TW522668B - Self-aligned integrated photoelectric transceiver - Google Patents

Abstract

The present invention provides an integrated photoelectric component and a self-aligned integrated photoelectric transceiver which is produced by using a flip chip technology and a self-alignment of mechanical manner. The main components of the self-aligned integrated photoelectric transceiver comprise: an L-shaped circuit board, a silicon substrate, a plurality of chips connected to the silicon substrate, a micro-lens array, an optical fiber, and a container housing the above components, in which the above components are assembled into an integral alignment construction. Said plurality of chips can include a laser diode, a laser diode driver, a photo detector, and a signal amplifier. The mechanical alignment method of the micro-lens array and the silicon substrate comprises using a groove formed on the surface of the two, and inserting an isolation ball into the two corresponding grooves to form a gap, thereby forming a self-alignment function.

Description

522668522668

五、發明說明（1) 【發明領域】 本發明係關於一種自動對準式之整合型光電收發器， 特別是關於整合光電元件且利用覆晶技術提供自動“； 能的自動對準式之整合型光電收發器。 力 【發明背景】 近年來應用在電腦方面的光電技術快速發展，如 通訊、光學貢料儲存裝置（例如光碟）等...。此外 ^ 術還應用在許多消費性商口古& σ ^ 九电技 體系統、電腦光碑機以及豆#怎如豕庭奴木糸統、多媒 片來儲存；料，；精密=，利用光碟 腦系統裡的資訊，光兩收乂 w ϋ Α的形/ “保存一般電 成元件。 “收發"則是光通訊系統裡重要的組 元電收發器 田 光 光 器 雷 括 作 量 射二極 纖傳輸 纖所傳 還包括 身十二極 光偵檢 為回饋 穩定， 為了 統的幾 型、壓 體將網 至另一 輸的光 一微透 體所發 器裝置 訊號使 不隨溫 使光電 何以及 縮的元 G符赞射和 路系統所提 用戶端；接 訊號並轉換 鏡陣列以及 出，經過透 ’其可將反 用，並且確 度、時間的 系統裡的光 對準條件的 件構裝以減 供電的 收部分 成電的 一光學 鏡表面 射的光 保由雷 改變而 電收發 配合。 少光電 個部 資訊 則利 寅訊 系統 產生 線轉 射二 變化 器能 幾何 裝置 分。 轉換 用受 〇 --- 用來 反射 換成 極體 风九訊號透 光一*極體偵 般的光電收 收集並處理 的光線；亦 為電子訊號 所發出的光 糸 小V. Description of the Invention (1) [Field of the Invention] The present invention relates to an automatic alignment type integrated photoelectric transceiver, and particularly to an integrated optical element and providing automatic "use of flip chip technology"; capable of automatic alignment type integration Optical Transceiver. [Background of the Invention] In recent years, the photoelectric technology applied to computers has developed rapidly, such as communication, optical storage devices (such as optical discs), etc. In addition, ^ technology is also used in many consumer markets Ancient & σ ^ Jiu Dian technical system, computer light tablet machine, and bean #How to store it as a 豕 庭 奴 木 糸 system, multimedia film; material ,; precision =, use the information in the optical disc brain system, two light Shape of 乂 w ϋ Α / "Save general electrical components. "Receiving and receiving" is an important component of the optical communication system. The optical transceiver Tian Guangguang, Lei Kuo, and the measuring radiation diode transmission fiber also include the body's twelve aurora detection for feedback stability. The pressure body will send the light to the other device. The signal sent by the micro-transmissive device will not cause the photoelectric device to shrink with the temperature, and the element G symbol will be emitted from the client system. It will receive the signal and convert the mirror array and output. After passing through, it can be used in the reverse, and the system of light alignment conditions in the system of time and accuracy is configured to reduce the power of the power supply. The light emitted from the surface of an optical mirror is changed by lightning and the electrical transmission and reception are matched. The information of the mini-optical unit is that the Liyinxun system produces two transmissive transducers that can be divided into geometric devices. The conversion receiver is used to reflect and change to the polar wind. The nine-signal light-transmitting one. Light collected and processed; it is also a small amount of light emitted by electronic signals

