TW509967B - Shock resistant variable load tolerant wafer shipper - Google Patents

Abstract

A wafer shipper for stacked wafers provides significantly improved resistance to shock and impact as well as flexibility and tolerance in wafer capacities and guidance in optimal amount of packing material. These characteristics are provided by unique structural configurations that provide rigidity and desirable distribution of impact forces. The shipper has a base and a top cover both of which have a nominal wall that primarily forms all of the features of the respective components. The base has four sides, four corners, and arcuate wall segments defining a wafer stack pocket. The sides are formed of a downwardly extending nominal wall portion and an upwardly extending lip. Both adjoin a nominal wall defining a planar surface that extends around the base and forms a seat for the top cover. The planar surface adjoins the arcuate wall segments and also adjoins the floor of the wafer stack pocket that is also part of the nominal wall. Channels formed from the nominal wall extend downwardly from the floor of the wafer stack. The channels extend primarily radially or chordially. At each of the four corners of the base are shoulders that extend upwardly from the planar seat surface with each of said shoulders extending to the side wall. A feature and advantage of particular embodiments of the invention is the unique form fit whereby impact forces that are received on the corners and/or sides of the top cover are transferred to the base through the top cover to upright portions on the opposite side of the base from where the impact occurs. There is not a direct horizontal shock conduit from the corners or sides of the top cover to the adjacent portions on the base. This provides a significant improvement in the robustness of the container as well as significant improvement in the protection provided to the wafers, as well as much better resistance to unlatching upon such impact. A further feature and advantage of the invention is that in particular embodiments of the invention, an additional set of radially inwardly positioned arcuate wall segments of a lesser diameter are provided. These may cooperated with the first set of arcuate wall segments to provide a double wall for additional strength for resisting fracturing or damage to the wafers during occurrences such as dropping. Moreover, said second wall can be utilized to make a mold for molding a wafer carrier for a first size of wafers convertible into a mold for molding wafer carriers for a second sized of wafers, said second size smaller than the first. The convertible feature can be added by forming the appropriate concentric slots in the mold for the wafer carrier for the first size. Said appropriate concentric slots, are sized for the second size wafers. Suitably sized blanks may be inserted in said slots when the mold is to be used for the first size wafer carrier and the blanks may be removed when the mold is utilized for the second size. More broadly stated a mold for a wafer carrier can utilize separate inserts for converting from a first size pocket to a second size pocket. An aspect of the invention also include the methodology of accomplishing the converting of the mold and of making carriers with the mold.

Description

曰提案的美國臨時專利申請案號 本案係根據2000年5月9 6〇/2〇2,585之實用的申請案 :發明係關於半導體晶圓的載具，更特定而纟，係關於 ^具。此實用中請案主張優先權到2_年5月9日所提的 ^申請案號6G/2G2,585，及2_年7㈣日所提的臨時申 h案號60/217,656’兩個巾請案皆在此引用做爲參考。 積體電路係由半導體晶圓製成，其習用上爲圓形，並以 :砰的石夕所製成。這種晶圓在轉換該半導體或晶圓到積體 私路疋件時須接受許多製程。該許多製程必須在非常乾淨 的條件下來執行，用以使得製程中該晶圓的冷染可能性降 到最低。每個晶圓可在其製程循環中，接受即始沒有上百 個步驟，也有數十個。-晶圓受到污染及損害的可能性， 或良率的降低，皆會在該不同的製程及封裝步驟中產生。 特別是在製造設備中進行製程期間，任何微小的微粒皆會 損害到其所掉落的積體電路上。―旦該晶圓製程完成之^ ’其通常仍以晶圓形式來運送到—設備，其會對晶圓上的 每個個別電路進行切割，並包裹在積體電路封裝中。 在進行製程期間的嚴格微粒控制通常在運送完成的晶圓 到該切割及封珠該個別電路的設備期間並不必要。 傳統上，在處理，儲存及運送半導體晶圓期間，該晶圓 係在其邊，緣受到支撑及夾持.，以防止料其上具有電路的 晶圓表面造成任何的接觸，及可能的損害及冷染。 即使當半導體晶圓的尺寸日益變大，現在的直徑已高到 -4- 本紙張尺度適用中國國家標準(CNS) Α4規格(210X297公着) 509967 A7The proposed U.S. provisional patent application number This case is a practical application based on May 960 / 2602,585 in May 2000: the invention is about a semiconductor wafer carrier, and more specifically, it is about a tool. In this application, the application claims priority to the two applications named ^ Application No. 6G / 2G 2,585 filed on May 9, 2_, and the provisional application No. 60 / 217,656 'filed on July 7, 2_. All cases are cited here for reference. The integrated circuit is made of semiconductor wafers, which are conventionally circular and made of bang shixi. Such wafers have to undergo a number of processes when converting the semiconductor or wafer to an integrated circuit module. Many of these processes must be performed under very clean conditions to minimize the possibility of cold dyeing of the wafer during the process. Each wafer can be in its process cycle, there are not hundreds of steps, there are dozens of them. -The possibility of contamination and damage to the wafer, or a decrease in yield, will occur during the different manufacturing and packaging steps. Especially during the manufacturing process in the manufacturing equipment, any tiny particles can damage the integrated circuit they dropped. Once the wafer process is completed, it is usually still delivered to the device as a device, which cuts each individual circuit on the wafer and wraps it in an integrated circuit package. Strict particle control during the process is usually not necessary during the transport of the completed wafer to the dicing and beading equipment of the individual circuit. Traditionally, during the processing, storage, and transportation of semiconductor wafers, the wafer is supported and clamped at its edges and edges to prevent any contact and possible damage to the surface of the wafer with the circuit on it. And cold dyeing. Even when the size of semiconductor wafers is getting larger, the diameter is now as high as -4- This paper size is applicable to China National Standard (CNS) A4 specification (210X297) 509967 A7

五、發明説明（2 則贿，其元件密度也變得相當^。再者，料也變得較 涛，而提供更爲薄的完成#體電路封t。此趨勢至少一部 份是由於行動電話產業所提供更薄的行動電話所推動。 。隨著日益增大，1爲密集及更薄的晶圓之發展趨勢，晶 圓變爲更加昂貴1易碎，且更容易在運送期間受到損害 。雖然其有可能，有需要，且普遍地在密封的容器中來運 送車父厚的晶圓，其專門在晶圓邊緣支撑，若使用這樣的裝 置來運送較薄的晶圓時，會因爲晶圓的破損及損害而已證 實會有許多問題。其使用發泡材料，如胺基甲酸酯，來緩 衝該堆疊的上部及底部。 因此，對於較薄的更易損壞的晶圓，係使用將該晶圓軸 向地堆疊在另一個之上，並以類似紙的彈性板材料的疊層 來隔開之外殼。因此’每個晶圓的支撑係來自相鄰的晶圓 及整個晶圓堆疊。 請參考圖1，先前技藝的晶圓載具係揭示於Lin所提之美 國專利編號5,553,771，其揭示一種容器，具有一基座，定 義了一圓形開口的直立側壁，晶圓隔離物，及一上蓋’其 可降下，並可栓鎖在該基座。 圖2所示爲一習用的晶圓載具，其中該外殼係由一餅乾盒 狀的塑膠容器所定義，其具有一底部40，一上蓋42，ϋ使 用一圓形胺基曱酸酯底部緩衝44，及散佈在晶圓50之間的 板狀材料49。 請參考圖2及圖3，其揭示另一個晶圓載具，用以運送其 間有隔離物的堆疊晶圓。此晶圓載具具有一基座5 2及一上V. Description of the invention (2 bribes, the component density has become quite ^. In addition, the material has also become more rugged, and provides a thinner finish # 体 电路 封 t. This trend is at least partly due to action Pushed by the thinner mobile phones provided by the telephone industry. As the growing trend, 1 is the development trend of denser and thinner wafers, wafers have become more expensive, 1 fragile, and more vulnerable to damage during shipping. Although it is possible, necessary, and commonly used to transport thicker wafers in sealed containers, it is specifically supported at the edge of the wafer. If such a device is used to transport thinner wafers, it will be because Wafer breakage and damage has proven to have many problems. It uses foamed materials, such as urethane, to cushion the top and bottom of the stack. Therefore, for thinner and more vulnerable wafers, the use of The wafers are stacked axially on top of each other and are separated by a shell of paper-like elastic sheet material. Therefore 'the support for each wafer comes from the adjacent wafer and the entire wafer stack Please refer to Figure 1, previous skills The wafer carrier is disclosed in U.S. Patent No. 5,553,771 filed by Lin, which discloses a container having a base defining an upright side wall with a circular opening, a wafer spacer, and an upper cover 'which can be lowered, and It can be bolted to the base. Figure 2 shows a conventional wafer carrier, wherein the shell is defined by a biscuit box-shaped plastic container, which has a bottom 40, an upper lid 42, and a round shape. Urethane bottom buffer 44 and plate-like material 49 interspersed between wafers 50. Please refer to Fig. 2 and Fig. 3, which shows another wafer carrier for transporting stacked wafers with spacers in between This wafer carrier has a base 5 2 and a top

本紙張尺度適用中國國家標準(CNS) Α4規格(210 X 297公釐)This paper size applies to China National Standard (CNS) Α4 (210 X 297 mm)

