523601 A7 _ B7___ 五、發明說明（/ ) 發明之領域= 一般言之，本發明係關於將一測試器對接至一探針臺 ，以用於測試晶圓形式之積體電路。特別言之，則本發明 係關於使用一 A型對接配置將一個泰瑞丁 Π50型測試器 對接至一探針臺。 發明背景 在製程中的不同階段皆需測試半導體積體電路。必須 以晶圓形式且再以封裝形式分別測試各個積體電路，以確 保積體電路可正常工作。無論是以晶圓形式或封裝形式， 自動化測試設備（ATE)將電氣訊號傳送至積體電路並分 析其反應以決定該電路是否正常作業。 以晶圓形式，積體電路係使用一種探針系統加以測試 。該探針系統包括一個探針臺（通常稱爲探針器），用於 移動晶圓以便適當地對正ATE (通常稱爲測試器）所測試 的積體電路。一個探針卡安裝在該探針臺的固定位置上並 包括數百個用於與受測積體電路之墊片間建立電氣接觸的 針狀物。一個彈簧高蹺塔用於在測試器與探針臺之間建立 機械連接。更特別地，該彈簧高蹺塔與測試器上的測試板 或母版之間建立有電氣接觸，並與探針臺上的探針卡之間 .建立有電氣接觸。之後，該測試器將電氣訊號傳輸至積體 電路並分析其反應。 圖1顯示一個測試器的一般範例，其包括一個測試頭 10，安裝在一探針臺12上。一測試頭定位系統14係用於 舉起與降低測試頭10，其重量大約在500至1000磅之間 3 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ，--------------------訂·-------- (請、先閲讀背面之注意事項再填寫本頁) 』 · ， ‘ 523601 A7 —_ _ B7 五、發明說明（i ) 。須操作該定位系統以便將該測試器與探針卡（未顯示在 圖中）適當地對正。 該測試器也可用於製程中的分離階段。更特別地，在 積體電路已以晶圓形式使用探針臺加以測試之後，便切割 該晶圓並封裝個別的積體電路。這些個別晶片在一個稱爲 操作器的單元中被測試。在使用操作器之時，測試器被安 ^:在操作益的側邊而非將測試窃1垂直降低至探針臺上。圖 2顯示安裝在一操作器22上的一測試器2〇之一般範例。 爲了將該測試器與該探針臺或操作器相對正，便使用 使測試器牢固並與探針臺或操作器有適當機械觸點或電氣 觸點的對接系統。在將一測試器安裝在一探針臺的情況下 ’該對接系統使用測試器上的公部份與探針臺上的母部份 而動態對接。一旦對接之後，則測試器與探針臺之間便可 適當對正，且母板、彈簧高蹺塔、以及探針卡之間的壓縮 便可確保其間的良好接觸。 目前，所有探針臺皆使用一種稱爲B型對接配置的對 接配置方式。圖3與4顯示使用在許多探針臺的B型對接 配置之範例，該探針臺之例爲TSK®、EG®、以及Tel®所 製作的探針臺。該B型對接配置在機械界面的三個角落具 .有動態對接單元26。雖然第四角落並未連接，但該種機械 界面已足夠’因爲測試器的重量可協助將測試器支撐在探 針臺上的適當位置。 另一方面，圖5所示係操作器使用一 A型對接配置操 作器。該A型對接配置在兩個角落上具有動態對接單元3〇 4 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公爱） 一 ：-----------—----訂·--------ί (請’先閱讀背面之注意事項再填寫本頁) * - - 523601 A7 B7 五、發明說明（$ ) ，而一第三對接單元32則通常位於單元30的相反側。使 用側安裝方式將測試器安裝至操作器上最好使用A型配置 ，因其相較於具有一個未附著角落的B型對接配置而言可 對測試器的重量提供較佳的支撐。 測試器，例如泰瑞丁 J750 ’其採買價格大約爲數百萬 元。泰瑞丁 Π50具有A型配置，因此，無法被安裝在任 何現有的探針臺上。因此，一個可安裝在操作器上，具有 A型配置的測試器（例如，J750 )便無法被使用在一個具 有B型配置的探針臺上，而用於測試工作。因此，目前的 製造商必須購買兩套不同的測試器，一套具有A型配置而 另一套則具有B型配置。 本發明之目的係期望可提供一套系統，可允許測試器 ，例如泰瑞丁 Π50，與一個操作器以及一個探針臺兩者有 效地配合使用。 發明槪要 本發明允許利用一致對接硬體而使泰瑞丁 Π50型測試 器可被安裝在一探針臺以及一操作器兩者上。操作器已具 有一種可安裝在J750上的A型配置。本發明將任何期望 的探針臺轉換至A型配置，以使Π50可被使用在探針臺 ‘以及操作器兩者上。因此，使用本發明，積體電路廠商可 採購較少測試器，因此便可大量減少資本支出。 一方面，設計各式頭臺（headstage)以使該等頭臺可 適用於不同形式的探針臺。該等頭臺被設計用於安裝將探 針臺轉換爲A型配置的一致對接硬體。因此，Π50型測試 5 本紙張尺度適用中國國家標準（CNS)A4規格^210 x 297 ) ' ：-----------裝--------訂--------- (請、先閱讀背面之注意事項再填寫本頁) ' · , 523601 A7 ____B7___ 五、發明說明（认） 器可被安裝在操作器以及各種探針臺兩者上。 另一方面，使用兩個分離式安裝組件。其中一種安裝 組件具有兩種安裝於其上的動態對接單元。另一種安裝組 件則具有一單一種動態對接單元。該等分離式安裝組件可 使安裝至探針臺成爲一項簡易之工作，並可使用低成本製 造安裝組件。 再另一方面，***針腳被置放於頭臺以確保安裝組 件可有適當的放置。 以下配合圖式之詳細說明將使本發明之上述與其他目 的更爲淸楚明瞭。 亂gL簡單說明 圖1顯示一個安裝在一探針臺上的習知技術測試器。 圖2顯示一個安裝在一操作器上的習知技術測試器。 圖3顯示一個用於習知技術探針臺的b型對接配置。 圖4顯示一個具有一 B型對接配置的習知技術探針臺 的更詳盡的視圖。 圖5顯示一個使用於一操作器上的習知技術a型對接 配置。 圖6顯示允許一探針臺被轉換爲一 a型對接配置之對 .接硬體。 圖7顯示圖6的對接硬體透過線7-7所見的上視圖。 圖8顯示用於安裝一單一動態對接單元的安裝組件。 圖9係一的詳細上視圖，用於說明根據一 a型配置的 動態對接單元的位置。 6 本紙張尺度财巾® S家鮮(CNS)aT^格(210 X 297公釐） ---------^裝---------訂--------- (請’先閱讀背面之注意事項再填寫本頁) ~ - · 523601 A7 ^_______B7__ 五、發明說明（夂） 圖1〇顯示圖7的對接硬體透過線10_10所見之剖面圖 〇 元件符號說明 10〜測試頭；12〜探針臺12 ; 14〜測試頭定位系統； 20〜操作器；20〜測試器；26〜動態對接單元；30〜動態 對接單元；32〜第三對接單元；40〜A型對接硬體；42〜 探針臺；44〜晶圓船；46〜操作員控制；48〜測試頭；50 〜頭臺；52〜工具加工盤；54〜中心孔；56、58〜K-對 接安裝組件；60、61〜動態對接單元；62〜動態對接單元 ;64〜基座；66〜延伸構件66 ; 68〜基座；70〜延伸構件 ;74、7 6〜***針腳；7 8〜螺隹」；7 9〜疋位器針腳， 8〇〜安裝硬體；82〜測試中心；84〜緯度軸；86〜點；88 〜角度線；90〜泰瑞丁 Π50 ; 91〜測試頭；92〜彈簧高蹺 塔；94〜探針卡；96〜頭臺；98〜公型安裝硬體；1〇〇〜定 位器針腳；102〜螺釘；104〜螺釘；106〜***針腳； 〜螺釘 圖6與圖7顯示根據本發明在一個一般探針臺42上的 一 A型對接硬體40。