TW516303B - Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like - Google Patents

Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like Download PDF

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Publication number
TW516303B
TW516303B TW090101670A TW90101670A TW516303B TW 516303 B TW516303 B TW 516303B TW 090101670 A TW090101670 A TW 090101670A TW 90101670 A TW90101670 A TW 90101670A TW 516303 B TW516303 B TW 516303B
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Taiwan
Prior art keywords
marking
laser
marked
laser light
item
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TW090101670A
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Chinese (zh)
Inventor
Joseph P Downes
J Miles Kane
Frank B Hunt Jr
Rainer Schramm
Donald J Svetkoff
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Gen Scanning Inc
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/47Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/544Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)

Abstract

A laser scanning method and system for marking articles is provided wherein control is provided by a single central controller. The system includes a conveyor for conveying the articles in a first direction at a marking station. A conveyor controller controls the conveyor in response to conveyor control signals. A laser and an optical subsystem are optically coupled to the laser for generating a focused laser beam in response to laser control signals. A scan head includes a laser beam deflector for steering the focused laser beam along two substantially orthogonal intersecting axes at the marking station to mark a first predetermined region on at least one of the articles in response to deflection control signals. An actuator is coupled to at least part of the scan head for displacing the axes in a second direction substantially orthogonal to the first direction at the marking station in response to displacement control signals wherein the laser beam deflector steers the focused laser beam along the displaced axes to mark a second predetermined region on the at least one article. A central controller is provided for generating the deflection control signals, the laser control signals, the displacement control signals and the conveyor control signals in response to input data representing marking locations and marking content.

Description

516303 A7 部 智 慧 財 費 印 4Ί 五、發明說明( <發明之技術領域> 本發明係有關一種用以標示例如印刷電路板、 積體電路及其類似物之物件的雷射掃描方法及系 統。更確切來說,本發明係有關一種雷射掃描方法 及系統,其用以高解析度標示印刷電路板、半導體 封裝,如位於標示站之微球柵陣列(BGA)與csp等 相似物件,例如一電子製造過程中的一組裝線。典 型地,欲標示區域(標示區域)的大小實質上小於基 體的大小或者小於裝置的大小,其中需要高清晰之 機器或人類可讀標記。 <發明之技術背景> PCB製造商,例如小型化電信電路的生產者, 將越來越需要電路之内部與現場故障追蹤功能。印 刷電路往往製造在面板上,其中在單一面板或基體 上存在有多重相同電路,稱為,,多重平台,,(mu|ti_up) · 例如在快動組態中或夾板上之電路的一 2x3 置。人類與機器可讀取標記將是需要的,包含二 細胞碼、文字或條碼。在其他相似組配中,物件將 以重複配置的方式出現在托盤或容器中。例如, 晶片模組或晶粒,或微-BGA(球柵陣列)可在托盤上 重複配置。 製造者需要一種彈性的、經濟的、高速的標示 系統。標示系統應該能輕易地整合到生產線上,其 線 配 維 多 4 本纸張尺度適用中國國家標準(CNS)A4規格(2〗〇χ 297公爱) 516303 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明(之 中傳送帶是一體成形於生產過程。標示速度必須足 夠快速以在多重區域中提供高清晰度的標示,而不 會減低生產的總通量。如果可以同時節省成本與空 間的話,將更是一大優點。 一雷射光可以在狹小的空間中標示資訊,並且 可符合微電子組件與印刷電路板都逐漸縮小且密集 的趨勢。例如,在高密度電路板上,在鄰近於電路 型樣的區域中,可能必須標示一特定型樣,如一高 密度二維細胞碼。這就需要標示光線位置的準確 性。 在過去二十多年來,雷射標示工業已進化並具 有標示金屬物以反射從紫外線(約355nm)至紅外線 (於10.6um的C02)之波長的使用。 以下將列出雷射標示符之相關參考資料: 蒙特谷之”電流計與共震低慣性的掃描器”,雷射 光掃描雜誌,馬梭·德克出版,1985年,第214-216 頁。 歐蘭海絲之”標示應用程式目前包含許多材質,,, 雷射焦點世界雜誌,1997二月出版,第153-160 頁;以及 布萊恩羅西之”用於工業市場之商用纖維雷射,,, 雷射焦點世界雜誌,1997年五月,第143-150頁。 以下為揭露具有代表性之標示方法與系統的美 國專利申請或PCT專利申請案的簡單說明: 裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 5516303 A7 Department of Intelligent Financial Expenses 4 印 5. Description of the Invention (< Technical Field of Invention >) The present invention relates to a laser scanning method and system for marking objects such as printed circuit boards, integrated circuits and the like More specifically, the present invention relates to a laser scanning method and system for high-resolution marking of printed circuit boards, semiconductor packages, such as micro-ball grid arrays (BGA) and csp, etc. at marking stations, For example, an assembly line in an electronic manufacturing process. Typically, the size of the area to be marked (marked area) is substantially smaller than the size of the substrate or the size of the device, and high-definition machine or human-readable markings are required. ≪ Invention Technical Background > PCB manufacturers, such as miniaturized telecommunication circuit producers, will increasingly require internal and on-site fault tracking capabilities of printed circuits. Printed circuits are often manufactured on panels, where multiple layers exist on a single panel or substrate The same circuit, called, multiple platform, (mu | ti_up) · For example, a 2x3 circuit in a snap action configuration or on a splint Human and machine-readable markings will be needed, including two-cell codes, text, or bar codes. In other similar combinations, objects will appear in a tray or container in a repeating configuration. For example, a chip module or Die, or micro-BGA (Ball Grid Array) can be repeatedly configured on the pallet. Manufacturers need a flexible, economical, high-speed marking system. The marking system should be easily integrated into the production line, and its line is equipped with Vindo 4 This paper size applies to China National Standard (CNS) A4 specifications (2〗 〇χ297297) 516303 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (in which the conveyor belt is integrated into the production process The marking speed must be fast enough to provide high-definition marking in multiple areas without reducing the total throughput of the production. It will be a great advantage if cost and space can be saved at the same time. A laser light can be used in a small area. Information in the space, and it can meet the trend of shrinking and dense of both microelectronic components and printed circuit boards. For example, in high-density circuits In the area adjacent to the circuit pattern, it may be necessary to mark a specific pattern, such as a high-density two-dimensional cell code. This requires the accuracy of the position of the light. In the past two decades, the laser marking industry Evolved and has the use of marking metal objects to reflect the wavelength from ultraviolet (about 355nm) to infrared (C02 at 10.6um). The following reference materials for laser markers will be listed: Monte Valley " "Low-inertia Scanner", Laser Scanning Magazine, published by Marshall Dirk, 1985, pp. 214-216. Oran Hess's labeling application currently contains many materials, Laser Focus World Magazine, 1997 Published February, pp. 153-160; and Brian Rossi, "Commercial Fiber Lasers for the Industrial Market," Laser Focus World Magazine, May 1997, pp. 143-150. The following is a brief description of a typical US patent application or PCT patent application that discloses the marking method and system: -------- Order --------- line (please read the first (Notes to fill out this page) 5