522668 五、發明說明（2) 源、微透鏡和光偵檢器間的對準也很重 、* 學訊號完全轉換成電子訊號， 二才能使光 失真的情形。 避免在先線傳达過程中造成 【發明之目的及概述】 本叙明目的在於提供一種自動對準式之敫八 發器來改善傳統光電收發器上的一些缺點。正s里光電收 本發明另有一個目的在於提供二種自動對 型光電收發器，豆效人# + - & 目動對丰式之整合 Γ t /、正α先電兀件而形成—整體性的谨狀 型光ΐ1:3!另有一個目的在於提供-種自動對準式之：二 孓先电收赉器，利用覆晶技術使其 '之正。 偵檢器能夠被動地對準。 '、 “、从透鏡與光 本發明另有一個目的在於提供一種自 土光電收發器，在一容器内整合光、，式之整合 板上形成一整體性的模組。 牛亚、，且裝在電路 本發明另有一個目的在於提供一、 i光電收發器，矽基板（si η 、準式之整合 打線接合（Wlreb0nd)(全線焊◦了）利用複數個 數個的晶片，使其產技術)以連接電路板和複 t發明^有一個目的在於提供一種自動對 电收發态，其複數個晶片利用自動 ^ i s 锡凸％，與矽基板產生電性連接。 旱设日日技術的銲 型弁i發明另有一個目的在於提供一種自動對準式之敕人 i先電收發器，利用矽基板和微诱 旱式之整合 凹槽等機械裝置’峰夕基板；微；鏡陣二 j厶厶υ〇δ -—_ _ — 五、發明說明（3) 能。 本發明揭露一種敕人 準功能的自動對準六、::先电兀件且利用覆晶技術提供對 佳實施例中，―乙型"iE'合型光電收發器。在本發明的較 所形成，垂直部分立板，由一垂直部分和一水平部分 分之底部表面具有複數2面之表面構裝—矽基板，水平部 電路板的垂直部分外二導電線路；一石夕基板，接合於其 個晶片，其包含雷 =表面，矽表面副裝置具有複數 其平行於前述矽美板Γ料肢和光偵檢器；一微透鏡陣列， 纖連接器輸出輪：m射二極體；-光纖，、經由光 個晶片、微透鏡陣;哭:揭基板、複數 準架構。 、義連接為加以結合形成一對 本發明揭露一整合弁帝开生 光電收發器，#中更：士二：：一自動對準式之整合型 表面上方 -Γ, 匕3 政…、态，裝置於該電路板水平 板f Ϊ1、:Γ 、線接合線路，用以連接石夕基板盘電路522668 V. Description of the invention (2) The alignment between the source, the micro lens and the light detector is also very heavy. * The academic signal is completely converted into an electronic signal. Second, the light can be distorted. Avoid the cause during the front line communication [Objective and summary of the invention] The purpose of this description is to provide an automatic alignment type transmitter to improve some shortcomings of the traditional photoelectric transceiver. Another objective of the present invention is to provide two types of automatic paired photoelectric transceivers. The douxiaoren # +-& eye-to-bundle type integration Γ t /, positive α pre-formed components- The holistic ridge-shaped light beam is 1: 3! Another purpose is to provide a kind of automatic alignment type: the second one is the electric receiver, and it is made to be positive using flip chip technology. The detector can be passively aligned. ',', Lens and light Another object of the present invention is to provide a self-storing photoelectric transceiver, which integrates light in a container, and an integrated module is formed into an integrated module. In the circuit, another object of the present invention is to provide an i-optical transceiver, a silicon substrate (si η, quasi-type integrated wire bonding (Wlreb0nd) (full-line soldering)) using a plurality of chips to make its production technology ) To connect the circuit board and the invention, there is an object to provide an automatic power transmission and reception state, in which a plurality of chips use the automatic solder bump% to electrically connect to the silicon substrate. Another object of the invention is to provide a self-aligning type of first-generation transceiver, which uses mechanical devices such as a silicon substrate and a micro-induction-type integrated groove.厶 υ〇δ -—_ _ — V. Description of the invention (3) Capability. The present invention discloses an automatic alignment of a quasi-function. Six :: The first electrical element and the use of flip-chip technology to provide a better embodiment, ―Type B " iE ' In the present invention, the vertical part of the vertical board is composed of a vertical part and a horizontal part with a bottom surface having a plurality of two surfaces—a silicon substrate, and the vertical part of the horizontal part of the circuit board is electrically conductive. Circuit; a Shi Xi substrate, bonded to its chip, which contains a lightning surface, the silicon surface sub-device has a plurality of parallel to the aforementioned silicon-membrane Γ material limb and light detector; a micro-lens array, fiber connector output wheel: m-emitting diodes; -optical fiber, via optical chips, microlens arrays; crying: uncovering the substrate, multiple quasi-architectures. The right connection is combined to form a pair of the present invention to unveil an integrated optical fiber transceiver, Zhongchang: Shier 2 :: An automatic alignment type integrated surface above -Γ, Dagger 3…, state, installed on the circuit board horizontal plate f Ϊ1,: Γ, wire bonding circuit to connect Shixi substrate Disk circuit