一 該基座與上盍係射出成型，其爲圓形，並在該基座 :件中軸向延伸結構化組件5 6，5 8。類似地，該上蓋具有 向I伸的圓形結構化組件5 9及6 0，及徑向延伸的肋條 66，69，其也轴向地突出。 圮些堆璺晶圓載具可以人工處理，或以機械手臂處理。 因此，開啓及關閉這種容器的裝置必須可以㈣手動或由 機械手臂操作，對於人工操作者必須儘可能地簡單，可靠 及決速。已知有不同的裝置可用來閃鎖這種晶圓載具。這 些包含在圖！所示的先前技藝之貫穿物，或圖2所示先前技 -的扣接ώ封裝置。在圖3，4，5及6所示的先前技藝的具 :實施例中的-最少旋轉螺紋，及圖7, 8, 9及10所示的先 酌技藝的具體貫施例中的軸向突出的彈簧栓鎖。 Θ曰日圓載具使用螺紋嚙合者皆很難用，並會有錯誤對準 及不適當的安裝。這些晶圓載具皆看起來對稱在至少兩個 平面，因此其基本上有四個不同的選擇來組合一上蓋到一 底I仁疋，白用的先前技藝載具通常需要該上蓋僅能組 裝在一特定的方向，用來適當的栓鎖。A base and an upper cymbal are injection-molded, which are circular, and a structural component 5 6, 5 8 is axially extended in the base. Similarly, the upper cover has circular structured components 59 and 60 extending toward I, and radially extending ribs 66, 69, which also protrude axially. These stacks of wafer carriers can be handled manually or with a robotic arm. Therefore, the device for opening and closing the container must be capable of being operated manually or by a robotic arm, and it must be as simple, reliable and fast as possible for manual operators. Various devices are known for flash-locking such wafer carriers. These are included in the picture! The penetrating object of the prior art shown, or the fastening device of the prior art shown in FIG. 2. The prior art tools shown in Figs. 3, 4, 5 and 6: in the embodiment-the minimum rotation thread, and the axial direction in the specific embodiment of the prior art shown in Figs. 7, 8, 9 and 10 Protruding spring latches. Θ said that Japanese yen carriers are difficult to use with threaded engagement, and will have misalignment and improper installation. These wafer carriers all look symmetrical in at least two planes, so they basically have four different options to combine an upper cover to a lower one. Previously used carriers of white technology usually required that the upper cover can only be assembled on A specific direction for proper latching.

Lewis等人所提的美國專利編號6,丨93,〇68，其揭示一種軸 ，延2彈簧問鎖’並使用—雙重壁來定義晶圓載具的堆 畳之谷器。忒雙重壁厚度係由兩個間隔的薄壁區段所定義 ，其由該基座延伸但彼此並爲附著。此架構可以允許個別 未支撑的薄壁僅在該底座支撑來具有及保持變形。該薄壁 的同心圓配置可使這種變形的可視度變爲明顯。在此先前 技藝的具體實施例中的雙重側壁可協助來隔離對上蓋的直U.S. Patent No. 6, 丨 93, 〇68 by Lewis et al. Discloses a shaft, 2 spring interlocks, and uses a double wall to define a wafer stacker.忒 Dual wall thickness is defined by two spaced thin-walled sections that extend from the base but are attached to each other. This structure allows individual unsupported thin walls to be supported and deformed only on the base. The thin-walled concentric circle configuration makes the visibility of this deformation obvious. The double sidewalls in this embodiment of the prior art can help isolate the