探針臺42可爲任何可取得的探針臺 .’例如TSK®、EG®、以及Tel®所製造者。該探針臺可包 括標準特性，例如一晶圓船44、操作員控制46，等。一個 以測試頭48加以標示之泰瑞丁：Γ750測試器係利用A型探 針臺對接硬體40而安裝在探針臺上，以下將進一步說明。 〜頭臺50 (圖7)具有一個置放於其上的工具加工盤 7 本紙張尺度適國家標準（CNS)A4規格（21〇 X 297公釐） ' ' (請f閱讀背面之注意事項再填寫本頁) 一裝 --訂---- # 523601 A7 五、發明說明（) 52。該工具加工盤具有一個安裝一探針卡組件（其包含一 個***環、探針卡等）的中心孔，其以54加以標示。A型 探針臺對接硬體40包括K-對接安裝組件56、58。安裝組 件56是一種雙K-對接安裝組件，因其支撐兩個動態對接 單元60、61。安裝組件58爲單安裝組件並僅支撐一個動 態對接單元62。每個組件56、58包括一個基座以及一個 延伸構件。例如，組件56包括基座64以及延伸構件66。 相似地，組件58包括基座68以及延伸構件70 (見圖8所 示之近距離立體圖）。如下之所將進一步說明者，基座64 、68係用於將該對接硬體適當地安裝於該頭臺上。延伸構 件66、68係用於置放並安裝動態對接單元6〇、61、62。 ***針腳（locator pin) 74、76被置放於該頭臺上，以 便分別精密安裝K-對接安裝組件56、58。螺釘78被用於 將安裝組件56、58安裝至頭臺50上。***針腳79也 可被置放於基座64上以便容易安裝延伸構件66。可藉由 整合基座64與沿伸構件66的方式去除不用***針腳79 。如圖6所示，泰瑞丁 Π50具有與A型對接硬體40相接 合的公型安裝硬體80以便將該測試器與該探針臺相對正， 其中母板、彈簧高蹺塔、以及探針座（未顯示在圖中）之 .間具有適當之壓縮。 圖9顯示以A型配置安裝在探針臺的動態對接單元60 、61、62的一般上視圖。圖中並未顯示特定的對接硬體， 因爲任何期望的對接硬體皆可被用於以一 A型配置安裝該 動態對接單元。例如，不使用兩個分離式的安裝組件而使 8 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） " ~ • 裝---------訂--------- ·! (請'先閱讀背面之注意事項再填寫本頁) 一 . . 523601 A7 ___B7___ 五、發明說明（]) 用一單一個安裝組件。另外，可使用三個安裝組件，每個 動態對接單元可使用一個安裝組件。更進一步’該對接單 元可被整合至該頭臺上。熟知本技術的人士將瞭解有數種 可用於將探針臺轉換爲A型配置的對接配置’且本發明並 不限於圖中所示的A型對接硬體。 點82所示爲一測試中心。一探針卡（未顯示在圖中） 中心座落於測試中心82上。一緯度軸84通過該測試中心 。兩個鏡像對接單元60、61位於該頭臺的右側且二者距緯 度軸84上之點86的距離相等。特別地，每一對接單元60 、61位於距離緯度軸1 1.562”之處。在頭臺50由對接單元 60、61所見的相反側之處，對接單元62位於與點86相距 31.650”之處的緯度軸上。該對接單元的置放方式與A型配 置相符。A型配置的尺寸與角度可改變，但其一般結構則 具有三個對接單元，其中二個單元與緯度軸之間等距相隔 ，而第三個對接單元則位於緯度軸上。對接單元60、61、 62具有一種特定方向，其以一 K-槽辨識。在所示的實施例 中，對接單元60、61的K-槽沿著角度線88對正，而對接 單元62的K-槽則沿著緯度軸對正。 圖10顯示A型探針臺對接硬體40的剖面圖，其中泰 ，瑞丁 J750測試器9G係被鎖在一測試位置。該測試器的測 試頭91位於一彈簧高蹺塔92頂部。一探針卡94位於彈簧 高蹺塔92下方並安裝於頭臺96之上。測試頭、彈簧高蹺 塔以及探針卡必須經過適當壓縮以確保良好連接。對接硬 體40的設計係使當測試器90的公型安裝硬體98被對接在 9 本紙張尺度適用中關家標準（CNS)A4規格（210 X 297公爱)一 n n n I n n n n n n · —i n 1- n n n ϋ ^l^OJ· n n n a— n ϋ n · I— (請、先閱讀背面之注意事項再填寫本頁) _ ^ 523601 A7 ____B7___ 五、發明說明（公） 動態對接單元60、61、62之時可達到適當壓縮的目的。定 位器針腳1〇〇被固定在頭臺96中，以使安裝組件56的基 座64可位於該頭臺的適當位置。螺釘1〇2將基座64固定 在該頭臺上。動態對接單元60利用螺釘104被固定在延伸 構件66上。相似地，安裝組件58利用***針腳106被 放置放於該頭臺上。螺釘（未顯示在圖中）將安裝組件固 定在該頭臺上。另外，螺釘108將對接單元62固定在安裝 組件58上。 以上已說明並描述所示實施例的原則，熟知本技術者 皆將明白，於不背離該原則之前提下，可修改該實施例之 配置及細節。 在看過數種可能的實施例之後，吾人將認知到所示實 施例僅包括本發明之範例，且不應以該等實施例反之限制 本發明的範圍。反而，本發明係由申請專利範圍所界定。 本人因而主張該等實施例皆在申請專利範圍之範圍內。 10 本紙張尺度適用中國國家標單（CNS)A4規格（21〇 X 297公爱） '-----------裝---------訂---------AW-II (請·先閱讀背面之注意事項再填寫本頁) ‘ .523601 A7 _ B7___ V. Description of the invention (/) Field of invention = In general, the invention relates to docking a tester to a probe station for testing integrated circuits in the form of wafers. In particular, the present invention relates to docking a Teradine Π50 tester to a probe station using a type A docking configuration. BACKGROUND OF THE INVENTION Semiconductor integrated circuits need to be tested at different stages in the process. Each integrated circuit must be tested separately in wafer form and then in package form to ensure that the integrated circuit can work properly. Whether in wafer form or package form, automated test equipment (ATE) sends electrical signals to the integrated