TW518649B - Substrate container with non-friction door element - Google Patents
Substrate container with non-friction door element Download PDFInfo
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- TW518649B TW518649B TW091101720A TW91101720A TW518649B TW 518649 B TW518649 B TW 518649B TW 091101720 A TW091101720 A TW 091101720A TW 91101720 A TW91101720 A TW 91101720A TW 518649 B TW518649 B TW 518649B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
518649 發明說明（1) 【發明領域】 半i ϊ Γ係有關於一種SMIF系統，用以於無塵環境中製造 密封拖f置，尤其係有關於一種SMIF系統，具有非摩擦的 r /機構’以免於作業時產生微粒。 【先前技術】 被^ ^來，於一基板上製造半導體元件之技術業已廣泛的 造過程。舉例而言，於半導體晶圓或液晶顯示器基板之製 ^ ^壬中’一晶圓或一玻璃基板係於無塵環境内進行加工 〃以便於製造半導體裝置或平版顯示器（Flat panel p ay ; FPD)，例如液晶顯示器（iiquid c dlsplay) 〇 接t對於提供無塵的作業環境，Hewlett-Packard公司所 種標準機械介面（Standard Mechanical nterFace , SMIF)系統，揭示於美國專利第4, 532, 97〇號 :^^4’534,389號。別11?系統的目的係在於降低該半導 μ製造，程中，儲藏及輸送該晶圓時，於半導體晶圓上的 微粒通2；。達成此一目的的手段中，部分係藉由機巧 保於儲藏及輸送時，環繞該晶圓之氣體媒介（空氣或^^ 基本上相對於該晶圓係靜止的，以及部分藉由確保來自周 界環境之微粒不致於進入晶圓環境中。 一SMIF具有三個主要的構件：（丨）小體積的密封艙（晶圓 盒或基板盒）’用以儲藏及輸送基板及/或基板匣；（2)一 輸入/輸出（I / 0)的微小環境，定位於一半導體加工設備 上’藉以提供一縮小的潔淨空間（用以充填潔淨空氣），用518649 Description of the invention (1) [Field of the invention] The semi-i ϊ Γ system is related to a SMIF system, which is used to manufacture a sealed unit in a dust-free environment. In particular, it is related to a SMIF system with a non-friction r / mechanism. In order to avoid particles during operation. [Prior art] The technology of manufacturing semiconductor elements on a substrate has been extensively manufactured. For example, in the manufacture of semiconductor wafers or liquid crystal display substrates, a wafer or a glass substrate is processed in a dust-free environment to facilitate the manufacture of semiconductor devices or flat panel displays (Flat panel p ay; FPD ), Such as a liquid crystal display (iiquid c dlsplay). For providing a dust-free working environment, the standard mechanical interface (Standard Mechanical nterFace, SMIF) system of Hewlett-Packard Company is disclosed in US Patent No. 4,532,97. No .: ^^ 4'534,389. The purpose of the 11? System is to reduce the manufacturing of the semiconducting μ, during the storage and transportation of the wafer, the particles on the semiconductor wafer pass through; Among the means to achieve this, part is to keep the gas medium (air or ^^ basically stationary relative to the wafer system) around the wafer during storage and transportation by ingenuity, and part of it The particles in the environmental environment will not enter the wafer environment. A SMIF has three main components: (丨) a small volume sealed compartment (wafer box or substrate box) 'for storing and transporting substrates and / or substrate boxes; (2) An input / output (I / 0) micro-environment is positioned on a semiconductor processing facility to provide a reduced clean space (for filling clean air) with
P01-187.ptd 第5頁 518649 五、發明說明（2) 以將需要輸入该加工設備内部，或由該内部輸出之晶圓或 晶圓匣，容納並暴露於其中；以及（3) —介面，用以於該 SM I F搶與該SM I F之微小環境間，輸送晶圓及/或晶圓匣， 且不致將該晶圓或匣暴露於微粒中。較佳之別丨F系統之進 一步細節，描述於Mihir Pari kh以及Ulrich Kaempf所著 之論文ff SMIF : —種用於VLSI製造中晶圓匣輸送之技術 (SMIF: A Technology For Wafer Cassette Transfer In VLSI Manufacturing)” 中，發表於Solid StateP01-187.ptd Page 5 518649 V. Description of the invention (2) To contain and expose the wafers or cassettes that need to be input into or output from the processing equipment; and (3) —Interface To transfer wafers and / or cassettes between the SM IF and the small environment of the SM IF without exposing the wafer or cassette to particles. Better yet 丨 Further details of the F system are described in a paper by Mihir Pari kh and Ulrich Kaempf ff SMIF: a technology for wafer transfer in VLSI manufacturing (SMIF: A Technology For Wafer Cassette Transfer In VLSI Manufacturing ) "In Solid State