裝 η -6- 509967 A7Loading η -6- 509967 A7

接衝擊， 的壁面。 其來自上盖結構而直接傳送到定 羲了該晶圓容器 在圖7, 8.，9及10所示的具體實施例中，何獨 將會發生’如圖Η中的G所示。該晶圓載具的這種自盡 可造成琢基座的其它平坦角落的變形，而 表面上時，加壓而造成不穩定的狀況，而在放 介面上時造成安置錯誤。這種變形可部份因爲過载情況而 造成，其部份也是由該晶圓載具的結構化架構所造成 其有需要在這種晶圓載具的基座中提供足夠的結構來防 止這種扭曲及彎曲。再者，其有高度需要來提供一晶圓載 具，其具有標示裝置來防止這種過載的狀況。 請參考圖12, 13, 14及15，其所示爲另一個先前技藝的 晶圓載具。此晶圓載具具有一阻止螺紋82, 84，其可允許 該晶圓載具旋轉小於3 0。來完成該閂鎖。此晶圓载具的困 難點在於在該旋轉之前，將該上蓋初次放置在該基座上時 ，需要相當精確的角度定位。 此具體實施例利用類似於圖8，9及丨〇的先前技藝具體實 施例的軸向突出雙重薄壁，雖然該雙重側壁係連接到每個 區段的末端。因此，其定義了四個獨立的壁面部份，其皆 彼此不同’並整合在該基座上。由於該連接部份可連接 每個薄側壁區段的配對，對於該上蓋的直接衝擊將會直接 地傳送這種衝擊力由該上蓋通過該連接部份94到該晶圓。 此上蓋也具有像是節的特徵，其可嚙合一軟式碟片。參考 圖16，其在該節之一處具有該壁面的一橫截面。 本纸張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 具體實施例皆爲熱塑 種材料需要像是肋條 一般而了，此處所有的晶圓載具的 性材料的射出成型，例如聚丙烯。這 及通道的結構來強化。 在這些載具中’其不需要嚴格的微粒控制條件，而其爲 在晶圓製程環境中載具所必須，其不需要具有密封的封條 。事貫上’這種密封封條係不利於機械手臂處理，而易於 人工處理二特別是該载具的開啓與關閉。其仍是很重要地 具有在上蓋與基座之間的介面來提供儘可能良好的密封特 性。再者’其很重要地是排除或減少任何在該上蓋或基座 的角落中間沿著側壁之一發生彎曲。 這一形式的j II皆使用_次並丟棄’或可回收使用多次 。雖然在這種容器中所運送的產品可爲非常高的價値，其 仍很重要地是來儘可能地降低該載具的製造成本，並符ς 其它必要的特性。 口 这種堆疊晶圓的晶圓載具的最重要特徵爲，該載具提供 防止由於運送期間的震動造成的損害。此震動可包含直接 對於該載具的上蓋或基座，或包含搖動整個載具包裝所致 的直接衝I。在任何情況τ，其很重要地要提供保護裝載 在其中的晶圓不要受到損害。 再者，其很重要地是這種晶圓載具提供高整合性的閂鎖 裝置’其不會在運送或處理期間不愼地開啓，例如在當該 載具不愼掉落時。 @ ~ 這種載具基本上經過落下測試來決定該載具的整體整合 f生在這種掉落，脱開，載具破壞或晶圓的損壞時，皆會 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐） 五、發明説明（6 …在掉落’包含落下測試，的衝擊，皆會產生 男力’壓縮及張力在該載具元件 # “座 ，比V q 眾載具，包含該閂鎖 白必須在裝載時承受這些力量的組合。 乙Ϊ具非常依賴晶圓之間的隔離材料，其可爲聚 =材及：，並提供-靜態消散特性，聚亞胺繼體 彈性薄板材料。基本上，放置在該堆疊的 一、=^ ^上的包裝材料’其爲可壓縮的聚亞胺醋發泡體 。琢發泡體的可壓縮性可以利於在一特殊載具中包裝不同 數目的曰曰B] ’其可留下一些不需要的判斷到該包裝器，例 如對於：特殊載具適合多少晶圓及/或多少襯整材料。再者 :在先前技藝的晶圓載具中，***額外或甚至晶圓及發泡 填料的完整負荷特別是在該對角線角落上具有閃鎖，造成 該上蓋及/或基座的扭曲及/或彎曲。此彎曲實際上可造成 該上蓋與基座之間的間隙。這種間隙直覺上是不必要的， 其可提供一路徑給污染物質，且進一步會在衝擊或震動期 間影響該容器的整合性，造成破壞或脱開。如果該載具係 以發泡體或^包裝材料所包裝，在正常的衝擊^艮制下的 極限將會發生破壞。已知的先前技藝中，晶圓載體未提供 好的輔助來辨識一適當的發泡範圍，及堆疊晶圓的厚度，' 其最佳地是可提供該晶圓的安全性。類似地，在相對對角 線角落上具有閂鎖的堆疊晶圓載具未提供裝置來使該溝槽 的可見性最小化，在當該載具完全負載或稍微過載時，存 在於該載具的側邊。再者，這些先前技藝的載具不適當地 技供結構化裝置到該基座與上蓋，藉以提供強固性，並使 -9 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 509967 -一 A7 ________gl 五、發明説明（7 ) "~~' -- 在該介面處的該彎曲及間隙最小化。 發明概述_ -種用於堆疊晶圓的晶圓載具，其可提供明顯改良的振 動及衝擊抗性，以及在最佳化的封裝材料數量下，晶圓容 量及導引的彈性及容許誤差。這些特性係由獨特的結構性 架構所提供，其可提供剛性及對於衝擊力量的所需要分佈 。該載具具有—基座及上蓋，兩者皆具有_公稱的壁面， 其主要形成了所有個別元件的特徵。該基座具有四邊，四 個角落’及拱形的壁面區段’其定義了 —晶圓堆疊容器。 該側邊係以向下延伸的公稱壁面部份及一向上延伸的邊緣 所形成。兩者皆靠近一公稱壁面，其定義了一平坦表面， 其延伸環緩該基座，並形成該上蓋的底座。該平坦承載表 面貼近該拱形壁面區段，也貼近該直立停止部份，其爲位 在該基座的角落處的四個肩部的部份。每個該肩部延伸到 該側壁。由該公稱基座壁形成的通道由該晶圓堆疊容器的 底部向下延伸。該通道主要是沿徑向或弦向地延伸。 茲上盍具有一連續公稱側壁，其延伸環繞該四個側邊。 該側邊貼近該上蓋的上壁面，其包含凹處的公稱壁面結構 ，其提供了該上蓋以及該堆疊上部嚙合表面的堅固性。四 個在該角落處向外延伸的耳部，其包含側邊上的閂鎖槽凹 下結構，及閂鎖保持裝置。在上蓋週邊的上方邊緣向上延 伸，其尺寸略小於該基座的向下延伸壁面，所以其可堆疊 數個載具。 ^ 本發明的特殊具體實施例的一特徵及好處在於其獨特的 -10- 本纸張尺度適用中國國豕標準(CNS) A4規格(210 X 297公爱) _____ B7 五、發明説明（8 ) 形式，使得在該角落及/或該上蓋側邊所接收到的衝擊力， 可以由該衝擊發生的地方，經由該上蓋傳送到該基座，再 到該基座的相反側上的直立部份。由該角落或該上蓋的側 邊不會有直接的水平震動管道到該基座上的相鄰部份。此 即提供了該容器的堅固性的明顯改善，及對於該晶圓所提 供保濩的明顯改善，以及在這種衝擊之下較佳的拉開阻力。 本發明的特殊具體實施例的進一步特徵及好處在於，其 提供較小直徑的一組額外的同心圓的的拱形壁面區段。這 些可於該第一組拱形壁面區段結合來提供一額外強度的雙 重壁面，用以在發生像是掉落的時候，可抵抗破裂或損害 到該晶圓。再者，該第二壁面可用來製成一模具，用以模 製一第一尺寸晶圓的一晶圓載具，其可轉換到一第二尺寸 晶圓的模製晶圓載具的模具，該第二尺寸係小於該第一尺 寸。該可轉換的特色可由在該第一尺寸的晶圓載具的模具 中形成適當的同心圓槽來加入。該適當的同心圓槽的尺寸 係符合該第二尺寸的晶圓。當該模具是用於該第一尺寸晶 圓載具時’可***適當尺寸的空白到該槽中，而當該模具 用於第二尺寸時，即移除該空白。更廣義而言，一晶圓載 具模具可利用獨立的***件來由一第一尺寸容器轉換到一 第二尺寸容器。 本發明的一特徵及好處在於，其可利用一單一模具來用 於承載不同尺寸晶圓的不同載具。再者，這種模具將提供 一單一標記，這種單一標記將可在改變晶圓時，以較少的 設備改變來簡易地構成自動化處理。這種單一標記將允許 -11 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐） 在一單—3& 田 士、 , ®中對於不同尺寸晶圓的載具堆疊。再者，運 送這種單—扭2、 ^ 載具，將在封裝及緩衝材料時較爲簡易及 使宜，對於—.J. 〇 、 特殊曰ΕΪ圓通常爲特殊尺寸者，其更爲通用。 ^ 义明的特殊具體實施例的特徵及好處在於，其可比其 匕先則技藝的晶圓载具要容易模製化，其需要結構性強固 的’且件。習用的肋條會造成縮水問題。 ^本發明的特殊具體實施例的進一步特徵及好處在於，也 ^用"亥Α稱壁面強固組件來產生記憶體碟片的容器，其 爲3 /2軟式磲片或cD。 口 ^ 4發明的特殊具體實施例的進-步特徵及好處在於，由 4公％壁面所形成的徑向通道將提供對於該元件，特別是 忑基座扭轉時的明顯較佳的抵抗性。 本發明的特殊具體 在邊上盍與該基座之 所提供一迷宮式密封 實施例的進一步特徵及好處在於，其 間的介面處，沿著該組裝的載具側邊 、、本發明的特殊具體實施例的進一步特徵及好處在於，由 f基座延伸的該閃鎖臂具有-水平元件來提供該臂的加長 此力。如此可提供一閂鎖力量，其可在比習用閂鎖臂要寬 的負載範圍之下仍維持—致’並可由該基座直接延伸，並 僅在垂直方向上。也就是説，該彈簧係數可比習用閂鎖臂 要在較大的距離中皆爲有效。 / 本發明的特殊具體實施例的特徵及好處在於，該公稱壁 面係用來提供結構的強固性，而不使用加強肋。該公稱壁 面係做成直線的通道，而非在本技藝中所熟知的與該 509967 A7Then hit the wall surface of the impact. It comes from the top cover structure and is directly transferred to the wafer container. In the specific embodiments shown in Figs. 7, 8, 9, and 10, He Du will happen 'as shown by G in Fig. Η. This self-destruction of the wafer carrier can cause deformation of other flat corners of the base, and when it is pressed on the surface, it causes an unstable situation, and it causes a placement error when it is placed on the interface. This deformation can be partly caused by overload conditions, and part of it is also caused by the structure of the wafer carrier. It is necessary to provide sufficient structure in the base of the wafer carrier to prevent this distortion. And bend. Furthermore, there is a high need to provide a wafer carrier with a marking device to prevent such an overload condition. Please refer to Figures 12, 13, 14 and 15, which show another wafer carrier of the prior art. The wafer carrier has a stop screw 82, 84 which allows the wafer carrier to rotate less than 30. To complete the latch. The difficulty of this wafer carrier is that the first time the upper cover is placed on the base before the rotation, it needs to be positioned at a fairly precise angle. This specific embodiment utilizes axially protruding double thin walls similar to the prior art specific embodiments of Figs. 8, 9, and 10, although the double side walls are attached to the ends of each section. Therefore, it defines four independent wall portions, all of which are different from each other 'and integrated on the base. Since the connecting portion can connect the pair of each thin sidewall section, a direct impact on the upper cover will directly transmit such an impact force from the upper cover through the connecting portion 94 to the wafer. This cover also has a knot-like feature, which can engage a flexible disc. Reference is made to Fig. 16, which has a cross section of the wall surface at one of the sections. This paper size applies the Chinese National Standard (CNS) A4 specification (210X 297mm). The specific examples are all thermoplastic materials need to be like ribs. Here, all the wafer carriers are injection molded. For example polypropylene. This and the structure of the channel to strengthen. In these carriers, it does not require strict particle control conditions, and it is required for carriers in a wafer processing environment, and it does not need to have a sealed seal. This kind of sealing seal is not conducive to the handling of the robot arm, and is easy to handle manually, especially the opening and closing of the vehicle. It is still important to have an interface between the upper cover and the base to provide the best possible sealing characteristics. Furthermore, it is important to exclude or reduce any bending along one of the side walls in the middle of the corner of the cover or base. This form of j II is used _ times and discarded 'or can be recycled and used multiple times. Although the product shipped in such a container can be very expensive, it is still important to minimize the manufacturing cost of the vehicle and to meet other necessary characteristics. The most important feature of this wafer carrier for stacked wafers is that the carrier provides protection against damage due to vibration during transport. This vibration may include direct impact on the top or base of the vehicle, or direct shock I caused by shaking the entire packaging of the vehicle. In any case τ, it is important to provide protection for the wafers loaded therein from being damaged. Furthermore, it is important that this wafer carrier provides a highly integrated latching device ' that does not open unintentionally during shipping or processing, for example when the carrier does not fall off. @ ~ This carrier is basically subjected to a drop test to determine the overall integration of the carrier. In this drop, disengagement, carrier damage, or wafer damage, all paper standards will apply Chinese national standards ( CNS) A4 specification (210 X 297 mm) V. Description of the invention (6… In the drop test, including the drop test, the impact will produce male force 'compression and tension in the carrier element # "block, than V q Many vehicles, including the combination of the latching white that must withstand these forces during