516303 A7 方 五、發明說明(彡 WO 96/16767·· 一種具有多重纖維饋送多個標 示符與分時之標示裝置; W〇98/53949 :具有一其说、玄,_ μ _ 、, 回功率纖維雷射之雷射 標示與能量控制方法; 5,965,042:-種制-低能量密度光線標示並 於其後清除的方法; 5,942,137··在硬晶體上進行凹槽雷射劃線的方 法,該晶體定位於一 X與Y工作台,以及_固定在 雷射系統上的顯微鏡; 5,932,119:-種具有工作台移動寶石方法之寶 石微紀錄系統,以及用於標示之4轉換雷射系統; 5,719,372:-種具有控制脈衝寬度的Q_轉換標 示系統; 5,690,846 ·具有用以移動物件之X與γ工作 與用以標示之一對鏡子的一種雷射處理系統; 5,635,976 :在光感應基體上標示幾何型樣的 法; 5,600,478: —種具有可移動鏡可導引光線路徑 以於一方向中掃描之雷射標示符,其目標移動於一 垂直相交方向; 5,521,628 :同時標示多重區域之折射光學系 統; 5,357,077 :-種用以標示安置於單一檔案筒狀 托架之丨CS的方法,該托架具有控制傳輸送器定位 ^ ---------------- (請先閱讀背面之注意事項再填寫本頁) 經 濟 部 智 慧 財 產 局 員 X 消 費 合 作 社 印 製 516303 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明(斗) 系統; 5,329,090:利用DPY雷射於矽晶上書寫之系 統’其中雷射光線移動到晶圓的表面; 4,985,780 : —種具有X托架與γ托架之可攜式 雷射雕刻機,其用以定位該雷射光以雕刻選出之型 樣; 4,945,204:具有特定聚焦能量密度與脈衝區間 之標示半導體裝置; 4,922,077 : —種Q_轉換系統,其於三步驟過程 標示金屬封裝,包含於一步驟中震盪雷射光線; 4,758,848 :標示一型樣並且利用雷射光之部分 饋送的方法; 4,734,558 :具有控制光罩之雷射機械,例如一 LCD ; 4,586,053 : _合到一 LCD的一顯示影像,其隨 後被控制以標示一產品; 4,522,656 :具有脈衝能量控制與經控制之點大 小的晶圓標示方法; 4,323,755 ··依序蒸發連續條狀物一本質上為 一 ”點狀矩陣”方法; 4,220,842 :利用C02雷射移動物件,控制相 對於擴充電漿的脈衝;以及 4,156,124 : —種用以雕刻之光罩配置系統。其 中移動支撐表或移動雷射光源;包含迴轉。 -------------I--------^---------線 (請先閱讀背面之注意事項再填寫本頁) 7 516303 A7 經濟部智慧財產局員工消費合作社印製 五、發明說明(5 ) 全場標示符典型地包含寬場光學掃描器,其掃 描現場足以覆蓋一完整”多重平台,,(Γτιυ|ίμυρ)或其他 欲標示區域。缺點之一是,例如,小型印刷電路板 基體上的低對比標記。現今的趨勢是尺寸越來越縮 小’例如存在有”多重平台,,(mu|ti-up)的peg工業, 全场方式已經越來越不足。同時,已出現位於托盤 袋中之裝置,其分離自傳統的,,海鷗式機翼” 與QFP”(四方扁平封裝)|Cs,並且包含微BGAs與 晶粒,其中可能需要限制區域中的高解析度標記。 在許多標示系統中,使用PCL(可程式邏輯控制 器)來操作一傳送帶以及開始標示過程已是很普遍 的。當整合變的越來越複雜時,例如SECS GEM 軟體介面,這些組配便不怎麼實用了。 習知技藝中高解析度標示系統,利用X與y工 作台以移動標示頭,或者需要載入器來定位X與y 工作台上的基體以進行標示。這項方法通常是較昂 貴的。再者,使用載入器也會降低生產通量。 美國專利號5,874,960揭露一種裝置與方法, 其用以定位多重工具,例如雷射光線或其他輻射光 線’其相對於多重連結分部工程之目標位置,並且 特別的是,其相對於利用一多階段與多讀取頭定位 器的一系統,其正確地座標化多重工具與聯結目標 位置之定位。 ^ Γ A__w--------訂 i、-------線 Hjlh" (請先閱讀背面之注意事項再填寫本頁) 五、 發明說明(6 ) <發明之概要說明> 本發明之實施例的目的是要提供一種用以標示 例如印刷電路板、積體電路及其類似物之物件的雷 射掃描方法及系統,其中一傳送帶、一標示符與一 工廠主機介面都經由一單一軟體程式來控制。 在達成上述目的與本發明之其他目的的過程 中,備置一種用以標示物件的雷射掃描方法。該方 法包含以下步驟·· a)控制性地在一標示台中於第一 方向中傳送物件;b)產生一聚焦之雷射光;c)控制 性地沿著二實質上垂直相交之軸線,在該標示台上 操縱該聚焦之雷射光,以根據代表標示位置與標示 内容的輸入資料,在至少一物件上,標示一第一既 定區域;d)在實質上垂直於該標示台上該第一方向 的一第二方向上移動該軸線;以及e)控制性地沿著 該移動軸線,操縱該聚焦雷射光,以根據該輸入資 料,在該至少一物件上,標示一第二既定區域。 上述方法可另包含感測位於該標示台上之至少 一物件的至少一部份,且提供代表該至少一部份之 &像的一對應信號,並在進行步驟e之前,根據 該信號於至少一軸線上進行推移。 上述物件實質上可為靜態,或者可以控制性地 在步驟c)中被傳送。 上述感測之步驟可包含掃描該至少一物件之一 區域的步驟,該區域含有該至少一物件之一已知特 x 297公釐 本紙張尺度適用中國國家標準 516303 A7 五、發明說明(7 ) 徵’且提供一對應影像信號,並在進行步驟c)之前, 根據該影像信號於至少一軸線上進行推移。 該物件可為印刷電路板。 該物件可為積體電路,或可以為半導體封裝。 一標示型樣可包含多個點,每個點都具有約25-50微米的大小,其標示在每個物件上。 在達成上述目的與本發明之其他目的的過程中, 另描· 一· 田 1、/ 播二 从 Ah 2 . f516303 A7 Fifth, the description of the invention (彡 WO 96/16767 ·· A marking device with multiple fibers feeding multiple identifiers and time-sharing; W〇98 / 53949: with all-inclusive, mysterious, _ μ _,, back Laser marking and energy control methods for power fiber lasers; 5,965,042:-Seeding-Low energy density light marking and subsequent clearing method; 5,942,137 · · Method for groove laser marking on hard crystals, the The crystal is positioned on an X and Y table, and a microscope fixed on the laser system; 5,932,119: a gem micro-recording system with a table moving gemstone method, and a 4 conversion laser system for labeling; 5,719,372: -A Q-conversion marking system with controlled pulse width; 5,690,846 · A laser processing system with X and γ work for moving objects and a pair of mirrors for marking; 5,635,976: Geometry marking on the light-sensitive substrate 5,600,478:-a laser indicator with a movable mirror that can guide the light path to scan in one direction, and its target moves in a direction of vertical intersection; 5,521,628: simultaneous marking Refractive optical system with multiple areas; 5,357,077:-a method to mark the CS placed on a single file cylindrical bracket, which has the position of the control conveyor ^ ------------ ---- (Please read the notes on the back before filling out this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs X, printed by the Consumer Cooperative 516303 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs, 5. Description of Invention (Doo) System; 5,329,090 : A system for writing on a silicon wafer using DPY lasers', in which laser light moves to the surface of the wafer; 4,985,780:-a portable laser engraving machine with an X bracket and a γ bracket, which is used to position the Laser light selected by engraving; 4,945,204: marked semiconductor device with specific focusing energy density and pulse interval; 4,922,077: a Q_ conversion system, which is marked in a three-step process with a metal package, which includes oscillating the laser in one step Light; 4,758,848: a method of marking a pattern and using laser light for part feeding; 4,734,558: a laser machine with a control mask, such as an LCD; 4,586,053: _into one A display image of the LCD, which is subsequently controlled to mark a product; 4,522,656: a wafer labeling method with pulse energy control and a controlled dot size; 4,323,755 ·· Sequential evaporation of continuous strips—essentially one dot "Matrix-like matrix" method; 4,220,842: using a C02 laser to move an object to control the pulse relative to the extended plasma; and 4,156,124: a mask configuration system for engraving. Among them are moving support tables or moving laser light sources; including turning. ------------- I -------- ^ --------- line (Please read the precautions on the back before filling this page) 7 516303 A7 Economy Printed by the Consumer Cooperative of the Ministry of Intellectual Property Bureau. 5. Description of the invention (5) The full-field identifier typically includes a wide-field optical scanner, whose scanning site is sufficient to cover a complete multi-platform, (Γτιυ | ίμυρ) or other signs Area. One of the disadvantages is, for example, the low contrast markings on the substrates of small printed circuit boards. The trend today is to shrink in size, such as the existence of “multi-platform,” peg industries, The field approach has become increasingly inadequate. At the same time, a device in a tray bag has emerged, which is separated from the traditional, seagull-type wing "and QFP" (square flat package) | Cs, and contains micro BGAs and die, which may require high Resolution flag. In many marking systems, it is common to use a PCL (programmable logic controller) to operate a conveyor and start the marking process. As integration becomes more complex, such as the SECS GEM software interface, these combinations become less practical. The high-resolution marking system in the conventional technique uses X and y worktables to move the marking head, or requires a loader to position the substrates on the X and y worktables for marking. This method is usually more expensive. Furthermore, the use of loaders can reduce throughput. U.S. Patent No. 5,874,960 discloses a device and method for locating multiple tools, such as laser light or other radiating light's relative to the target position of a multi-link divisional project, and in particular, it is relative to utilizing multiple stages A system with a multi-reader positioner that accurately coordinates the positioning of multiple tools and linked target positions. ^ Γ A__w -------- Order i, ------- line Hjlh " (Please read the notes on the back before filling this page) V. Description of the invention (6) < Summary of the invention > The purpose of the embodiments of the present invention is to provide a laser scanning method and system for marking objects such as printed circuit boards, integrated circuits and the like, in which a conveyor belt, a marker and a factory host interface Are controlled by a single software program. In the process of achieving the above object and other objects of the present invention, a laser scanning method for marking an object is provided. The method includes the following steps: a) controllably transferring an object in a first direction in a signage table; b) generating a focused laser light; c) controllably along two substantially perpendicularly intersecting axes, where Manipulate the focused laser light on the signage table to mark a first predetermined area on at least one object based on input data representing the signing position and content of the mark; d) substantially perpendicular to the first direction on the signage table Moving the axis in a second direction; and e) controllingly controlling the focused laser light along the moving axis to mark a second predetermined area on the at least one object based on the input data. The above method may further include sensing at least a part of at least one object located on the marking table, and providing a corresponding signal representing the & image of the at least part, and before step e, according to the signal in Move on at least one axis. The aforementioned objects may be static in nature or may be controlled to be transmitted in step c). The above sensing step may include a step of scanning an area of the at least one object, the area containing one of the at least one object being known x 297 mm. The paper size is applicable to the Chinese national standard 516303 A7. 5. Description of the invention (7) And provide a corresponding image signal, and before step c), the image signal is shifted on at least one axis according to the image signal. The object may be a printed circuit board. The object may be an integrated circuit, or may be a semiconductor package. A marking pattern may include multiple dots, each dot having a size of about 25-50 microns, which is marked on each object. In the process of achieving the above-mentioned objects and other objects of the present invention, a further description of Tian 1 and / Bian from Ah 2. f