Technology， 1 984 年 7 月號第 111 至 115 頁。 衫響别述型式之系統之微粒尺度範圍，係由低於〇 · 〇 2微 米至咼於2 0 0微米。具有這些尺度的微粒對於半導體的加 工係相當危險的，因為所製造之半導體裝置係為小尺度 的現今所使用的進階半導體製程，使用〇 · 5微米或更低 ♦的尺度。不良的污染物微粒，尺寸大於〇 · 1微米，就大體 上會影響1微米尺寸的半導體裝置。當然，半導體加工的 尺度係愈趨微小，現今在研發實驗室中已經發展出接 1微米或更低的尺度。未來，半導體的尺寸將更形微4賞:· 而更微小的污染微粒甚至分子將產生重要的影響。 SM IF艙大致上包括一艙門，與艙外殼配合，藉以提供一 密封的環境，可儲存及輸送晶圓或基板。已知的所謂，/底 部開啟π 艙（bottom opening unified p〇d : B0UP)中，該 搶門係水平的放置於該艙之底部，且該晶圓為一 £所支/ 樓’再接著為該艙門所支撐。”前方開啟”艙（fr〇nt opening unified pod : F0UP)亦係已知的，其中該搶係位Technology, July 1984, pp. 111-115. The particle size range of the shirt-speaking system is from less than 0.2 micrometers to less than 200 micrometers. Particles with these dimensions are very dangerous for semiconductor processing systems, because the semiconductor devices manufactured are small-scale advanced semiconductor processes used today, using dimensions of 0.5 micron or less. Defective contaminant particles, larger than 0.1 micron in size, will generally affect semiconductor devices of 1 micron size. Of course, the scale of semiconductor processing is getting smaller and smaller, and the scale of 1 micron or lower has been developed in research and development laboratories. In the future, the size of semiconductors will be even smaller: · Smaller pollution particles and even molecules will have an important impact. The SM IF cabin roughly includes a cabin door that cooperates with the cabin shell to provide a sealed environment for storing and transporting wafers or substrates. In the so-called bottom opening unified pod (bottom opening B0UP), the door grabbing system is horizontally placed on the bottom of the compartment, and the wafer is one pound per floor / floor. The hatch is supported. "Front opening unified pod (F0UP)" is also known, in which the grab position
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於一垂直平面上，且該晶圓係支撺在固定於該舱之一g 中，或成架的固定於艙外殼上。不論前方開啟或底部開 啟’艙門皆包括一内部表面’包含於該艙的密封環境的一 部份，以及一外部表面暴露於該晶圓麻的環境中。 為了於一 S ΜI F艙與一晶圓廠之一加工設備間輪送晶圓， 通常該艙係由手動或自動的裝載於該設備前端之一負載口 上。該加工設備包括一取得口，當艙未固定於其上時，係 為一覆蓋門所覆蓋，該覆蓋門包括一外部表面暴露於該晶 圓廠環境中，以及一内部表面係為該加工設備中密封環境 的一部份。該SM I F艙係密封於該負載口，如此該搶門與該 覆蓋門係為相鄰。重合銷（r e g i s t r a t i 〇 n p i η)係位於該覆 蓋門上，與艙門之孔配對，藉以確保該艙門相對於該 門正確的對齊。 、 一旦該艙定位於該負載口上，該覆蓋門中之機構會將該 艙Ρ由該艙外殼上卸下，並將該艙門及覆蓋門一起移動進 〇该加工設備中，然後該兩門會被收起遠離該晶圓傳丨^^ ^。知外殼保持與該介面口接近，藉以保持一潔淨環: 2其包括該加工設備與該艙外殼之内部。於該加工設備 之一晶圓操作機械手臂之後接近該艙中所支撐之該個別 的，圓，藉以於該艙及該加工設備間輸送晶圓。 $重要的是提供一無塵的環境，包圍該加工機械中之該 二路的$圓。雖然於該晶圓廠中空氣通常會過濾至某一等 $ ’但環繞該加工設備與SMIF艙的環境還是較該設備與該 内’具有較高程度的微粒與污染物。因此，將SM丨F艙及On a vertical plane, and the wafer is supported in one g of the cabin, or fixed on the shell of the cabin. The 'cabin door, whether opened front or bottom, includes an internal surface' which is part of the sealed environment of the cabin, and an external surface is exposed to the wafer hemp environment. In order to rotate wafers between an S MI F compartment and a processing facility in a fab, the compartment is usually loaded manually or automatically on a load port at the front of the device. The processing equipment includes an access port, which is covered by a cover door when the cabin is not fixed to it, the cover door includes an external surface exposed to the fab environment, and an internal surface is the processing equipment Part of a sealed environment. The SM I F cabin is sealed at the load port so that the grab door is adjacent to the cover door. The reclosing pin (r e g i s t r a t i 〇 n p i η) is located on the cover door and is matched with the hole of the hatch to ensure that the hatch is properly aligned with