loading. The Ai tool is very dependent on the isolation material between the wafers, which can be poly = and and provides-static dissipation characteristics, poly Amine relay elastic sheet material. Basically, the packaging material placed on the stack of one, ^^ ^ is a compressible polyurethane foam. The compressibility of the foam can be beneficial in one A special carrier packs a different number of days, B] 'It can leave some unneeded judgments on the packer, such as: how many wafers and / or how much lining material the special carrier is suitable for. Also: in the previous Technology wafer carrier, insert additional or even wafers and The full load of the foam filler has flash locks in particular on the diagonal corners, causing distortion and / or bending of the cover and / or base. This bending can actually cause a gap between the cover and the base. This This kind of gap is intuitively unnecessary, it can provide a path to the pollutants, and further affect the integrity of the container during shock or vibration, causing damage or disengagement. If the carrier is made of foam or ^ The packaging material will be damaged under normal impact conditions. In the known prior art, the wafer carrier does not provide good assistance to identify a proper foaming range and the thickness of the stacked wafers. , 'It is best to provide the security of the wafer. Similarly, stacked wafer carriers with latches on opposite diagonal corners do not provide a means to minimize the visibility of the trenches. When the vehicle is fully or slightly overloaded, it exists on the side of the vehicle. Furthermore, these prior art vehicles inappropriately provide structured devices to the base and cover to provide robustness and make -9-paper Zhang scale is applicable to China National Standard (CNS) A4 specification (210X297 mm) 509967-one A7 ________gl V. Description of the invention (7) " ~~ '-Minimize the bending and gap at the interface. Summary of the invention_ -A wafer carrier for stacked wafers, which can provide significantly improved vibration and shock resistance, as well as the flexibility and tolerance of wafer capacity and guidance under the optimized amount of packaging materials. These characteristics are Provided by a unique structural structure, it can provide rigidity and the required distribution of impact force. The carrier has a base and a cover, both of which have a nominal wall surface, which mainly forms the characteristics of all individual components The base has four sides, four corners, and an arched wall section, which defines a wafer stacking container. The side is formed by a nominal wall portion extending downward and an edge extending upward. Both are close to a nominal wall surface, which defines a flat surface, whose extension ring slows down the base and forms the base of the upper cover. The flat load-bearing surface is close to the arched wall surface section and also close to the upright stop portion, which is a portion of four shoulders at the corners of the base. Each of the shoulders extends to the side wall. A channel formed by the nominal pedestal wall extends downward from the bottom of the wafer stacking container. The channel extends mainly radially or chordally. Herein, the upper side has a continuous nominal side wall, which extends around the four sides. The side edge is close to the upper wall surface of the upper cover, and includes a nominal wall surface structure of the recess, which provides the rigidity of the upper cover and the upper engaging surface of the stack. Four ears extend outward at the corner, and include latch recesses on the sides, and latch retention devices. The upper edge of the perimeter of the upper cover extends upward, and its size is slightly smaller than the downward extending wall surface of the base, so it can stack several carriers. ^ A feature and benefit of the special embodiment of the present invention lies in its unique -10- This paper size applies to China National Standard (CNS) A4 specification (210 X 297 public love) _____ B7 V. Description of the invention (8) Form so that the impact force received at the corner and / or the side of the upper cover can be transmitted from the place where the impact occurs to the base via the upper cover, and then to the upright part on the opposite side of the base . There will be no direct horizontal vibration pipe from the corner or the side of the upper cover to the adjacent part on the base. This provides a significant improvement in the robustness of the container, and a significant improvement in the security provided for the wafer, as well as a better pull resistance under such impacts. A further feature and benefit of the particular embodiment of the present invention is that it provides a set of additional concentric circular arcuate wall sections of smaller diameter. These can be combined in the first set of arched wall sections to provide a double wall of extra strength to resist cracking or damage to the wafer in the event of a drop. Furthermore, the second wall surface can be used to make a mold for molding a wafer carrier of a first size wafer, which can be converted to a mold of a mold wafer carrier of a second size wafer, the The second dimension is smaller than the first dimension. The switchable feature can be added by forming appropriate concentric grooves in the mold of the first size wafer carrier. The size of the appropriate concentric groove is a wafer of the second size. When the mold is used in the first size wafer carrier, a blank of an appropriate size can be inserted into the slot, and when the mold is used in the second size, the blank is removed. More broadly, a wafer carrier mold can use a separate insert to switch from a first size container to a second size container. A feature and benefit of the present invention is that it can utilize a single mold for different carriers carrying wafers of different sizes. Furthermore, such a mold will provide a single mark, which can easily constitute an automated process with less equipment changes when changing wafers. This single mark will allow -11-this paper size to apply the Chinese National Standard (CNS) A4 specification (210X297 mm) in a single-3 & Tian Shi,, ® for the stacking of different size wafers. In addition, transporting such single-twisted 2, ^ carriers will be easier and more convenient when packaging and cushioning materials. For -.J. 〇, special Ϊ circle is usually a special size, it is more general . ^ The features and benefits of Yiming's special embodiment are that it can be easier to mold than the wafer carrier of its dagger technology, and it requires a structurally strong one. Conventional ribs can cause shrinkage problems. ^ A further feature and benefit of the particular embodiment of the present invention is that ^ a container with a wall surface rigidity component is also used to create a memory disc container, which is a 3/2 soft diaphragm or cD. A further feature and benefit of the particular embodiment of the invention is that the radial channel formed by the 4 mm% wall surface will provide significantly better resistance to the element, particularly when the base is twisted. The special embodiment of the present invention is further characterized by a labyrinth seal provided on the side and the base, and the advantage is that the interface therebetween is along the side of the assembled vehicle, the special embodiment of the present invention. A further feature and benefit of the embodiment is that the flash lock arm extending from the f base has a horizontal element to provide the arm with an extension of this force. This provides a latching force that can be maintained over a wider load range than a conventional latching arm-and it can be directly extended by the base and only in the vertical direction. In other words, this spring coefficient can be more effective over a larger distance than the conventional latch arm. / A special embodiment of the present invention is characterized and advantageous in that the nominal wall surface is used to provide structural rigidity without using reinforcing ribs. The nominal wall is formed as a straight passage, rather than the 509967 A7, which is well known in the art.