本紙張尺度適用中國國豕標準(CNS)A4規格(21〇 X 297公爱) 516303 A7 五、發明說明(没 號。 該系統另包含一機器視覺子系統,其用以感測 位於該標示台上之至少—物件的至少—部份並且 提供代表該至少-部份之—影像的—對應影像信 號,該巾央㈣n產生賴於該影像錢之一推移 信號,以於該至少一軸線上進行推移。 該機器視覺子系統可包含_照明組件,其用以 照明位於標示台上之物件。 該照明組件可包含-脈衝式照明子系統。 該雷射光偏轉器可包含—二維、可定址電流器。 該系統可另包含一第二雷射,其用以產生一掃 描雷射光,該雷射光線偏轉器沿著轴線方向操縱該 掃描雷射光,以掃描至少_物件之__區域,而該區 域含有至少—物件之一已知特徵’並且提供一對應 影像信號’該中心控制器產生回應於該影像信號 -推移信號,以在至少—軸線上進行推移。 該物件可為印刷電路板。 該物件可為積體電路,或可以為半導體封裝。 -標示型樣可包含多個點,每個點都具有約25_ 50微米的大小,其標示在每個物件上。 其中該傳送帶可由該傳送控制器,以約5密耳 之定位準確度,來控制其定位。 本發明之至少一實施例的目的同時包含: 提供-種用以標示例如印刷電路板、積體電路 訂 之 線 本紙張尺度&㈣_鮮(CNS)A4祕 11 516303 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明(7) 及其類似物之物件的雷射掃描方法及系統。 提供一種雷射標示符,其為,,自含的,,,且容易整 合到一自動化生產線,或者可以於一獨立式組態中 操作。 提供可由機械或人類讀取之高清晰度(高解析度) 標記的能力,高解析度二維細胞碼。 配合生產速率提供高速標示方法。 透過雷射波長與強度之選擇,提供一系統,其 可以標示固定於板上並具有多種不同材料組成之 PCB基體、導體區域與裝置。 提供一種系統以在”托盤中,,標示裝置,包含積體 電路晶粒,其中在限制顯微區域中需要高解析度標 記。 提供一種經濟的標示系統,其中一傳送帶沿著 基體的方向提供足夠的定位準確度,以便減少對重 複定位機或載入器的需要。 足夠地提供正確光線與基體定位效能,包含生 產線上之機器視覺基礎對準,以允許在電路型樣的 附近區域,標示人類或機器可讀取之型樣,包含晶 粒上之電路型樣’而不必冒著損失電路的危險。 提供一種標示系統,其中標示内容可由使用者 根據”每部分,,(per-part)與”每裝置”(per-device)來界 定,而不必提供位於(X,y)總體系統與局部掃描器(χ,, y )座4示糸統中用以標不之規格或說明。 12 }紙張尺度刺中關家標準(CNS)A4規格⑵G X 297公爱)----------- (請先閱讀背面之注意事項再填寫本頁) ----I--I ^ 0 —1 — — — — — — . 516303 A7 五、發明說明(ΙΟ Β7 局 員 X 消 費 合 社 印 製 2之目的可由以下之方法與系統中來達成: 積體m示台上進行高解析度標示咖、 =裝,與相似物件之方法。該方法包 (1) 提供: ⑷用以標示之-掃描頭,其包含一光線掃 ,、-標示雷射、一聚焦系統與—既 定最大掃描現場; ()控制系統與操作性連接到該控制系統 的-傳送帶,其用在該標示台上之至 一位置控制性地定位物件,該傳送帶 有運行之第一方向;以及 ⑷-轉換機制,其用以選擇性地定位該掃 描頭,該轉換沿著運行之第二方向進行; (2) 控制性地以該傳送帶定位該物件到一第_ 位置; (3) 利用掃描該標示雷射光標示該物件的特 定位置;以及 ⑷刀別地重複定位與標示步驟⑺至⑶,直到 物件的所有特定部分都被標示為止。 可以備置種系統來進行上述步驟。該傳送帶 可以沿著- X-方向來進行傳送,並且控制轉換機制 以於- Y·方向中移動,該γ_方向實質上垂直於該 方向。 少具 訂 本紙張尺度刺巾® Θ家^MCNS)A4娜 13 X· 經濟部智慧財產局員工消費合作社印製 516303 A7 ------- B7 五、發明說明(/ / ) 另外’該方法與系統可分別包含以下步驟或要 件中之至少一個: : —個二維可定址光線掃描器,其產生 一 2D型樣; 鼓蓋邊該機制可包含一電動單一軸轉換器一 其控制性地於運行之至少一第二方向轉換該掃 描頭,該第二方向可實質上垂直於傳送帶運行 之第一方向; : 一可地址與可程式化掃描器,其 光栅/向量模式在該掃描現場的範圍中; 基體或物件一:該基體或物件可位於靜態中,或 可能在標示過程中移動; 重A :該雷射是根據雷射物質交互作用來選取 的,並可包含(例如)C02、YAG(釔鋁石榴石)、 或一光纖雷射。具有非線性晶體之頻率乘法可 被用來轉換丨R(紅外線)波長為可見波長。波長 可從UV(紫外線)至丨R中選取。該雷射可為 一’’ΜΟΡΑ”(主振盪器、功率擴大器)組態。這些 雷射與其操作式是熟悉技藝者已知的; 部分:在每個狀況下,例如可包含 PCB”多重平台”(mu|ti_up)的多重部分或包含丨c 封裝或晶粒上的顯微區域。該掃描頭可利用,,單 軸轉換器檢索到多個標示區域,沿著,,與傳送 帶垂直之運行的第二方向”;This paper size is in accordance with China National Standard (CNS) A4 specification (21〇X 297 public love) 516303 A7 V. Description of the invention (No. This system also includes a machine vision subsystem, which is used to sense the location of the marking station. At least-at least-part of the object and providing a corresponding image signal representing the at least-part of-the image, the towel generates a transition signal that depends on the image money for the transition on the at least one axis The machine vision subsystem may include a lighting component, which is used to illuminate objects located on the signage table. The lighting component may include a pulsed lighting subsystem. The laser light deflector may include a two-dimensional, addressable current device The system may further include a second laser for generating a scanning laser light, the laser ray deflector manipulating the scanning laser light along the axis direction to scan at least __ the area of the object, and the The area contains at least one of the known features of the object 'and provides a corresponding image signal' The central controller generates a shift signal in response to the image signal to push on at least the axis The object may be a printed circuit board. The object may be an integrated circuit, or it may be a semiconductor package.-The marking pattern may include multiple dots, each dot having a size of about 25-50 microns, which is marked on each The conveyor belt can be controlled by the conveyor controller with a positioning accuracy of about 5 mils. The purpose of at least one embodiment of the present invention also includes: providing-a type for marking a printed circuit board, for example 、 Integrated Circuit Binding Book Paper Size & ㈣_Fresh (CNS) A4 Secret 11 516303 Printed by A7 B7, Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Laser Description of Invention (7) and Similar Objects Scanning method and system. Provide a laser marker, which is self-contained, and easy to integrate into an automated production line, or can be operated in a stand-alone configuration. Provides a height that can be read by machinery or humans Clarity (high-resolution) Marking ability, high-resolution two-dimensional cell code. Provides a high-speed marking method to match the production rate. Provides a system through the choice of laser wavelength and intensity, Can mark PCB substrates, conductor areas, and devices that are fixed to the board and have a variety of different materials. Provide a system to mark devices in a "tray", including integrated circuit dies, where high levels are required in restricted microscopic areas Resolution Marking. Provide an economical marking system in which a conveyor belt provides sufficient positioning accuracy along the direction of the substrate to reduce the need for repeated positioning machines or loaders. Provides sufficient light and substrate positioning performance, including The machine vision foundation of the production line is aligned to allow human or machine-readable patterns to be marked in the vicinity of the circuit pattern, including circuit patterns on the die, without risking circuit loss. Marking system, where the marking content can be defined by the user according to "per-part" and "per-device", without having to provide the (X, y) overall system and local scanner (χ ,, y) Block 4 shows the specifications or instructions used in the system. 12} Paper Standards CNS A4 Specification ⑵G X 297 Public Love) ----------- (Please read the precautions on the back before filling this page) ---- I- -I ^ 0 —1 — — — — — —. 516303 A7 V. Description of the invention (10 B7 Bureau X Consumer Co., Ltd. The purpose of printing 2 can be achieved by the following methods and systems: The method for marking the coffee, the resolution, and the similar objects. The method package (1) provides: ⑷ A scanning head for marking, which includes a light scan, a marking laser, a focusing system, and a predetermined maximum Scanning the site; () Control system and a conveyor belt operatively connected to the control system, which is used to position the object in a controlled manner to a position on the marking platform, the conveyor belt has a first direction of operation; and , Which is used to selectively position the scanning head, and the conversion is performed along the second direction of the operation; (2) control the positioning of the object to a first position with the conveyor belt; (3) scanning the marking laser light Mark the specific location of the object; and repeat positioning and marking with a trowel Steps ⑺ to ⑶ until all specific parts of the object are marked. A system can be provided to perform the above steps. The conveyor can be transported in the -X- direction, and the conversion mechanism is controlled to move in the -Y · direction The γ_ direction is substantially perpendicular to this direction. Less printed paper-scale stab wipes® Θ 家 ^ MCNS) A4na 13 X · Printed by the Intellectual Property Bureau Staff Consumer Cooperatives of the Ministry of Economic Affairs 516303 A7 ------- B7 V. Description of the invention (//) In addition, the method and system may respectively include at least one of the following steps or requirements:-a two-dimensional addressable light scanner, which generates a 2D pattern; the mechanism is on the side of the drum cover It may include an electric single-axis converter that converts the scanning head in at least a second direction of operation in a controlled manner, the second direction may be substantially perpendicular to the first direction of operation of the conveyor belt: an addressable and programmable Scanner, its raster / vector mode is within the range of the scanning scene; substrate or object 1: the substrate or object can be in static or may move during the marking process; weight A: the laser is based on To select the interaction shot material, and may include (e.g.) C02, YAG (yttrium aluminum garnet), or a fiber laser. Frequency multiplication with a non-linear crystal can be used to convert R (infrared) wavelength to visible wavelength. The wavelength can be selected from UV (ultraviolet) to R. The laser can be configured as a "ΜΟΡΑ" (main oscillator, power amplifier). These lasers and their operation types are known to those skilled in the art; part: in each case, for example, it can include a PCB. Multiple sections of the "platform" (mu | ti_up) or contain micro areas on the c package or die. The scan head can be used, a single axis converter to retrieve multiple marked areas, along, and perpendicular to the conveyor belt Second direction of operation ";