respect to the door. Once the cabin is positioned on the load port, the mechanism in the cover door will remove the cabin from the cabin shell, and move the cabin door and cover door together into the processing equipment, and then the two doors Will be stowed away from the wafer. ^^^ ^. It is known that the outer shell is kept close to the interface port so as to maintain a clean ring: 2 It includes the processing equipment and the interior of the cabin shell. After a wafer handling robotic arm of one of the processing equipments approaches the individual round supported in the cabin, the wafer is transported between the cabin and the processing equipment. It is important to provide a dust-free environment that surrounds the two roads in the processing machine. Although the air in the fab is usually filtered to a certain level, the environment surrounding the processing equipment and the SMIF cabin still has a higher degree of particles and pollutants than the equipment and the interior. Therefore, the SM 丨 F cabin and
518649 五、發明說明（4) 加工設備之内部保持高潔靜度是相當重要的步驟。 舉例而θ ’2000年8月22日，頒予Fujimori等人之美國 專利第6, 105, 782號，併入本文以為參考，其揭示一種精 雄、基板之儲存容器 l〇(St〇rage container for precision substrates)，顯示於第1圖中。該容器包括一艙I〗，用 以谷納夕個晶圓’以及一中空的門元件2 〇，用以密封的關 閉該艙11之開啟的前端。該艙U另具有一機械手臂凸緣12 以便位於上方的機械手臂輸送該艙丨丨，以及一 γ形之底板 17用以支撐該艙11。該門元件20包括係由一内板24及一外 板22所構成。該門元件20另具有一密封裝置26，用以於該 ^2〇關閉時密封該艙丨丨、一導向裝置28用以與該艙丨丨上之 導向裝置18相配合、以及一鎖定裝置23用以可開啟的將該 ^ =件20固定於該艙11上。如前所述，該艙11需要極高的 潔淨度’但該鎖定裝置23與該導向裝置1 8皆會於該門開啟 或關閉之過程中產生摩擦，而因此可能產生微粒，而降低 加工的可靠度。 ，樣的’於2〇〇1年7月17日頒予Fosnight等人之美y 利第6,261，044 81號、2000年9月26日頒予丫〇七311111〇14^人 之美國專利第6, 1 23, 1 20號、20 0 0年8月8日頒予Okada等人 之美國專利第6,〇98,809號、以及2000年4月25日頒予 Che^g之美國專利第6, 053, 688號中，揭示不同的SMIF艙以 及糸、、先’用以加工基板。然而，前述之專利，併入本文以 為參考’亦未能提供適當的門構件，以避免於該門構件開 啟與關閉之過程中產生微粒。518649 V. Description of the invention (4) Maintaining high cleanliness inside the processing equipment is a very important step. For example, θ 'Aug. 22, 2000, U.S. Patent No. 6,105,782, issued to Fujimori et al., Which is incorporated herein by reference, discloses an elite, substrate storage container 10 (StOrage container for precision substrates), shown in Figure 1. The container includes a compartment I for wafers and a hollow door element 20 for hermetically closing the open front end of the compartment 11. The capsule U also has a robot arm flange 12 for the robot arm located above to transport the capsule 丨 and a γ-shaped bottom plate 17 for supporting the capsule 11. The door element 20 includes an inner panel 24 and an outer panel 22. The door element 20 further has a sealing device 26 for sealing the compartment when the ^ 20 is closed, a guide device 28 for cooperating with the guide device 18 on the compartment, and a locking device 23 The ^ = piece 20 is fixed on the cabin 11 by an openable member. As mentioned before, the cabin 11 requires extremely high cleanliness', but the locking device 23 and the guide device 18 both generate friction during the door opening or closing process, and thus may generate particles, which reduces the processing Reliability. No. 6,261,044 No. 6,261,044 81 issued to Fosnight et al. On July 17, 2001, and U.S. Patent No. 6,311,111,014 ^ issued on September 26, 2000 No. 1, 23, 120, U.S. Patent No. 6,008,809 issued to Okada et al. On August 8, 2000, and U.S. Patent No. 6,053 issued to Che ^ g on April 25, 2000 In No. 688, different SMIF capsules and 糸, 先 are used to process substrates. However, the aforementioned patent, incorporated herein by reference ', also failed to provide an appropriate door member to prevent particles from being generated during the opening and closing of the door member.
