloys ::: brother, the alloy is more able to meet the danger of burning. In consideration of this :: br> :: once the line leakage situation will produce zinc, etc. Surface coating treatment, Youganli, the whole external area is cooled by aluminum and tin ^, and it can make the roughening or high porosity of the surface, not only τ and 3 problems .: Enough: accept ... leakage, "SI : Into the media. Because of environmental factors, do not consider using

第12頁 535486 五、發明說明（8) 具撓性流媒管道使本發明的主動式冷卻器，利於將深層或不易直接裝設風冷鰭片部位的熱產生元件之熱引導出來。其材質可以是耐熱高分子、耐熱橡膠、耐熱複合材料或具可撓性之金屬管等。對於熱交換器内部之冷卻流媒管道組的材料，可以選自鋁、銅、鎂或其合金，其内壁經表面處理產生陶瓷塗層，以抵抗液態冷卻液，特別是抵抗液態金屬之侵蝕，可選用之表面陶甍塗層包含有氧化物（例如氧化铭、氧化矽、氧化鎂）、氮化物（例如氮化鋁、氮化鈦、氮化矽）等。有關本專利之磁流泵磁路計算、内流管道之尺寸、及冷卻功率等細節計算如以下專利實施案例所述。〔實施案例與計算分析〕圖一為本案之一種較佳實施例，其中主動式熱交換冷卻裝置10是用於發散熱產生元件11之功率，該裝置包含下列組件：熱擴散塊1 7，1 8 ;内流管道組1 3 ;散熱鰭片1 4 ; 磁流泵1 5 ;流道外殼1 2及散熱器端蓋1 6。而該内流管道組内部將設置曲線表面以提高散熱面積者，類似之多層化設計亦為熟知此項技藝者所習知之技術。此裝置中之磁流泵 1 5將注滿液態金屬之流體，以置於冷卻側之抽取方式，循Page 12 535486 V. Description of the invention (8) The flexible cooler pipeline makes the active cooler of the present invention beneficial for directing the heat of the heat generating element deep or difficult to directly install the air-cooled fins. The material can be heat-resistant polymer, heat-resistant rubber, heat-resistant composite material, or flexible metal pipe. For the material of the cooling fluid pipe group inside the heat exchanger, it can be selected from aluminum, copper, magnesium or its alloy. The inner wall is surface-treated to produce a ceramic coating to resist the liquid cooling liquid, especially the erosion of liquid metal. The optional surface ceramic coatings include oxides (such as oxide oxide, silicon oxide, magnesium oxide), nitrides (such as aluminum nitride, titanium nitride, silicon nitride), and so on. The calculation of the magnetic circuit of the magnetic current pump, the size of the internal flow pipe, and the cooling power of the patent are detailed as described in the following patent implementation examples. [Implementation case and calculation analysis] FIG. 1 is a preferred embodiment of the present case, in which the active heat exchange cooling device 10 is used for generating power of the heat radiation generating element 11, and the device includes the following components: a heat diffusion block 1 7, 1 8; inner flow pipe group 13; heat dissipation fins 14; magnetic current pump 15; flow channel housing 12 and radiator end cover 16; In addition, a curved surface will be provided inside the inflow pipeline group to increase the heat dissipation area. Similar multi-layer design is also a technique familiar to those skilled in the art. The magnetic current pump 15 in this device will fill the fluid filled with liquid metal,

