507399 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 發明領域： 本發明係有關於一種雙頻（dual-band)玻纖（FR4)晶片 天線（chip antenna)，特別是有關於一種將蜿蜒（meandering) 輻射金屬線形成於玻纖材質晶片上的雙頻晶片天線。 發明背景： 隨著通訊科技的蓬勃發展，各式的通訊產品與技術也 如雨後春筍般的出現。加上積體電路的技術日益成熟，使 得產品的體積也逐漸傾向於輕薄短小。對於在通訊產品中 用來傳送與接收訊號的天線，其體積之大小更是攸關通訊 產品能否達到輕薄短小的目標。 天線係用以輻射或接收電磁波的一種元件，一般可從 操作頻率、輻射場型（radiation pattern)、返回損失（return loss)和天線增益（antenna gain)等參數來獲知天線的特性。 現今之無線產品所使用的天線必須具有體積小、性能佳和 成本低等特點，方能得到市場的廣泛接受與肯定。以玫置 位置來區分，無線產品所使用的天線大致可分為外接與内 建兩類，而基於外型美觀的考量，外接式天線已逐漸被内 建式天線所取代。另一方面，由於適合量產的表面黏著技 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 x 297公釐） n n I i n n n n ϋ ϋ n n I · n n n ϋ «I n ϋ 如tfj* n n n ϋ n n n I (請先閱讀背面之注意事項再填寫本頁) 507399 A7 B7 五、發明說明（） (請先閱讀背面之注意事項再填寫本頁) 術（SMT )已經非常成熟，故適用於表面黏著技術的晶片 天線可大幅地降低封裝與連接所需的成本，因而成為内建 式天線中最受歡迎的設計方式。 然而，習知之晶片天線通常係製作於陶瓷材料上。由 於陶瓷材料昂貴而且易碎，故陶瓷晶片天線的生產成本相 當高，且其易碎的特性亦使得產品不耐用。因此，非常迫 切需要發展一種低廉且堅固的晶片天線，以解決習知之陶 瓷晶片天線的缺點，並且在與電路整合時所需成本可以降 低，且增加產品的穩定度。 發明目的及概述： 鑒於上述之發明背景中，習知之使用陶瓷材料的晶片 穴線不僅昂貴而且易碎’造成產品的成本增加且不耐用， 因而無法廣泛地應用於各項產品中。 經濟部智慧財產局員工消費合作社印製 因此，本發明的主要目的為提供了一種雙頻玻纖晶片 天線，本發明使用成本低廉且堅固的玻纖材質，藉以取代 習知之陶免材料’而設計出成本低廉、性能佳和堅固的晶 片天線，並可依實際需要而有各種不同的樣式和形狀，藉 由適當地調整輻射金屬線長度與蜿蜒方式便可變化天線 的共振頻率及頻率比’以供各種不同無線通訊系統使用。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公餐） 經濟部智慧財產局員工消費合作社印製 507399 A7 _B7___ 五、發明說明（） 本發明的另一目的為提供了一種雙頻玻纖晶片天線， 藉以適用於表面黏著技術，而可做大量生產，進而降低與 電路整合時所需的成本，更增加產品穩定度。 根據以上所述之目的，本發明提供了一種雙頻玻纖晶 片天線。本發明之雙頻玻纖晶片天線至少包括：由玻纖材 料所製成之玻纖晶片；蜿蜒輻射金屬線；以及表面黏著接 點。其中蜿蜒輻射金屬線係形成於玻纖材質晶片的至少 兩個表面上，為天線用以輻射電磁波的主要部分，其總長 度為接近天線的第一操作頻段之中心頻率的1 /4波長；而 表面黏著接點係用以連接蜿蜒輻射金屬線至訊號傳輸 線，訊號傳輸線則係用來做為系統電路的訊號傳輸。本發 明之雙頻玻纖晶片天線可藉著適當地調整輻射金屬線長 度與蜿蜒方式來調整其共振頻率及頻率比。本發明之雙頻 玻纖晶片天線係放置於具有接地面的微波基板上，其中接 地面係用以與訊號地端相接。 圖式簡單說明： 本發明的較佳實施例將於往後之說明文字中辅以下列 圖形做更詳細的闞述，其中： 本紙張尺度適用中國國家標準（CNS>A4規格（210 X 297公f ) -----I-------裝--------訂---------線 (請先Μ讀背面之注意事項再填寫本頁) 507399 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 第1圖為繪示本發明之一較佳實施例的雙頻玻纖晶片 天線安裝於微波基板上之結構示意圖； 第2圖為繪示本發明之一較佳實施例的雙頻玻纖晶片 天線之結構不意圖， 第3圖為繪示本發明之一較佳實施例的雙頻玻纖晶片 天線之下視示意圖； 第4圖為緣示本發明之一較佳實施例的雙頻玻纖晶片 天線之俯視不意圖， 第5圖為緣示本發明之一較佳實施例的雙頻玻纖晶片 天線之侧視不意圖， 第6圖為繪示本發明之一較佳實施例的雙頻玻纖晶片 天線之關於返回損失對頻率的模擬與實驗結果曲線圖； 第7圖為繪示本發明之一較佳實施例的雙頻玻纖晶片 天線在2450 MHz的輻射場型量測結果； 第8圖為繪示本發明之一較佳實施例的雙頻玻纖晶片 天線在5800 MHz的輻射場型量測結果； 第9圖為繪示本發明之一較佳實施例的雙頻玻纖晶片 天線於2450 MHz頻帶之天線增益量測結果； 第1 0圖為緣示本發明之一較佳實施例的雙頻玻纖晶 片天線於5800 MHz頻帶之天線增益量測結果； 第11圖和第13圖為繪示本發明之其他實施例的雙頻 玻纖晶片天線安裝於微波基板上之結構示意圖；以及 第12圖和第14圖為緣不本發明之其他實施例的雙頻 本紙張瓦度適用中國國家標準（CNS)A4規格（210 X 297公釐） ------‘------* 裝----11--訂--------广線 — · (請先閱讀背面之注意事項再填寫本頁) 507399 A7 _B7 五、發明說明（) 玻纖 ,晶片 天 線之結構 示 意 圖 〇 圖號 >對照 說 明： 10、 70、 80 雙 頻 玻 纖 晶 片 天線 11' 71、 81 玻 纖 晶 片 12、 Ί2、 82 婉 蜒 輻 射 金 屬 線 13 表 面 黏 著 接 點 20 訊 號 傳 輸 線 30 接 地 面 40 微 波 基 板 121 、721 821 下 層 金 屬 線 122 、722 、 822 上 層 金 屬 線 123 、723 % 823 連 接 金 屬 線 21 實 驗 結 果 22 模 擬 結 果 n m n flu i_l· n If n m en n Hi I * -I an a·.·— n ϋ n n 一：e m ϋ SI m -ϋ ϋ 卜線i, (請先閱讀背面之注意事項再填寫本頁) 發明詳細說明： 經濟部智慧財產局員工消費合作社印製 本發明揭露一種雙頻玻纖晶片天線。本發明之雙頻玻 纖晶片天線係將蜿蜒輻射金屬線形成於價格低廉且堅固 的玻纖材質晶片上，並藉著適當地調整輻射金屬線長度與 蜿蜒方式來調整晶片天線共振頻率及頻率比，以得到雙頻 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) 507399 經濟部智慧財產局員工消費合作社印製 A7 _____Β7_ 五、發明說明（） 段的操作，且改善習知之使用陶瓷材料的晶片天線的昂貴 而且易碎的缺點。 請參照第1圖，第1圖為緣示本發明之一較佳實施例 的雙頻玻纖晶片天線安裝於微波基板上之結構示意圖。雙 頻玻纖晶片天線10係放置於具有接地面30的微波基板 40上，而接地面30係與訊號地端相接。微波基板4〇的 尺寸為例如約1 00 X 3 5 mm2，其中微波基板40位於雙頻 玻纖晶片天線1 0之正下方的部分不具有接地面，其大小 為例如約9 X 5 微波基板40可被視為一無線通訊 手機的電路板，亦即此晶片天線應用於無線通訊手機上作 為藍芽或無線區域網路系統的應用實施例β另外，訊號傳 輸線20係用以做為系統電路之訊號傳輸，此訊號傳輸線 20可為例如微帶傳輸線、同軸饋線或其他能夠傳遞電磁 訊號之元件。 請參照第2圖’第2圖為繪'示本發明之一較佳實施例 的雙頻玻纖晶片天線之結構示意圖。如第2圖所示，本發 明之雙頻玻纖晶片天線10至少包括：一破纖晶片11; 一 蜿蜒輻射金屬線12;以及一表面黏著接點13。表面黏著 接點13係用以連接婉蜒輻射金屬線12至訊號傳輸線 20。玻纖晶片1 1係由玻纖材料所製成的長方形柱體，其 介電常數係介於約4至約5之間。玻纖晶片π的厚度不 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公f ) I n n n n m m*t ϋ n ϋ ϋ n I · n n n an n n d 一 e. . n n 1 n n n n I K (請先閱讀背面之注意事項再填寫本頁) 507399 Α7 Β7 五、發明說明（） -------*-------裝--- (請先閲讀背面之注意事項再填寫本頁) -線 經濟部智慧財產局員工消費合作社印制衣 能太薄’否則會嚴重影響天線的頻寬，本較佳實施例使用 之厚度為例如約1 · 6 mm，然而，本發明之玻纖晶片1 1的 厚度亦可為例如約0.8mm。