P0M87.ptdP0M87.ptd
518649 五、發明說明（5) 如前所述，便有需要提供一種SMiF艙及 擦式的門元件，以藉此避免於該門元# ^ 有非摩 微粒。 /門兀件開啟或關閉時產生 【發明概要】 本發明之主要目的係提供一鍤 容器，具有密封的空間用以容納4體2 = 板 板，該基板容器具有非摩擦的門 ^』不益基 器，並避免產生微粒的產生。牛用M密封該基板容 本發明之次要目的在於提供一種輸送 工設備所提供之一潔淨環境盥一美柄六„ 用以於一加 圓或顯示器基板。 ，、土板谷益間輸送半導體晶 為達上述目的，本發明提供一種具有盔 以，用以輸送工件，其包括：-驗本體 工間用以容納該工件’以及—開口且、-有内部 於該艙本體之一端面乂 =久磁鐵’成形 件，形成-㈣夕m : ·以關閉該杯 該開口之t^衣兄，一電磁鐵，位於該門元件，鱼 相連接，相對應；以及一連接器，與-外部電源 件。 可技制的啟動該電磁鐵，並藉此開啟該門元，、 以Ξίΐ:明2 -觀：’本”提供-種輪送I置，用 内部空八匕括.一基板容器具有一艙本體，且有 成形；；：以容納該工件，以及-開口具有-：久；：— s亥艙本體之一端面、-門元件，且有^磁鐵， /、有一磁性材料， P0l-187.ptd 第9頁 518649 接器， 連接器 電磁鐵 〇 本發明 納輸送 納該工 及一門 可控制 與該閥 成負壓 本發明 送工件 空間用 端面、 一閥門 門機構 過該閥 本體， 所述， 導體或 ’本發 :一艙 口，成 内板及 空源相 可控制 本體， ，本發 基板容 ，以及 ，具有 多個開 器與該 體内部 件，而 該基板 造過程 二磁：相對應’並與該永久磁 ^ 形成一密封之環境、一 3 σ之永久磁鐵相對應、以 鐵；以及一卸門機構， J接益相連接，用以可控制的 遠門元件，並藉此輸出或輸入 明提供 本體， 形於該 一外板 連接， 孔，與 門元件 空間中 輸出或 艙以及 ，提供 五、發明說明（6) 與該驗本體之 鐵共同作用， 磁鐵，位於該 及一連 具有一 啟動該 該工件 根據 用以容 用以容 面；以 閥門， 開孔， 間中形 根據 用以輸 一内部 體之一 板具有 及一卸 用以透 封該艙 如前 夠為半 該開口處之永 以關閉該門元 門元件上，與 與電性連接至 與該門元件之 ’並藉此開啟 之又另一觀點 工件，其包括 件，以及一開 元件，具有一 的與一外部真 門相連，藉此 ，以封閉該艙 之再另一觀點 ，其包括：一 以容納該工件 以及一門元件 ，該内板具有 ，具有一連接 門控制該艙本 或開啟該門元 根據本發明之 液晶顯示器製 一種基板 具有一内 艙本體之 ，該外板 該内板具 的於該艙本體之 形成一密封之環 明提供一種輸送 器具有一搶本體 一開口，成形於 一内板及一外板 該閥門相 之閥門相 之壓力， 輸入該工 該SMIF系 容器， 部空間 一端 具有一 有多個 内吾ρ空 境。 裝置， ，參有 該翁本 ，該外 連；以 連接， 藉以密 件。 統，能 ’具有 加工空間518649 V. Description of the invention (5) As mentioned above, it is necessary to provide an SMiF cabin and a wiping door element, so as to avoid non-friction particles in the door element # ^. / The door element is generated when the door is opened or closed. [Summary of the invention] The main purpose of the present invention is to provide a container with a sealed space for accommodating 4 bodies. 2 = board, the substrate container has a non-friction door. Base and avoid generation of particles. The cow uses M to seal the substrate. The secondary purpose of the present invention is to provide a clean environment and a beautiful handle provided by conveyor equipment. It is used to round or display substrates. In order to achieve the above object, the present invention provides a helmet for conveying a workpiece, which includes:-an inspection body workshop for accommodating the workpiece; and-an opening; and-having an inner end surface inside one of the cabin bodies A magnet 'shaped part to form -㈣xim: To close the opening of the cup, a t-shirt, an electromagnet, which is located on the door element, is connected to the fish, and corresponds; and a connector, which is connected to an external power source The electromagnet can be technically activated, and the door element can be opened by means of the following: 明 2: View: 'Ben' provided-a kind of carousel I set, with an internal empty dagger. A substrate container has a The main body of the cabin is shaped, and: to accommodate the workpiece, and-the opening has-: long;--one end surface of the main body of the cabin,-the door element, and has a magnet, /, a magnetic material, P0l-187 .ptd Page 9 518649 Connector, connector solenoid According to the invention, the conveyance and the door can be controlled to form a negative pressure with the valve. The end surface for conveying workpieces in the present invention, a valve door mechanism passing through the valve body, said conductor or 'the hair: a hatch, into an inner panel And the air source phase can control the body, the base board