第13頁 535486 五、發明說明環冷流媒片14者。至空氣中其中之永管道因接式做防蝕之接觸面熱擴散塊二簡易表單元之大 (9) 經熱產生元件11及内流管道1 3使熱發散於散熱鰭此時之散熱鰭片可以自然或強制對流之方式傳熱，而磁流泵亦可因冷流媒已冷卻而不會導致損壞磁元件者。而由圖一之A-A及B-B截面圖中，内流觸液態金屬將導致腐蝕，故應以特殊表面處理方之塗層處理。而熱產生元件1 1與熱交換冷卻裝置，因考慮提高熱慣性及降低熱導阻抗，故可施用 1 7，1 8以增強效果。而圖一之截面側視圖可以圖達之，其中之熱產生元件11可為電腦之中央處理量發熱元件。而本案之另一較佳實施例則表示於圖三，其中可使用複數組熱產生元件111，11 2，11 3，另行使用複數組之磁流泵1 5 1，1 5 2及散熱器，並將複數組之内流管道組3 1，3 2行分流之狀況，而以達成複數組之主動式熱交換冷卻裝置者。圖四則為本案之另一種較佳實施例，其中兩組之磁流泵及熱交換器以加大體積方式串聯，並提高整體散熱效果為實施例之一。圖五為本案採用撓性管路之實施例，其中，複數組之熱產生元件、磁流泵及散熱器皆與圖三之實施例相同，不同之處在於新增具有撓性之内流管道組3 3，除可依照熱產生元件之位置不同而進行冷卻管路之配置，更可以將冷卻管路延伸至遠離熱產生元件之處，進而利用其他冷卻形式Page 13 535486 V. Description of the invention Circulating cold flow media 14 of them. The permanent pipe in the air is connected to the anti-corrosion contact surface of the thermal diffusion block. The size of the simple table unit is large (9) The heat generating element 11 and the internal flow pipe 1 3 dissipate the heat to the heat dissipation fins. It can transfer heat by natural or forced convection, and the magnetic current pump can also cool the magnetic components without causing damage to the magnetic components. From the A-A and B-B cross-sectional views in Figure 1, internal contact with liquid metal will cause corrosion, so it should be treated with a special surface treatment. The heat-generating element 11 and the heat-exchange cooling device may increase the thermal inertia and reduce the thermal resistance, so it can be applied with 17, 18 to enhance the effect. The cross-sectional side view of FIG. 1 can be used to illustrate this. The heat generating element 11 can be a central processing heat generating element of a computer. Another preferred embodiment of this case is shown in FIG. 3, in which a plurality of heat generating elements 111, 11 2, 11 3 can be used, and a magnetic current pump 1 5 1, 1 2 2 and a radiator of a plurality of heat sinks can be used separately. In addition, the internal flow pipeline group 3, 1, 2 of the complex array is divided, and the active heat exchange cooling device of the complex array is achieved. Fig. 4 shows another preferred embodiment of the present invention, in which two sets of magnetic current pumps and heat exchangers are connected in series by increasing the volume, and the overall heat dissipation effect is one of the embodiments. Fig. 5 is an embodiment of the present invention using a flexible pipeline, in which the heat generating element, the magnetic current pump and the radiator of the complex array are the same as those in the embodiment of Fig. 3, except that a flexible inner flow pipe is newly added. Group 3 3, in addition to the configuration of the cooling pipe according to the location of the heat generating element, it can also extend the cooling pipe away from the heat generating element, and then use other cooling forms

第14頁、發明說明（10) _ 強冷卻效果（如散熱片1 42、狀可依需要作適當變化， I扇36)，同時内流管道之中，接縫3 7係為液密接 ϋ圖由圓形管變換為扁平狀， (如銘、銅）、高分子（如而繞性管路之材質可為金屬家件34係說明如果有1 亞^酿胺Polyimide)或橡膠等。貼壁連接，此時：挽零件阻撞流道，使其無。 < s路即可以懸空配置或繞行五加形其零法之實用體推力產產生羅侖圖，其中永久磁石以外殼形通設直流羅侖茲力例為設計電流值以羅舍兹力之：之磁流果均以羅侖益a γ 、、隹时錄力（Lorentz Force)為流 — 源者’由外加電流與預置之磁場交互作用，茲力者j圖六為本案所採用之磁流泵基本級成預置之永久磁石54, 55是由稀土元素組成之強力 ’、並以平行串接磁場方式設置，其中導磁迴路θ 成磁路者。此時於平行磁場兩側設置電極板，$ 電源以產生正交於磁場内之導電流體上電流，則將推動流一體朝向第三正交方向流動；本案之實施一具0 · 5毫米高及1 〇毫米寬之狹口，並控制直漭也產生流體推力為一計算分析實例。 < (Lorentz Force)是一下列之基本物理式計算 = (T(五 + w X jS) F = JxB = aBE (jV/w3)Page 14 、 Explanation of the invention (10) _ Strong cooling effect (such as the heat sink 1 42, the shape can be changed as needed, I fan 36), and in the internal flow pipe, the joints 37 and 7 are liquid-tight joints. Transformed from a round tube to a flat shape (such as Ming, copper), high polymer (such as the material of the winding pipe can be metal parts 34 series, if there is 1 polyamine amine Polyimide) or rubber. Adhere to the wall, at this time: pull the part to block the flow channel, make it no. < The s road can be used in a floating configuration or bypass the five-plus-shaped zero-practice thrust to generate a Lorentz diagram, in which a permanent magnet is provided with a DC Lorentz force in the shape of a shell. No .: The currents of the magnetic currents are all based on Luo Lunyi a γ and Lorentz Force—the source 'interacts with the pre-set magnetic field by the applied current. The force used in this case is shown in Figure 6. The basic level of the flow pump is the preset permanent magnets 54 and 55, which are composed of rare earth elements. They are arranged in parallel magnetic fields, and the magnetically conductive circuit θ forms a magnetic circuit. At this time, electrode plates are arranged on both sides of the parallel magnetic field, and the power source generates current on the conductive fluid orthogonal to the magnetic field, which will push the flow into the third orthogonal direction as a whole; the implementation of this case has a height of 0.5 mm and A 10 mm wide slit, and the control mullion also generates fluid thrust as a calculation analysis example. < (Lorentz Force) is the following basic physical formula calculation = (T (Five + w X jS) F = JxB = aBE (jV / w3)

