TW506620U - Low pressure CVD apparatus - Google Patents

Low pressure CVD apparatus

Info

Publication number
TW506620U
TW506620U TW090204676U TW90204676U TW506620U TW 506620 U TW506620 U TW 506620U TW 090204676 U TW090204676 U TW 090204676U TW 90204676 U TW90204676 U TW 90204676U TW 506620 U TW506620 U TW 506620U
Authority
TW
Taiwan
Prior art keywords
low pressure
cvd apparatus
pressure cvd
low
pressure
Prior art date
Application number
TW090204676U
Other languages
Chinese (zh)
Inventor
Taroh Uchiyama
Yukio Yoshikawa
Takashi Tsukamoto
Jiro Nishihama
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP08729696A external-priority patent/JP3473263B2/en
Priority claimed from JP35780996A external-priority patent/JP3861350B2/en
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW506620U publication Critical patent/TW506620U/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/08Reaction chambers; Selection of materials therefor
TW090204676U 1996-03-15 1997-03-12 Low pressure CVD apparatus TW506620U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP08729696A JP3473263B2 (en) 1996-03-15 1996-03-15 Low pressure CVD equipment
JP35780996A JP3861350B2 (en) 1996-12-27 1996-12-27 Low pressure CVD equipment

Publications (1)

Publication Number Publication Date
TW506620U true TW506620U (en) 2002-10-11

Family

ID=26428584

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090204676U TW506620U (en) 1996-03-15 1997-03-12 Low pressure CVD apparatus

Country Status (5)

Country Link
US (1) US5902406A (en)
EP (1) EP0795897B1 (en)
KR (1) KR100440992B1 (en)
DE (1) DE69730370T2 (en)
TW (1) TW506620U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10136472B2 (en) 2012-08-07 2018-11-20 Plansee Se Terminal for mechanical support of a heating element

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6331212B1 (en) * 2000-04-17 2001-12-18 Avansys, Llc Methods and apparatus for thermally processing wafers
US6758909B2 (en) * 2001-06-05 2004-07-06 Honeywell International Inc. Gas port sealing for CVD/CVI furnace hearth plates
US6776848B2 (en) 2002-01-17 2004-08-17 Applied Materials, Inc. Motorized chamber lid
US7041231B2 (en) * 2003-01-06 2006-05-09 Triumph Brands, Inc. Method of refurbishing a transition duct for a gas turbine system
SG125934A1 (en) * 2003-02-27 2006-10-30 Asahi Glass Co Ltd Outer tube made of silicon carbide and thermal treatment system for semiconductors
KR101052448B1 (en) * 2003-03-28 2011-07-28 아사히 가라스 가부시키가이샤 Semiconductor heat treatment equipment
US7390535B2 (en) 2003-07-03 2008-06-24 Aeromet Technologies, Inc. Simple chemical vapor deposition system and methods for depositing multiple-metal aluminide coatings
US8246749B2 (en) * 2005-07-26 2012-08-21 Hitachi Kokusai Electric, Inc. Substrate processing apparatus and semiconductor device producing method
WO2008032668A1 (en) * 2006-09-11 2008-03-20 Ulvac, Inc. Vacuum evaporation processing equipment
KR101333363B1 (en) * 2006-10-13 2013-11-28 도쿄엘렉트론가부시키가이샤 Heat treatment apparatus
US20080232424A1 (en) * 2007-03-23 2008-09-25 Honeywell International Inc. Hearth plate including side walls defining a processing volume
US7731494B2 (en) * 2007-08-22 2010-06-08 A.S.M. International N.V. System for use in a vertical furnace
JP5136574B2 (en) 2009-05-01 2013-02-06 東京エレクトロン株式会社 Plasma processing apparatus and plasma processing method
US20120279401A1 (en) * 2011-05-06 2012-11-08 Prince Castle LLC Egg Scrambler for Preparing Scrambled Eggs
CN105392758B (en) 2014-03-27 2019-04-09 日本碍子株式会社 The connected structure of ceramic wafer and made of metal cylinder part
US10872804B2 (en) * 2017-11-03 2020-12-22 Asm Ip Holding B.V. Apparatus and methods for isolating a reaction chamber from a loading chamber resulting in reduced contamination

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2943634C2 (en) * 1979-10-29 1983-09-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Epitaxial reactor
EP0164928A3 (en) * 1984-06-04 1987-07-29 Texas Instruments Incorporated Vertical hot wall cvd reactor
JPH07120634B2 (en) * 1988-12-27 1995-12-20 東京エレクトロン東北株式会社 Processor
JP3007432B2 (en) * 1991-02-19 2000-02-07 東京エレクトロン株式会社 Heat treatment equipment
JPH0590214A (en) * 1991-09-30 1993-04-09 Tokyo Ohka Kogyo Co Ltd Coaxial type plasma treatment device
JP3234617B2 (en) * 1991-12-16 2001-12-04 東京エレクトロン株式会社 Substrate support for heat treatment equipment
JP2825172B2 (en) * 1992-07-10 1998-11-18 東京エレクトロン株式会社 Reduced pressure processing apparatus and reduced pressure processing method
JP3073627B2 (en) * 1993-06-14 2000-08-07 東京エレクトロン株式会社 Heat treatment equipment
US5484484A (en) * 1993-07-03 1996-01-16 Tokyo Electron Kabushiki Thermal processing method and apparatus therefor
US5578132A (en) * 1993-07-07 1996-11-26 Tokyo Electron Kabushiki Kaisha Apparatus for heat treating semiconductors at normal pressure and low pressure
JPH088194A (en) * 1994-06-16 1996-01-12 Kishimoto Sangyo Kk Gas phase growth mechanism and heating apparatus in heat treatment mechanism
JP3982844B2 (en) * 1995-01-12 2007-09-26 株式会社日立国際電気 Semiconductor manufacturing apparatus and semiconductor manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10136472B2 (en) 2012-08-07 2018-11-20 Plansee Se Terminal for mechanical support of a heating element

Also Published As

Publication number Publication date
DE69730370D1 (en) 2004-09-30
KR100440992B1 (en) 2004-09-18
DE69730370T2 (en) 2005-09-01
KR19980063270A (en) 1998-10-07
EP0795897B1 (en) 2004-08-25
US5902406A (en) 1999-05-11
EP0795897A3 (en) 2000-11-22
EP0795897A2 (en) 1997-09-17

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model