------7 —^ --------訂 -------- (請先閱讀背面之注意事項再填寫本頁) 516303 經-;^部智慧財產局員工消費合作社印製------ 7-^ -------- Order -------- (Please read the notes on the back before filling this page) 516303 Jing-; ^ Ministry of Intellectual Property Bureau staff consumption Printed by a cooperative

A7 —-------___ 發明説明(/乙) 多重區域可在標示現場中被標示, 該標示現場由掃描器之最大掃描現場所界定, 該標示過程進行於x,,y,座標线中所界定之多 個座標’並且當掃描頭與傳送帶均為靜態時, 光學性的進#。該位置可由一定序程式界定, 其在控制電腦中為多個區域轉換x,,y,座標; 該定序程式可從過程中決定用以快 速標示的順序,利用接受作為輸入標示位置與 標示内容。自動化定序程式可輸出一控制信號, 以於(X,y,X’,y’)座標系統中定位該標示頭,以 標示位置的陣列,· :可另包含一對準步驟,其用 以自動地找出一已知特徵的位置,其在一欲標 示基體的特定區域中的轉換與迴轉中推移; 該對半步驟可另包含掃描包括已知特徵之一區 域,利用可程式化掃描器,並且調整掃描器的 座標位置,以進行基體之特定區域的後續標示; 該IfJii可另包含一低功率雷射,其用以在1 兔步驟中掃描。或者,可以備置包含一照明與 照相系統的一視覺系統;以及 該复可進行,當基體於運行中。如果根 據視覺系統之照相被使用的話,該照明光線便 可被閃控。 在進一步達成上述目的與本發明之至少一實施 本紙張尺度適用中國國家標準(CNS)A4規格ΟΠΟ x 297公釐)A7 —-------___ Description of the invention (/ B) Multiple areas can be marked on the marking site, which is defined by the maximum scanning site of the scanner. The marking process is performed at x, y, and coordinates The multiple coordinates defined in the line are optically advanced when the scanning head and the conveyor are both static. The position can be defined by a sequence program, which converts x ,, y, and coordinates for multiple areas in the control computer. The sequence program can determine the order for rapid labeling from the process, and use acceptance as input to label the position and content . The automatic sequence program can output a control signal to locate the marking head in the (X, y, X ', y') coordinate system to mark the array of positions, and may include an additional alignment step, which is used to Automatically find the location of a known feature, which moves in the transition and rotation in a specific area of the substrate to be marked; the half-step may additionally include scanning an area including one of the known features, using a programmable scanner , And adjust the coordinate position of the scanner for subsequent marking of specific areas of the substrate; the IfJii may additionally include a low-power laser, which is used to scan in 1 rabbit steps. Alternatively, a vision system including an illumination and photographing system may be provided; and the compounding may be performed while the substrate is in operation. This illumination light can be flash-controlled if used according to the vision system's camera. To further achieve the above-mentioned object and at least one implementation of the present invention, the paper size applies the Chinese National Standard (CNS) A4 specification 〇Π〇 x 297 mm)

-線· (請先閱讀背面之注意事項再填寫本頁) -n I- ϋ i— I n · 裝--------訂. 516303 A7 B7 五、發明說明(G ) 例之其他目的的過程中,另提供—種用以控制一 PCB標示符的方法,其中具有—控制程式的電腦接 收有關標記之内容、位置與欲標示物件之出現的資 訊,並為掃描器、雷射、傳送帶與橫向台架計算(或 查找)適當的動作順序,且使它們被執行。 在達成上述目的與本發明之至少一實施例的其 他目的之過程中,另提供一種***,其中一目標基 體、雷射、掃描頭、聚焦光學器材、傳送帶為X抽, 而橫向台架作為y轴’而具有控制程式的—處理單 位,在目標基體上的可程式化位置進行標示。 還有其他幾個主要要素:_例如,標示電腦之 標示軟體功能與控制功能,以及產生高對比標記之 雷射功率與脈衝寬度。 產生的結果為·· 當維持一定速度並維持在一小覆蓋區中時,掃 描器之標示解析度可能是高的(即大量之狹小且聚焦 的點/現場)。 鄰近於電路要素之基體、封裝或晶粒的部分可 被標示,以經提昇之準確度,而不必w著電路被損 害的危險。 對準步驟允許在經嚴密約束之標示區域進行標 示° 減少載入器的使用,其在習知技藝中是需要的, 以降低生產成本並提高生產通量。 訂 部 智 慧 財-Line · (Please read the precautions on the back before filling this page) -n I- ϋ i— I n · Equipment -------- Order. 516303 A7 B7 V. Description of Invention (G) Others In the process of the purpose, a method for controlling a PCB identifier is also provided, in which a computer having a control program receives information about the content, location of the mark and the appearance of the object to be marked, and provides information for the scanner, laser, The conveyor belt and the cross stand calculate (or find) the proper sequence of actions and cause them to be executed. In the process of achieving the above objectives and other objectives of at least one embodiment of the present invention, another system is provided, in which a target substrate, a laser, a scanning head, focusing optics, and a conveyor belt are X-pumped, and a horizontal stage is used as y Axis' and a processing unit with a control program are marked at a programmable position on the target substrate. There are several other major elements: for example, marking software functions and control functions of a marking computer, and laser power and pulse width that produce high contrast markings. The result is that when maintaining a certain speed and in a small coverage area, the scanner's marking resolution may be high (ie a large number of narrow and focused points / fields). Parts of the substrate, package, or die that are adjacent to the circuit elements can be labeled for improved accuracy without the risk of circuit damage. The alignment step allows marking in tightly constrained marking areas. Reduces the use of loaders, which are needed in the art to reduce production costs and increase production throughput. Ordering Department