535486 五、發明說明（π) 其中J是電流密度；B是磁場密度；σ是流體電導係數。此時因流速很低而忽略流速所產生之感應電流。若將此羅侖茲力轉換為流體所受之壓力梯度，則可計算於此條件所對應之體積流率如下列： Q = jud-dy=z^ 其中a，d，L是管道寬此時若此體積流率用率可表示如下：高、及長度；//是流體黏滯係數。來輪送含熱量之流體，則其熱輸送功535486 V. Description of the invention (π) where J is the current density; B is the magnetic field density; σ is the fluid conductivity coefficient. At this time, the induced current generated by the flow rate is ignored because the flow rate is very low. If this Lorentz force is converted into the pressure gradient to which the fluid is subjected, the volume flow rate corresponding to this condition can be calculated as follows: Q = jud-dy = z ^ where a, d, and L are the width of the pipeline at this time If this volume flow rate is used, it can be expressed as follows: high, and length; // is the fluid viscosity coefficient. To transport fluids containing heat, its heat transfer work

Wc〇〇^^Cp.Q.p.AT 其中Cp是流體比熱差。 P是流體密度；而△ τ是散熱後之溫圖七是本案中磁户Wc〇 ^^ Cp.Q.p.AT where Cp is the specific heat difference of the fluid. P is the fluid density; △ τ is the temperature after heat dissipation Figure 7 is the magnetic household in this case

用一對永久磁石641來捷之較佳實施例之一，此泵中僅, 磁路結構體6 7 1，而—料=磁％，並以軟磁性材料形成C 電流，此時將使用一雷\電極651則用以提供可控制之直之絕緣用。圖八是本宏=絕緣膜661提供電極與軟磁材剩中僅使用兩對永久磁;t磁流泵之另一較佳實施例’此 741來建立串聯磁路之反向磁場，One of the preferred embodiments is to use a pair of permanent magnets 641. In this pump, only the magnetic circuit structure 6 71 is used, and the material = magnetic%, and the C current is formed by a soft magnetic material. Lightning electrode 651 is used to provide controllable straight insulation. Figure 8 shows this macro = only two pairs of permanent magnets are used in the insulating film 661 to provide electrodes and soft magnetic material; another preferred embodiment of the t magnetic current pump '741 is used to establish the reverse magnetic field of the series magnetic circuit.

第16頁 535486 五、發明說明（12) 但因兩對電極7 3 1可用反向接續而形成推力串聯之泵體，則此泵將產生更大之推力，此時之軟磁材料7 7 1將可簡化成片狀之結構體。若將此磁流泵使用於流道長度為5 0厘米管道，根據前述公式計算得到如圖九之磁場強度分佈圖，此時磁路中之磁力線束分佈將如圖十所示，此時使用一對稀土族元素永久磁石。同前述之兩對永久磁石設計，將可得到如圖十一及圖十二之計算分析結果，而内流道中之磁場密度值約為丨· 8T° 若將熔媒，則圖十 -三中將流之，而相對溫差為攝氏關係如圖十考慮磁流泵失損耗於液中時，可發達到高功率點為攝一之分體體積應之流 6 0度時五所示之冷卻態金屬現本案之散熱氏3 0度之析案例將流率與直體壓差則，此時冷，總合成功率效率鎵上，故所用之磁功效。金屬鎵應用與本案之冷卻流可得到如下列之計算結果；圖流電流密度之影響關係表示表示於圖十四中；若假設冷卻卻功率與直流電流密度之影響如圖十六之三度空間圖示。若時，因輸入功率是以電阻熱損將其損失計算之並會於圖十七流泵應可以損耗不高之情形下綜上所述，本案以創新設計，完成含磁流果之主動式熱交換冷卻裝置發明，相較於習知技術或先前發明，本案Page 16 535486 V. Description of the invention (12) However, because the two pairs of electrodes 7 3 1 can be connected in reverse to form a pump body in series with thrust, the pump will generate greater thrust. At this time, the soft magnetic material 7 7 1 will Can be simplified into a sheet-like structure. If this magnetic current pump is used in a pipeline with a length of 50 cm, the magnetic field intensity distribution diagram shown in Figure 9 is calculated according to the foregoing formula. At this time, the distribution of the magnetic flux in the magnetic circuit will be shown in Figure 10. A pair of rare earth element permanent magnets. With the design of the two pairs of permanent magnets described above, the calculation and analysis results shown in Figure 11 and Figure 12 can be obtained, and the magnetic field density value in the inner flow channel is about 丨 · 8T °. Flow, and the relative temperature difference is the Celsius relationship. As shown in Fig. 10, when the loss of magnetic current pump is considered in the liquid, it can reach the high-power point as the split volume of the photo. The analysis case of the metal in this case is 30 degrees Celsius, and the flow rate and the straight body pressure difference are cold. At this time, the total synthetic power efficiency is gallium, so the magnetic efficiency is used. The application of metal gallium and the cooling flow in this case can get the following calculation results; the relationship between the current density of the graph is shown in Figure 14; if cooling is assumed, the effect of power and DC current density is shown in the three-dimensional space of Figure 16. Icon. If at that time, the input power is calculated based on the resistance heat loss and it will be calculated under the situation that the flow pump should be able to have low loss. In summary, this case uses an innovative design to complete the active type with magnetic current. The invention of heat exchange cooling device, compared with the conventional technology or the prior invention, this case