circuit and analyzes its response to determine whether the circuit is operating normally. In wafer form, integrated circuits are tested using a probe system. The probe system includes a probe station (commonly referred to as a prober) that moves the wafer to properly align the integrated circuit tested by the ATE (commonly called a tester). A probe card is mounted in a fixed position on the probe station and includes hundreds of pins for establishing electrical contact with the pads of the circuit under test. A spring stilt tower is used to establish a mechanical connection between the tester and the probe station. More specifically, electrical contact is established between the spring stilt tower and the test board or master on the tester, and electrical contact is established between the spring card and the probe card on the probe station. The tester then transmits the electrical signal to the integrated circuit and analyzes its response. FIG. 1 shows a general example of a tester including a test head 10 mounted on a probe station 12. A test head positioning system 14 is used to lift and lower the test head 10, and its weight is about 500 to 1000 pounds. 3 This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm),- ------------------ Order · -------- (Please read the precautions on the back before filling in this page) "", "523601 A7 —_ _ B7 V. Description of the invention (i). The positioning system must be operated to properly align the tester with the probe card (not shown). The tester can also be used in the separation phase of a process. More specifically, after the integrated circuit has been tested in the form of a wafer using a probe station, the wafer is cut and the individual integrated circuits are packaged. These individual wafers are tested in a unit called a manipulator. When using the manipulator, the tester is installed on the side of the operating device instead of lowering the test theft 1 vertically to the probe station. FIG. 2 shows a general example of a tester 20 mounted on an operator 22. In order to align the tester with the probe station or manipulator, a docking system is used that secures the tester and has appropriate mechanical or electrical contacts to the probe station or manipulator. In the case of installing a tester on a probe station, the docking system uses the male part on the tester and the female part on the probe station to dynamically dock. Once docked, the tester and probe station can be properly aligned, and compression between the motherboard, spring stilt tower, and probe card can ensure good contact between them. At present, all probe stations use a docking configuration called a B-type docking configuration. Figures 3 and 4 show examples of type B docking configurations used in many probe stations. Examples of probe stations are probe stations made of TSK®, EG®, and Tel®. The B-type docking device is provided at three corners of the mechanical interface with a dynamic docking unit 26. Although the fourth corner is not connected, this mechanical interface is sufficient ’because