capacity of the hair, and a plurality of openers and the body parts, and the base board manufacturing process of the two magnets: corresponding to and forming a sealed environment with the permanent magnet, A 3 σ permanent magnet corresponds to iron; and a door unloading mechanism, J is connected to control the remote door element, and the output or input is provided to provide the body, which is connected to the outer plate, The hole, with the output or compartment in the space of the door element, and providing five, the invention description (6) interacts with the iron of the inspection body, the magnet is located in the chain and has a start to start the workpiece according to the capacity of the surface; Valves, openings, and intermediate shapes are used to enter a plate of an inner body and to unload to seal the cabin as half as the opening to close the door element, And another electrically connected workpiece connected to the door element and opened therewith, including a piece, and an opening element, having a connection with an external true door, thereby closing the compartment According to still another aspect, it includes: a housing for accommodating the workpiece and a door element, the inner panel having a connecting door to control the hatch or opening the door element according to the liquid crystal display of the present invention; The outer plate and the inner plate form a sealed ring on the cabin body to provide a conveyor with an opening on the body, formed on an inner plate and an outer plate, and the pressure of the valve phase of the valve phase. This SMIF container is constructed with one inner space at one end of the space. The device, which involves the Ommoto, the external connection; the connection, so that the secret. System, can have processing space
P01-187.ptd 518649 五、發明說明（7) 相當面程度的潔淨度。再者，根據本發明之基板艙，於操 作日寸並無產生摩擦的元件，以避免微粒的產生，並藉此進 一步提高潔淨度。 為了。襄本發明之上述和其他目的、特徵、和優點能更明 顯特彳政’下文特舉本發明較佳實施例，並配合所附圖示， 作洋細說明如下。 【發明說明】 ，f參考第2a及2b圖，其中分別顯示根據本發明之一較 佳實施例之一基板艙5〇之立體示意圖，以及該基板艙5〇之 門70件之平面視圖。該基板艙50係為一SM IF (Standard M^c^iamcal InterFace)艙用以容納半導體晶圓或液晶顯 不器基板等平板顯示器之類的基板，以藉此一加工設備盥 送該基板，並提供無塵的環境。該基板擒Μ 精自動或軌道導向式車輛（Aut〇 〇r RaU Guided Vehicle)所搬運。 / 土板:fe50包括一艙本體η ，用以 ^開::;:空的門元件6。，密封的關閉】： 元=ΐ ; = ;6内6板6用4及-外板62所構成。該Η 於太州夕！在封裝置66 ’用以於該門60關閉時，盥,亥 = :端面58共同作用，藉以密封該餘本體心:亥 别”58係為—永久磁鐵，且該門元件6。之 二 内具有鐵金屬構件之類的磁性材 ' 由永久磁鐵之磁力作用而固定：：密件6〇可藉 心、且在封遠艙本體51。該門 P0M87.ptd 第11頁 518649 五、發明說明⑻ " '^-- 元件60具有一電磁鐵68，且該門元件6〇之外板62另具 $接器63用以與外部之一電源相連接，以控制該電：鐵 =。當該電磁鐵68啟動時，所產生的磁力係與該永久磁鐵 相排斥而藉此開啟該艙本體5 1。 現請參考第3a及3b圖，其中顯示根據本發明之另一實施 例之一基板艙80，與該基板艙50類似，其中類似的元件^ 不以類似的標號。該門元件9 〇包括包括一單向閥門9 3與一 夕夕卜部真空源可控制的相連接，且該門元件9〇之内板94 ^有 ^個開孔95。因此，當該連接器93與該真空源相連時\、該 舱本體8 1内部之空氣將為經由該閥門93排出，且藉此於該 舱本體81形成負壓，而將該門元件9〇密封固定於該搶本^ 81上。當欲開啟該門元件90時，僅需將該閥門93開啟，該 門元件9 0即可脫離該艙本體。 人 現請參考第4及5圖，其中顯示根據本發明之基板艙5〇應 用於一SMIF系統1〇〇之示意圖。該系統1〇〇包括一面板m 用以區分一加工設備側丨丨2以及一基板艙側丨丨4。該^挺搶 側114具有一卸載平台118，用以承載該基板艙5〇。胃^ 於該加工設備側1 1 2，該面板111具有一開口 1 2 2，其尺 寸大體上等同於該基板搶5〇之門元件之尺寸。該門元件 6 0係與該開口 1 2 2對齊，並且藉由提供正壓而防止污染物 進入該加工設備之潔淨室。該系統1 0 0另具有一卸門機 構’包括一平板132及一支撐桿134。該平板132可於一縮 回位置（如第4圖所示）及一伸出位置（如第4圖所示）間，並 藉由該支撐桿134支撐而移動。