I 印 16 本紙張尺度適用中國國家標準(CNS)A4規格(2】0 X 297公爱 516303 五、發明說明(/4 ) 本發明之上述目的與其他目的、特徵與優點將 、下之發明說明與附錄之圖式中更為明顯。 <圈示的簡要說明> 盆第1a圖為根據本發明所建構之系統的方塊圖, :::為掃描頭運行的方向,而x則為傳送帶運行 第1b圖為一結構透視圖,其為第la圖之系統 的部分,且其中顯示一,,多重平台”PCB上之代表性 的標示現場(全區)與特定區域; 第1c圖為第1c圖的特定區域之一的分解圖, 其中具有一 2D碼; 第1d圖為-PCB的頂端平面圖,其顯示具有 一典型2D細胞碼之特定標示區域; 中 第1e圖與第ib圖相似,但少了傳送帶,其 相或一容器中裝有以隔板隔開的電子裝置; 第1 f圖與第1 c圖相似; 第2a-2d圖顯示介於特定區域中,掃描現場與 距離的相對尺寸,其中第2a圖顯示大於基體的」 標式掃描線場; 第2b圖顯不一不夠寬的標示掃描現場,與掃描 頭轉換方向; 一田 —第2c圖顯示一夠寬的標示掃描區域,其可使三 個貫質上相同的電路在傳送帶上傳送; 17 297公釐) 本紙張尺度ϋ财關家鮮(CNS)A4規格(21石 516303I printed 16 This paper size is applicable to China National Standard (CNS) A4 specifications (2) 0 X 297 public love 516303 5. Description of the invention (/ 4) The above and other objects, features and advantages of the present invention will be described below. And the drawings in the appendix are more obvious. ≪ Brief description of the circle > The first figure of the basin is a block diagram of a system constructed according to the present invention, ::: is the direction of the scanning head, and x is the conveyor belt. Figure 1b of operation is a structural perspective view, which is part of the system of Figure 1a, and it shows one, a multi-platform "representative representative site (full area) and a specific area on the PCB; Figure 1c is An exploded view of one of the specific areas in Figure 1c, which has a 2D code; Figure 1d is a top plan view of the -PCB, which shows a specific labeled area with a typical 2D cell code; Figure 1e is similar to Figure ib, But without a conveyor belt, the phase or a container is equipped with electronic devices separated by partitions; Figures 1f and 1c are similar; Figures 2a-2d show that the scan site and distance are in a specific area. Relative dimensions, where Figure 2a shows the ”Standard scanning line field; Figure 2b shows a scan field that is not wide enough to switch directions with the scanning head; Yita—Figure 2c shows a wide enough scan area to mark three scans that are identical in quality. Circuit on the conveyor belt; 17 297 mm) Paper size: ϋ 财 关 家 鲜 (CNS) A4 size (21 stone 516303)

(請先閱讀背面之注意事項再填寫本頁) --------------- •線. A7(Please read the notes on the back before filling out this page) --------------- • Line. A7

經濟部智慧財產局員工消費合作社印製 516303 五、發明說明(力) 特定標示區域的電路型樣關係,其中第1c圖為該 特定區域中之一區域的分解圖,在此例中為PCB” 多重平台”的一項要素。 雷射盖綠:C02與YAG設計皆是可使用的,並 且纖維雷射已經出現了,包含可見波長模型。這些 緊密型雷射提供了多個潛在的優點。使用YAG與近 IR雷射經常可發現高對比,而當C02材質相交時 經常改變顏色。UV固態雷射越來越實用,雖然目 前是較貴的,但可被使用。同時如以下說明之電路 板材質’根據代表性材質與對比要件來選擇雷射。 板修飾 雷射 濕桿光罩 C02 乾桿光罩 C02 電鍍 YAG、纖維 環氧樹脂 YAG、纖維、C02 油墨 YAG、纖維 裸板 C02 其他 尚待決定 根據材質的光學特性與感熱性也可以選擇使用 其他雷射。這些基本參數,其接根據雷射輻射與物 質的相交,將同時影響或決定其他系統參數的選 擇,例如標示現場的尺寸與點的大小都將在以下做_ 19 本紙張尺度賴中國國家標準(CNS)A4規格(210 X 297公爱) --------------裝--------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 五、發明說明(/7 ) 更進一步之說明。在較佳的系統中,雷射光輸出是 對準的,並將傳送到掃描頭,或者纖維會耦合到該 掃描頭。 掃描_1 :在較佳實施例中,標示頭轉換與光線 的組合將使用於以高解析度標示在托盤中大基體或 物件的顯微區域。利用掃描頭轉換,介於低解析度 與高解析度之全場標示間的固有折衷將減輕,較佳 地與運行中之傳送帶軸成垂直相交方向。使用X、 γ電流計掃描器來進行標示是習知技藝中已知的, 如上述之蒙特谷於1985年的著作,其包含顯示標 示符表現參數的表。利用一對X,y鏡(在χ,y座標 系統中界定連結之雷射光線的座標)的較佳配置,來 操縱程式控制下的雷射光。如前述之習知技藝參考 案中所說明之雕刻、點矩陣或擺動模式將可被使 用。 經濟部智慧財產局員工消費合作社印製 在本發明中,聚焦透鏡必須提供約25-50微米 之點大小,其典型地超過一掃描現場約彳〇〇平方 mm(4英吋x4英吋)。這對應了約1:3000 — 1:6000 解析度。在某些狀況下,較大的標示現場可以同時 被選出’在某些狀況下高達約1:16000或更多。在 任一種情況下,較佳的是能產生高解析度碼。 對熟悉技藝者來說,設計選擇是已知的,並且 可包含其他種類的光偏轉器。然而,電流器方法之 可定址性與夠快的標示應用速度,使得X、Y鏡方 20 516303 五、發明說明(/^ ) 法成為較佳。^上所顯示,其中數個區域必須被 標示的基體需要的是,掃描頭或掃描頭組件的附屬 設備能被附加在一用以進行轉移的運行系統中。因 此’該掃描頭應該要是耐用而緊密的。 ^4材質的多重組合可能會 影響雷射標記的對比。因此,在微電子區域中有一 種高度變動性。如上所述,雷射選擇由基體參數所 驅動。”裸板”將依照表面修飾而有所不同,而電鍍、 裱氧樹脂與油墨將影響對比。在較佳系統中,現場 尺寸與點大小將被指明為欲標示之條碼或細胞碼的 功旎。利用條碼,主要參數為材質上的對比。利用 2D細胞碼,點大小與材質相交將改變雷射波長、 功率與聚焦點大小的選擇。以文字來說,人類可讀 取性是重要的,並且會影響點大小的選擇。舉例來 说,如上表之方法來選擇雷射作為標示印刷電路板 的材質。 I行與基體定位系、、统:較佳系統中的一主要特 徵疋使用傳送帶以定位電路板或相似物件到標示系 統中的多個位置,而可高準確性達成垂直大小中之 控制運行與正碑性的適當位準。同樣的,在一較佳 實施例中,在掃描現場外之具有欲標示區域的基體 將被標示,利用手動地或自動地定位該掃描頭到一 既定位置以進行標示。該基體較佳地以一傳送帶系 統定位,其典型地被制約+_5密耳(+-I25um)的定位 21 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐 516303Printed by the Intellectual Property Bureau's Consumer Cooperatives of the Ministry of Economic Affairs 516303 V. Description of the invention (force) Circuit type relationship of a specific marked area, where Figure 1c is an exploded view of one of the specific areas, in this case PCB " Multiplatform ". Laser Cover Green: Both C02 and YAG designs are available, and fiber lasers have already appeared, including models with visible wavelengths. These compact lasers offer several potential advantages. High contrast is often found with YAG and near IR lasers, and the color often changes when the C02 material intersects. UV solid-state lasers are becoming more practical and, although currently more expensive, can be used. At the same time, as described below, the material of the circuit board is selected according to the representative material and the comparison requirements. Board Modified Laser Wet Rod Mask C02 Dry Rod Mask C02 Electroplated YAG, Fiber Epoxy YAG, Fiber, C02 Ink YAG, Fiber Bare Board C02 Others to be determined Depending on the optical characteristics and thermal properties of the material, other options can also be used Laser. These basic parameters, which are based on the intersection of laser radiation and matter, will also affect or determine the choice of other system parameters, such as the size of the marked site and the size of the points will be made as follows. CNS) A4 specification (210 X 297 public love) -------------- install -------- order --------- line (please read the back first (Notes on this page, please fill out this page) 5. Description of the invention (/ 7) Further explanation. In a preferred system, the laser light output is aligned and transmitted to the scan head, or a fiber is coupled to the scan head. Scan_1: In the preferred embodiment, the combination of the marking head conversion and the light will be used to mark the microscopic area of the large substrate or object in the tray with high resolution. With scanning head conversion, the inherent trade-off between low-resolution and high-resolution full-field markings will be reduced, and it is better to perpendicularly intersect the conveyor axis in operation. The use of X, γ galvanometer scanners for labeling is known in the art, as described by Monte Valley in 1985, which includes a table that displays indicator performance parameters. The preferred configuration of a pair of X, y mirrors (coordinates that define the connected laser rays in the χ, y coordinate system) is used to manipulate the laser light under program control. The engraving, dot matrix, or wobble pattern as described in the previous art reference will be used. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In the present invention, the focusing lens must provide a spot size of about 25-50 microns, which typically exceeds about 1000 square mm (4 inches x 4 inches) over a scanning site. This corresponds to approximately 1: 3000 — 1: 6000 resolution. In some cases, larger signage sites can be selected at the same time, 'in some cases up to about 1: 16000 or more. In either case, it is preferable to be able to generate a high-resolution code. Design options are known to the skilled artisan and may include other types of light deflectors. However, the addressability of the galvanometer method and the fast enough application speed of the marking method make the X and Y mirror methods 20 516303 V. Invention Description (/ ^) method becomes better. As shown above, the substrate where several areas must be marked requires that the scanning head or the accessory equipment of the scanning head assembly can be attached to an operating system for transfer. Therefore, the scanning head should be durable and compact. ^ 4 Multiple combinations of materials may affect the contrast of laser marks. Therefore, there is a high degree of variability in the microelectronic region. As mentioned above, laser selection is driven by matrix parameters. "Bare board" will vary according to the surface modification, while electroplating, mounting epoxy resin and ink will affect the contrast. In the preferred system, the site size and dot size will be specified as a function of the bar code or cell code to be marked. With barcodes, the main parameter is the contrast on the material. With 2D cell codes, the intersection of point size and material will change the choice of laser wavelength, power and focus point size. In words, human readability is important and affects the choice of dot size. For example, select the laser as the material of the printed circuit board as shown in the table above. Row I and substrate positioning system: a major feature in a better system: using conveyor belts to locate circuit boards or similar objects to multiple locations in the marking system, and to achieve high accuracy control operations in vertical sizes and Proper level of stele. Similarly, in a preferred embodiment, a substrate having an area to be marked outside the scanning site is marked, and the scanning head is manually or automatically positioned to a predetermined position for marking. The substrate is preferably positioned with a conveyor system, which is typically restricted to + _5 mil (+ -I25um) positioning. 21 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm 516303).