發明説明（10 容器爲同心圓的圓形通道。該直線通道係在該基座及上蓋 上爲徑向或弦向的方向。其中有數個鎖扣位置來連接該基 厓與該上蓋，例如四個或更多，其係環繞該晶圓容器做圓 周性地相隔開，該同心圓形通道較適合。但是，當有兩個 鎖扣位置位在該基座及上蓋的角落處的彼此對角線上，在 田使用技向及/或弦向延伸的通道時，該基座的結構強固性 及扭轉的抵抗性可以明顯地改善。Description of the invention (10 The container is a concentric circular channel. The linear channel is a radial or chordal direction on the base and the upper cover. There are several locking positions to connect the base cliff to the upper cover, such as four Two or more, which are circumferentially spaced around the wafer container, and the concentric circular passage is more suitable. However, when there are two lock positions located diagonally from each other at the corners of the base and the upper cover On the wire, when the technically and / or chordally extending channels are used in Tian, the structural rigidity and resistance to torsion of the base can be significantly improved.

裝 本發明的特殊具體實施例的進一步特徵及好處在於，由 該上蓋延伸的側壁具有一形狀的單一公稱壁面，在平面圖 上，其具有四個直線側壁及小型的角落，其具有向内延伸 的通道。這種架構提供了比習用的簡單形狀，如圓柱形或 方形，其具有明顯較佳的強固性，並使用比本技藝中熟知 雙重加強壁大致要較少的材料。 … 本發明的特殊具體實施例的進一步特徵及好處在於，其 可簡單地進行一致性的模製，並比先前技藝中的堆疊晶圓 載具要使用明顯較少的材料。 1式簡單A further feature and advantage of the special embodiment of the present invention is that the side wall extending from the upper cover has a single shape of a nominal wall surface. In a plan view, it has four linear side walls and small corners. aisle. This architecture provides a simpler shape than conventional, such as cylindrical or square, which has significantly better robustness and uses substantially less material than the double reinforced walls well known in the art. … A further feature and benefit of the particular embodiment of the present invention is that it can be molded uniformly and uses significantly less material than stacked wafer carriers in the prior art. Type 1 is simple