the weight of the tester can help support the tester in place on the probe stand. On the other hand, the operator shown in Fig. 5 uses an A-type docking configuration operator. The A-type docking configuration has dynamic docking units 3 on both corners. This paper size is applicable to China National Standard (CNS) A4 specifications (210 X 297 public love). One: ------------- ---- Order · -------- ί (Please 'read the notes on the back before filling this page) *--523601 A7 B7 V. Description of the invention ($), and a third docking unit 32 It is usually located on the opposite side of the unit 30. It is best to use the A-type configuration to install the tester on the operator using the side-mounting method, because it can provide better support for the weight of the tester than the B-type butt configuration with an unattached corner. Testers, such as Teradine J750 ’, have a purchase price of approximately several million yuan. The Teradine Π50 has a Type A configuration and therefore cannot be mounted on any existing probe station. Therefore, a tester with an A configuration (for example, J750) that can be mounted on an operator cannot be used in a probe station with a B configuration for testing. As a result, current manufacturers must purchase two different sets of testers, one with a type A configuration and the other with a type B configuration. It is an object of the present invention to provide a system that allows a tester, such as Teradine Π50, to be effectively used with both an operator and a probe station. Summary of the Invention The present invention allows the use of a consistent docking hardware so that the Teradine Π50 tester can be mounted on both a probe station and an operator. The operator already has a Type A configuration that can be mounted on the J750. The present invention converts any desired probe station to a type A configuration so that the UI50 can be used on both the probe station ′ and the operator. Therefore, using the present invention, integrated circuit manufacturers can purchase fewer testers, and thus can significantly reduce capital expenditures. On the one hand, various headstages are designed so that they can be applied to different types of probe stations. These heads are designed to fit consistent docking hardware that converts the probe head to a Type A configuration. Therefore, the Π50 type test 5 paper sizes are applicable to China National Standard (CNS) A4 specifications ^ 210 x 297) ': ----------- installation -------- order ---- ----- (Please read the precautions on the back before filling in this page) '·, 523601 A7 ____B7___ 5. Description of the invention (recognizer) The device can be installed on both the operator and various probe stations. On the other hand, two separate mounting components are used. One type of mounting kit has two types of dynamic docking units mounted on it. The other mounting component has a single dynamic docking unit. These separate mounting kits make installation into the probe station an easy task, and they can be manufactured at low cost. On the