反個1c晶片於蝴反。其複數個積體電路= i曰曰片更包括複數個銲錫凸塊以提供1〇晶片與矽基 C ;:i f，複數個晶片也可利用其複數個銲錫凸塊以；準 7 =板。自動對準式之整合型光電收發器更包含有分別 在矽基板表面及微透鏡陣列底面形成四個以上的凹样， 基板和微透鏡陣列組裝後，兩者之凹槽彼此成—鏡^對夕 f，逛包含四個以上的隔離小球，置放於矽基板和微 陣列對稱的凹槽之間，使矽基板自動對準微透鏡陣列。'兄 此自動對準式之整合型光電收發器其電路板係以絕緣 522668 五、發明說明（4) 材料製成，複數個積體電 包括雷射二極體、光偵：(Ι(；)曰曰片可為四種ic晶[其 大器，複數個晶片上更包^田射—極體驅動器和訊號放 板間的電性連接。自動：數：打線接合以提供與矽基 矽基板和微透鏡陣列之=之整合型光電收發器還包括 板和微透鏡陣列間保持二兩個隔離棒，使得石夕基 分之底部表面所形成；數=的空間。編板水平部 腳。 □冷電線路為銲錫凸塊或導電接 由一 ί:自!:式”合型光電收發器，其中之容器係 中央各有-小孔，及底板’支柱 過小孔。導桿一 π、g♦先包收叙态守使一對導桿分別通 ϋ ift ^ ^ ^ 而k匕％路板垂直部分的小孔，另一端則 通過肷裝於容器上板盥 力細則 為一光纖束。矽美板、二f的支柱之中央小孔。該光纖係 容器内時，係為；相平：數：晶片以及微透鏡陣列組裝於 為使對本發明的目Z。每射一極體係產生脈衝雷射。 了解，兹配人FI - 勺、構造特徵及其功能有進一步的 J月午從配合圖不詳細說明如 【貫施例詳細說明】 本發明揭露一聲人忠一 及機械對準>μ ώ Γ先笔70件並使用自動對準覆晶技術 及执楸對旱方法的自動 純本=:;動對準式之：合。電：：=:型電 和-容器組⑮數個的晶片、-微透鏡陣列、-光纖 L型電路板由一恭 盂直邛分和一水平部分組成，垂直部Invert a 1c chip. Its plurality of integrated circuits = i said chip further includes a plurality of solder bumps to provide 10 chips and silicon-based C ;: i f, a plurality of wafers can also use its solder bumps; quasi 7 = board. The self-aligning integrated optical transceiver further includes four or more concave samples formed on the surface of the silicon substrate and the bottom surface of the microlens array. After the substrate and the microlens array are assembled, the grooves of the two form a mirror-pair. In the evening, the four or more isolation balls are placed between the silicon substrate and the symmetrical groove of the microarray, so that the silicon substrate is automatically aligned with the microlens array. 'Brother this self-aligning integrated optical transceiver, the circuit board is made of insulation 522668 V. Description of the invention (4) Material, a plurality of integrated electrics including laser diode, light detection: (Ι (; ) Said chip can be four kinds of IC crystal [its large device, more packages are included on several chips ^ field emission-the electrical connection between the polar body driver and the signal amplifier board. Automatic: number: wire bonding to provide silicon-based silicon The integrated optical transceiver of the substrate and the microlens array also includes two or two isolation rods maintained between the board and the microlens array, so that the bottom surface of Shi Xijifen is formed; the space of the number = the horizontal leg of the plate. □ The cold electricity circuit is a solder bump or a conductive connection. A :: !! type "type photoelectric transceiver, where the container has a small hole in the center and a small hole in the bottom plate. The guide rod is a π, g ♦ Firstly, the state-of-the-art tactics are adopted to make a pair of guide rods pass through the ift ^ ^ ^, and the small hole in the vertical part of the k d %% road board, and the other end is a fiber bundle by mounting on the container. The small hole in the center of the silicon-silicon board and the pillar of the two f. When the optical fiber is in the container, the system is; The lens and the microlens array are assembled for the purpose of the present invention. A per-pole system generates a pulsed laser. It is understood that the FI-spoon, structural features and functions thereof are further J. Noon. From the mating diagram is not detailed Explained as [the detailed description of the examples] The present invention discloses a loyalty and mechanical alignment > μ trophy first 70 pieces and uses automatic alignment flip-chip technology and an automatic pure method of drought control method = :; Dynamic alignment type: close. Electric :: =: type electric and -container group of several wafers, -micro lens array, -optical fiber L-shaped circuit board consists of a straight line and a horizontal part, vertical unit