於該伸出位置，該平板132P01-187.ptd 518649 V. Description of the invention (7) Equivalent degree of cleanliness. Furthermore, according to the substrate compartment of the present invention, there are no components that generate friction during operation, so as to avoid the generation of particles and further improve the cleanliness. in order to. The above and other objects, features, and advantages of the present invention can be more obvious. The following describes the preferred embodiments of the present invention and the accompanying drawings in detail, as follows. [Explanation of the invention], f refers to Figures 2a and 2b, which respectively show a perspective view of a substrate compartment 50 according to a preferred embodiment of the present invention, and a plan view of 70 doors of the substrate compartment 50. The substrate compartment 50 is a SM IF (Standard M ^ c ^ iamcal InterFace) compartment for accommodating a substrate such as a flat panel display such as a semiconductor wafer or a liquid crystal display substrate, so as to convey the substrate by a processing equipment. And provide a dust-free environment. The substrate is carried by a precision automatic or orbit-guided vehicle (Autor RaU Guided Vehicle). / Soil plate: fe50 includes a cabin body η for ^ opening :::; empty door element 6. , Seal closed]: Yuan = ΐ; =; 6 inner 6 plate 6 is composed of 4 and-outer plate 62. The Η is in Taizhou Xi! When the sealing device 66 'is used to close the door 60, the toilet = hai =: the end face 58 cooperates to seal the Yu body core: haibei "58 is a permanent magnet, and the door element 6. inside Magnetic materials with ferrous metal components and the like 'are fixed by the magnetic force of permanent magnets: the confidential piece 60 can be taken for granted, and it is in the Fengyuan cabin body 51. The door P0M87.ptd page 11 518649 V. Description of the invention ⑻ & quot '^-Element 60 has an electromagnet 68, and the door element 60 has an external connector 62 with a connector 63 for connection to an external power source to control the electricity: iron =. When the electromagnetic When the iron 68 is started, the generated magnetic force repels the permanent magnet and thereby opens the cabin body 51. Please refer to FIGS. 3a and 3b, which shows a substrate cabin 80 according to another embodiment of the present invention. It is similar to the base plate compartment 50, in which similar elements ^ are not given similar reference numerals. The door element 90 includes a one-way valve 93 connected to a controllable vacuum source, and the door element 9 〇 内 板 94 ^ has ^ openings 95. Therefore, when the connector 93 is connected to the vacuum source \ 2. The air inside the cabin body 81 will be exhausted through the valve 93, and a negative pressure will be formed on the cabin body 81, and the door element 90 will be sealed and fixed on the grabbing plate 81. When it is desired to open the When the door element 90 is used, only the valve 93 needs to be opened, and the door element 90 can be disengaged from the cabin body. Please refer to Figs. 4 and 5, which show that the substrate compartment 50 according to the present invention is applied to a SMIF system. Schematic diagram of 100. The system 100 includes a panel m for distinguishing a processing equipment side 2 and a substrate compartment side 4 and the side 4. The grabbing side 114 has an unloading platform 118 for carrying the Substrate compartment 50. On the side of the processing equipment 1 12, the panel 111 has an opening 1 2 2 whose size is substantially