蜿蜒輻射金屬線12是天線用 以輻射電磁波的主要部分，其係形成於玻纖晶片1 1的至 少兩個表面上。蜿蜒輻射金屬線12係可由任何電導體製 成，例如：銀、銅等。蜿蜒輻射金屬線1 2更至少包括位 於玻纖晶片1 1之下表面的下層金屬線1 2 1 ;位於玻纖晶 片11之上表面的上層金屬線122;以及連接金屬線123， 其中連接金屬線123係位於玻纖晶片1 1之側邊，藉以連 接下層金屬線121與上層金屬線122。就設計而言，蜿蜒 輻射金屬線1 2的總長度大約是天線第一操作頻段之中心 頻率（例如：24 5 0 MHz)的1/4波長，例如：約35 mm。本 發明之一較佳實施例的雙頻玻纖晶片天線的尺寸為例如 約6><6><1.6mm3，而天線的第一及第二操作頻段則為蜿蜒 輻射金屬線12的前二個共振頻率，而調整蜿蜒輻射金屬 線12的總長度可改變天線的第一共振頻率《另一方面， 變化蜿蜒輻射金屬線12的寬度（例如：約1·〇 mm)可以調 整天線的前二個共振頻率的頻率比，例如：可將蜿蜒輻射 金屬線1 2做由細至寬的變化，.藉以調整第二操作頻段之 中心頻率的大小。蜿蜒輻射金屬線12的寬度從起點到終 點可以不是一定值，亦即蜿蜒輻射金屬線1 2可有複數個 寬度。因此，透過蜿蜒輻射金屬線12的不同長度、寬度 和形狀之設計，可輕易達成所需之操作頻段和頻率比β 本紙張瓦度適用中國國家標準（CNS)A4規格（210 X 297公f ) 507399 經濟部智慧財產局員工消費合作社印製 A7 —_____JB7 五、發明說明（） 請參照第3圖至第5圖，其中第3圖為繪示本發明之 一較佳實施例的雙頻玻纖晶片天線之下視示意圖；第4圖 為緣示本發明之一較佳實施例的雙頻玻纖晶片天線之俯 視示意圖；而第5圖為緣示本發明之一較佳實施例的雙頻 玻纖晶片天線之侧視示意圖。如第3圖所示，下層金屬線 1 2 1係由三條線組成，此三條線蜿蜒於玻纖晶片u之下 表面的周圍的三邊。與其中起始之第一線接觸的微波基板 4〇具有接地面30，此第一線通常垂直地連接於訊號傳輸 線20方向。接著，下層金屬線12ι的第二線係垂直地連 接於第一線’而第三線則垂直地連接於第二線。如第4圖 所示’上層金屬線1 2 2係由三條水平線與二條垂直線所組 成’其形成次序為先形成第一水平線，接著連接第一垂直 線’再連接第二水平線，然後再連接第二垂直線，而此第 二垂直線只延伸至玻纖晶片丨1之上表面之一邊大約是中 間的位置，然後便再連接第三水平線，而第三水平線的長 度較第一水平線和第二水平線短，故不會與第一垂直線接 觸。另外’如第5圖所示，下層金屬線ι21與上層金屬線 122之間係由與二者垂直之連接金屬線ι23所連接。本較 佳實施例之金屬線的蜿蜒方式可達到天線之體積小的要 求》 如上所述’本發明之一較佳實施例的雙頻玻纖晶片天 9 本紙張尺^1§財國國家標準（C^S〉A4規格（21Q χ挪公餐）-—-*---- I---— — III — — « — I — — — — — ^ . I I I I I I L I I (請先閱讀背面之注意事項再填寫本頁) 507399 經濟部智慧財產局員工消費合作社印製 A7507399 A7 B7 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention () Field of the invention: The present invention relates to a dual-band glass fiber (FR4) chip antenna, especially The invention relates to a dual-frequency chip antenna in which a meandering radiation metal wire is formed on a glass fiber material wafer. Background of the Invention: With the vigorous development of communication technology, various communication products and technologies have sprung up. Coupled with the increasing maturity of integrated circuit technology, the volume of products has gradually become thinner and shorter. For antennas used in communication products to transmit and receive signals, the size of the antenna is more important for whether the communication products can achieve the goals of lightness, thinness, and shortness. An antenna is a component used to radiate or receive electromagnetic waves. Generally, the characteristics of the antenna can be obtained from parameters such as the operating frequency, radiation pattern, return loss, and antenna gain. The antennas used in today's wireless products must have the characteristics of small size, good performance, and low cost to be widely accepted and affirmed in the market. According to the location of the antenna, the antennas used in wireless products can be roughly divided into external and built-in types. Based on considerations of aesthetic appearance, external antennas have gradually been replaced by built-in antennas. On the other hand, due to the size of the surface adhesive technology suitable for mass production, the paper size applies the Chinese National Standard (CNS) A4 specification (21 × 297 mm) nn I innnn ϋ ϋ nn I · nnn ϋ «I n ϋ as tfj * nnn ϋ nnn I (Please read the notes on the back before filling this page) 507399 A7 B7 V. Description of the invention () (Please read the notes on the back before filling this page) The technique (SMT) is very mature, so it is suitable for the surface Adhesive chip antennas can greatly reduce the cost required for packaging and connection, making them the most popular design method for built-in antennas. However, conventional chip antennas are usually fabricated on ceramic materials. Because ceramic materials are expensive and fragile, the production cost of ceramic chip antennas is relatively high, and their fragile characteristics also make the product less durable. Therefore, it is very urgent to develop a low-cost and robust chip antenna to solve the disadvantages of the conventional ceramic chip antenna, and the cost required for integration with the circuit can be reduced, and the stability of the product can be increased. Object and summary of the invention: In view of the above-mentioned background of the invention, the conventional wafer hole line using ceramic material is not only expensive but also fragile, which causes the cost of the product to increase and is not durable, so it cannot be widely used in various products. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. Therefore, the main purpose of the present invention is to provide a dual-frequency glass fiber chip antenna. The present invention uses a low-cost and strong glass fiber material to replace the conventional ceramic materials. The low-cost, high-performance and rugged chip antenna can be produced in various styles and shapes according to actual needs. The antenna's resonance frequency and frequency ratio can be changed by appropriately adjusting the length and meandering of the radiating metal wire ' For various wireless communication systems. This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 meals) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 507399 A7 _B7___ V. Description of the invention () Another object of the present invention is to provide a dual frequency The glass fiber chip antenna can be applied to surface adhesion technology and can be mass-produced, thereby reducing the cost required for integration with the circuit and increasing product stability. According to the above purpose, the present invention provides a dual-frequency glass fiber wafer antenna. The dual-frequency glass fiber chip antenna of the present invention includes at least: a glass fiber chip made of glass fiber material; a meandering radiation metal wire; and a surface adhesive contact. The meandering radiation metal wire is formed on at least two surfaces of the glass fiber material wafer, which is the main part of the antenna for radiating electromagnetic waves, and the total length is close to the quarter frequency of the center frequency of the first operating frequency band of the antenna; The surface adhesive contact is used to connect the winding radiating metal wire to the signal transmission line, and the signal transmission line is used for signal transmission of the system circuit. The dual-frequency glass fiber chip antenna of the present invention can adjust its resonance frequency and frequency ratio by appropriately adjusting the length and meandering mode of the radiating metal wire. The dual-frequency glass fiber chip antenna of the present invention is placed on a microwave substrate having a ground plane, wherein the ground plane is used to connect with the signal ground terminal. Brief description of the drawings: The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following figures, of which: This paper size applies to the Chinese national standard (CNS > A4 size (210 X 297 mm) f) ----- I ------- install -------- order --------- line (please read the precautions on the back before filling this page) 507399 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the Invention (1) Figure 1 is a schematic diagram showing the structure of a dual-frequency glass fiber chip antenna mounted on a microwave substrate, which is a preferred embodiment of the present invention; FIG. Is a schematic view showing a structure of a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention, and FIG. 3 is a schematic diagram showing a bottom view of a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention; FIG. 4 is a plan view showing a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention, and FIG. 5 is a side view showing a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention It is not intended. FIG. 6 is