第17頁 535486 五、發明說明（13) 所用之結構及原理確可達到高功率之散熱功能，實已具發明專利要件，而本案之設計均以詳細分析計算驗證，實為高度技術創作，依專利法第十九及第二十條規定，誠望均局專利委貝儘速審定核准。Page 17 535486 V. Description of the invention (13) The structure and principle used can indeed achieve high-power heat dissipation function, which already has the elements of the invention patent. The design of this case is verified by detailed analysis and calculation, which is a highly technical creation. Articles 19 and 20 of the Patent Law stipulate that the Patent Commission of the Bureau of Bureaus is sincerely expected to review and approve as soon as possible.

第18頁 535486 圖式簡單說明〔圖示編號與說明〕圖一本專利的實施例之一圖二圖一的截面圖圖三多工冷卻的實施例之一圖四多重冷卻串聯的實施例之一圖五具撓性冷卻管路的實施例之一圖六磁流泵的實施例之一圖七單一磁流泵實施例的三視結構圖圖八二組磁流果實施例的三視結構圖圖九經計算得出之氣隙磁場密度分佈；使用一對永久磁石之設計方式例圖十經計算得出正視之磁力線束分佈；使用一對永久磁石及c型軛鐵之設計方式例圖十一經計算得出之氣隙磁場密度分佈；使用二對永久磁石之磁路串聯設計方式例圖十二經計算得出正視之磁力線束分佈；使用二對永久磁石及板型辄鐵之串聯設計方式例Page 18 535486 Brief description of the drawings [Figure numbering and description] Figure 1 One of the embodiments of the patent Figure 2 Sectional view of Figure 1 Figure 3 One embodiment of multiplex cooling Figure 4 Embodiment of multiple cooling series One of the five embodiments of the flexible cooling pipeline. One of the six embodiments of the magnetic current pump. The seven-view structure of the single magnetic current pump embodiment. The three-view of the eight-group magnetic current embodiment. Structure diagram Figure IX Air-gap magnetic field density distribution calculated; Example of a design method using a pair of permanent magnets Figure 10 Example of a magnetic beam harness distribution face-to-face calculated; Example of a design method using a pair of permanent magnets and c-shaped yoke Figure 11: Calculated air-gap magnetic field density distribution; Example of a series design of magnetic circuits using two pairs of permanent magnets Figure 12: Calculated frontal distribution of magnetic flux; Using two pairs of permanent magnets and plate-shaped iron Example of tandem design method

圖十三經計算之體積流率與外加電流密度關係；此時之流體為鎵金屬且磁場強度為0.8TFigure 13 Relationship between calculated volume flow rate and applied current density; at this time, the fluid is gallium metal and the magnetic field strength is 0.8T

圖十四經計算之流體壓差與外加電流密度關係；此時之流體為鎵金屬且磁場強度為0. 8TFigure 14 Relationship between calculated fluid pressure difference and applied current density; at this time, the fluid is gallium metal and the magnetic field strength is 0.8T

圖十五經計算之冷卻功率與外加電流密度關係；此時之流體為錄金屬且磁場強度為0.8TFigure 15 Relationship between calculated cooling power and applied current density; at this time, the fluid is metal recording and the magnetic field strength is 0.8T