other hand, the positioner pins are placed on the head stage to ensure that the mounting components can be placed properly. The following detailed description in conjunction with the drawings will make the above and other objects of the present invention more comprehensible. Brief Description of Random gL Figure 1 shows a conventional technology tester mounted on a probe station. Figure 2 shows a conventional technology tester mounted on an operator. Figure 3 shows a b-type docking configuration for a conventional technology probe station. Figure 4 shows a more detailed view of a prior art probe station having a B-type docking configuration. Figure 5 shows a conventional a-type docking arrangement used on an operator. Figure 6 shows docking hardware that allows a probe station to be converted into an a-type docking configuration. FIG. 7 shows a top view of the docking hardware of FIG. 6 as seen through lines 7-7. Figure 8 shows a mounting assembly for mounting a single dynamic docking unit. Fig. 9 is a detailed top view for explaining the position of the dynamic docking unit according to an a-type configuration. 6 paper-size paper towels® S house fresh (CNS) aT ^ grid (210 X 297 mm) --------- ^ installed --------- order ------ --- (Please read the precautions on the back before filling this page) ~-· 523601 A7 ^ _______ B7__ V. Description of the invention (夂) Figure 10 shows a cross-sectional view of the docking hardware transmission line 10_10 shown in Figure 7 Symbol description 10 ~ test head; 12 ~ probe stand 12; 14 ~ test head positioning system; 20 ~ operator; 20 ~ tester; 26 ~ dynamic docking unit; 30 ~ dynamic docking unit; 32 ~ third docking unit; 40 to A-type docking hardware; 42 to probe station; 44 to wafer boat; 46 to operator control; 48 to test head; 50 to head stage; 52 to tool processing disc; 54 to center hole; 56, 58 ~ K-docking installation assembly; 60, 61 ~ dynamic docking unit; 62 ~ dynamic docking unit; 64 ~ base; 66 ~ extension member 66; 68 ~ base; 70 ~ extension member; 74, 7 6 ~ locator pin ; 7 8 ~ 隹 "; 7 9 ~ positioner pins, 80 ~ mounting hardware; 82 ~ test center; 84 ~ latitude axis; 86 ~ point; 88 ~ angle line; 90 ~ Teradine Π50; 91 ~ Test head; 92 ~ bomb Stilt tower; 94 ~ probe card; 96 ~ head platform; 98 ~ male type mounting hardware; 100 ~ locator pins; 102 ~ screws; 104 ~ screws; 106 ~ locator pins; ~ screws Figure 6 and Figure 7 shows a type A docking hardware 40 on a general probe stand 42 according to the present invention. The probe station 42 can be any available probe station. 'For example, TSK®, EG®, and Tel®. The probe station may include standard features such as a wafer ship 44, operator control 46, and the like. A Teradine: Γ750 tester is marked with a test head 48. It is mounted on the probe station by using a type A probe station to dock with the hardware 40, which will be described further below. ~ The head stage 50 (Figure 7) has a tool processing disc placed on it. 7 The paper size is in accordance with the national standard (CNS) A4 specification (21 × 297 mm). '' (Please read