經濟部智慧財產局員工消費合作社印製 五、發明說明() 物準確性,當處理大範圍的印刷電路板厚度規格 時。在一較佳實施例中,傳送帶約為彳公尺長,並 且可以處理長度約從75miT|_500mm的板子。該系 統將同時包含自動或手動地調整相對於該傳送帶之 標示頭的高纟。當托盤中之半導體裝置以高解析度 被標示時,具有嚴苛要件之半導體晶粒可能為半約 束性的。 遂欲標示基體的範圍典型地從單一微 型電路到具有,,多重平台”配置之5〇〇mm χ 5〇〇mm 土體或者,托盤可包含一典型1 〇〇mm χ 200mm 區域中的多個晶粒。接下來之特定配置將更進一步 顯示該系統之操作。 在最簡單配置之掃描現場,典型地1〇〇mm χ 1〇〇mm,對標示任何特定區域來說是夠大的,而不 需掃描頭的運行。該掃描頭可以手動的定位以補償 連接於不同電路板佈置與結構的推移(參照第2a 圖)。 在第2c圖中之第二組配中,例如一 3x1多重平 台,標示現場足夠覆蓋PCB基體的寬度。傳送帶 被用來沿著第一方向,以,,步驟與重複,,之方式檢索 基體。X’與y’掃描動作隨後將較佳地標示在該掃描 現場中之所有可定址區域。並不需要掃描頭的運 行。在此區域的標示過程完成之後,傳送帶便檢索 到另一位置。 22 本紙張尺度·巾關家鮮ic^i)A4規格⑵〇x297公爱) —;—^--------訂 ---------線 (請先閱讀背面之注意事項再填寫本頁) 516303 A7 五、發明說明(>〇 在第2b圖中所顯示之第= ^ ^ . 配置中,利用狹窄傳 运帶在標不現場範圍中 ^ ^ ^ ^ 1基體,但超過垂直於 該傳迗帶運作方向之標示現 ^ ^ ^ ^ 穷見度。基體中位於可 項取知描現場範圍内的區域 ^ ^ 匕A被私不之後,標示頭隨 後便以垂直於傳送帶之方向轉換。 最後,第2d圖顯示通用運作之第四方法。傳送 :定位板子的位置,並且利用轉換該掃描頭為一既 疋位置所有基體位置都被標示為—固定傳送帶位 置,,並且隨後以",與y,掃描行動來標示。隨後,該 傳送帶被檢索並且重複過程。 第圖顯示相似的配置’其中存在大量的晶粒。 訂 該裳置位於一格盤中π + + ^ 皿〒如此一來,一較小標示現場 可此疋有利的’其具有視覺輔助區與裝置對準。該 欲標示區域可能需要正確的雷射光定位。 線 盘在標示步驟中,必須要鑑別基體的適當 區段,其為標示發生之位置。這是相當重要的,如 果電路鄰近於該特定標示區域的話,高密度pcB 佈局的特徵將出現。如果雷射光定位是具有準確性 以避免對電路區域造成損害的話,可能必須要鑑別 電路开/貌,其可旎為執跡、鑑別標記或標準,並且 在利用高功率雷射進行標示之前,推移掃描位置。 在貝施例中,當電路板移動到系統中時,利用一 光感測掃描基體,其不相交於掃描頭,以找出板 子的位置。在較佳實施例中,為了準確的緣故,定 23 本紙張尺度刺巾S S家鮮(CNS)A4麟(2】〇 X 297公爱)" 516303 .A7 --------— B7 _ 五、發明說明(二I ) 位-低功率雷射光之光線可能透過掃描頭傳送,並 且掃描電路板的—區域。追溯反射能量透過光系統 感測’並且稍後被數位化以找出電路形貌,並從該 形貌中計算掃描器的推移。或者,可能以一分開視 覺系統進行相似的操作。在一移動基體中,較佳的 是,一脈衝式照明系統被使用,例如一控制lEDs 之陣列,以產生高對比影像。 兔1 己驗鸯可備置一標記讀取器,如簡單的2D 細胞碼讀取器,其可能附著在讀取頭上。 上述之配置與例示意圖要說明本發明之實施 例,但不應被視為限制本發明。 本發明之最佳實施例已詳細地說明,熟知技藝 者可以由以下附錄之申請專利範圍中,辨識出不同 的替代設計與實施例以實現本發明。 (請先閱讀背面之注意事項再填寫本頁) t 幻j-------線· 經濟部智慧財產局員工消費合作社印製 24 本紙張尺度適用中國國家標準(CNS)A4規格(2】〇χ 297公釐)Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention () The accuracy of the material when dealing with a wide range of printed circuit board thickness specifications. In a preferred embodiment, the conveyor is approximately 彳 meters long and can handle boards with a length of approximately 75 miT | _500 mm. The system will also include automatic or manual adjustment of the height of the marking head relative to the conveyor. When the semiconductor devices in the tray are marked with high resolution, semiconductor grains with severe requirements may be semi-constrained. The substrate to be labeled typically ranges from a single microcircuit to a 500mm x 500mm soil with a multi-platform configuration. Alternatively, the tray may contain multiples in a typical 100mm x 200mm area. Die. The specific configuration that follows will further show the operation of the system. At the scan site of the simplest configuration, typically 100mm x 100mm, it is large enough to mark any particular area, and No need for scanning head operation. The scanning head can be manually positioned to compensate for changes in layout and structure connected to different circuit boards (see Figure 2a). In the second set of Figure 2c, such as a 3x1 multiple platform The marking site is sufficient to cover the width of the PCB substrate. The conveyor belt is used to retrieve the substrate along the first direction by ,, steps and repetitions. X 'and y' scanning actions will then be better marked at the scanning site All the addressable areas in the system. The operation of the scanning head is not required. After the marking process of this area is completed, the conveyor will search for another location. 〇x297 public love) —; — ^ -------- Order --------- line (please read the notes on the back before filling this page) 516303 A7 V. Description of the invention (> 〇 In the configuration shown in Figure 2b, = ^^^. In the configuration, a narrow transport belt is used in the field of the target site ^ ^ ^ ^ 1 substrate, but the sign that exceeds the direction perpendicular to the operation direction of the transport belt is displayed ^ ^ ^ ^ Poor visibility. The area in the substrate that is within the range of the field where the item can be traced ^ ^ After the dagger A has been confiscated, the marking head is then switched in a direction perpendicular to the conveyor belt. Finally, Figure 2d shows the general operation Four methods. Transfer: locate the position of the board, and use the scan head to convert it into a pre-existing position. All substrate positions are marked as-fixed conveyor position, and then marked with ", and y, scanning actions. Then, The conveyor is retrieved and the process is repeated. The figure shows a similar configuration where there are a large number of grains. The order is placed in a grid plate π + + ^ 〒 This way, a smaller marking site can be beneficial 'It has a visual aid zone aligned with the device. The area may need to be positioned correctly with laser light. In the marking step of the wire coil, it is necessary to identify the appropriate section of the substrate, which is where the marking takes place. This is very important. If the circuit is close to the specific marking area, high density Features of the pcB layout will appear. If the laser light positioning is accurate to avoid damage to the circuit area, it may be necessary to identify the circuit opening / view, which can be regarded as a track mark, identification mark or standard, and is using high power Before the laser is marked, the scanning position is shifted. In the embodiment, when the circuit board is moved into the system, a light sensing scanning substrate is used, which does not intersect the scanning head to find out the position of the board. In the preferred embodiment, for the sake of accuracy, 23 paper-scale stab scarves SS home fresh (CNS) A4 Lin (2) 0X 297 public love) " 516303 .A7 --------- B7 _ V. Description of the invention (II) Bit-low power laser light may be transmitted through the scanning head and scan the area of the circuit board. The retro-reflected energy is sensed through the optical system 'and later digitized to find the circuit topography and calculate the scanner's movement from that topography. Alternatively, a similar operation may be performed with a separate visual system. In a moving substrate, it is preferred that a pulsed lighting system is used, such as an array controlling 1EDs, to produce a high contrast image. Rabbit 1 has provided a tag reader, such as a simple 2D cell code reader, which may be attached to the read head. The above configuration and example diagrams are intended to illustrate embodiments of the present invention, but should not be construed as limiting the present invention. The preferred embodiment of the present invention has been described in detail, and those skilled in the art can recognize different alternative designs and embodiments to implement the present invention from the patent application scope of the appendix below. (Please read the precautions on the back before filling this page) t Magic j ------- line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 24 This paper size is applicable to China National Standard (CNS) A4 specifications (2 ] 0 x 297 mm)