五、發明說明（5) d : S面接合：:夕基板’水平部分的底面為導線 雷射-極-:丄則配置一散熱裝i。矽基板由複數個包括 直部分的外部面板上。更有利二：成’亚組夺、於·电路板垂 體、♦射_ h ^ 更有利的方法是，把包括雷射二極 H =驅動裝置、光偵檢器 上M片構1於矽基板的頂端表面。 隔離球機械式對準 對準雷射二極體，安透鏡卩車列平行於石夕基板並 輸出輸入光訊號，呈；哭：=部的光纖經由光纖連接器 收發器1〇的各關不鍵組其件為之本3發明自動對準式之整合型光電 光電收發H1G * _L型電路^圖，—此自動對準式之整合型 體電路晶片（1C晶月）勺扭φ ,、一矽基板30、複數個積 器之1C晶片42、一微^^ 一極體之IC晶片40和光偵檢 置22，L型電路板2〇水 刀24的上方可組裝散熱裝 銲錫凸塊使其與外部兩 '为4底面26具有導線配置28如 有微量金屬（無標示)：垂直J改在[型電路板2〇内部也含 線接合34形成電性連接 甩路板32能和矽基板30經過打 第2圖Λ太/ (如第3圖所示）。 於容器内V、主要？件自之動對準式之整合型光電收發器組裝 鏡陣列50，在容哭6〇內^面圖，如第2圖所示，包括微透 孔64的支柱62,置-對分別於中心各有-中Λ 及—光纖連接器，進-步說明此容丄 五、發明說明（6) ;2° ;二、;二板直6 r容^邊側板V. Description of the invention (5) d: S-plane bonding :: The bottom surface of the horizontal part of the substrate is a wire. The laser-pole-: is equipped with a heat sink i. The silicon substrate is composed of a plurality of external panels including straight portions. More advantageous two: into a sub-group, Yu · circuit board pituitary, 射 _ h ^ A more advantageous method is to include the laser diode H = drive device, M chip structure 1 on the light detector on a silicon substrate Top surface. The isolation ball is mechanically aligned and aligned with the laser diode, and the lens array is parallel to the Shixi substrate and outputs the input optical signal. The key set consists of the integrated self-aligning photoelectric photoelectric H1G * _L type circuit of the invention of the 3rd invention. The figure of the self-aligning integrated body circuit chip (1C crystal moon). A silicon substrate 30, a plurality of integrator 1C chips 42, a single IC chip 40 and a photodetector 22, and an L-shaped circuit board 20 above the water knife 24 can be assembled with a heat sinking solder bump to make it The two sides with the outside are 4 and the bottom surface 26 has a wire arrangement 28. If there is a trace of metal (not marked): vertical J is changed in the [type circuit board 20. The inside also includes wire bonding 34 to form an electrical connection. The circuit board 32 can be connected to the silicon substrate 30. After hitting picture 2 Λ too / (as shown in picture 3). V in the container, mainly? A self-aligning, self-aligning, integrated photoelectric transceiver assembly mirror array 50 is shown in the figure 60. As shown in FIG. 2, the pillars 62 including the micro-through holes 64 are placed at the center respectively. Each has -medium Λ and -fiber optic connectors, further explanation of this content. V. Description of the invention (6); 2 °; 2 ;; two plates straight 6 r capacity ^ side side plate

桿36通過，而引導桿36之另一端八則、Φ拉 對引V 62的中心小孔64。 知刀別連接至容器60内支柱 第3圖為本發明自動對準式之整合 數個K晶片40、42、石夕基板3。和乙型 ：以 :第3圖所示’複數個的1C晶片4。、‘2包括利用 46^ ^ ^ ^30 # ^ ^1〇 ^ 4〇f ^ LI和：:卜=;Β ”別是用來 貞私态Λ號的訊號放大器之Z C晶片。此 ，片利用銲錫凸塊44(如第2圖）連接到石夕基板30，而石夕基二 反30則利用打線接合34而與L型電路板2 所" :，片40、42、52和54僅作為圖例參考之用，任:：；1 之1C晶片皆可用於本發明自動對準式之整合型光 第4圖為本發明自動對準式之整 ==、微透鏡陣列5°、雷射二極體之I。：二 纖？!#隹置圖。光纖連接器70其内部導入光纖74，光 、截7 4收集由雷射一 + Μ 面 ^極肢之1C曰曰片40所發出投射至微透鏡鏡 鏡面區56底^二極體之1C晶片4〇由打線接合46、頂端 μ 一 - 4鏡面區5 8以及中心的雷射腔7 6所組成。如 二/、Π不雷射腔76是由兩氧化層78夾著一增益層80之 '°、、、"構所組成，其發射的雷射光線8 2由雷射二極體之 522668 五、發明說明（7) 1C晶片40所產生。 第5圖為本發明自動對準式之整合型 |§ 6 0與其内部組件配置的放大截面示意圖，包务态中容 内部之光纖連接器70、一對引導桿36、微容器與其 對隔離棒48、1C晶片4〇以及矽基板30的安=陣列5〇、一 60經由引導桿36以及電路板小孔38連接到配置。此容器 1C晶片40與石夕基板30之間則利用銲錫凸 ^路板20， 其^基板30以及容器6Q壁之間所形成的惰氣腔接。 性氣體（如氮氣）。第6圖為本發明自動對準式敕人滿、惰 電收發器中容器60與其内部組件配置的截面細部；:型一光立 圖、，模擬雷射光線82進入雷射二極體前通過^ 微透鏡鏡面98以及氮氣氣氛88情形的模型。雨生二同、 :係透過雷射二極體之IC晶片4〇所提供的銲：凸= 基板30表面的接合墊（無圖示）以產生對準能力。Λ 另一層次的自動對準能力係利用本發明的機械機制， 如弟7圖所不之光纖連接器7〇、微透鏡陣列5〇、帝 體之1C晶片40以及矽基板3〇的配置圖。在微透鏡陣列“ 面9 2和矽基板3 〇頂端表面9 4至少具有四個以上的凹桦-微透鏡陣列50和矽基板30表面之凹槽9〇互相為鏡像^稱: 經過組裝後，四個以上預先決定直徑的隔離球丨〇〇在微 鏡陣列50和矽基板30表面之凹槽9〇間形成物距以提供兩者 自動對準的作用，如第8圖所示之本發明自動對準式之整 口型光電收發器的微透鏡陣列和矽基板間機械對準機制放 大截面圖。