the precautions on the back again. (Fill in this page) One Pack-Order ---- # 523601 A7 V. Description of Invention () 52. The tooling disc has a central hole for a probe card assembly (which includes an insertion ring, a probe card, etc.), designated 54. The A-type probe station docking hardware 40 includes K-docking mounting assemblies 56 and 58. The mounting assembly 56 is a dual K-docking mounting assembly because it supports two dynamic docking units 60, 61. The mounting assembly 58 is a single mounting assembly and supports only one dynamic docking unit 62. Each assembly 56, 58 includes a base and an extension member. For example, the assembly 56 includes a base 64 and an extension member 66. Similarly, the assembly 58 includes a base 68 and an extension member 70 (see a close-up perspective view of FIG. 8). As will be further explained below, the bases 64 and 68 are used to properly mount the docking hardware on the headrest. Extension members 66 and 68 are used to place and install dynamic docking units 60, 61, and 62. The locator pins 74 and 76 are placed on the head stage so as to precisely install the K-docking installation components 56, 58 respectively. The screws 78 are used to mount the mounting assemblies 56, 58 to the head 50. The locator pins 79 can also be placed on the base 64 for easy installation of the extension member 66. The non-positioner pin 79 can be removed by integrating the base 64 and the extension member 66. As shown in FIG. 6, the Teradine Π50 has a male mounting hardware 80 that is engaged with the A-type docking hardware 40 so that the tester is relatively positive to the probe station, wherein the mother board, the spring stilt tower, and the probe Needle seat (not shown) with proper compression. Fig. 9 shows a general top view of the dynamic docking units 60, 61, 62 mounted on the probe station in an A configuration. The specific docking hardware is not shown in the figure, as any desired docking hardware can be used to install the dynamic docking unit in a type A configuration. For example, instead of using two separate mounting components, 8 paper sizes are applicable to China National Standard (CNS) A4 (210 X 297 mm) " ~ • 装 --------- Order-- ------- ·! (Please 'read the precautions on the back before filling out this page) 1. 523601 A7 ___B7___ 5. Description of the invention (]) Install the components one by one. In addition, three mounting components can be used, one for each dynamic docking unit. Furthermore 'the docking unit can be integrated on the head. Those skilled in the art will understand that there are several docking configurations' that can be used to convert the probe station to an A-type configuration, and the present invention is not limited to the A-type docking hardware shown in the figure. Point 82 shows a test center. A probe card (not shown) is centered on the test center 82. A latitude axis 84 passes the test center. The two mirrored docking units 60, 61 are located on the right side of the headrest and are equal in distance from the point 86 on the latitude axis 84. In