a diagram illustrating a return loss versus frequency of a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention. A plot of the experimental results; FIG. 7 is a radiation field type measurement result of a dual-frequency glass fiber chip antenna at 2450 MHz according to a preferred embodiment of the present invention; FIG. 8 is a comparison of one of the present invention Radiation field measurement results of the dual-band glass fiber chip antenna of the preferred embodiment at 5800 MHz; FIG. 9 shows the antenna gain of the dual-frequency glass fiber chip antenna of the preferred embodiment of the present invention in the 2450 MHz frequency band. Measurement results; Fig. 10 shows the measurement results of the antenna gain of the dual-frequency glass fiber chip antenna in the 5800 MHz band according to a preferred embodiment of the present invention; Figs. 11 and 13 show other aspects of the present invention. The schematic diagram of the structure of the dual-frequency glass fiber chip antenna of the embodiment mounted on a microwave substrate; and Figures 12 and 14 are the dual-frequency paper paper wattage of other embodiments of the present invention. The Chinese national standard (CNS) A4 is applicable. Specifications (210 X 297 mm) ------'------ * Packing ---- 11--Order -------- Guangxian-- · (Please read the note on the back first Please fill in this page again for details) 507399 A7 _B7 V. Description of the invention () Schematic diagram of the structure of glass fiber and chip antenna Description: 10, 70, 80 dual-frequency glass fiber chip antenna 11 '71, 81 glass fiber chip 12, Ί2, 82 radiant metal wire 13 surface adhesive contact 20 signal transmission line 30 ground plane 40 microwave substrate 121, 721 821 lower layer Metal wires 122, 722, 822 Upper metal wires 123, 723% 823 Connected metal wires 21 Experimental results 22 Simulation results nmn flu i_l · n If nm en n Hi I * -I an a ··· — n ϋ nn 1: em ϋ SI m -ϋ ϋ Bu line i, (Please read the notes on the back before filling this page) Detailed description of the invention: Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, this invention discloses a dual-frequency glass fiber chip antenna. The dual-frequency glass fiber chip antenna of the present invention forms a meandering radiation metal wire on a low-cost and strong glass fiber material wafer, and adjusts the resonance frequency of the chip antenna by appropriately adjusting the length of the radiation metal wire and the meandering method and Frequency ratio to get dual-frequency paper size Applicable to China National Standard (CNS) A4 specification (210 X 297 male f) 507399 Printed by A7 _____ Β7_ in the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy The disadvantage of expensive and fragile chip antennas using ceramic materials is improved. Please refer to FIG. 1. FIG. 1 is a schematic diagram showing a structure of a dual-frequency glass fiber chip antenna mounted on a microwave substrate according to a preferred embodiment of the present invention. The dual-frequency glass fiber chip antenna 10 is placed on a microwave substrate 40 having a ground plane 30, and the ground plane 30 is connected to the signal ground. The size of the microwave substrate 40 is, for example, about 100 X 3 5 mm2. The portion of the microwave substrate 40 directly below the dual-frequency glass fiber chip antenna 10 does not have a ground plane. The size is, for example, about 9 X 5 microwave substrate 40. It can be regarded as a circuit board of a wireless communication mobile phone, that is, an application embodiment of the chip antenna applied to a wireless communication mobile phone as a Bluetooth or wireless local area network system. In addition, the signal transmission line 20 is used as a system circuit. Signal transmission. The signal