需注意，在第7圖中雷射二極體與矽基板利用The rod 36 passes, and the other end of the guide rod 36 is drawn in the center hole 64 of the lead V 62. It is known that the knife is connected to the pillar in the container 60. FIG. 3 shows the automatic alignment type integration of the present invention. Type B: as shown in Fig. 3 ', a plurality of 1C chips 4. , '2 includes the use of 46 ^ ^ ^ ^ 30 # ^ ^ 1〇 ^ 4〇f ^ LI and :: bu =; B "Besides, it is a ZC chip for the signal amplifier of the private state Λ. Therefore, the chip uses The solder bump 44 (as shown in FIG. 2) is connected to the Shixi substrate 30, and the Shixi base two counter 30 is connected to the L-shaped circuit board 2 by using wire bonding 34. The slices 40, 42, 52, and 54 are only As a reference for the legend, any of the: 1; 1C chip can be used for the integrated light of the automatic alignment type of the present invention. The fourth figure is the alignment of the automatic alignment type of the present invention ==, micro lens array 5 °, laser Diode I .: Two fibers?! # 隹 Set drawing. The optical fiber connector 70 introduces optical fiber 74 inside, light and cut 7 4 collected by the laser 1 + Μ plane ^ pole limb 1C said film 40 The 1C wafer 40, which is projected onto the mirror surface area 56 of the microlens mirror, is composed of wire bonding 46, the top μ-4 lens area 5 8 and the center laser cavity 76. The cavity 76 is composed of two layers of oxide layer 78 sandwiching a gain layer 80, and the laser beam 8 emitted by the laser diode 82 is 522668 of the laser diode. 5. Description of the invention (7) 1C wafer 40. Section 5 This is an auto-aligned integrated type of the invention | § 60 and an enlarged cross-sectional view of the internal component configuration, including the optical fiber connector 70, a pair of guide rods 36, a microcontainer and its pair of isolation bars 48, 1C The array 40 of the chip 40 and the silicon substrate 30 are connected to the configuration via the guide rod 36 and the circuit board hole 38. The container 1C chip 40 and the stone substrate 30 are soldered to the circuit board 20 The inert gas cavity formed between the substrate 30 and the wall of the container 6Q. The gas (such as nitrogen) is shown in Figure 6. Figure 6 shows the container 60 and its internal components in the automatic alignment type full-crowded, inert electrical transceiver of the present invention. Configuration cross-section details: Model 1 light elevation, a model that simulates the situation where laser light 82 passes through the laser diode ^ micro lens mirror 98 and nitrogen atmosphere 88. Yusheng II is the same:: It is through the laser II Welding provided by the IC chip 40 of the polar body: convex = bonding pads (not shown) on the surface of the substrate 30 to generate alignment capability. Λ Another level of automatic alignment capability is using the mechanical mechanism of the present invention, such as 7 the optical fiber connector 70, micro lens array 50, The layout of the Teikoku 1C chip 40 and the silicon substrate 30. There are at least four concave birch-microlens arrays 50 and the surface of the silicon substrate 30 on the micro lens array "face 92 and the silicon substrate 30 top surface 9 4 The grooves 90 are mirror images of each other. After the assembly, four or more isolation balls with a predetermined diameter are formed. An object distance is formed between the grooves 90 on the surface of the micromirror array 50 and the silicon substrate 30 to provide both. The function of automatic alignment is as shown in FIG. 8, which is an enlarged cross-sectional view of the mechanical alignment mechanism between the microlens array and the silicon substrate of the automatic alignment type full-size photoelectric transceiver of the present invention. Please note that in Figure 7, the laser diode and the silicon substrate are used.