Claims (1)

516303516303 A7 B7 五、發明説明( 第90101670號專利申請案申請專利範圍修正本91年丨丨月6曰 1 · 一種用以標示物件之雷射掃描方法,該方法包 含·· a) 控制性地在一標示台中於第一方向_傳送物 件; b) 產生一聚焦之雷射光; c) 控制性地沿著二實質上垂直相交之軸線,在該 標示台上操縱該聚焦之雷射光,以根據代表標示 位置與標示内容的輸入資料,在至少一物件上, 標示一第一既定區域; d) 在實質上垂直於該標示台上該第一方向的一第 二方向上移動該軸線;以及 e) 控制性地沿著該移動的軸線,操縱該聚焦雷射 光’以根據該輸入資料,在該至少一物件上,標 示一第二既定區域。 2.如申請專利範圍第1項之方法,其另包含感測位 於该標示台上之至少一物件的至少一部份,且提 供代表該至少一部份之一影像的一對應信號,並 在進行步驟c之前,根據該信號於至少一轴線上 進行推移。 3·如申請專利範圍第1項之方法,其中該物件於步 驟c)中實質上為靜態。 4.如申請專利範圍第1項之方法,其中該物件於步 驟c)中控制性地被傳送。 -25- 本紙張尺度適用中國國家標準(⑽)A4規格(21〇&gt;&lt;297公釐) 516303 A7 B7 ’单’ 五、發明説明 正充 » Φ 5. 如申請專利範圍第2項之方法,其中該感測步驟 包含掃描該至少一物件之一區域的步驟,該區域 含有該至少一物件之一已知特徵,且提供一對應 影像信號,並在進行步驟c)之前,根據該影像信 號於至少一軸線上進行推移。 6. 如申請專利範圍第,項之方法,其中該物件為印 刷電路板。 7. 如申請專利範圍第1項之方法,其中該物件為積 體電路。 8·如申請專利範圍第1項之方法,其中該物件為半 導體封裝。 9 ·如申請專利範圍第1項之方法,其中一標示型樣 包含多個點,而具有約25-50微米大小之每個點 都標示在每個物件上。 -種用以標示物件之雷射掃描系統,該系統包 含: 一傳送帶,其用以在一標示台上於一第一方向傳 送物件; 一傳送帶控制器,其用以控制回應於傳送帶控制 信號之該傳送帶; 一雷射與一光學子系統’其均光學性的耦合到該 雷射光’以產生回應於雷射控制信號之一聚焦雷 射光; 一掃楛頭’其包含一雷射光偏轉器,該偏轉器用 -26- 10. 本紙張尺凌適用中國國家標準Α4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 袭丨 .訂· :線丨 516^_:_r . 姐-fc 年 九一—L·〜 Τ. ' · # L__ 小,;无 A7 -—-—~—·&gt;~&gt; _ Β7 五、發明說明() 以沿著二實質上垂直相交之軸線,操縱,位於該標 不台上之該聚焦雷射光,以在該至少一物件上標 不一第一既定區域,以回應該偏轉控制信號; 一致動器’其耦合到該掃描頭之至少一部份,以 移動實質上垂直於該標示台上之該第一方向的第 二方向軸線,以回應於移動控制信號,其中該雷 射光偏轉器沿著經移動之軸線來操縱該聚焦雷射 光線’以在該至少一物件上標示一第二既定區 域;以及 一中央控制器,其用以產生回應於代表標示區域 與標示内容之輸入資料的偏轉控制信號、雷射控 制信號、移動控制信號與傳送帶控制信號。 11·如申請專利範圍第10項之系統,其另包含一機 器視覺子系統,其用以感測位於該標示台上之至 少一物件的至少一部份,並且提供代表該至少一 4伤之一景&gt; 像的一對應影像信號,該中央控制器 產生回應於該影像信號之一推移信號,以於該至 少一軸線上進行推移。 12. 如申請專利範圍第11項之系統,其中該機器視 覺子系統包含一照明組件,其用以照明位於該標 示台上之物件β &lt; 13. 如申請專利範圍第1 2項之系統,其中該照明組 件包含一脈衝式照明子系統。 14·如申請專利範圍第1〇項之系統,其中該雷射光 -27- 本紙張尺度適用中國國家標準〈CNS) A4規格(210X297公爱) (請先閱讀背面之注意事項再填窝本頁) 、=口 · t 516303 ❿ 五、發明説明A7 B7 V. Description of the Invention (Patent Application No. 90101670, Application for Amendment of Patent Scope 91, 丨 丨 6th January 1st · A laser scanning method for marking objects, the method includes ... Convey the object in the first direction in the marking table; b) generate a focused laser light; c) controlively control the focused laser light on the marking table along two substantially perpendicular intersection axes to mark according to the representative Input data of position and marking content, marking a first predetermined area on at least one object; d) moving the axis in a second direction substantially perpendicular to the first direction on the marking platform; and e) controlling Along the moving axis, the focused laser light is manipulated to mark a second predetermined area on the at least one object according to the input data. 2. The method according to item 1 of the scope of patent application, further comprising sensing at least a part of at least one object located on the signage table, and providing a corresponding signal representing an image of the at least one part, and Before step c is performed, at least one axis is shifted according to the signal. 3. The method of claim 1 in which the object is substantially static in step c). 4. The method of claim 1 in which the object is controlledly transferred in step c). -25- The size of this paper applies Chinese national standard (⑽) A4 specification (21〇 &gt; &lt; 297mm) 516303 A7 B7 'Single' V. Description of invention is positive charge »Φ 5. If the method of applying for the second item of patent scope , Wherein the sensing step includes a step of scanning an area of the at least one object, the area contains a known feature of the at least one object, and provides a corresponding image signal, and according to the image signal before performing step c) Move on at least one axis. 6. The method according to item 1 of the patent application, wherein the object is a printed circuit board. 7. The method according to item 1 of the patent application scope, wherein the object is an integrated circuit. 8. The method according to item 1 of the patent application scope, wherein the object is a semiconductor package. 9 · The method according to item 1 of the patent application scope, wherein one of the marking patterns includes a plurality of dots, and each dot having a size of about 25-50 micrometers is marked on each object. A laser scanning system for marking an object, the system comprising: a conveyor belt for transferring an object in a first direction on a marking table; a conveyor controller for controlling a response to a conveyor control signal The conveyor belt; a laser and an optical subsystem 'both optically coupled to the laser light' to generate a focused laser light in response to a laser control signal; a sweeping head 'which contains a laser light deflector, the For deflectors -26- 10. This paper ruler applies the Chinese national standard A4 specification (210X297 mm) (Please read the precautions on the back before filling in this page) 丨 丨. Order:: Line 丨 516 ^ _: _r. Sister -fc 九 一 —L · ~ Τ. '· # L__ small ,; no A7 -—-— ~ — · &gt; ~ &gt; _ Β7 V. Description of the invention () To substantially perpendicularly intersect the axis along two , Manipulating the focused laser light located on the target stage to mark a first predetermined area on the at least one object in response to a deflection control signal; an actuator 'which is coupled to at least one of the scanning heads Part to move essentially vertically A second direction axis of the first direction on the marking platform in response to a movement control signal, wherein the laser light deflector manipulates the focused laser light ray along the moved axis to be on the at least one object Marking a second predetermined area; and a central controller for generating a deflection control signal, a laser control signal, a movement control signal, and a conveyor control signal in response to input data representing the marked area and the marked content. 11. The system of claim 10, which further includes a machine vision subsystem, which is used to sense at least a part of at least one object located on the signage table, and to provide a representative of the at least one injury. A scene &gt; a corresponding image signal of the image, the central controller generates a shift signal in response to one of the image signals to shift on the at least one axis. 12. If the system of item 11 of the patent application, wherein the machine vision subsystem includes a lighting component, which is used to illuminate the object located on the signboard β &lt; 13. If the system of item 12 of the patent application, The lighting assembly includes a pulsed lighting subsystem. 14. If you apply for the system of item 10 of the patent scope, where the laser light -27- This paper size is applicable to the Chinese national standard <CNS) A4 specification (210X297 public love) (Please read the precautions on the back before filling in this page ) 、 = 口 · t 516303 ❿ 5. Description of the invention 偏轉器包含一二維、可定址電流器。 1 5.如申凊專利範圍第1 〇項之系統,其另包含一第 -射其用以產生一掃描雷射光,該雷射光線 偏轉器沿著軸線方向操縱該掃描雷射光,以掃描 至少一物件之一區域,而該區域含有至少一物件 之已知特徵,並且提供一對應影像信號,該中 心控制器產生回應於該影像信號之一推移信號, 以在至少一軸線上進行推移。 16. 如申請專利範圍第1〇項之系統,其中該物件為 印刷電路板。 17. 如申請專利範圍第1〇項之系統,其中該物件為 積體電路。 18. 如申請專利範圍第1〇項之系統,其中該物件為 半導體封裝。 19_如申請專利範圍第1〇項之系統,其中一標示型 樣包含多個點,而具有約25-5〇微米大小之每個 點都標示在每個物件上。 20.如申請專利範圍第1〇項之系統,其中該傳送帶 可由該傳送控制器,以約5密耳之定位準確度, 來控制其定位。 21· 一種使用電路零件之光束位置控制之方法, 係用於以南解析度標示印刷電路板(pcB)、晶片〜 寸封裝(CSP)、微球栅陣列(# _BGA)或相似物件的 雷射標示系統中,該標示作用係在一具有一雷射 -28 - 本紙張尺度適用中國國家標準(CNS) A4規袼(210X297公楚〉 其 尺The deflector contains a two-dimensional, addressable current device. 15. According to the system of claim 10 of the patent scope, it further comprises a first laser beam for generating a scanning laser light, and the laser light deflector controls the scanning laser light along the axis direction to scan at least An area of an object, and the area contains the known characteristics of at least one object and provides a corresponding image signal. The central controller generates a shift signal in response to the image signal for shifting on at least one axis. 16. The system of claim 10, wherein the object is a printed circuit board. 17. The system as claimed in claim 10, wherein the object is an integrated circuit. 18. The system of claim 10, wherein the object is a semiconductor package. 19_ The system according to item 10 of the patent application, wherein a marking pattern includes a plurality of dots, and each dot having a size of about 25-50 microns is marked on each object. 20. The system of claim 10, wherein the conveyor can be controlled by the conveyor controller with a positioning accuracy of about 5 mils. 21 · A method for controlling the position of the light beam using circuit parts, which is used to mark the printed circuit board (pcB), chip ~ inch package (CSP), microsphere grid array (# _BGA) or similar objects at a south resolution In the marking system, the marking function is a laser -28-This paper size applies the Chinese National Standard (CNS) A4 Regulation (210X297)> -----------------------•袭------------------、可------------------線 (請先閲讀背面之注意事项再填寫本頁) 標示頭、一標示光束與—光束***的.標示台上 進行,該方法包含下列步驟: 將-機械視覺子系統設置在一與該雷射標示 頭分離的位置上; 將一欲被標示之物件設置在該標示台内; 利用該機械視覺子系統而自該欲被標示之物 件獲取影像資料; 使用該影像資料纟定位該物件之一特徵,以獲 取一特徵位置; 制該㈣位置來計算在—物件上欲被標示 之位置與該標示光束之間的至少一推移量; 基於該推移量來調整該標示光束之位置,以獲 得一經調整的標示光束;且 一在標示區域内的特定位置上,以該經調整的標 不光束來標不該物件。 22·如申凊專利範圍第21項之方法,其中在至少一 該物件上有數個特徵,且其中該計算步驟包含有 計算該推移與旋轉量。 23. 如申請專利範圍第21項之方法,其令該物件係 為IC封裝、晶片尺寸構裝或晶粒,且其_該欲標 不之特定位置係十分接近電路元件。 24. 如申請專利範圍帛21項之方法,其令該等電路 特徵係為電路線路或互聯部分。 25. 如申請專利範圍第以項之方法,其中至少一該 -29- ^氏張尺度賴巾關格(21GX297公釐) -—- 516303----------------------- • Attack ------------------ 、 Can ----- ------------- Line (Please read the precautions on the back before filling out this page) Marking head, a marking beam and —beam locator. The marking stage is performed. The method includes the following steps : Set the mechanical vision subsystem at a position separate from the laser marking head; set an object to be marked in the marking table; use the mechanical vision subsystem to obtain from the object to be marked Image data; using the image data to locate a feature of the object to obtain a feature position; to make the position to calculate at least a shift between the position to be marked on the object and the marked beam; based on the The position of the marking beam is adjusted by the amount of movement to obtain an adjusted marking beam; and at a specific position within the marking area, the object is marked with the adjusted marking beam. 22. The method of claim 21, wherein there are several features on at least one of the objects, and wherein the calculating step includes calculating the amount of rotation and rotation. 23. If the method in the scope of patent application is No. 21, the object is an IC package, a wafer size structure or a die, and the specific position where the object is to be marked is very close to the circuit component. 24. If the method of applying for the scope of item 21 of the patent, it makes these circuit features be circuit lines or interconnecting parts. 25. If the method according to item 1 of the scope of patent application is applied, at least one of the -29- ^ Zhang scale Lai Jinguan grid (21GX297 mm)---516303 發明説明Invention description 等互聯部分係為一微球柵陣列。 26. 如申請專利範圍第21項之方本甘士 ^ 万法,其中該等電路 特徵係為基準物或識別標記。 27. 如申請專利範圍第21項之方法,其令該等物件 係被標記在具有數個點的特定區域内,該等點每 一個的此尺寸係在約25-50微米之間。 28. 如申請專利範圍第21項之方法,其進一步包括 自動調整該雷射標示頭相對於該物件的高度。 29·如申請專利範圍第21項之方法,其中該標示區 域係為約1〇〇平方毫米。 (請先閲讀背面之注意事项再填寫本頁} 丨袭- ir— :線丨 •30- 本紙張尺度適用中國國家標準(CNS) Α4規格(210Χ297公釐)The equi-interconnected part is a microsphere grid array. 26. For example, the Fangben Ganshang method of the scope of application for patent No. 21, where the circuit characteristics are reference objects or identification marks. 27. In the method of applying for item 21 of the patent scope, the objects are marked in a specific area with a number of points, each of which has a size between about 25-50 microns. 28. The method of claim 21, further comprising automatically adjusting the height of the laser marking head relative to the object. 29. The method of claim 21, wherein the marked area is about 100 square millimeters. (Please read the precautions on the back before filling in this page} 丨 Raid-ir—: Line 丨 • 30- This paper size applies to China National Standard (CNS) Α4 specification (210 × 297 mm)
TW090101670A 2000-01-28 2001-05-02 Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like TW516303B (en)