particular, each docking unit 60, 61 is located 1.562 "from the latitude axis. On the opposite side of the head 50 as seen by the docking unit 60, 61, the docking unit 62 is located 31.650" from the point 86 Latitude axis. The docking unit is placed in the same way as the A-type configuration. The size and angle of the type A configuration can be changed, but its general structure has three docking units, two of which are equidistant from the latitude axis, and the third docking unit is located on the latitude axis. The docking units 60, 61, 62 have a specific orientation, which is identified by a K-slot. In the illustrated embodiment, the K-slots of the docking units 60, 61 are aligned along the angle line 88, and the K-slots of the docking units 62 are aligned along the latitude axis. Fig. 10 shows a cross-sectional view of the A-type probe station docking hardware 40, in which the Thai and Reading J750 testers 9G are locked in a test position. The test head 91 of the tester is located on top of a spring stilt tower 92. A probe card 94 is located below the spring stilt tower 92 and is mounted on the head platform 96. The test head, spring stilt tower, and probe card must be properly compressed to ensure a good connection. The design of the docking hardware 40 is such that when the male mounting hardware 98 of the tester 90 is docked on 9 paper standards, the Zhongguan Family Standard (CNS) A4 specification (210 X 297 public love)-nnn I nnnnnn · —in 1- nnn ϋ ^ l ^ OJ · nnna— n ϋ n · I— (Please read the precautions on the back before filling out this page) _ ^ 523601 A7 ____B7___ 5. Description of the invention (public) Dynamic docking unit 60, 61, At 62, the purpose of proper compression can be achieved. Positioner pins 100 are fixed in the headstock 96 so that the base 64 of the mounting assembly 56 can be positioned at the appropriate position of the headstock. Screws 102 fix the base 64 to the headrest. The dynamic docking unit 60 is fixed to the extension member 66 with screws 104. Similarly, the mounting assembly 58 is placed on the head using the locator pins 106. Screws (not shown) secure the mounting assembly to the headstock. In addition, screws 108 fix the docking unit 62 to the mounting assembly 58. The principles of the illustrated embodiment have been described and described above, and those skilled in the art will understand that the configuration and details of the embodiment can be modified without departing from the principle. After looking at several possible embodiments, I will realize that the illustrated embodiments include only examples of the invention, and that the scope of the invention should not be limited by these embodiments instead. Instead, the invention is defined by the scope of patent applications. I therefore claim that these embodiments are within the scope of patent application. 10 This paper size applies to China National Standards (CNS) A4 specifications (21〇X 297 public love) '----------- install --------- order ----- ---- AW-II (Please read the notes on the back before filling this page) '.