第10頁 522668 五、 凸 石夕 器 該 非 圍 發明說明（8) 塊達到自動對準功㊣，並利 、 基板的接合墊96造成電性連接。、凌接合46雷射二極體與 本發明提供一種新的自動 ，係利用覆晶技術以及機械 二之整合型光電收發 架構已詳細描繪於第！圖至第8圖達到自動對準的功能， 以上所述者，僅為本發士 用來限定本發明的實施範？的較佳實施例而已，並 所作的均等變化與修飾：二,f發明申請專利範 白為本發明專利範圍所涵蓋。 522668 圖式簡單說明 第1圖為本發明自動對準式之整合型光電收發哭的夂 關鍵組件之配置圖； & - 、σ 第2圖為本發明自動對準式之整合型光電收哭士 於容器内之主要組件之截面圖； X扣、、且衣 第3圖為本發明自動對準式之整合型光電收發器之複 數個晶片、石夕基板及電路板的配置圖； “第4圖為本發明自動對準式之整合型光電收發器中 纖連接器、微透鏡陣列、雷射二極體之I C晶只 \ 的配置圖； 片以及矽基板 第5圖為本發明自動對準式之整合型光 器與其内部組件配置的放大截面示意圖； 叙态中容 第6圖為本發明自動對準式之整合 器與其内部組件配置的截面細部放大示意見收發器中容 第7圖為光纖連接器、微透鏡陣列^ ， 晶片以及矽基板的配置圖；及 田射二極體之I c 第8圖為本發明自動對準式之整合 透鏡陣列和矽基板間機械對 ，光電收發器的 【圖式符號說明】 放大截兩圖。 10 光電收發器 20 L型電路板 22 散熱裝置 24 L型電路板水平部分 26 L型電路板水平部分底面 28 導線配置 第12頁 522668 圖式簡單說明 30 $夕基板 32 垂直電路板 34 打線接合 36 引導桿 38 電路板小孔 40 I C晶片 42 I C晶片 44 焊錫凸塊 46 打線接合 48 隔離棒 50 微透鏡陣列 52 I C晶片 54 I C晶片 56 頂端鏡面區. 58 底部鏡面區 60 容器 62 支柱 64 中心小孑L 66 容器上板 68 容器底板 70 光纖連接器 72 容器兩邊側板 74 光纖 76 雷射腔Page 10 522668 V. Convex Stone Device Description (8) The block achieves the function of automatic alignment and facilitates the electrical connection of the bonding pad 96 of the substrate. The Ling junction 46 laser diode and the present invention provide a new automatic, which uses flip chip technology and mechanical two integrated photoelectric transceiver architecture has been described in detail! Figures 8 through 8 achieve the function of automatic alignment. The above are only used by the author to limit the implementation of the present invention? Only the preferred embodiments, and the same changes and modifications are made: Second, the patent application for f invention is covered by the scope of the invention patent. 522668 Brief description of the diagram. The first diagram is the configuration diagram of the key components of the automatic alignment type integrated photoelectric transceiver according to the present invention. &Amp;-, σ The second diagram is the automatic alignment type integrated photoelectric receiver according to the present invention. Sectional view of the main components of the driver in the container; X buckle, and garment Figure 3 is the layout diagram of the multiple wafers, Shi Xi substrate and circuit board of the self-aligning integrated photoelectric transceiver of the present invention; Fig. 4 is an arrangement diagram of the IC connector of the fiber optic connector, micro-lens array, and laser diode of the self-aligned integrated photoelectric transceiver according to the present invention; Fig. 5 and the silicon substrate An enlarged cross-sectional view of a quasi-type integrated optical device and its internal component configuration; Figure 6 of the narrative content is an enlarged cross-sectional view of the automatic alignment type integrated device and its internal component configuration. It is a layout diagram of a fiber optic connector, a micro lens array ^, a chip, and a silicon substrate; and Ic of a field-emitting diode Fig. 8 is an automatic alignment type mechanical alignment between the integrated lens array and the silicon substrate according to the present invention. Device Explanation of formula symbols] Enlarge and cut two pictures. 10 Photoelectric transceiver 20 L-shaped circuit board 22 Heat sink 24 L-shaped circuit board horizontal part 26 L-shaped circuit board horizontal part bottom 28 Wire configuration page 12 522668 Simple illustration 30 $ 夕Substrate 32 vertical circuit board 34 wire bonding 36 guide rod 38 circuit board hole 40 IC chip 42 IC chip 44 solder bump 46 wire bonding 48 spacer 50 micro lens array 52 IC chip 54 IC chip 56 top mirror area. 58 bottom mirror Zone 60 Container 62 Pillar 64 Center Small L 66 Container Top Plate 68 Container Bottom Plate 70 Fiber Optic Connector 72 Side Plates on Both Sides of the Container 74 Fiber 76 Laser Cavity