transmission line 20 may be, for example, a microstrip transmission line, a coaxial feed line, or other components capable of transmitting electromagnetic signals. Please refer to FIG. 2. FIG. 2 is a schematic diagram illustrating a structure of a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention. As shown in FIG. 2, the dual-frequency glass fiber chip antenna 10 of the present invention includes at least: a fiber breaking chip 11; a meandering radiation metal wire 12; and a surface adhesive contact 13. The contact 13 on the surface is used to connect the radiating metal wire 12 to the signal transmission line 20. The glass fiber wafer 11 is a rectangular cylinder made of glass fiber material, and its dielectric constant is between about 4 and about 5. The thickness of the glass fiber wafer π is not the same as the paper size. The Chinese national standard (CNS) A4 specification (210x297 male f) I nnnnmm * t ϋ n ϋ ϋ n I · nnn an nnd a e.. Nn 1 nnnn IK (Please read first Note on the back then fill out this page) 507399 Α7 Β7 V. Description of the invention () ------- * ------- install --- (Please read the notes on the back before filling out this page) -The consumer clothing cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs can print clothing that is too thin, otherwise it will seriously affect the bandwidth of the antenna. The thickness of the preferred embodiment is, for example, about 1.6 mm. However, the glass fiber wafer of the present invention The thickness of 11 may also be, for example, about 0.8 mm. The meandering radiating metal wire 12 is a main part of the antenna for radiating electromagnetic waves, and is formed on at least two surfaces of the glass fiber wafer 11. The meandering radiating metal wire 12 can be made of any electrical conductor, such as silver, copper, and the like. The meandering radiation metal wire 12 further includes at least a lower metal wire 1 2 1 located on the lower surface of the glass fiber wafer 11; an upper metal wire 122 located on the upper surface of the glass fiber wafer 11; and a connection metal wire 123, wherein the connection metal The line 123 is located on the side of the glass fiber wafer 11 so as to connect the lower metal line 121 and the upper metal line 122. As far as design is concerned, the total length of the meandering radiating metal wire 12 is about 1/4 of the center frequency of the first operating frequency band of the antenna (for example: 24 50 MHz), for example, about 35 mm. The size of the dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention is, for example, about 6 > < 6 > < 1.6mm3, and the first and second operating frequency bands of the antenna are of a meandering radiation metal wire 12. The first two resonance frequencies, and adjusting the total length of the meandering radiation metal wire 12 can change the first resonance frequency of the antenna. On the other hand, changing the width of the meandering radiation metal wire 12 (eg, about 1.0 mm) can be adjusted. The frequency ratio of the first two resonance frequencies of the antenna, for example, the meandering radiation metal wire 12 can be changed from fine to wide, so as to adjust the center frequency of the second operating frequency band. The width of the meandering radiation metal wire 12 may not be a certain value from the starting point to the end point, that is, the meandering radiation metal wire 12 may have a plurality of widths. Therefore, through the design of the different length, width and shape of the meandering radiating metal wire 12, the required operating frequency band and frequency ratio can be easily achieved. The paper wattage is in accordance with the Chinese National Standard (CNS) A4 specification (210 X 297 mmf). ) 507399 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 —_____ JB7 V. Description of the invention () Please refer to Figures 3 to 5, where Figure 3 is a dual-frequency glass showing a preferred embodiment of the present invention A schematic view from below of a fiber chip antenna; FIG. 4 is a schematic top view showing a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention; and FIG. 5 is a dual view showing a dual-frequency fiber antenna according to a preferred embodiment of the present invention. A schematic side view of a frequency glass fiber chip antenna. As shown in FIG. 3, the lower metal line 1 2 1 is composed of three lines that meander around three sides around the lower surface of the glass fiber wafer u. The microwave substrate 40 in contact with the first line starting therefrom has a ground plane 30, and this first line is usually connected perpendicularly to the direction of the signal transmission line 20. Next, the second line of the lower metal line 12m is connected vertically to the first line 'and the third line is connected to the second line vertically. As shown in Figure 4, 'the upper metal line 1 2 2 is composed of three horizontal lines and two vertical lines'. The order of formation is to form the first horizontal line first, then connect the first vertical line, then the second horizontal line, and then connect. The second vertical line, and this second vertical line extends only to the middle position of one edge of the upper surface of the glass fiber wafer, and then connects the third horizontal line, and the third horizontal line is longer than the first horizontal line and the first horizontal line. The two horizontal lines are short, so they will not contact the first vertical line. In addition, as shown in FIG. 5, the lower metal line ι21 and the upper metal line 122 are connected by a connecting metal line ι23 perpendicular to the two. The meandering way of the metal wire in this preferred embodiment can meet the requirements of a small antenna volume. "As described above," a dual-frequency glass fiber chip of a preferred embodiment of the present invention. Standard (C ^ S> A4 specification (21Q χ Norwegian meal)---* ---- I -----III — — «— I — — — — — ^. IIIIIILII (Please read the note on the back first Please fill in this page again for matters) 507399 Printed by A7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs
IE 五、發明說明（） 線可操作於2450MHz (第一操作頻段）與58〇〇MHz (第二 操作頻帶）。請參照第6圖，第6圖為繪示本發明之一較佳 實施例的雙頻玻纖晶片天線之關於返回損失對頻率的模 擬與實驗結果曲線圖。如第6圖所示，圖中曲線21為實 驗量測結果，曲線22為使用電磁模擬軟體HFSS所得結 果’實驗量測與電腦模擬的結果相當吻合。其頻寬分別為 105 MHz與820 MHz。第6圖中之虛線為本較佳實施例的 參考點，其所示的返回損失約為7 3 dB ,亦即相當於i : 2.5的電壓駐波比。 請參照第7圖和第8圖，第7圖為繪示本發明之一較 佳實施例的雙頻玻纖晶片天線在2450 MHz的輻射場型量 測結果’而第8圖為緣示本發明之一較佳實施例的雙頻玻 纖晶片天旅在5800 MHz的輻射場型量測結果。請參照第 9圖和第10圖’第9圖為繪示本發明之一較佳實施例的雙 頻玻纖晶片天線於2450 MHz頻帶之天線增益量測結果， 而第10圖為緣示本發明之一較佳實施例的雙頻玻纖晶片 天線於5800 MHz頻帶之天線增益量測結果《由所得量測 結果可知，於約2380 MHz至約2500 MHz頻帶操作時，本 發明之一較佳實施例的天線增益約在1 dBi至2 dBi之間。 而於約5100 MHz至約5900 MHz之頻帶操作時，本發明之 一實施例的天線增益約在1 dBi至2 dBi之間。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） II---- ----I I « - I I I I I I I ^ «IIIIIIL — (請先閱讀背面之注意事項再填寫本頁) 507399 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（ 綜合以上所述，本發明之一較佳實施例的雙頻玻纖晶 片天線足以含蓋2450 MHz與5800 MHz兩個ISM頻段 (Industrial-Scientific-Medical band)所需之頻寬’同時具 有良好的天線增益，非常適合藍芽或無線區域網路的應 用0 此外，如第2圖所示之玻纖晶片π的形狀亦可為選 自於一矩形柱體、一正方形枉體與一圓柱體所組成之一族 群，而蜿蜒輻射金屬線12亦可以各種不同樣式來形成。 請參照第11圖至第14圖，其中i π圖和第π圖為繪示 本發明之其他實施例的雙頻玻纖晶片天線安裝於微波基 板上之結構示意圖，而第12圖和第14圖為繪示本發明之 其他實施例的雙頻玻纖晶片天線之結構示意圖。第1 1圖 和第12圖為繪示具不同樣式之蜿蜒輻射金屬線72的雙頻 玻纖晶片天線70，蜿蜒輻射金屬線72係形成於玻纖晶片 71的至少兩個表面上。蜿蜒輻射金屬線72更至少包括下 層金屬線721 ;上層金屬線722以及連接金屬線723。第 13圖和第14圖之雙頻玻纖晶片天線80,其蜿蜒輻射金屬 線82係使用圓柱體的玻纖晶片8 1，而玻纖晶片8 1的至 少兩個表面上形成有蜿蜒輻射金屬線82。此蜿蜒輻射金 屬線82更至少包括下層金屬線821 ;上層金屬線822以 及連接金屬線823 11 本紙張尺度適用中國國家標準<CNS)A4規格（210 X 297公f ) II — — 1 I*— I I I I I I · I I I I I I I ^ « — — — — — I (請先W讀背面之注意事項再填寫本頁) 507399 A7B7 五、 明 說 明 發 至亦 的線 片屬 晶金 纖射 玻輻 於蜒 成蜿 形 ’ 可程 除製 線與 屬計 金設 射之 輻同 蜒不 蜿依 面上 方面 一 表 另個 兩 少 内 之 片 晶 纖 玻 於 成 形 或 面 表 1 單 之 片 晶 纖 玻 於 成 形。 