the same as the size of the door element of the substrate 50. The door element 60 is connected with The openings 1 2 are aligned and prevent contaminants from entering the clean room of the processing equipment by providing positive pressure. The system 100 also has a door unloading mechanism 'including a flat plate 132 and a support rod 134. The flat plate 132 Available in a retracted position (as shown in Figure 4) and an extended position (as shown in Figure 4) ), And moved by being supported by the support rod 134. In the extended position, the flat plate 132
P01-187.ptd 第12頁 518649 五、發明說明（9) 可***該開口 1 2 2廿& 平板U2可具有該基板搶5〇之門元件6〇相喃合。該 接，並藉以控制/門接器;與制元件6〇之連接器63相連 當然，根據本；:月:件60之開啟與關閉。 於該SM㈣統丨GG巾之/1關之該基板細亦可應用 件之連接ϋ9Λ’/ 平板132具有連接器與該門元 提供該細負壓Άί藉以釋放該艙8〇中之負壓，或 ^ 、、 错以緊密的關閉該艙80。 夠戈本發明之該基板艙以及該SMIF系統，能 -步提高潔淨ί:的’件，以避免微粒的產生，並藉此進 定發前述較佳實施例揭#，然其並非用以限 範圍内，♦可“匕技藝者’在不脫離本發明之精神和 圍G後之更動與修改。因此本發明之保” ㈤田視後附之申請專利範圍所界定者 【 P〇l-187.ptd 第13頁 518649 圖式簡單說明 【圖示說明】 第1圖：為先前技術中之一基板之儲存容器之立體展開 透視圖。 第2a圖 : 為 根 據 本發 明 之 一 較 佳 實 施 例 之 — 基 板 艙 之 立 體展開透 視 圖 〇 第2b圖 為 第 2 a 圖 中 所 示 之 該 基 板 艙 之 門 元 件 之 部 分 剖 面平面視 圖 〇 第3 a圖 • 為 根 據 本 發 明 之 另 一 較 佳 實 施 例 之 一 基 板 艙 之 立體展開 透 視 圖 〇 第3b圖 • 為 第3a 圖 中 所 示 之 該 基 板 艙 之 門 元 件 之 平 面 視 圖。 第4 及5 圖 ; 根 據 本發 明 之 基 板 艙 應 用 至 _ 一 SMIF 系 統 之 立 體示意圖 〇 【圖號說 明 ] 10 精 密 基 板 之 儲 存 容 器 11 艙 12 凸 緣 1 !： !. 17 底 板 18 導 向 裝 置 l· 20 門 元 件 22 外 板 24 内 板 26 密 封 裝 置 28 導 向 裝 置 23 鎖 定 裝 置 50 基 板 艙 51 艙 本 體 60 門 元 件 58 前 端 面 62 外 板 63 連 接 器P01-187.ptd Page 12 518649 V. Description of the invention (9) Can be inserted into the opening 1 2 2 廿 & The flat panel U2 can have a gate element 60 for the substrate to be fused. This connection is used to control / gate connector; it is connected to connector 63 of control element 60. Of course, according to this :: month: piece 60 open and close. In the SM system, the base plate of the GG towel can also be connected with the components. The 9Λ '/ flat plate 132 has a connector and the door element to provide the fine negative pressure to release the negative pressure in the cabin 80. Or ^ ,, and wrong to close the cabin 80 tightly. The substrate compartment and the SMIF system of the present invention can improve the cleanliness step by step, to avoid the generation of particles, and to issue the above-mentioned preferred embodiment, but it is not limited. Within the scope, ♦ "Dagger artisans" can be changed and modified without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention is defined by the scope of the patent application attached to Putian Vision [P〇l-187 .ptd Page 13 518649 Brief Description of Drawings [Illustration] Figure 1: A perspective perspective view of a storage container of a substrate in the prior art. Fig. 2a is a perspective perspective development view of a substrate compartment according to a preferred embodiment of the present invention. Fig. 2b is a partial sectional plan view of the door element of the substrate compartment shown in Fig. 2a. Fig. a is a perspective development perspective view of a substrate compartment according to another preferred embodiment of the present invention. Fig. 3b is a plan view of a door element of the substrate compartment shown in Fig. 3a. Figures 4 and 5; The application of the substrate compartment according to the present invention to a SMIF system. [Illustration of the drawing number] 10 Storage container for precision substrates 11 Compartment 12 Flange 1!:!. 17 Base plate 18 Guiding device l · 20 Door element 22 Outer plate 24 Inner plate 26 Sealing device 28 Guide device 23 Locking device 50 Base plate compartment 51 Compartment body 60 Door element 58 Front end surface 62 Outer plate 63 Connector