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Claims (1)

522668 六、申請專利範圍 i•-種自動對準式之整合型光電收發器，其包 —L型電路板，由一垂直部分和一 成，該垂直部分具有一外部平面 "77 形 具有一配置複數個導電線路之底部^ 遠水平部分 Μ 板（S1丨1⑽咖屬⑴構1於前述電路拓 的，直部分外平面之表面，該石夕基板之表面呈有至^ 片； ％ 1貝松杰之積體電路（Ic)晶 一微透鏡陣列，其平行於哕其 極體； T於忒矽基板亚對準該雷射二 一光纖，透過一光纖連接器以輸出或輸入一 號；及 尤訊 一容器，將該矽基板、該複數個j c晶片、該 陣列，及該光纖連接器加以結合形成—對準架構:透鏡 2· : : ΐ專：？圍第1項所述之自動對準式之整合型光+ 收叙态，其中更句今一 |土疋兒 之表面上方，用來謳兮兮矽:衣置於忒水平電路板 L型電路板之L型結構。 及支撐該 3,如申5青專利範圍笛1 Tg 、+、 收發器，其中更包入、、之自動對準式之整合型光電 板與该L型電路板。 逆接邊石夕基 4 ·如申晴專利範圍第1 、、 收發器，其中該複數個ic'動對準曰式之整合型光電 供該複數個I c晶片#曰曰片更含有銲錫凸塊，用以提 曰片與該矽基板間的電性連接。522668 6. Application scope i • -A type of self-aligning integrated photoelectric transceiver, the package of which is an L-shaped circuit board consisting of a vertical section and a vertical section, the vertical section has an external plane " 77 shape has a The bottom of the plurality of conductive lines is provided with a ^ far horizontal portion of the M plate (S1, 1), which is a straight part of the surface of the aforementioned circuit topology, and the surface of the Shixi substrate has up to ^ pieces; Songjie's integrated circuit (IC) is a micro-lens array, which is parallel to the polar body; T sub-aligns the laser 21 fiber on the silicon substrate and passes a fiber connector to output or input the number one; And a container of Youxun, combining the silicon substrate, the plurality of jc chips, the array, and the optical fiber connector to form an alignment structure: lens 2 ·:: Aligned integrated light + narrative state, which is more sentenced above the top of the surface of the earth, for the sake of silicon: clothes are placed on the L-shaped structure of the L-shaped circuit board of the horizontal circuit board. And support The 3, such as the application of 5 patents, 1 Tg, +, transceiver, An integrated photovoltaic panel with an automatic alignment type and an L-shaped circuit board included in the mid-range, and the reverse-connected side Shi Xiji 4 · Shenqing Patent No. 1 and Transceiver, among which a plurality of ic 'moving pairs The quasi-integrated integrated optoelectronics are provided for the plurality of IC chips. The chip further includes solder bumps for improving the electrical connection between the chip and the silicon substrate. 第15頁 522668 /、、申請專利範圍 —一 5·如申請專利範圍第丨項所述之自動對準式之整人型光+ :其中該複數個IC晶片利用銲錫凸塊自：對“ 6.如申請專利範圍第丨項所述之自動對準式之 收發器，其中更包含： 。J先电 透鏡的凹槽，分別形成在該石夕基板表面及該微 迓 '兄皁列底面，該矽基板和該微透鏡陣 之凹槽彼此成—鏡像對稱；及 衣後，兩者 四個以上的隔離小球，置放於該矽基板和哕彳％锈& 陣列對稱的凹桿之門站兮故甘』a a |和。亥彳政透鏡 列。 钇之間使该矽基板自動對準該微透鏡陣 U t請專利範圍第i項所述 r lj:該複數⑽晶片之功能係包含雷 “申體驅動器、訊號放大器。 收發器，並中：叙項所述之自動對準式之整合型光電 基板達到電性連^晶片係利用打線接合，與該石夕 9 ·如申請專利筋= 收發器，該矽基板\所^述之自動對準式之整合型光電 棒，在該矽基：和；2=陣列間具有至少兩個隔離 間。 矛邊嘁透鏡陣列間保持一段預留的空 1 0 ·如申請專利笳囹$ 收發器，其中該c之自動對準式之整合型光電 複數個銲锡球。