第19頁 535486Page 19 535486

圖式簡單說明圖十六經計算之冷卻功率與外加電流密度及外加電流密度關係；此時之流體為鎵金屬且磁場強度為0 . 8T 圖十七經計算之冷卻功率與輸入消耗功率之關係；此時之流體為鎵金屬且磁場強度為0. 8T 〔符號元件對照說明〕 10 : 101 11， 12, 13 : 14, 15, 16： 17, 18 21 22 30 31 32 33 102 ：111， 112, 121 ： 113, 141 151 142 152 143, 153, 171， 172 熱交換冷卻裝置以磁流冷卻組件構成之模組 1 1 4 :待冷卻之電子零件流道外殼及組件内流管道 144 :散熱鰭片 154:磁流泵（MHD Pump) 散熱器端蓋熱擴散塊（Thermal Spreader) 熱擴散塊平行板式流道波浪式流道 « 多工冷卻之磁流泵及所構成之冷卻組件主流道第一分歧流道第二分歧流道（具撓性）The diagram briefly illustrates the relationship between the calculated cooling power, the applied current density, and the applied current density in Figure 16. The fluid at this time is gallium metal and the magnetic field strength is 0.8 T. Figure 17. The relationship between the calculated cooling power and the input power consumption ; At this time, the fluid is gallium metal and the magnetic field strength is 0.8T. , 121: 113, 141 151 142 152 143, 153, 171, 172 The heat exchange cooling device is a module composed of magnetic current cooling components 1 1 4: the flow channel housing of the electronic parts to be cooled and the internal flow channels of the components 144: heat dissipation fins Sheet 154: Magnetic Flow Pump (MHD Pump) Radiator End Cover Thermal Spreader Thermal Spreader Parallel Plate Flow Path Wave Flow Path «Multi-flow cooling magnetic flow pump and the main channel of cooling components Divided runner second branch runner (flexible)

第20頁 535486 圖式簡單說明 3 4 :非發熱性零件 3 5 :待冷卻之電子產品外殼 3 6 :風扇 3 7 :液密接縫 4 0 :多重冷卻串連之磁流泵及所構成之冷卻組件 4 1 :内部流道 4 2 :連接流道 5 0 :磁流泵本體結構圖 5 1 :導電性流道外壁 5 2 :内部流道 5 3 :導電電極 54:上置之扁平狀永久磁石 55:下置之扁平狀永久磁石 6 0 1 :單一磁流泵之三視結構 6 1 1 :非導磁性之流道外壁 6 2 1 :内部流道 6 3 1 :導電電極 6 4 1 :永久磁石 6 5 1 :接電線路 6 6 1 :絕緣墊 6 7 1 :導磁性材料Page 20 535486 Brief description of the drawing 3 4: Non-heating parts 3 5: The shell of the electronic product to be cooled 3 6: Fan 3 7: Liquid-tight joint 4 0: Multi-flow cooling series magnetic current pump and its components Cooling unit 4 1: Internal flow channel 4 2: Connection flow channel 50 0: Structure of magnetic current pump body 5 1: Conductive flow channel outer wall 5 2: Internal flow channel 5 3: Conductive electrode 54: Flat top permanent Magnet 55: flat permanent magnet 6 0 1 below: three-view structure of a single magnetic current pump 6 1 1: outer wall of non-magnetically conductive flow path 6 2 1: internal flow path 6 3 1: conductive electrode 6 4 1: Permanent magnet 6 5 1: Power line 6 6 1: Insulation pad 6 7 1: Magnetically conductive material

第21頁 535486Page 21 535486

第22頁圖式簡單說明 701 二組磁流泵之三視結構 711 非導磁性之流道外壁 721 内部流道 731 導電電極 741 永久磁石 751 接電線路 761 絕緣墊 771 軟磁材料Page 22 Brief description of drawings 701 Three-view structure of two sets of magnetic current pumps 711 Non-magnetically-conductive flow channel outer wall 721 Internal flow channel 731 Conductive electrode 741 Permanent magnet 751 Power line 761 Insulating pad 771 Soft magnetic material

