TW506620U - Low pressure CVD apparatus - Google Patents
Low pressure CVD apparatusInfo
- Publication number
- TW506620U TW506620U TW090204676U TW90204676U TW506620U TW 506620 U TW506620 U TW 506620U TW 090204676 U TW090204676 U TW 090204676U TW 90204676 U TW90204676 U TW 90204676U TW 506620 U TW506620 U TW 506620U
- Authority
- TW
- Taiwan
- Prior art keywords
- low pressure
- cvd apparatus
- pressure cvd
- low
- pressure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/08—Reaction chambers; Selection of materials therefor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP08729696A JP3473263B2 (en) | 1996-03-15 | 1996-03-15 | Low pressure CVD equipment |
JP35780996A JP3861350B2 (en) | 1996-12-27 | 1996-12-27 | Low pressure CVD equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
TW506620U true TW506620U (en) | 2002-10-11 |
Family
ID=26428584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW090204676U TW506620U (en) | 1996-03-15 | 1997-03-12 | Low pressure CVD apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US5902406A (en) |
EP (1) | EP0795897B1 (en) |
KR (1) | KR100440992B1 (en) |
DE (1) | DE69730370T2 (en) |
TW (1) | TW506620U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10136472B2 (en) | 2012-08-07 | 2018-11-20 | Plansee Se | Terminal for mechanical support of a heating element |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6331212B1 (en) * | 2000-04-17 | 2001-12-18 | Avansys, Llc | Methods and apparatus for thermally processing wafers |
US6758909B2 (en) * | 2001-06-05 | 2004-07-06 | Honeywell International Inc. | Gas port sealing for CVD/CVI furnace hearth plates |
US6776848B2 (en) | 2002-01-17 | 2004-08-17 | Applied Materials, Inc. | Motorized chamber lid |
US7041231B2 (en) * | 2003-01-06 | 2006-05-09 | Triumph Brands, Inc. | Method of refurbishing a transition duct for a gas turbine system |
SG125934A1 (en) * | 2003-02-27 | 2006-10-30 | Asahi Glass Co Ltd | Outer tube made of silicon carbide and thermal treatment system for semiconductors |
KR101052448B1 (en) * | 2003-03-28 | 2011-07-28 | 아사히 가라스 가부시키가이샤 | Semiconductor heat treatment equipment |
US7390535B2 (en) | 2003-07-03 | 2008-06-24 | Aeromet Technologies, Inc. | Simple chemical vapor deposition system and methods for depositing multiple-metal aluminide coatings |
US8246749B2 (en) * | 2005-07-26 | 2012-08-21 | Hitachi Kokusai Electric, Inc. | Substrate processing apparatus and semiconductor device producing method |
WO2008032668A1 (en) * | 2006-09-11 | 2008-03-20 | Ulvac, Inc. | Vacuum evaporation processing equipment |
KR101333363B1 (en) * | 2006-10-13 | 2013-11-28 | 도쿄엘렉트론가부시키가이샤 | Heat treatment apparatus |
US20080232424A1 (en) * | 2007-03-23 | 2008-09-25 | Honeywell International Inc. | Hearth plate including side walls defining a processing volume |
US7731494B2 (en) * | 2007-08-22 | 2010-06-08 | A.S.M. International N.V. | System for use in a vertical furnace |
JP5136574B2 (en) | 2009-05-01 | 2013-02-06 | 東京エレクトロン株式会社 | Plasma processing apparatus and plasma processing method |
US20120279401A1 (en) * | 2011-05-06 | 2012-11-08 | Prince Castle LLC | Egg Scrambler for Preparing Scrambled Eggs |
CN105392758B (en) | 2014-03-27 | 2019-04-09 | 日本碍子株式会社 | The connected structure of ceramic wafer and made of metal cylinder part |
US10872804B2 (en) * | 2017-11-03 | 2020-12-22 | Asm Ip Holding B.V. | Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2943634C2 (en) * | 1979-10-29 | 1983-09-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Epitaxial reactor |
EP0164928A3 (en) * | 1984-06-04 | 1987-07-29 | Texas Instruments Incorporated | Vertical hot wall cvd reactor |
JPH07120634B2 (en) * | 1988-12-27 | 1995-12-20 | 東京エレクトロン東北株式会社 | Processor |
JP3007432B2 (en) * | 1991-02-19 | 2000-02-07 | 東京エレクトロン株式会社 | Heat treatment equipment |
JPH0590214A (en) * | 1991-09-30 | 1993-04-09 | Tokyo Ohka Kogyo Co Ltd | Coaxial type plasma treatment device |
JP3234617B2 (en) * | 1991-12-16 | 2001-12-04 | 東京エレクトロン株式会社 | Substrate support for heat treatment equipment |
JP2825172B2 (en) * | 1992-07-10 | 1998-11-18 | 東京エレクトロン株式会社 | Reduced pressure processing apparatus and reduced pressure processing method |
JP3073627B2 (en) * | 1993-06-14 | 2000-08-07 | 東京エレクトロン株式会社 | Heat treatment equipment |
US5484484A (en) * | 1993-07-03 | 1996-01-16 | Tokyo Electron Kabushiki | Thermal processing method and apparatus therefor |
US5578132A (en) * | 1993-07-07 | 1996-11-26 | Tokyo Electron Kabushiki Kaisha | Apparatus for heat treating semiconductors at normal pressure and low pressure |
JPH088194A (en) * | 1994-06-16 | 1996-01-12 | Kishimoto Sangyo Kk | Gas phase growth mechanism and heating apparatus in heat treatment mechanism |
JP3982844B2 (en) * | 1995-01-12 | 2007-09-26 | 株式会社日立国際電気 | Semiconductor manufacturing apparatus and semiconductor manufacturing method |
-
1997
- 1997-03-12 TW TW090204676U patent/TW506620U/en not_active IP Right Cessation
- 1997-03-13 DE DE69730370T patent/DE69730370T2/en not_active Expired - Lifetime
- 1997-03-13 EP EP97104321A patent/EP0795897B1/en not_active Expired - Lifetime
- 1997-03-14 US US08/818,096 patent/US5902406A/en not_active Expired - Lifetime
- 1997-03-14 KR KR1019970008789A patent/KR100440992B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10136472B2 (en) | 2012-08-07 | 2018-11-20 | Plansee Se | Terminal for mechanical support of a heating element |
Also Published As
Publication number | Publication date |
---|---|
DE69730370D1 (en) | 2004-09-30 |
KR100440992B1 (en) | 2004-09-18 |
DE69730370T2 (en) | 2005-09-01 |
KR19980063270A (en) | 1998-10-07 |
EP0795897B1 (en) | 2004-08-25 |
US5902406A (en) | 1999-05-11 |
EP0795897A3 (en) | 2000-11-22 |
EP0795897A2 (en) | 1997-09-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 | ||
MK4K | Expiration of patent term of a granted utility model |