可部 線發 天本 片 ， 。 晶明限 纖說此 玻例在 頻舉不 雙為並 之僅明 述等發 所置本 中位故 例成 施形 實·及 各狀 之形 明、 發寸 本尺的 於的際 上件實 以元依 各可 之明 整 同 做 而 要 需 經濟部智慧財產局員工消費合作社印制衣 因此，本發明之優點為提供了 一種雙頻玻纖晶片天 線，本發明之雙頻玻纖晶片天線使用成本低廉且堅固的破 纖材質，可以取代習知之陶瓷材料，完全沒有習知之陶I 晶片天線的缺點《本發明可設計出成本低廉、性能佳和堅 固的晶片天線，並可依實際需要而以各種不同的樣式和形 狀來製成，藉由適當地調整輻射金屬線長度與蜿蜒方式即 可變化天線的共振頻率及頻率比，因而可以廣泛地提供各 種不同無線通訊系統使用、 本發明之另一優點為提供了一種雙頻玻纖晶片天線， 得以適用於表面黏著技術，因而可做大量生產，進而降低 與電路整合時所需的成本，更增加產品的穩定度。故本發 明之雙頻玻纖晶片天線具有極高之產業應用價值。 本紙張尺度適用中國國家標準（CNS)A4規格（21〇 X 297公f ) ------t --------訂：-------r線 f請先閱讀背面之注意事項再填寫本頁} 507399 A7 ___B7___ 五、發明說明（） 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均爲包含在下述之申請專利範圍内。 IIIIIIIIIIII — * I I I i I I 1 ·11111111 {請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐）IE V. Invention Description () The line can operate at 2450MHz (the first operating frequency band) and 5800MHz (the second operating frequency band). Please refer to FIG. 6. FIG. 6 is a graph showing simulation and experimental results of return loss versus frequency of a dual-frequency glass fiber chip antenna according to a preferred embodiment of the present invention. As shown in Figure 6, curve 21 in the figure is the experimental measurement result, and curve 22 is the result obtained using the electromagnetic simulation software HFSS. The experimental measurement is in good agreement with the computer simulation result. Its bandwidth is 105 MHz and 820 MHz. The dotted line in Figure 6 is the reference point of the preferred embodiment, and the return loss shown is about 73 dB, which is equivalent to a voltage standing wave ratio of i: 2.5. Please refer to FIG. 7 and FIG. 8. FIG. 7 is a radiation field measurement result of a dual-frequency glass fiber chip antenna at 2450 MHz according to a preferred embodiment of the present invention, and FIG. 8 is a margin illustration. One preferred embodiment of the invention is a dual-band glass fiber wafer Tianlv's radiation field measurement results at 5800 MHz. Please refer to FIG. 9 and FIG. 10. FIG. 9 is a diagram showing an antenna gain measurement result of a dual-frequency glass fiber chip antenna in a 2450 MHz band according to a preferred embodiment of the present invention. One preferred embodiment of the invention is the antenna gain measurement result of the dual-frequency glass fiber chip antenna in the 5800 MHz frequency band. According to the measurement results obtained, one of the present invention is preferred when operating in the frequency band of about 2380 MHz to about 2500 MHz. The antenna gain of the embodiment is between about 1 dBi and 2 dBi. When operating in a frequency band of about 5100 MHz to about 5900 MHz, the antenna gain of an embodiment of the present invention is about 1 dBi to 2 dBi. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) II ---- ---- II «-IIIIIII ^« IIIIIIL — (Please read the precautions on the back before filling this page) 507399 A7 B7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (To sum up, the dual-frequency glass fiber chip antenna of a preferred embodiment of the present invention is sufficient to cover the two ISM bands of 2450 MHz and 5800 MHz ( Industrial-Scientific-Medical band) At the same time, it has good antenna gain, which is very suitable for Bluetooth or wireless LAN applications. In addition, the shape of the glass fiber chip π as shown in Figure 2 can also be It is selected from a group consisting of a rectangular cylinder, a square corpse, and a cylinder, and the meandering radiation metal wire 12 can also be formed in various different styles. Please refer to FIGS. 11 to 14, where i π Figures and π are schematic diagrams showing the structure of a dual-frequency glass fiber chip antenna mounted on a microwave substrate according to other embodiments of