圖1爲用以承載一晶圓堆疊之先前技藝晶圓載具的透視圖。 圖2爲先前技藝晶圓載具的基座之透視圖。 圖3爲先前技藝晶圓載具的上蓋之透視圖。 圖4所示爲先前技藝晶圓載具之透視圖，用以説明彎曲移 足性的問題。 圖5 jpg據此處發明的一晶圓載具之透視圖。 發明的一載具基座之平面圖。 -13 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) A7 B7 五、發明説明（11 圖7爲根據此處發明的一基座之底視圖。 圖8爲圖2 6的基座之側視圖。 圖9爲根據此處發明的一上蓋之上視圖。 圖1〇爲圖27的線CC所取出的橫截面圖。 圖11爲根據此處發明的一基座角落之透視圖。 圖12爲圖27的上蓋之底視圖。 圖1 3爲一晶圓載具的橫截面圖，其説明該震動吸收特性。 圖爲一底座的平面圖，其説明該上蓋的正常安置位置。 圖1 5爲根據此處説明的一晶圓載具的正視圖，其説明該 基座的該迷宮密封及週邊邊緣。 圖16爲圖31的線33-33所取出的橫截面圖，其説明該基 座的該迷宮密封及週邊邊緣。 圖17爲圖34，35，36及37中所示的該晶圓載具基座的上 視圖。 圖1 8爲圖3 8中所示的該晶圓載具設計的底視圖。 圖19爲圖38中線A-A所取出之該晶圓載具的截面圖。 圖20爲圖38中線B-B所取出之該晶圓載具的截面圖。 圖2 1爲一可轉換模具的透視圖，其具有***件來轉換該 模具在具有一第一尺寸的晶圓容器之載具模具到一第二尺 寸的晶圓容器之模具。 較佳具體實施例的詳細説明 請參考圖5, 6, 7, 8, 9, 10, 11及I2，其爲一晶圓載具的 不同透視圖，其包含兩個結合的部份，做爲一基座2〇2及— 上盖204。該上蓋及基座在一介面206處結合，並由問鎖機 -14- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) ' -^ --- 509967 一- A7 ___ B7 五、發明説明<2 ) 制207所固定。 請參考圖6，7 v 8及1 1，該基座具有複數個拱型橫向晶圓 支撐區段208，其自該基座的一平面部分21〇延伸，定義了 該晶圓堆疊封包212。地板211係置於該封包的底部。該平 面部分構成一底座及該上蓋邊緣的承載表面。一側壁214延 伸在該基座的周圍214。在該封包地板中的公稱壁面結構 216，218，200藉由位在該地板與每個晶圓支撐側壁部分之 間的波浪形固著221而提供了結構性剛性。由該公稱壁面結 構形成的輻射狀結構係包含複數個由該封包地板向下延伸 的通道222。 請參考圖5, 8及n，其爲該基座部份角落之不同的透視 圖。該平坦表面210，其構成該上蓋邊緣的承載表面，其延 伸環繞邊側向晶圓支撑區段208。其由該平坦表面21〇向上 延伸，其爲一突出結構而做爲一肩部25〇。該肩部包含一直 亙表面254，其做爲該上蓋2〇4的一外部限制，其主要是在 衝擊或其它壓力期間。 由該基座的四個角落中的兩個延伸爲閂鎖組件264。閂鎖 組件包含一鉤狀部份266，其具有一凸輪表面268及一嚙合 表面270。孩凸輪表面在當該上蓋降低到該閂鎖位置時，偏 斜該問鎖㈣，並咬住與該上蓋的上表面嘴合的表面27〇。 明顯地’㈣鎖f具有_水平延伸區段⑽及延伸到一直立 部份284的曲部份282。該水平部份藉由允許該组件的 向上及向下彎曲，而降低該問鎖組件在該垂直方向中的彈 簧係數。此相較於習用具有閃鎖的晶圓載具，其並不包含 -15- 本紙張尺度適用中國國豕標準(CNS) A4規格(210X297公爱) 509967 A7 B7 五、發明説明<3 孩水平組件，其垂直方向上的彈簧係數係等於該材料的彈 簧係數，及任何其所附著的基座彎曲。Μ平部份可有效 地延伸到該位置，其中該上蓋可固定於此。再者，其可軟 化該上蓋的下拉朝向該基座，其可允許在衝擊時的較大震 動吸收，例如該載具的掉落。言亥震動口及收可防止對該晶圓 進一步地損害，其可防止可能會對該載具發生的損害。 在圖5, 6, 8及11中也顯示，一邊緣274可由該平坦表面 210向上延伸。該邊緣提供該上蓋的額外衝擊表面，將在下 面詳細説明。 巧參考圖5，9，10及12，其所示爲該第二零件或上蓋的 不同視圖。該明顯的特徵包含一公稱壁面32〇,其包含了該 上盍的大邵份’其包含不同的加強結構33〇。請參考圖2 1， 該公稱壁面係用來提供一容器336給31/2英吋碟片，及一較 大的谷器338 ’其尺寸是給一 CD外殼。該上蓋具有一週邊 350 ’其包含沿著該週邊向上延伸的邊緣354。該邊緣加入 到琢結構強固性，並提供一堆疊裝置。四個平面側壁36〇由 該上邊緣350向下延伸，並具有***角落部份365，其定義 一晶圓外殼。該晶圓外殼周邊368的形狀通常爲方形，其角 落369***一膨脹的通道形狀，如編號372所標示。在每個 角落369處，其爲具有孔洞376的凸緣部份374，用以接收該 閂鎖組件的頭部377。該孔洞係部份由凸輪表面38〇所定義 ’藉以在該閂鎖組件的上部喝合該傾斜面。該凸緣具有一 平面邵份390及一邊緣部份392，其結合來提供明顯地強固 性到該角落部份。由該上蓋明顯向下延伸結構395配合該側 -16 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)FIG. 1 is a perspective view of a prior art wafer carrier used to carry a wafer stack. FIG. 2 is a perspective view of a base of a prior art wafer carrier. FIG. 3 is a perspective view of an upper cover of a wafer carrier of the prior art. Figure 4 shows a perspective view of a prior art wafer carrier to illustrate the problem of bendability. Figure 5 jpg A perspective view of a wafer carrier invented according to this. A plan view of a vehicle base invented. -13-This paper size applies Chinese National Standard (CNS) A4 specification (210X297mm) A7 B7 V. Description of the invention (11 Figure 7 is a bottom view of a base according to the invention here. Figure 8 is a view of Figure 2 6 Side view of the base. Fig. 9 is a top view of an upper cover according to the invention herein. Fig. 10 is a cross-sectional view taken from line CC of Fig. 27. Fig. 11 is a perspective view of a corner of the base according to the invention. Fig. 12 is a bottom view of the upper cover of Fig. 27. Fig. 13 is a cross-sectional view of a wafer carrier, which illustrates the vibration absorption characteristics. The figure is a plan view of a base, which illustrates the normal placement position of the upper cover. 15 is a front view of a wafer carrier described here, illustrating the labyrinth seal and peripheral edge of the pedestal. FIG. 16 is a cross-sectional view taken from line 33-33 of FIG. 31, which illustrates the base The labyrinth seal and peripheral edge of the seat. Figure 17 is a top view of the wafer carrier base shown in Figures 34, 35, 36 and 37. Figure 18 is the wafer carrier design shown in Figure 38 FIG. 19 is a cross-sectional view of the wafer carrier taken from the line AA in FIG. 38. FIG. 20 is the line BB in FIG. 38 A cross-sectional view of the wafer carrier taken out. Figure 21 is a perspective view of a convertible mold having an insert to convert the mold from a carrier mold having a wafer container of a first size to a mold of a second size. Die for wafer container. For a detailed description of the preferred embodiment, please refer to FIGS. 5, 6, 7, 8, 9, 10, 11 and I2, which are different perspective views of a wafer carrier, which includes two combined Part is used as a base 202 and — upper cover 204. The upper cover and the base are combined at an interface 206, and are interlocked by an interlocking machine. 14- This paper size applies to China National Standard (CNS) A4 specifications 210 X 297 mm) '-^ --- 509967 A-A7 ___ B7 V. Description of the invention < 2) System 207 fixed. Please refer to FIGS. 6, 7 v 8 and 11. The pedestal has a plurality of arched lateral wafer support sections 208 extending from a planar portion 21 of the pedestal to define the wafer stack package 212. The floor 211 is placed on the bottom of the packet. The flat portion constitutes a base and a bearing surface on the edge of the upper cover. A side wall 214 extends around the periphery 214 of the base. The nominal wall structure 216, 218, 200 in the package floor provides structural rigidity by a wavy anchor 221 located between the floor and each wafer support side wall portion. The radial structure formed by the nominal wall structure includes a plurality of channels 222 extending downward from the packet floor. Please refer to Figures 5, 8 and n for different perspective views of some corners of the base. The flat surface 210 constitutes a bearing surface of the edge of the upper cover, and extends around the side-to-side wafer support section 208. It extends upward from the flat surface 21o, and it is a protruding structure as a shoulder 25o. The shoulder contains a straight condyle surface 254 which acts as an external limitation of the upper cover 204, which is mainly during impact or other pressure. A latch assembly 264 extends from two of the four corners of the base. The latch assembly includes a hook portion 266 having a cam surface 268 and an engaging surface 270. When the cam surface is lowered to the latch position, the cam surface is biased and the surface 27 which is engaged with the mouth of the cam surface is bitten. Obviously, the shackle f has a horizontally extending section and a curved section 282 extending to the upright section 284. The horizontal portion reduces the spring coefficient of the interlocking assembly in the vertical direction by allowing the assembly to bend up and down. Compared with the conventional wafer carrier with flash lock, it does not include -15- This paper size is applicable to China National Standard (CNS) A4 specification (210X297 public love) 509967 A7 B7 V. Description of the invention < 3 child level The spring coefficient of the component in the vertical direction is equal to the spring coefficient of the material, and any bending of the base to which it is attached. The M flat portion can be effectively extended to this position, wherein the upper cover can be fixed thereto. Furthermore, it can soften the pull-down of the upper cover toward the base, which can allow greater shock absorption during impacts, such as dropping of the vehicle. The Yanhai vibration port can prevent further damage to the wafer, and it can prevent possible damage to the carrier. Also shown in FIGS. 5, 6, 8 and 11, an edge 274 may extend upward from the flat surface 210. This edge provides the additional impact surface of the upper cover, which will be detailed below. Coincidentally referring to Figs. 5, 9, 10 and 12, there are shown different views of the second part or cover. The obvious feature includes a nominal wall surface 32o, which contains the upper part of the upper part ′, which contains different reinforcing structures 33o. Please refer to FIG. 21, the nominal wall surface is used to provide a container 336 for 31/2 inch discs, and a larger trough 338 'which is sized for a CD case. The cover has a perimeter 350 'which includes an edge 354 extending upwardly along the perimeter. This edge adds to the structural rigidity and provides a stacking device. Four planar side walls 36o extend downward from the upper edge 350 and have insertion corner portions 365, which define a wafer housing. The shape of the wafer housing perimeter 368 is generally square, and its corners 369 are inserted into an expanded channel shape, as indicated by number 372. At each corner 369, it is a flange portion 374 having a hole 376 for receiving the head 377 of the latch assembly. The hole system portion is defined by the cam surface 38 ′, so as to fit the inclined surface at the upper portion of the latch assembly. The flange has a flat surface 390 and an edge portion 392, which are combined to provide significant strength to the corner portion. The upper cover is clearly extended downwards by the structure 395 to match the side -16-This paper size applies to China National Standard (CNS) A4 (210X 297 mm)