板水平部分底面之傳導線路係為Page 15 522668 /, patent application scope-a 5 · as described in the scope of the patent application, the whole alignment of the whole human type light +: wherein the plurality of IC chips using solder bumps from: to "6 The self-aligning transceiver as described in item 丨 of the patent application scope, which further includes:. The grooves of the first electric lens are respectively formed on the surface of the Shixi substrate and the bottom surface of the micro-column column, The grooves of the silicon substrate and the microlens array are mirror-symmetrical to each other; and after the dressing, four or more isolation spheres of the two are placed on the silicon substrate and the 哕 彳% rust & array symmetrical concave rod. The gate is standing, so it ’s ‘aa’ and ’. The lens array is aligned between yttrium. The silicon substrate is automatically aligned with the micro lens array. U t Please refer to item i of the patent scope. Contains Ray's body driver, signal amplifier. Transceiver, and in the middle: the automatic alignment type integrated optoelectronic substrate described in the item described above achieves electrical connection. The chip is bonded by wire bonding with the stone Xi 9 · If the patented rib = transceiver, the silicon substrate \ ^ The self-aligning integrated photoelectric rod described above, in the silicon base: and; 2 = there are at least two isolation spaces between the arrays. A reserved space is kept between the spear edge lens arrays. 10 · For example, a patent application for a $ transceiver, where the c's self-aligning integrated optoelectronics has a plurality of solder balls. The conductive line on the bottom surface of the horizontal part of the board is 522668 六、申請專利範圍 Π·如申請專利範圍第1項所述之自動對準式之整合型光電 收發器，其中該容器由一上板、一底板所組成，該上 板及該底板分別嵌裝一中央各有一小孔的支柱，在組 裝光電收發器時使一對導桿分別通過該小孔。 1 2 ·如申請專利範圍第1項所述之自動對準式之整合型光電 收發器，其中該電路板的垂直部分在接近垂直部分頂 端和底部的地方，分別具有兩個可讓導桿通過的小 子L 。 1 3 ·如申請專利範圍第1 2項所述之自動對準式之整合型光 電收發器，其中更包含一對導桿，其一端通過該電路 板垂直部分的小孔，另一端則通過前述嵌裝於容器上 板與底板的支柱之中央小孔。 1 4 ·如申請專利範圍第丄項戶斤述之自動對準式之整合型光電 收發器，其中該光纖係為一光纖束。 1 5 ·如申請專利範圍第1項所述之整合光電元件的光電收發 裔’其中该石夕基板、該複數個I C晶片以及該微透鏡陣 歹J於、、且衣在遠容器内時係為互相平行。522668 6. Scope of patent application Π · The automatic alignment type integrated photoelectric transceiver as described in item 1 of the scope of patent application, wherein the container is composed of an upper plate and a bottom plate, and the upper plate and the bottom plate are respectively embedded A pillar with a small hole in the center is installed, and a pair of guide rods are passed through the small holes when the photoelectric transceiver is assembled. 1 2 · The self-aligning integrated optical transceiver as described in item 1 of the scope of patent application, wherein the vertical part of the circuit board is near the top and bottom of the vertical part, and each has two guide rods for passing Kid L. 1 3 · The self-aligning integrated optical transceiver as described in item 12 of the patent application scope, which further includes a pair of guide rods, one end of which passes through a small hole in the vertical portion of the circuit board, and the other end passes through the aforementioned Embedded in the central small hole of the pillar of the upper plate and the bottom plate of the container. 1 4 · The self-aligning integrated optical-electrical transceiver described in item (2) of the patent application scope, wherein the optical fiber is an optical fiber bundle. 1 5 · The optoelectronic transceiver with integrated optoelectronic elements as described in item 1 of the scope of the patent application, wherein the Shixi substrate, the plurality of IC chips, and the microlens array are used when they are in a remote container. For each other. 第17頁Page 17