Claims

〔申請專利範圍〕〜種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，除熱交換主體外，係具備有至少一組磁流泵安裝於冷流側出口附近，並將已冷卻之導電流體經密閉式管道，泵送給遠端之熱產生元件者；其主要構件特徵爲： α· —熱交換器主體； β· —散熱鰭片組，設置於熱交換器主體外； C. 一內流管道組，設置於熱交換器主體內；〇·至少一磁流泵組，設置於熱交換器主體冷流側出口附近者； Ε·至少一冷卻流媒管道組，其中至少有一部份具有撓性，液密地連接熱交換器主體到熱產生元件，並永久封著者； F. —具有高導電度的冷卻流媒，密封且塡滿於冷卻主體內。 2. 如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該熱交換器主體之材料是金屬、合金、導熱性陶瓷或導熱性高分子所組成。 3. 如申請專利範圍第2項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中構成該熱交換器主體材料之金屬或合金係選自鋁、鎂、銅，鋁合金、鎂合金、銅合金、鈦合金、鐵合金、鎳合金，經砂模鑄造、壓鑄、燒結、機械加工，或板片材經硬焊而成者。 4. 如申請專利範圍第2項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中構成該熱交換器主體材料之導熱性陶瓷係選自氧化鋁、氮化鋁、氮化矽、碳化矽、碳化鋁之一，經壓型、燒結，或粉末射出成型、燒結而得者。 5.如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中散熱鰭片組之製造方式爲預置式澆鑄、壓鑄、機械加工或是硬焊於熱交換器主體者。 6·如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中冷卻流媒管道組爲內面具有各式曲面，且貫穿熱交換主體內、最大體積佔有率者。 7.如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中之磁流泵是具有至少一對永久磁石，夾置於內流管道上下側，且以軟性磁鐵包裹成磁迴路，並在正交於磁場方向、且正交於流動方向，設置有相同對數之電極，提供正交於磁場方向之電流場者。 8·如申請專利範圍第7項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該磁流泵之較佳實施例是具有兩對或兩對以上之永久磁石，以磁場方向串聯設置，且以軟性磁鐵包裹成磁迴路，並夾置於內流管道上下側，同時設置有相同對數串接式電極，提供正交於磁場方向之電流場者。 9. 如申請專利範圍第7項或第8項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該磁流泵所使用之永久磁鐵係選自稀土永磁，包括Nd2Fe14B，SmCo5 and Sm (Co, Fe，Cu，Zr)7.5，以及其改良成分者。 10. 如申請專利範圍第7項或第8項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該磁流泵所使用之軟性磁鐵係選自高導磁、高磁飽和之軟磁材料，包括矽鋼片、高導磁合金、超高導磁合金、鐵鈷合金，以及其改良成分者。 11·如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中之磁流泵安裝位置，位於熱交換主體冷側出口附近， 535486 可裝置在主體內’也可裝在其緊鄰之外側；用以推送冷卻後之冷卻流媒至熱產生元件者。 12·如申請專利範圍第；1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中冷卻流媒管道組是以液密封形式加以連結，並至少有一部份，也可以全部具有撓性，可任意彎曲、蜿蜒至待冷卻之熱產生元件者。 13. 如申請專利範圍第12項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中冷卻流媒管道組之管道截面形狀可以是方形、橢圓形、圓形、蛇腹，或依需要設計之任意形狀。 14. 如申請專利範圍第1項或第12項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中冷卻流媒管道組之材料，可以選自鋁、銅、鎂，其合金，或市售材料中具撓性且可密封之任何材料之一’並足以提供熱交換器主體與熱產生元件之液密性連接者。 15. 如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中之導電式冷卻流媒是非腐鈾性高導電水溶液、高導電非水溶液、水基或非水基懸浮液，或熔點低於攝氏30度之液態金屬。 16. 如申請專利範圍第15項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中構成該導電式冷卻流媒之非腐飩性高導電水溶液，係選自包含無機強電解質如鹼金屬矽酸鹽、含有硫酸根、硝酸根、氯氧根等的無機鹽類之一者。 17. 如申請專利範圍第15項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中構成該導電式冷卻流媒之高導電非水溶液’係選自高導電性的有機電解質，導電性塑膠溶液，或無機電解質溶解於有機溶劑之一者。 is.如申請專利範圍第15項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中構成該導電式冷卻流媒之高導電水基或非水基懸浮液，係選自微米（10_6米）或奈米（1〇·9米）級導電顆粒，分散、懸浮於水基或非水基溶液，所成之高導電性懸浮液者。 I9·如申請專利範圍第1S項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該微米或奈米級導電顆粒係選自金屬、石墨、導電性陶瓷、導電高分子、或其混合者。 2〇·如申請專利範圍第I9項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該金屬顆粒係選自銅、銀、金、白金、鈦、鋅、鍚、鐵、鎳，貴金屬、或其合金者。 21·如申請專利範圍第19項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該石墨顆粒係選自含碳材料，包括純碳、熱解石·、可膨脹石墨，及其改質物。 22·如申請專利範圍第19項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中該導電陶瓷顆粒係選自具導電性之氧化物、硼化物、碳化物、矽化物、氮化物、或是硫屬化合物。 23·如申請專利範圍第15項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中構成該導電式冷卻流媒之液態金屬是共晶鉀鈉合金、共晶鎵錫合金、共晶鎵鋁合金、共晶鎵銀合金、共晶鎵錫鋅合金、或是共晶録錫鉢錦合金。 24·如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中之內流管道組、冷卻流媒管道組內壁，是經表面處理產生陶瓷塗層，以抵抗液態冷卻液，特別是抵抗液態金屬之侵蝕者。 535486 25·如申請專利範圍第24項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中之內流管道及冷卻流媒管道組內壁之表面陶瓷塗層，係選自氧化物、碳化物、氮化物、砂化物、碳化物之一者。 26·如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置，其中整體外部經表面處理，使粗化或高孔隙化，以增進散熱面積者。 27.如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置’其中之冷卻系統係與熱產生元件上的熱擴散塊密接，以導出其熱量者。 28·如申請專利範圍第1項之一種裝設有磁流泵具撓性流媒管道之主動式熱交換冷卻裝置’其中之冷卻系統在設計允許的情況下，直接與熱產生元接觸導熱，而不透過熱擴散塊者。[Scope of patent application] ~ An active heat exchange cooling device equipped with a magnetic fluid pump with a flexible fluid medium pipe, in addition to the heat exchange main body, is provided with at least one set of magnetic fluid pumps installed near the cold flow side outlet, And the cooled conductive fluid is pumped to the heat generating element at the far end through the closed pipeline; its main component features are: α · —heat exchanger main body; β · —radiating fin group, which is arranged in the heat exchanger Outside the main body; C. An internal flow pipe group installed in the main body of the heat exchanger; 〇 · At least one magnetic current pump group installed near the cold flow side outlet of the main body of the heat exchanger; At least a part of it is flexible, and connects the main body of the heat exchanger to the heat-generating element in a liquid-tight manner, and is permanently sealed; F. — a cooling fluid with high conductivity, sealed and filled inside the cooling body. 2. For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with a scope of patent application, wherein the material of the main body of the heat exchanger is metal, alloy, thermally conductive ceramic or thermally conductive Made of polymers. 