裝 訂 春·線 509967 一 A7 B7 五、發明説明（4 ) 壁360，提供了一上蓋較高的強度，即使當以像是聚丙烯的 軟性塑膠來形成時。 請參考圖1 3，所示爲該上蓋結合該基座的一方面。該基 座502係嚙合於該上蓋504，其包含一晶圓堆疊510。該晶圓 堆疊係在其底部由聚胺基甲酸酯發泡緩衝5 14，及在其上部 由圓形的聚胺基甲酸酯發泡緩衝516所緩衝化。在該晶圓中 間爲隔離材料530的板。由於一掉落或類似事件，會有一震 動施加於該上蓋上，例如由箭頭F所標示，這種震動力會經 由該上蓋540及側壁542來傳遞，最終由該側壁542嚙合於該 基座的肩部546而傳遞到該基座502。該嚙合點係由標示爲 550的區域所代表。此係位在該晶圓載具相對於該施力點的 相反側。該力量的此分散經由該上部及側壁有效地傳送該 衝擊力環繞該晶圓堆疊，藉此來保護該晶圓。請注意在區 域550處的嚙合，在區域552仍留有一間隙。在該肩部及側 向側壁區段之間的平坦表面及間隙可適當地配置來提供此 力量傳遞效應。藉由充份的力量，在區域552處的間距將會 封閉。 請參考圖6，在該平坦表面上該上蓋的正常位置係由標示 爲編號600的虛線所代表。該效應，如圖3 0所示，其可部份 藉由使該側向壁面區段及該上蓋側壁之間由G2所標示的間 隙，大於該上蓋的壁面與該肩部250的嚙合表面之間的間隙 G3的方式來完成。當該衝擊力具有充份的大小，該上蓋側 壁將首先嚙合相對於該衝擊點的肩部250，然後該相鄰於該 衝擊區域的上蓋側壁，後續將嚙合該側向晶圓支撑側壁區 -17- 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐） 509967 一- A7 _ 五、發明説明（5 ) 段的基座，或其它由該平坦表面向上延伸的其它結構，只 要適合的話。因此，其可注意到，該平坦表面2 1〇可有效地 做爲一承載表面，做爲該上蓋向下延伸壁的邊緣表面。同 時’由於除了特殊的狀況之外，該上蓋將不會接觸該側向 晶圓支撑區段208。如圖1 1所示的額外加強肋710可加入到 該區域中，如由箭頭720所標示。圖6中，可加入額外的支Binding Spring · Thread 509967 A A7 B7 V. Description of the Invention (4) The wall 360 provides a high strength of the cover, even when it is formed of soft plastic like polypropylene. Please refer to FIG. 13, which shows an aspect that the upper cover is combined with the base. The base 502 is engaged with the upper cover 504 and includes a wafer stack 510. The wafer stack is buffered by polyurethane foam buffer 5 14 at its bottom and circular polyurethane foam buffer 516 at its upper portion. In the middle of the wafer is a plate of isolation material 530. Due to a drop or similar event, a vibration is applied to the upper cover, for example, as indicated by arrow F. This vibration force is transmitted through the upper cover 540 and the side wall 542, and finally the side wall 542 engages with the base. The shoulder 546 is passed to the base 502. The engagement point is represented by the area labeled 550. This system is located on the opposite side of the wafer carrier relative to the force application point. This dispersion of the force effectively transmits the impact force around the wafer stack via the upper and side walls, thereby protecting the wafer. Note the meshing in area 550, and there is still a gap in area 552. The flat surfaces and gaps between the shoulder and lateral sidewall sections can be appropriately configured to provide this force transfer effect. With sufficient force, the spacing at area 552 will be closed. Please refer to FIG. 6, the normal position of the upper cover on the flat surface is represented by the dotted line marked with the number 600. The effect, as shown in FIG. 30, can be made in part by making the gap indicated by G2 between the lateral wall section and the side wall of the upper cover larger than the engagement surface between the wall surface of the upper cover and the shoulder 250. The way between the gaps G3 is done. When the impact force is sufficient, the upper cover sidewall will first engage the shoulder 250 relative to the impact point, and then the upper cover sidewall adjacent to the impact area will subsequently engage the lateral wafer support sidewall area- 17- This paper size is in accordance with Chinese National Standard (CNS) A4 (210X 297 mm) 509967 Ⅰ-A7 _ V. The base of paragraph (5) of the invention description, or other structures extending upward from the flat surface, as long as If appropriate. Therefore, it can be noticed that the flat surface 210 can be effectively used as a bearing surface as an edge surface of the downwardly extending wall of the upper cover. At the same time, since the top cover will not contact the lateral wafer support section 208 except for special conditions. Additional reinforcing ribs 710 as shown in FIG. 11 may be added to this area, as indicated by arrows 720. In Figure 6, additional branches can be added

撑肋，而不會有與該上蓋側壁接觸的可能性，其由於在此 位置處的側壁中的突出D 叫參考圖8及1 1，该側向晶圓支撑的一部份之結構mo， 其結構可提供視覺指示器來提供一適當的或最佳的負載高 度的範圍，其包含緩衝器。此參考具有兩個水平表面，其 標示爲742及746，其定義了 一範圍748，其中該晶圓及緩衝 器可適當地延伸。 此處的具體實施例提供了堆疊晶圓的容器，其中該基座 與上蓋提供了安全的閂鎖機制，且提供了較廣範圍的晶圓 數目’其可取佳化地承載’間隔大小及缓衝材料，其可抵 抗衝擊’並有效地將該晶圓與這種衝擊隔離，此非常適合 於機械手臂的運作，並提供該晶圓的有效密封，且抵抗彎 曲及基座的不穩定性，其可在該上蓋加強區域的部份中接 收1己憶碟片。請參考圖1 4，其爲該上蓋的承載表面的嚙合 之平面圖，在一未受力狀態的基座所示爲具有一誇大的間 隙。以F作用在該上蓋（未示出）的角落時，該力量傳遞到該 基座’將會在相對於該角落的基座處來接收該力量，且將 主要是在肩部602。請注意，在該基座的側邊，一邊緣6〇5 -18- 本紙張尺度適用中國國家標準(CNS) A4規格(21(ρΓ297公釐) 509967 一 A7 ______B7 五、發明説明彳6 ) 可向上延伸來提供一補充的或另一個嚙合组件，用以在該 載具的相對側上來接收力量。 請參考圖1 5及1 6，其所示爲本發明的進一步特徵。雖然 上述的結構化架構將降低或最小化該上蓋804及基座8〇2的 扭曲，相較於先前技藝（圖11)，某種程度上在該上蓋會發 生一些扭轉’而在成該上蓋下緣810與該底座812的脱開， 該週邊邊緣813將該上升的邊緣保持在該邊緣813的上部之 下’因此維持一迷宮路徑815到該晶圓容器，並消除了該間 隙G 4的視覺性暴露。 請參考圖17，18，19及20，其所示爲該晶圓載具的另一 個具體實施例。該晶圓載具具有一第一複數個拱形側向晶 圓支撑區段908，其由該基座902延伸，且定義一第一晶圓 堆璺谷器912。該第一晶圓堆疊容器912係大致對稱於一中 心軸914。該第一晶圓堆疊容器912的直徑較佳地約爲8英吋。 該晶圓載具也包含一第二複數個拱形側向晶圓支撑區段 918，其由該基座9〇2延伸，且定義一第二晶圓堆疊容器922 。該第二晶圓堆疊容器922係大致對稱於該中心軸914。該 第二晶圓堆疊容器922的直徑較佳地是約爲6英吋。在該第 一晶圓堆疊容器912内提供該第二晶圓堆疊容器922進一步 加強了本發明的晶圓載具的能力，用以防止由施加在該晶 圓載具上的外力對於放置在該晶圓載具中置放的晶圓造成 損害。 每個該拱形側向晶圓支撑區段918較佳地是對準於該拱形 側向曰曰圓支撑區段908之一。該拱形側向晶圓支撑區段918 -19- 本紙張尺度適用中國國家標準(CNS) A4規格(21〇X297公釐) 509967 一一 A7 B7 五 、發明説明彳7 ) 係位在該拱形側向晶圓支撑區段908及該中心軸914之間。 一側壁914延伸環繞該基座902的周邊914。在該容器底部 911中的公稱壁面結構916提供結構性的強固到該基座902， 其藉由提供在該底部911及每個晶圓支撑區段908之間的起 伏的附著位置。 該基座902具有一承載表面910及一肩部950，其由該承載 表面910向上延伸。該肩部950具有一直立表面954，其在衝 擊期間，或當其它類似的應力施加在該晶圓載具上時，可 做爲對該上蓋904的外部限制。例如其由一 8英吋載具或一 6 英吋載具。該完成方法包含***空白到該溝槽，並執行該 模製運作。 -20- 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)The support ribs do not have the possibility of contact with the side wall of the upper cover. Because of the protrusion D in the side wall at this position, refer to FIGS. 8 and 11. A part of the structure of the lateral wafer support mo, Its structure provides a visual indicator to provide a suitable or optimal range of load heights, including a buffer. This reference has two horizontal surfaces, designated 742 and 746, which define a range 748 in which the wafer and buffer can be extended appropriately. The specific embodiment here provides a container for stacking wafers, wherein the base and the cover provide a secure latching mechanism, and provide a wide range of wafer numbers 'which can be optimally carried' with a gap size and ease Punching material, which can resist impact and effectively isolate the wafer from such impact, which is very suitable for the operation of the robotic arm, and provides an effective seal of the wafer, and resists bending and instability of the base, It can receive 1 memory disc in a part of the reinforced area of the cover. Please refer to FIG. 14, which is a plan view of the engagement of the bearing surface of the upper cover. An unstressed base is shown with an exaggerated gap. When F acts on the corner of the upper cover (not shown), the force transmitted to the base 'will receive the force at the base opposite to the corner, and will mainly be on the shoulder 602. Please note that on the side of the base, one edge is 605 -18- This paper size is applicable to China National Standard (CNS) A4 specifications (21 (ρΓ297 mm) 509967 -1 A7 ______B7 V. Description of invention 彳 6) Yes Extending upwards to provide a supplementary or another engaging component for receiving power on the opposite side of the vehicle. Please refer to FIGS. 15 and 16 which show further features of the present invention. Although the above-mentioned structured structure will reduce or minimize the distortion of the upper cover 804 and the base 802, compared to the previous art (Figure 11), some twisting will occur in the upper cover to some extent, and the upper cover will become Disengagement of the lower edge 810 from the base 812, the peripheral edge 813 keeps the rising edge below the upper portion of the edge 813 ', thus maintaining a labyrinth path 815 to the wafer container, and eliminating the gap G 4 Visual exposure. Please refer to Figs. 17, 18, 19 and 20, which show another specific embodiment of the wafer carrier. The wafer carrier has a first plurality of arched lateral wafer support sections 908 extending from the base 902 and defining a first wafer stacker 912. The first wafer stacking container 912 is substantially symmetrical to a central axis 914. The diameter of the first wafer stacking container 912 is preferably about 8 inches. The wafer carrier also includes a second plurality of arched lateral wafer support sections 918 that extend from the base 902 and define a second wafer stacking container 922. The second wafer stacking container 922 is substantially symmetrical to the central axis 914. The diameter of the second wafer stacking container 922 is preferably about 6 inches. Providing the second wafer stacking container 922 in the first wafer stacking container 912 further enhances the capability of the wafer carrier of the present invention to prevent external forces applied to the wafer carrier from placing on the wafer carrier. The wafer placed in the tool caused damage. Each of the arched lateral wafer support sections 918 is preferably aligned with one of the arched lateral wafer support sections 908. The arched lateral wafer support section 918 -19- This paper size is applicable to Chinese National Standard (CNS) A4 specification (21 × 297 mm) 509967 A7 B7 V. Description of invention 彳 7) It is located in the arch Between the lateral wafer support section 908 and the central axis 914. A side wall 914 extends around the periphery 914 of the base 902. The nominal wall structure 916 in the bottom 911 of the container provides structural reinforcement to the base 902 by providing an undulating attachment location between the bottom 911 and each wafer support section 908. The base 902 has a bearing surface 910 and a shoulder 950. The bearing surface 910 extends upward from the bearing surface 910. The shoulder 950 has an upstanding surface 954 that can be used as an external constraint on the upper cover 904 during an impact, or when other similar stresses are applied to the wafer carrier. For example, it consists of an 8-inch vehicle or a 6-inch vehicle. The completion method includes inserting a blank into the groove and performing the molding operation. -20- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)