the present invention, and Figures 12 and 14 are dual-frequency diagrams illustrating other embodiments of the present invention. Fiberglass chip antenna Figures 11 and 12 show a dual-frequency glass fiber chip antenna 70 with meandering radiation wires 72 of different patterns. The meandering radiation wires 72 are formed on at least two of the fiberglass wafer 71. On the surface, the meandering radiation metal wire 72 further includes at least a lower layer metal wire 721; an upper layer metal wire 722 and a connecting metal wire 723. The dual-frequency glass fiber chip antenna 80 of FIGS. 13 and 14 has a meandering radiation metal wire 82 A cylindrical glass fiber wafer 81 is used, and meandering radiation metal wires 82 are formed on at least two surfaces of the glass fiber wafer 81. The meandering radiation metal wire 82 further includes at least a lower metal wire 821 and an upper metal wire. 822 and connecting metal wires 823 11 This paper size applies to Chinese National Standards < CNS) A4 specification (210 X 297 male f) II — — 1 I * — IIIIII · IIIIIII ^ «— — — — — I (Please read first Note on the back, please fill out this page again) 507399 A7B7 V. It is stated that the wire piece sent to the line is made of crystal gold fiber and the glass is radiated in a meandering shape. Winding on the face, one table and the other two The inner piece of crystal fiber is formed or the single piece of crystal fiber is formed. You can send out this video. Jingming Fibers said that this example of glass is not only in the frequency, but only explicitly states the median position of the book, so the example has been implemented, and the shape of the shape, the size of the scale, In fact, the Yuan can do everything in accordance with the requirements of the Ministry of Economic Affairs, Intellectual Property Bureau, staff consumer cooperatives to print clothes. Therefore, the advantage of the present invention is to provide a dual-frequency glass fiber chip antenna, and the dual-frequency glass fiber chip of the present invention. The antenna uses a low-cost and sturdy fiber-breaking material, which can replace the conventional ceramic material, without the shortcomings of the conventional ceramic I chip antenna. "The invention can design a low-cost, high-performance and rugged chip antenna. It is made in various styles and shapes, and the resonance frequency and frequency ratio of the antenna can be changed by appropriately adjusting the length and meandering mode of the radiating metal wire, so that it can be widely used in various wireless communication systems. Another advantage is that it provides a dual-frequency glass fiber chip antenna, which can be applied to surface adhesion technology, so it can be mass-produced, which reduces the time required for integration with circuits. The required cost increases the stability of the product. Therefore, the dual-frequency glass fiber chip antenna of the present invention has extremely high industrial application value. This paper size is applicable to China National Standard (CNS) A4 specification (21〇X 297 male f) ------ t -------- Order: ------- r line f Please read first Note on the back, please fill out this page again} 507399 A7 ___B7___ 5. Description of the Invention () As understood by those skilled in the art, the above description is only a preferred embodiment of the present invention and is not intended to limit the application of the present invention Patent scope; all other equivalent changes or modifications made without departing from the spirit disclosed by the present invention are included in the scope of patent application described below. IIIIIIIIIIII — * I I I i I I 1 · 11111111 {Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper applies the Chinese National Standard (CNS) A4 (210x297 mm)