3. For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with the scope of the patent application, wherein the metal or alloy constituting the main body of the heat exchanger is selected from aluminum, magnesium, Copper, aluminum alloy, magnesium alloy, copper alloy, titanium alloy, iron alloy, nickel alloy, sand casting, die casting, sintering, machining, or plate and sheet by brazing. 4. For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with a scope of patent application item 2, wherein the thermally conductive ceramic constituting the main material of the heat exchanger is selected from alumina and nitrogen. One of aluminum, silicon nitride, silicon carbide, and aluminum carbide, obtained by compression molding, sintering, or powder injection molding and sintering. 5. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item 1 of the scope of the patent application, wherein the manufacturing method of the heat dissipation fin group is preset casting, die casting, machining or Those who are brazed to the main body of the heat exchanger. 6. An active heat exchange cooling device equipped with a flexible fluid medium pipe of a magnetic current pump, as described in item 1 of the scope of the patent application, wherein the cooling fluid medium pipe group has various curved surfaces on the inner surface and runs through the heat exchange main In vivo, the largest volume occupation. 7. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump as described in item 1 of the scope of the patent application, wherein the magnetic current pump has at least one pair of permanent magnets sandwiched in the internal flow pipe The upper and lower sides are wrapped with a soft magnet to form a magnetic circuit, and the electrodes of the same logarithm are provided in the direction orthogonal to the magnetic field direction and the flow direction to provide a current field orthogonal to the magnetic field direction. 8. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump as described in item 7 of the scope of patent application, wherein the preferred embodiment of the magnetic current pump is to have two or more pairs. Permanent magnets are arranged in series in the direction of the magnetic field, and are wrapped by a soft magnet into a magnetic circuit, sandwiched on the upper and lower sides of the internal flow pipe, and are provided with the same logarithmic series-connected electrodes to provide a current field orthogonal to the direction of the magnetic field. 9. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item 7 or item 8 of the scope of patent application, wherein the permanent magnet used in the magnetic current pump is selected from rare earth permanent magnets. Magnetic, including Nd2Fe14B, SmCo5 and Sm (Co, Fe, Cu, Zr) 7.5, and its improved components. 10. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item 7 or item 8 of the scope of patent application, wherein the soft magnet used in the magnetic current pump is selected from the group consisting of high-conductivity Magnetic and high magnetically saturated soft magnetic materials include silicon steel sheets, high magnetic permeability alloys, ultra-high magnetic permeability alloys, iron-cobalt alloys, and those with improved components. 11. According to item 1 of the scope of the patent application, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, wherein the magnetic current pump is installed near the cold-side outlet of the heat exchange main body. The device is 'inside the main body' and can also be installed on its immediate outer side; it is used to push the cooled cooling fluid to the heat generating element. 12 · If the scope of the patent application is the first; an active heat exchange cooling device equipped with a magnetic fluid pump with a flexible fluid medium pipeline, wherein the cooling fluid medium pipeline group is connected in a liquid-tight manner, and at least one All of them can be flexible, and can be bent and meandered to the heat generating element to be cooled. 13. For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with item 12 of the scope of the patent application, wherein the cross-sectional shape of the pipe of the cooling flow medium pipe group can be square, oval, or circular. , Belly, or any shape you want. 14. For example, an active heat exchange cooling device equipped with a flexible fluid medium pipe of a magnetic current pump with item 1 or 12 of the scope of the patent application, wherein the material of the cooling fluid medium pipe group may be selected from aluminum and copper , Magnesium, its alloy, or any of the commercially available materials that are flexible and sealable 'is sufficient to provide a liquid-tight connection between the heat exchanger body and the heat-generating element. 