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Cited By (4)

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US7622806B2 (en) 2005-10-14 2009-11-24 Chipmos Technologies (Bermuda) Ltd. Laser mark on an IC component
CN102446263A (en) * 2010-10-15 2012-05-09 北京赛腾工业标识***有限公司 Collection method of bar code information data of product
TWI511820B (en) * 2013-12-02 2015-12-11 Ardentec Corp Parameter loading method of laser process machine
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US7119351B2 (en) 2002-05-17 2006-10-10 Gsi Group Corporation Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking system
US7705268B2 (en) 2004-11-11 2010-04-27 Gsi Group Corporation Method and system for laser soft marking
US20070277619A1 (en) * 2005-05-02 2007-12-06 Grishaber Randy-David B Method for measuring deformations in test specimens and a system for marking the test specimens
US8378252B2 (en) * 2009-05-29 2013-02-19 Electro Scientific Industries, Inc. Method and apparatus for hybrid resolution feedback of a motion stage
US11964472B2 (en) 2018-11-28 2024-04-23 Hewlett-Packard Development Company, L.P. Applying marks to a surface of a medium

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5966457A (en) * 1955-06-14 1999-10-12 Lemelson; Jerome H. Method for inspecting, coding and sorting objects
PL169904B1 (en) * 1991-01-17 1996-09-30 United Distillers Plc Method of and apparatus for marking moving products
TW245844B (en) * 1993-01-29 1995-04-21 Komatsu Mfg Co Ltd
US6057871A (en) * 1998-07-10 2000-05-02 Litton Systems, Inc. Laser marking system and associated microlaser apparatus

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US7622806B2 (en) 2005-10-14 2009-11-24 Chipmos Technologies (Bermuda) Ltd. Laser mark on an IC component
CN102446263A (en) * 2010-10-15 2012-05-09 北京赛腾工业标识***有限公司 Collection method of bar code information data of product
TWI511820B (en) * 2013-12-02 2015-12-11 Ardentec Corp Parameter loading method of laser process machine
CN110139727A (en) * 2016-12-30 2019-08-16 伊雷克托科学工业股份有限公司 The method and system of optical device lifetime for extending in radium-shine processing equipment
US11260472B2 (en) 2016-12-30 2022-03-01 Electro Scientific Industries, Inc. Method and system for extending optics lifetime in laser processing apparatus
CN114654082A (en) * 2016-12-30 2022-06-24 伊雷克托科学工业股份有限公司 Method and system for extending optics lifetime in a laser processing apparatus

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