P01-187.ptd 第14頁 518649 圖式簡單說明 64 内板 66 密封裝置 68 電磁鐵 80 基板艙 90 該門元件 93 單向閥門 95 開孔 100 S Μ I F糸統 111 面板 112 加工設備側 114 基板搶側 118 卸載平台 122 開口 132 平板 134 支撐桿P01-187.ptd Page 14 518649 Brief description of the drawing 64 Inner plate 66 Sealing device 68 Electromagnet 80 Base plate compartment 90 The door element 93 One-way valve 95 Opening 100 S IF system 111 Panel 112 Processing equipment side 114 Base plate Grab side 118 Unloading platform 122 Opening 132 Flat plate 134 Support rod
POl-187.ptd 第15頁POl-187.ptd Page 15
Claims (1)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW091101720A TW518649B (en) | 2002-01-30 | 2002-01-30 | Substrate container with non-friction door element |
| KR1020020046163A KR20030065275A (en) | 2002-01-30 | 2002-08-05 | Substrate container with non-friction door element |
| JP2002266077A JP2003229476A (en) | 2002-01-30 | 2002-09-11 | Substrate housing container with door member free from causing friction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW091101720A TW518649B (en) | 2002-01-30 | 2002-01-30 | Substrate container with non-friction door element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW518649B true TW518649B (en) | 2003-01-21 |
Family
ID=27752436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091101720A TW518649B (en) | 2002-01-30 | 2002-01-30 | Substrate container with non-friction door element |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2003229476A (en) |
| KR (1) | KR20030065275A (en) |
| TW (1) | TW518649B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107636243A (en) * | 2015-05-22 | 2018-01-26 | 应用材料公司 | Substrate carrier door component, substrate carrier and method including magnetic door seal part |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8424703B2 (en) | 2008-05-01 | 2013-04-23 | Brooks Automation, Inc. | Substrate container sealing via movable magnets |
| WO2009135144A2 (en) * | 2008-05-01 | 2009-11-05 | Blueshift Technologies, Inc. | Substrate container sealing via movable magnets |
| JP5015280B2 (en) * | 2010-02-26 | 2012-08-29 | Ｔｄｋ株式会社 | Substrate storage pod, lid member thereof, and substrate processing apparatus |
| JP5464235B2 (en) * | 2012-06-06 | 2014-04-09 | Ｔｄｋ株式会社 | Substrate storage pod, lid member thereof, and substrate processing apparatus |
| CN114743905B (en) * | 2022-04-19 | 2023-11-17 | 荣耀半导体材料(嘉善)有限公司 | Semiconductor wafer storage container |
-
2002
- 2002-01-30 TW TW091101720A patent/TW518649B/en not_active IP Right Cessation
- 2002-08-05 KR KR1020020046163A patent/KR20030065275A/en not_active Application Discontinuation
- 2002-09-11 JP JP2002266077A patent/JP2003229476A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107636243A (en) * | 2015-05-22 | 2018-01-26 | 应用材料公司 | Substrate carrier door component, substrate carrier and method including magnetic door seal part |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2003229476A (en) | 2003-08-15 |
| KR20030065275A (en) | 2003-08-06 |
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