15. For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with the scope of patent application, wherein the conductive cooling flow medium is a non-corrosive uranium-based highly conductive aqueous solution and a highly conductive non-aqueous solution. , Water-based or non-water-based suspensions, or liquid metals with a melting point below 30 ° C. 16. For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with the scope of patent application item 15, wherein the non-corrosive highly conductive aqueous solution constituting the conductive cooling flow medium is selected. Self-contained inorganic strong electrolytes such as one of alkali metal silicates, inorganic salts containing sulfate, nitrate, chloride and the like. 17. For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with the scope of patent application item 15, wherein the highly conductive non-aqueous solution that constitutes the conductive cooling flow medium is selected from high conductivity Organic solvents, conductive plastic solutions, or inorganic electrolytes are dissolved in one of the organic solvents. is. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, as described in item 15 of the scope of patent application, wherein a highly conductive water-based or non-water-based suspension constituting the conductive cooling flow medium , Is selected from micron (10-6 meters) or nanometer (10.9 meters) grade conductive particles, dispersed and suspended in water-based or non-aqueous solution, the highly conductive suspension formed. I9. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item 1S of the scope of patent application, wherein the micron or nanometer conductive particles are selected from metal, graphite, and conductive ceramics. , Conductive polymer, or a mixture thereof. 20. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item I9 of the scope of patent application, wherein the metal particles are selected from the group consisting of copper, silver, gold, platinum, titanium, and zinc. , Hafnium, iron, nickel, precious metals, or alloys thereof. 21 · For example, an active heat exchange cooling device equipped with a flexible fluid medium pipe of a magnetic current pump with item 19 in the scope of the patent application, wherein the graphite particles are selected from carbonaceous materials, including pure carbon and pyrolytic stone. Expandable graphite and its modified products. 22. · An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, as described in item 19 of the scope of patent application, wherein the conductive ceramic particles are selected from conductive oxides, borides, and carbonization. Compounds, silicides, nitrides, or chalcogens. 23. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item 15 of the scope of the patent application, wherein the liquid metal constituting the conductive cooling flow medium is a eutectic potassium-sodium alloy, Crystal gallium tin alloy, eutectic gallium aluminum alloy, eutectic gallium silver alloy, eutectic gallium tin zinc alloy, or eutectic tin tin alloy. 24. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item 1 of the scope of the patent application, wherein the inner flow pipe group and the inner wall of the cooling flow medium pipe group are surface treated. Create ceramic coatings to resist liquid coolants, especially those eroded by liquid metals. 535486 25 · For example, an active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump with item 24 of the scope of application for a patent, wherein the inner wall of the inner flow pipe and the cooling medium pipe group has a ceramic coating on the surface Is selected from oxides, carbides, nitrides, sands, and carbides. 26. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pump, such as item 1 of the scope of the patent application, wherein the entire exterior is surface-treated to roughen or highly porosify the surface to enhance heat dissipation. By. 27. An active heat exchange cooling device equipped with a flexible flow medium pipe of a magnetic current pumping device as described in item 1 of the scope of the patent application, wherein the cooling system is in close contact with the heat diffusion block on the heat generating element to derive its Calories. 28. For example, the active heat exchange cooling device equipped with a flexible fluid medium pipe of a magnetic current pump with the first item of the scope of the patent application, where the cooling system is in direct contact with the heat generating element to conduct heat when the design permits, Those who do not penetrate the heat diffusion block.