Claims (1)

509967509967 第090111068號專利申請案 中文申請專利範圍修正本(91年7月) .魏 「、申請專利範圍 八 ㈣邮補充丨 1· 一種承載複數個堆栽具，該載具包含： 一上蓋，其包含一通常為水平的上部，其具有四個角 落及四個側壁部份，其由該水平部份向下延伸，每個該 四個側壁部份具有一面向下的承載表面，一面向内的= 面，及一面向外的表面，該四個側壁部份在其中定義了 一晶圓接收區域，及 一基座，其包含一通常為水平底部，其具有一周邊， 一用以接收一晶圓堆疊的容器，晶圓支撐部份，向上延 伸的肩部’及-面向上的承載表面，用以接收該上蓋的 面向下的承載表面，其中 該向上延伸的肩部的配置使得具有一水平分量的力量 作用在該上蓋，造成該上蓋的面向外的表面鳴合於該基 座的向上延伸的肩部，其係在該上蓋的面向内的表面鳴 合於孩基座的該晶圓支撐部份之前。 2.如申請專利範圍第!項之晶圓載具，其中 部份皆為相鄰。 3·如申請專利範圍第2項之晶圓載且， 、八， 间秋具，其中孩四邊的側壁 邵伤係由向内突出的角落部份所結合。 4·如申請專利範圍第1項之晶圓載且1並击—甘— 士掩如八具其中該基座的晶圓 支撐部份為换形，並定羞了白 疋我了包含一晶圓堆疊的圓形容器 〇 5 .如申請專利範圍第1項之曰圓# B 梹形，並定義具有其中該晶圓支撐為 一第—t ^ — 仫的罘一圓形容器，及具有 弟一直技的罘二圓形支禮交 /又符谷态，其中該第二直徑係大 本紙張尺度適财® S家辟(CNS)No. 090111068 Patent Application Chinese Patent Application Amendment (July 91). Wei Wei, "Applicable Patent Scope Hachiman Post Supplements" 1. A carrier carrying a plurality of stackers, the carrier contains: an upper cover, which contains A generally horizontal upper portion having four corners and four side wall portions extending downwardly from the horizontal portion, each of the four side wall portions having a load-bearing surface facing downward, and one facing inward = Surface, and an outward-facing surface, the four sidewall portions defining a wafer receiving area therein, and a pedestal including a generally horizontal bottom with a perimeter and a wafer receiving portion A stacked container, a wafer support portion, and an upwardly extending shoulder portion and an upward-facing bearing surface for receiving the downwardly-facing bearing surface of the upper cover, wherein the upwardly extending shoulder portion is configured to have a horizontal component The force acting on the upper cover causes the outwardly facing surface of the upper cover to sing to the upwardly extending shoulder of the base, which is tied to the inwardly facing surface of the upper cover to the wafer on the child base. Before the support part. 2. If the wafer carrier in the scope of the patent application item No.!, Some of them are adjacent. The side walls of the four sides are combined by the inwardly protruding corners. 4. If the wafer in the scope of the patent application No. 1 is loaded with a 1-strike attack-Gan-Shizharu has eight wafer support parts in the base. The shape is changed, and I am ashamed of it. I have a round container containing a wafer stack. For example, the scope of the patent application No. 1 Zhiyuan # B 梹 shape, and defined as having the wafer support as a The first — t ^ — round container, and the second round branch with the traditional skills. The second diameter is the large-scale paper size Shicai® Sjiapi (CNS ) 6. 於该第一直徑。 如申請專利範圍第1項之晶圓載具 份包含一堆疊位準指示器。 其中該晶圓支撐部 9· 10. 1 1 · 12. 如申請專利範圍第6須之晶 一 ^ _矛，、足阳固載具，其中該堆疊位準指 不态為孩晶圓支撐部份中的一切痕。 t申請專利範圍第1項之晶圓載具，其中該基座進-步 包含複數㈣鎖組件，而該上蓋進—步包含複數個孔洞 ’用以由其中接收該閂鎖組件。 如申請專利範圍第8項之晶圓載具，其中該問鎖组件具 有-水平向内延伸的水平部份，一向上延伸的垂直部份 及-：合邵份’其中該嚙合部份係用來嚙合該上蓋的孔 洞，藉此來可釋放地固定該基座與該上蓋。 ^申請專利範圍第9項之晶圓載具，/中該問鎖组件沿 著為水平部份鄰接該基座。 如申請專利範圍第i項之晶圓載具，其中該基座進一步 包含沿著該周邊向上延伸的一邊緣。 如申請專利範圍第11項之晶圓載具，其中該邊緣向上延 伸一咼度，其足以隱藏形成在該上蓋的面向下的表面及 該基座的面向上的承載表面之間的一間隙，該邊緣形成 一迷宮在、封，其具有該面向下的承載表面及該面向上的 承載表面。 1 3 ·如申請專利範圍第1項之晶圓載具，其中至少該上蓋與 基座之一，進一步包含複數個公稱壁面通道形成在其中 來提供強固性，該壁面通道為線性，其方向為至少一徑 -2- 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐) 、申請專利範圍 向或弦向方向之一。 其中該上蓋進一步 其用以接收一資料 其中該資料儲存媒 14·如申請專利範圍第1項之晶圓載且 包含在該水平上部中的-容器部份 儲存媒體。 刀 申咕專利範圍第14項之晶圓載且 體為一 3.5英吋碟片。 戰 1 6 ·如申請專利範圍第丨4 曰 .體為在—寶石外殼中的—光^片載具’其中該資科错存媒 17. =5範二第:項之晶圓載具，其中至少該上蓋及 扭轉的抵^包含形成直線通道的公稱⑽來提供對 18. 一種承載複數個堆疊晶圓的晶圓載具，該載具包含： —上盍，其包含一通常為水平的上部，其且 落及四個側壁部份其由、 、八 邱於卢甘士Γ 由孩水平邵份向下延伸，該側壁 σ刀中疋義了一晶圓儲存區域，及 f座’其包含一通常為水平底部，其具有一用以接 部:::堆疊的容器’晶圓支撐部份，及向上延伸的肩 至少該晶圓支撐部份之-係包含—堆4位準指示器。 19. 如：請專利範圍第18項之晶圓載具，其中該堆疊位準指 π器為該晶圓支撐部份中的一切痕。 20·如申請專利範圍第18項之晶圓載具，纟中該上蓋進一步 包含在該水平上部中的一容器部份，其用來接收一資料 儲存媒體。 A8 B8 C8 D8 申请專利氣園 種承載複數個堆疊晶圓的晶圓載具，該載具包含·· —一上蓋，其包含一通常為水平的上部，其具有四個角 洛及四個側壁部份，其由該水平部份向下延伸，該側壁 部份在其中定義了一晶圓儲存區域，及 一基座，纟包含一通常為水平底部，纟具有一用以接 收曰曰圓堆璺的容器，晶圓支撐部份，及向上延伸的肩 部，其中 至少喊座肖上蓋之一包含複數個公稱壁面通道，並 在其中形成而提供強固性，該壁面通遒為線性，其方^ 為至少一徑向或弦向方向之一。 22. 如申請專利範圍第21項之晶圓載具，其中該上蓋進一步 包含在該水平上部中的一玄器却 儲存媒體。 其用以接收一資料 23. 一種在一晶圓容器中承載複數個堆疊晶圓之方法，該 法包含·· 〜 提供-儲存基座，該儲存基Μ 邊的水平底部，-用以接收一晶圓堆疊的圓： 撐延伸的肩部及—面向上的 有四個角落及四個側壁部份，其的上邵’其具 ，每個該四個側壁部份且有：：財平邵份向下延伸 #人·、二 有一面向下的承載表面，用以 —薇向上延仲的㈣表面，—面向内 向外的表面，該四個側壁部份在其中定 ：及-面 區域，其中該向上延伸的户却& 我了 一日日圓接收 (伸的屑邵的配置使得具有一水平分 本紙張尺度適用中國國家標準(cns) A8 B8 C86. At the first diameter. For example, the wafer carrier of item 1 of the patent application includes a stack level indicator. Wherein the wafer support 9 · 10. 1 1 · 12. If the patent application scope No. 6 Xu Zhijing ^ _ _ spear, Zuyang solid carrier, where the stacking level refers to the child wafer support All traces in the serving. tThe wafer carrier for patent application No. 1 wherein the base step includes a plurality of yoke components, and the upper cover step includes a plurality of holes ′ for receiving the latch component therein. For example, the wafer carrier of the patent application No. 8 wherein the interlocking component has a horizontal portion extending horizontally inward, a vertical portion extending upwardly and-: He Shao Fen 'wherein the engaging portion is used for The holes of the upper cover are engaged, thereby releasably fixing the base and the upper cover. ^ The wafer carrier for item 9 of the patent application, in which the interlocking device adjoins the base along a horizontal portion. For example, the wafer carrier of the scope of application for patent i, wherein the base further includes an edge extending upward along the periphery. For example, for a wafer carrier with a scope of patent application item 11, wherein the edge extends upwards by a degree, which is sufficient to hide a gap formed between the downward-facing surface of the upper cover and the upward-facing bearing surface of the base, the The edge forms a labyrinth, which has the downward-facing bearing surface and the upward-facing bearing surface. 1 3 · If the wafer carrier according to item 1 of the patent application scope, at least one of the upper cover and the pedestal further comprises a plurality of nominal wall channels formed therein to provide robustness, the wall channels are linear, and their directions are at least Yijing-2- This paper size is applicable to one of the Chinese National Standard (CNS) A4 specifications (210X297 mm) and the patent application scope or chord direction. The upper cover is further used for receiving a piece of data. The data storage medium 14. The storage medium of the container part, such as a wafer carried on the wafer in the scope of patent application and contained in the upper part of the level. Knife Shengu's patent No. 14 includes a 3.5-inch wafer on a wafer. War 1 6 · If the scope of patent application is described in the 4th. The body is in the-gem shell-light ^ chip carrier 'where the asset is wrongly stored 17. = 5 Fan 2 #: wafer carrier, where At least the upper cover and the twisted abutment include a nominal 形成 forming a straight channel to provide a pair. 18. A wafer carrier carrying a plurality of stacked wafers, the carrier comprising:-an upper 盍, which includes a generally horizontal upper portion, Its side walls and four side walls are formed by,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, It is usually a horizontal bottom, which has a container: wafer stacking portion for receiving the :: stack, and an upwardly extending shoulder at least-the wafer supporting portion-including-a 4-level indicator. 19. For example, the wafer carrier of item 18 of the patent scope, where the stacking level refers to the π device as all marks in the wafer support portion. 20. The wafer carrier of claim 18, wherein the upper cover further includes a container portion in the upper horizontal portion for receiving a data storage medium. A8 B8 C8 D8 A patent-applied wafer carrier carrying a plurality of stacked wafers. The carrier includes ... an upper cover that includes a generally horizontal upper portion with four corners and four side walls Portion, which extends downward from the horizontal portion, the side wall portion defines a wafer storage area therein, and a pedestal, which includes a generally horizontal bottom, and has a circular stack for receiving Container, wafer support portion, and upwardly extending shoulder, at least one of the upper cover of the seat contains a plurality of nominal wall channels formed in it to provide robustness. The wall surface is generally linear, and its square ^ One of at least one radial or chordwise direction. 22. The wafer carrier of claim 21, wherein the upper cover further contains a storage device in the horizontal upper portion but a storage medium. It is used to receive a piece of data. 23. A method for carrying a plurality of stacked wafers in a wafer container, the method includes providing a storage base, a horizontal bottom of the storage substrate M side, and-for receiving a Wafer stacking circle: The shoulders of the support extension and-there are four corners and four side wall portions facing upwards, and the upper side of the four side wall portions each have :: Cai Ping Shao份 DOWNExtends # 人 ·, the second has a load-bearing surface facing downwards, which is-the surface of the crotch extending upwards,-the surface facing inward, and the four side wall portions are defined therein: and-the surface area, where The upwardly extending households & I received it for one day (the configuration of the extended shaw shaw makes it have a level of paper size applicable to Chinese national standards (cns) A8 B8 C8 I的力量作用在該上蓋上，造成該上蓋的面向外的表面 嚙合於該基座的向上延伸的肩部，其係在該上蓋的面向 内的表面嚙合於該儲存基座的該晶圓支撐部份之前；' 在該儲存基座的容器中放置一第一晶圓堆疊緩衝， 在該第一晶圓堆疊緩衝中放置一晶圓堆疊，該晶圓堆 宜包含複數個個別晶圓，其堆疊在彼此之上，而在個別 晶圓之間***一晶圓緩衝， 在該晶圓堆疊上放置一第二晶圓堆疊緩衝，及 放置該上蓋在該儲存基座。 24, 如申請專利範圍第23項之方法，其進一步包含可釋放地 問鎖該上蓋到該儲存基座的步驟。 25. 如申請專利範圍第门項之方法，其中該基座進一步包含 複數個問鎖組件，且該上蓋進一步包含複數個孔洞，用 來接收該閂鎖組件。 2 6 .如申叫專利範圍第2 5項之方法，其中該閂鎖組件具有水 平向内延伸的水平部份，一向上延伸的垂直部份，及一 四口部伤’其中該嚙合部份係用來嚙合該上蓋的孔洞， 藉以可釋放地固定該儲存基座到該上蓋。 2 7 .如申印專利範圍第2 6項之方法，其中該閂鎖組件沿著該 水平部份鄰接該基座。 28·如申請專利範圍第23項之方法，其中該儲存基座進一步 包含沿著該周邊向上延伸的一邊緣。 29.=申請專利範圍第28項之方法，其中該邊緣向上延伸一 同度，其足以隱藏形成在該上蓋的面向下的表面及該基 _____ -5- 本紙張尺度適财g g家鮮(CNS) A4規格Gi〇X297公釐）The force of I acts on the upper cover, causing the outwardly facing surface of the upper cover to engage the upwardly extending shoulder of the base, which is tied to the inwardly facing surface of the upper cover to engage the wafer support of the storage base. Partially before; 'Place a first wafer stack buffer in the container of the storage base, and place a wafer stack in the first wafer stack buffer. The wafer stack should include a plurality of individual wafers, which They are stacked on top of each other, and a wafer buffer is inserted between the individual wafers, a second wafer stack buffer is placed on the wafer stack, and the cover is placed on the storage base. 24. The method of claim 23, further comprising the step of releasably locking the cover to the storage base. 25. The method according to the patent application, wherein the base further includes a plurality of interlocking components, and the upper cover further includes a plurality of holes for receiving the latching components. 26. The method as claimed in claim 25 of the patent scope, wherein the latch assembly has a horizontal portion extending horizontally inwardly, a vertical portion extending upwardly, and a four-mouth injury including one of the engaging portions. It is used to engage the hole of the upper cover, thereby releasably fixing the storage base to the upper cover. 27. The method of claim 26 in the scope of a patent application, wherein the latch assembly abuts the base along the horizontal portion. 28. The method of claim 23, wherein the storage base further includes an edge extending upward along the periphery. 29. = The method of the scope of application for patent No. 28, wherein the edges extend upwards together, which is sufficient to hide the downward-facing surface formed on the upper cover and the base _____ ) A4 size Gi × 297mm) 裝 線Loading line 申請專利範圍 ㈣$ T% i的承載表面之間的 密封。. 間隙 藉此形成一迷宮 30.如!請專利範園第23项之方法，其中至少該上蓋盥笑座 步包含複數個公稱壁面通道形成在其。提 之!壁面通道為線性’其方向為至少-徑向或 申6"專利範圍第23項之方法’其中該上蓋進-步包本 媒:水平上部中的-容器部份’其用以接收-資料儲; A如3申5lt利範圍第31項之方法，其中該資科儲存媒體為 一 3·5·英吋碟片。 认專利範圍第31項之方法，其中該資料儲存媒體為 在一貝石外殼中的一光碟片。 34·如:凊專利範圍第23項之方法，其中至少該上蓋及基座 足進一步包含形成直線通道的公稱壁面來提供對 的抵抗性。 35. =請專利範圍第23項之方法，其進—步包含檢查該第 =晶圓堆疊緩衝的高度，晶圓堆疊，及第二晶圓堆疊緩 衝相對於一堆疊位準指示器的步驟。 36. 如中請專利範圍第35項之方法，其中該堆疊位準指示器 為該晶圓支撐部份中的一切痕。 37. —種晶圓載具的模具系統，該模具具有凹處，用以形成 一第二組壁面，其定義了該晶圓載具的一第—尺寸的— 晶圓容器，且進一步具有通常為同心圓的凹處，用以形 -6-Patent application ㈣ $ T% i Sealing between load bearing surfaces. The gap thereby forms a maze 30. For example, please call the method of patent fan garden item 23, wherein at least the upper toilet seat step includes a plurality of nominal wall channels formed therein. Note: The wall channel is linear 'its direction is at least-radial or Shen 6 " method of patent scope item 23' where the cover enters-step package this medium: the container part in the horizontal upper part 'which is used to receive -Data storage; A such as the method of item 31 of the 5lt profit range, wherein the asset storage medium is a 3.5-inch disc. A method for recognizing item 31 of the patent, wherein the data storage medium is an optical disc in a lapis shell. 34. For example, the method of item 23 of the patent scope, wherein at least the upper cover and the base foot further include a nominal wall surface forming a straight channel to provide resistance to. 35. The method of claim 23 of the patent, which further includes the steps of checking the height of the wafer stack buffer, the wafer stack, and the second wafer stack buffer relative to a stack level indicator. 36. The method according to item 35 of the patent, wherein the stack level indicator is all marks in the wafer support portion. 37. A mold system for a wafer carrier, the mold has a recess for forming a second set of wall surfaces, which defines a first-size-wafer container of the wafer carrier, and further has a generally concentric Round recess for -6- 509967 A B c D 六、申請專利範圍 成一第二組壁面，用以定義一第二尺寸的一晶圓容器， 該模具系統進一步包含***件，用以***到至少該組凹 處之一來轉換該模具。 38· —種形成具有一第一容器尺寸的晶圓載具及用以形成具 有一第二容器尺寸的晶圓載具之方法，該方法包含： 提供一模具部份，其包含具有兩組凹處的一模穴，每 組形成複數個壁面區段來定義一不同尺寸的晶圓容器， 及 ， ***空白到至少一組凹處，及 注射融溶塑膠到該模穴。 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)509967 AB c D 6. The scope of the patent application is a second set of wall surfaces to define a wafer container of a second size. The mold system further includes an insert for inserting into at least one of the set of recesses to convert the Stencil. 38 · A method for forming a wafer carrier having a first container size and a method for forming a wafer carrier having a second container size, the method comprising: providing a mold part including two sets of recesses A mold cavity, each group forming a plurality of wall surface sections to define a wafer container of a different size, and inserting a blank into at least one set of recesses, and injecting molten plastic into the cavity. This paper size applies to China National Standard (CNS) A4 (210X 297 mm)